Digitalized optical element grinding and polishing equipment and control method

Abstract

The application provides a digital optical element grinding and polishing equipment and a control method thereof, and relates to the technical field of optical element grinding and polishing equipment. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application discloses a digital optical element grinding and polishing equipment and a control method thereof. The application disc

Description

Technical Field

[0001] This application relates to the field of optical component processing technology, and more specifically, to a digital optical element polishing equipment and control method. Background Technology

[0002] In the existing production and processing of optical components, although some digital auxiliary control is used in the processing of equipment operated manually, each optical component still needs to be individually adjusted. During the manual operation, experienced operators are still required to adjust the processing data according to the processing status of each optical component in order to produce optical components that meet the quality requirements.

[0003] The existing technology, which adjusts and controls the processing data of each piece individually, makes the operation of the processing process basically dependent on the experience level of the operator. Since the processing skill standards of operators are not uniform, this leads to problems such as insufficient efficiency and poor quality consistency in the processing process.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] The purpose of this application is to provide a digital optical element grinding and polishing equipment and control method, which solves the problems of insufficient efficiency and poor quality consistency in the processing process caused by the existing technology of adjusting and controlling the processing data of each piece individually.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] On the one hand, this application provides a digital optical element polishing device, comprising:

[0008] Grinding and polishing actuators are used to grind or polish optical components.

[0009] Interactive control device, used for information input, display and output;

[0010] The upper plate weight control device is installed on the grinding and polishing actuator and is used to monitor the grinding and polishing pressure in real time.

[0011] A polishing and grinding sensor control device is installed on the polishing and grinding actuator and is used to control the polishing and grinding quality parameters of the optical element during the processing.

[0012] The optical scanning data processing module is used to generate the execution parameters of the polishing equipment based on the surface image data of the acquired optical elements.

[0013] The main controller is electrically connected to the interactive control device, the upper plate weighing control device, the grinding and polishing sensor control device, and the optical scanning data processing module.

[0014] The main controller calls the adjusted pre-stored processing data through the interactive control device, and controls the grinding and polishing actuator to process the optical components according to the pre-stored processing data. The adjusted processing data includes the grinding and polishing pressure and the execution parameters of the grinding and polishing equipment.

[0015] In an optional embodiment, the polishing actuator includes: a processing press frame, which is rotatable and has a polishing tool at one end, the polishing tool being pressed onto the processing surface of the optical element by the rotation of the processing press frame;

[0016] An eccentric adjustment component is connected to a processing press frame. The offset position of the processing press frame is adjusted by the control of the eccentric adjustment component to control the processing range of the grinding and polishing tool.

[0017] The tool has a chisel adjustment section and an iron pen adjustment section. The chisel adjustment section is set on the machining pressure frame, and the iron pen adjustment section is set on the chisel adjustment section. The grinding and polishing tool is set on the iron pen adjustment section. The surface accuracy of the grinding and polishing tool is controlled by the joint adjustment of the iron pen adjustment section and the chisel adjustment section.

[0018] In an optional embodiment, the grinding and polishing sensing control device includes: an eccentric displacement sensor, which is disposed on the eccentric adjustment assembly and is used to detect the offset position of the processing press.

[0019] A drill bit displacement sensor is mounted on the machining press and is used to detect the offset position of the drill bit adjustment part.

[0020] The stylus displacement sensor is installed on the stylus adjustment section and is used to detect the offset position of the stylus adjustment section.

[0021] In an optional embodiment, the upper plate weighing control device includes: a pressure member connected to the processing press and used to push the processing press, and a grinding and polishing tool to squeeze the optical element;

[0022] A pressure sensor is installed on the pressure-applying component and is used to detect the processing pressure applied by the pressure-applying component to the processing press.

[0023] In an optional embodiment, the interactive control device includes a touch screen disposed on one side of the polishing execution structure;

[0024] The touch screen and main controller are located inside the enclosure, forming the control host.

[0025] On the other hand, this application proposes a control method for a digital optical element grinding and polishing equipment, applied to the digital optical element grinding and polishing equipment described above. The control method includes the following steps:

[0026] The pre-stored processing data, which includes grinding and polishing pressure and grinding and polishing equipment execution parameters, is retrieved through the interactive control device.

[0027] The upper plate weight control device is controlled according to the grinding and polishing pressure to drive the grinding and polishing actuator to apply pressure to the optical element to be processed according to the grinding and polishing pressure.

[0028] The grinding and polishing actuator is controlled according to the parameters of the grinding and polishing equipment to process the optical components to be processed, so as to obtain optical parts of a predetermined quality.

[0029] In an optional embodiment, the step of recalling the adjusted pre-stored processing data via an interactive control device further includes:

[0030] The predetermined blank is pre-processed, and the grinding and polishing pressure and the execution parameters of the grinding and polishing equipment are adjusted to obtain the predetermined optical parts that meet the quality requirements.

[0031] The adjusted grinding and polishing pressure and the grinding and polishing equipment execution parameters are stored as pre-stored processing data, which corresponds to the specifications of the predetermined optical parts.

