base

Abstract

The present invention relates to a susceptor, and in the ceramic susceptor of the present invention, a multi-layered structure of a heating element pattern is arranged in a manner that circular arc portions do not overlap, or a straight line section of the heating element is arranged at different angles with respect to the center in different layers, or even in a single layer structure of the heating element pattern, a straight line section of the heating element is arranged at different angles with respect to the center, thereby improving the temperature uniformity in the entire area of the upper surface of the susceptor.

Description

Technical Field

[0001] This invention relates to a ceramic base, and more particularly to a ceramic base using a heating pattern for improving temperature uniformity. Background Technology

[0002] Typically, semiconductor devices or display devices are manufactured by patterning multiple thin film layers, including dielectric and metal layers, sequentially stacked on a glass substrate, flexible substrate, or semiconductor wafer substrate. These thin film layers are sequentially deposited on the substrate using chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes. CVD processes include low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and metal-organic chemical vapor deposition (MOCVD). These CVD and PVD apparatuses are equipped with ceramic substrates for supporting the glass substrate, flexible substrate, or semiconductor wafer substrate and for generating predetermined heat or plasma via high-frequency (RF) electrodes. For precision processes such as miniaturization of wiring in semiconductor devices, the ceramic substrate is widely used in plasma deposition processes and other processes to meet the requirements of accurate temperature control and heat treatment. In addition, the ceramic substrate is used for plasma formation or substrate heating in etching processes or photoresist firing processes for thin film layers formed on semiconductor wafer substrates.

[0003] A typical ceramic substrate includes a heating element disposed between ceramic materials for heating purposes. In the ceramic substrate structure, the heating element receives electricity and generates heat to heat semiconductor wafer substrates, etc. In order to improve yield through stable semiconductor processes, the temperature uniformity of the substrate is important.

[0004] Figure 1A It is a plan view of the heating element pattern of an existing ceramic base.

[0005] Reference Figure 1A Existing ceramic bases typically have an inner heating element pattern 10 in the diameter direction and an outer heating element pattern 20 in the diameter direction on the same plane. The inner heating element pattern 10 is a pattern that extends in an arc shape between the first terminal pairs 10a and 10b in the center, and the outer heating element pattern 20 is a pattern that extends in an arc shape between the second terminal pairs 20a and 20b in the center.

[0006] However, existing ceramic substrates have an inner heating element pattern 10 and an outer heating element pattern 20 formed on the same plane in the same layer. Therefore, when the temperature of the upper surface of the substrate on which the substrate is placed is not uniform throughout the region, an attempt is made to improve the temperature uniformity by adjusting the pitch of the heating elements to heat or cool the corresponding part.

[0007] Furthermore, in existing ceramic bases, one side of the straight sections 21a, 21b is connected to the second terminal pairs 20a, 20b and extends to two connection points of the outer heating element pattern 20 with a resistance pattern, thus forming an outer heating element pattern 20 that is connected to and extends from the second terminal pairs 20a, 20b. Therefore, in existing ceramic bases, as... Figure 1B As shown, due to defects such as cracks caused by oxidation in the straight sections 21a and 21b of the narrowly spaced heating element, the resistance value may be changed or a short circuit may occur, which is a problem affecting the temperature uniformity. Summary of the Invention

[0008] The problem the invention aims to solve

[0009] Therefore, the present invention is proposed to solve the above-mentioned problems. The purpose of the present invention is to provide a ceramic base in which a multi-layer heating element pattern is arranged in a manner in which the arc portions do not overlap, or the straight sections of the heating element are arranged at different angles relative to the center in different layers, or even in a single-layer heating element pattern, the straight sections of the heating element are arranged at different angles relative to the center, thereby improving the temperature uniformity of the entire area of ​​the upper surface of the base.

[0010] means for solving problems

[0011] First, to summarize the features of the present invention, according to one aspect of the present invention for achieving the stated object, a ceramic base includes an insulating plate having a plurality of heating element layers; the plurality of heating element layers include: a first heating element layer having a first pattern, the first pattern including a first resistive portion and a first connecting portion connected between a first terminal pair; and a second heating element layer having a second pattern, the second pattern including a second resistive portion and a second connecting portion connected between a second terminal pair; the first connecting portion connects an end of the first resistive portion to any one terminal of the first terminal pair, and the second connecting portion connects an end of the second resistive portion to any one terminal of the second terminal pair.

