Image inspection device, image inspection method, and image inspection program for electronic component

Abstract

An image inspection apparatus (100) of an electronic component (1) comprises: a position detection unit (10) for detecting a product position PP on the basis of a product image P; an image correction unit (20) for generating, on the basis of the product position PP, a corrected product image Pc in which the product image P is corrected; a first inspection unit (30) for performing a first inspection T1 with a first inspection logic L1 on the basis of the corrected product image Pc, and outputting a first inspection result T1R; a relief check unit (40) for, when the first check result T1R satisfies a specific condition in the first check logic L1, performing a relief check Tk having a relief check logic Lk different from the first check logic L1, and outputting a relief check result TkR; and a comprehensive determination unit (50) for comprehensively determining the electronic component (1) on the basis of the first inspection result T1R and the relief inspection result TkR.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic component image inspection apparatus, an electronic component image inspection method, and an electronic component image inspection program. BACKGROUND

[0002] In the past, there have been apparatuses that, after performing inspection A of detecting the position of a product by photographing the product, simultaneously perform inspection B and inspection C of detecting various appearance defects, and perform appearance inspection to comprehensively determine whether the product is a good product only when none of the inspections are determined to be defective (for example, Patent Literature 1 and Patent Literature 2).

[0003] In the past appearance inspection, each inspection has its own image inspection standard, and the inspection standards are set so that a defective product of a specific type of appearance defect is always determined to be defective (NG). Further, the image inspection standards in the past can only set simple inspection standards, and one inspection can only produce one inspection result. On the other hand, some defective products are not much different from good products in images. Even such defective products need to be determined to be defective in appearance inspection. However, the inspection standards of each inspection are too strict, and some products that should be good products can be erroneously determined to be defective products.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent No. 6999150

[0007] Patent Literature 2: Japanese Patent No. 7298825 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION

[0009] An object of the present application is to provide an electronic component image inspection apparatus, an electronic component image inspection method, and an electronic component image inspection program that can suppress products that should be good products from being determined to be defective products.

[0010] SOLUTION TO PROBLEM

[0011] (1) An image inspection apparatus of an electronic component according to an aspect of the present application includes: a position detection unit configured to detect a product position based on a product image captured of the electronic component; an image correction unit configured to generate a corrected product image in which the product image is corrected based on the product position; a first inspection unit configured to perform a first inspection with a first inspection logic based on the corrected product image, and output a first inspection result; a remedial inspection unit configured to perform a remedial inspection with a remedial inspection logic different from the first inspection logic when the first inspection logic determines whether or not to pass, and output a remedial inspection result if the first inspection result is a fail; and a comprehensive determination unit configured to make a comprehensive determination of the electronic component based on the first inspection result and the remedial inspection result; the first inspection logic is a function of determining pass or fail based on a threshold value set for a parameter for evaluating a defect; and the remedial inspection logic is generated by a learning artificial intelligence based on a relationship between information of the product image or the corrected product image and an inspection result.

[0012] (2) In the above (1), the first inspection can be an inspection of detecting dirt or a foreign substance on a bulk of a defect of the electronic component.

[0013] (3) In the above (1) or (2), the comprehensive determination unit can make a comprehensive determination as a good product when the first inspection result is a pass, or the remedial inspection result is a pass; and make a comprehensive determination as a defective product when the first inspection result is a fail and the remedial inspection result is a fail.

[0014] (4) In the above (1) or (2), a second inspection unit configured to perform a second inspection with a second inspection logic different from the first inspection logic, and output a second inspection result; and the comprehensive determination unit can make the comprehensive determination based on the first inspection result, the remedial inspection result, and the second inspection result.

[0015] (5) In the above (4), the comprehensive determination unit can make a comprehensive determination as a good product when the first inspection result is a pass, or the remedial inspection result is a pass, and the second inspection result is a pass; and make a comprehensive determination as a defective product when the first inspection result is a fail and the remedial inspection result is a fail, or the second inspection result is a fail.

[0016] (6) In the above (1) or (2), the first inspection can be an inspection of detecting a defect of the electronic component.

[0017] (7) In the above (5), the second inspection can be an inspection of measuring a size of the electronic component.

