Display panel, method for manufacturing display panel, and display device

Abstract

The application discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, a plurality of light emitting devices arranged on one side of the substrate, the light emitting devices comprising a first electrode, a light emitting functional layer and a second electrode which are sequentially stacked in a direction away from the substrate, the first electrode comprising a first conductive layer and a functional structure, a pixel definition layer comprising a pixel limiting portion and a plurality of pixel openings formed by the pixel limiting portion, the pixel limiting portion being arranged on a side of the functional structure away from the substrate, the pixel limiting portion being arranged protruding from the functional structure towards the pixel openings, and a partition groove being formed between the pixel limiting portion and the functional structure, wherein the first conductive layer comprises a first conductive portion and a second conductive portion which are spaced apart at the partition groove, the first conductive portion being located on a side of the pixel opening close to the substrate, and at least part of the second conductive portion being located on a side of the pixel limiting portion away from the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, in current display products, due to limitations in the manufacturing process, short-circuit connections can easily occur between the pixel electrodes of adjacent sub-pixels, which means that the operational stability of display products needs to be improved. Summary of the Invention

[0005] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the working stability of the display panel.

[0006] An embodiment of the first aspect of this application provides a display panel, comprising: a substrate; a plurality of light-emitting devices disposed on one side of the substrate, wherein, in a direction away from the substrate, the light-emitting devices include a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially, the first electrode including a first conductive layer and a functional structure; a pixel definition layer, the pixel definition layer including a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion, the pixel defining portion being disposed on the side of the functional structure away from the substrate, the first conductive layer, the light-emitting functional layer, and the second electrode being at least partially located within the corresponding pixel openings, the pixel defining portion protruding from the functional structure toward the pixel opening, and a partition groove being formed between the pixel defining portion and the functional structure, wherein the first conductive layer includes a first conductive portion and a second conductive portion spaced apart at the partition groove, the first conductive portion being located on the side of the pixel opening closer to the substrate, and at least a portion of the second conductive portion being located on the side of the pixel defining portion away from the substrate.

[0007] An embodiment of the second aspect of this application provides a method for manufacturing a display panel, comprising:

[0008] Provide substrate;

[0009] An electrode material layer is formed on a substrate;

[0010] The electrode material layer is patterned to form an initial structure;

[0011] A pixel-defining material layer is fabricated on the initial structure and substrate;

[0012] The pixel definition material layer is patterned to form at least a partial pixel definition portion and at least a partial pixel opening enclosed by the pixel definition portion;

[0013] The initial structure exposed from at least a portion of the pixel opening is patterned to form at least a portion of the functional structure, the pixel limiting portion protrudes from the functional structure toward the pixel opening, and a partition groove is formed between the pixel limiting portion and the functional structure.

[0014] A first conductive layer is formed, the first conductive layer including a first conductive portion and a second conductive portion spaced apart at the partition groove, the first conductive portion being located on the side of the pixel opening close to the substrate, and at least a portion of the second conductive portion being located on the side of the pixel defining portion away from the substrate.

[0015] An embodiment of the third aspect of this application provides a display device, including a display panel of any of the above embodiments, or a display panel prepared by the preparation method of any of the above embodiments.

[0016] The beneficial effects of this application are as follows: In a display panel provided in the embodiments of this application, the display panel includes a substrate, a pixel definition layer, and a plurality of light-emitting devices. The light-emitting devices are disposed on one side of the substrate. In the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially. Under the voltage applied to the light-emitting functional layer by the first electrode and the second electrode, the light-emitting functional layer can emit light, so that the light-emitting device can be used to realize the light-emitting display operation of the display panel.

[0017] The pixel definition layer includes a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion. The first conductive layer, the light-emitting functional layer and the second electrode are all located at least partially within the corresponding pixel openings. The pixel definition layer can be used to participate in the division of sub-pixels of the display panel.

[0018] The first electrode includes a first conductive layer and a functional structure, with a pixel defining portion disposed on the side of the functional structure facing away from the substrate. The pixel defining portion protrudes from the functional structure toward the pixel opening, and a partition groove is formed between the pixel defining portion and the functional structure. The partition groove can be used to partition the material of the first conductive layer during the fabrication of the display panel, so that the material of the first conductive layer can be discontinuous at the partition groove, which facilitates the fabrication of the first conductive portion and the second conductive portion spaced apart at the partition groove in the first conductive layer.

[0019] The first conductive portion is located on the side of the pixel opening closest to the substrate, and can be used to drive the light emission of the light-emitting functional layer within the pixel opening. At least a portion of the second conductive portion is located on the side of the pixel defining portion away from the substrate. Under the blocking effect of the partition groove, the first conductive portion and the second conductive portion can be insulated at the partition groove, thereby making it difficult for the first electrodes of adjacent light-emitting devices to short-circuit through the second conductive portion, thus improving the working stability of the display panel. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0022] Figure 2 This is a partial cross-sectional view of a substrate provided in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of an isolation structure and a light-emitting device provided in an embodiment of this application;

[0024] Figure 4 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0025] Figure 5 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0026] Figure 6 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0027] Figure 7 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0028] Figure 8 This is one of the partial cross-sectional views of a display panel provided in another embodiment of this application;

[0029] Figure 9 This is a second partial cross-sectional view of a display panel provided in another embodiment of this application;

[0030] Figure 10 This is a third partial cross-sectional view of a display panel provided in another embodiment of this application;

[0031] Figure 11 This is a fourth partial cross-sectional view of a display panel provided in another embodiment of this application;

[0032] Figure 12 This is a partially enlarged cross-sectional view of a display panel provided in an embodiment of this application;

[0033] Figure 13 This is a partial structural diagram of a pixel definition layer and functional structure provided in an embodiment of this application;

[0034] Figure 14 This is a partial structural diagram of a pixel definition layer, isolation structure, and functional structure provided in an embodiment of this application;

[0035] Figure 15 This is a partial structural diagram of a pixel definition layer and a second conductive part provided in an embodiment of this application;

[0036] Figure 16 This is a schematic flowchart of a method for manufacturing a display panel provided in an embodiment of this application;

[0037] Figure 17 This is one of the schematic diagrams illustrating the fabrication process of a display panel fabrication method provided in this application embodiment;

[0038] Figure 18 This is a second schematic diagram illustrating the fabrication process of a display panel fabrication method provided in this application embodiment;

[0039] Figure 19 This is the third schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment;

[0040] Figure 20 This is the fourth schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment;

[0041] Figure 21 This is the fifth schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment;

[0042] Figure 22 This is a sixth schematic diagram illustrating the fabrication process of a display panel fabrication method provided in this application embodiment;

[0043] Figure 23 This is the seventh schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment;

[0044] Figure 24 This is the eighth schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment.

[0045] Explanation of reference numerals in the attached figures:

[0046] 10. Display panel; 11. Pixel definition material layer; 12. Isolation material layer; 12a. First isolation material layer; 12b. Second isolation material layer; 12c. Third isolation material layer;

[0047] 100, Substrate; 110, Substrate; 120, First insulating layer; 130, Second insulating layer; 140, Planarization layer; 140a, Via; 150, Pixel circuit; 151, Transistor; 151a, Gate; 151b, Source / drain; 152, Storage capacitor; 152a, First electrode plate; 152b, Second electrode plate;

[0048] 200, Pixel definition layer; 210, Pixel limiting section; 211, First sub-layer; 212, Second sub-layer; 220, Pixel opening;

[0049] 300, Isolation structure; 301, Isolation opening; 301a, First opening; 301b, Second opening; 301c, Third opening; 310, First isolation section; 320, Second isolation section; 330, Third isolation section;

[0050] 400. Light-emitting device; 401. Type I device; 402. Type II device; 403. Type III device; 410. First electrode; 411. First conductive layer; 411a. First conductive part; 411b. Second conductive part; 412. Second conductive layer; 413. Third conductive layer; 414. Functional structure; 414a. First sidewall; 420. Light-emitting functional layer; 421. First material part; 422. Second material part; 430. Second electrode;

[0051] 500, First encapsulation layer; 510, Encapsulation unit; 501, First unit; 502, Second unit; 503, Third unit; 511, First encapsulation section; 512, Second encapsulation section;

[0052] 600, Second encapsulation layer;

[0053] 700, Third encapsulation layer;

[0054] PS, initial structure; PSA, functional material; UC, partition groove; AA, display area; NA, non-display area; X, first direction; Y, second direction; Z, thickness direction; DR1, first preset direction; DR2, second preset direction. Detailed Implementation

[0055] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0056] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0057] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0058] This application provides a display panel, a method for manufacturing the display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the method for manufacturing the display panel, and the display device.

[0059] Figure 1 This is a schematic diagram of the structure of a display panel 10 provided in an embodiment of this application. Figure 2 This is a partial cross-sectional view of a substrate 100 provided in an embodiment of this application. Figure 3 This is a schematic diagram of an isolation structure 300 and a light-emitting device 400 provided in an embodiment of this application. Figure 4 This is a partial cross-sectional view of a display panel 10 provided in an embodiment of this application.

[0060] In the diagram, the X direction is the first direction, the Y direction is the second direction, and the Z direction is the thickness direction of the display panel 10. The first direction X, the second direction Y, and the thickness direction Z of the display panel 10 can intersect each other. For example, the first direction X, the second direction Y, and the thickness direction Z of the display panel 10 can be perpendicular to each other. Figure 4 This can be one embodiment. Figure 3 A partial sectional view at point AA.

[0061] like Figures 1 to 4As shown, an embodiment of the first aspect of this application provides a display panel 10, including: a substrate 100; a plurality of light-emitting devices 400 disposed on one side of the substrate 100, wherein, in a direction away from the substrate 100, each light-emitting device 400 includes a first electrode 410, a light-emitting functional layer 420, and a second electrode 430 stacked sequentially, the first electrode 410 including a first conductive layer 411 and a functional structure 414; and a pixel definition layer 200, the pixel definition layer 200 including a pixel defining portion 210 and a plurality of pixel openings 220 formed by the pixel defining portion 210, the pixel defining portion 210 being disposed on the functional structure 414 away from the substrate 100. On one side, the first conductive layer 411, the light-emitting functional layer 420, and the second electrode 430 are all at least partially located within the corresponding pixel opening 220. The pixel limiting portion 210 protrudes from the functional structure 414 toward the pixel opening 220 and forms a partition groove UC between the pixel limiting portion 210 and the functional structure 414. The first conductive layer 411 includes a first conductive portion 411a and a second conductive portion 411b spaced apart at the partition groove UC. The first conductive portion 411a is located on the side of the pixel opening 220 closer to the substrate 100, and at least a portion of the second conductive portion 411b is located on the side of the pixel limiting portion 210 away from the substrate 100.