[0012] The first resistor portion and the second resistor portion may each include a plurality of arc portions extending in the circumferential direction and a plurality of fold portions for connecting the arc portions. When the arc portions of the first resistor portion and the arc portions of the second resistor portion are projected onto the plane of the insulating plate, the arc portions of the second resistor portion may be located between the arc portions of the first resistor portion.

[0013] The first connecting portion and the second connecting portion may be arranged radially at different angles relative to the center of the insulating plate.

[0014] The plurality of heating element layers may further include a third heating element layer having a third pattern. The third pattern includes a third resistive portion and a third connecting portion connected between the third terminal pairs. The third connecting portion may connect the end of the third resistive portion to any one of the terminals in the third terminal pair. The third resistive portion may include a plurality of arcuate portions extending in a circumferential direction and a plurality of folded portions for connecting the arcuate portions.

[0015] When the arc portion of the first resistor, the arc portion of the second resistor, and the arc portion of the third resistor are projected onto the plane of the insulating plate, the arc portion of the third resistor can be located between the arc portions of the first resistor and the arc portions of the second resistor.

[0016] The first connecting portion, the second connecting portion, and the third connecting portion can be arranged radially at different angles relative to the center of the insulating plate.

[0017] The first pattern and the second pattern can each be set in one or more segmented setting areas of the same number.

[0018] The first pattern and the second pattern can each be set in one or more segmented setting areas of different numbers.

[0019] The first connecting part and the second connecting part may each include a waveform connecting line.

[0020] In addition, as another example of the present invention, the first resistor portion and the second resistor portion may each include a plurality of arc portions extending along the circumferential direction and a plurality of fold portions for connecting the arc portions. One or more first patterns and one or more second patterns are respectively disposed in mutually different setting areas without interlayer overlap and include the arc portions and the fold portions that are symmetrical with respect to the center. The first connecting portion and the second connecting portion may be radially disposed at positions at different angles relative to the center.

[0021] Preferably, the two connecting portions of the first heating element layer are arranged at 180° to each other in the outer direction of the diameter, the two connecting portions of the second heating element layer are arranged at 180° to each other in the outer direction of the diameter, and the extension lines of the two connecting portions of the first heating element layer are perpendicular to the extension lines of the two connecting portions of the second heating element layer.

[0022] Furthermore, in another aspect of the present invention, the base includes an insulating plate provided with a heating element, the heating element including patterns respectively provided in a plurality of divided areas on the same plane, each pattern including a resistive portion and a connecting portion connected between terminal pairs, each connecting portion connecting to the end of a corresponding resistive portion connected to a first terminal and a second terminal.

[0023] Each resistor may include multiple arcuate portions extending in a circumferential direction and multiple folded portions for connecting the arcuate portions.

[0024] The connecting portions of each pattern can be arranged radially at different angles relative to the center of the insulating plate.

[0025] Invention Effects

[0026] According to the ceramic base of the present invention, a multi-layer heating element pattern is arranged with non-overlapping arc portions, thereby uniformly distributing the heating elements in each region for heating, thus improving temperature uniformity. In the multi-layer heating element pattern, the connecting lines between multiple interlayer straight sections do not overlap or run side by side. Alternatively, even in a single-layer heating element pattern, two or more connecting lines are arranged at different angles relative to the center, thereby improving temperature uniformity throughout the entire area of ​​the upper surface of the base. Furthermore, the structure described above reduces the occurrence of defects such as cracks caused by oxidation of the connecting lines, and since the temperature of each region in each layer can be freely adjusted in the multi-layer heating element pattern, the degree of freedom in temperature control for temperature uniformity is increased. Attached Figure Description

[0027] To aid in understanding the invention, embodiments of the invention are provided in the accompanying drawings, which are included as part of the detailed description, and together with the detailed description serve to illustrate the technical ideas of the invention.

[0028] Figure 1A It is a plan view of the heating element pattern of an existing ceramic base.

[0029] Figure 1B This illustrates an exemplary defect in the linear range of the heating element in an existing ceramic substrate.

[0030] Figure 2 This is a schematic cross-sectional view of a ceramic base according to an embodiment of the present invention.

[0031] Figures 3A to 3D This is a diagram illustrating various patterns of an exemplary single-layer structure for demonstrating the heating element pattern of the ceramic base of the present invention.

[0032] Figure 4 The diagram shows the connection between the terminal and the resistor in the heating element pattern of the ceramic base of the present invention.

