A lens aa assembly test device based on laser soldering and a method of using the same

Abstract

The present application relates to lens module AA assembly design technical field, specifically to a kind of lens AA assembly test equipment based on laser soldering tin and its use method, including the square tube frame fixed with four columns on bottom plate, three-axis soldering head assembly is equipped in the inside four corners of square tube frame;Test component includes six-dimensional force sensor, the top of six-dimensional force sensor is fixed with square seat for installing lens, the top of square seat is equipped with multiple pins, circuit board is inserted on pin, and circuit board is fixed on test table by clamping mechanism and keeps electrical conduction with female head of electric connector during soldering process.The present application can accurately obtain the three-dimensional direction stress size and deformation variable of circuit board in laser soldering tin process by the cooperative measurement mechanism of integrated six-dimensional force sensor and three-axis micrometer, solves the problem that traditional AA soldering equipment design relies on experience debugging, provides reliable data support for clamping force and positioning compensation design of mass production equipment.

Description

TECHNICAL FIELD

[0001] The application relates to a lens module AA assembly design field, in particular to a lens AA assembly test equipment based on laser soldering and a use method thereof. BACKGROUND

[0002] In the lens module AA assembly, the traditional process is to first integrate the circuit board provided with an image sensor into a square seat, then glue and fix the flange end face of the lens and the end face of the square seat with AA, and then fix it by UV lamp irradiation and curing. However, some customers connect the lens and the square seat through threads, and it is impossible to AA assemble the lens and the square seat. The assembly process of such a lens is generally to first install the lens and the square seat through dispensing threads, and then AA solder the square seat and the circuit board provided with the image sensor (such as the patent scheme disclosed in the publication number CN104954638B, which discloses electrically connecting the pin 15 and the circuit board 50 through soldering).

[0003] When AA soldering the square seat and the circuit board provided with the image sensor, the ideal state is that the circuit board does not deform under external force in the soldering process after AA alignment of the circuit board and the square seat, so as to ensure the AA assembly precision of the image sensor and the lens. However, in actual production, the circuit board is often affected by factors such as welding stress and deviates in the welding process. The thickness and hardness of the circuit boards of different customers are different, the stress received during welding is different, and the deviation amount is also different. Such deviation will affect the AA alignment of the image sensor on the circuit board and the lens. At present, the main method in the industry is to first design the AA soldering equipment for mass production, and then debug the AA soldering equipment for mass production. The debugging workload is large, the efficiency is low, and the delivery period is seriously affected.

[0004] Publication number CN117300329A discloses a robot static shaft shoulder friction stir welding thermal power mixing control system. A multi-dimensional force sensor is installed on the flange at the end of the robot six-axis, the temperature and multi-dimensional force signals are directly measured, and the heat input and force in the welding process are actively controlled through thermal power mixing control, so as to fundamentally improve the welding seam quality. However, the multi-dimensional force sensor in the scheme is arranged at the execution end of the welding device, rather than the circuit board side, and cannot detect the stress and deviation amount of the circuit board in the laser welding process, and is not applicable to the lens module AA assembly design field.

[0005] In summary, it is urgent to design a lens AA assembly test equipment based on laser soldering and a use method thereof, to solve the problems of experience-dependent design of mass-produced AA soldering equipment, long debugging period, low efficiency, and difficulty in quantifying the relationship between welding stress and deformation in the prior art. SUMMARY

[0006] In view of this, the present invention aims to propose a lens AA assembly testing device based on laser soldering and its usage method, to solve the problems of existing mass production AA soldering equipment design relying on experience, long debugging cycle, low efficiency, and difficulty in quantifying the relationship between welding stress and deformation.

[0007] This solution involves testing the stress and deformation of the circuit board during the soldering process using the testing equipment provided in this solution before designing the mass-produced AA soldering equipment for lens modules. This allows the design accuracy of the mass-produced AA soldering equipment to be considered in light of the effects of these forces and deformations.

[0008] The technical solution of this invention is implemented as follows:

[0009] One objective of this invention is to disclose a lens AA assembly and testing device based on laser soldering, including a base plate and a testing component mounted on the base plate. A square tube frame is fixed on the base plate by four columns, and a three-axis soldering head assembly is provided at each of the four inner corners of the square tube frame.

[0010] The testing assembly includes a test platform with a test base. A six-dimensional force sensor is mounted on the test base. A square base for mounting a lens is fixed to the top of the six-dimensional force sensor. Multiple pins are provided on the top of the square base. Circuit boards are inserted into the pins. The circuit boards are fixed to the test platform by a clamping mechanism and maintain electrical continuity with the female connector during the soldering process.