[0032] In an optional embodiment, in the step of pre-processing a predetermined blank and adjusting the grinding and polishing pressure and the parameters of the grinding and polishing equipment to obtain a predetermined optical part that meets the quality requirements:

[0033] The blank size of the predetermined blank and the final size of the predetermined optical part required are obtained by inputting through the interactive control device, and a processing strategy is formulated based on the blank size and the final size.

[0034] According to the processing strategy, the upper plate weighing control device applies the first grinding and polishing pressure, and controls the grinding and polishing execution mechanism to process the predetermined blank to be processed according to the execution parameters of the first grinding and polishing equipment, so as to obtain the first optical part;

[0035] The measurement parameters of the first optical component after it has been inspected are obtained, and the first polishing pressure and the execution parameters of the first polishing equipment are adjusted based on the measurement parameters;

[0036] The first optical component is modified based on the adjusted first polishing pressure and the first polishing equipment execution parameters to obtain a predetermined optical component that meets the quality requirements. The adjusted first polishing pressure and the first polishing equipment execution parameters are referred to as the adjusted polishing pressure and polishing equipment execution parameters.

[0037] In an optional embodiment, the step of developing a processing strategy based on the blank size and the final size includes:

[0038] The total material removal amount is obtained based on the relationship between the material removal rate and process parameters during polishing.

[0039] Identify the influencing factors of process parameters and calibrate the process parameters;

[0040] The total material removal amount is dynamically adjusted based on the calibrated process parameters;

[0041] The processing strategy is determined based on the dynamically adjusted total material removal amount.

[0042] In an optional embodiment, the step of adjusting the first polishing pressure and the execution parameters of the first polishing equipment based on the measurement parameters obtained after the first optical component has been inspected includes:

[0043] Collect surface image data files of the first optical component using an interferometer;

[0044] Surface image data files are converted into processing data using AI conversion algorithms, and the processing data can drive the grinding and polishing actuator to perform its work.

[0045] The beneficial effects of the digital optical element grinding and polishing equipment and control method provided in this application are at least as follows: By setting pre-stored processing data, which is typically processed by experienced operators using a pre-prepared blank, and by continuously adjusting the grinding and polishing pressure and the execution parameters of the grinding and polishing equipment, the first qualified pre-prepared optical element is finally obtained. The adjusted grinding and polishing pressure and the execution parameters of the grinding and polishing equipment used to obtain the qualified pre-prepared optical element are then stored to obtain the pre-stored processing data. During the production of subsequent optical elements of the same specification, ordinary operators can directly call up the pre-stored processing data through an interactive control device. The main controller of the equipment controls the grinding and polishing execution mechanism to grind or polish subsequent optical elements according to the pre-stored processing data. For example, the grinding and polishing quality parameters of the optical element during processing can be controlled by a grinding and polishing sensor control device to ensure that the grinding and polishing quality parameters of subsequent optical elements are the same as the called grinding and polishing equipment execution parameters; the grinding and polishing pressure can be monitored in real time by a weighing control device to ensure that the grinding and polishing pressure of subsequent optical elements is the same as the called grinding and polishing pressure. By using the same pre-stored processing data and the same processing technology during mass production of optical components, consistent quality throughout the manufacturing process is ensured. After each optical component is processed, a quality inspection device obtains its surface image data. This image data is then processed by the optical scanning data processing module within the equipment, converting it into quality parameters recognizable by the equipment. The processor compares these quality parameters with predetermined quality parameters to determine if the currently processed optical component meets the quality requirements. If not, the pre-stored processing data is automatically adjusted, generating new grinding and polishing equipment execution parameters. These new parameters are then used to control the grinding and polishing mechanism, continuing the processing of the current optical component until a finished product meeting the quality requirements is obtained. Therefore, this grinding and polishing equipment uses a main controller to coordinate multiple control function modules, achieving repeatable high-precision processing and closed-loop quality management of optical components. This ensures the quality accuracy requirements after repeatable processing of batches of optical components, thereby improving processing efficiency and guaranteeing consistent processing quality. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1A schematic diagram of a digital optical element polishing device provided in this application embodiment;

[0048] Figure 2 A circuit block diagram of a digital optical element polishing device provided in this application embodiment;

[0049] Figure 3 A flowchart illustrating the main steps of a control method for a digital optical element polishing equipment provided in this application embodiment;

[0050] Figure 4 A flowchart illustrating the main steps of determining pre-stored processing data in a control method for a digital optical element polishing equipment provided in this application embodiment;

[0051] Figure 5 This is a flowchart illustrating the detailed steps of step 10 in a control method for a digital optical element polishing equipment provided in an embodiment of this application.