[0033] Figures 5A to 5D This is a diagram illustrating an exemplary double-layer structure of the heating element pattern of the ceramic base of the present invention.

[0034] Figures 6A to 6D This is a diagram of another pattern illustrating an exemplary double-layer structure of the heating element pattern of the ceramic base of the present invention.

[0035] Figure 7 This is a diagram illustrating an exemplary three-layer structure of the heating element pattern of the ceramic base of the present invention.

[0036] Explanation of reference numerals in the attached figures

[0037] 110: Insulation board

[0038] 114: Fever Body

[0039] 90: Pattern

[0040] 81a, 81b: Terminal pairs

[0041] 85: Arc section

[0042] 86: Folding section

[0043] 91: Resistor Section

[0044] 92: Connecting part

[0045] 511: First heating element layer

[0046] 512: Second heating element layer

[0047] 513: Third heating element layer Detailed Implementation

[0048] The present invention will now be described in detail with reference to the accompanying drawings. In these drawings, the same constituent elements will be indicated by the same reference numerals wherever possible. Furthermore, detailed descriptions of known functions and / or structures will be omitted. The following disclosure focuses on explaining the parts necessary to understand the operation of various embodiments, and omits descriptions of elements that may obscure the main points of the explanation. Additionally, some constituent elements in the drawings may be enlarged or omitted, or shown in a schematic manner. The sizes of the constituent elements do not perfectly reflect their actual sizes; therefore, the content described herein is not limited to the relative sizes or spacing of the constituent elements shown in the various drawings.

[0049] In describing embodiments of the present invention, detailed descriptions of relevant prior art will be omitted when it is determined that such detailed descriptions would unnecessarily obscure the spirit of the invention. Furthermore, the terminology used below, defined in consideration of its functionality within the present invention, may be varied according to the intent or convention of the user or practitioner. Therefore, definitions should be based on the entire contents of this specification. The terminology used in the detailed description is for the purpose of describing embodiments of the invention and should not be considered limiting. Unless expressly stated otherwise, a single quantity includes the meaning of multiple quantities. In this description, expressions such as "comprising" or "having" are used to indicate certain characteristics, numbers, steps, actions, elements, portions or combinations thereof, and should not be construed as excluding the presence or possibility of one or more other characteristics, numbers, steps, actions, elements, portions or combinations thereof other than those described.

[0050] In addition, terms such as "first" and "second" can be used to describe multiple constituent elements, but the constituent elements are not limited to these terms. These terms are only used to distinguish one constituent element from other constituent elements.

[0051] Figure 2 This is a schematic cross-sectional view of a ceramic base 100 according to an embodiment of the present invention.

[0052] Reference Figure 2 According to one embodiment of the present invention, the (ceramic) base 100 includes an insulating plate 110 and a shaft 120.

[0053] The ceramic substrate 100 of one embodiment of the present invention is a semiconductor device for supporting substrates (semiconductor wafers, glass substrates, flexible substrates, etc.) for various applications and heating the substrates at a predetermined temperature. The ceramic substrate 100 can also be used in semiconductor processes using plasma (such as plasma-enhanced chemical vapor deposition or dry etching).

[0054] The insulating plate 110 can be configured to have high-frequency electrodes 112 for generating plasma and / or heating elements 114 for heating the substrate disposed (embedded) at predetermined intervals between ceramic materials. The insulating plate 110 can stably support the substrate to be processed while performing semiconductor processes using the heating element 114 to heat the substrate and / or using the plasma generated by the high-frequency electrodes 112.

[0055] Although not shown in the ceramic base 100 of the present invention, one or more chuck electrodes with electrostatic chuck function may be provided to support the substrate 11 placed on the insulating plate 110. For example, one or more chuck electrodes may also be provided (embedded) at predetermined intervals above or below the high-frequency electrode 112 or the heating element 114.

[0056] The insulating plate 110 can be formed into a plate-like structure with a predetermined shape. As an example, the insulating plate 110 can be formed into a circular plate-like structure, but is not necessarily limited thereto. The ceramic material can be at least one of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, autoclaved lightweight concrete (AlC), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, BN, SiO2, SiC, YAG, mullite, and AlF3, preferably aluminum nitride (AlN). Furthermore, each ceramic powder may selectively contain about 0.1% to 10% yttrium oxide powder, preferably about 1% to 5% yttrium oxide powder.

