Lift pin assembly and substrate processing apparatus
By using guide pins and tilting structures, the problem of misalignment between the lifting pin and the pin hole is solved, achieving accurate alignment and stable lifting of the lifting pin, reducing damage, and improving the reliability of the substrate processing device.
Patent Information
- Application Number
- CN202510449682.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-04-12
- Filing Date
- 2025-04-10
- Publication Date
- 2025-10-21
AI Technical Summary
In the prior art, misalignment between the lifting pin and the pin hole causes damage or breakage of the lifting pin, and it is difficult to restore it to the correct position.
The system employs a guide pin and inclined section structure. The guide pin elastically extends and retracts below the base or lower nozzle, while the inclined section slides in the lifting pin groove to ensure accurate alignment between the lifting pin and the pin hole.
It effectively prevents interference between the lifting pin and the pin hole, reduces damage, ensures accurate alignment and stable lifting of the lifting pin, reduces dead zones, and improves the reliability of the substrate processing device.
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Figure CN120824249A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a lifting pin assembly and a substrate processing device, and more particularly to a lifting pin assembly and a substrate processing device that can reduce the damage or breakage caused by the lifting pins that lift the substrate and interfere with the inner wall of the pin hole of the base or the lower nozzle. Background Art
[0002] Typically, a substrate processing apparatus places a substrate on a susceptor located inside a chamber for processing, or places the substrate above a lower showerhead for processing below the substrate. In this case, lift pins can be provided that extend through the susceptor or showerhead for elevation, with the substrate placed on top of the pins.
[0003] Figure 6 In the device according to the prior art, a lift pin hole 32 is formed through a base 30 , and a lift pin 10 is disposed through the lift pin hole 32 .
[0004] like Figure 6 As shown in FIG. 1A , a weight member 12 supporting the lift pin 10 can be disposed below the lift pin 10 . The weight member 12 can be placed on the lift pin base 20 so that the center of gravity of the lift pin 10 is located below the lift pin 10 .
[0005] In this case, the lower surface of the weight member 12 and the upper surface of the base 20 may be in contact with each other through horizontal surfaces, and the position of the weight member 12 may be fixed by friction.
[0006] Therefore, if Figure 6 As shown in FIG. 1A , when the lift pin 10 and the lift pin hole 32 are arranged on concentric circles and accurately aligned, there is no concern about damage or breakage caused by raising and lowering the lift pin 10 .
[0007] However, if Figure 6 As shown in FIG. 1B , if the lift pin 10 ′ and the lift pin hole 32 are misaligned, the lift pin 10 ′ may be damaged or broken due to interference with the lift pin 10 ′ and the inner wall of the lift pin hole 32 when the lift pin 10 ′ is lifted or lowered.
[0008] In particular, in the conventional device, the lower surface of the weight component 12' and the upper surface of the base 20 are in horizontal contact, resulting in a large friction force. Therefore, when the weight component 12' is misaligned from the correct position, it is difficult to restore the weight component 12' to the correct position. Summary of the Invention
[0009] In order to solve the above problems, the present invention aims to provide a lift pin assembly and a substrate processing device that can accurately align lift pins and pin holes when configuring lift pins.
[0010] It can be that the purpose of the present invention is achieved through a lifting pin assembly as described above, which is characterized in that it comprises: a lifting pin, which is configured to have a through pin hole, and the pin hole is formed on the base or the lower nozzle; and a lifting pin base, which moves relative to the base or the lower nozzle in the vertical direction to lift the lifting pin, and a weight part is provided at the lower end of the lifting pin, and a lifting pin groove into which the weight part is inserted is formed in the lifting pin base.
[0011] In this case, the weight portion may include a protruding portion protruding downward, and the lift pin groove may include an inclined portion on which the protruding portion is seated and slides.
[0012] Furthermore, the inclination angle of the inclined portion relative to the upper surface of the lift pin base may be smaller than the inclination angle of the protruding portion relative to the upper surface of the lift pin base.
[0013] Furthermore, the lift pin assembly may include a guide pin provided on the bottom of the base or the lower nozzle and protruding downward, and a guide groove provided on the lift pin base and into which the guide pin is inserted.
[0014] In this case, the guide pin may be composed of a plurality of guide pins, and may be arranged to surround the lift pin.