[0062] In a display panel 10 provided in this application embodiment, the display panel 10 includes a substrate 100, a pixel definition layer 200 and a plurality of light-emitting devices 400.

[0063] The display panel 10 provided in this application embodiment can be a display panel 10 that emits light based on the principle of Liquid Crystal Display (LCD), or a display panel 10 that emits light based on the principle of Organic Light Emitting Diode (OLED), or a display panel 10 that emits light based on the principle of Quantum Dot Light Emitting Diodes (QLED). This application does not specifically limit its application to these specific types. For ease of description, the following embodiments will use the display panel 10 provided in this application embodiment that emits light based on the principle of Organic Light Emitting Diode (OLED) as an example for illustration.

[0064] Optionally, the display panel 10 may include a non-display area NA and a display area AA with display function. The display area AA of the display panel 10 may be rectangular, square, circular, elliptical, or other shapes, and the non-display area NA may surround at least part of the display area AA.

[0065] Optionally, the display area AA may include a first display area AA (not shown in the figure) and a second display area AA (not shown in the figure), wherein the light transmittance of the first display area AA may be greater than that of the second display area AA. For example, the second display area AA is a display area AA that is set for a corresponding sensor and has light transmittance, while the first display area AA is a display area AA that is not set for a corresponding sensor.

[0066] Optionally, the substrate 100 can be configured in various ways. The substrate 100 may include, for example, a substrate 110 and a pixel circuit 150 disposed on one side of the substrate 110. Exemplarily, the pixel circuit 150 may include a transistor 151, a storage capacitor 152, and drive signal lines for connecting various devices. The transistor 151 may include a semiconductor, a gate 151a, and source / drain electrodes 151b. The storage capacitor 152 may include a first electrode 152a and a second electrode 152b.

[0067] Optionally, in the direction away from the substrate 110, the substrate 100 may further include a first insulating layer 120, a second insulating layer 130, and a third insulating layer stacked sequentially. As an example, the gate 151a and the first electrode 152a may be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b may be located between the first insulating layer 120 and the second insulating layer 130, and the source / drain electrode 151b may be located between the second insulating layer 130 and the third insulating layer.

[0068] Optionally, the third insulating layer can serve as a planarization layer 140, meaning the surface of the third insulating layer facing away from the substrate 110 can be relatively flat, facilitating the subsequent fabrication of other film layers on the substrate 100. For example, both the light-emitting device 400 and the pixel definition layer 200 can be disposed on the side of the third insulating layer facing away from the substrate 110. Optionally, the planarization layer 140 may have a via 140a, through which the pixel circuit 150 can be connected to the light-emitting device 400.

[0069] Optionally, one pixel circuit 150 can be used to drive at least one light-emitting device 400 to emit light. Optionally, there can be multiple pixel circuits 150 and multiple light-emitting devices 400, and multiple pixel circuits 150 and multiple light-emitting devices 400 can be arranged in an array along the first direction X and the second direction Y.

[0070] Optionally, there are various ways to set the working principle and circuit structure of the pixel circuit 150. The pixel circuit 150 can be a 2T1C, 4T1C, 7T1C, 7T2C, 8T1C or 8T2C circuit structure.

[0071] Optionally, the substrate 100 also includes scan lines and data lines that provide scan signals to the pixel circuit 150 and data signals to the pixel circuit 150.

[0072] Optionally, transistor 151 may include a driving transistor and a data writing transistor. The first end of the data writing transistor is connected to a data line, the control end of the data writing transistor is connected to a scan line, and the second end of the data writing transistor is connected to the control end of the driving transistor. The two plates of the storage capacitor 152 are respectively connected to the control end and the second end of the driving transistor. The second end of the driving transistor is also connected to the light-emitting device 400.

[0073] The light-emitting device 400 is disposed on one side of the substrate 100. In the direction away from the substrate 100, the light-emitting device 400 includes a first electrode 410, a light-emitting functional layer 420 and a second electrode 430 stacked in sequence. When the first electrode 410 and the second electrode 430 apply a voltage to the light-emitting functional layer 420, the light-emitting functional layer 420 can emit light, so that the light-emitting device 400 can be used to realize the light-emitting display operation of the display panel 10.

[0074] Optionally, the light-emitting functional layer 420 may include a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), an emitting material layer (EML), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL) stacked along a direction away from the substrate 100.

[0075] Optionally, the material of the second electrode 430 includes metallic materials such as an alloy of magnesium and silver (MgAg).

[0076] Optionally, the first electrode 410 and the second electrode 430 can serve as pixel electrodes of the display panel 10. One of the first electrode 410 and the second electrode 430 can serve as an anode, and the other can serve as a cathode to drive the light-emitting functional layer 420 to emit light. In this embodiment, the first electrode 410 is used as the anode of the display panel 10, and the second electrode 430 is used as the cathode of the display panel 10 for illustrative purposes.

[0077] Optionally, the light-emitting device 400 can be connected to the pixel circuit 150. For example, the first electrode 410 can be connected to the pixel circuit 150, so that the pixel circuit 150 can provide a driving current to the first electrode 410 to drive the light-emitting device 400 to emit light.

[0078] The pixel definition layer 200 includes a pixel defining portion 210 and a plurality of pixel openings 220 formed by the pixel defining portion 210. The first conductive layer 411, the light-emitting functional layer 420 and the second electrode 430 are all located at least partially within the corresponding pixel openings 220. The pixel definition layer 200 can be used to participate in dividing the sub-pixels of the display panel 10.

[0079] Optionally, each light-emitting device 400 can be configured to correspond to different pixel openings 220, that is, the first conductive layer 411, the light-emitting functional layer 420 and the second electrode 430 in different light-emitting devices 400 can be located in different pixel openings 220.

[0080] Optionally, the light-emitting devices 400 may be arrayed in the first direction X and the second direction Y.

[0081] Optionally, the light-emitting device may include a first type of device 401 and a second type of device 402 with different light-emitting colors, so as to realize the color display of the display panel 10. Optionally, the light-emitting device 400 may also include a third type of device 403, wherein the light-emitting colors of the first type of device 401, the second type of device 402 and the third type of device 403 are different from each other.

[0082] For example, the first type of device 401 emits blue light, the second type of device 402 emits green light, and the third type of device 403 emits red light.

[0083] Optionally, the pixel defining layer is made of an inorganic material, such as an inorganic insulating material formed using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0084] Figure 5 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0085] like Figure 5 As shown, optionally, the pixel definition layer 200 includes multiple sub-layers, including a first sub-layer 211 and a second sub-layer 212 stacked sequentially along a direction away from the substrate 100, that is, the pixel definition layer 200 can adopt a double-layer design.

[0086] For example, the first sublayer 211 has better film-forming properties than the second sublayer 212. That is, under the same thickness conditions, the first sublayer 211 can better cover the stepped structure formed by the first electrode 410 than the second sublayer 212, without producing cracks. Conversely, to obtain the same stepped coverage effect, the thickness of the first sublayer 211 needs to be thinner than that of the second sublayer 212. That is, the thickness requirement for the first sublayer 211 is relatively low, which is conducive to product thinning. In addition, the better film-forming properties are reflected in the better coverage of the film formed, which is denser and more conducive to the isolation of water vapor.

[0087] For example, the second sub-layer 212 has better etching resistance than the first sub-layer 211. Since the side of the pixel definition layer 200 facing away from the substrate 100 will be etched during the manufacturing process of the display panel 10, by selecting a material with stronger etching resistance as the second sub-layer 212, the etching resistance of the pixel definition layer 200 can be improved, and the reliability of the display panel 10 can be further improved.

[0088] For example, the first sublayer 211 and the second sublayer 212 may be made of different materials. For instance, the material of the first sublayer 211 may include silicon nitride, and the material of the second sublayer 212 may include silicon oxide.

[0089] For example, the thickness of the first sublayer 211 is greater than or equal to 1000 angstroms and less than or equal to 5000 angstroms. For instance, the thickness of the first sublayer 211 is 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, etc.

[0090] For example, the thickness of the second sublayer 212 is greater than or equal to 500 angstroms and less than or equal to 3000 angstroms. For example, the thickness of the second sublayer 212 is 500 angstroms, 1000 angstroms, 2000 angstroms, 3000 angstroms, etc.

[0091] The first electrode 410 includes a first conductive layer 411 and a functional structure 414, and the pixel limiting portion 210 is disposed on the side of the functional structure 414 away from the substrate 100.

[0092] Optionally, the surface of the first conductive layer 411 facing away from the substrate 100 may contact the light-emitting functional layer 420, so that the first conductive layer 411 can be used to drive the light-emitting functional layer 420 to emit light.

[0093] Optionally, the material of the first conductive layer 411 includes a transparent conductive material, and the first electrode 410 further includes a second conductive layer 412 disposed on the side of the first conductive layer 411 and the functional structure 414 facing the substrate 100, and the material of the second conductive layer 412 includes silver.

[0094] By including silver in the material of the second conductive layer 412, the second conductive layer 412 can be used to improve the overall conductivity of the first electrode 410, and also to reflect the light emitted by the light-emitting functional layer 420 to the side away from the substrate 100, thereby improving the luminous efficiency of the light-emitting device 400. By including a conductive transparent material in the material of the first conductive layer 411, the first conductive layer 411 is less likely to affect the reflection of the light emitted by the light-emitting functional layer 420 by the second conductive layer 412.

[0095] Optionally, the first electrode 410 further includes a third conductive layer 413 disposed on the side of the second conductive layer 412 near the substrate 100. The materials of the first conductive layer 411 and the third conductive layer 413 both include conductive oxides, and / or the material of the functional structure 414 includes conductive oxides, so that the first conductive layer 411, the third conductive layer 413 and the functional structure 414 can all be used to suppress the oxidation of the second conductive layer 412, and the first conductive layer 411 can be used to improve the work function of the first electrode 410, and the third conductive layer 413 can be used to improve the adhesion between the first electrode 410 and the third insulating layer in the substrate 100.

[0096] For example, the second conductive layer 412 can be formed using silver, a metal material with excellent light reflectivity. The first conductive layer 411, the third conductive layer 413, and the functional structure 414 can be formed, for example, from transparent conductive oxides such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide).

[0097] Optionally, a microcavity structure may be formed between the second conductive layer 412 and a portion of the film layer (e.g., the first conductive layer 411) located on the side of the second conductive layer 412 away from the substrate 100, so as to utilize the microcavity effect to enhance the luminous efficiency and color saturation of the emitted light of the light-emitting device 400.