[0011] Furthermore, the clamping mechanism includes two upright plates disposed on the test platform, with a lower horizontal plate and an upper horizontal plate arranged sequentially from bottom to top between the two upright plates;

[0012] The lower horizontal plate is provided with an XZ axis precision adjustment stage, and the XZ axis precision adjustment stage is provided with a parallel gripper cylinder. The gripper of the parallel gripper cylinder has a stepped surface, and the circuit board is clamped on the stepped surface.

[0013] The upper horizontal plate is equipped with a Z-axis slide cylinder, and the drive plate of the Z-axis slide cylinder is equipped with lower pressure ribs on both sides. The lower pressure ribs are fixed with positioning blocks for pressing the circuit board onto the stepped surface.

[0014] Furthermore, the lower horizontal plate is also provided with an L-shaped bracket, and the L-shaped bracket is provided with an electrical connector female head, which is inserted and mated with an electrical connector male head provided on the top surface of the circuit board;

[0015] A compression spring is fitted on the outer side of the female connector. The compression spring is used to apply a preload force to the female connector toward the male connector to maintain the electrical connection during the welding process.

[0016] Furthermore, the test bench is also equipped with a micrometer assembly for measuring the deformation of the circuit board in the X, Y, and Z directions. The micrometer assembly includes three micrometers arranged along the X, Y, and Z directions respectively. After the circuit board is clamped, the probes of the micrometers contact the side or top surface of the circuit board respectively.

[0017] Furthermore, the triaxial solder head assembly includes a support fixed on a square tube frame, an angle adjustment table that rotates around the X-axis on the support, a rotary slide table that rotates around the Y-axis on the angle adjustment table, a rotary arm on the rotary slide table, a Z-axis displacement platform on the rotary arm, and a laser fixed on the Z-axis displacement platform.

[0018] Furthermore, the laser integrates a monitoring camera and a temperature measuring device for monitoring the soldering process. The monitoring camera is used to acquire images of the solder joints, and the temperature measuring device is used to detect the temperature of the soldering area in real time.

[0019] Furthermore, the pins and the through holes on the circuit board are in clearance fit, which allows the circuit board to be adjusted in position relative to the square base within a certain range, avoiding interference between the pins and the inner wall of the through holes.

[0020] Furthermore, the bottom of the square base is connected to a six-dimensional force sensor via screws, and a simulated lens is also threaded onto the bottom of the square base to reproduce the actual product weight and connection method.

[0021] Furthermore, the XZ-axis precision adjustment stage is used to fine-tune the position of the parallel gripper cylinder, so that the circuit board is not subjected to additional pressure when it contacts the square seat, ensuring that the six-dimensional force sensor only detects the stress generated during the soldering process.

[0022] Another object of the present invention discloses a method for using a lens AA assembly and testing device based on laser soldering, which, based on any of the above-described lens AA assembly and testing devices based on laser soldering, includes the following steps:

[0023] S1: Install the circuit board to be tested into the clamping mechanism and connect it to the pins on the square base;

[0024] S2: The position is adjusted by the clamping mechanism so that the circuit board contacts the square base but without preload;

[0025] S3: Activate the clamping mechanism to fix the circuit board and make it connected to the female electrical connector;

[0026] S4: Start the three-axis solder head assembly for laser soldering, and at the same time collect stress and deformation data during the soldering process through a six-dimensional force sensor and a micrometer;

[0027] S5: Analyze the data and establish a stress-deformation model to guide the design of mass production equipment.

[0028] Compared with existing technologies, the lens AA assembly and testing equipment based on laser soldering and its usage method of the present invention have the following advantages:

[0029] 1. This invention, through the integrated measurement mechanism of a six-dimensional force sensor and a three-axis micrometer, can accurately acquire the magnitude of stress and deformation in three dimensions of the circuit board during laser soldering in real time. It solves the problems of traditional AA soldering equipment design relying on experience-based debugging, long debugging cycles, low efficiency, and difficulty in quantifying the relationship between welding stress and deformation. It improves the accuracy of welding offset prediction by more than 90%, provides reliable data support for the clamping force and positioning compensation design of mass production equipment, and significantly improves the first-time success rate of AA alignment.

[0030] 2. This invention employs a stepped surface clamping and independent pressing structure to ensure that the clamping force is not transmitted to the sensor below. At the same time, combined with the power-on monitoring function of the electrical connector, it realizes the pure acquisition of mechanical signals and the synchronous verification of the reliability of electrical connection during the welding process. This effectively avoids the influence of external interference on the test results, improves the accuracy and comprehensiveness of the test data, and ensures the authenticity and repeatability of the process verification.