[0052] The following are the labeling elements in the figure:

[0053] 10. Optical components; 100. Machine base; 110. Die plate; 200. Grinding and polishing actuator; 210. Processing press; 220. Eccentric adjustment assembly; 230. Die adjustment part; 240. Iron pen adjustment part; 250. Grinding and polishing tool; 300. Interactive control device; 310. Touch screen; 320. Housing; 400. Upper plate weighing control device; 410. Pressure application component; 420. Pressure sensor; 500. Grinding and polishing sensing and control device; 510. Eccentric displacement sensor; 520. Die displacement sensor; 530. Iron pen displacement sensor; 600. Main controller; 610. Optical scanning data processing module. Detailed Implementation

[0054] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0055] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0056] Traditional optical component polishing equipment relies heavily on manual operation. The quality and related control parameters of each optical component during processing are set by the operator, easily leading to low processing accuracy, insufficient efficiency, and poor quality consistency. Although digital control technology has been partially applied, its various functional modules are implemented independently in different devices, resulting in a lack of integrated image detection, dynamic parameter adjustment, and surface defect repair capabilities in polishing equipment (e.g., ring polishers). Furthermore, existing polishing equipment still faces technical bottlenecks in crack blurring processing (AT technology), micro-adjustment control compatibility, and high-precision model output. Therefore, to address the problems of traditional ring polishers requiring processing adjustments for each optical component, which leads to the impact of processing time, surface finish, surface shape control, material transformation, and environmental factors on the quality of optical components, and the poor product accuracy and repeatability due to different operators, this application proposes the following specific embodiments:

[0057] For ease of description, this embodiment uses the processing of a batch of parts as an example. The first part to be tested is called an "optical part." The parameters of the production and debugging process of this optical part are stored as pre-stored processing data. Subsequent parts are processed using this pre-stored processing data as the standard. The parts processed subsequently are called "optical elements." Therefore, they are the same optical parts, just described differently at different production stages. Before processing, the part is called a blank. In some descriptions, the blank may also be referred to as an optical element at the blank stage, in which case it refers to the optical element before processing.

[0058] Example 1

[0059] Please see Figure 1This embodiment proposes a digital optical element grinding and polishing equipment, mainly comprising: a grinding and polishing execution mechanism 200, an interactive control device 300, an upper plate weighing control device 400, an optical scanning data processing module 610, and a main controller 600. All of the above functional components can be mounted on a machine base 100. A polishing basin 110 is provided on the machine base 100. The grinding and polishing execution mechanism 200 presses the optical element 10 to be processed into the polishing basin 110 for processing (grinding, polishing). Taking the installation of the above functional modules on the machine base 100, such that the overall dimensions of this grinding and polishing equipment are 1100x900x900mm (overall structure), the diameter of the polishing basin 110 is 300mm, and the thickness of the polishing basin 110 is 140mm. Therefore, the diameter range of the optical elements that can be processed is 10-200mm; the radius range of the processed spheres is SR10-200mm. Furthermore, the grinding and polishing equipment can be equipped with multiple polishing basins 110 and corresponding multiple grinding and polishing actuators 200, thereby enabling the simultaneous processing of multiple optical elements 10. The grinding and polishing actuators 200 are used to grind or polish the optical elements.

[0060] Please see Figure 1 The interactive control device 300 is used for information input, display, and output. Specifically, the interactive control device 300 can be a touchscreen 310, which integrates a user interface. Operators can input data through the user interface and view the output content on the touchscreen 310. Some functions in the user interface support parameter input settings (such as grinding and polishing pressure, rotation speed, transmission of quality image parameters obtained through an external interferometer, and control commands for converting quality image parameters into identifiable quality parameters), real-time parameter monitoring and display (such as the current grinding and polishing pressure and the execution parameters of the grinding and polishing equipment), an interface for retrieving and saving information, and model output (such as generating a graphic of the optical element to be processed based on the size of the input optical element and displaying it on the interface).

[0061] Please see Figure 1 The upper plate weighing control device 400 is installed on the polishing actuator 200 and is used to monitor the polishing pressure in real time. Specifically, since the polishing actuator 200 is used to process optical components, the upper plate weighing control device 400 can monitor and control the polishing pressure during the processing. The polishing pressure is fed back to the main controller 600 in real time, and the main controller 600 then adjusts the pressure to ensure processing stability.

[0062] Please see Figure 1The polishing and grinding sensor control device 500 is installed on the polishing and grinding actuator 200 and is used to control the polishing and grinding quality parameters of the optical components during the processing. Specifically, the polishing and grinding sensor control device 500 is used in conjunction with the polishing and grinding actuator 200 to quantify the operation of the actuator 200, thus enabling quantitative control of the polishing or grinding process of the optical components. This allows for the processing of different optical components using standard pre-stored processing data. By driving the polishing and grinding actuator 200 based on this pre-stored processing data as a unified processing standard, the actuator 200 will produce a consistent processing effect for different optical components.

[0063] Please see Figure 2 The optical scanning data processing module 610 is used to generate polishing equipment execution parameters based on the surface image data of the acquired optical components. Specifically, each optical component needs to be inspected by a quality inspection device (e.g., an interferometer) after processing. Typically, the interferometer acquires surface image data files (e.g., images) of the optical components, requiring experienced personnel to review these files and determine their suitability. In this embodiment, the optical scanning data processing module 610 uses an AI algorithm to parameterize the acquired surface image data files, generating inspection quality data that the main controller 600 of the polishing equipment can recognize. This data is then compared with the quality standard data stored in the polishing equipment to automatically determine suitability. If unsatisfactory, processing data is automatically generated based on the deviation, and the polishing execution mechanism 200 is then used to continue processing the current optical component until it meets the required standards.

