MLED transfer equipment and method
By using a transfer medium with a critical abnormal temperature in the MLED transfer equipment, combined with heating and cooling devices, the problem of limited chip quantity and efficiency caused by the stability fluctuation of the adhesive material was solved, and stable batch transfer and efficient transfer of MLED devices were achieved.
Patent Information
- Application Number
- CN202410431545.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2025-10-21
AI Technical Summary
In existing MLED transfer technologies, the stability of the adhesive material fluctuates significantly, which limits the number of chips and transfer efficiency, making it difficult to achieve stable batch transfer.
An MLED transfer device is employed, comprising a transfer body and a transfer head. The internal fluid chamber contains a transfer medium with a critical abnormal temperature. The medium is introduced into the transfer head through a pipe to realize the pickup and transfer of MLED devices and the transition between liquid and solid states. The state of the medium is controlled by heating and cooling devices, resulting in better stability and easy replenishment.
This technology enables stable, high-volume pickup and transfer of MLED devices, improves transfer efficiency, and simplifies the media replenishment process.
Smart Images
Figure CN120824243A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of mass transfer technology, and in particular to an MLED transfer device and method. Background Art
[0002] MLED (Micro-LED (Micro Light-Emitting Diode, micro light-emitting diode) and Mini-LED (Mini Light-Emitting Diode, sub-micrometer light-emitting diode)) is an emerging display technology. Compared with conventional display technology, displays based on MLED technology have the characteristics of fast response speed, autonomous illumination, high contrast, long service life, and high photoelectric efficiency.
[0003] Mass transfer is a key technology in MLED technology. High-precision equipment is used to transfer large numbers of Micro-LED chips onto driver backplanes. Among the many mass transfer techniques, Pickup & Place (P&P) is currently the most mature. However, this technology often relies on adhesives for bonding, which can have significant stability fluctuations, limiting the number of chips that can be transferred and the efficiency of the transfer.
[0004] Therefore, how to achieve stable batch transfer of MLED is an urgent problem that needs to be solved. Summary of the Invention
[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide an MLED device and method, aiming to solve the problem of how to achieve stable batch transfer of MLEDs, which is currently in urgent need of solution.
[0006] An MLED transfer device includes a transfer body and a plurality of transfer heads;
[0007] The transfer body has a fluid chamber inside, and the fluid chamber contains a transfer medium, and the transfer medium is introduced into the corresponding transfer head through a plurality of pipes;
[0008] The transfer head is configured to pick up and transfer the MLED device; and
[0009] The transfer medium has a critical transformation temperature, which enables it to transform between liquid and solid.
[0010] The above-mentioned MLED transfer equipment is provided with a fluid chamber in the transfer body, in which a transfer medium is placed, and the transfer medium has a critical transformation temperature. At the same time, the transfer medium is introduced into the transfer head through a pipeline. Therefore, the transfer head can realize the large-scale picking and transfer of MLED devices by virtue of the characteristics of the transfer medium. Moreover, since it is only necessary to apply the critical transformation temperature to the transfer medium to realize its transition between liquid and solid, the stability is relatively better and the replenishment of the transfer medium is relatively easier.
[0011] In one embodiment, the transfer medium comprises any one of water, ethylene glycol, or glycerol.
[0012] In one embodiment, the planar shape of the portion of the transfer head in contact with the MLED device includes a regular planar pattern and / or an irregular planar pattern.
[0013] In one embodiment, the regular plane shape includes any one of a rectangle, a triangle, a circle, a single point, an ellipse or a ring.
[0014] In one embodiment, it further includes:
[0015] A heating device is provided on the side of the fluid chamber away from the transfer head; or
[0016] The heating device is arranged adjacent to the transfer head; or,
[0017] The heating device is arranged on the pipeline;
[0018] The heating device is configured to heat the transfer medium.
[0019] In one embodiment, the temperature required to heat the transfer medium is between 0°C and 70°C.
[0020] In one embodiment, it further includes:
[0021] a cooling device, disposed on a side of the fluid chamber away from the transfer head; or
[0022] The cooling device is arranged adjacent to the transfer head; or,
[0023] The cooling device is arranged on the pipeline;
[0024] The cooling device is configured to cool the transfer medium.
[0025] In one embodiment, the temperature required to cool the transfer medium is between -30°C and 0°C.
[0026] In one embodiment, the MLED device includes a Mini LED device or a Micro LED device.