[0031] 3. This invention achieves high-precision dynamic positioning of the laser focus point through four independently adjustable three-axis solder head assemblies, combined with an angle adjustment stage, a rotary slide, and a Z-axis displacement platform. It supports multi-point sequential welding and real-time temperature monitoring, simulates the welding process in a mass production environment, and can be flexibly adapted to different product models. The testing cycle is shortened by 40%, which greatly improves the equipment's versatility and R&D efficiency. It is suitable for R&D verification scenarios with multiple varieties and small batches. Attached Figure Description

[0032] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0033] Figure 1 This is a schematic diagram of the structure of the testing equipment of the present invention;

[0034] Figure 2 This is a schematic diagram of the structure of the test component of the present invention;

[0035] Figure 3 This is a partial enlarged view of the test component of this invention;

[0036] Figure 4 This is a schematic diagram of the structure of the three-axis solder head assembly of the present invention.

[0037] Figure label:

[0038] 1. Base plate; 2. Test assembly; 21. Test platform; 22. Test base; 23. Six-dimensional force sensor; 24. Square base; 25. Pins; 26. Circuit board; 261. Male electrical connector; 27. Vertical plate; 28. Lower horizontal plate; 281. XZ axis precision adjustment stage; 282. Parallel gripper cylinder; 283. Stepped surface; 284. L-shaped bracket; 285. Female electrical connector; 286. Compression spring; 29. ​​Upper horizontal plate; 291. Z-axis slide cylinder; 292. Lower pressure rib; 293. Positioning block; 3. Column; 4. Square tube frame; 5. Three-axis solder head assembly; 51. Support; 52. Angle adjustment stage; 53. Rotary slide; 54. Rotary arm; 55. Z-axis displacement platform; 56. Laser; 561. Monitoring camera; 562. Temperature measuring device. Detailed Implementation

[0039] To make the technical means and objectives and effects of the present invention easier to understand, the embodiments of the present invention will be described in detail below with reference to specific illustrations.

[0040] It should be noted that all directional and positional terms used in this invention, such as "up," "down," "left," "right," "front," "back," "vertical," "horizontal," "inner," "outer," "top," "lower," "lateral," "longitudinal," and "center," are only used to explain the relative positional relationships and connections between components in a specific state. They are merely for the convenience of describing the invention and do not require the invention to be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0041] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] This invention provides a lens module AA assembly testing device based on laser soldering technology, aiming to solve the problems of existing mass production AA soldering equipment, such as reliance on experience in design, long debugging cycles, low efficiency, and difficulty in quantifying the relationship between welding stress and deformation. This testing device allows for precise measurement of the stress state and deformation of different circuit boards during the laser soldering process before formally designing mass production equipment, providing a scientific design basis for the clamping system, welding parameters, and compensation algorithms of the mass production equipment.

[0044] like Figures 1-4 As shown, the lens module AA assembly test equipment of this embodiment includes a base plate 1 and a test component 2 set on the base plate 1, which is used to simulate the actual AA assembly structure of the lens module and to collect data. A rectangular square tube frame 4 is fixedly connected to the four corners of the base plate 1 by four columns 3. The square tube frame 4 can be formed by welding or bolting plates and is used to support and position four triaxial solder head assemblies 5.

[0045] Four three-axis solder head assemblies 5 are provided, corresponding to the pin 25 positions at the four corners of the top of the square base 24 of the lens module. Each three-axis solder head assembly 5 can independently adjust the spatial attitude of the laser 56 to ensure that the laser beam can be accurately focused on the solder joint position.

[0046] Test assembly 2 includes a test platform 21 fixed on the base plate 1, a test base 22 mounted on the test platform 21, and a six-dimensional force sensor 23 mounted on the test base 22. The test platform 21, as the main support platform of test assembly 2, is fixed to the base plate 1 and possesses high rigidity and stability. It is used to install and integrate all lower structures, such as the test base 22, clamping mechanisms, electrical connectors, etc., ensuring the relative positional accuracy between components and preventing vibration or deformation from affecting test results. The test base 22 provides a stable and flat mounting reference surface and has certain vibration damping and heat insulation functions, reducing the influence of the external environment on the sensor. The six-dimensional force sensor 23 can simultaneously measure forces in the X, Y, and Z directions, as well as torques around the three axes. Its core function is to capture in real time all mechanical responses generated by thermal expansion, solder melting and solidification contraction during laser soldering. These forces are transmitted through the path of pin 25 → circuit board 26 → square base 24 → six-dimensional force sensor 23, truly reflecting the potential impact of soldering on AA alignment accuracy.

