An optoelectronic co-packaged module packaging structure

Abstract

This invention provides a co-packaged optoelectronic module packaging structure, comprising a packaging substrate, an optoelectronic module, and a carrier assembly. The optoelectronic module and the carrier assembly are both disposed above and electrically connected to the packaging substrate. The optoelectronic module includes a first / second optoelectronic unit extending along a first horizontal direction and vertically separated. At least one of the first / second optoelectronic units is connected to the carrier assembly, such that there is a predetermined vertical distance between them. This packaging structure, by setting the carrier assembly on the packaging substrate and electrically connecting at least one of the first / second optoelectronic units to the carrier assembly, utilizes the height difference formed by the carrier assembly to allow the two units to be independently distributed vertically. This enables multiple optical fibers to fan out within a small packaging space, avoiding bending and deformation of the optical fibers of different optoelectronic units due to the limited space, preventing fiber loss or breakage, and effectively ensuring the working quality and service life of the packaging structure.

Description

Technical Field

[0001] This invention belongs to the field of communication and semiconductor technology, and relates to a packaging structure for an optoelectronic co-packaged module. Background Technology

[0002] Co-packaged Optics (CPO) technology is a novel optoelectronic integration technology. Its core technology lies in packaging network switching chips and optical modules (or optical engines) together and assembling them in the same slot, forming a co-package of the chip and optical module. By packaging the switching chip and optical engine together, CPO technology can shorten the distance between the switching chip and the optical engine. Besides reducing size and improving efficiency, it also significantly shortens the electrical interconnect length, reduces signal loss and power consumption, and facilitates faster signal transmission between the chip and the engine, thus improving transmission efficiency. Based on this, CPO technology shows great potential and development prospects in the fields of optoelectronic information and optical communication.

[0003] Currently, the Optical Internetworking Forum (OIF) has released a protocol for 3.2Tb / s co-packaged modules, requiring optical transceivers to support 8×400GBASE-FR4 or 8×400GBASE-DR4, while also imposing strict limitations on the width dimension of the CPO package structure (it must have a relatively small package width). However, CPO package structures manufactured under these conditions often exhibit data transmission quality and speed significantly lower than expected design values ​​in practical applications. Occasionally, the lifespan or service life of the CPO package structure even falls short of its design life.

[0004] Therefore, how to provide a co-packaged optoelectronic module packaging structure to improve the working quality and service life of the CPO packaging structure has become an important technical problem that needs to be solved by those skilled in the art.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an optoelectronic co-package module packaging structure to solve the problem that the working quality and service life of the existing CPO packaging structure need to be improved.

[0007] To achieve the above and other related objectives, the present invention provides an optoelectronic co-packaging module packaging structure, comprising:

[0008] Packaging substrate;

[0009] An optoelectronic module is disposed above the packaging substrate and electrically connected to the packaging substrate. The optoelectronic module includes a first optoelectronic unit and a second optoelectronic unit that extend along a first horizontal direction and are separately disposed in the vertical direction.

[0010] A carrier assembly is disposed above the packaging substrate and electrically connected to the packaging substrate. At least one of the first photoelectric unit and the second photoelectric unit is connected to the carrier assembly, such that the first photoelectric unit and the second photoelectric unit have a preset distance in the vertical direction.

[0011] Optionally, there are multiple first photoelectric units and multiple second photoelectric units, with the multiple first photoelectric units spaced apart in the second horizontal direction and the multiple second photoelectric units spaced apart in the second horizontal direction.

[0012] Optionally, the carrier assembly includes a first carrier, the first photoelectric unit is connected to the side of the first carrier away from the packaging substrate, and the second photoelectric unit is located on one side of the first carrier in a first horizontal direction.

[0013] Optionally, the carrier assembly further includes a second carrier, the second photoelectric unit being connected to the side of the second carrier facing away from the packaging substrate, and the side of the second carrier facing away from the packaging substrate being lower than the side of the first carrier facing away from the packaging substrate.

[0014] Optionally, the first carrier plate and the second carrier plate are disposed separately, or the first carrier plate and the second carrier plate are separately connected in a first horizontal direction, or the first carrier plate and the second carrier plate are integrally formed.

[0015] Optionally, the first carrier board and / or the second carrier board are integrally formed with the packaging substrate, or the first carrier board and / or the second carrier board are separately connected to the packaging substrate, wherein the separate connection method includes at least one of FlipChip and gold wire connection.

[0016] Optionally, when there are multiple first photoelectric units and multiple second photoelectric units, the number of first carrier plates is less than or equal to the number of first photoelectric units, and the number of second carrier plates is less than or equal to the number of second photoelectric units. When there are multiple first carrier plates and multiple second carrier plates, the multiple first carrier plates and / or multiple second carrier plates are separately arranged, or the multiple first carrier plates and / or multiple second carrier plates are sequentially connected separately, or the multiple first carrier plates and / or multiple second carrier plates are integrally formed.