[0015] In addition, the guide pin may be configured to be elastically extendable and retractable below the base or the lower nozzle.
[0016] On the other hand, the purpose of the present invention may be achieved by a substrate processing device as described above, which is characterized in that it comprises: a cavity, which provides a processing space for the substrate; a base or a lower nozzle, which is arranged at the lower part of the processing space of the cavity and is formed with a pin hole; and a lifting pin assembly, which passes through the pin hole to support the substrate, and the lifting pin assembly comprises: a lifting pin, which is arranged to pass through the pin hole; and a lifting pin base, which moves relative to the base or the lower nozzle in a vertical direction to lift the lifting pin, a weight part is provided at the lower end of the lifting pin, and a lifting pin groove into which the weight part is inserted is formed in the lifting pin base.
[0017] Here, the weight portion may include a protruding portion protruding downward, and the lift pin groove may include an inclined portion on which the protruding portion is received and slides.
[0018] Furthermore, the inclined angle of the inclined portion relative to the upper surface of the lift pin base may be smaller than the inclined angle of the protruding portion relative to the upper surface of the lift pin base.
[0019] Furthermore, the substrate processing apparatus may include: a guide pin provided below the base or the lower shower head and protruding downward; and a guide groove provided on the lift pin base and into which the guide pin is inserted.
[0020] On the other hand, the guide pin may be composed of a plurality of guide pins, and arranged to surround the pin hole.
[0021] Furthermore, the guide pin may be configured to be elastically extendable and retractable below the base or the lower nozzle.
[0022] According to the present invention having the aforementioned structure, when the lift pins are arranged, the lift pins and the pin holes can be accurately aligned by the guide pin structure.
[0023] Furthermore, according to the present invention, even if the alignment of the lift pins is misaligned, the weight member of the lift pins can be slid by the inclined portion of the lift pin groove of the lift pin base, thereby adjusting the alignment of the lift pins. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 is a side sectional view of a substrate processing apparatus according to an embodiment of the present invention,
[0025] Figure 2 is a side view showing the lower nozzle and lift pin assembly,
[0026] Figure 3 is a plan view showing the base of the lift pin,
[0027] Figure 4 is a side view showing the structure of the lift pin in more detail,
[0028] Figure 5 is a side view showing the structure of the guide pin in detail,
[0029] Figure 6 is a side sectional view showing the structure of a lift pin in a device according to the prior art.
[0030] (Explanation of Reference Numerals)
[0031] 100: Cavity
[0032] 110: Processing Space
[0033] 200: Upper nozzle
[0034] 230: Upper heater
[0035] 400: substrate support
[0036] 410: Substrate holder
[0037] 420: Fixed part
[0038] 422: Exhaust flow path
[0039] 430: Lower nozzle
[0040] 450: Lower the board
[0041] 470: Connecting rod
[0042] 490: Exhaust
[0043] 500: Lifting pin assembly
[0044] 510: Lifting pin
[0045] 516: Weight Department
[0046] 518: protrusion
[0047] 530: Guide pin
[0048] 534: Locking parts
[0049] 536: Elastic components
[0050] 550: Lifting pin base
[0051] 556: Lifting pin slot
[0052] 559: Guide groove
[0053] 1000: Substrate processing equipment DETAILED DESCRIPTION
[0054] Hereinafter, the structure of a substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
[0055] Figure 1 A side cross-sectional view of a substrate processing apparatus 1000 according to an embodiment of the present invention illustrates an internal structure.
[0056] Reference Figure 1 The substrate processing apparatus 1000 may include a chamber 100 that provides a processing space 110 for performing a processing process on the substrate W. Various processes may be performed on the substrate W in the processing space 110 .
[0057] For example, the substrate processing apparatus 1000 may further include a substrate supporting portion 400 disposed inside the cavity 100 to support the edge of the substrate W, a lower nozzle 430 disposed inside the substrate supporting portion 400 and supplying process gas toward the bottom of the substrate W, and an upper nozzle 200 inside the cavity 100 to supply inert gas toward the top of the substrate W.
[0058] That is, the substrate processing apparatus 1000 according to the present invention may correspond to an apparatus for supplying process gas to the bottom surface of the substrate W to deposit a thin film on the bottom surface of the substrate W. However, the substrate processing apparatus 1000 according to the present invention is not limited to the aforementioned structure. Although not shown in the drawings, the substrate W may also be placed on a susceptor disposed in the lower portion of the processing space 110 of the chamber 100, and process gas may be supplied toward the substrate W in the upper portion of the processing space 110.