[0018] (8) An image inspection method of an electronic component according to an aspect of the present application includes: a position detection step of detecting a product position based on a product image captured of the electronic component; an image correction step of generating a corrected product image in which the product image is corrected based on the product position; a first inspection step of performing a first inspection having a first inspection logic based on the corrected product image, and outputting a first inspection result; a remedial inspection step of, when the first inspection logic determines whether or not to be acceptable, if the first inspection result is unacceptable, performing a remedial inspection having a remedial inspection logic different from the first inspection logic, and outputting a remedial inspection result; and a comprehensive determination step of making a comprehensive determination of the electronic component based on the first inspection result and the remedial inspection result; the first inspection logic is a function of determining to be acceptable or unacceptable based on a threshold value set for a parameter for evaluating a defect; and the remedial inspection logic is generated by a learning artificial intelligence based on a relationship between information of the product image or the corrected product image and an inspection result.

[0019] (9) An image inspection program of an electronic component according to an aspect of the present application, for causing a computer to execute: a position detection function of detecting a product position based on a product image captured of the electronic component; an image correction function of generating a corrected product image in which the product image is corrected based on the product position; a first inspection function of performing a first inspection having a first inspection logic based on the corrected product image, and outputting a first inspection result; a remedial inspection function of, when the first inspection logic determines whether or not to be acceptable, if the first inspection result is unacceptable, performing a remedial inspection having a remedial inspection logic different from the first inspection logic, and outputting a remedial inspection result; and a comprehensive determination function of making a comprehensive determination of the electronic component based on the first inspection result and the remedial inspection result; the first inspection logic is a function of determining to be acceptable or unacceptable based on a threshold value set for a parameter for evaluating a defect; and the remedial inspection logic is generated by a learning artificial intelligence based on a relationship between information of the product image or the corrected product image and an inspection result.

[0020] Effects of the Invention

[0021] According to the present application, it is possible to provide an image inspection apparatus, an image inspection method, and an image inspection program of an electronic component capable of suppressing a product that should be a good product from being determined to be a defective product. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a diagram for explaining an outline of an image inspection apparatus of an electronic component.

[0023] Figure 2 is a diagram for explaining a flow of an image inspection method performed by an image inspection apparatus of an electronic component. DETAILED DESCRIPTION

[0024] (Embodiments)

[0025] Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0026] Figure 1 is an explanatory diagram that explains an outline of the image inspection apparatus 100 for the electronic component 1. Figure 2 is a schematic diagram of a flow of an image inspection method performed by the image inspection apparatus 100 for the electronic component 1. Further, hereinafter, portions having common functions can be given the same reference numerals or symbols.

[0027] The image inspection apparatus 100 for the electronic component 1 according to the embodiment is used to inspect the appearance of the electronic component 1.

[0028] The electronic component 1 is a product that needs to be inspected to determine whether it is a good product (OK) or a defective product (NG). The electronic component 1 is a component or an element that constitutes an electronic device. The electronic component 1 is, for example, a resistor, a capacitor, an inductor, a transistor, a diode, an integrated circuit, or the like. The electronic component 1 is used to control current or voltage in an electronic circuit, or to process and transfer information. The electronic component 1 is used in, for example, electronic devices such as mobile phones, computers, automobiles, household appliances, and the like. The electronic component 1 has a three-dimensional shape such as a hexahedral shape.

[0029] The image inspection apparatus 100 includes an imaging unit C and a control unit S. The image inspection apparatus 100, for example, uses the imaging unit C such as a camera to take an image of the electronic component 1 from six sides (front, back, plane, bottom, left side, right side), which is a workpiece placed on the upper surface of a rotating disc-shaped transparent glass conveyer and conveyed by suction, and performs appearance inspection by the control unit S to determine whether the taken product image P is OK or not.

[0030] The imaging unit C appropriately has a front camera that takes an image of the front of the electronic component 1, a back camera that takes an image of the back of the electronic component 1, a plane camera that takes an image of the plane of the electronic component 1, a bottom camera that takes an image of the bottom of the electronic component 1, a right side camera that takes an image of the right side (inner surface facing the rotation center of the conveyer) of the electronic component 1, and a left side camera that takes an image of the left side (outer surface facing away from the rotation center of the conveyer) of the electronic component 1. The imaging unit C generates a product image P taken of the electronic component 1. The product image P is sent to the control unit S.