[0057] The shaft 120 is in the form of a pipe with a through hole and is joined or bonded to the lower surface of the insulating plate 110. The shaft 120 may be formed of the same ceramic material as the insulating plate 110 and joined or bonded to the insulating plate 110.

[0058] The high-frequency electrode 112 or one or more chuck electrodes may be formed of tungsten (W), molybdenum (Mo), silver (Ag), gold (Au), niobium (Nb), titanium (Ti), aluminum nitride (AlN), or alloys thereof, preferably molybdenum (Mo). The high-frequency electrode 112 can be connected to or grounded to an RF (radio) power supply via a connecting rod 121 contained within the hollow shaft 120, and one or more chuck electrodes can be connected to a chuck electrode driving power supply (DC or AC power) via other connecting rods contained within the hollow shaft 120. The high-frequency electrode 112 has a wire-type or sheet-type mesh structure. The mesh structure is formed by interlacing multiple metals arranged along a first direction and multiple metals arranged along a second direction.

[0059] The heating element 114 is formed of tungsten, molybdenum, or their alloys or carbides, and has a high melting point and high electrical resistance. The heating element 114 can be formed as a plate-shaped coil based on heating wires (or resistance wires or heating electrodes). Alternatively, for precise temperature control, the heating element 114 can also be formed as a multilayer structure. This heating element 114 can be connected to a power source in semiconductor manufacturing processes via a connecting rod 123 included in the shaft 120. For smooth deposition and etching processes, the heating element 114 can perform the function of heating the substrate to be processed on the insulating plate 110 at a predetermined constant temperature.

[0060] like Figures 3A to 7As shown, in a ceramic base 100 of an embodiment of the present invention, a multi-layered heating element pattern is provided in the heating element 114 formed by heating wires (or resistance wires) in a manner where the arc portions do not overlap, thereby uniformly distributing the heating elements in each region and heating them, thereby improving temperature uniformity. Furthermore, in the pattern of the multi-layered heating element 114, by providing a multi-layered heating element 114 pattern, multiple interlayer straight sections (connection portions for connecting terminals and resistors) do not overlap or are not side-by-side, thereby further improving temperature uniformity. Additionally, even in cases such as... Figures 3A to 3D In the pattern of the single-layer heating element 114 shown, two or more straight sections (connection sections for connecting terminals and resistors) are set at different angles relative to the center, thereby improving the temperature uniformity of the entire area of ​​the upper surface of the base.

[0061] The following is for reference Figures 3A to 7 The above-described structure of the present invention will be described in detail below.

[0062] Figures 3A to 3D This is a diagram illustrating the pattern of the heating element 114 of the ceramic base 100 of the present invention, showing various patterns of heating elements 114 with a single-layer structure.

[0063] Figure 3A The diagram shows a pattern 90 in which a single-layer heating element 114 is set in two equally divided setting areas 311 and 312 in a plan view of a ceramic base 100. Figure 3B The diagram shows a pattern 90 in which a single-layer heating element 114 is set in three equally divided setting areas 321, 322, and 323 in a plan view of a ceramic base 100. Figure 3C The diagram shows a pattern 90 in which a single-layer heating element 114 is set in four equally divided areas 331, 332, 333, and 334 in a plan view of a ceramic base 100. Figure 3D The diagram shows a pattern 90 in which a single-layer heating element 114 can be set in a plurality of equally divided setting areas in a plan view of a ceramic base 100.

[0064] Reference Figures 3A to 3D The heating element 114 may include patterns disposed in two or more equal or not equal parts on the same plane inside the insulating plate 110.

[0065] That is, the heating element 114 includes patterns 90 respectively disposed in multiple disposed areas divided on the same plane inside the insulating plate 110. Each pattern 90 includes a resistive portion 91 and a connecting portion 92 connected between terminal pairs 81a and 81b.

[0066] Each connecting portion 92 connects the end of the corresponding resistor portion 91 connected to the first terminal 81a to the second terminal 81b, and each resistor portion 91 includes a plurality of arc portions 85 extending in the circumferential direction and a plurality of folded portions 86 for connecting the arc portions 85.

[0067] Furthermore, the connecting portions 92 of each pattern 90 are configured such that no two connecting portions are parallel to each other, and the connecting portions 92 of each pattern 90 are arranged radially relative to the center at positions at different angles. That is, the connecting portions 92 of adjacent patterns 90 are arranged in a manner that they are not adjacent to each other.