[0017] Optionally, the carrier assembly includes a recessed carrier having a first recess that opens from one side of the recessed carrier toward the encapsulation substrate and extends upward, and the first recess penetrates at least one side of the recessed carrier in a first horizontal direction.

[0018] Optionally, the first photoelectric unit is connected to the side of the grooved carrier plate opposite to the packaging substrate, and the second photoelectric unit extends into the first groove along a first horizontal direction and is connected to the bottom of the first groove; or, the first photoelectric unit is connected to the side of the grooved carrier plate opposite to the packaging substrate, and the second photoelectric unit extends into the bottom of the first groove along a first horizontal direction and is connected to the packaging substrate; or, the first photoelectric unit extends into the first groove along a first horizontal direction and is connected to the bottom of the first groove, and the second photoelectric unit extends into the bottom of the first groove along a first horizontal direction and is connected to the packaging substrate.

[0019] Optionally, the grooved carrier plate further includes a second groove, which opens from the bottom of the first groove and extends upward, and the second groove also penetrates one side of the grooved carrier plate in a first horizontal direction. The first photoelectric unit extends into the first groove in the first horizontal direction and is connected to the bottom of the first groove, and the second photoelectric unit extends into the second groove in the first horizontal direction and is connected to the bottom of the second groove.

[0020] Optionally, when there are multiple first photoelectric units and multiple second photoelectric units, the number of grooved carrier plates is less than or equal to the number of the first photoelectric units and the number of the second photoelectric units. When there are multiple grooved carrier plates, the multiple grooved carrier plates are separately arranged, or the multiple grooved carrier plates are sequentially connected in the second horizontal direction, or the multiple grooved carrier plates are integrally formed.

[0021] Optionally, both the first optoelectronic unit and the second optoelectronic unit include an electrical chip, an optical chip, and an optical fiber array, wherein the electrical chip is electrically connected to the optical chip, and the optical fiber array is connected to the optical chip to input optical signals to the optical chip or output optical signals generated by the optical chip; the carrier assembly includes at least one of a semiconductor carrier, a ceramic carrier, and an organic carrier.

[0022] Optionally, the electrical chip and the optical chip are electrically connected by gold wire connection; the electrical chip includes at least one of a transimpedance amplifier and a driver, the optical chip includes at least one of an optical emitting chip and an optical receiving chip; the fiber array includes at least one of 2 channels, 4 channels, 8 channels, 16 channels and 32 channels.

[0023] As described above, the optoelectronic co-packaging module packaging structure of the present invention, by setting a carrier plate assembly on a packaging substrate, and then electrically connecting at least one of the first optoelectronic unit and the second optoelectronic unit to the carrier plate assembly, utilizes the height difference formed by the carrier plate assembly to allow the first optoelectronic unit and the second optoelectronic unit to be independently distributed vertically, realizing the fan-out of multiple optical fibers within a small packaging space, and avoiding the bending and deformation of optical fibers of different optoelectronic units due to the narrow space, thus avoiding problems such as optical fiber loss or breakage, and effectively ensuring the working quality and service life of the packaging structure. Furthermore, through diversified design of the carrier plate assembly structure, it can meet the packaging requirements of different types of optoelectronic co-packaging modules. The grooved carrier plate structure design can further improve the space utilization of the packaging structure and adapt to the miniaturization trend of packaging structures. Attached Figure Description

[0024] Figure 1 The diagram shown is a top view of a partial structure of the CPO package.

[0025] Figure 2 The diagram shown is a partial side view of the CPO package structure.

[0026] Figure 3 The diagram shown is a partial structural schematic of the optoelectronic co-packaging module packaging structure of the present invention in Embodiment 1.

[0027] Figure 4 The diagram shows a second partial structure of the optoelectronic co-packaging module packaging structure of the present invention in Embodiment 1.

[0028] Figure 5 The diagram shows a third partial structure of the optoelectronic co-packaging module packaging structure of the present invention in Embodiment 1.

[0029] Figure 6 The diagram shows a fourth partial structure of the optoelectronic co-packaging module packaging structure of the present invention in Embodiment 1.

[0030] Figure 7 The diagram shown is a partial structural schematic of the optoelectronic co-encapsulation module packaging structure of the present invention in Embodiment 2.

[0031] Figure 8 Displayed as Figure 7 The first vertical cross-sectional view of the structure shown is illustrated.

[0032] Figure 9 Displayed as Figure 7 The diagram shows a second vertical cross-section of the structure.

[0033] Figure 10 The diagram shown is a third partial structural diagram of the optoelectronic co-encapsulation module packaging structure of the present invention in Embodiment 2.