[0098] Optionally, the connection between the first electrode 410 and the pixel circuit 150 may refer to the connection between the third conductive layer 413 in the first electrode 410 and the pixel circuit 150.

[0099] Optionally, the pixel limiting portion 210 may cover the edges of the functional structure 414, the second conductive layer 412, and the third conductive layer 413.

[0100] Optionally, the display panel 10 also includes an isolation structure 300 disposed on the side of the functional structure 414 away from the substrate 100. The isolation structure 300 encloses and forms an isolation opening 301, which is connected to the pixel opening 220. The isolation structure 300 can also be used to participate in dividing the sub-pixels of the display panel 10.

[0101] Optionally, the relative positions of the pixel defining layer 200 and the isolation structure 300 can be arranged in various ways. For example, the isolation structure 300 can be disposed on the side of the pixel defining portion 210 away from the substrate 100, that is, the isolation structure 300 can be directly disposed on the pixel defining portion 210. Or, for example, the pixel defining portion 210 can have a slot structure (not shown in the figure), and at least part of the isolation structure 300 can be located in the slot structure, so that the isolation structure 300 is less likely to have an excessive height relative to the substrate 100, thereby effectively reducing the thickness of the display panel 10. For ease of description, the following embodiments will be described using the example of the isolation structure 300 being disposed on the side of the pixel defining portion 210 away from the substrate 100.

[0102] Optionally, both the isolation structure 300 and the pixel definition layer 200 can be mesh-like. The hollow areas in the mesh-like isolation structure 300 can form isolation openings 301, and the hollow areas in the mesh-like pixel definition layer 200 can form pixel openings 220. A single isolation opening 301 can be connected to a single pixel opening 220.

[0103] Optionally, the shapes of the orthographic projections of the pixel opening 220 and the corresponding isolation opening 301 on the substrate 100 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening 301 on the substrate 100 is larger than the area of ​​the orthographic projection of the pixel opening 220 connected to the isolation opening 301 on the substrate 100. The orthographic projections of the pixel opening 220 and the isolation opening 301 on the substrate 100 overlap.

[0104] Optionally, the first conductive layer 411, the light-emitting functional layer 420, and the second electrode 430 may be at least partially located within the isolation opening 301. For example, the first conductive layer 411, the light-emitting functional layer 420, and the second electrode 430 may all extend from within the pixel opening 220 into the isolation opening 301.

[0105] Optionally, the isolation opening 301 may include a first opening 301a, a second opening 301b and a third opening 301c. A first type of device 401 may be set corresponding to the first opening 301a, a second type of device 402 may be set corresponding to the second opening 301b and a third type of device 403 may be set corresponding to the third opening 301c.

[0106] Optionally, the first type of device 401 corresponding to the first opening 301a may refer to the first type of device 401 being at least partially located within the first opening 301a. Optionally, the second type of device 402 corresponding to the second opening 301b may refer to the second type of device 402 being at least partially located within the second opening 301b.

[0107] Optionally, the isolation structure 300 can be used to block and isolate the material of the light-emitting functional layer 420 and the second electrode 430 during the fabrication of the display panel 10.

[0108] Optionally, the shape of the isolation structure 300 may be described as overhanging.

[0109] Optionally, the isolation structure 300 may include a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100. The second isolation portion 320 may be disposed protruding from the first isolation portion 310 toward the isolation opening 301.

[0110] By providing the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 301, the second isolation portion 320 can block at least a portion of the material used to prepare the light-emitting functional layer 420 and the second electrode 430 when the material of the light-emitting functional layer 420 and the second electrode 430 of the display panel 10 is deposited, thereby isolating the light-emitting functional layer 420 and the second electrode 430 between adjacent light-emitting devices 400. It also facilitates the formation of multiple spaced light-emitting functional layers 420 and the second electrode 430, thereby eliminating the need to use a high-precision mask when depositing the light-emitting functional layer 420 and the second electrode 430 of the display panel 10. For example, it eliminates the need to use a high-precision metal mask (FMM) when depositing the light-emitting functional layer 420 and the second electrode 430, thereby significantly reducing the manufacturing cost of the display panel 10.

[0111] Optionally, the isolation structure 300 can also be used to block the material of the first conductive layer 411 during the fabrication of the display panel 10. For example, the first conductive layer 411 can be fabricated using a sputtering process. When sputtering the material of the first conductive layer 411, the second isolation portion 320 can block at least a portion of the material used to fabricate the first conductive layer 411, thereby isolating the first conductive layer 411 between adjacent light-emitting devices 400 and facilitating the formation of multiple spaced first conductive layers 411.

[0112] Optionally, the material of the isolation structure 300 includes a conductive material, and the second electrode 430 is electrically connected to the isolation structure 300, so that the second electrodes 430 of adjacent light-emitting devices 400 can be electrically connected through the isolation structure 300 to facilitate the control of the second electrode 430.

[0113] Optionally, the isolation structure 300 may include a third isolation portion 330 located on the side of the first isolation portion 310 near the substrate 100. The third isolation portion 330 protrudes from the first isolation portion 310 toward the isolation opening 301, thereby facilitating an increase in the electrical connection area between the second electrode 430 and the isolation structure 300.

[0114] Optionally, the materials of the first isolation portion 310 and the second isolation portion 320 may be different. During the fabrication of the isolation structure 300, the etching rate of the etching material on the second isolation portion 320 may be less than the etching rate of the etching material on the first isolation portion 310, so as to form a shape in which the second isolation portion 320 protrudes from the first isolation portion 310 toward the isolation opening 301.

[0115] Optionally, the material of the first isolation portion 310 includes a conductive material, specifically including at least one of aluminum (Al) and aluminum alloys. For example, the aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi).

[0116] Optionally, the second isolation portion 320 can be a single-layer structure or a multi-layer structure. If the second isolation portion 320 is a single-layer structure, the material of the second isolation portion 320 may include at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. If the second isolation portion 320 is a multi-layer structure, one layer of the second isolation portion 320 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and the other layer of the second isolation portion 320 may include a conductive oxide or an inorganic insulating material. The conductive oxide may be, for example, indium tin oxide (ITO) or indium zinc oxide (IZO).

[0117] Optionally, the materials of the first isolation portion 310 and the third isolation portion 330 may be different. During the fabrication of the isolation structure 300, the etching rate of the etching material on the third isolation portion 330 may be less than the etching rate of the etching material on the first isolation portion 310, so as to form a shape in which the third isolation portion 330 protrudes from the first isolation portion 310 toward the isolation opening 301.

[0118] Optionally, the material of the third isolation section 330 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0119] Optionally, the display panel 10 may also include a first encapsulation layer 500 disposed on the side of the light-emitting device 400 away from the substrate 100, the first encapsulation layer 500 being used to encapsulate the light-emitting device 400.

[0120] Optionally, the material of the first encapsulation layer 500 may include inorganic materials (e.g., the material of the first encapsulation layer 500 may include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON)) to better limit the influence of moisture on the light-emitting device 400. For example, the first encapsulation layer 500 may be prepared by chemical vapor deposition (CVD).

[0121] Optionally, the first encapsulation layer 500 may include a plurality of encapsulation units 510 spaced apart. Each encapsulation unit 510 may be correspondingly arranged with a single light-emitting device 400, that is, a single encapsulation unit 510 may be located above a single light-emitting device 400, so that each encapsulation unit 510 may encapsulate each light-emitting device 400 relatively independently.

[0122] For example, the packaging unit 510 may include a first unit 501 disposed on the side of the first type device 401 facing away from the substrate 100, a second unit 502 disposed on the side of the second type device 402 facing away from the substrate 100, and a third unit 503 disposed on the side of the third type device 403 facing away from the substrate 100. The first unit 501, the second unit 502, and the third unit 503 can be used to package the first type device 401, the second type device 402, and the third type device 403 relatively independently, respectively.

[0123] Optionally, the packaging unit 510 may extend through the sidewall of the isolation structure 300 to the side of the isolation structure 300 opposite to the substrate 100.

[0124] Figure 6 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0125] For example, the packaging unit 510 may include a first packaging portion 511 and a second packaging portion 512 connected to each other. The first packaging portion 511 is located within the isolation opening 301 and disposed on the side of the light-emitting device 400 facing away from the substrate 100. The second packaging portion 512 is located on the side of the isolation structure 300 facing the isolation opening 301. The surface of the first packaging portion 511 facing away from the substrate 100 and the surface of the second packaging portion 512 facing away from the isolation structure 300 form a gap space. Alternatively, the surface of the first packaging portion 511 facing away from the substrate 100 and the surface of the second packaging portion 512 facing away from the isolation structure 300 may not be connected, or, as... Figure 6 As shown, the surface of the first package portion 511 facing away from the substrate 100 and the surface of the second package portion 512 facing away from the isolation structure 300 can be at least partially connected to each other.

[0126] In some embodiments of this application, the shielding and blocking effect of the isolation structure 300 on the light-emitting device 400 can be used to realize the separate fabrication of light-emitting devices 400 of different colors.

[0127] Optionally, the isolation structure 300 can be used to fabricate the first type of device 401, the first unit 501 above the first type of device 401, the second type of device 402, the second unit 502 above the second type of device 402, the third type of device 403, and the third unit 503 above the third type of device 403.

[0128] For example, the first unit 501, the first type of device 401, the second unit 502, the second type of device 402, the third unit 503 and the third type of device 403 can be fabricated sequentially using the isolation structure 300.

[0129] Specifically, the third conductive layer 413, the second conductive layer 412, and the functional material PSa for forming the functional structure 414 of the first electrode 410 in each light-emitting device 400 can be prepared first. Then, the functional material PSa exposed from the first opening 301a can be patterned to form the functional structure 414 corresponding to the first opening 301a. Then, the materials of the first conductive layer 411, the light-emitting functional layer 420, and the second electrode 430 in the first type of device 401 can be vapor-deposited on the entire surface. The isolation structure 300 can isolate part of the material of the first conductive layer 411, part of the light-emitting functional layer 420, and part of the material of the second electrode 430 in the first type of device 401. Then, the material of the first encapsulation layer 500 is prepared on the whole surface. Then, at least part of the material of the first encapsulation layer 500 outside the first opening 301a is removed to form the first unit 501. Then, at least part of the material of the second electrode 430 of the first type device 401 outside the first opening 301a, at least part of the material of the light-emitting functional layer 420 of the first type device 401 outside the first opening 301a, and at least part of the material of the first conductive layer 411 of the first type device 401 outside the first opening 301a are removed in sequence to form the first type device 401 corresponding to the first opening 301a.