[0068] Figure 4 The diagram shows the connection portion 92 between the terminal 81b and the resistor portion 91 in the pattern of the heating element 114 of the ceramic base 100 of the present invention.

[0069] Reference Figure 4 Each pattern 90, which is set in multiple divided setting areas, includes a resistor 91 and a connection 92 connected between terminal pairs 81a and 81b, and the connection 92 includes a connection line with a waveform such as a sine wave.

[0070] That is, the waveform has a shape where the portion connecting the downwardly convex portion and the upwardly convex portion has more than one shape, and the curvature of each convex portion is preferably designed to be about R400 to R500. This is to form a smooth curve by increasing the curvature, thereby reducing defects caused by oxidation, etc.

[0071] As described above, the resistive portion 91 and the connecting portion 92 of the heating element 114 are formed of tungsten, molybdenum, or their alloys or carbides. The resistive portion 91 is the portion that increases the resistance by processing the heating element 114 material as described above into a coil shape (or, depending on the situation, a serrated or zigzag shape, etc.) to increase the electron travel distance, and the connecting portion 92 is a connecting wire portion for electrical connection.

[0072] Similarly, the concepts of pattern 90, terminal pairs 81a and 81b, arc portion 85, fold portion 86, resistive portion 91, and connecting portion 92 of the heating element 114 described above also apply to multi-layer structures with two or more heating element layers.

[0073] Figures 5A to 5D This is a diagram illustrating an exemplary double-layer structure of the heating element layer of the ceramic base 100 of the present invention, used to explain the pattern of the heating element 114. Figure 5A A plan view showing a pattern 90 of a heating element 114 arranged in a double-layer structure on different planes inside the ceramic base 100. Figure 5B Show Figure 5A The schematic stacked structure of the upper first heating element layer 511 and the lower second heating element layer 512 in the cross-sectional structure. Figure 5C Show Figure 5A Plan view of the first heating element layer 511. Figure 5D Show Figure 5A Plan view of the second heating element layer 512.

[0074] Reference Figures 5A to 5D The heating element 114 of the ceramic base 100 of the present invention has a double-layer stacked structure, including a first heating element layer 511 and a second heating element layer 512 formed by being separated by a predetermined distance from each other by ceramic material.

[0075] The first heating element layer 511 includes a first pattern 90-1, which includes a first resistive portion 91-1 and a first connecting portion 92-1 connected between terminal pairs 81a-1 and 81b-1. The second heating element layer 512 includes a second pattern 90-2, which includes a second resistive portion 91-2 and a second connecting portion 92-2 connected between terminal pairs 81a-2 and 81b-2 in other layers.

[0076] Furthermore, the first connecting portion 92-1 and the second connecting portion 92-2 are respectively connected to the end of the corresponding resistor portion 91-1 / 91-2 connected to the first terminal 81a-1 / 81a-2 and the second terminal 81b-1 / 81b-2. Additionally, each of the first resistor portion 91-1 and the second resistor portion 91-2 includes a plurality of arcuate portions 85-1 / 85-2 extending in the circumferential direction and a folded portion 86-1 / 86-2 for connecting the arcuate portions 85-1 / 85-2.

[0077] Among them, such as Figure 5A As shown, the arcuate portion 85-1 of the first resistor portion 91-1 and the arcuate portion 85-2 of the second resistor portion 91-2 can be disposed in the overlapping area between layers. That is, when the first pattern 90-1 and the second pattern 90-2 are projected onto the plane of the insulating plate 110, specifically when the arcuate portion 85-1 of the first resistor portion 91-1 and the arcuate portion 85-2 of the second resistor portion 91-2 are projected onto the plane of the insulating plate 110, the arcuate portion 85-2 of the second resistor portion 91-2 can be located between the arcuate portions 85-1 of the first resistor portion 91-1. At this time, the arcuate portions 85-1 of the first resistor portion 91-1 and the arcuate portions 85-2 of the second resistor portion 91-2 can be disposed at positions with different radii relative to the center O, thereby ensuring the heating temperature between the patterns and improving temperature uniformity.

[0078] Furthermore, the first connecting portion 92-1 and the second connecting portion 92-2 are arranged radially relative to the center O at positions at different angles to each other. For example... Figure 5A As shown, preferably, in a structure in which a pattern 90-1 / 90-2 is provided in each layer, the first connecting part 92-1 and the second connecting part 92-2 are arranged in a direction that is 180° to each other in the outer diameter direction relative to the center O.