[0059] Hereinafter, the substrate processing apparatus 1000 is defined as follows: Figure 1 The device for evaporating a thin film on the bottom side of the substrate W is shown for explanation.
[0060] Specifically, the chamber 100 may provide a processing space 110 inside thereof for accommodating various components required for the evaporation process on the substrate W.
[0061] An opening (not shown) for loading or unloading the substrate W into or from the processing space 110 may be provided at one side of the chamber 100 , and a door (not shown) may be provided at the opening.
[0062] An upper showerhead 200 may be provided at the upper portion of the chamber 100 to supply an inert gas toward the upper surface of the substrate W. In addition, an upper heater 230 may be provided at the upper portion of the chamber 100 to heat the processing space 110 .
[0063] In this case, an upper supply path 252 for supplying an inert gas or the like may be provided at the upper portion of the chamber 100 .
[0064] In addition, the upper shower head 200 may provide a first buffer space 212 between the upper heater 230. Alternatively, although not shown, the first buffer space 212 may be provided inside the upper shower head 200 so that the first buffer space 212 does not contact the upper heater 230.
[0065] Therefore, the inert gas supplied through the upper supply path 252 diffuses in the first buffer space 212 and is supplied downward through the first supply holes 214 of the upper shower head 200 .
[0066] On the other hand, the substrate support portion 400 is disposed at the lower portion of the processing space 110 to support the lower edge of the substrate W. The substrate support portion 400 may be connected to a connecting rod 470 extending downward.
[0067] A lower shower head 430 is disposed at the inner side of the substrate support portion 400 , and a process gas is supplied toward the lower surface of the substrate W through the lower shower head 430 to deposit a thin film on the lower surface of the substrate W.
[0068] The substrate support portion 400 may include a substrate holder 410 for supporting a lower edge of the substrate W and a lower showerhead 430 disposed inside the substrate holder 410 and supplying a process gas toward a lower surface of the substrate W.
[0069] In this case, the lower showerhead 430 may include a showerhead plate 431 having second supply holes 434 for supplying process gas, and a lower plate 450 connected to the showerhead plate 431 and forming a heat exchange flow path (not shown).
[0070] The substrate holder 410 may be supported by a fixing portion 420 whose lower end is connected to the lower plate 450. The substrate holder 410 may extend upward from the fixing portion 420, and the upper end of the substrate holder 410 may be curved inward.
[0071] In this case, a recess 416 may be formed at the upper end of the substrate holder 410. Therefore, when the substrate W is placed on the substrate holder 410, the substrate W is inserted into the recess 416 and supported below the edge of the substrate W.
[0072] The lower plate 450 may support the showerhead plate 431 and the substrate holder 410 .
[0073] In this case, the showerhead plate 431 may be connected to the upper surface of the lower plate 450 , and the process gas supplied from the bottom may pass through the connecting rod 470 and the lower plate 450 and be connected to the second buffer space 432 .
[0074] In addition, the fixing portion 420 supporting the lower end portion of the substrate holder 410 may be connected to the lower plate 450 .
[0075] The process gas supplied from the lower showerhead 430 is exhausted to the lower portion of the chamber 100 through the exhaust passage 422 and then exhausted to the outside of the chamber 100 through the exhaust portion 490 provided at the lower portion of the chamber 100. The exhaust passage 422 corresponds to the space between the side surface of the lower showerhead 430, the side surface of the lower plate 450, and the inner surface of the substrate holder 410.
[0076] The residual gas in the process gas after the evaporation process is exhausted to the lower portion of the chamber 100 along the exhaust flow path 422 , and then exhausted to the outside of the chamber 100 through the exhaust portion 490 from the lower portion of the chamber 100 .
[0077] On the other hand, the inert gas supplied from the upper shower head 200 toward the upper surface of the substrate W may flow toward the lower portion of the chamber 100 and be exhausted to the outside of the chamber 100 through the exhaust portion 490 .
[0078] On the other hand, the substrate processing apparatus 1000 having the aforementioned structure may be provided with a lift pin assembly 500 for lifting the substrate W.