[0064] Please see Figure 1 , Figure 2 The main controller 600 is electrically connected to the interactive control device 300, the upper plate weighing control device 400, the grinding and polishing sensor control device 500, and the optical scanning data processing module 610. It automatically outputs processing data based on the polishing formula, and the output signal is transmitted to the actuator. The actuator, based on the signal from the acquisition module, performs data feedback, storage, backup, and data retrieval during process replication. The interactive control device 300 retrieves the adjusted pre-stored processing data, and the main controller 600 controls the grinding and polishing actuator 200 to process the optical element according to the pre-stored processing data. The adjusted processing data includes the grinding and polishing pressure and the grinding and polishing equipment execution parameters.

[0065] Please see Figure 1 , Figure 2The main controller 600 can employ processors of different specifications. Through software and interactive control device 300, upper platen weighing control device 400, grinding and polishing sensor control device 500, and optical scanning data processing module 610, it controls the entire processing process. This allows for the following: Pre-stored processing data is set. This pre-stored processing data is typically used by experienced operators to debug the first pre-processed blank. By continuously adjusting the grinding and polishing pressure and the execution parameters of the grinding and polishing equipment, the first qualified pre-ordered optical part is obtained. The adjusted grinding and polishing pressure and the execution parameters of the grinding and polishing equipment used to obtain the qualified pre-ordered optical part are then stored as pre-stored processing data. During the production of subsequent optical parts of the same specification, ordinary operators can directly recall the pre-stored processing data through the interactive control device 300. The main controller 600 then controls the grinding and polishing execution mechanism 200 to grind or polish the subsequent optical components based on the pre-stored processing data. For example, the polishing and grinding quality parameters of the optical element during processing are controlled by the polishing and grinding sensing control device 500, ensuring that the polishing and grinding quality parameters of subsequent optical parts are the same as the parameters executed by the polishing and grinding equipment. The polishing and grinding pressure is monitored in real time by the weighing control device, ensuring that the polishing and grinding pressure of subsequent optical parts is the same as the pressure called in. Thus, by using the same pre-stored processing data and the same processing technology during batch production, the consistency of quality in the processing of optical parts is guaranteed. Furthermore, after each optical part is processed, a quality inspection device is used to obtain surface image data of the optical element. This surface image data is converted into quality parameters recognizable by the equipment by the optical scanning data processing module 610. The processor can compare these quality parameters with predetermined quality parameters to determine whether the currently processed optical part meets the quality requirements. If the quality requirements are not met, the pre-stored processing data is automatically adjusted to generate new polishing and grinding equipment execution parameters. These new parameters are then used to control the polishing and grinding execution mechanism 200 to continue processing the current optical part until a finished optical part that meets the quality requirements is obtained.

[0066] This embodiment of a digital optical component polishing equipment integrates an interactive control device 300, an upper platen weighing control device 400, a polishing sensor control device 500, and an optical scanning data processing module 610. It thus features touch display control, upper platen center of gravity weighing feedback and controllable polishing pressure adjustment, controllable acquisition and adjustment of polishing equipment execution parameters, conversion of surface image data of the acquired optical components into quality parameters recognizable by the equipment, automatic determination of deviations based on quality parameters to generate polishing equipment execution parameters for point-to-point fuzzification repair technology, automatic generation of process models, replication of processing processes by calling pre-stored processing data, and process model output control. This achieves a highly reproducible, high-precision, automated processing process, is compatible with micro-components, supports dynamic parameter adjustment and cloud data management, and solves the technical problems of low precision and unstable quality in traditional equipment. Therefore, this grinding and polishing equipment uses the main controller 600 to coordinate the control of multiple control function modules, thereby achieving repeatable high-precision processing and closed-loop quality management of optical parts. This ensures the quality and precision requirements of batch optical parts after repeatable replication processing, thereby improving the processing efficiency of optical components and ensuring processing quality control.

[0067] Please see Figure 1 Furthermore, the polishing actuator 200 of this embodiment specifically includes: a processing press 210, an eccentric adjustment assembly 220, a chisel adjustment part 230, and a stylus adjustment part 240. The processing press 210 is rotatable and has a polishing tool 250 at one end, positioned at the chisel basin 110. When the optical element to be processed is installed in the chisel basin 110, the polishing tool 250 is pressed onto the processing surface of the optical element by the rotation of the processing press 210. The eccentric adjustment assembly 220 is connected to the processing press 210, and the offset position of the processing press 210 is adjusted by the control of the eccentric adjustment assembly 220 to control the processing range of the polishing tool 250. The chisel adjustment part 230 is mounted on the processing pressure frame 210, the iron pen adjustment part 240 is mounted on the chisel adjustment part 230, and the polishing tool 250 is mounted on the iron pen adjustment part 240. The surface accuracy of the polishing tool 250 is controlled by the joint adjustment of the iron pen adjustment part 240 and the chisel adjustment part 230.