[0079] exist Figure 5A In, for example, such as Figures 3A to 3D As shown, instead of the first pattern 90-1 of the first heating element layer 511, a heating element layer with a pattern of heating element 114 can also be configured in two or more multi-divided setting areas. In this case, the second pattern 90-2 can be directly applied.

[0080] In addition, in this invention, such as Figures 3A to 3D As shown, the present invention can also replace Figure 5A The second pattern 90-2 of the second heating element layer 512 is a heating element layer with a pattern of heating element 114 arranged in two or more multi-divided setting areas. At this time, the first pattern 90-1 can be directly applied.

[0081] That is, in this invention, in the double-layer stacked structure of the first heating element layer 511 and the second heating element layer 512, each heating element layer has a pattern of heating element 114 in all combinations of pattern structures in one or more multi-divided arrangement areas (the divided arrangement areas in each layer may be the same or different), which can be implemented in the manner described above. Furthermore, this principle is that when a stacked structure of three or more heating element 114 layers (see...) Figure 7 When each heating element layer constitutes a pattern or a pattern structure of all combinations of patterns of heating element 114 in two or more multi-divided setting regions (the divided setting regions in each layer may be the same or different), the heating element layer can be implemented in the manner described above.

[0082] Figures 6A to 6D This is a diagram of another pattern illustrating an exemplary double-layer structure of the heating element 114 of the ceramic base 100 of the present invention. Figures 6A to 6D An example is shown in the double-layer stacked structure of the first heating element layer 511 and the second heating element layer 512, where each heating element layer has the same pattern of heating element 114 in the setting areas of double division, triple division, quadruple division and other multiple divisions.

[0083] First of all, Figures 6B to 6D In, such as Figure 5AAs shown, the arcuate portion 85-1 of the first resistive portion 91-1 included in the first pattern 90-1 of the first heating element layer 511 and the arcuate portion 85-2 of the second resistive portion 91-2 included in the second pattern 90-2 of the second heating element layer 512 can be disposed in the overlapping area between the layers. That is, when the first pattern 90-1 and the second pattern 90-2 are projected onto the plane of the insulating plate 110, that is, when the arcuate portion 85-1 of the first resistive portion 91-1 and the arcuate portion 85-2 of the second resistive portion 91-2 are projected onto the plane of the insulating plate 110, the arcuate portion 85-2 of the second resistive portion 91-2 can be located between the arcuate portions 85-1 of the first resistive portion 91-1 (see reference). Figure 5A At this time, the arcuate portions 85-1 of the first resistor portion 91-1 and 85-2 of the second resistor portion 91-2 can be positioned at different radii relative to the center O, thereby ensuring the heating temperature between the patterns and improving temperature uniformity. Furthermore, the first connecting portion 92-1 of the first heating element layer 511 and the second connecting portion 92-2 of the second heating element layer 512 are radially positioned at different angles relative to the center O.

[0084] Additionally, refer to Figure 6A ,like Figure 5A As shown, the first heating element layer 511 and the second heating element layer 512 are the same in terms of having terminal pairs 81a and 81b, arc portion 85, folded portion 86, resistor portion 91 and connecting portion 92.

[0085] However, the heating element 114 may include: a first heating element layer 511 having one or more first patterns 90-1, the first pattern 90-1 including a first resistive portion 91-1 and a first connecting portion 92-1 connected between terminal pairs 81a-1 and 81b-1; and a second heating element layer 512 having one or more second patterns 90-2, the second pattern 90-2 including a second resistive portion 91-2 and a second connecting portion 92-2 connected between other terminal pairs 81a-2 and 81b-2.

[0086] Furthermore, one or more first patterns 90-1 and second patterns 90-2 are disposed in mutually distinct disposal areas without interlayer overlap (disposal areas do not overlap). That is, one or more first patterns 90-1 may include an arc portion 85 symmetrical with respect to the center point O and a folded portion 86 symmetrical with respect to the center point O, and one or more second patterns 90-2 may include an arc portion 85 symmetrical with respect to the center point O and a folded portion 86 symmetrical with respect to the center point O.