[0079] For example, the lower nozzle 430 may be provided with an insertion lift pin 510 (see FIG. Figure 2 ) to enable the pin holes 433 and 451 to be raised and lowered, and the lifting pin assembly 500 is configured to pass through the pin holes 433 and 451.
[0080] On the other hand, as described above, when the substrate processing apparatus 1000 is placed on a base (not shown), the pin holes 433 and 451 may be formed on the base.
[0081] Figure 2 is a side view showing the lower nozzle 430 and the lift pin assembly 500, Figure 3 1 is a plan view showing the lift pin base 550 .
[0082] Reference Figure 2 as well as Figure 3 The lift pin assembly may include a lift pin 510 disposed through the pin holes 433 and 451 and a lift pin base 550 that moves vertically relative to the lower nozzle 430 to move the lift pin 510 up and down.
[0083] The lifting pin 510 is disposed through the pin holes 433 and 451 of the lower nozzle 430. For example, a first pin hole 433 may be formed in the nozzle plate 431, and a second pin hole 451 may be formed in the lower plate 450. The lifting pin 510 is disposed through the first pin hole 433 and the second pin hole 451.
[0084] In this case, the lift pin base 550 may be disposed below the lift pins 510 .
[0085] The lift pin base 550 may be configured to be relatively movable in a vertical direction relative to the lower nozzle 430 .
[0086] For example, a through hole 554 penetrating the lifting support rod 570 may be formed on one side of the lifting pin base 550 , and the lifting pin base 550 may be lifted and lowered along the lifting support rod 570 by the operation of a driving unit (not shown).
[0087] Furthermore, a central hole 552 may be formed in the center of the lift pin base 550, through which the connecting rod 470 passes, and an opening 560 may be formed on the other side of the lift pin base 550. Therefore, when the lift pin base 550 is moved horizontally for installation, the connecting rod 470 can be inserted into the central hole 552 through the opening 560.
[0088] On the other hand, the lifting pin base 550 may be formed with a lifting pin groove 556 and a guide groove 559. Figure 4 as well as Figure 5 Make observations.
[0089] Figure 4 FIG. 5 is a side view showing the lift pin 510 in more detail.
[0090] Reference Figures 2 to 4 Alternatively, a receiving portion 512 extending laterally for receiving the substrate W may be formed at the upper end of the lift pin 510, and the receiving portion 512 may be placed on the upper surface of the lower showerhead 430. Alternatively, a weight portion 516 may be provided at the lower end of the lift pin 510, and a lift pin slot 556 may be formed in the lift pin base 550 to receive the weight portion 516.
[0091] The weight portion 516 may be connected to the lower end of the lift pin 510. The weight portion 516 may be configured to have a relatively large weight compared to the weight of the lift pin 510. The weight portion 516 may be configured to position the center of gravity of the lift pin 510 at the lower portion of the lift pin 510, thereby allowing the lift pin 510 to move linearly in the vertical direction when passing through the pin holes 433 and 451 and ascending and descending.
[0092] On the other hand, the weight portion 516 may be provided with a protruding portion 518 protruding downward, and the lifting pin groove 556 may be formed with an inclined portion 558 on which the protruding portion 518 is seated and slides.
[0093] If the weight portion is disposed on the plane of the lift pin base as in the conventional device, it is difficult to reposition the lift pin in the correct position if the lift pin and the pin hole are misaligned.
[0094] However, in this embodiment, a protrusion 518 is provided on the lower portion of the weight portion 516, and a sloped portion 558 is provided in the lift pin slot 556, which is inserted into the protrusion 518 and slides. Therefore, even if the lift pin 510 is misaligned in the pin holes 433 and 451, the protrusion 518 of the weight portion 516 can be positioned correctly while sliding along the sloped portion 558 of the lift pin slot 556 when the lift pin base 550 is raised. Specifically, the protrusion 518 of the weight portion 516 slides along the sloped portion 558, aligning the center of the protrusion 518 of the weight portion 516 with the center of the lift pin slot 556. This allows the lift pin 510 and the pin holes 433 and 451 to be concentrically aligned.
[0095] Furthermore, when looking at the inclined portion 558 and the protrusion 518, the inclination angle θ2 of the inclined portion 558 relative to the upper surface of the lift pin base 550 can be formed to be smaller than the inclination angle θ1 of the protrusion 518. In other words, the inclination of the inclined portion 558 relative to the upper surface of the lift pin base 550 can be formed to be more gradual than the inclination of the protrusion 518.