[0047] Preferably, the test base 22 includes two bases and a connecting plate connecting the two bases. The two bases are arranged symmetrically about the central axis of the test platform 21. The bases are mounted on the test platform 21 by screws, and both ends of the connecting plate are connected to the base screws respectively. When the six-dimensional force sensor 23 is placed on the connecting plate, the overall structure is easier to integrate with the vibration-damping support structure. The six-dimensional force sensor 23 is placed only on the connecting plate and is not directly fixed to the base, or only lightly positioned. The force on the sensor comes only from the square base 24 above and the simulated lens, and does not bear the preload or structural deformation stress from the base mounting screws. This avoids "preload" or "eccentric force" caused by improper assembly of the test base 22. During laser soldering, local temperature rise may cause thermal expansion of the metal structure. The split structure allows for a small relative displacement between the base and the connecting plate, releasing thermal stress. The connecting plate can be made of a material with a low coefficient of thermal expansion to further improve thermal stability.

[0048] Preferably, a heat-insulating pad can be provided between the square base 24 and the six-dimensional force sensor 23 to reduce the heat conduction to the sensor during laser welding, thereby improving the sensor's service life and measurement accuracy.

[0049] The top of the six-dimensional force sensor 23 is fixed with a square base 24 for mounting a lens. This square base 24 is used to simulate the structure of connecting lenses in actual products. The bottom of the square base 24 has an internal thread, which can be threaded to connect a simulated lens. The mass of the simulated lens is consistent with that of the actual lens to reproduce the weight and center of gravity distribution under real working conditions.

[0050] The square base 24 has four pins 25 at the four corners of its top. The circuit board 26 has through holes corresponding to the pins 25. After the pins 25 are inserted into the through holes, the two are in clearance fit. The range of the clearance on one side can be 0.05~0.1mm, so that the position of the circuit board 26 relative to the square base 24 can be adjusted within a certain range to avoid interference between the pins 25 and the inner wall of the through holes.

[0051] In order to achieve stable clamping and precise positioning of the circuit board 26, it is fixed on the test bench 21 by a clamping mechanism and can maintain electrical conductivity with the electrical connector female head 285 during the soldering process. An image sensor is provided at the bottom of the circuit board 26.

[0052] Specifically, the clamping mechanism includes two vertical plates 27 mounted on the test stage 21 along the Z-axis. Between the two vertical plates 27, from bottom to top, are a lower horizontal plate 28 and an upper horizontal plate 29. The lower horizontal plate 28 has an XZ-axis precision adjustment stage 281, and the XZ-axis precision adjustment stage 281 has a parallel gripper cylinder 282. This XZ-axis precision adjustment stage 281 is a commercially available micron-level displacement platform used to fine-tune the position of the parallel gripper cylinder 282, ensuring that the circuit board 26 is not subjected to additional pressure when in contact with the square base 24, and ensuring that the six-dimensional force sensor 23 only detects stress generated during soldering. The parallel gripper cylinder 282 is connected to a movable slider screw on the XZ-axis precision adjustment stage 281.

[0053] The parallel gripper cylinder 282 has a stepped surface 283 on its gripper, and the circuit board 26 is clamped on the stepped surface 283. The clamping force is controlled by air pressure and can be adjusted from 20 to 100 N, or the clamping force can be selected as needed. The lower horizontal plate 28 is also provided with an L-shaped bracket 284, and an electrical connector female head 285 is provided on the L-shaped bracket 284. The electrical connector female head 285 can be inserted and mated with the electrical connector male head 261 provided on the top surface of the circuit board 26. A compression spring 286 is sleeved on the outside of the electrical connector female head 285. The compression spring 286 is used to apply a preload force to the electrical connector female head 285 toward the electrical connector male head 261 to ensure stable electrical connection during welding. The open circuit can be monitored by an external circuit.

[0054] Preferably, the gripping surfaces of the parallel gripper cylinders 282 can be replaced with a V-groove structure or a vacuum suction cup structure to grip circuit boards 26 of different shapes or materials. The grippers of the parallel gripper cylinders 282 have various specifications, and the grippers of the two parallel gripper cylinders 282 are arranged opposite each other, so that the distance between the step surfaces 283 of the grippers of the two parallel gripper cylinders 282 can be adjusted to accommodate circuit boards 26 of different specifications. Alternatively, two parallel gripper cylinders 282 that can move along the Y-axis can be used to facilitate adjustment of the distance between the gripping surfaces.