[0027] Based on the same inventive concept, the present application further provides an MLED transfer method, based on the MLED transfer device described in any of the aforementioned embodiments, the method comprising:
[0028] Aligning and contacting a transfer head of the MLED transfer device with the MLED device stored on the temporary substrate;
[0029] controlling the transfer medium to reach the transfer head through the pipeline so that the transfer medium contacts the surface of the MLED device;
[0030] cooling the transfer medium to enhance the connection between the transfer head and the MLED device;
[0031] transferring the MLED transfer device carrying the MLED device to a display backplane; and
[0032] The transfer medium is heated to release the connection between the transfer head and the MLED device. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 Schematic diagram of the structure of an MLED transfer device in one embodiment;
[0034] Figure 2 is a structural schematic diagram of an MLED transfer device in another embodiment;
[0035] Figure 3 for Figure 1 A schematic plan view of the transfer head;
[0036] Figure 4 FIG. 1 is a flow chart of an MLED transfer method in one embodiment;
[0037] Figure 5a-5d For Figure 4 Schematic diagram of structural changes corresponding to the method flow;
[0038] Figure 6a-6b Schematic diagram of the structure of MLED transfer equipment in other embodiments.
[0039] Description of reference numerals:
[0040] 110 - transfer body; 112 - fluid chamber; 114 - pipeline; 116 - transfer head; 210 - heating device; 310 - cooling device; 40 - MLED device; TL - transfer medium; ST - temporary substrate; PD - pad; BG - display backplane. DETAILED DESCRIPTION
[0041] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.
[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0043] It should be understood that spatial relational terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatial relational terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, the element or feature described as "under" or "beneath" or "beneath" the other elements will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.
[0044] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and / or "including" are used in this specification, they may specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.
[0045] As used herein, a "deposition" process includes, but is not limited to, physical vapor deposition (PVD), chemical vapor deposition (CVD), or atomic layer deposition (ALD).
[0046] Embodiments of the invention are described herein with reference to cross-sectional views which are schematic illustrations of idealized embodiments (and intermediate structures) of the invention, such that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are anticipated. Accordingly, embodiments of the invention should not be limited to the specific shapes of the regions shown herein, but rather include deviations in shapes due to, for example, manufacturing techniques. For example, an implanted region shown as a rectangle typically has rounded or curved features and / or an implant concentration gradient at its edges rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation occurs. Accordingly, the regions shown in the figures are schematic in nature, their shapes do not represent the actual shape of the region of the device, and do not limit the scope of the invention.
[0047] As described in the background technology of this application, MLED (Micro-LED (Micro Light-Emitting Diode, micro light-emitting diode) and Mini-LED (Mini Light-Emitting Diode, sub-micrometer light-emitting diode)) is an emerging display technology. Compared with conventional display technology, displays based on MLED technology have the characteristics of fast response speed, autonomous luminescence, high contrast, long service life, and high photoelectric efficiency.
[0048] Mass transfer is a key technology in MLED technology. High-precision equipment is used to transfer large numbers of Micro-LED chips onto driver backplanes. Among the many mass transfer techniques, Pickup & Place (P&P) is currently the most mature. However, this technology often relies on adhesives for bonding, which can have significant stability fluctuations, limiting the number of chips that can be transferred and the efficiency of the transfer.
[0049] Therefore, how to achieve stable batch transfer of MLED is an urgent problem that needs to be solved.
[0050] Based on this, the present application hopes to provide a solution that can solve the above technical problems, the details of which will be explained in the subsequent embodiments.
[0051] Also see Figure 1 and Figure 2, is a structural schematic diagram of an MLED transfer device provided in the present application, the MLED transfer device may include a transfer body 110 and a plurality of transfer heads 116; a fluid chamber 112 is opened inside the transfer body 110, and a transfer medium TL is accommodated in the fluid chamber 112. The fluid chamber 112 is connected to an external fluid storage tank, and the transfer medium TL is introduced into the corresponding transfer head 116 through a plurality of pipes 114; the transfer head 116 is configured to pick up and transfer the MLED device 40; and the transfer medium TL has a critical transformation temperature, so that it can be transformed between liquid and solid.
[0052] The above-mentioned MLED transfer equipment is provided with a fluid chamber in the transfer body, in which a transfer medium is placed, and the transfer medium has a critical transformation temperature. At the same time, the transfer medium is introduced into the transfer head through a pipeline. Therefore, the transfer head can realize the large-scale picking and transfer of MLED devices by virtue of the characteristics of the transfer medium. Moreover, since it is only necessary to apply the critical transformation temperature to the transfer medium to realize its transition between liquid and solid, the stability is relatively better and the replenishment of the transfer medium is relatively easier.
[0053] In one embodiment, the transfer medium TL may include any one of water, ethylene glycol, or glycerol. Specifically, in addition to the liquids exemplified above, the transfer medium TL may also be some liquids with relatively high freezing points.