[0031] The control unit S is a computer system including a CPU and a memory (storage medium) such as a RAM, a ROM, and an auxiliary storage device, an external connection interface with an input / output device, a network interface, and a bus. The memory stores an image inspection program for causing the control unit S (computer system) to execute the image inspection method according to the embodiment.

[0032] The CPU is an arithmetic circuit that comprehensively controls the control unit S. The CPU reads a program stored in the ROM or the auxiliary storage device into the RAM. The CPU executes various processes in the program read into the RAM. The ROM stores a system program or the like for controlling the control unit S. The auxiliary storage device stores an application program or the like for executing various processes. The auxiliary storage device is, for example, an HDD, an SSD, or the like. The external connection interface is an interface for connecting various devices to the control unit S. The external connection interface connects, for example, the imaging unit C, a display, a keyboard, or the like to the control unit S. The network interface functions to communicate through a network based on the control of the CPU. The bus communicably connects the above-described functional units that constitute the control unit S.

[0033] The image inspection device 100 photographs the electronic component 1 by the imaging unit C, and determines whether the electronic component 1 is good or not (whether the electronic component 1 is a good product or a defective product) based on the photographed product image P by the control unit S.

[0034] In detail, as shown in FIG. 1, the image inspection device 100 according to the embodiment (specifically, the control unit S of the image inspection device 100) includes a position detection unit 10 that detects a product position PP based on a product image P photographed for the electronic component 1, an image correction unit 20 that generates a corrected product image Pc in which the product image P is corrected based on the product position PP, a first inspection unit 30 that executes a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputs a first inspection result T1R, a remedial inspection unit 40 that executes a remedial inspection Tk having a remedial inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 and outputs a remedial inspection result TkR, and a comprehensive determination unit 50 that makes a comprehensive determination on the electronic component 1 based on the first inspection result T1R and the remedial inspection result TkR. Figure 2

[0035] ​The image inspection apparatus 100 can include an inspection logic correction unit. The inspection logic correction unit is provided between the position detection unit 10 or the image correction unit 20 and the first inspection unit 30 in the information transmission path. Based on the product image P or the corrected product image Pc, the parameters of the first inspection logic L1, the second inspection logic L2, the third inspection logic L3, or the relief inspection logic Lk are corrected. The parameters of each inspection logic of the first inspection logic L1, the second inspection logic L2, the third inspection logic L3, or the relief inspection logic Lk can be, for example, a function of determining pass or fail based on a threshold value set for a parameter for evaluating defects. The parameters of each inspection logic of the first inspection logic L1, the second inspection logic L2, the third inspection logic L3, or the relief inspection logic Lk can also be, for example, generated by a learning-type (or learned) artificial intelligence AI based on a relationship between information of the product image P or the corrected product image Pc and an inspection result. In this way, the inspection logic can be changed according to the information of the product image P or the corrected product image Pc, and thus the inspection result (determination of pass or fail) of each inspection unit can be accurately obtained.

[0036] In addition, for example, the first inspection logic L1 can be considered as a function of determining pass or fail based on a threshold value set for a parameter for evaluating defects, and the relief inspection logic Lk can be considered as being generated by a learning-type artificial intelligence AI based on a relationship between information of the product image P or the corrected product image Pc and an inspection result. In this way, the first inspection T1 does not use the learning-type artificial intelligence AI, and the relief inspection Tk uses the learning-type artificial intelligence AI, and thus, for safety reasons, electronic components 1 (product images P or corrected product images Pc) that are difficult to determine as good products or defective products can be determined as defective (over-reaction) by the first inspection T1 (first inspection unit 30) of the first step that does not use the learning-type artificial intelligence AI that functions as a filter (by appropriately adjusting the threshold value to make it easier to fail), and accurate determination of these defective electronic components 1 can be performed by the relief inspection Tk (relief inspection unit 40) of the second step that uses the learning-type artificial intelligence AI that functions as a filter, and appropriate comprehensive determination can be performed by the comprehensive determination unit 50 through the filtering of the two steps.

[0037] The image inspection apparatus 100 can appropriately include a preliminary inspection unit for performing preliminary inspection before the first inspection T1 by the first inspection unit 30.