[0130] Then, the functional material PSa exposed from the second opening 301b can be patterned to form a functional structure 414 corresponding to the second opening 301b. Then, the materials of the first conductive layer 411, the light-emitting functional layer 420, and the second electrode 430 in the second type device 402 are vapor-deposited across the entire surface. The isolation structure 300 can isolate a portion of the material of the first conductive layer 411, a portion of the material of the light-emitting functional layer 420, and a portion of the material of the second electrode 430 in the second type device 402. Then, the material of the first encapsulation layer 500 is prepared across the entire surface. Then, at least a portion of the material of the first encapsulation layer 500 outside the second opening 301b is removed to form the second unit 502. Then, at least a portion of the material of the second electrode 430 of the second type device 402 outside the second opening 301b, at least a portion of the material of the light-emitting functional layer 420 of the second type device 402 outside the second opening 301b, and at least a portion of the material of the first conductive layer 411 of the second type device 402 outside the second opening 301b are sequentially removed to form the second type device 402 corresponding to the second opening 301b.

[0131] Then, the functional material PSa exposed from the third opening 301c can be patterned to form a functional structure 414 corresponding to the third opening 301c. Then, the materials of the first conductive layer 411, the light-emitting functional layer 420 and the second electrode 430 in the third type of device 403 can be vapor-deposited on the entire surface. The isolation structure 300 can isolate part of the material of the first conductive layer 411, part of the light-emitting functional layer 420 and part of the material of the second electrode 430 in the third type of device 403. Then, the material of the first encapsulation layer 500 is prepared on the whole surface. Then, at least a portion of the material of the first encapsulation layer 500 outside the third opening 301c is removed to form the third unit 503. Then, at least a portion of the material of the second electrode 430 of the third type device 403 outside the third opening 301c, at least a portion of the material of the light-emitting functional layer 420 of the third type device 403 outside the third opening 301c, and at least a portion of the material of the first conductive layer 411 of the third type device 403 outside the third opening 301c are removed in sequence to form the third type device 403 corresponding to the third opening 301c.

[0132] Optionally, the thickness of the functional structure 414 of the first type of device 401, the thickness of the functional structure 414 of the second type of device 402, and the thickness of the functional structure 414 of the third type of device 403 are the same, so that during the fabrication process of the display panel 10, the material of the entire functional structure 414 can be prepared, and then the material of the functional structure 414 can be patterned to form the functional structure 414 of each light-emitting device 400, thereby improving the fabrication efficiency of the functional structure 414.

[0133] Optionally, in the aforementioned embodiment of the display panel 10, the first conductive layer 411 of the first electrode 410 is less susceptible to the influence of etching materials. Under the isolation effect of the isolation structure 300, the thickness of the first conductive layer 411 of the first electrode 410 in each light-emitting device 400 can be controlled more precisely.

[0134] For example, the thickness of the first conductive layer 411 of the first electrode 410 in light-emitting devices 400 with different emission colors can be made different, so that the thickness of the first conductive layer 411 of the first electrode 410 in light-emitting devices 400 with different emission colors can be adjusted more precisely according to the luminous efficiency of light-emitting devices 400 with different emission colors. This allows the size of the microcavity structure in each light-emitting device 400 to be adjusted according to the luminous efficiency of light-emitting devices 400 with different emission colors, thereby improving the optical characteristics of the display panel 10.

[0135] As an example, when the light emission color of the first type of device 401 is blue and the light emission color of the second type of device 402 is green, the thickness of the first conductive layer 411 of the first type of device 401 can be less than the thickness of the first conductive layer 411 of the second type of device 402.

[0136] As an example, when the light emission color of the first type of device 401 is blue, the light emission color of the second type of device 402 is green, and the light emission color of the third type of device 403 is red, the thickness of the first conductive layer 411 of the first type of device 401 can be less than the thickness of the first conductive layer 411 of the second type of device 402, and the thickness of the first conductive layer 411 of the second type of device 402 is less than the thickness of the first conductive layer 411 of the third type of device 403.

[0137] Optionally, the thickness of the first conductive portion 411a of the first type of device 401 may be less than the thickness of the first conductive portion 411a of the second type of device 402, the thickness of the first conductive portion 411a of the second type of device 402 may be less than the thickness of the first conductive portion 411a of the third type of device 403, and / or, the thickness of the second conductive portion 411b of the first type of device 401 may be less than the thickness of the second conductive portion 411b of the second type of device 402, and the thickness of the second conductive portion 411b of the second type of device 402 may be less than the thickness of the second conductive portion 411b of the third type of device 403.

[0138] The pixel limiting portion 210 protrudes from the functional structure 414 toward the pixel opening 220, and an isolation groove UC is formed between the pixel limiting portion 210 and the functional structure 414. The isolation groove UC can be used to isolate the material of the first conductive layer 411 during the manufacturing process of the display panel 10, so that the material of the first conductive layer 411 can be discontinuous at the isolation groove UC, which facilitates the fabrication of the first conductive portion 411a and the second conductive portion 411b that are spaced apart at the isolation groove UC in the first conductive layer 411.

[0139] Optionally, the pixel limiting portion 210 protrudes from the functional structure 414 toward the pixel opening 220. This can mean that there may be a gap between the edge of the functional structure 414 toward the first conductive portion 411a and the edge of the pixel limiting portion 210 toward the pixel opening 220, and the gap between the edge of the pixel limiting portion 210 toward the pixel opening 220 and the first conductive portion 411a may be smaller than the gap between the edge of the functional structure 414 toward the first conductive portion 411a and the first conductive portion 411a.

[0140] Optionally, forming a partition groove UC between the pixel limiting portion 210 and the functional structure 414 may mean that the surface of the functional structure 414 facing the first conductive portion 411a and the surface of the pixel limiting portion 210 facing the substrate 100 can participate in enclosing and forming the partition groove UC.

[0141] Optionally, the functional structure 414 may be spaced apart from the first conductive part 411a.

[0142] Optionally, under the blocking effect of the partition groove UC, when sputtering the material of the first conductive layer 411, the pixel limiting part 210 can block at least part of the material used to prepare the first conductive layer 411, so that the first conductive layer 411 is discontinuous at the partition groove UC, so as to form the first conductive part 411a and the second conductive part 411b spaced apart at the partition groove UC in the first conductive layer 411.

[0143] The first conductive part 411a is located on the side of the pixel opening 220 near the substrate 100. The first conductive part 411a can be used to drive the light emission of the light-emitting functional layer 420 in the pixel opening 220.

[0144] For example, the surface of the first conductive portion 411a near the substrate 100 can contact the second conductive layer 412, and the surface of the first conductive portion 411a away from the substrate 100 can contact the light-emitting functional layer 420, so that the pixel circuit 150 can provide driving current to the light-emitting functional layer 420 through the third conductive layer 413, the second conductive layer 412 and the first conductive portion 411a.

[0145] Optionally, under the blocking effect of the partition groove UC, the first conductive part 411a may also be spaced apart from the pixel limiting part 210.

[0146] At least a portion of the second conductive portion 411b is located on the side of the pixel limiting portion 210 away from the substrate 100. Under the blocking effect of the partition groove UC, the first conductive portion 411a can be insulated from the second conductive portion 411b at the partition groove UC, thereby making it difficult for the first electrodes 410 of adjacent light-emitting devices 400 to be short-circuited through the second conductive portion 411b, thereby improving the working stability of the display panel 10.

[0147] For example, when the sputtering angle of the first conductive layer 411 cannot be adjusted well, and the second conductive part 411b of the first conductive layer 411 comes into contact with the second electrode 430 or the isolation structure 300, by setting the isolation groove UC, the first conductive part 411a can be insulated from the second conductive part 411b at the isolation groove UC, so that the first conductive part 411a of adjacent light-emitting devices 400 is not easily short-circuited through the second conductive part 411b, the second electrode 430 and the isolation structure 300, thereby improving the working stability of the display panel 10.

[0148] In some embodiments of this application, the first conductive layer 411 can be isolated at the partition groove UC to form a first conductive part 411a and a second conductive part 411b by reasonably setting the size of the partition groove UC and the thickness of the first conductive layer 411.

[0149] In some alternative embodiments, the partition groove UC has a dimension in the thickness direction Z of the display panel 10 that is greater than the maximum thickness of the first conductive layer 411, and / or the thickness of the functional structure 414 is greater than the maximum thickness of the first conductive layer 411.

[0150] For example, the dimension of the partition groove UC in the thickness direction Z of the display panel 10 may be greater than the thickness of the first conductive layer 411 of the third type device 403, and / or the thickness of the functional structure 414 may be greater than the thickness of the first conductive layer 411 of the third type device 403.

[0151] Optionally, the dimension of the partition groove UC in the thickness direction Z of the display panel 10 may be equal to the thickness of the functional structure 414.

[0152] Optionally, the first conductive portion 411a may be spaced apart from the pixel defining portion 210.

[0153] In these alternative embodiments, by reasonably setting the size of the partition groove UC and the thickness of the first conductive layer 411, it is not easy to form a continuous first conductive layer 411 material at the partition groove UC when sputtering the first conductive layer 411. This is beneficial to realize that the first conductive layer 411 can be isolated at the partition groove UC to form the first conductive part 411a and the second conductive part 411b, which in turn is beneficial to realize the insulation relationship between the first conductive part 411a and the second conductive part 411b.

[0154] In some embodiments of this application, the morphology of the light-emitting functional layer 420 at the partition groove UC can be configured in various ways.

[0155] In some alternative embodiments, such as Figures 4 to 6 As shown, the second electrode 430 and at least part of the light-emitting functional layer 420 are continuous at the partition groove UC.

[0156] Optionally, at least a portion of the light-emitting functional layer 420 may be continuous at the partition groove UC, which may refer to at least one film layer in the light-emitting functional layer 420 being continuous at the partition groove UC. For example, at least one of the hole injection layer, hole transport layer, electron blocking layer, light-emitting material layer, hole blocking layer, electron transport layer, and electron injection layer may be continuous at the partition groove UC.

[0157] Optionally, a portion of the film layer in the light-emitting functional layer 420 may be continuous at the partition groove UC, and another portion of the film layer in the light-emitting functional layer 420 may be partitioned at the partition groove UC. For example, a portion of the hole injection layer, hole transport layer, electron blocking layer, light-emitting material layer, hole blocking layer, electron transport layer, and electron injection layer may be continuous at the partition groove UC, and another portion may be partitioned at the partition groove UC.

[0158] In a further example, at least one of the hole injection layer and the hole transport layer may be isolated at the isolation slot UC, and at least one of the electron blocking layer, the luminescent material layer, the hole blocking layer, the electron transport layer, and the electron injection layer may be continuous at the isolation slot UC.