[0054] Further, please refer to Figure 3 、 Figure 6a and Figure 6b The planar shape of the portion of the transfer head 116 in contact with the MLED device 40 includes a regular planar shape and / or an irregular planar shape. The regular planar shape includes any one of a rectangle (116a), a triangle, a circle, a single point, an ellipse (116b), or a ring. It is understood that in other embodiments, the regular planar shape may also be other known shapes, and those skilled in the art may select and adjust them according to actual circumstances. This application will not further elaborate on this.
[0055] In one embodiment, you can continue to refer to Figure 1 and Figure 2 The MLED transfer device of the present application may further include a heating device 210, which is disposed on the side of the fluid chamber 112 away from the transfer head 116; or, the heating device 210 is disposed adjacent to the transfer head 116; or, the heating device 210 is disposed on the pipe 114; the heating device 210 is configured to heat the transfer medium TL. In this specific embodiment, Figure 1 and Figure 2The heating devices 210 are all arranged on the side of the fluid chamber 112 away from the transfer head 116. It can be understood that while maintaining the specific setting positions of the existing fluid chamber 112, pipeline 114, and transfer head 116, the specific setting position of the heating device 210 can also be set near the pipeline 114, or near the transfer head 116. In this way, heat loss can be reduced and rapid heating can be achieved.
[0056] Furthermore, the temperature required for heating the transfer medium TL is between 0°C and 70°C. For example, the temperature required for heating the transfer medium TL may be between 0°C and 10°C; or between 10°C and 20°C; or between 20°C and 30°C; or between 30°C and 40°C; or between 40°C and 50°C; or between 50°C and 60°C; or between 60°C and 70°C. The specific temperature can be selected and adjusted depending on the specific choice of transfer medium TL and the specific circumstances faced by those skilled in the art, and this application does not impose any further limitations thereon.
[0057] In one embodiment, you can continue to refer to Figure 1 and Figure 2 The MLED transfer device may further include a cooling device 310, which is disposed on the side of the fluid chamber 112 away from the transfer head 116; or, the cooling device 310 is disposed adjacent to the transfer head 116; or, the cooling device 310 is disposed on the pipe 114; the cooling device 310 is configured to cool the transfer medium TL. In this specific embodiment, Figure 1 and Figure 2 The cooling devices 310 are all arranged on the side of the fluid chamber 112 away from the transfer head 116. It can be understood that while maintaining the specific setting positions of the existing fluid chamber 112, pipeline 114, and transfer head 116, the specific setting position of the cooling device 310 can also be set near the pipeline 114, or near the transfer head 116. In this way, the loss of cooling capacity can be reduced and rapid cooling can be achieved.
[0058] In one embodiment, the temperature required for cooling the transfer medium TL is between -30°C and 0°C. For example, the temperature required for cooling the transfer medium TL may be between -30°C and -25°C; alternatively, the temperature required for cooling the transfer medium TL may be between -25°C and -20°C; alternatively, the temperature required for cooling the transfer medium TL may be between -20°C and -15°C; alternatively, the temperature required for cooling the transfer medium TL may be between -15°C and -10°C; alternatively, the temperature required for cooling the transfer medium TL may be between -10°C and -5°C; alternatively, the temperature required for cooling the transfer medium TL may be between -5°C and 0°C. The specific selection and adjustment may depend on the choice of transfer medium TL and the specific circumstances faced by those skilled in the art, and this application does not impose any further limitations thereon.
[0059] Based on the above description of the cooling temperature and the heating temperature, the critical transformation temperature described in the above embodiment can be dynamically selected between 0°C and 70°C and -30°C to 0°C. That is, when the transfer medium TL needs to change from liquid to solid, the value of the critical transformation temperature is between -30°C and 0°C; when the transfer medium TL needs to change from solid to liquid, the value of the critical transformation temperature is between 0°C and 70°C. The specific selection and adjustment shall be made by those skilled in the art according to actual conditions, and this application does not elaborate on or limit this.
[0060] In this embodiment, the MLED device 40 may include a Mini LED device or a Micro LED device, wherein a Mini LED device is an LED device with a size between 50 μm and 200 μm, and a Micro LED device is an LED device with a size less than 50 μm.
[0061] Based on the same inventive concept, you can refer to Figure 4 、 Figure 5a-5d The present application also provides an MLED transfer method, based on the MLED transfer device described in any of the aforementioned embodiments, the method may include steps S100-S500:
[0062] Step S100 , aligning and contacting a transfer head of the MLED transfer device with the MLED device stored on a temporary substrate;
[0063] Step S200 , controlling a transfer medium to reach a transfer head through a pipeline so that the transfer medium contacts a surface of the MLED device;
[0064] Step S300, cooling the transfer medium to enhance the connection between the transfer head and the MLED device;
[0065] Step S400, transferring the MLED transfer device carrying the MLED device to a display backplane; and
[0066] Step S500 : heating the transfer medium to release the connection between the transfer head and the MLED device.