[0038] The position detection unit 10 detects the product position PP. The position detection unit 10 can detect, for example, a two-dimensional coordinate set on the surface of the conveyance table with the conveyance table rotation axis as a reference, a product position PP defined by a distance and a direction (angle) with the conveyance table rotation axis as a reference. The position detection unit 10 can also check, for example, the product position PP as a two-dimensional coordinate with a corner of a rectangular range that can be captured by the imaging unit C as a reference. The information of the product position PP detected by the position detection unit 10 is used for the image correction unit 20 to correct the product image P.

[0039] The image correction unit 20 generates a corrected product image Pc in which the product image P is corrected based on the product position PP. For example, when the front surface of the electronic component 1 is not perpendicular to the direction of the front surface camera, the image correction unit 20 corrects the product image P based on the product position PP to generate a corrected product image Pc that corresponds to the front surface image of the electronic component 1 when the front surface of the electronic component 1 is perpendicular to the direction of the front surface camera. The corrected product image Pc generated by the image correction unit 20 is used for the first inspection T1 performed by the first inspection unit 30.

[0040] The first inspection unit 30 performs the first inspection T1 with the first inspection logic L1 based on the corrected product image Pc and outputs the first inspection result T1R. The corrected product image Pc is provided by the image correction unit 20. The first inspection logic L1 is a logic that determines pass or fail in the first inspection T1. The first inspection logic L1 is a logic that considers as fail when a predefined defect is found in the corrected product image Pc and considers as pass when no defect is found. The first inspection logic L1 can be, for example, a function that determines pass or fail with a threshold value set for a parameter that evaluates a defect as a reference. The function can be a model (algorithm) generated by a learned artificial intelligence AI with pass or fail product image samples as training data.

[0041] In this way, the first inspection T1 is an inspection that detects defects of the electronic component 1. Here, the defect is a concept that includes what is called a defect in general appearance inspection, including incorrect dimensions (dimensions exceeding a tolerance range or a set standard), foreign matter mixed in, damage including a defect such as a missing corner or the like, and damage in which the appearance is completely broken. In this way, the first inspection T1 is an inspection that detects defects of the electronic component 1, and it is possible to actually determine as defective an electronic component 1 that is actually defective.

[0042] The first inspection T1 is preferably an inspection for detecting dirt or foreign matter on the matrix in the defect of the electronic component 1. The first inspection T1 is more preferably an inspection for detecting dirt on the matrix in the defect of the electronic component 1. The matrix refers to the other portion when the electronic component 1 is divided into the electrode portion and the other portion. As is known, the inspection for dirt or foreign matter on the matrix is more likely to cause an overreaction, in which the electronic component 1 that is actually a good product is determined to be defective, than other inspections such as the size inspection in the defect inspection. Therefore, by setting the inspection for detecting dirt or foreign matter on the matrix, which is likely to cause an overreaction, as the first inspection T1, the electronic component 1 in which dirt or foreign matter on the matrix is detected can be temporarily determined to be defective for safety reasons in the first inspection T1, and a determination of whether or not the electronic component 1 is good or defective with respect to the dirt or foreign matter on the matrix can be accurately made in the relief inspection Tk immediately after the first inspection T1.

[0043] When the first inspection result T1R satisfies a specific condition of the first inspection logic L1, the relief inspection unit 40 performs the relief inspection Tk having a relief inspection logic Lk different from the first inspection logic L1, and outputs a relief inspection result TkR.

[0044] Specifically, the specific condition refers to a case where the first inspection result T1R is determined to be defective when the first inspection logic L1 determines whether or not to be good. In this way, even if the first inspection result T1R is defective, the electronic component 1 that is actually a good product can be determined to be good in the relief inspection Tk by the relief inspection unit 40.