[0034] Figure 11 Displayed as Figure 10 A schematic diagram of a vertical cross-section of the structure shown.

[0035] Figure 12 The diagram shows a fourth partial structure of the optoelectronic co-encapsulation module packaging structure of the present invention in Embodiment 2.

[0036] Figure 13 Displayed as Figure 12 A schematic diagram of a vertical cross-section of the structure shown.

[0037] Figure 14 The diagram shown is a fifth partial structural diagram of the optoelectronic co-packaging module packaging structure of the present invention in Embodiment 2.

[0038] Explanation of reference numerals in the attached figures

[0039] 100 CPO package structure

[0040] 101 The first group of optoelectronic modules

[0041] 102 The next set of photoelectric modules

[0042] 103 Fiber Optics

[0043] 10 Packaging substrate

[0044] 20 Optoelectronic Modules

[0045] 21 First photoelectric unit

[0046] 211 electrical chip

[0047] 212 Optical Chip

[0048] 213 Fiber Array

[0049] 2131 Fiber Optic

[0050] 22 Second photoelectric unit

[0051] 30 Carrier Plate Assembly

[0052] 31a First Carrier Board

[0053] 31b Second Carrier Board

[0054] 32 Groove Carrier Plate

[0055] 321 First Groove

[0056] 322 Second Groove Detailed Implementation

[0057] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0058] Please see Figures 1 to 14 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0059] Based on the technical issues mentioned in the background, analysis and verification revealed that, due to the standards or protocols established by OIF for CPO packaging structures, in order to integrate multiple sets of optoelectronic modules within the CPO packaging structure 100 within a relatively narrow width, a technical solution is adopted that staggers two sets of optoelectronic modules along the fiber extension direction. For example, ... Figure 1 As shown, however, this arrangement inevitably leads to the problem that the optical fiber 103 of the preceding group of optoelectronic modules 101 will obstruct the extension of the optical fiber 103 of the following group of optoelectronic modules 102. To avoid this problem, the optical fiber 103 of the following group of optoelectronic modules 102 is bent to bypass the obstruction area and ultimately coupled together with the optical fiber 103 of the preceding group of optoelectronic modules 101 into the same optical fiber interface for connection with the optical signal input / output connector during subsequent use, for example, as... Figure 2As shown, the optical fiber 103 of the latter group of optoelectronic modules 102 is bent twice to bypass the space where the former group of optoelectronic modules 101 is located. However, because the bending of the optical fiber 103 of the latter group of optoelectronic modules 102 increases the vertical distance between the optical fibers 103 of the two groups of optoelectronic modules, it is not conducive to simultaneously coupling into the optical fiber interface with a limited diameter. Therefore, the optical fiber 103 of the former group of optoelectronic modules 101 also needs to be bent to reduce the vertical distance between them so that they can be successfully coupled into the optical fiber interface. This will cause all the optical fibers 103 in the CPO packaging structure 100 to be bent, which may result in bending loss or even breakage. In actual use, this will cause problems such as increased transmission loss, signal transmission integrity and signal-to-noise degradation, which directly affect the signal quality and transmission efficiency of optical fiber transmission. At the same time, excessive bending will cause physical loss to the optical fiber (e.g., forming microcracks, causing material fatigue damage), which will lead to the problem of optical fiber breakage during subsequent use, thus affecting the service life of the CPO packaging structure.

[0060] Example 1

[0061] This embodiment provides a co-packaged optoelectronic module packaging structure (hereinafter referred to as "packaging structure"). Please refer to [link to relevant documentation]. Figures 3 to 6 The diagram shows several partial structural schematics of the encapsulation structure, which includes an encapsulation substrate 10, an optoelectronic module 20, and a carrier assembly 30.

[0062] Specifically, the optoelectronic module 20 is disposed above the packaging substrate 10 and electrically connected to the packaging substrate 10. The optoelectronic module 20 includes a first optoelectronic unit 21 and a second optoelectronic unit 22 extending along a first horizontal direction and separately disposed vertically. Figure 3 The X direction shown is "vertical". Figure 3 The carrier assembly 30 (shown in the Z direction, with the X direction perpendicular to the Z direction) is disposed above the packaging substrate 10 and electrically connected to the packaging substrate 10 (the carrier assembly 30 has an internal circuit structure that enables electrical connection between the optoelectronic module 20 and the packaging substrate 10). At least one of the first optoelectronic unit 21 and the second optoelectronic unit 22 is connected to the carrier assembly 30, such that the first optoelectronic unit 21 and the second optoelectronic unit 22 have a predetermined distance in the vertical direction. Figure 3 (as shown in a).

