High-voltage MOS device pin forming device and method

Abstract

The high-voltage MOS device pin forming device comprises a machine cabinet, a discharging mechanism, an extrusion forming mechanism, a material collecting mechanism and a control unit, and the top end of the machine cabinet is arranged to be an inclined face; the discharging mechanism is arranged at the top of the inclined plane; the extrusion forming mechanism is arranged in the middle of the slope; the material collecting mechanism is arranged at the bottom of the inclined plane and comprises a rotating part, a material clamping part and a counting driving part, the material clamping part is arranged on the outer surface of the rotating part in a surrounding mode, and the counting driving part is connected to the middle of the rotating part in a penetrating and inserting mode; the control unit is arranged on the side edge of the inclined face and used for controlling discharging of the discharging mechanism through photoelectric induction signals. Through the arrangement of the counting driving part, under the automatic counting setting of photoelectric induction, the corresponding number of finished products can be collected according to actual requirements, so that quantitative counting and collecting are achieved, errors caused by manual counting are avoided, and the accuracy of counting and collecting is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing equipment, and in particular to a high-voltage MOS device pin forming device and method. Background Art

[0002] In modern electronic devices, high-voltage MOS devices are widely used in power management, high-frequency switching, and inverters due to their superior switching characteristics and high voltage withstand capability. With the continuous development of technology, higher requirements are placed on the performance and reliability of high-voltage MOS devices. During their manufacturing process, lead forming is a key step that directly affects the overall performance and service life of the device.

[0003] The pin forming process for high-voltage MOS devices typically requires a dedicated pin forming device. Existing pin forming devices already offer automatic unloading, extrusion, and collection functions. These devices utilize gravity to ensure a smooth flow of MOS devices by locating the unloading, extrusion, and collection mechanisms on the centerline of a single inclined plane. MOS devices are first unloaded from the unloading mechanism, then formed by the extrusion mechanism, and finally fall under the influence of gravity into the collection mechanism for collection.

[0004] However, existing lead forming devices have certain shortcomings during the material collection process. Specifically, existing devices cannot automatically control the number of material receiving boxes based on the actual material quantity received. Instead, they rely on manual counting or program control settings of the motor. This reliance on manual labor not only wastes human resources but is also prone to errors during manual operation, thus affecting the quality and accuracy of the quantitative material collection. Furthermore, program control makes the equipment operation and debugging very cumbersome. In view of this, this proposal proposes a lead forming device and method for high-voltage MOS devices. Summary of the Invention

[0005] The object of the present invention is to provide a high-voltage MOS device pin forming device and method to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a high-voltage MOS device pin forming device, comprising: A cabinet, wherein the top of the cabinet is arranged as an inclined surface, and a discharge baffle is arranged on the top of the inclined surface; A discharge mechanism, the discharge mechanism being arranged at the top of the inclined surface and above the discharge baffle, and being used in conjunction with the discharge baffle to discharge the MOS device to be formed; An extrusion molding mechanism, which is arranged in the middle of the inclined surface and below the discharge baffle, and is used to press down the pins of the MOS device after it passes through the discharge baffle and guide the discharge; A material receiving mechanism is provided at the bottom of the inclined surface, and includes a rotating portion, a material clamping portion, and a counting drive portion. The material clamping portion is disposed around the outer surface of the rotating portion, and the counting drive portion is inserted and connected to the middle portion of the rotating portion. The counting drive portion is configured to drive the rotating portion to rotate by counting. A control unit is arranged on the side of the inclined surface, and the control unit is used to control the unloading of the material discharging mechanism through a photoelectric sensing signal.

[0007] Preferably, a universal wheel is provided at one end of the bottom of the cabinet, a supporting foot is provided at the other end of the bottom of the cabinet, a discharge port is provided in the middle of the discharge baffle, and the discharge mechanism is used to discharge the MOS devices to be formed through the discharge port.

[0008] Preferably, the discharge mechanism includes: A placement rack, the placement rack is fixedly connected to the top of the inclined surface, and a push port is opened at the bottom of the placement rack, wherein the push port, the discharge port and the discharge guide of the extrusion molding mechanism are on the same center line; A downward pressing rod is inserted and connected to the middle part of the placement rack. A downward pressing spring is provided between the middle part of the downward pressing rod and the top end of the inner wall of the placement rack. The downward pressing rod is squeezed close to the top end of the placement rack by the downward pressing spring.

[0009] Preferably, the discharge mechanism further comprises: A pushing cylinder is provided at the top of the inclined surface and on one side of the bottom of the placement rack, and the output end of the pushing cylinder is connected to the side of the pushing port in a horizontal direction; A photoelectric sensor is provided at the top of the inclined surface and below the discharge port. The photoelectric sensor is used to measure the photosensitivity interval passing through the discharge port. The output end of the photoelectric sensor is electrically connected to the receiving end of the control unit.