[0159] In these alternative embodiments, by setting at least a portion of the light-emitting functional layer 420 to be continuous at the partition groove UC, it is beneficial to form a more continuous second electrode 430 above the light-emitting functional layer 420, thereby enabling a more stable electrical connection between the second electrode 430 and the isolation structure 300, which in turn helps to improve the working stability of the display panel 10.

[0160] When a portion of the film layer in the light-emitting functional layer 420 is isolated at the isolation groove UC, it helps to reduce lateral leakage current in the light-emitting functional layer 420. For example, when at least one of the hole injection layer and the hole transport layer is in contact with the second electrode 430 or the isolation structure 300, by setting at least one of the hole injection layer and the hole transport layer to be isolated at the isolation groove UC, the lateral leakage current between the hole injection layer and the hole transport layer of adjacent light-emitting devices 400 through the second electrode 430 or the isolation structure 300 can be reduced, thereby improving the working stability of the display panel 10.

[0161] Figure 7 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0162] In some other alternative embodiments, such as Figure 7 As shown, the light-emitting functional layer 420 includes a first material portion 421 and a second material portion 422 spaced apart at the partition groove UC. The first material portion 421 is located on the side of the first conductive portion 411a away from the substrate 100, and the second material portion 422 is at least partially located on the side of the second conductive portion 411b away from the substrate 100. The second electrode 430 is continuous at the partition groove UC.

[0163] Optionally, both the first material section 421 and the second material section 422 may include a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting material layer, a hole blocking layer, an electron transport layer, and an electron injection layer.

[0164] In these optional embodiments, by making the second electrode 430 continuous at the partition groove UC, a relatively stable electrical connection can be established between the second electrode 430 and the isolation structure 300, thereby improving the operational stability of the display panel 10. Furthermore, by providing a first material portion 421 and a second material portion 422 that are separated at the partition groove UC to form a gap, the lateral leakage of the light-emitting functional layer 420 can be effectively reduced. For example, when the light-emitting functional layer 420 is in contact with the isolation structure 300, lateral leakage between the light-emitting functional layers 420 of adjacent light-emitting devices 400 is less likely to occur through the isolation structure 300, thus significantly improving the operational stability of the display panel 10.

[0165] In some alternative embodiments, the functional structure 414 may be disposed around the first conductive portion 411a.

[0166] Optionally, the functional structure 414 surrounds the first conductive portion 411a, which may mean that the orthographic projection of the functional structure 414 on the substrate 100 can surround the first conductive portion 411a.

[0167] Optionally, the orthographic projection of the functional structure 414 onto the substrate 100 may be in the form of a ring.

[0168] Optionally, the partition groove UC may be provided around the first conductive part 411a.

[0169] In these alternative embodiments, by providing the functional structure 414 around the first conductive portion 411a, the functional structure 414 can be provided more continuously around the periphery of the first conductive portion 411a. This allows the functional structure 414 and the pixel limiting portion 210 to form a continuous and surrounding partition groove UC around the first conductive portion 411a. This facilitates the complete separation of the material of the first conductive portion 411a from the material of the second conductive portion 411b during the fabrication of the display panel 10 using the partition groove UC.

[0170] In some embodiments of this application, there are various ways to set the relative positional relationship between the second conductive part 411b and the isolation structure 300.

[0171] like Figures 4 to 7 As shown, in some optional embodiments, the second conductive portion 411b may be spaced apart from the isolation structure 300.

[0172] Optionally, the second electrode 430 can directly contact the isolation structure 300 to achieve an electrical connection between the second electrode 430 and the isolation structure 300.

[0173] In these optional embodiments, by setting the second conductive part 411b to be spaced apart from the isolation structure 300, it is beneficial to further reduce the possibility of short circuit between the first electrodes 410 of adjacent light-emitting devices 400 through the second conductive part 411b, thereby improving the working stability of the display panel 10.

[0174] Figure 8 This is one of the partial cross-sectional views of a display panel 10 provided in another embodiment of this application. Figure 9 This is a second partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0175] like Figure 8 and Figure 9 As shown, in some alternative embodiments, the second conductive portion 411b is connected to the isolation structure 300, and a portion of the second electrode 430 extends to the surface of the second conductive portion 411b opposite to the substrate 100.

[0176] Optionally, a portion of the second electrode 430 extends to connect with the surface of the second conductive portion 411b opposite to the substrate 100. This can mean that a portion of the second electrode 430 can extend to the side of the second conductive portion 411b opposite to the substrate 100, and the second electrode 430 can contact the surface of the second conductive portion 411b opposite to the substrate 100.

[0177] Optionally, the second conductive portion 411b can be connected to the isolation structure 300 by reasonably adjusting the sputtering angle. Furthermore, the evaporation angle of the light-emitting functional layer 420 can be reasonably adjusted so that a portion of the second conductive portion 411b is not covered by the light-emitting functional layer 420, thereby facilitating the extension of a portion of the second electrode 430 to the surface opposite to the substrate 100 of the second conductive portion 411b for connection.

[0178] In these optional embodiments, by connecting the second conductive part 411b to the isolation structure 300, at least a portion of the second electrode 430 can be electrically connected to the isolation structure 300 through the second conductive part 411b. This helps to increase the electrical connection area between the second electrode 430 and the isolation structure 300 and to reduce the electrical connection impedance between the second electrode 430 and the isolation structure 300, thereby improving the reliability of the electrical connection between the second electrode 430 and the isolation structure 300.

[0179] In some embodiments of this application, the second conductive portion 411b may be connected to any film layer in the isolation structure 300.

[0180] In some alternative embodiments, such as Figure 8 As shown, the second conductive part 411b is connected to the third isolation part 330; or, as... Figure 9As shown, the second conductive part 411b is connected to both the first isolation part 310 and the third isolation part 330.

[0181] Optionally, the second conductive portion 411b may be located on the side of the third isolation portion 330 facing the pixel opening 220, and the second conductive portion 411b may be located on the side of at least a portion of the third isolation portion 330 away from the substrate 100.

[0182] Optionally, the second conductive part 411b is connected to the third isolation part 330, and the second conductive part 411b is spaced apart from the first isolation part 310.

[0183] Optionally, when the second conductive portion 411b is connected to the third isolation portion 330, and the second conductive portion 411b is spaced apart from the first isolation portion 310, a portion of the second electrode 430 may extend to the surface of the third isolation portion 330 facing away from the substrate 100 for connection; or, a portion of the second electrode 430 may extend to the surface of the third isolation portion 330 facing away from the substrate 100 and to the surface of the first isolation portion 310 facing the isolation opening 301 for connection.

[0184] Optionally, when the second conductive part 411b is connected to both the first isolation part 310 and the third isolation part 330, the second electrode 430 may not be in contact with the isolation structure 300, that is, the second electrode 430 may be electrically connected to the isolation structure 300 only through the second conductive part 411b; or, the second electrode 430 may be in contact with the third isolation part 330, so that while the second electrode 430 is electrically connected to the isolation structure 300 through the second conductive part 411b, the second electrode 430 may also be electrically connected directly to the third isolation part 330.

[0185] In these optional embodiments, the impedance of the electrical connection between the second electrode 430 and the isolation structure 300 can be adjusted by reasonably setting the arrangement range of the second conductive part 411b, so that the second electrode 430 can have a more suitable voltage, thereby improving the working stability of the display panel 10.

[0186] Figure 10 This is a third partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0187] like Figure 10 As shown, in some optional embodiments, the display panel 10 may further include a second encapsulation layer 600 disposed on the side of the first encapsulation layer 500 away from the substrate 100 and a third encapsulation layer 700 disposed on the side of the second encapsulation layer 600 away from the substrate 100. The arrangement of the second encapsulation layer 600 and the third encapsulation layer 700 can better improve the encapsulation effect of the light-emitting device 400.

[0188] Optionally, the material of the second encapsulation layer 600 may include organic materials, which facilitates the preparation of a thicker second encapsulation layer 600, thereby improving the encapsulation effect of the second encapsulation layer 600 and improving the flatness of the second encapsulation layer 600.

[0189] For example, the material of the second encapsulation layer 600 may include organic materials, so that the material of the second encapsulation layer 600 can have good fluidity during the preparation of the display panel 10, and the surface of the second encapsulation layer 600 away from the substrate 100 can have good flatness, which can facilitate the formation of subsequent film layers.

[0190] Optionally, at least a portion of the structure in the second encapsulation layer 600 may be fabricated using an inkjet printing (IJP) process.

[0191] Optionally, the material of the third encapsulation layer 700 may include inorganic materials, so that the third encapsulation layer 700 can better reduce the impact of moisture on the operation of the light-emitting device 400. For example, the third encapsulation layer 700 can be prepared by chemical vapor deposition.

[0192] Optionally, the material of the third encapsulation layer 700 includes at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The material of the second encapsulation layer 600 includes resin materials such as epoxy resin and acrylic resin.

[0193] Optionally, the second encapsulation layer 600 and the third encapsulation layer 700 are continuously disposed at least over the entire display area AA, and a portion thereof may also be disposed in the non-display area NA.

[0194] Optionally, the display panel 10 may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate 100, and a protective cover. This film layer may also be bonded to the display panel 10 via an adhesive layer such as optical clear adhesive (OCA).

[0195] Figure 11 This is a fourth partial cross-sectional view of a display panel 10 provided in another embodiment of this application.

[0196] like Figure 11 As shown, in some optional embodiments, the partition groove UC corresponding to the first type of device 401 has a first width, the partition groove UC corresponding to the second type of device 402 has a second width, and the partition groove UC corresponding to the third type of device 403 has a third width. The first width is smaller than the second width, and the second width is smaller than the third width.

[0197] Optionally, the width of the partition groove UC can refer to the size of the partition groove UC in the direction from the functional structure 414 corresponding to the partition groove UC to the first conductive part 411a. For example, W1 in the figure can indicate a first width, W2 in the figure can indicate a second width, and W3 in the figure can indicate a third width.

[0198] In these optional embodiments, since the thickness of the first conductive layer 411 of the first type of device 401 is less than the thickness of the first conductive layer 411 of the second type of device 402, and the thickness of the first conductive layer 411 of the second type of device 402 is less than the thickness of the first conductive layer 411 of the third type of device 403, the difficulty in isolating the material of the first conductive layer 411 of the third type of device 403 is greater than the difficulty in isolating the material of the first conductive layer 411 of the first type of device 401 and the second type of device 402 during the fabrication of the display panel 10. Therefore, by setting the width of the isolation groove UC corresponding to the third type of device 403 to be larger, the isolation groove UC corresponding to the third type of device 403 can better isolate the material of the first conductive layer 411 of the third type of device 403, thereby making it less likely for the first electrodes 410 of adjacent light-emitting devices 400 to short-circuit through the second conductive portion 411b. Furthermore, by setting the width of the partition groove UC corresponding to the first type of device 401 to be small, the functional structure 414 of the first type of device 401 can provide better support for the pixel limiting part 210 above the partition groove UC, making the pixel limiting part 210 above the partition groove UC corresponding to the first type of device 401 less prone to collapse, thereby improving the structural stability of the display panel 10.