[0063] As an example, the preset distance is greater than 0.5mm (i.e., a > 0.5mm). Correspondingly, under the premise that the distance between the optical fiber of the first optoelectronic unit 21 and the optical fiber of the second optoelectronic unit 22 is greater than 0.5mm to satisfy the complete staggered distribution of the two optoelectronic units in the vertical space, the process difficulty of setting up the optoelectronic units can be reduced (i.e., ensuring the operation window during the installation of the optoelectronic units and avoiding contact or friction between the optical fibers of different optoelectronic units to avoid loss). The specific value of the preset distance can be reasonably set according to the application scenario of the packaging structure (including the volume requirements of the packaging structure, the connection requirements of the optical fiber of the optoelectronic unit and the optical signal input / output interface, etc.). The preset distance is preferably 0.8 to 1.5mm.

[0064] As an example, both the first optoelectronic unit 21 and the second optoelectronic unit 22 include an electrical chip 211, an optical chip 212, and an optical fiber array 213. The electrical chip 211 is electrically connected to the optical chip 212, and the optical fiber array 213 is connected to the optical chip 212 to input or output optical signals generated by the optical chip 212. Furthermore, when the first optoelectronic unit and the second optoelectronic unit are disposed on the packaging substrate, the free ends of the multiple optical fibers of the optical fiber array of each optoelectronic unit (i.e., the ends of the optical fibers furthest from the optical chip) preferably extend outside the packaging substrate to facilitate connection between the co-packaged module and a conventional structured optical input / output connector.

[0065] As an example, the electrical chip 211 includes at least one of a transimpedance amplifier and a driver, and the optical chip 212 includes at least one of a light emitting chip and a light receiving chip. In this embodiment, the optical chip of the first optoelectronic unit and the optical chip of the second optoelectronic unit are respectively a light emitting chip and a light receiving chip. At this time, the first optoelectronic unit and the second optoelectronic unit, which are distributed vertically, constitute an optoelectronic unit group and the optoelectronic unit group has both light emitting and light receiving functions.

[0066] As an example, the electrical chip 211 and the optical chip 212 are electrically connected by gold wire connection. Of course, in other embodiments, other suitable electrical connection methods can also be used between the two.

[0067] As an example, the fiber array 213 includes at least one of 2 channels, 4 channels, 8 channels, 16 channels, and 32 channels (i.e., the number of optical fibers contained in the fiber array is any of the above values). The specifications of the fiber array and the number of the first optoelectronic unit and the second optoelectronic unit are selected based on actual needs. For example, when used as a 1.6T co-packaged module, 32 optical fibers are required for signal transmission. In this case, the number of the first optoelectronic unit and the second optoelectronic unit are both set to two, and the fiber array specification of each optoelectronic unit is 8 channels. When used as a 3.2T co-packaged module, 64 optical fibers are required. Correspondingly, the number of the first optoelectronic unit and the second optoelectronic unit can be set to two, and the fiber array of each optoelectronic unit can be 16 channels.

[0068] As an example, the thickness of the packaging substrate 10 ranges from 0.8 to 1.5 mm, including but not limited to 1.0 mm and 1.2 mm, so that the packaging substrate can be miniaturized and lightweight while satisfying the requirement of having a basic circuit structure inside. The packaging substrate also has conductive bumps on its interior away from the optoelectronic module for electrical connection with other structures (please refer to [reference needed]). Figure 8 ).

[0069] As an example, the carrier assembly 30 includes at least one of a semiconductor carrier, a ceramic carrier, and an organic carrier, that is, the material of the carrier includes semiconductor materials, ceramic materials, organic materials, and other materials with a certain degree of rigidity.

[0070] As an example, there are multiple first photoelectric units 21 and multiple second photoelectric units 22. The multiple first photoelectric units 21 are spaced apart in the second horizontal direction, and the multiple second photoelectric units 22 are spaced apart in the second horizontal direction ("second horizontal direction" is...). Figure 3 As shown in the Y direction (in this embodiment, the Y direction is perpendicular to both the X and Z directions), further, the number of the first photoelectric unit 21 and the second photoelectric unit 22 are the same and they correspond one-to-one. In this embodiment, there are two of both the first photoelectric unit and the second photoelectric unit, but in other embodiments, there may be one or more of the first photoelectric unit and the second photoelectric unit, depending on actual needs.

[0071] For example, please refer to Figure 3 and Figure 4The diagram shows two partial structural schematics of the packaging structure when the carrier assembly only includes the first carrier plate. The carrier assembly 30 includes a first carrier plate 31a. The first photoelectric unit 21 is connected to the side of the first carrier plate 31a away from the packaging substrate 10. The second photoelectric unit 22 is located on one side of the first carrier plate 31a in the first horizontal direction. At this time, the arrangement of the first carrier plate 31a makes the first photoelectric unit 21 higher than the second photoelectric unit 22, thereby realizing the independent distribution of the two photoelectric units in the vertical space.