[0010] Preferably, the control unit includes a controller, the output end of the controller is electrically connected to the driving end of the push cylinder, the controller is used for output control of the extrusion molding mechanism, and the output end of the controller is electrically connected to a buzzer.

[0011] Preferably, the extrusion molding mechanism includes: A support frame, wherein a downward pressure cylinder is provided on the top of the support frame, an output end of the downward pressure cylinder extends to the bottom of the support frame, and a forming mold is provided at the output end of the downward pressure cylinder; A material guide track, the material guide track is aligned with the discharge port and fixedly connected to the top of the inclined surface, and the material guide track is inserted under the support frame; The first material stopping cylinder and the second material stopping cylinder are symmetrically arranged along the center of the inclined plane, and the output ends of the first material stopping cylinder and the second material stopping cylinder are respectively provided with a first baffle and a second baffle, and the first baffle and the second baffle are used to intercept the material guide track, and the material guide track area intercepted by the first baffle and the second baffle is used to press down the forming mold, and the output end of the second material stopping cylinder is fixedly connected with a toggle gear block, and the toggle gear block is inserted and connected in the cabinet, and the toggle gear block is used to toggle the counting drive part.

[0012] Preferably, the counting drive unit includes: A limit switch is provided in the cabinet, and an output end of the limit switch is electrically connected to the rotating part; A lower slotted gear plate is inserted and connected in the cabinet. A counting pull rod is fixedly connected to the top of the lower slotted gear plate. The top of the counting pull rod is inserted and connected to the inclined surface. A plug rod is fixedly connected to the bottom end of the lower slotted gear plate. The plug rod moves downward with the lower slotted gear plate and is used to press and trigger the travel switch. A rotating rod is rotatably connected to the cabinet, one end of the rotating rod is fixedly connected to a toggle gear, the outer wall of the toggle gear is meshed with the tooth wall of the lower spline plate, and the other end of the rotating rod is fixedly connected to a ratchet plate, which is meshed with the toggle gear block in a counterclockwise direction for transmission.

[0013] Preferably, a rotating opening is provided at the bottom of the inclined surface, and the rotating portion includes: A rotating belt, the rotating belt is rotatably connected to the rotating mouth, a plurality of groups of the clamping parts are arranged around the outer ring wall of the rotating belt, and the side of the inner ring wall of the rotating belt is provided with teeth; Drive rollers, wherein a plurality of drive rollers are respectively connected to both ends of the rotating belt, the outer walls of the drive rollers are meshed with the teeth, and the middle of the drive rollers is connected to a supporting rotating rod; The drive motor is arranged in the cabinet, the control end of the drive motor is electrically connected to the output end of the limit switch, the output end of the drive motor is provided with a coupling, and the end of the coupling away from the drive motor is transmission-connected to one of the supporting rotating rods.

[0014] Preferably, the clamping portion includes: Block blocks, wherein the blocks are arranged symmetrically in the horizontal direction, the opposite sides of the blocks are in contact with each other, the ends of the blocks are fixed to the outer ring wall of the rotating belt, and the middle parts of the blocks are provided with a blocking rod; The clamping blocks are arranged horizontally and symmetrically in a plurality of groups, and the plurality of groups of clamping blocks are symmetrical one by one with the plurality of groups of blocking blocks along the horizontal longitudinal direction. The clamping blocks are arranged in an angled shape, and one end of the clamping blocks is fixedly connected to the outer ring wall of the rotating belt.

[0015] A method for processing a high-voltage MOS device pin forming device, using the high-voltage MOS device pin forming device, the processing method includes the following steps: In the first step, the material box containing the finished MOS devices is arranged and installed on the outer ring wall of the rotating part through the material clamping part; In the second step, the clamping space of the discharge mechanism is first opened, and then the cassettes filled with the MOS devices to be formed are arranged vertically in the clamping space of the discharge mechanism. At this time, the MOS devices to be formed in the bottom cassette slide downward along the slope under the action of gravity and enter the extrusion molding mechanism after passing through the discharge baffle. During the unloading process, the unloading status of the MOS devices to be formed is judged by photoelectric sensing, and the discharge mechanism and the entire equipment are controlled accordingly. The unloading status includes: When the light blocking time interval is 2-3 seconds, the bottom box will no longer discharge material. At this time, the pushing cylinder is triggered to quickly push the bottom box out. When the light shielding time interval is 4-6 seconds, the unloading and transfer of MOS devices is not detected, and the buzzer is triggered to continuously alarm; If the light blocking time interval exceeds 6 seconds, the system will stop immediately. In the third step, the MOS devices to be formed are blocked in batches in the pin pressing area of ​​the extrusion molding mechanism, and then continue to fall along the slope under the action of gravity after the pin pressing molding; In the fourth step, the number of MOS devices to be loaded into each group of finished product collection boxes is set through the counting drive unit. The molded MOS devices enter the finished product collection box through the material guide. Under the triggering of the pressing stroke, the set collection amount is reached at this time. At the same time, the counting drive unit drives the rotating part to rotate. At this time, the next group of finished product collection boxes enters the material receiving position to receive the material. After resetting the number to be collected, a new round of finished product collection begins.