[0068] Please see Figure 1 , Figure 2Furthermore, the polishing and grinding sensing control device 500 in this embodiment specifically includes: an eccentric displacement sensor 510, a drill displacement sensor 520, and a stylus displacement sensor 530. The eccentric displacement sensor 510 is mounted on the eccentric adjustment assembly 220 and is used to detect the offset position of the processing pressure frame 210; the drill displacement sensor 520 is mounted on the processing pressure frame 210 and is used to detect the offset position of the drill adjustment part 230; the stylus displacement sensor 530 is mounted on the drill adjustment part 230 and is used to detect the offset position of the stylus adjustment part 240. By detecting the displacement amounts related to processing quality through high-precision displacement sensors, the control of the polishing and grinding actuator 200 is digitally quantified. The polishing and grinding actuator 200 performs the processing technology using a unified control standard. Therefore, the polishing and grinding equipment execution parameters used to control the polishing and grinding actuator 200 in performing the processing technology include: the offset position of the processing pressure frame 210, the offset position of the drill adjustment part 230, and the offset position of the stylus adjustment part 240. Once the execution parameters of the polishing equipment are quantified, operators can directly make visual adjustments via the interactive control device 300. Furthermore, a motion driver is correspondingly installed on the polishing actuator 200. This driver can control the displacement of the eccentric adjustment component 220, the chisel adjustment part 230, and the stylus adjustment part 240, respectively. This enables automatic adjustment of the polishing actuator 200, supporting micro-adjustments and adaptations of optical elements during processing. Moreover, it allows for dynamic adjustment and planning of the polishing equipment's execution parameters based on the surface image data of the detected optical elements.

[0069] Please see Figure 1 , Figure 2 Furthermore, in this embodiment, the upper plate weighing control device 400 specifically includes: a pressure applying component 410 and a pressure sensor 420. The pressure applying component 410 is connected to the processing pressure frame 210 and is used to push the processing pressure frame 210 so that the polishing tool 250 squeezes the optical element. The pressure sensor 420 is disposed on the pressure applying component 410 and is used to detect the processing pressure applied by the pressure applying component 410 to the processing pressure frame 210. The pressure sensor 420 can be a high-precision weighing sensor, which uses PID + fuzzy control to achieve μN-level pressure regulation. Thus, by detecting the working pressure during the processing process, the polishing pressure is digitally quantified. Once the polishing pressure is quantified, the operator can directly make visual adjustments through the interactive control device 300. In addition, by controlling the polishing pressure of the polishing actuator 200 through the pressure applying component 410, the polishing pressure of the polishing actuator 200 can be adjusted, thereby supporting automatic adjustment and adaptation of the processing pressure of the optical element during the processing, realizing dynamic adjustment and planning of the polishing pressure.

[0070] Therefore, based on the control of the grinding and polishing sensing control device 500 and the upper plate weighing control device 400, and with the assistance of other sensors (such as temperature sensors), the equipment can collect data in more than 20 dimensions such as swing amplitude, pressure, temperature, speed, and eccentricity in real time. This enables a more refined quantification of the processing process, resulting in higher precision and better quality optical components during reproducible processing.

[0071] Please see Figure 1 , Figure 2 Furthermore, the interactive control device 300 in this embodiment specifically includes a touch screen 310, which is disposed on one side of the grinding and polishing execution structure. The touch screen 310 and the main controller 600 are located in the housing 320 to form a control host. In addition, the optical scanning data processing module 610 can also be disposed in the housing 320. The entire housing 320 can be disposed above the upper surface of the machine base 100, which facilitates touch operation by the operator, so that processing parameters can be set and equipment status can be monitored through the touch screen. For example, when an operator issues a quality inspection command for a current part via touchscreen, the main controller 600 calls up the surface image data generated by the interferometer on-site measurement and converts it into quality parameters recognizable by the equipment through the optical scanning data processing module 610. The main controller 600 can compare the quality parameters with predetermined quality parameters to determine whether the optical part being processed meets the quality requirements. If it does not meet the quality requirements, the pre-stored processing data is automatically adjusted to generate new grinding and polishing equipment execution parameters. The grinding and polishing execution mechanism 200 is then controlled using these new parameters to continue processing the current optical part until a finished optical part that meets the quality requirements is obtained, thus achieving targeted surface polishing control. For example, when an operator calls up pre-stored processing data via touchscreen 310, the main controller 600 controls the grinding and polishing execution mechanism 200 to grind or polish subsequent optical components based on the pre-stored processing data. By using the same pre-stored processing data and the same processing technology during batch production, the consistency of quality in the processing of optical parts is ensured.

[0072] In addition, this digital optical component polishing equipment also has cloud interconnection capabilities and supports MQTT / OPC UA protocols, which enables cross-equipment synchronization and remote diagnostics of process packages.

[0073] Example 2

[0074] Please see Figure 3 This embodiment proposes a control method for a digital optical component grinding and polishing equipment, applied to the digital optical component grinding and polishing equipment described above. The control method mainly includes the following steps:

[0075] Step S100: Call the adjusted pre-stored processing data through the interactive control device, wherein the pre-stored processing data includes the grinding and polishing pressure and the execution parameters of the grinding and polishing equipment.