[0072] Furthermore, when the carrier assembly 30 includes only the first carrier 31a, the thickness range of the first carrier 31a is ( Figure 3 and Figure 4 As shown in b), the distance is 0.5mm to 2.5mm, including but not limited to 0.8mm, 1.2mm, 1.6mm, and 2.2mm. That is, the vertical distance between the first photoelectric unit and the second photoelectric unit is within the above-mentioned numerical range, and is reasonably set by taking into account other factors while ensuring that the two are staggered in vertical space.

[0073] For example, please refer to Figure 5 and Figure 6 The diagram shows two partial structural schematics of the carrier assembly in the encapsulation structure, including a first carrier and a second carrier. The carrier assembly 30 further includes a second carrier 31b. The second photoelectric unit 22 is connected to the side of the second carrier 31b facing away from the encapsulation substrate 10. The side of the second carrier 31b facing away from the encapsulation substrate 10 is lower than the side of the first carrier 31a facing away from the encapsulation substrate 10 (in this embodiment, this can be considered as the thickness of the first carrier 31a being greater than the thickness of the second carrier 31b, such as...). Figure 5 and Figure 6 (As shown, c > d).

[0074] Furthermore, when the carrier assembly 30 includes both a first carrier 31a and a second carrier 31b, the thickness range of the first carrier 31a is ( Figure 5 and Figure 6 The thickness (as shown in c) is 1.5mm to 2.5mm, including but not limited to 1.6mm, 1.8mm, 2.0mm, and 2.2mm; the thickness range of the second carrier plate 31b is ( Figure 5 and Figure 6 (As shown in d) is 0.5mm to 1mm, including but not limited to 0.6mm and 0.8mm. It can be set according to actual needs, provided that the two are staggered in the vertical space.

[0075] As an example, the first carrier plate 31a and the second carrier plate 31b are disposed separately (e.g. Figure 5(as shown), or, the first carrier plate 31a and the second carrier plate 31b are separately connected in the first horizontal direction (as shown). Figure 6 (as shown), or, the first carrier plate 31a and the second carrier plate 31b are integrally formed (as shown). Figure 6 (As shown). Separate settings or separate connections allow for flexible design of the internal structure of the encapsulation structure according to actual conditions, while a one-piece molding method can ensure the overall structural stability and consistency of the carrier board assembly. Therefore, the choice should be made according to actual needs in practical applications.

[0076] Furthermore, the separate connection method between the first carrier plate 31a and the second carrier plate 31b includes at least one of bonding connection, adhesive bonding and fastener connection or other suitable connection methods in the prior art.

[0077] As an example, the first carrier plate 31a and / or the second carrier plate 31b are integrally formed with the packaging substrate 10, for example, such as Figure 4 As shown, the first carrier plate is integrally formed with the packaging substrate. In this case, the packaging substrate can be considered to be stepped, and the protruding stepped structure therein is the first carrier plate. Alternatively, the first carrier plate 31a and / or the second carrier plate 31b are separately connected to the packaging substrate 10 (e.g., Figure 3 , Figure 5 and Figure 6 As shown), and the split connection method includes FlipChip (see reference). Figure 8 At least one of the following: ) and gold wire connection.

[0078] As an example, when there are multiple first photoelectric units 21 and multiple second photoelectric units 22, the number of first carrier plates 31a is less than or equal to the number of first photoelectric units 21, and the number of second carrier plates 31b is less than or equal to the number of second photoelectric units 22. When there are multiple first carrier plates 31a and multiple second carrier plates 31b, the multiple first carrier plates 31a and / or the multiple second carrier plates 31b are separately arranged (e.g., ...). Figure 3 and Figure 5 (as shown), or, multiple first carrier plates 31a and / or multiple second carrier plates 31b are sequentially connected separately (as shown). Figure 4 and Figure 6 (as shown), or, multiple first carrier plates 31a and / or multiple second carrier plates 31b are integrally formed (as shown). Figure 4 and Figure 6(As shown). That is, when there are multiple first photoelectric units, if there is only one first carrier plate, all the first photoelectric units are connected to the first carrier plate; if the number of first carrier plates and the number of first photoelectric units are the same, then one first photoelectric unit is provided on each first carrier plate; if there are more than one first carrier plate but fewer than the number of first photoelectric units, then the multiple first photoelectric units are grouped and respectively provided on the corresponding first carrier plates, and the distribution of the second carrier plates and the second photoelectric units corresponds to the above. When multiple first carrier plates and multiple second carrier plates are sequentially connected, and the first carrier plates and second carrier plates correspondingly provided in the first horizontal direction are also connected, it is equivalent to the carrier plate assembly being an integral structure. In this case, the carrier plate assembly has a stepped structure, and the first photoelectric units and the second photoelectric units are respectively distributed on different step surfaces of the stepped structure.