[0016] Technical effects and advantages of the present invention: (1) The present invention has designed the structure of the material receiving mechanism. By setting the counting drive part and combining the material blocking setting of the extrusion molding mechanism, under the premise of quantitative processing of material discharge, the counting drive part is driven by the material discharge action, so that the counting drive part drives the rotating part to rotate under the mechanical operation setting, so that the next group of material can be collected. Under the design of such a structure and operation mode, the device can collect the corresponding number of finished products according to actual needs, thereby realizing quantitative counting and collection, thus avoiding the error of manual counting and ensuring the accuracy of counting and collection. At the same time, the counting drive part can adjust and set the counting amount in real time through the pull-up operation, making the technical operation of the device more convenient and flexible. (2) The present invention provides a clamping portion around the outer ring wall of the rotating portion. First, the empty finished product collection box is arranged and clamped by the clamping portion. Then, under the drive of the counting drive portion, the rotating portion drives the clamping portion at the corresponding position to move, thereby realizing the switching of the corresponding finished product collection box, thereby ensuring that the device can stably realize the counting and collection of finished products; (3) The present invention has designed a structure for the discharge mechanism, and monitors the stability of the discharge process through photoelectric sensing, thereby ensuring the stable unloading of the MOS device to be formed, and further ensuring that the MOS device to be formed can be stably discharged and collected after extrusion molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the present invention as a whole.

[0018] Figure 2 It is a side view of the structure of the present invention as a whole.

[0019] Figure 3 It is a front view of the overall structure of the present invention.

[0020] Figure 4 This is a schematic diagram of the overall structural connection of the present invention without the downward pressure cylinder part.

[0021] Figure 5 This is a front view of the overall structure connection without the downward pressure cylinder part of the present invention.

[0022] Figure 6 It is a structural schematic diagram of the material receiving mechanism of the present invention.

[0023] Figure 7 It is the rear view of the structure of the material receiving mechanism of the present invention.

[0024] Figure 8 It is a schematic diagram of the structural connection between the rotating part and the clamping part of the present invention.

[0025] Figure 9 Schematic diagram of the structure of the counting drive unit of the present invention.

[0026] Figure: 1, cabinet; 101, universal wheel; 102, support foot; 103, unloading baffle; 2, placement rack; 201, down-pressing rod; 202, down-pressing spring; 203, push cylinder; 204, photoelectric sensor; 3, support rack; 301, down-pressing cylinder; 302, forming mold; 4, guide rail; 5, first stop cylinder; 501, first baffle; 6, second stop cylinder; 601, second baffle; 602 , toggle gear block; 7. controller; 701, buzzer; 8. rotating belt; 801, teeth; 9. blocking block; 901, blocking rod; 10. clamping block; 11. driving roller; 1101, supporting rotating rod; 12. driving motor; 1201, coupling; 13. travel switch; 14. lower tooth plate; 1401, counting pull rod; 1402, inserting rod; 15. rotating rod; 1501, toggle gear; 1502, ratchet disk. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In embodiment 1, the present invention provides Figure 1-9 A high-voltage MOS device pin forming device is shown, comprising: Cabinet 1, the top of the cabinet 1 is set as an inclined surface, the top of the inclined surface is provided with a discharge baffle 103, one end of the bottom of the cabinet 1 is provided with a universal wheel 101, the other end of the bottom of the cabinet 1 is provided with a support foot 102, and the middle of the discharge baffle 103 is provided with a discharge port; It should be noted that the universal wheel 101 is arranged at one end of the bottom of the cabinet 1 near the back. Through the setting of the universal wheel 101, the front end of the cabinet 1 can be tilted up, so that the whole machine can be pushed to move, and the support foot 102 is fixed at one end of the bottom of the cabinet 1 near the front. When the cabinet 1 is stably placed flat, the bottom end of the support foot 102 touches the ground, so that the whole machine can be placed for use.

[0029] The discharge mechanism is arranged at the top of the inclined surface and above the discharge baffle 103. The discharge mechanism cooperates with the discharge baffle 103 to discharge the MOS device to be formed. The discharge mechanism is used to discharge the MOS device to be formed through the discharge port; Specifically, the discharge mechanism includes: The placing rack 2 is fixedly connected to the top of the inclined plane, and a push port is provided at the bottom of the placing rack 2. The push port, the discharge port and the discharge guide of the extrusion molding mechanism are on the same center line; It should be noted that the placement rack 2 is an N-shaped structure, with a push-out opening at the bottom and passing through one side of the placement rack 2. In the setting of this scheme, the end of the placement rack 2 away from the unloading baffle 103 is an open structure, so that loading can be carried out through this open area.