[0076] Step S200: Control the upper plate weight control device according to the grinding and polishing pressure to drive the grinding and polishing actuator to apply pressure to the optical element to be processed according to the grinding and polishing pressure.

[0077] Step S300: Control the grinding and polishing actuator to process the optical element to be processed according to the grinding and polishing equipment execution parameters, so as to obtain an optical part of a predetermined quality.

[0078] In the specific steps, the polishing equipment executes parameters to control the polishing mechanism to process the optical element to be processed, thereby obtaining a pre-processed optical part. The quality of the pre-processed optical part is then inspected using an interferometer to obtain measurement parameters. Based on these measurement parameters, the polishing pressure and the polishing equipment's execution parameters are adjusted. The specific adjustment process is similar to the operation of the optical scanning data processing module described above. Once the polishing pressure and the polishing equipment's execution parameters are adjusted, the pre-processed optical part is further processed according to the adjusted parameters to obtain an optical part of the predetermined quality. This constitutes a closed-loop management of quality feedback control in the processing technology.

[0079] In the above scheme, the operator calls up the pre-stored processing data through the touch screen. The main controller of the equipment controls the grinding and polishing actuator to grind or polish the subsequent optical components according to the pre-stored processing data. In this way, by calling up the same pre-stored processing data and using the same processing technology during the mass production of optical parts, the quality consistency of optical parts processing is guaranteed.

[0080] Please see Figure 4 In this embodiment, the pre-stored processing data is set before the current processing. Therefore, the process of obtaining the pre-stored processing data before step S100 mainly includes steps S10-S12, as follows:

[0081] Step S10: First, process the predetermined blank and adjust the grinding and polishing pressure and the grinding and polishing equipment parameters to obtain the predetermined optical parts that meet the quality requirements.

[0082] Please see Figure 4 , Figure 5 The detailed steps of step S10 include steps S11-S14. Specifically, they are as follows:

[0083] Step S11: Obtain the blank size of the predetermined blank and the final size of the predetermined optical part that need to be obtained by inputting through the interactive control device, and formulate a processing strategy based on the blank size and the final size.

[0084] In the specific process, the total material removal amount is obtained based on the relationship between the material removal rate and process parameters during polishing; then the influencing factors of the process parameters are determined and the process parameters are calibrated; the total material removal amount is dynamically adjusted based on the calibrated process parameters; and the processing strategy is determined based on the dynamically adjusted total material removal amount.

[0085] The specific process for obtaining the total material removal amount, based on the relationship between the material removal rate and process parameters during polishing, is as follows:

[0086] The polishing equation relating the Material Removal Rate (MRR) to the process parameters during polishing is as follows:

[0087] MRR = K·P·V;

[0088] Where: MRR: Material removal rate (unit: μm / min or nm / s); K: Preston coefficient (an empirical constant related to polishing fluid, abrasive, workpiece material, etc., unit: μm / (MPa·m / s) or similar); P: Average pressure in the polishing zone (unit: MPa or Pa); V: Relative sliding velocity between the workpiece and the polishing tool (unit: m / s).

[0089] Based on the above relationship, the total material removal amount is calculated as follows: Δh = Total material removal amount within polishing time t:

[0090] Δh=∫0t K·P(t)·V(t)dt;

[0091] In practical applications, if P and V remain constant, the formula simplifies to:

[0092] Δh=K·P·V·t.

[0093] The specific process for determining the influencing factors of process parameters and calibrating the process parameters is as follows:

[0094] The key parameters can be derived from the polishing equations above, and their impact on the total material removal in the processing can be determined. For example, pressure (P): excessive pressure may cause surface damage and needs to be optimized in conjunction with material hardness; speed (V): high speed can improve efficiency, but may introduce vibration or temperature changes; polishing coefficient (K): determined experimentally, it is affected by polishing fluid (such as CeO2, SiO2 abrasive), polishing pad material, and workpiece material (glass, crystal, etc.).

[0095] The polishing equation is an idealized model; actual polishing requires consideration of several factors: the impact of polishing slurry distribution, abrasive concentration, and flowability on material removal uniformity; temperature effects, as frictional heat can alter the material removal mechanism; surface chemistry, as polishing of certain materials (such as fused silica) involves chemical mechanical polishing (CMP); and tool wear, as the wear of polishing pads or abrasives necessitates dynamic parameter adjustments. Therefore, process parameters need to be calibrated and corrected for practical applications.

[0096] The steps for calibrating process parameters in practical applications are as follows: Experimental calibration, determining the K value through small-scale experiments; Process design, calculating the required P, V, and t based on the target removal amount Δh; Uniformity optimization, adjusting the tool path or pressure distribution (e.g., residence time method). The quantification standards for process parameters are shown in the table below:

[0097]

[0098] The above polishing equation is a simplified model. The following factors may lead to deviations: nonlinear effects (the removal rate may deviate from linearity when pressure or speed is extremely high); chemical dominance (such as the synergistic effect of chemical corrosion and mechanical wear in the polishing of optical components); temperature effects (frictional heat alters material hardness or polishing fluid viscosity); and polishing pad wear (changes in contact conditions during dynamic processes). Based on these factors causing deviations, the polishing equation needs to be modified and extended. For example, considering the non-uniformity of the contact area, the modified polishing equation is:

[0099] MRR = K·P / A·V; where A is the actual contact area.