[0199] Similarly, by setting the width of the partition groove UC corresponding to the second type of device 402 to be moderate, the partition groove UC corresponding to the second type of device 402 can effectively isolate the material of the first conductive layer 411 of the second type of device 402, while also preventing the pixel limiting part 210 above the partition groove UC corresponding to the second type of device 402 from collapsing.

[0200] Figure 12 This is a partially enlarged cross-sectional view of a display panel 10 provided in an embodiment of this application. Optionally, a1 in the figure may indicate a first included angle.

[0201] like Figure 12 As shown, in some optional embodiments, the functional structure 414 has a first sidewall 414a on the side facing the partition groove UC, and the first sidewall 414a has a first angle with the plane where the substrate 100 is located. At least two light-emitting devices 400 emit different colors, and the first angles corresponding to the light-emitting devices 400 with different colors are different.

[0202] Optionally, the first included angle corresponding to the first type of device 401 is different from the first included angle corresponding to the second type of device 402, and / or, the first included angle corresponding to the first type of device 401 is different from the first included angle corresponding to the third type of device 403, and / or, the first included angle corresponding to the second type of device 402 is different from the first included angle corresponding to the third type of device 403.

[0203] In these optional embodiments, when the sizes of the pixel openings 220 corresponding to light-emitting devices 400 of different emitting colors are different (for example, when the sizes of the pixel openings 220 corresponding to the first type of device 401, the second type of device 402, and the third type of device 403 are different), it is easy for the etching material to have different etching degrees on the material of the functional structure 414 exposed from the pixel openings 220 of different sizes during the manufacturing process of the display panel. For example, the etching time for the etching material to etch the material of the functional structure 414 exposed from the pixel openings 220 of different sizes is different, which makes it easy for the first included angles corresponding to light-emitting devices 400 with different emitting colors to be different.

[0204] Figure 13 This is a partial structural diagram of a pixel definition layer 200 and a functional structure 414 provided in an embodiment of this application. Optionally, Figure 13 The small dashed box in the diagram can be used to indicate the edge of functional structure 414.

[0205] like Figure 13 As shown, in some optional embodiments, in a single functional structure 414, the width of the functional structure 414 located on one side of the first conductive portion 411a is different from the width of the functional structure 414 located on the other side of the first conductive portion 411a.

[0206] For example, in a single functional structure 414, the width of the functional structure 414 located on one side of the first conductive portion 411a in the first direction X is different from the width of the functional structure 414 located on the other side of the first conductive portion 411a in the first direction X, and / or, the width of the functional structure 414 located on one side of the first conductive portion 411a in the second direction Y is different from the width of the functional structure 414 located on the other side of the first conductive portion 411a in the second direction Y, and / or, the width of the functional structure 414 located on at least one side of the first conductive portion 411a in the first direction X is different from the width of the functional structure 414 located on at least one side of the first conductive portion 411a in the second direction Y.

[0207] Optionally, the minimum spacing between adjacent functional structures 414 can be the same.

[0208] In these alternative embodiments, when the widths of the pixel limiting portions 210 located between different light-emitting devices 400 are different, a wider functional structure 414 can be provided below the pixel limiting portion 210 with a wider width, so as to enhance the supporting effect of the functional structure 414 on the pixel limiting portion 210, making the pixel limiting portion 210 above the partition groove UC less prone to collapse.

[0209] For example, when the width of the pixel limiting portion 210 located on one side of the pixel opening 220 in the first direction X is greater than the width of the pixel limiting portion 210 located on the other side of the pixel opening 220 in the first direction X, the width of the functional structure 414 located on one side of the first conductive portion 411a in the first direction X can be set to be greater than the width of the functional structure 414 located on the other side of the first conductive portion 411a in the first direction X.

[0210] When the width of the pixel limiting portion 210 located on one side of the pixel opening 220 in the second direction Y is greater than the width of the pixel limiting portion 210 located on the other side of the pixel opening 220 in the second direction Y, the width of the functional structure 414 located on one side of the first conductive portion 411a in the second direction Y can be set to be greater than the width of the functional structure 414 located on the other side of the first conductive portion 411a in the second direction Y.

[0211] Figure 14 This is a partial structural diagram of a pixel definition layer 200, an isolation structure 300, and a functional structure 414 provided in an embodiment of this application. Optionally, Figure 14 The small dashed box in the image indicates the edge of functional structure 414 facing the partition groove UC. This is for ease of demonstration. Figure 14 The edge of functional structure 414 facing away from the partition groove UC is not shown in the figure. Optionally, D1 in the figure may indicate the first spacing.

[0212] like Figure 14 As shown, in some optional embodiments, the orthographic projection of the edge of the functional structure 414 toward the partition groove UC side onto the substrate 100 has a first gap with the orthographic projection of the edge of the second isolation portion 320 toward the isolation opening 301 side onto the substrate 100. The functional structure 414 is arranged around the first conductive portion 411a. In a single functional structure 414, the first gap corresponding to the functional structure 414 located on one side of the first conductive portion 411a is different from the first gap corresponding to the functional structure 414 located on the other side of the first conductive portion 411a.

[0213] For example, the first spacing corresponding to the functional structure 414 located on one side of the first conductive portion 411a in the first direction X is different from the first spacing corresponding to the functional structure 414 located on the other side of the first conductive portion 411a in the first direction X, and / or, the first spacing corresponding to the functional structure 414 located on one side of the first conductive portion 411a in the second direction Y is different from the first spacing corresponding to the functional structure 414 located on the other side of the first conductive portion 411a in the second direction Y, and / or, the first spacing corresponding to the functional structure 414 located on at least one side of the first conductive portion 411a in the first direction X is different from the first spacing corresponding to the functional structure 414 located on at least one side of the first conductive portion 411a in the second direction Y.

[0214] Optionally, the width of the isolation structure 300 at each location is the same. For example, the width of the first isolation portion 310 at each location is the same, the width of the second isolation portion 320 at each location is the same, and the width of the third isolation portion 330 at each location is the same.

[0215] In these alternative embodiments, when the width of the isolation structure 300 at each location is the same and the width of the pixel limiting portion 210 located between different light-emitting devices 400 is different, if a wider functional structure 414 is provided below the wider pixel limiting portion 210, the first distance between the edge of the wider functional structure 414 and the edge of the second isolation portion 320 will be greater than the first distance between the edge of the narrower functional structure 414 and the edge of the second isolation portion 320.

[0216] Figure 15 This is a partial structural diagram of a pixel definition layer 200 and a second conductive part 411b provided in an embodiment of this application.

[0217] like Figure 15 As shown, in some optional embodiments, in a single pixel opening 220, the second conductive portion 411b is located on the side of the pixel limiting portion 210 on one side of the pixel opening 220 in the first preset direction DR1 that is away from the substrate 100, and the second conductive portion 411b is spaced apart from the pixel limiting portion 210 on the other side of the pixel opening 220 in the first preset direction DR1; and / or, the second conductive portion 411b is spaced apart from the pixel limiting portions 210 on both sides of the pixel opening 220 in the second preset direction DR2, wherein the first preset direction DR1 and the second preset direction DR2 intersect the thickness direction of the display panel 10 in pairs.

[0218] Optionally, the first preset direction DR1 can be the scanning direction when sputtering the first conductive layer 411, and the second preset direction DR2 can be a direction perpendicular to the scanning direction when sputtering the first conductive layer 411.

[0219] In these optional embodiments, when the first preset direction DR1 is used as the scanning direction when sputtering the first conductive layer 411, as the sputtering equipment scans, under the shielding effect of the isolation structure 300, the material of the first conductive layer 411 will fall unevenly into the pixel opening 220, thereby easily forming a morphology in which "the second conductive part 411b is located on the side of the pixel limiting part 210 on the first preset direction DR1 away from the substrate 100, and the second conductive part 411b and the pixel limiting part 210 on the other side of the pixel opening 220 on the first preset direction DR1 are spaced apart", and / or, it is easy to form a morphology in which "the second conductive part 411b and the pixel limiting part 210 on both sides of the pixel opening 220 on the second preset direction DR2 are spaced apart", thereby further making it difficult for the first electrodes 410 of adjacent light-emitting devices 400 to be short-circuited through the second conductive part 411b.

[0220] Figure 16 This is a schematic flowchart of a display panel manufacturing method provided in an embodiment of this application. Figure 17 This is one of the schematic diagrams illustrating the fabrication process of a display panel fabrication method provided in this application embodiment. Figure 18 This is a second schematic diagram illustrating the fabrication process of a display panel fabrication method provided in this application embodiment. Figure 19 This is the third schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment. Figure 20 This is the fourth schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment. Figure 21 This is the fifth schematic diagram of the fabrication process of a display panel fabrication method provided in this application embodiment. Figure 22 This is the sixth schematic diagram of the fabrication process of a display panel fabrication method provided in this application embodiment. Figure 23 This is the seventh schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment. Figure 24 This is the eighth schematic diagram of the manufacturing process of a display panel manufacturing method provided in this application embodiment.

[0221] The second aspect of this application provides a method for manufacturing a display panel. The display panel 10 manufactured by the method can be any of the display panels 10 provided in the first aspect of the application described above. Please refer to... Figures 1 to 10 And see Figures 16 to 24 The manufacturing methods for the display panel include:

[0222] Step S10: As Figure 17 As shown, a substrate 100 is provided.

[0223] Step S20: An electrode material layer is formed on the substrate 100.

[0224] Optionally, the electrode material layer can be used to form the third conductive layer 413, the second conductive layer 412, and the functional structure 414 as described in any of the foregoing embodiments. Therefore, in the direction away from the substrate 100, the electrode material layer may include the material of the third conductive layer 413, the material of the second conductive layer 412, and the material of the functional structure 414, which are stacked sequentially.

[0225] Step S30: As Figure 18 As shown, the electrode material layer is patterned to form the initial structure PS.

[0226] Optionally, the initial structure PS may include a third conductive layer 413, a second conductive layer 412 located on the side of the third conductive layer 413 facing away from the substrate 100, and a functional material PSa located on the side of the second conductive layer 412 facing away from the substrate 100.

[0227] Optionally, the functional material PSa can be used to form the functional structure 414 described in any of the foregoing embodiments.

[0228] Step S40: As Figure 19 As shown, a pixel definition material layer 11 is formed on the initial structure PS and the substrate 100.