[0030] A down-pressing rod 201 is inserted and connected to the middle part of the placement rack 2. A down-pressing spring 202 is provided between the middle part of the down-pressing rod 201 and the top of the inner wall of the placement rack 2. The down-pressing rod 201 is pressed close to the top of the placement rack 2 by the down-pressing spring 202. It should be noted that both ends of the downward pressure rod 201 adopt a pancake-shaped structure that exceeds the radius of the rod body. The downward pressure spring 202 is set under the restriction of one of the pancake-shaped structures and the top inner wall of the placement rack 2, and the downward pressure spring 202 always maintains downward pressure on the downward pressure rod 201, so that the downward pressure rod 201 always moves in the direction close to the inclined surface of the cabinet 1.

[0031] The unloading mechanism also includes: The pushing cylinder 203 is arranged at the top of the inclined surface and located on one side of the bottom of the placement rack 2. The output end of the pushing cylinder 203 is connected to the side of the pushing port in a horizontal direction. It should be noted that a guide support block is provided at the top of the inclined surface of the cabinet 1, which is used to support and guide the sliding of the output end of the pushing cylinder 203. In this way, through the output of the pushing cylinder 203, the bottom push port of the placement rack 2 is pushed and swept, so that the material box pressed down at the bottom of the placement rack 2 will be pushed out of the placement rack 2, thereby making the material box replaceable.

[0032] Photoelectric sensor 204, photoelectric sensor 204 is set at the top of the slope and below the discharge port. Photoelectric sensor 204 is used to measure the light-sensitive interval passing through the discharge port. Photoelectric sensor 204 adopts a reflective photoelectric sensor to detect the light-shielding state. When the photoelectric sensor 204 is not light-shielded, the timer is started; if the light is blocked again in the middle, the timer is reset immediately. In the setting of this scheme, the photoelectric sensor 204 is used to detect the light-shielding through the discharge port.

[0033] An extrusion molding mechanism is provided in the middle of the inclined surface and below the discharge baffle 103. The extrusion molding mechanism is used to press down the pins of the MOS device after it passes through the discharge baffle 103 and guide the discharge of the material. The control unit is arranged on the side of the inclined surface. The control unit is used to control the unloading of the material discharging mechanism through the photoelectric sensing signal. The output end of the photoelectric sensor 204 is electrically connected to the receiving end of the control unit.

[0034] Specifically, the control unit includes a controller 7 , an output end of the controller 7 is electrically connected to a driving end of the push cylinder 203 , the controller 7 is used for output control of the extrusion molding mechanism, and the output end of the controller 7 is electrically connected to a buzzer 701 .

[0035] It should be noted that the controller 7 is electrically connected to the photoelectric sensor 204, the buzzer 701, the push cylinder 203, the pressing cylinder 301, the first stop cylinder 5, the second stop cylinder 6 and the drive motor 12, and a shutdown control module is also provided in the controller 7. The module is communicated with the pressing cylinder 301, the first stop cylinder 5, the second stop cylinder 6 and the drive motor 12 for performing interrupt control of these structures. Among them, the photoelectric sensor 204 is electrically connected to a digital input pin of the controller 7, the control end of the push cylinder 203 is electrically connected to a digital output pin of the controller 7, the buzzer 701 is electrically connected to another output pin of the controller 7, and the output priority of the shutdown control module is higher than that of the output pin.

[0036] Specifically, the extrusion molding mechanism includes: The support frame 3 is provided with a downward pressure cylinder 301 on the top of the support frame 3. The output end of the downward pressure cylinder 301 extends to the bottom of the support frame 3. The output end of the downward pressure cylinder 301 is provided with a forming mold 302. The forming mold 302 is detachably fixedly connected to the output end of the downward pressure cylinder 301 and can be replaced according to the shape of the pin to be pressed and cut; The material guide track 4 is aligned with the discharge port and fixedly connected to the top of the inclined surface. The material guide track 4 is inserted under the support frame 3. The material guide track 4 has insertion openings at both ends of the area below the forming mold 302. By blocking the insertion openings, the area below the forming mold 302 is blocked. In this way, when the MOS device to be formed is in this area, it is blocked and then pressed down by the forming mold 302 to press and cut the pins. The first material stopping cylinder 5 and the second material stopping cylinder 6 are symmetrically arranged along the center of the inclined plane. The output ends of the first material stopping cylinder 5 and the second material stopping cylinder 6 are respectively provided with a first baffle 501 and a second baffle 601. The first baffle 501 and the second baffle 601 are used to intercept the guide track 4, and the area of ​​the guide track 4 intercepted by the first baffle 501 and the second baffle 601 is used to press down the forming mold 302. The output end of the second material stopping cylinder 6 is fixedly connected with a toggle gear block 602. The toggle gear block 602 is inserted and connected in the cabinet 1, and the toggle gear block 602 is used to toggle the counting drive part.