[0087] Furthermore, the first connecting portion 92-1 of the first heating element layer 511 and the second connecting portion 92-2 of the second heating element layer 512 are arranged radially relative to the center O at positions at different angles to each other. In particular, preferably, the two connecting portions 92-1 of the first heating element layer 511 are arranged in a direction 180° to each other in the outer direction of the diameter, and the two connecting portions 92-2 of the second heating element layer 512 are arranged in a direction 180° to each other in the outer direction of the diameter, and the extension lines of the two connecting portions 92-1 of the first heating element layer 511 and the extension lines of the two connecting portions 92-2 of the second heating element layer 512 are preferably perpendicular to each other.

[0088] Figure 7 This is a diagram illustrating the pattern of the heating element 114 of the ceramic base 100 of the present invention, showing an exemplary pattern of a three-layer heating element 114.

[0089] Reference Figure 7 The heating element 114 of the ceramic base 100 of the present invention includes, in a similar or identical manner, the following components: Figure 5A or Figures 6A to 6D The first heating element layer 511 and the second heating element layer 512 in the embodiments described above have the structures described above, and may additionally include a third heating element layer 513 separated from the second heating element layer 512 by a ceramic material.

[0090] As described above, each of the heating element layers 511, 512 and 513 can use a pattern structure with one pattern as described above or all combinations of patterns of heating element 114 in two or more multi-divided setting areas (the setting areas of each layer can be the same or different).

[0091] The structures of the first heating element layer 511 and the second heating element layer 512 are as follows: Figure 5A As described in the description, the third heating element layer 513 may include a third pattern 90-3, which includes a third resistive portion 91-3 and a third connecting portion 92-3 connected between the third terminal pairs 81a-3 and 81b-3.

[0092] The third connection part 92-3 includes a connection line with the waveform described above, which is used to connect the end of the corresponding resistor part 91-3 connected to the first terminal 81a-3 of the third terminal pair 81a-3, 81b-3 to the second terminal 81b-3 of the third terminal pair 81a-3, 81b-3.

[0093] The third resistor section 91-3 includes an arcuate section 85-3 extending in the circumferential direction and a folded section 86-3 for connecting the arcuate section 85-3.

[0094] and Figure 5ASimilar to the double-layer stacked structure, the arcuate portions 85-1, 85-2, and 85-3 of the resistive portions 91-1, 91-2, and 91-3 of the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513 can be set in the overlapping area between the layers. In this case, they can be set at positions with different radii relative to the center O. That is, when the first pattern 90-1, the second pattern 90-2, and the third pattern 90-3 are projected onto the plane of the insulating plate 110, specifically when the arc portion 85-1 of the first resistor portion 91-1, the arc portion 85-2 of the second resistor portion 91-2, and the arc portion 85-3 of the third resistor portion 91-3 are projected onto the plane of the insulating plate 110, the arc portion 85-3 of the third resistor portion 91-3 can be located between the arc portion 85-2 of the second resistor portion 91-2 and the arc portion 85-1 of the first resistor portion 91-1 (the arc portions of the three layers do not overlap). This ensures that the arc portions in any two of the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513 do not overlap. Therefore, the heating temperature between the patterns can be guaranteed to improve temperature uniformity.

[0095] Furthermore, the connecting portions 92-1, 92-2, and 92-3 of the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513 are arranged radially relative to the center O at positions with different angles to each other. This can also be established between adjacent layers of the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513.

[0096] As described above, in the ceramic base 100 of the present invention, the pattern of the multi-layer heating element 114 is arranged in such a way that the arc portions do not overlap, thereby uniformly distributing the heating element 114 in each region and heating it, thereby improving temperature uniformity. In the pattern of the multi-layer heating element 114, the multiple connecting portions 92 that are straight intervals between layers do not overlap or are not side by side. Alternatively, even in the pattern of the single-layer heating element 114, two or more straight interval connecting portions 92 are arranged at different angles relative to the center, thereby improving the temperature uniformity of the entire region of the upper surface of the base. In addition, the structure described above can reduce the occurrence of defects such as cracks caused by oxidation of the connecting portions 92, and since the pattern of the multi-layer heating element 114 allows for free adjustment of the temperature of each set area in each layer, the degree of freedom for temperature control for temperature uniformity can be increased.

[0097] As described above, this invention has been illustrated with specific details and limited embodiments, such as specific constituent elements, and accompanying drawings. However, this is only provided to facilitate a more comprehensive understanding of the invention. The invention is not limited to the described embodiments, and various modifications and variations can be made by those skilled in the art without departing from the essential characteristics of the invention. Therefore, the concept of the invention should not be limited to the illustrated embodiments, and all technical ideas equivalent to or having equivalent variations of the appended claims should be interpreted as included within the scope of the invention.