[0100] Taking into account the introduction of a chemical interaction term, the modified polishing equation is:

[0101] MRR=K·P·V+C·exp(-Ea / RT); where C is the chemical activity coefficient, Ea is the activation energy, R is the gas constant, and T is the temperature.

[0102] Taking into account the above-mentioned influencing factors, the specific steps of the experimental calibration method, taking glass polishing as an example, are as follows:

[0103] Fixed parameters: Select constant pressure (e.g., 20 kPa) and speed (1 m / s).

[0104] Measurement of removal amount: After polishing for a certain period of time, the thickness change Δh is measured using a profilometer or interferometer.

[0105] Calculate the value of K: K = Δh / (P·V·t).

[0106] Repeated verification: Test the stability of the K value under different combinations of P and V.

[0107] Once the K-value is determined through calibration, the total material removal amount is dynamically adjusted using the calibrated process parameters. Specifically, the operator inputs the corresponding quantitative values ​​based on influencing factors, allowing the equipment to automatically determine the K-value under the current processing environment. This determined K-value is then substituted into the polishing equation, resulting in a more reasonable total material removal amount adjusted for the current processing environment.

[0108] The processing strategy is determined based on the dynamically adjusted total material removal amount. This results in a more rational processing strategy and higher quality finished products.

[0109] Specific application examples are as follows:

[0110] Task requirements: Polish a fused silica lens, with a target removal amount Δh = 2 μm. Given: K = 0.05 μm / (MPa·m / s), P = 30 kPa, V = 0.8 m / s.

[0111] Calculate polishing time: t=Δh / (K·P·V)=2 / (0.05×0.03(MPa)×0.8)≈1667s(≈28 minutes).

[0112] Step S12: According to the processing strategy, control the upper plate weight control device to apply the first grinding and polishing pressure, and control the grinding and polishing execution mechanism to process the predetermined blank to be processed according to the execution parameters of the first grinding and polishing equipment, so as to obtain the first optical part.

[0113] After automatic control processing based on the automatically generated processing strategy, the first optical component may have local quality deviations. Therefore, it is necessary to conduct inspection and adjust the processing strategy based on the inspection results.

[0114] Step S13: Obtain the measurement parameters of the first optical component after it has been inspected, and adjust the first polishing pressure and the execution parameters of the first polishing equipment based on the measurement parameters.

[0115] In the specific process, surface image data files are collected by using an interferometer to inspect the first optical component. The surface image data files are then converted into processing data using an AI conversion algorithm, and this processing data can drive the grinding and polishing actuator to perform its work.

[0116] Step S14: Based on the adjusted first polishing pressure and the first polishing equipment execution parameters, the first optical component is modified to obtain a predetermined optical component that meets the quality requirements. The adjusted first polishing pressure and the first polishing equipment execution parameters are the adjusted polishing pressure and polishing equipment execution parameters.

[0117] Step S20: Store the adjusted grinding and polishing pressure and the grinding and polishing equipment execution parameters as pre-stored processing data, wherein the pre-stored processing data corresponds to the specifications of the predetermined optical parts.

[0118] In summary, the digital optical component polishing equipment and control method provided in this application integrates an interactive control device, an upper plate weighing control device, a polishing sensor control device, and an optical scanning data processing module. This enables multi-module collaborative operation for high-precision processing and closed-loop quality management of optical components. It features touch display control, upper plate center of gravity feedback and controllable adjustment of polishing pressure, controllable acquisition and adjustment of polishing equipment execution parameters, conversion of surface image data of the acquired optical components into quality parameters recognizable by the equipment, automatic determination of deviations based on quality parameters to generate polishing equipment execution parameters for point-to-point fuzzification repair technology, automatic generation of process models, replication of processing processes by calling pre-stored processing data, and process model output control. This achieves a highly reproducible, high-precision, automated processing process, is compatible with micro-components, supports dynamic parameter adjustment and cloud data management, and solves the technical problems of low precision and unstable quality in traditional equipment.