[0229] Optionally, the pixel definition material layer 11 can be used to prepare the pixel definition layer 200 as described in any of the foregoing embodiments.

[0230] Optionally, after step S40, the method further includes: forming an isolation material layer 12 on the side of the pixel definition material layer 11 facing away from the substrate 100.

[0231] Optionally, the insulating material layer 12 can be used to form the insulating structure 300 in any of the foregoing embodiments.

[0232] Optionally, in the direction away from the substrate 100, the isolation material layer 12 may include a first isolation material layer 12a, a second isolation material layer 12b, and a third isolation material layer 12c stacked sequentially, wherein the first isolation material layer 12a, the second isolation material layer 12b, and the third isolation material layer 12c may be used to form the third isolation portion 330, the first isolation portion 310, and the second isolation portion 320 in any of the foregoing embodiments.

[0233] Step S50: As Figure 20 As shown, the pixel definition material layer 11 is patterned to form at least a partial pixel defining portion 210 and at least a partial pixel opening 220 formed by the pixel defining portion 210.

[0234] Optionally, step S50 includes: patterning the isolation material layer 12 to form at least a partial isolation opening 301, the isolation opening 301 being connected to the pixel opening 220, and the isolation opening 301 including a first opening 301a.

[0235] Optionally, in step S50, only a portion of the isolation openings 301 and some of the pixel openings 220 may be formed (for example, in step S50, only the first opening 301a and the pixel opening 220 communicating with the first opening 301a may be formed, or in step S50, only the first opening 301a, the pixel opening 220 communicating with the first opening 301a, the second opening 301b, and the pixel opening 220 communicating with the second opening 301b may be formed). The remaining isolation openings 301 may be formed before the corresponding materials for the light-emitting device 400 are formed in subsequent processes. Alternatively, in step S50, all the isolation openings 301 and pixel openings 220 may be formed at once (for example, in step S50, the first opening 301a, the pixel opening 220 communicating with the first opening 301a, the second opening 301b, the pixel opening 220 communicating with the second opening 301b, the third opening 301c, and the pixel opening 220 communicating with the third opening 301c may be formed).

[0236] Step S60: As Figure 21 As shown, the initial structure PS exposed from at least a portion of the pixel opening 220 is patterned to form at least a portion of the functional structure 414. The pixel limiting portion 210 protrudes from the functional structure 414 toward the pixel opening 220, and a partition groove UC is formed between the pixel limiting portion 210 and the functional structure 414.

[0237] Optionally, step S60 includes: patterning the functional material PSa exposed from the pixel opening 220 to form a functional structure 414.

[0238] Optionally, in step S60, only the functional material PSa exposed from the first opening 301a formed can be patterned to form a partial functional structure 414. The remaining functional structure 414 can be formed after the corresponding isolation opening 301 and pixel opening 220 are formed in the subsequent preparation process, and before the corresponding light-emitting device 400 is prepared. This allows the functional material PSa to provide better protection for the second conductive layer 412 and the third conductive layer 413 of the light-emitting device 400 that is being prepared.

[0239] For example, before fabricating the first type of device 401, the functional material PSa exposed from the first opening 301a formed during fabrication can be patterned, so that the functional material PSa in the second opening 301b and the third opening 301c can better cover the underlying second conductive layer 412 and the third conductive layer 413. This allows the functional material PSa in the second opening 301b and the third opening 301c to provide better protection for the underlying second conductive layer 412 and the third conductive layer 413 during the fabrication of the first type of device 401.

[0240] Similarly, after completing the first type of device 401 and before fabricating the second type of device 402, the functional material PSa exposed from the second opening 301b formed during fabrication can be patterned, so that the functional material PSa in the third opening 301c can better cover the second conductive layer 412 and the third conductive layer 413 below. This allows the functional material PSa in the third opening 301c to provide better protection for the second conductive layer 412 and the third conductive layer 413 below during the fabrication of the second type of device 402.

[0241] For ease of description, the following embodiments will be described using the example of all isolation openings 301 and pixel openings 220 being prepared in one step S50. For example, step S50 includes: patterning the isolation material layer 12 to form isolation openings 301, the isolation openings 301 being connected to the pixel openings 220, and the isolation openings 301 including a first opening 301a, a second opening 301b, and a third opening 301c.

[0242] For example, step S60 includes: patterning the initial structure PS exposed from the first opening 301a and the pixel opening 220 connected to the first opening 301a to form a partial functional structure 414.

[0243] Step S70: As Figures 22 to 24 As shown, a first conductive layer 411 is formed. The first conductive layer 411 includes a first conductive portion 411a and a second conductive portion 411b spaced apart at the partition groove UC. The first conductive portion 411a is located on the side of the pixel opening 220 close to the substrate 100, and at least a portion of the second conductive portion 411b is located on the side of the pixel limiting portion 210 away from the substrate 100.

[0244] Optionally, step S70 includes:

[0245] Step S71: Sequentially prepare the first conductive electrode material and the first type of device material on the entire surface.

[0246] Step S72: Sequentially remove a portion of the first type of device material and the first conductive electrode material outside the first opening 301a to form a first type of device 401 corresponding to the first opening 301a. In the direction away from the substrate 100, the first type of device 401 includes a first electrode 410, a light-emitting functional layer 420 and a second electrode 430 stacked sequentially. The first electrode 410 of the first type of device 401 includes a first conductive layer 411 and a functional structure 414.

[0247] Optionally, the first conductive electrode material is used to form the first conductive layer 411 of the first electrode 410 in the first type of device 401 in any of the foregoing embodiments.

[0248] Optionally, the first type of device material may include a first type of light-emitting material and a first conductive material located on the side of the first type of light-emitting material facing away from the substrate 100. The first type of light-emitting material and the first conductive material may be used to participate in forming the light-emitting functional layer 420 of the first type of device 401 in any of the foregoing embodiments and the second electrode 430 of the first type of device 401, respectively.

[0249] Optionally, step S71 includes: forming a first packaging material on the entire side of the first type of device material away from the substrate 100.

[0250] Optionally, the first encapsulation material may be used to form the first unit 501 in any of the foregoing embodiments.

[0251] Optionally, before sequentially removing the portion of the first type of device material and the first conductive electrode material outside the first opening 301a, the process includes:

[0252] Remove a portion of the first encapsulation material outside the first opening 301a to form the first unit 501.

[0253] Optionally, after sequentially removing a portion of the first type of device material and the first conductive electrode material outside the first opening 301a, the method further includes:

[0254] The initial structure PS exposed from the second opening 301b and the pixel opening 220 connected to the second opening 301b is patterned to form a partial functional structure 414.

[0255] The second conductive electrode material and the second type of device material are prepared sequentially by covering the entire surface.

[0256] The second type of device material and the second conductive electrode material outside the second opening 301b are removed in sequence to form a second type of device 402 corresponding to the second opening 301b. In the direction away from the substrate 100, the second type of device 402 includes a first electrode 410, a light-emitting functional layer 420 and a second electrode 430 stacked in sequence. The first electrode 410 of the second type of device 402 includes a first conductive layer 411 and a functional structure 414.

[0257] Optionally, the second conductive electrode material is used to form the first conductive layer 411 of the first electrode 410 in the second type of device 402 in any of the foregoing embodiments.

[0258] Optionally, the second type of device material may include a second type of light-emitting material and a second type of conductive material located on the side of the second type of light-emitting material facing away from the substrate 100. The second type of light-emitting material and the second conductive material may be used to participate in forming the light-emitting functional layer 420 of the second type of device 402 in any of the foregoing embodiments and the second electrode 430 of the second type of device 402, respectively.

[0259] Optionally, the second conductive electrode material and the second type of device material are prepared sequentially over the entire surface, including: preparing the second encapsulation material over the entire surface of the second type of device material on the side opposite to the substrate 100.

[0260] Optionally, the second encapsulation material may be used to form the second unit 502 in any of the foregoing embodiments.

[0261] Optionally, before sequentially removing a portion of the second type of device material and the second conductive electrode material outside the second opening 301b, the process includes:

[0262] Remove a portion of the second encapsulation material outside the second opening 301b to form the second unit 502.

[0263] Optionally, after sequentially removing a portion of the second type of device material and the second conductive electrode material outside the second opening 301b, the method further includes:

[0264] The initial structure PS exposed from the third opening 301c and the pixel opening 220 connected to the third opening 301c is patterned to form a partial functional structure 414.

[0265] The third conductive electrode material and the third type of device material are sequentially prepared across the entire surface;

[0266] The third type of device material and the third conductive electrode material outside the third opening 301c are removed in sequence to form a third type of device 403 corresponding to the third opening 301c. In the direction away from the substrate 100, the third type of device 403 includes a first electrode 410, a light-emitting functional layer 420 and a second electrode 430 stacked in sequence. The first electrode 410 of the third type of device 403 includes a first conductive layer 411 and a functional structure 414.

[0267] Optionally, the third conductive electrode material is used to form the first conductive layer 411 of the first electrode 410 in the third type of device 403 in any of the foregoing embodiments.

[0268] Optionally, the third type of device material may include a third type of light-emitting material and a third type of conductive material located on the side of the third type of light-emitting material facing away from the substrate 100. The third type of light-emitting material and the third type of conductive material may be used to participate in forming the light-emitting functional layer 420 and the second electrode 430 of the third type of device 403 in any of the foregoing embodiments, respectively.

[0269] Optionally, the third conductive electrode material and the third type of device material are prepared sequentially over the entire surface, including: preparing the third encapsulation material over the entire surface of the third type of device material on the side opposite to the substrate 100.

[0270] Optionally, a third encapsulation material may be used to form the third unit 503 in any of the foregoing embodiments.

[0271] Optionally, before sequentially removing the portion of the third type of device material and the third conductive electrode material outside the third opening 301c, the process includes:

[0272] Remove part of the third encapsulation material outside the third opening 301c to form the third unit 503.

[0273] In the method for fabricating a display panel provided in this application embodiment, a functional material PSa is prepared on the third conductive layer 413 and the second conductive layer 412. After the preparation of the pixel opening 220 and the isolation opening 301 above the functional material PSa is completed, the functional material PSa is patterned to expose the second conductive layer 412. This allows the functional material PSa to better protect the underlying second conductive layer 412 and the third conductive layer 413 during the patterning process of the pixel definition material layer 11 and the isolation material layer 12, thereby improving the structural stability of the first electrode 410 of each light-emitting device 400.