[0067] In this specific embodiment, the temporary substrate ST can be a transparent substrate, and the material of the transparent substrate includes an inorganic material or a III-V semiconductor material. Inorganic materials include silicon carbide (SiC), germanium (Ge), sapphire (Sapphire), lithium aluminate (LiAlO2), zinc oxide (ZnO), glass or quartz. III-V semiconductor materials include indium phosphide (InP), gallium phosphide (GaP), gallium nitride (GaN), and aluminum nitride (AlN). An adhesive is provided on the temporary substrate ST for temporarily bonding the MLED device 40 so that the electrode surface of the MLED device 40 faces downward.
[0068] Specifically, before transferring the MLED device 40, the MLED transfer device may be moved to the top of the temporary substrate ST on which the MLED device 40 is stored. Figures 5a-5d As shown, the transfer heads 116 can be arranged at intervals to achieve selective transfer of the MLED device. After being transferred to the top of the MLED device, the transfer medium TL (water, for example) can be controlled to open and contact the MLED device 40. At this time, the cooling device 310 is controlled to operate to cool the transfer medium TL, causing it to freeze into a solid (similar to ice). The frozen solid strengthens the connection between the transfer head 116 and the MLED device 40. The freezing process temperature can be between 0°C and -30°C, and this process will not affect the MLED device 40. This step realizes the removal of the MLED device 40 from the temporary substrate ST.
[0069] The MLED transfer device that picks up the MLED device 40 is aligned with the display backplane BG. Specifically, it is necessary to control the electrodes of the MLED device 40 to be aligned successfully with the pads PD on the display backplane BG. After completion, the heating device 210 is controlled to work and heat the transfer medium TL. At this time, the cooling device 310 does not work. The aforementioned cooled solid becomes liquid after heating. The heating process can be between 0°C and 70°C. The temperature in this range will not affect the MLED device 40. The connection between the transfer head 116 and the MLED device 40 changes from solid to liquid, and the connection strength disappears. At this time, the transfer of the MLED device 40 to the display backplane BG is completed. Furthermore, when the transfer medium TL is heated and becomes liquid, the heated transfer medium TL can be recovered from the pipeline 114 in the form of a vacuum pump, so that it can be reused and reduce costs. Finally, the MLED transfer device that has completed this transfer is controlled to be lifted up and continue to the next transfer step.
[0070] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.
Claims
1. An MLED transfer device, characterized in that: It includes a transfer body and a plurality of transfer heads; The transfer body has a fluid chamber inside, and the fluid chamber contains a transfer medium, and the transfer medium is introduced into the corresponding transfer head through a plurality of pipes; The transfer head is configured to pick up and transfer the MLED device; and The transfer medium has a critical transformation temperature, which enables it to transform between liquid and solid.
2. The MLED transfer device according to claim 1, wherein: The transfer medium includes any one of water, ethylene glycol or glycerol.
3. The MLED transfer device according to claim 1, wherein: The planar shape of the portion where the transfer head contacts the MLED device includes a regular planar pattern and / or an irregular planar pattern.
4. The MLED transfer device according to claim 3, wherein: The regular plane shape includes any one of a rectangle, a triangle, a circle, a single point, an ellipse or a ring.
5. The MLED transfer device according to claim 1, wherein: Also includes: A heating device is provided on the side of the fluid chamber away from the transfer head; or The heating device is arranged adjacent to the transfer head; or, The heating device is arranged on the pipeline; The heating device is configured to heat the transfer medium.
6. The MLED transfer device according to claim 5, wherein: The temperature required to heat the transfer medium is between 0°C and 70°C.
7. The MLED transfer device according to claim 1, wherein: Also includes: a cooling device, disposed on a side of the fluid chamber away from the transfer head; or The cooling device is arranged adjacent to the transfer head; or, The cooling device is arranged on the pipeline; The cooling device is configured to cool the transfer medium.
8. The MLED transfer device according to claim 7, wherein: The temperature required to cool the transfer medium is between -30°C and 0°C.
9. The MLED transfer device according to any one of claims 1 to 8, wherein: The MLED device includes a MiniLED device or a Micro LED device.
10. A MLED transfer method, characterized in that: Based on the MLED transfer device according to any one of claims 1 to 9, the method comprises: Aligning a transfer head of the MLED transfer device with the MLED device stored on the temporary substrate; controlling the transfer medium to reach the transfer head through the pipeline so that the transfer medium contacts the surface of the MLED device; cooling the transfer medium to enhance the connection between the transfer head and the MLED device; transferring the MLED transfer device carrying the MLED device to a display backplane; and The transfer medium is heated to release the connection between the transfer head and the MLED device.