[0055] Preferably, one or more stepped surfaces 283 are arranged along the X-axis direction, and the stepped surfaces 283 are arranged on the extension of the jaws of the parallel gripper cylinder 282 along the Y-axis to avoid interference between the jaws and the circuit board 26.

[0056] Preferably, an elastic guide structure is provided between the female connector 285 and the L-shaped bracket 284 to compensate for minor misalignment between the male connector 261 and the female connector 285 during the insertion process.

[0057] The upper horizontal plate 29 is equipped with a Z-axis slide cylinder 291. The drive plate of the Z-axis slide cylinder 291 has downward pressing ribs 292 on both sides. Positioning blocks 293 are fixed on the downward pressing ribs 292 to press the circuit board 26 onto the stepped surface 283. When the parallel gripper cylinder 282 clamps the circuit board 26, the Z-axis slide cylinder 291 drives the positioning blocks 293 to press down, completely pressing the circuit board 26 onto the stepped surface 283, achieving complete fixation. Because the downward pressure is directly transmitted to the lower horizontal plate 28 through the stepped surface 283, it is not transmitted to the square base 24 and the six-dimensional force sensor 23, thus ensuring that the sensor only measures the thermal stress and shrinkage stress generated during the soldering process.

[0058] Preferably, the Z-axis slide cylinder 291 is prior art, including a movable slider for connecting the lower pressure rib 292 to drive the positioning block 293 to press down or lift up, and also including a limit plate set at the top to prevent the slider from moving beyond the limit.

[0059] Preferably, the lower pressure rib 292 can be L-shaped, the vertical arm of the lower pressure rib 292 is screwed to the Z-axis slide cylinder 291, and the vertical arm of the lower pressure rib 292 is connected to the positioning block 293.

[0060] Preferably, the positioning block 293 includes a fixing part and a positioning part. The fixing part is threadedly connected to the lower pressure rib 292. The positioning part is a protrusion along the Z-axis downward along one end of the fixing part away from the lower pressure rib 292. The side wall of the positioning part is provided with a clearance part to avoid the circuit board 26 or the male connector 261.

[0061] To measure the three-dimensional deformation of circuit board 26 during the soldering process, the test bench 21 is also equipped with a micrometer assembly for measuring the deformation of circuit board 26 in the X, Y, and Z directions. The micrometer assembly includes three micrometers arranged along the X, Y, and Z directions, respectively. After circuit board 26 is clamped, the micrometer probes contact the side or top surface of circuit board 26. After circuit board 26 is clamped, the micrometer probes in the X and Y directions are in contact with the two adjacent side surfaces of circuit board 26, respectively, and the micrometer probe in the Z direction is in contact with the top surface of circuit board 26, with the initial reading set to zero. During the soldering process, the minute displacement of circuit board 26 in the three directions can be obtained by reading the changes in the micrometer values ​​in real time.

[0062] Specifically, the triaxial solder head assembly 5 includes a support 51 fixed on a square tube frame 4. The support 51 has an angle adjustment stage 52 that rotates around the X-axis. The angle adjustment stage 52 has a rotary slide 53 that rotates around the Y-axis. The rotary slide 53 has a rotary arm 54, and the rotary arm 54 has a Z-axis displacement platform 55. A laser 56 is fixed on the Z-axis displacement platform 55. The support 51 serves as the basic connecting component of the entire triaxial solder head assembly 5, rigidly fixing the assembly to the square tube frame 4, providing a stable installation reference, and ensuring the repeatability and positioning accuracy of subsequent motion mechanisms. The angle adjustment stage 52 rotates around the X-axis, which is existing technology, enabling the laser 56 to adjust its tilt angle in the pitch direction (i.e., vertical tilt), controlling the laser beam incident angle and avoiding heat concentration or reflection damage caused by vertical irradiation. The rotary slide 53 rotates around the Y-axis, enabling the laser 56 to deflect in the horizontal plane, i.e., swing left and right. Combined with the angle adjustment stage 52, this allows the laser beam to be incident along the tangential direction of the cavity wall, facilitating uniform spread of the molten solder and reducing porosity and cold solder joints. The rotary arm 54 connects the rotary slide 53 to the Z-axis displacement platform 55, serving as a force and motion transmission structure. It possesses sufficient rigidity and a lightweight design, ensuring stable support for the laser 56 under various angles. The Z-axis displacement platform 55, a prior art technology, provides micron-level precise movement of the laser 56 in the vertical direction, used to adjust the distance between the laser focus and the solder joint, ensuring optimal laser energy density and achieving stable, high-quality solder melting and solidification. The laser 56, acting as a heat source actuator, emits a high-energy laser beam to heat and melt the solder between the pin 25 and the through-hole of the circuit board 26, completing the electrical and mechanical connection. Integrating the monitoring camera 561 and temperature measuring device 562 also enables closed-loop process control.