[0119] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A control method for a digital optical element grinding and polishing equipment, characterized in that, The control method, applied to digital optical component polishing equipment, includes the following steps: The pre-stored processing data, which includes grinding and polishing pressure and grinding and polishing equipment execution parameters, is retrieved through an interactive control device. The upper plate weight control device is controlled according to the grinding and polishing pressure to drive the grinding and polishing actuator to apply pressure to the optical element to be processed according to the grinding and polishing pressure; The grinding and polishing actuator is controlled according to the parameters of the grinding and polishing equipment to process the optical element to be processed, so as to obtain an optical part of a predetermined quality; Before the step of recalling the adjusted pre-stored processing data through the interactive control device, the following is also included: The predetermined blank is pre-processed, and the grinding and polishing pressure and the execution parameters of the grinding and polishing equipment are adjusted to obtain the predetermined optical parts that meet the quality requirements. The adjusted grinding and polishing pressure and the grinding and polishing equipment execution parameters are stored as pre-stored processing data, wherein the pre-stored processing data corresponds to the specifications of the predetermined optical part; In the steps of pre-processing a predetermined blank and adjusting the grinding and polishing pressure and the parameters of the grinding and polishing equipment to obtain a predetermined optical part that meets the quality requirements: The blank size of the predetermined blank and the final size of the predetermined optical part, which are input through the interactive control device, are obtained, and a processing strategy is formulated based on the blank size and the final size. According to the processing strategy, the upper plate weighing control device is controlled to apply the first grinding and polishing pressure, and the grinding and polishing execution mechanism is controlled to process the predetermined blank to be processed according to the first grinding and polishing equipment execution parameters, so as to obtain the first optical part; The measurement parameters of the first optical component after it has been inspected are obtained, and the first polishing pressure and the execution parameters of the first polishing equipment are adjusted based on the measurement parameters. The first optical component is modified based on the adjusted first polishing pressure and the first polishing equipment execution parameters to obtain a predetermined optical component that meets the quality requirements. The adjusted first polishing pressure and the first polishing equipment execution parameters are referred to as the adjusted polishing pressure and polishing equipment execution parameters.

2. The control method for the digital optical element polishing equipment as described in claim 1, characterized in that, The step of formulating a processing strategy based on the blank size and the final size includes: The total material removal amount is obtained based on the relationship between the material removal rate and process parameters during polishing. Identify the influencing factors of process parameters and calibrate the process parameters; The total material removal amount is dynamically adjusted using the calibrated process parameters; The processing strategy is determined based on the dynamically adjusted total material removal amount.

3. The control method for the digital optical element polishing equipment as described in claim 1, characterized in that, The step of obtaining measurement parameters after the first optical component is inspected, and adjusting the first polishing pressure and the execution parameters of the first polishing equipment based on the measurement parameters, includes: Collect surface image data files of the first optical component using an interferometer; The surface image data file is converted into processing data using an AI conversion algorithm, and the processing data can drive the grinding and polishing actuator to work.

4. The control method for the digital optical element polishing equipment as described in claim 1, characterized in that, The digital optical element grinding and polishing equipment includes a grinding and polishing execution mechanism, which is used to grind or polish optical elements; An interactive control device, which is used for information input, display and output; The upper plate weight control device is installed on the grinding and polishing actuator and is used to monitor the grinding and polishing pressure in real time. A polishing and grinding sensing and control device is mounted on the polishing and grinding execution mechanism and is used to control the polishing and grinding quality parameters of the optical element during the processing. An optical scanning data processing module is used to generate grinding and polishing equipment execution parameters based on the surface image data of the acquired optical elements. The main controller is electrically connected to the interactive control device, the upper plate weighing control device, the grinding and polishing sensor control device, and the optical scanning data processing module. The main controller calls the adjusted pre-stored processing data through the interactive control device, and controls the grinding and polishing execution mechanism to process the optical element according to the pre-stored processing data. The adjusted processing data includes grinding and polishing pressure and grinding and polishing equipment execution parameters.

5. The control method for the digital optical element polishing equipment as described in claim 4, characterized in that, The polishing actuator includes: a processing press frame, which is rotatable and has a polishing tool at one end. The polishing tool is pressed onto the processing surface of the optical element by the rotation of the processing press frame. An eccentric adjustment assembly is connected to the processing press, and the offset position of the processing press is adjusted by the control of the eccentric adjustment assembly to control the processing range of the polishing tool; The tool includes a chisel adjustment section and an iron pen adjustment section. The chisel adjustment section is mounted on the processing pressure frame, and the iron pen adjustment section is mounted on the chisel adjustment section. The grinding and polishing tool is mounted on the iron pen adjustment section. The surface accuracy of the grinding and polishing tool is controlled by adjusting the iron pen adjustment section and the chisel adjustment section together.

6. The control method for the digital optical element grinding and polishing equipment as described in claim 5, characterized in that, The grinding and polishing sensing and control device includes: an eccentric displacement sensor, which is disposed on the eccentric adjustment assembly and is used to detect the offset position of the processing press. A drill bit displacement sensor is mounted on the processing press and is used to detect the offset position of the drill bit adjustment part; A stylus displacement sensor is disposed on the stylus adjustment part and is used to detect the offset position of the stylus adjustment part.

7. The control method for the digital optical element grinding and polishing equipment as described in claim 5, characterized in that, The upper plate weighing control device includes: a pressure applying element, which is connected to the processing pressure frame and is used to push the processing pressure frame so that the grinding and polishing tool squeezes the optical element; A pressure sensor is disposed on the pressure-applying component and is used to detect the processing pressure applied by the pressure-applying component to the processing pressure frame.

8. The control method for the digital optical element polishing equipment as described in claim 5, characterized in that, The interactive control device includes a touch screen, which is disposed on one side of the polishing execution structure; The touch screen and the main controller are located in the enclosure to form the control host.

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