[0037] It should be noted that the first baffle 501 and the second baffle 601 are driven by the first baffle cylinder 5 and the second baffle cylinder 6 respectively to intersperse the material guide track 4, and the interspersing interval of the two is 2s, and the first baffle 501 and the second baffle 601 are only interspersed with the material guide track 4 for 1s, and the distance between the first baffle 501 and the second baffle 601 is a constant value, so as to ensure that the MOS devices in one pressing operation are quantitative.

[0038] The material receiving mechanism is arranged at the bottom of the inclined surface. The material receiving mechanism includes a rotating part, a clamping part and a counting drive part. The clamping part is arranged around the outer surface of the rotating part, and the counting drive part is inserted and connected to the middle part of the rotating part. The counting drive part is used to drive the rotating part to rotate by counting. The counting drive unit includes: The limit switch 13 is provided in the cabinet 1, and the output end of the limit switch 13 is electrically connected to the rotating part; The lower gear plate 14 is inserted and connected in the cabinet 1. The top of the lower gear plate 14 is fixedly connected with a counting rod 1401. The top of the counting rod 1401 is inserted and connected with the inclined surface. The outer wall of the counting rod 1401 can be provided with a scale, so as to measure the downward movement distance through the scale value above the exposed inclined surface. A damping interlacing is formed between the counting rod 1401 and the inclined surface. The sliding friction of the interlacing of the two is used to lift the lower gear plate 14 in an unpowered state. The bottom end of the lower gear plate 14 is fixedly connected with an insertion rod 1402. The insertion rod 1402 is used to press and trigger the travel switch 13 after following the lower gear plate 14 downward. The rotating rod 15 is rotatably connected to the cabinet 1. One end of the rotating rod 15 is fixedly connected to the toggle gear 1501. The outer wall of the toggle gear 1501 is meshed with the tooth wall of the lower tooth plate 14. The other end of the rotating rod 15 is fixedly connected to the ratchet plate 1502. The ratchet plate 1502 is meshed with the toggle tooth block 602 in the counterclockwise direction for transmission.

[0039] It should be noted that, since the number of MOS devices formed each time is a fixed value, after the second baffle 601 is driven to discharge the material, the fixed number of MOS devices falls to the finished product receiving box for collection; In the arrangement of this solution, one output operation of the second material-blocking cylinder 6 represents one material discharge, so when it drives the tooth block 602 to perform one horizontal reciprocating movement, it will engage with the ratchet disc 1502. Since the ratchet disc 1502 can only perform counterclockwise engagement transmission, one reciprocating movement of the tooth block 602 can only drive the ratchet disc 1502 to rotate counterclockwise by one tooth gap. After the ratchet disc 1502 rotates counterclockwise, it drives the rotating rod 15 to rotate synchronously. At this time, when the toggle gear 1501 rotates counterclockwise, it toggles the lower spline plate 14 to move downward through the meshing transmission. The lower spline plate 14 is lifted and pulled by the counting pull rod 1401 and the damping of the inclined surface. Therefore, the lower spline plate 14 can move downward under the meshing toggle, and the lower spline plate 14 drives the counting pull rod 1401 to move downward when moving. It can be seen that the counting pull rod 1401 controls the downward movement distance of the lower spline plate 14 by the distance from the top of the exposed inclined surface. After the lower spline plate 14 continues to move downward, until the insertion rod 1402 is inserted into the travel switch 13, the travel switch 13 is triggered, and the travel switch 13 sends a trigger signal to the control end of the drive motor 12, and the drive motor 12 is started.

[0040] Specifically, a rotating opening is opened at the bottom of the inclined surface, and the rotating part includes: The rotating belt 8 is rotatably connected to the rotating mouth, and multiple groups of clamping parts are arranged around the outer ring wall of the rotating belt 8. The middle area of ​​the rotating belt 8 is light-transmissive. The counting drive part is inserted into the inner ring wall of the rotating belt 8. The side of the inner ring wall of the rotating belt 8 is provided with teeth 801. The rotating belt 8 and the teeth 801 are made of the same material. Both are flexible, so as to ensure the surrounding rotation in the curled state. In the setting of this scheme, the rotating belt 8 is made of polycarbonate, a light-transmissive material. This material has good transparency and strength and is suitable for conveyor belts that require high impact resistance and thermal stability, so as to facilitate light penetration and assist the counting drive part in performing light-sensitive counting; Drive rollers 11, multiple drive rollers 11 are respectively connected to both ends of the rotating belt 8, the outer wall of the drive roller 11 is meshed with the teeth 801, the middle of the drive roller 11 is connected with a support rod 1101, and the end of the drive roller 11 is provided with an external convex tooth, which is adapted to the teeth 801 to ensure stable meshing transmission between the drive roller 11 and the rotating belt 8; The drive motor 12 is arranged in the cabinet 1. The control end of the drive motor 12 is electrically connected to the output end of the limit switch 13. The output end of the drive motor 12 is provided with a coupling 1201. The end of the coupling 1201 away from the drive motor 12 is transmission-connected to one of the supporting rotating rods 1101. The drive motor 12 is used to receive the trigger signal of the limit switch 13. After receiving the trigger signal, the drive motor 12 performs an operation. The angle of each rotation is the same, and the moving distance of the rotating belt 8 is just the distance between the two sets of blocking blocks 9.