[0096] If, on the other hand, the inclination angle of the protrusion 518 is more gradual than that of the inclined portion 558, the protrusion 518 may eventually contact the inclined portion 558 in a circular line, resulting in an alignment error, which may cause the lift pin 510 to be aligned at an angle. To address this problem, the present invention makes the inclination angle θ2 of the inclined portion 558 smaller than the inclination angle θ1 of the protrusion 518, enabling accurate alignment without error.
[0097] On the other hand, the aforementioned lift pins 510 may be composed of a plurality of pins. For example, they may be composed of three pins, but the number is not particularly limited.
[0098] On the other hand, when installing the lift pin base 550 that raises and lowers the lift pin 510, it is important to accurately align the lift pin 510 with the pin holes 433 and 451. If the lift pin 510 and the pin holes 433 and 451 are not accurately aligned, the lift pin 510 may be damaged or broken due to interference with the inner walls of the pin holes 433 and 451 during raising and lowering. Therefore, it is necessary to align the protrusion 518 of the weight portion 516 at the lower end of the lift pin 510 with the lift pin groove 556 of the lift pin base 550.
[0099] In addition, when the substrate processing apparatus of the present invention is an apparatus that performs various processes below the substrate W, the area where the lift pins 510 are arranged corresponds to a so-called "dead zone" where it is difficult to supply gas and heat to the bottom of the substrate W. Therefore, making the diameter of the lift pins 510 as small as possible can reduce such a dead zone. However, when the diameter of the lift pins 510 is made as small as possible, if the lift pins 510 interfere with the lower showerhead 430, they may be damaged. Therefore, it becomes important to accurately align the lift pins 510 and the pin holes 433 and 451. In the present invention, a guide pin 530 can be provided for the aforementioned alignment.
[0100] Figure 5 It is a side view showing the structure of the guide pin 530 in detail.
[0101] Reference Figure 2 、 Figure 3 as well as Figure 5 The guide pin 530 may be configured to protrude downward below the lower nozzle 430. In addition, a guide groove 559 may be provided in the lift pin base 550 for inserting the lower end portion of the guide pin 530.
[0102] In this case, the guide pin 530 may be composed of a plurality of pins arranged to surround the lifting pin 510. Therefore, the guide groove 559 may be as follows: Figure 3 The configuration shown is around the lift pin slot 556.
[0103] The guide grooves 559 may be formed on the lift pin base 550 in the same number as the guide pins 530. Figure 3 The structure in which three guide grooves 559 surround one lifting pin groove 556 is exemplarily shown, and the number of the guide grooves 559 can be composed of multiple ones and is not particularly limited. Figure 3 Although the structure of one lift pin 510 and three guide pins 530 surrounding the lift pin 510 is shown, the guide pin 530 may be composed of a plurality of guide pins without particular limitation.
[0104] On the other hand, when the lower end of the guide pin 530 is inserted into the guide groove 559 of the lifting pin base 550, the setting position of the guide pin 530 can be determined so that the lifting pin 510, the pin holes 433, 451 and the lifting pin groove 556 of the lifting pin base 550 are accurately aligned.
[0105] In addition, the guide pins 530 can be arranged below the lower nozzle 430 (or below the lower plate 450) to be elastically extendable and retractable. Therefore, when the lift pin base 550 is disposed below the lower nozzle 430, damage to the guide pins 530 can be prevented and installation can be facilitated.
[0106] For example, an insertion groove 452 into which the upper end of the guide pin 530 is inserted may be provided below the lower nozzle 430. An elastic member 536 such as a spring may be provided inside the insertion groove 452 to elastically pressurize the guide pin 530 downward.
[0107] The insertion groove 452 may include a first insertion groove 456 into which the elastic member 536 is inserted, and a second insertion groove 454 disposed above the first insertion groove 456 and communicating with the first insertion groove 456 .
[0108] In addition, the first insertion groove 456 can be connected to the bottom of the lower nozzle 430 through the through hole 458.
[0109] The upper end of the guide pin 530 may be disposed through the through hole 458. In this case, the upper end of the guide pin 530 may be disposed inside the first insertion groove 456, or inside the second insertion groove 454 through the first insertion groove 456.