[0063] Preferably, the laser 56 can be a semiconductor laser or a fiber laser with a wavelength range of 808nm~980nm and an adjustable output power range of 20W~100W, suitable for melting and soldering solder paste or solder rings. Other laser equipment can also be selected according to actual conditions.

[0064] Preferably, the angle adjustment stage 52 and the rotary slide 53 are either manually adjustable or motor-driven automatically adjustable, used to adjust the incident angle of the laser 56 so that the laser beam is focused on the welding area between the pin 25 and the circuit board 26. Manual adjustment allows for fine angle adjustment via knobs, dials, or fine-tuning screws, suitable for small-batch testing during the R&D verification phase. Operators can position the laser based on experience or visual alignment, resulting in low cost and simple maintenance, making it suitable for applications with low automation requirements. The motor-driven automatically adjustable structure can use stepper motors or servo motors to drive the angle adjustment stage 52 and the rotary slide 53, working in conjunction with a control system to achieve programmed angle setting and repeatable positioning. It supports preset multiple welding angle parameters, enabling rapid switching between different product models, and can be linked with the laser 56 and monitoring camera 561 to build a closed-loop automatic welding system.

[0065] Specifically, the laser 56 integrates a monitoring camera 561 and a temperature measuring device 562 for monitoring the soldering process. The monitoring camera 561 is used to acquire images of the solder joints and determine whether the solder is uniform and whether there are any cold solder joints. The temperature measuring device 562 is used to detect the temperature of the soldering area in real time, realize closed-loop power adjustment, and ensure stable soldering quality.

[0066] This setting can judge the quality of the weld joint during the welding process. If an abnormality is detected, an alarm can be triggered immediately or the welding process can be terminated to avoid batch defects, improve the reliability of test data, ensure that stress and deformation measurements are based on qualified weld joints, and ensure consistent heat input for each weld through closed-loop temperature control, thereby improving weld joint consistency and reliability.

[0067] Specifically, the bottom of the square base 24 is connected to the six-dimensional force sensor 23 via screws, and a simulated lens is also threaded onto the bottom of the square base 24 to reproduce the actual product weight and connection method. The screw connection achieves a rigid, detachable, and high-precision centering connection between the square base 24 and the six-dimensional force sensor 23, ensuring that all dynamic forces generated during the welding process can be transmitted to the sensor without loss or offset, guaranteeing the integrity and accuracy of the measurement signal, and avoiding the maintenance difficulties caused by irreversible connection methods such as adhesive bonding or welding. The threaded connection has good repeatability and positioning accuracy, ensuring center alignment and consistent height after each installation, improving test repeatability.

[0068] Specifically, the test bench 21 is also equipped with an ambient temperature monitoring module and a vibration-damping support structure to reduce the impact of external environmental interference on test accuracy. Its purpose is to eliminate interference from external environmental factors on high-precision mechanical measurements. Because the laser soldering process involves thermo-mechanical coupling effects, and components such as the six-dimensional force sensor 23 and micrometer are extremely sensitive to environmental changes, even minor temperature fluctuations or mechanical vibrations can lead to distorted measurement data. When this setup is used for testing under different times and environmental conditions, if temperature and vibration are controlled, the results show high consistency, improving the accuracy and reliability of the test data.

[0069] The beneficial effects of this embodiment are as follows: By integrating a six-dimensional force sensor 23 and a three-axis micrometer, real-time, accurate, and multi-dimensional measurement of stress and deformation during the welding process is achieved, providing reliable data support for the design of AA soldering equipment. The "stepped surface clamping + independent pressing" structure decouples the clamping force from the welding stress, ensuring the purity and accuracy of the test data. The introduction of an electrical connector power-on monitoring mechanism allows for simultaneous verification of the reliability of electrical connections during the welding process, enhancing the comprehensiveness of the test. The three-axis solder head assembly 5 has high degree of freedom adjustment capabilities, supports multi-point sequential welding and process parameter pre-calibration, and is suitable for verification of various products. The overall equipment realizes a shift in the R&D model from "test first, design later," significantly shortening the development cycle of mass production equipment, reducing debugging costs, and increasing the first-time design success rate, making it particularly suitable for the large-scale production needs of high-precision lens modules.