[0041] Specifically, the clamping part includes: Blocking blocks 9, multiple groups of blocking blocks 9 are symmetrically arranged in the horizontal direction, with opposite sides of the multiple groups of blocking blocks 9 contacting each other, and ends of the multiple groups of blocking blocks 9 that are away from each other are fixed to the outer ring wall of the rotating belt 8, and a blocking rod 901 is provided in the middle of the multiple groups of blocking blocks 9; In the setting of this scheme, two blocking blocks 9 are a group, and one end of them is not connected to the rotating belt 8, and the end not connected to the rotating belt 8 is fitted with each other. In the setting of this scheme, the blocking block 9 is L-shaped, so that the two blocking blocks 9 are combined into a U-shape to surround and block the finished product collection box, and through the setting of the blocking rod 901, the blocking rod 901 can be inserted into one end of the finished product collection box to prevent the collected MOS device products from falling, and at the same time cooperate to achieve the clamping and positioning of the finished product collection box.

[0042] The clamping blocks 10 are arranged horizontally symmetrically, and the multiple groups of clamping blocks 10 are symmetrical one by one with the multiple groups of blocking blocks 9 along the horizontal longitudinal direction. The clamping blocks 10 are arranged in an angled shape, and one end of the clamping blocks 10 is fixedly connected to the outer ring wall of the rotating belt 8.

[0043] It should be noted that the clamping blocks 10 of this solution are also arranged in groups of two, and correspond to the two blocking blocks 9 in the same group. The clamping blocks 10 are made of elastic material. After the bottom thereof is fixed to the rotating belt 8, the space on the opposite side of the two clamping blocks 10 can be adjusted by flipping the top thereof, thereby utilizing elastic recovery to clamp the finished product collection box.

[0044] In a second embodiment, the present invention provides a method for processing a high-voltage MOS device pin forming device, using the high-voltage MOS device pin forming device of the first embodiment, and the processing method includes the following steps: In the first step, the material box containing the finished MOS devices is arranged and installed on the outer ring wall of the rotating part through the material clamping part; First, insert one end of the finished product collection box into a group of blocking blocks 9, and insert the blocking rod 901 into the inner wall of the feed box, then pull open the tops of the two clamping blocks 10 in the same group, and clamp the other end of the box in the space between the two clamping blocks 10.

[0045] In the second step, the clamping space of the discharge mechanism is first opened, and then the cassettes filled with the MOS devices to be formed are arranged vertically in the clamping space of the discharge mechanism. At this time, the MOS devices to be formed in the bottom cassette slide downward along the slope under the action of gravity and enter the extrusion molding mechanism after passing through the discharge baffle 103. During the discharge process, the discharge status of the MOS devices to be formed is determined by photoelectric sensing, and the discharge mechanism and the entire equipment are controlled accordingly. The discharge status includes: When the light blocking time interval is 2-3 seconds, the bottom box no longer discharges material, and the pushing cylinder 203 is triggered to move and quickly push the bottom box out. When the light shielding time interval is 4-6 seconds, the unloading and transfer of the MOS device is not detected, and the buzzer 701 is triggered to continuously alarm; If the light blocking time interval exceeds 6 seconds, the system will stop immediately. In the third step, the MOS devices to be formed are shielded in batches in the pin pressing area of ​​the extrusion molding mechanism. After the pins are molded, they continue to fall along the inclined surface under the action of gravity. When the first baffle 501 and the second baffle 601 are in the process of intersecting the guide track 4, the output of the pressing cylinder 301 drives the molding die 302 to cut and extrude the pins of the MOS devices. After that, the second baffle 601 is retracted first, and the formed MOS devices fall and are collected. In the fourth step, the number of MOS devices to be loaded into each group of finished product collection boxes is set through the counting drive unit. The molded MOS devices enter the finished product collection box through the material guide. Under the triggering of the pressing stroke, the set collection amount is reached at this time. At the same time, the counting drive unit drives the rotating part to rotate. At this time, the next group of finished product collection boxes enters the material receiving position to receive the material. After resetting the number to be collected, a new round of finished product collection begins.