[0274] By patterning the functional material PSa exposed from the pixel opening 220, a shape is formed in which the pixel defining portion 210 protrudes from the functional structure 414 towards the pixel opening 220. Specifically, by patterning the functional material PSa exposed from the pixel opening 220, a partition groove UC is formed between the pixel defining portion 210 and the functional structure 414. This allows the material of the first conductive layer 411 to be discontinuous at the partition groove UC during subsequent fabrication, facilitating the formation of the first conductive portion 411a and the second conductive portion 411b spaced apart at the partition groove UC. The partition groove UC isolates the first conductive portion 411a from the second conductive portion 411b at the partition groove UC, making it less likely for short circuits to occur between the first electrodes 410 of adjacent light-emitting devices 400 through the second conductive portion 411b, thereby significantly improving the operational stability of the display panel 10.

[0275] An embodiment of the third aspect of this application provides a display device, which includes a display panel 10 of any of the above embodiments, or a display panel 10 prepared by the preparation method of any of the above embodiments. Since the display device provided by the third aspect of this application includes the display panel 10 of any of the first aspects, or a display panel 10 prepared by the preparation method of any of the second aspects, the display device provided by the third aspect of this application has the beneficial effects of the display panel 10 of any of the first aspects or the display panel 10 prepared by the preparation method of any of the second aspects, which will not be elaborated further here.

[0276] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0277] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0278] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; Multiple light-emitting devices, including a first type of device and a second type of device with different light-emitting colors, are disposed on one side of the substrate. In the direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence. The first electrode includes a portion of a first conductive layer and a functional structure. A pixel definition layer includes a pixel defining portion and a plurality of pixel openings enclosed by the pixel defining portion. The pixel defining portion is disposed on the side of the functional structure away from the substrate. The first conductive layer, the light-emitting functional layer and the second electrode are at least partially located in the corresponding pixel openings. The pixel defining portion protrudes from the functional structure toward the pixel openings, and a partition groove is formed between the pixel defining portion and the functional structure. An isolation structure is disposed on the side of the pixel defining portion away from the substrate. The isolation structure encloses and forms a plurality of isolation openings. The isolation openings are connected to the corresponding pixel openings. The material of the isolation structure includes a conductive material. The first conductive layer includes a first conductive portion and a second conductive portion spaced apart at the partition groove. The first electrode includes the first conductive portion of the first conductive layer. The thickness of the first conductive portion of the first type of device is less than the thickness of the first conductive portion of the second type of device. The first conductive portion is located on the side of the pixel opening close to the substrate. At least a portion of the second conductive portion is located on the side of the pixel defining portion away from the substrate. The light-emitting functional layer is spaced apart from the isolation structure by the second conductive portion. The second conductive portion is connected to the isolation structure. A portion of the second electrode is electrically connected to the surface of the second conductive portion on the side away from the substrate and to the isolation structure.

2. The display panel according to claim 1, characterized in that, The dimension of the partition groove in the thickness direction of the display panel is greater than the maximum thickness of the first conductive layer, and / or the thickness of the functional structure is greater than the maximum thickness of the first conductive layer.

3. The display panel according to claim 2, characterized in that, The first conductive portion is spaced apart from the pixel defining portion.

4. The display panel according to claim 1, characterized in that, The light-emitting device also includes a third type of device, wherein the light-emitting colors of the first type of device, the second type of device and the third type of device are different from each other, and the thickness of the first conductive layer of the second type of device is less than the thickness of the first conductive layer of the third type of device.

5. The display panel according to claim 4, characterized in that, The thickness of the functional structure of the first type of device, the thickness of the functional structure of the second type of device, and the thickness of the functional structure of the third type of device are the same.

6. The display panel according to claim 4, characterized in that, The partition groove corresponding to the first type of device has a first width, the partition groove corresponding to the second type of device has a second width, and the partition groove corresponding to the third type of device has a third width. The first width is smaller than the second width, and the second width is smaller than the third width.

7. The display panel according to claim 4, characterized in that, The first type of device emits blue light, the second type of device emits green light, and the third type of device emits red light.

8. The display panel according to claim 1, characterized in that, The functional structure has a first sidewall facing the partition groove, and the first sidewall has a first angle with the plane of the substrate. At least two of the light-emitting devices emit different colors, and the first included angles corresponding to the light-emitting devices with different colors are different.

9. The display panel according to claim 1, characterized in that, The functional structure is arranged around the first conductive part.

10. The display panel according to claim 9, characterized in that, In a single functional structure, the width of the functional structure located on one side of the first conductive portion is different from the width of the functional structure located on the other side of the first conductive portion.

11. The display panel according to claim 1, characterized in that, In a single pixel opening, the second conductive portion is located on the side of the pixel limiting portion facing away from the substrate on one side of the pixel opening in a first preset direction, and the second conductive portion is spaced apart from the pixel limiting portion on the other side of the pixel opening in the first preset direction; And / or, the second conductive portion is spaced apart from the pixel defining portions on both sides of the pixel opening in a second preset direction. The first preset direction and the second preset direction intersect each other with the thickness direction of the display panel.

12. The display panel according to claim 1, characterized in that, The light-emitting functional layer includes a first material portion and a second material portion spaced apart at the partition groove. The first material portion is located on the side of the first conductive portion away from the substrate, and the second material portion is at least partially located on the side of the second conductive portion away from the substrate. The second electrode is continuous at the partition groove. Alternatively, the second electrode and at least a portion of the light-emitting functional layer are continuous at the partition groove.

13. The display panel according to claim 1, characterized in that, The isolation structure includes a first isolation portion, a second isolation portion located on the side of the first isolation portion away from the substrate, and a third isolation portion located on the side of the first isolation portion closer to the substrate. Both the second isolation portion and the third isolation portion protrude from the first isolation portion toward the isolation opening. The second conductive part is connected to the third isolation part; Alternatively, the second conductive part is connected to both the first isolation part and the third isolation part.

14. The display panel according to claim 13, characterized in that, The second conductive part is connected to the third insulating part, and the second conductive part is spaced apart from the first insulating part. A portion of the second electrode extends to a surface that is connected to the third isolation portion on the side opposite to the substrate; Alternatively, a portion of the second electrode extends to the surface opposite to the substrate of the third isolation portion and is connected to the surface of the first isolation portion facing the isolation opening.

15. The display panel according to claim 1, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion facing away from the substrate. A first distance exists between the orthographic projection of the edge of the functional structure facing the partition groove on the substrate and the orthographic projection of the edge of the second isolation portion facing the isolation opening on the substrate. The functional structure is disposed around the first conductive portion. In a single functional structure, the first spacing corresponding to the functional structure located on one side of the first conductive portion is different from the first spacing corresponding to the functional structure located on the other side of the first conductive portion.

16. The display panel according to claim 1, characterized in that, The first conductive layer is made of a transparent conductive material, and the first electrode further includes a second conductive layer disposed on the side of the first conductive layer and the functional structure facing the substrate, wherein the material of the second conductive layer is silver.

17. The display panel according to claim 16, characterized in that, The first electrode further includes a third conductive layer disposed on the side of the second conductive layer near the substrate, wherein the materials of the first conductive layer and the third conductive layer both include conductive oxides; And / or, the material of the functional structure includes conductive oxides.

18. A method for manufacturing a display panel, characterized in that, include: Provide substrate; An electrode material layer is formed on a substrate; The electrode material layer is patterned to form an initial structure; A pixel definition material layer is formed on the initial structure and the substrate; An isolation material layer is formed on the side of the pixel definition material layer opposite to the substrate, wherein the material of the isolation material layer includes a conductive material; The isolation material layer is patterned to form at least a partial isolation opening, and the pixel definition material layer is patterned to form at least a partial pixel defining portion and at least a partial pixel opening enclosed by the pixel defining portion, wherein the material of the isolation material layer includes a conductive material, the isolation opening is in communication with the pixel opening, and the isolation opening includes a first opening and a second opening; The initial structure exposed from the first opening and the pixel opening communicating with the first opening is patterned to form at least a partial functional structure, wherein the pixel defining portion protrudes from the functional structure toward the pixel opening and a partition groove is formed between the pixel defining portion and the functional structure. The first conductive electrode material and the first type of device material are sequentially prepared by covering the entire surface. The first type of device material and the first conductive electrode material outside the first opening are removed in sequence to prepare a first type of device that includes a portion of the first conductive electrode material and is disposed corresponding to the first opening. In the direction away from the substrate, the first type of device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence. The first electrode of the first type of device includes a portion of the first conductive layer and the functional structure. The initial structure exposed from the second opening and the pixel opening connected to the second opening is patterned to form a partial functional structure. The second conductive electrode material and the second type of device material are prepared sequentially by covering the entire surface. The second type of device material and the second conductive electrode material outside the second opening are removed in sequence to prepare a portion of the first conductive layer including the second conductive electrode material and a second type of device corresponding to the second opening. In the direction away from the substrate, the second type of device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence. The first electrode of the second type of device includes a portion of the first conductive layer and the functional structure. Furthermore, the first conductive layer includes a first conductive portion and a second conductive portion spaced apart at the partition groove; the first electrode of the first type of device includes the first conductive portion of the first conductive layer; the first electrode of the second type of device includes the first conductive portion of the first conductive layer; the thickness of the first conductive portion of the first type of device is less than the thickness of the first conductive portion of the second type of device; the first conductive portion is located on the side of the pixel opening close to the substrate; at least a portion of the second conductive portion is located on the side of the pixel defining portion away from the substrate; the light-emitting functional layer of the first type of device is spaced apart from the isolation material layer by the second conductive portion; the second conductive portion is connected to the isolation material layer; and a portion of the second electrode of the first type of device is electrically connected to the surface of the second conductive portion on the side away from the substrate and the isolation material layer.

19. The method according to claim 18, characterized in that, The initial structure includes a third conductive layer, a second conductive layer located on the side of the third conductive layer facing away from the substrate, and a functional material located on the side of the second conductive layer facing away from the substrate. The step of patterning the initial structure exposed from the pixel opening to form a functional structure includes: The functional material exposed from the pixel opening is patterned to form a functional structure.

20. The method according to claim 18, characterized in that, The isolation opening also includes a third opening. After sequentially removing the portion of the second type of device material and the second conductive electrode material outside the second opening, the method further includes: The initial structure exposed from the third opening and the pixel opening connected to the third opening is patterned to form a partial functional structure. The third conductive electrode material and the third type of device material are sequentially prepared across the entire surface; The third type of device material and the third conductive electrode material outside the third opening are removed in sequence to form a third type of device corresponding to the third opening. In the direction away from the substrate, the third type of device includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence. The first electrode of the third type of device includes the first conductive layer and the functional structure.

21. A display device, characterized in that, It includes a display panel as described in any one of claims 1 to 17, or a display panel prepared by the method as described in any one of claims 18 to 20.

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