[0070] A second objective of this invention is to disclose a method of using any of the aforementioned testing devices, comprising the following steps:

[0071] S1: Install the circuit board to be tested 26 in the clamping mechanism and connect it to the pin 25 on the square base 24;

[0072] By constructing a realistic AA assembly structure, pin 25 is inserted into the through hole to form a clearance fit, simulating the "align first, then solder" process in actual products, ensuring that the test object is a real customer product or equivalent structure, and improving the engineering representativeness of the verification results.

[0073] S2: Adjust the position using the XZ axis precision adjustment stage 281 so that the circuit board 26 contacts the square base 24 but without preload;

[0074] This achieves zero-stress initial alignment between the circuit board 26 and the square base 24, avoiding the introduction of additional mechanical stress due to improper clamping or positioning, and ensuring that the stress measured subsequently comes only from the soldering process itself.

[0075] S3: Activate the clamping mechanism to fix the circuit board 26 and make the male connector 261 of the electrical connector 285 conductive;

[0076] Stable clamping is achieved through the "stepped surface + pressure rib" structure, and the clamping force is not transmitted to the six-dimensional force sensor 23. After the electrical connector is turned on, the circuit on / off status can be monitored in real time to verify whether welding thermal stress causes electrical failures such as poor welding or open circuit, thus achieving dual mechanical and electrical verification.

[0077] S4: Start the three-axis solder head assembly 5 to perform laser soldering, and at the same time collect stress and deformation data during the soldering process through the six-dimensional force sensor 23 and micrometer;

[0078] Simulates the multi-point laser soldering process in real mass production, which can solder sequentially or synchronously. It can collect forces, torques and three-dimensional deformations in the X / Y / Z directions in real time. The data has high temporal resolution and can analyze the dynamic behavior of the soldering process.

[0079] S5: Analyze the data and establish a stress-deformation model to guide the design of mass production equipment.

[0080] The collected data is analyzed in the time domain, frequency domain, or by machine learning to identify key influencing factors and establish an empirical or mathematical model of "welding sequence-stress distribution-deformation trend". The model is then directly output as design parameters for mass production equipment, such as clamping force setting, welding path planning, and dynamic compensation algorithm.

[0081] This setup allows for standardized testing of circuit boards 26 with different thicknesses, materials, and sizes. By obtaining objective data through standardized processes, it reduces interference from human factors, improves the scientific nature of decision-making, and optimizes clamping force, support structure, and welding sequence based on real data. This reduces equipment rework, parts replacement, or on-site rectification caused by improper design. It can also establish a "product-process-parameter" database, allowing new projects to quickly access historical data for design reference.

[0082] Specifically, in step S4, the solder quality is monitored in real time by the monitoring camera 561 and the temperature measuring device 562, and the laser power is adjusted according to the temperature feedback to achieve closed-loop soldering control.

[0083] This closed-loop control system ensures that the heat input of each welding group is highly consistent, avoiding process deviations caused by environmental fluctuations and material differences. It significantly reduces the defect rate of incomplete welds, cold welds, and over-welds, improves the mechanical strength and electrical conductivity of weld joints, and helps to achieve visualization and traceability of the welding process.

[0084] The third objective of this invention is to disclose a design method for a mass production AA soldering equipment for lens modules. The method uses the testing equipment described above to obtain stress distribution and deformation data of different types of circuit boards 26 during the soldering process, and sets the clamping force of the jaws, the soldering sequence, and the positioning compensation parameters in the mass production equipment based on the data.

[0085] This testing equipment is used to test the stress distribution and deformation of different types of circuit boards 26 during laser soldering before designing mass-production lens module AA soldering equipment. This provides a design basis for setting the clamping force, planning the soldering sequence, and the positioning compensation algorithm of the mass production equipment. By providing precise design basis for the clamping force, soldering sequence, and compensation algorithm of the mass production equipment, it solves the long-standing problems in the industry such as blind design, inefficient debugging, and uncontrollable delivery time.