[0110] On the other hand, in the aforementioned structure, the diameter of the first insertion groove 456 may be the largest, and the diameters of the second insertion groove 454 and the through hole 458 may be relatively smaller than that of the first insertion groove 456 .
[0111] Therefore, a step portion 459 is formed due to the difference in diameter between the through hole 458 and the first insertion groove 456. When the guide pin 530 is provided with a locking member 534, the locking member 534 is engaged with the step portion 459, and even when the elastic member 536 is pressed downward, the depth of the lower end portion of the guide pin 530 inserted into the guide groove 559 can be adjusted.
[0112] On the other hand, in Figure 2 In the structure, when the lift pin base 550 rises, the guide pins 530 also rise despite the elasticity of the elastic member 536. As a result, the upper ends of the lift pins 510 can protrude above the lower showerhead 430, so that the substrate W is placed on the placement portion 512 of the lift pins 510.
[0113] On the other hand, the guide pins 530 may remain in the substrate processing apparatus 1000 after the lift pin base 550 is installed, or the guide pins 530 may be removed after the lift pin base 550 is installed. In other words, the guide pins 530 may be used only when installing and aligning the lift pin base 550 and then removed.
[0114] While the present invention has been described above with reference to preferred embodiments, those skilled in the relevant art will be able to implement various modifications and variations to the present invention without departing from the scope and spirit of the invention as set forth in the appended claims. Therefore, any variations that substantially encompass the constituent elements of the claims should be deemed to be fully encompassed within the technical scope of the present invention.
Claims
1. A lifting pin assembly, characterized in that: have: A lifting pin is configured to pass through a pin hole formed in the base or the lower nozzle; and The lifting pin base moves relative to the base or the lower nozzle in the vertical direction to move the lifting pin up and down. A weight portion is provided at a lower end portion of the lift pin, and a lift pin groove into which the weight portion is inserted is formed in the lift pin base.
2. The lift pin assembly according to claim 1, wherein: The weight portion has a protruding portion protruding downward, The lifting pin groove has an inclined portion formed therein, on which the protrusion is seated so as to slide.
3. The lift pin assembly according to claim 2, wherein: An inclination angle of the inclined portion relative to the upper surface of the lift pin base is smaller than an inclination angle of the protruding portion relative to the upper surface of the lift pin base.
4. The lift pin assembly according to claim 1, wherein: The lift pin assembly comprises: a guide pin, disposed below the base or the lower nozzle and protruding downward; and A guide groove is provided on the lifting pin base and is inserted into the guide pin.
5. The lift pin assembly according to claim 4, wherein: The guide pins are composed of a plurality of guide pins and are arranged to surround the lift pins.
6. The lift pin assembly according to claim 4, wherein: The guide pin is configured to be elastically extendable and retractable below the base or the lower nozzle.
7. A substrate processing device, characterized in that: have: The cavity provides a processing space for the substrate; a base or a lower showerhead, disposed at the lower portion of the processing space of the chamber and formed with a pin hole; and A lifting pin assembly passes through the pin hole to support the substrate, The lift pin assembly comprises: a lifting pin, disposed to pass through the pin hole; and The lifting pin base moves relative to the base or the lower nozzle in the vertical direction to move the lifting pin up and down. A weight portion is provided at a lower end portion of the lift pin, and a lift pin groove into which the weight portion is inserted is formed in the lift pin base.
8. The substrate processing apparatus according to claim 7, wherein: The weight portion has a protruding portion protruding downward, The lifting pin groove has an inclined portion formed therein, on which the protrusion is seated so as to slide.
9. The substrate processing apparatus according to claim 8, wherein: An inclination angle of the inclined portion relative to the upper surface of the lift pin base is smaller than an inclination angle of the protruding portion relative to the upper surface of the lift pin base.
10. The substrate processing apparatus according to claim 7, wherein: The substrate processing device comprises: a guide pin, disposed below the base or the lower nozzle and protruding downward; and A guide groove is provided on the lifting pin base and is inserted into the guide pin.
11. The substrate processing apparatus according to claim 10, wherein: The guide pins are composed of a plurality of guide pins and are arranged to surround the pin hole.
12. The substrate processing apparatus according to claim 10, wherein: The guide pin is configured to be elastically extendable and retractable below the base or the lower nozzle.