[0045] The relief inspection logic Lk is a logic for determining whether or not to be good in the relief inspection Tk. Unlike the first inspection logic L1, the relief inspection logic Lk is specifically set for the inspection of the corrected product image Pc in which the first inspection result T1R satisfies the specific condition (determined to be defective) in the first inspection logic L1. The relief inspection logic Lk is a logic in which, when a pre-defined defect different from the defect defined in the first inspection logic L1 is found with respect to the corrected product image Pc in which the first inspection result T1R satisfies the specific condition (determined to be defective) in the first inspection logic L1, the corrected product image Pc is determined to be defective, and when no defect is found, the corrected product image Pc is determined to be good. The type of defect defined in the first inspection logic L1 and the type of defect defined in the relief inspection logic Lk can be the same, and the determination criterion of whether or not to be good in the first inspection logic L1 and the determination criterion of whether or not to be good in the relief inspection logic Lk can be different. In this way, the image inspection apparatus 100 includes the relief inspection unit 40, and thus, even if the electronic component 1 to be inspected is originally a good product, the electronic component 1 determined to be defective in the first inspection T1 can be determined to be good in the relief inspection Tk.

[0046] The comprehensive judgment unit 50 comprehensively judges the electronic component 1 based on the first inspection result T1R and the relief inspection result TkR. Specifically, the comprehensive judgment unit 50 comprehensively judges as a good product when the first inspection result T1R is a pass or the relief inspection result TkR is a pass, and comprehensively judges as a defective product when the first inspection result T1R is a fail and the relief inspection result TkR is a fail. In other words, the comprehensive judgment unit 50 comprehensively judges as a pass when the first inspection result T1R is a pass, comprehensively judges as a pass when the first inspection result T1R is a fail and the relief inspection result TkR is a pass, and comprehensively judges as a fail when the first inspection result T1R is a fail and the relief inspection result TkR is a fail. Thus, even if the first inspection result T1R is a fail, it is not immediately comprehensively judged as a fail, and even if the first inspection result T1R is a fail, if the relief inspection result TkR is a pass, it is comprehensively judged as a pass. Therefore, with the image inspection apparatus 100, it is possible to suppress a product that should be a good product from being judged as a defective product.

[0047] The image inspection apparatus 100 can also include a second inspection unit 60 that performs a second inspection T2 having a second inspection logic L2 different from the first inspection logic L1 and outputs a second inspection result T2R. Thus, it is possible to perform the second inspection T2 in parallel with the first inspection T1 from a different angle with respect to the electronic component 1, and thus even if the electronic component 1 that should be a defective product passes the first inspection T1, if it fails the second inspection T2, it is possible to comprehensively judge as a defective product. Therefore, it is possible to suppress a product that should be a defective product from being judged as a good product, and thus it is possible to improve the inspection accuracy of the image inspection apparatus 100.

[0048] The comprehensive judgment unit 50 comprehensively judges based on the first inspection result T1R, the relief inspection result TkR, and the second inspection result T2R. Thus, even if the electronic component 1 that should be a defective product passes the first inspection T1, if it fails the second inspection T2, it is possible to comprehensively judge as a defective product. Therefore, it is possible to suppress a product that should be a good product from being judged as a defective product, and it is also possible to suppress a product that should be a defective product from being judged as a good product, and thus it is possible to improve the inspection accuracy of the image inspection apparatus 100.

[0049] Specifically, the second inspection T2 is preferably an inspection that measures the size of the electronic component 1. It is known that, compared to other inspections such as inspection of dirt or foreign matter on the substrate in defect inspection, an inspection that measures the size is likely to cause overacting and judge an electronic component 1 that should be a good product as a fail. Therefore, it is preferable to implement the second inspection T2 that is likely to cause overacting, such as measuring the size of the electronic component 1, independently and in parallel with the first inspection T1 that does not perform relief inspection Tk.

[0050] The image inspection apparatus 100 can also include a second remedial inspection unit, which is similar to the remedial inspection unit 40, for performing a remedial inspection Tk2 having a second remedial inspection logic Lk2 different from the second inspection logic L2 when the second inspection result T2R satisfies a certain condition in the second inspection logic L2, and outputting a second remedial inspection result TkR2. That is, similar to the remedial inspection Tk for the first inspection T1, the second inspection T2 can also not be subjected to the second remedial inspection Tk2. In this way, it is possible to further suppress products that should be good products from being judged as defective products.

[0051] The image inspection apparatus 100 can also include a third inspection unit 70 for performing a third inspection T3 having a third inspection logic L3 different from the first inspection logic L1 of the first inspection T1 and the second inspection logic L2 of the second inspection T2. The third inspection unit 70 is configured independently and in parallel to the first inspection unit 30 and the second inspection unit 60. In this way, it is possible to inspect the electronic component 1 from more angles, thereby improving the inspection accuracy of defective products.