[0086] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A lens AA assembly and testing device based on laser soldering, characterized in that, Includes a base plate (1) and a test assembly (2) set on the base plate (1). A square tube frame (4) is fixed on the base plate (1) by four columns (3). A three-axis solder head assembly (5) is provided at each of the four inner corners of the square tube frame (4). The test assembly (2) includes a test platform (21), a test base (22) is provided on the test platform (21), a six-dimensional force sensor (23) is provided on the test base (22), a square base (24) for mounting a lens is fixed on the top of the six-dimensional force sensor (23), a plurality of pins (25) are provided on the top of the square base (24), a circuit board (26) is inserted into the pins (25), and the circuit board (26) is fixed on the test platform (21) by a clamping mechanism and maintains electrical connection with the female connector (285) during the soldering process; The clamping mechanism includes two upright plates (27) set on the test table (21), and a lower horizontal plate (28) and an upper horizontal plate (29) are arranged between the two upright plates (27) from bottom to top. The lower horizontal plate (28) is provided with an XZ axis precision adjustment stage (281), and the XZ axis precision adjustment stage (281) is provided with a parallel gripper cylinder (282). The gripper of the parallel gripper cylinder (282) has a stepped surface (283), and the circuit board (26) is clamped on the stepped surface (283). The upper horizontal plate (29) is provided with a Z-axis slide cylinder (291), and the drive plate of the Z-axis slide cylinder (291) is provided with a lower pressing rib (292) on both sides. The lower pressing rib (292) is fixed with a positioning block (293) for pressing the circuit board (26) onto the step surface (283).

2. The lens AA assembly and testing equipment based on laser soldering according to claim 1, characterized in that, The lower horizontal plate (28) is also provided with an L-shaped bracket (284), and the L-shaped bracket (284) is provided with an electrical connector female head (285), which is connected to the electrical connector male head (261) provided on the top surface of the circuit board (26). A compression spring (286) is fitted on the outside of the female connector (285). The compression spring (286) is used to apply a preload force toward the male connector (261) to the female connector (285) to maintain the electrical connection during the welding process.

3. The lens AA assembly and testing equipment based on laser soldering according to claim 1, characterized in that, The test bench (21) is also provided with a micrometer assembly for measuring the deformation of the circuit board (26) in the X, Y, and Z directions. The micrometer assembly includes three micrometers arranged along the X, Y, and Z directions respectively. After the micrometer probes are clamped on the circuit board (26), they contact the side or top surface of the circuit board (26) respectively.

4. The lens AA assembly and testing equipment based on laser soldering according to claim 1, characterized in that, The triaxial solder head assembly (5) includes a support (51) fixed on a square tube frame (4), an angle adjustment table (52) rotating around the X-axis is provided on the support (51), a rotary slide (53) rotating around the Y-axis is provided on the angle adjustment table (52), a rotary arm (54) is provided on the rotary slide (53), a Z-axis displacement platform (55) is provided on the rotary arm (54), and a laser (56) is fixed on the Z-axis displacement platform (55).

5. The lens AA assembly and testing equipment based on laser soldering according to claim 4, characterized in that, The laser (56) integrates a monitoring camera (561) and a temperature measuring device (562) for monitoring the soldering process. The monitoring camera (561) is used to acquire images of the solder joints, and the temperature measuring device (562) is used to detect the temperature of the soldering area in real time.

6. The lens AA assembly and testing equipment based on laser soldering according to claim 1, characterized in that, The pin (25) and the through hole on the circuit board (26) are in clearance fit, so that the circuit board (26) can be adjusted in position relative to the square base (24) within a certain range, avoiding interference between the pin (25) and the inner wall of the through hole.

7. The lens AA assembly and testing equipment based on laser soldering according to claim 1, characterized in that, The bottom of the square base (24) is connected to the six-dimensional force sensor (23) by screws, and the bottom of the square base (24) is also threaded with a simulated lens to reproduce the actual product weight and connection method.

8. The lens AA assembly and testing equipment based on laser soldering according to claim 1, characterized in that, The XZ axis precision adjustment stage (281) is used to fine adjust the position of the parallel gripper cylinder (282) so that the circuit board (26) is not subjected to additional pressure when it contacts the square seat (24), ensuring that the six-dimensional force sensor (23) only detects the stress generated during the soldering process.

9. A method for using a lens AA assembly and testing device based on laser soldering, characterized in that, The lens AA assembly and testing equipment based on laser soldering as described in any one of claims 1-8 includes the following steps: S1: Install the circuit board to be tested (26) in the clamping mechanism and plug it into the pin (25) on the square base (24); S2: Adjust the position by clamping mechanism so that the circuit board (26) contacts the square base (24) but without pre-pressure; S3: Activate the clamping mechanism to fix the circuit board (26) and make it conductive with the electrical connector female head (285); S4: Start the three-axis solder head assembly (5) to perform laser soldering, and at the same time collect stress and deformation data during the soldering process through a six-dimensional force sensor (23) and a micrometer; S5: Analyze the data and establish a stress-deformation model to guide the design of mass production equipment.

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