Claims

1. A base, wherein, Including an insulating board with multiple layers of heating elements stacked together. The plurality of heating element layers include: A first heating element layer has a first pattern, the first pattern including a first resistive portion and a first connecting portion connected between a first terminal pair; and The second heating element layer has a second pattern, the second pattern including a second resistive portion and a second connecting portion connected between the second terminal pairs. The first connecting portion connects to either the end of the first resistive portion or any one of the terminals in the first terminal pair; the second connecting portion connects to either the end of the second resistive portion or any one of the terminals in the second terminal pair. The first resistive portion and the second resistive portion each include a plurality of arcuate portions extending in a circumferential direction and a plurality of folded portions for connecting the plurality of arcuate portions. In the portion of the first pattern where the plurality of folds are opposite, only one of the first connecting portions is arranged to extend diametrically relative to the center of the insulating plate. In the portion of the second pattern where the plurality of folds are opposite, only one of the second connecting portions is arranged to extend diametrically relative to the center of the insulating plate. The first connecting portion, the plurality of arc portions, and the plurality of fold portions of the first pattern and the second connecting portion, the plurality of arc portions, and the plurality of fold portions of the second pattern do not overlap in the stacking direction.

2. The base according to claim 1, wherein, When the arcuate portions of the first resistor and the second resistor are projected onto the plane of the insulating plate, the arcuate portion of the second resistor is located between the arcuate portions of the first resistor.

3. The base according to claim 1, wherein, The first connecting portion and the second connecting portion are arranged radially at different angles relative to the center of the insulating plate.

4. The base according to claim 1, wherein, The plurality of heating element layers further includes a third heating element layer, the third heating element layer having a third pattern, the third pattern including a third resistive portion and a third connecting portion connected between third terminal pairs. The third connecting portion connects the end of the third resistor portion to any one of the terminals of the third terminal pair, and the third resistor portion includes a plurality of arc portions extending in the circumferential direction and a plurality of fold portions for connecting the arc portions.

5. The base according to claim 4, wherein, When the arc portion of the first resistor, the arc portion of the second resistor, and the arc portion of the third resistor are projected onto the plane of the insulating plate, the arc portion of the third resistor is located between the arc portions of the first resistor and the arc portions of the second resistor.

6. The base according to claim 4, wherein, The first connecting portion, the second connecting portion, and the third connecting portion are arranged radially at different angles relative to the center of the insulating plate.

7. The base according to claim 1, wherein, The first pattern and the second pattern are respectively set in one or more segmented setting areas of the same number.

8. The base according to claim 1, wherein, The first pattern and the second pattern are respectively set in one or more segmented setting areas of different numbers.

9. The base according to claim 1, wherein, The first connecting part and the second connecting part each include a waveform connecting line.

10. The base according to claim 1, wherein, One or more first patterns and one or more second patterns are respectively disposed in mutually distinct placement areas without interlayer overlap and include the arc portion and the fold portion that are symmetrical about the center. The first connecting portion and the second connecting portion are arranged radially at different angles relative to the center.

11. The base according to claim 10, wherein, The two connecting portions of the first heating element layer are arranged at 180° to each other in the outer direction of the diameter, and the two connecting portions of the second heating element layer are arranged at 180° to each other in the outer direction of the diameter, and the extension lines of the two connecting portions of the first heating element layer are perpendicular to the extension lines of the two connecting portions of the second heating element layer.

12. A base, wherein, Including an insulating plate with a heating element, The heating element comprises multiple patterns disposed in multiple segmented areas on the same plane. Each pattern includes a first terminal, a second terminal, a resistive portion connecting the first terminal and the second terminal, and a connecting portion. Each of the connecting portions connects to the other end of the corresponding resistor portion that is connected to the first terminal and to the second terminal. Each of the resistors includes a plurality of arcuate portions extending in a circumferential direction and a plurality of folded portions for connecting the plurality of arcuate portions. The connecting portion of each pattern extends diametrically relative to the center of the insulating plate, such that only one connecting portion is provided at the opposite portion of the plurality of folds between any two patterns.

13. The base according to claim 12, wherein, The connecting portions of each pattern are arranged radially at different angles relative to the center of the insulating plate.

14. The base according to claim 12, wherein, Each of the patterns includes a connecting line with a waveform.

Images