[0079] Furthermore, it should be noted that although the first optoelectronic unit and the second optoelectronic unit are aligned at least at one end in all the figures of this embodiment, in reality, provided that the optical fibers of the first optoelectronic unit and the second optoelectronic unit are successfully coupled into the optical fiber interface to output optical signals, the first optoelectronic unit and the second optoelectronic unit may not be aligned at both ends.

[0080] The optoelectronic co-packaging module packaging structure of this embodiment utilizes a carrier board assembly on a packaging substrate. At least one of the first and second optoelectronic units is electrically connected to the carrier board assembly. The height difference created by the carrier board assembly allows the first and second optoelectronic units to be independently distributed vertically (staggered in vertical space). This enables multiple optical fibers to fan out within a smaller packaging space, preventing bending and deformation of the optical fibers from different optoelectronic units due to the confined space. This avoids fiber loss or breakage, effectively ensuring the working quality and lifespan of the packaging structure. Furthermore, through diverse designs of the carrier board assembly structure, the packaging requirements of different types of optoelectronic co-packaging modules can be met.

[0081] Example 2

[0082] This embodiment provides a co-packaged optoelectronic module packaging structure. The difference from Embodiment 1 is that the carrier board assembly in this embodiment includes a grooved carrier board, while the carrier board assembly in Embodiment 1 includes a carrier board without grooves. Please refer to [link to previous document]. Figures 7 to 14 The diagram shows several partial structural schematics of the encapsulation structure, including the encapsulation substrate 10, the optoelectronic module 20, and the carrier assembly 30.

[0083] Specifically, the photoelectric module 20 is disposed above and electrically connected to the packaging substrate 10. The photoelectric module 20 includes a first photoelectric unit 21 and a second photoelectric unit 22 extending along a first horizontal direction and separately disposed vertically. The carrier assembly 30 is disposed above and electrically connected to the packaging substrate 10. At least one of the first photoelectric unit 21 and the second photoelectric unit 22 is connected to the carrier assembly 30, such that the first photoelectric unit 21 and the second photoelectric unit 22 have a predetermined distance in the vertical direction. Figure 8 (as shown in a).

[0084] As an example, the carrier plate assembly 30 includes a recessed carrier plate 32; see [link to relevant documentation]. Figures 7 to 11 The diagram shows a partial structural schematic of the grooved carrier plate when it only includes the first groove. The grooved carrier plate 32 has a first groove 321, which opens from the side of the grooved carrier plate 32 toward the packaging substrate 10 and extends upward, and the first groove 321 at least penetrates one side of the grooved carrier plate 32 in a first horizontal direction.

[0085] Furthermore, such as Figures 7 to 9 As shown, the first groove 321 partially penetrates the grooved carrier plate 32 in the first horizontal direction (i.e., only penetrates one side), or, as... Figure 10 and Figure 11 As shown, the first groove 321 completely penetrates the grooved carrier plate 32 in the first horizontal direction (i.e., it penetrates both sides simultaneously).

[0086] As an example, the thickness range of the grooved carrier plate 32 ( Figure 8 The thickness (as shown in e) is 1.5mm to 2.5mm, including but not limited to 1.6mm, 1.8mm, 2.0mm and 2.2mm. The grooved carrier plate is set to the above thickness, which is a numerical range summarized after comprehensively considering the internal circuit structure, sufficient load-bearing capacity of the connected optoelectronic unit, sufficient groove space and the overall volume of the packaging structure.

[0087] As an example, see also Figure 7 and Figure 8 , Figure 8 Displayed as Figure 7 The diagram shows a vertical cross-sectional view of the structure, in which the first photoelectric unit 21 is connected to the side of the grooved carrier plate 32 facing away from the packaging substrate 10, and the second photoelectric unit 22 extends into the first groove 321 along a first horizontal direction and is connected to the bottom of the first groove 321; or, in conjunction with the above... Figure 7 and Figure 9 , Figure 9 Displayed as Figure 7The diagram shows another vertical cross-sectional view of the structure. The first photoelectric unit 21 is connected to the side of the grooved carrier plate 32 facing away from the packaging substrate 10. The second photoelectric unit 22 extends into the first groove 321 along a first horizontal direction and is connected to the packaging substrate 10. Alternatively, the first photoelectric unit 21 extends into the first groove 321 along a first horizontal direction and is connected to the bottom of the groove 321. The second photoelectric unit 22 extends into the first groove 321 along a first horizontal direction and is connected to the packaging substrate 10. (Not shown in the attached diagram; please refer to the reference diagram.) Figure 8 and Figure 9 (To understand).