[0052] Note that the technical scope of the present application is not limited to the above-described embodiments, and various changes can be made thereto without departing from the scope of the present application.

[0053] In addition, each component in the above-described embodiments can be appropriately replaced with well-known components within the scope of the present application. Furthermore, the above-described variations can also be appropriately combined within the scope of the present application.

[0054] As described above, the image inspection apparatus 100 of the electronic component 1 according to the embodiment includes a position detection unit 10 for detecting a product position PP based on a product image P taken of the electronic component 1, an image correction unit 20 for generating a corrected product image Pc of the product image P based on the product position PP, a first inspection unit 30 for performing a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc, and outputting a first inspection result T1R, a remedial inspection unit 40 for performing a remedial inspection Tk having a remedial inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a certain condition in the first inspection logic L1, and outputting a remedial inspection result TkR, and a comprehensive judgment unit 50 for comprehensively judging the electronic component 1 based on the first inspection result T1R and the remedial inspection result TkR. In this way, even if the electronic component 1 that should be judged as a good product (OK) is judged as a defective product (NG) by the first inspection unit 30 (hereinafter, this phenomenon is sometimes referred to as overaction), the comprehensive judgment unit 50 judges it as a good product if the remedial inspection unit 40 judges it as a good product. Thus, with the image inspection apparatus 100 of the electronic component 1, it is possible to suppress products that should be good products from being judged as defective products.

[0055] The image inspection method according to the embodiment includes: a position detection step of detecting a product position PP based on a product image P taken of the electronic component 1; an image correction step of generating a corrected product image Pc in which the product image P is corrected based on the product position PP; a first inspection step of performing a first inspection T1 having a first inspection logic LI based on the corrected product image Pc, and outputting a first inspection result T1R; a relief inspection step of performing a relief inspection Tk having a relief inspection logic Lk different from the first inspection logic LI when the first inspection result T1R satisfies a certain condition of the first inspection logic LI, and outputting a relief inspection result TkR; and a comprehensive determination step of making a comprehensive determination of the electronic component 1 based on the first inspection result T1R and the relief inspection result TkR. Thus, even if the electronic component 1 that should have been determined as a good product (OK) is determined as a defective product by the first inspection unit 30 (hereinafter, this phenomenon is sometimes referred to as overaction), the electronic component 1 is determined as a good product in the comprehensive determination step if it is determined as a good product in the relief inspection step. Thus, with the image inspection method of the electronic component 1, it is possible to suppress a product that should have been a good product from being determined as a defective product.

[0056] The image inspection function according to the embodiment is for causing a computer to execute the above-described image inspection method. That is, the image inspection function according to the embodiment is for causing a computer to execute: a position detection function of detecting a product position PP based on a product image P taken of the electronic component 1; an image correction function of generating a corrected product image Pc in which the product image P is corrected based on the product position PP; a first inspection function of performing a first inspection T1 having a first inspection logic LI based on the corrected product image Pc, and outputting a first inspection result T1R; a relief inspection function of performing a relief inspection Tk having a relief inspection logic Lk different from the first inspection logic LI when the first inspection result T1R satisfies a certain condition of the first inspection logic LI, and outputting a relief inspection result TkR; and a comprehensive determination function of making a comprehensive determination of the electronic component 1 based on the first inspection result T1R and the relief inspection result TkR. Thus, even if the electronic component 1 that should have been determined as a good product (OK) is determined as a defective product by the first inspection unit 30 (hereinafter, this phenomenon is sometimes referred to as overaction), the electronic component 1 is determined as a good product in the comprehensive determination step if it is determined as a good product in the relief inspection step. Thus, with the image inspection method of the electronic component 1, it is possible to suppress a product that should have been a good product from being determined as a defective product.