[0046] It should be noted that the operating principle of the counting control is to pull the counting rod 1401 upward so that the vertical distance between the lower spline plate 14 and the limit switch 13 can be adjusted. In order to enable the insertion rod 1402 to be inserted downward to trigger the limit switch 13, the number of times the gear 1501 is moved to the lower spline plate 14 can be adjusted. At this time, the number of times the ratchet plate 1502 is moved can be adjusted, and then the output of the second stop cylinder 6 can be adjusted at this time, so that the discharge amount of the finished MOS device can be adjusted.

[0047] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-voltage MOS device pin forming device, characterized in that: include: A cabinet (1), wherein the top of the cabinet (1) is configured as an inclined surface, and a discharge baffle (103) is provided on the top of the inclined surface; A discharge mechanism, the discharge mechanism being arranged at the top of the inclined surface and located above the discharge baffle (103), and the discharge mechanism being used in conjunction with the discharge baffle (103) to discharge the MOS device to be formed; An extrusion molding mechanism, the extrusion molding mechanism being arranged in the middle of the inclined surface and located below the discharge baffle (103), and the extrusion molding mechanism being used for pressing down the pins of the MOS device after it passes through the discharge baffle (103) and guiding the discharge of the material; A material receiving mechanism is provided at the bottom of the inclined surface, and includes a rotating portion, a material clamping portion, and a counting drive portion. The material clamping portion is disposed around the outer surface of the rotating portion, and the counting drive portion is inserted and connected to the middle portion of the rotating portion. The counting drive portion is configured to drive the rotating portion to rotate by counting. A control unit is arranged on the side of the inclined surface, and the control unit is used to control the unloading of the material discharging mechanism through a photoelectric sensing signal.

2. A high-voltage MOS device pin forming device according to claim 1, characterized in that: One end of the bottom of the cabinet (1) is provided with a universal wheel (101), the other end of the bottom of the cabinet (1) is provided with a supporting foot (102), a discharge port is provided in the middle of the discharge baffle (103), and the discharge mechanism is used to discharge the MOS device to be formed through the discharge port.

3. A high-voltage MOS device pin forming device according to claim 2, characterized in that: The unloading mechanism comprises: A placement rack (2), the placement rack (2) is fixedly connected to the top of the inclined surface, a push port is provided at the bottom of the placement rack (2), and the push port, the discharge port and the discharge guide of the extrusion molding mechanism are located on the same center line; A downward pressing rod (201) is inserted and connected to the middle part of the placement rack (2), and a downward pressing spring (202) is provided between the middle part of the downward pressing rod (201) and the top end of the inner wall of the placement rack (2). The downward pressing rod (201) is pressed close to the top end of the placement rack (2) by the downward pressing spring (202).

4. A high-voltage MOS device pin forming device according to claim 3, characterized in that: The discharging mechanism further comprises: A pushing cylinder (203), the pushing cylinder (203) is arranged at the top of the inclined surface and located on one side of the bottom of the placement rack (2), and the output end of the pushing cylinder (203) is connected to the side of the pushing port in a horizontal direction; A photoelectric sensor (204) is provided at the top of the inclined surface and below the discharge port, the photoelectric sensor (204) is used to measure the light-sensing interval passing through the discharge port, and the output end of the photoelectric sensor (204) is electrically connected to the receiving end of the control unit.

5. A high-voltage MOS device pin forming device according to claim 4, characterized in that: The control unit includes a controller (7), the output end of the controller (7) is electrically connected to the driving end of the push cylinder (203), the controller (7) is used for output control of the extrusion molding mechanism, and the output end of the controller (7) is electrically connected to a buzzer (701).

6. A high-voltage MOS device pin forming device according to claim 5, characterized in that: The extrusion molding mechanism comprises: A support frame (3), wherein a downward-pressing cylinder (301) is provided at the top of the support frame (3), an output end of the downward-pressing cylinder (301) extends to the bottom of the support frame (3), and a forming mold (302) is provided at the output end of the downward-pressing cylinder (301); A material guide track (4), the material guide track (4) is aligned with the discharge port and fixedly connected to the top of the inclined surface, and the material guide track (4) is inserted below the support frame (3); A first material-blocking cylinder (5) and a second material-blocking cylinder (6) are symmetrically arranged along the center of the inclined plane, and the output ends of the first material-blocking cylinder (5) and the second material-blocking cylinder (6) are respectively provided with a first baffle (501) and a second baffle (601), the first baffle (501) and the second baffle (601) are used to intercept the material guide track (4), and the area of ​​the material guide track (4) intercepted by the first baffle (501) and the second baffle (601) is used to press down the forming mold (302), and the output end of the second material-blocking cylinder (6) is fixedly connected with a toggle gear block (602), the toggle gear block (602) is inserted and connected in the cabinet (1), and the toggle gear block (602) is used to toggle the counting drive unit.