[0088] For example, please refer to Figure 12 and Figure 13 The diagram shows a partial structural schematic of the grooved carrier plate including a first groove and a second groove. The grooved carrier plate 32 also includes a second groove 322. The second groove 322 opens from the bottom of the first groove 321 and extends upward (i.e., the vertical projection of the second groove 322 is within the vertical projection range of the first groove 321). The second groove 322 also penetrates one side of the grooved carrier plate 32 in a first horizontal direction (when the first groove 321 also partially penetrates the grooved carrier plate 32, the side penetrated by the first groove 321 and the second groove 322 is the same side). The first photoelectric unit 21 extends into the first groove 321 along the first horizontal direction and is connected to the bottom of the first groove 321. The second photoelectric unit 22 extends into the second groove 322 along the first horizontal direction and is connected to the bottom of the second groove 322.

[0089] As an example, the depth range of the first groove 321 ( Figure 8 The depth of the second groove (as shown in f) is 0.5mm to 1mm, including but not limited to 0.6mm and 0.8mm. The depth of the second groove is reasonably set while ensuring that the preset distance is greater than 0.5mm, and is not specifically limited here.

[0090] As an example, when there are multiple first photoelectric units 21 and multiple second photoelectric units 22, the number of grooved carrier plates 32 is less than or equal to the number of the first photoelectric units 21 and the number of the second photoelectric units 22. Specifically, when there are multiple grooved carrier plates 32, they are either separately arranged, or sequentially connected in the second horizontal direction (the methods of separate arrangement and connection are not shown in the accompanying drawings; please refer to the relevant drawings in Embodiment 1 for understanding), or the multiple grooved carrier plates 32 are integrally formed (e.g., ...). Figure 12(As shown). When multiple grooved carrier plates are integrally formed, it can be considered that a planar carrier plate has multiple groove structures extending along a first horizontal direction and spaced apart in a second horizontal direction on one side facing the packaging substrate (the groove structure may include only the first groove or both the first and second grooves). When there is only one grooved carrier plate, correspondingly, as shown... Figure 14 As shown (please refer to the following) Figure 12 In this configuration, the first groove is only one (and in the case of a second groove, there is also only one second groove). In this case, the grooved carrier plate is equivalent to having a blind groove on the side facing the packaging substrate, and the bottom of the blind groove is either a flat surface (corresponding to the case of only one first groove) or a stepped surface (corresponding to the case of having one first groove and one second groove). The structure is simple and easy to manufacture. Furthermore, corresponding to Embodiment 1, when there is more than one grooved carrier plate but fewer than the number of the first and second photoelectric units, multiple photoelectric units can be grouped and distributed on different grooved carrier plates. Preferably, the number of grooved carrier plates is more than one, equivalent to having multiple grooves with a supporting structure between adjacent grooves in the second horizontal direction, to ensure the structural stability of the grooved carrier plate, thereby ensuring the structural stability of the packaging structure.

[0091] The optoelectronic co-packaging module packaging structure of this embodiment, based on the packaging structure of Embodiment 1, further adjusts the structure of the carrier board assembly. Under the premise that the height difference formed by the carrier board assembly allows the first optoelectronic unit and the second optoelectronic unit to be independently distributed in the vertical direction (distributed staggered in the vertical space), a groove is provided on the side of the carrier board assembly facing the packaging substrate to allow different optoelectronic units to be embedded and connected, further improving the space utilization of the packaging structure and adapting to the miniaturization trend of the packaging structure.

[0092] In summary, the optoelectronic co-packaging module packaging structure of the present invention, by setting a carrier plate assembly on the packaging substrate and electrically connecting at least one of the first optoelectronic unit and the second optoelectronic unit to the carrier plate assembly, utilizes the height difference formed by the carrier plate assembly to allow the first optoelectronic unit and the second optoelectronic unit to be independently distributed vertically. This achieves multiple optical fibers fanning out within a small packaging space and avoids bending and deformation of the optical fibers of different optoelectronic units due to the limited space, thus avoiding fiber loss or breakage and effectively ensuring the working quality and service life of the packaging structure. Furthermore, through diversified design of the carrier plate assembly structure, it can meet the packaging requirements of different types of optoelectronic co-packaging modules. The grooved carrier plate structure design can further improve the space utilization of the packaging structure and adapt to the miniaturization trend of packaging structures. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0093] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A co-packaged optoelectronic module packaging structure, characterized in that, include: Packaging substrate; An optoelectronic module is disposed above the packaging substrate and electrically connected to the packaging substrate. The optoelectronic module includes a first optoelectronic unit and a second optoelectronic unit that extend along a first horizontal direction and are separately disposed in the vertical direction. A carrier assembly is disposed above the encapsulation substrate and electrically connected to the encapsulation substrate. At least one of the first photoelectric unit and the second photoelectric unit is connected to the carrier assembly, such that the first photoelectric unit and the second photoelectric unit have a preset distance in the vertical direction. The carrier assembly includes a grooved carrier plate having a first groove. The first groove opens from the side of the grooved carrier plate facing the encapsulation substrate and extends upward, and the first groove penetrates at least one side of the grooved carrier plate in a first horizontal direction. A first photoelectric unit is connected to the side of the grooved carrier plate opposite to the encapsulation substrate, and a second photoelectric unit extends into the first groove along the first horizontal direction and is connected to the bottom of the first groove. The grooved carrier plate further includes a second groove, which opens from the bottom of the first groove and extends upward, and the second groove also penetrates one side of the grooved carrier plate in a first horizontal direction. The first photoelectric unit extends into the first groove in the first horizontal direction and is connected to the bottom of the first groove, and the second photoelectric unit extends into the second groove in the first horizontal direction and is connected to the bottom of the second groove.