[0057] Explanation of Reference Numerals

[0058] 100: image inspection apparatus

[0059] 1: electronic component

[0060] 10: position detection unit

[0061] 20: image correction unit

[0062] 30: first checking unit

[0063] 40: relief checking unit

[0064] 50: comprehensive determination unit

[0065] 60: second checking unit

[0066] 70: third checking unit

[0067] C: imaging unit

[0068] S: control unit

[0069] L1: first checking logic

[0070] L2: second checking logic

[0071] L3: third checking logic

[0072] P: product image

[0073] T1: first checking

[0074] T1R: first checking result

[0075] T2: second checking

[0076] T2R: second checking result

[0077] T3: third checking

[0078] Tk: relief checking

[0079] TkR: relief checking result

Claims

1. An image inspection device for electronic components, comprising: a position detection unit for detecting a product position based on an image of the product taken of the electronic component; an image correction unit, configured to generate a corrected product image obtained by correcting the product image based on the product position; a first inspection unit, configured to perform a first inspection having a first inspection logic based on the corrected product image and output a first inspection result; a relief check unit configured to, when the first check logic determines whether the device is qualified, perform a relief check using a relief check logic different from the first check logic if the first check result is unqualified, and output a relief check result; a comprehensive determination unit, configured to perform a comprehensive determination on the electronic component based on the first inspection result and the relief inspection result; The first inspection logic is a function that determines whether a product is qualified or unqualified based on a threshold value set for a parameter for evaluating a defect; The relief inspection logic is generated by a learning-type artificial intelligence based on the relationship between the information of the product image or the corrected product image and the inspection result.

2. The electronic component image inspection device according to claim 1, The first inspection is an inspection for detecting dirt or foreign matter on the element body among defects of the electronic component.

3. The electronic component image inspection device according to claim 1 or 2, The comprehensive determination unit comprehensively determines that the product is a good product when the first inspection result is qualified or the relief inspection result is qualified; and comprehensively determines that the product is a defective product when the first inspection result is unqualified and the relief inspection result is unqualified.

4. The electronic component image inspection apparatus according to claim 1 or 2, comprising: a second checking unit, configured to perform a second check using a second checking logic different from the first checking logic, and output a second checking result; The comprehensive determination unit performs the comprehensive determination based on the first inspection result, the relief inspection result, and the second inspection result.

5. The electronic component image inspection device according to claim 4, The comprehensive judgment unit comprehensively judges the product as a good product when the first inspection result is qualified, or the relief inspection result is qualified and the second inspection result is qualified; and comprehensively judges the product as a defective product when the first inspection result is unqualified, the relief inspection result is unqualified, and the second inspection result is unqualified.

6. The electronic component image inspection device according to claim 1 or 2, The first inspection is an inspection for detecting defects in the electronic component.

7. The electronic component image inspection device according to claim 5, The second inspection is an inspection for measuring the dimensions of electronic components.

8. A method for inspecting an electronic component by image inspection, comprising: a position detection step of detecting a product position based on a product image captured of the electronic component; an image correction step of generating a corrected product image by correcting the product image based on the product position; a first inspection step of performing a first inspection with a first inspection logic based on the corrected product image and outputting a first inspection result; a relief check step, when the first check logic determines whether the device is qualified, if the first check result is unqualified, performing a relief check using a relief check logic different from the first check logic, and outputting a relief check result; a comprehensive determination step of performing a comprehensive determination on the electronic component based on the first inspection result and the relief inspection result; The first inspection logic is a function that determines whether a defect is qualified or not based on a threshold value set for a parameter for evaluating a defect; The relief inspection logic is generated by a learning-type artificial intelligence based on the relationship between the information of the product image or the corrected product image and the inspection result.

9. An image inspection program for electronic components, configured to cause a computer to execute: Position detection function, which detects the product position based on the product image taken of the electronic component; An image correction function for generating a corrected product image based on the product position, wherein the product image is corrected; a first inspection function, performing a first inspection having a first inspection logic based on the corrected product image, and outputting a first inspection result; a relief check function for, when the first check logic determines whether the equipment is qualified, executing a relief check using a relief check logic different from the first check logic if the first check result is unqualified, and outputting a relief check result; a comprehensive determination function for performing a comprehensive determination on the electronic component based on the first inspection result and the relief inspection result; The first inspection logic is a function that determines whether a defect is qualified or not based on a threshold value set for a parameter for evaluating a defect; The relief inspection logic is generated by a learning-type artificial intelligence based on the relationship between the information of the product image or the corrected product image and the inspection result.

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