7. A high-voltage MOS device pin forming device according to claim 6, characterized in that: The counting drive unit includes: A travel switch (13), wherein the travel switch (13) is arranged in the cabinet (1), and an output end of the travel switch (13) is electrically connected to the rotating part; A lower toothed plate (14), the lower toothed plate (14) is inserted and connected in the cabinet (1), the top of the lower toothed plate (14) is fixedly connected to a counting pull rod (1401), the top of the counting pull rod (1401) is inserted and connected to the inclined surface, and the bottom of the lower toothed plate (14) is fixedly connected to an insertion rod (1402), and the insertion rod (1402) is used to press and trigger the travel switch (13) after following the lower toothed plate (14) to move downward; A rotating rod (15) is rotatably connected to the cabinet (1); one end of the rotating rod (15) is fixedly connected to a toggle gear (1501); the outer wall of the toggle gear (1501) is meshed with the tooth wall of the lower spline plate (14); the other end of the rotating rod (15) is fixedly connected to a ratchet disc (1502); the ratchet disc (1502) is meshed with the toggle gear block (602) in a counterclockwise direction for transmission.

8. The high-voltage MOS device pin forming device according to claim 7, characterized in that: A rotating opening is provided at the bottom of the inclined surface, and the rotating portion includes: A rotating belt (8), the rotating belt (8) is rotatably connected to the rotating mouth, a plurality of groups of the clamping parts are arranged around the outer ring wall of the rotating belt (8), and teeth (801) are provided on the side of the inner ring wall of the rotating belt (8); Drive rollers (11), wherein a plurality of the drive rollers (11) are respectively connected to both ends of the rotating belt (8), the outer walls of the drive rollers (11) are meshed with the teeth (801), and the middle of the drive rollers (11) is connected to a supporting rotating rod (1101); A drive motor (12), the drive motor (12) being arranged in the cabinet (1), a control end of the drive motor (12) being electrically connected to an output end of a travel switch (13), a coupling (1201) being provided at the output end of the drive motor (12), and an end of the coupling (1201) being away from the drive motor (12) being in transmission connection with one of the supporting rotating rods (1101).

9. The high-voltage MOS device pin forming device according to claim 8, characterized in that: The clamping portion includes: Blocking blocks (9), wherein the plurality of groups of blocking blocks (9) are symmetrically arranged in the horizontal direction, the opposite sides of the plurality of groups of blocking blocks (9) are in contact with each other, the ends of the plurality of groups of blocking blocks (9) that are away from each other are fixed to the outer ring wall of the rotating belt (8), and the middle parts of the plurality of groups of blocking blocks (9) are all provided with blocking rods (901); The clamping blocks (10) are arranged horizontally and symmetrically in a plurality of groups, and the plurality of groups of clamping blocks (10) and the plurality of groups of blocking blocks (9) are symmetrical one to one along the horizontal longitudinal direction. The clamping blocks (10) are arranged in an angled shape, and one end of the clamping blocks (10) is fixedly connected to the outer ring wall of the rotating belt (8).

10. A method for processing a high-voltage MOS device pin forming device, comprising: The processing method comprises the following steps: In the first step, the material box containing the finished MOS devices is arranged and installed on the outer ring wall of the rotating part through the material clamping part; In the second step, the clamping space of the discharge mechanism is first opened, and then the material box filled with the MOS devices to be formed is arranged in the vertical direction and placed in the clamping space of the discharge mechanism. At this time, the MOS devices to be formed in the material box at the bottom slide downward along the slope under the action of gravity and enter the extrusion molding mechanism after passing through the discharge baffle (103). During the discharge process, the discharge status of the MOS devices to be formed is judged by photoelectric sensing, so as to control the discharge mechanism and the whole equipment. The discharge status includes: When the light shielding time interval is not sensed for 2-3 seconds, the bottommost box no longer discharges material, and the pushing cylinder (203) is triggered to move and quickly push the bottommost box out; When the light shielding time interval is not sensed for 4-6 seconds, the unloading and transfer of the MOS device is not detected, and the buzzer (701) is triggered to continuously alarm; If the light blocking time interval exceeds 6 seconds, the system will stop immediately. In the third step, the MOS devices to be formed are blocked in batches in the pin pressing area of ​​the extrusion molding mechanism, and then continue to fall along the slope under the action of gravity after the pin pressing molding; In the fourth step, the number of MOS devices to be loaded into each group of finished product collection boxes is set through the counting drive unit. The molded MOS devices enter the finished product collection box through the material guide. Under the triggering of the pressing stroke, the set collection amount is reached at this time. At the same time, the counting drive unit drives the rotating part to rotate. At this time, the next group of finished product collection boxes enters the material receiving position to receive the material. After resetting the number to be collected, a new round of finished product collection begins.

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