2. The optoelectronic co-packaging module packaging structure according to claim 1, characterized in that: There are multiple first photoelectric units and multiple second photoelectric units, with the multiple first photoelectric units spaced apart in the second horizontal direction and the multiple second photoelectric units spaced apart in the second horizontal direction.

3. The optoelectronic co-packaging module packaging structure according to claim 1 or 2, characterized in that: The carrier assembly includes a first carrier, the first photoelectric unit is connected to the side of the first carrier away from the packaging substrate, and the second photoelectric unit is located on one side of the first carrier in a first horizontal direction.

4. The optoelectronic co-packaging module packaging structure according to claim 3, characterized in that: The carrier assembly further includes a second carrier, the second photoelectric unit is connected to the side of the second carrier away from the packaging substrate, and the side of the second carrier away from the packaging substrate is lower than the side of the first carrier away from the packaging substrate.

5. The optoelectronic co-packaging module packaging structure according to claim 4, characterized in that: The first carrier plate and the second carrier plate are disposed separately, or the first carrier plate and the second carrier plate are separately connected in a first horizontal direction, or the first carrier plate and the second carrier plate are integrally formed.

6. The optoelectronic co-packaging module packaging structure according to claim 4, characterized in that: The first carrier and / or the second carrier are integrally formed with the packaging substrate, or the first carrier and / or the second carrier are separately connected to the packaging substrate, wherein the separate connection method includes at least one of flip chip and gold wire connection.

7. The optoelectronic co-packaging module packaging structure according to claim 6, characterized in that: When there are multiple first photoelectric units and multiple second photoelectric units, the number of first carrier plates is less than or equal to the number of first photoelectric units, and the number of second carrier plates is less than or equal to the number of second photoelectric units. When there are multiple first carrier plates and multiple second carrier plates, the multiple first carrier plates and / or multiple second carrier plates are separately arranged, or the multiple first carrier plates and / or multiple second carrier plates are sequentially connected separately, or the multiple first carrier plates and / or multiple second carrier plates are integrally formed.

8. The optoelectronic co-packaging module packaging structure according to claim 1, characterized in that: The first photoelectric unit is connected to the side of the grooved carrier plate opposite to the packaging substrate, and the second photoelectric unit extends into the first groove along a first horizontal direction and is connected to the bottom of the first groove. Alternatively, the first photoelectric unit is connected to the side of the grooved carrier plate opposite to the packaging substrate, and the second photoelectric unit extends into the bottom of the first groove along a first horizontal direction and is connected to the packaging substrate. Alternatively, the first photoelectric unit extends into the first groove along a first horizontal direction and is connected to the bottom of the first groove, and the second photoelectric unit extends into the bottom of the first groove along a first horizontal direction and is connected to the packaging substrate.

9. The optoelectronic co-packaging module packaging structure according to claim 1, characterized in that: When there are multiple first photoelectric units and multiple second photoelectric units, the number of grooved carrier plates is less than or equal to the number of the first photoelectric units and the number of the second photoelectric units. When there are multiple grooved carrier plates, the multiple grooved carrier plates are set separately, or the multiple grooved carrier plates are connected separately in the second horizontal direction, or the multiple grooved carrier plates are integrally formed.

10. The optoelectronic co-packaging module packaging structure according to claim 1, characterized in that: Both the first optoelectronic unit and the second optoelectronic unit include an electrical chip, an optical chip, and an optical fiber array. The electrical chip is electrically connected to the optical chip, and the optical fiber array is connected to the optical chip to input optical signals to the optical chip or output optical signals generated by the optical chip. The carrier assembly includes at least one of a semiconductor carrier, a ceramic carrier, and an organic carrier.

11. The optoelectronic co-packaging module packaging structure according to claim 10, characterized in that: The electrical connection between the electrical chip and the optical chip includes gold wire connection; the electrical chip includes at least one of a transimpedance amplifier and a driver, and the optical chip includes at least one of an optical emitting chip and an optical receiving chip; the fiber array includes at least one of 2 channels, 4 channels, 8 channels, 16 channels and 32 channels.

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