An impedance matching method, system, terminal and medium for an MPCVD device

Abstract

This application relates to the field of microwave impedance matching technology, and discloses an impedance matching method, system, terminal, and medium for an MPCVD device. The impedance matching method for the MPCVD device includes: acquiring the initial reflected power of the MPCVD device during operation; if the initial reflected power is greater than a preset threshold, adjusting the position of the three pins multiple times to obtain the current reflected power data of the MPCVD device; determining the target reflected power based on the current reflected power data, wherein the target reflected power is less than the preset threshold; and adjusting the three pins to the target position based on the target reflected power to complete the impedance matching of the MPCVD device. This application can achieve high-precision impedance matching.

Description

Technical Field

[0001] This application relates to the field of microwave impedance matching technology, and in particular to an impedance matching method, system, terminal and storage medium for an MPCVD device. Background Technology

[0002] In MPCVD (Microwave Plasma Assisted Chemical Vapor Deposition) equipment, microwaves are coupled into the reaction chamber via waveguides to excite gases and form plasma for the growth of high-quality diamond films. To achieve efficient energy transfer and avoid damage to the microwave source, it is essential to ensure the microwave system is in a good impedance-matched state, i.e., minimizing reflected power. Traditional equipment commonly uses a "triple stub tuner" for manual adjustment. The operator rotates three metal probes (pins) located on the waveguide to change their insertion depth, thereby adjusting the microwave field distribution and achieving impedance matching. However, this method has the following drawbacks: it relies on manual experience, requiring the operator to adjust based on experience and reflected power values, resulting in high subjectivity and poor consistency; the adjustment accuracy is low, as manual knobs cannot achieve sub-millimeter precision positioning, affecting the matching effect.

[0003] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0004] The main objective of this application is to provide an impedance matching method, system, terminal, and medium for MPCVD equipment, aiming to solve the problem of impedance mismatch in the medium microwave system caused by manual adjustment of the three pins in existing MPCVD equipment.

[0005] The first aspect of this application provides an impedance matching method for an MPCVD device, the impedance matching method for the MPCVD device comprising the following steps:

[0006] Obtain the initial reflection power of the MPCVD device during operation;

[0007] If the initial reflection power is greater than a preset threshold, the position of the three pins is adjusted multiple times to obtain the current reflection power data of the MPCVD device;

[0008] The target reflection power is determined based on the current reflection power data, wherein the target reflection power is less than the preset threshold.

[0009] The three pins are adjusted to the target position according to the target reflection power to complete the impedance matching of the MPCVD equipment.

[0010] Optionally, in one embodiment of this application, the current reflection power data includes a first reflection power, a second reflection power, and a third reflection power;

[0011] The process of repeatedly adjusting the positions of the three pins to obtain the current reflection power data of the MPCVD equipment specifically includes:

[0012] The positions of the three pins are adjusted for the first time to obtain the first reflection power of the MPCVD equipment, wherein the first reflection power is less than the initial reflection power;

[0013] The positions of the three pins are adjusted a second time to obtain the second reflection power of the MPCVD equipment;

[0014] The position of the three pins is adjusted a preset number of times to obtain at least one third reflection power of the MPCVD device.

[0015] Optionally, in one embodiment of this application, the process of first adjusting the position of the three pins to obtain the first reflection power of the MPCVD device further includes:

[0016] Acquire historical data from the MPCVD equipment;

[0017] Based on the initial reflected power and the historical data, the adjustment direction of the three pins is determined, and the position of the three pins is adjusted for the first time according to the adjustment direction.

[0018] Optionally, in one embodiment of this application, the first adjustment of the position of the three pins to obtain the first reflection power of the MPCVD device specifically involves:

[0019] The three pins are controlled to make a first adjustment to the front and middle sections of the device by a fixed step size along the adjustment direction, and the three pins are controlled to make a first adjustment to the tail section of the device by a dynamic step size along the adjustment direction, so as to obtain the first reflection power of the MPCVD device, wherein the fixed step size is greater than the dynamic step size.

[0020] The second adjustment of the position of the three pins to obtain the second reflection power of the MPCVD equipment is specifically as follows:

[0021] The three pins are controlled to perform a second front-middle section position adjustment by a fixed step size along the adjustment direction, and the three pins are controlled to perform a second tail section position adjustment by a dynamic step size along the adjustment direction to obtain the second reflection power of the MPCVD equipment.

[0022] The step of adjusting the position of the three pins a preset number of times to obtain at least one third reflection power of the MPCVD equipment specifically includes:

[0023] If the second reflection power is less than the first reflection power, then the three pins are controlled to perform a third adjustment of the front and middle sections by a fixed step size along the adjustment direction, and the three pins are controlled to perform a third adjustment of the tail section by a dynamic step size along the adjustment direction, so as to obtain the third reflection power of the MPCVD equipment.

[0024] If the second reflection power is greater than the first reflection power, then the three pins are controlled in the opposite direction of the adjustment direction to perform a third adjustment of the front and middle sections by a fixed step size, and the three pins are controlled in the opposite direction of the adjustment direction to perform a third adjustment of the tail section by a dynamic step size, so as to obtain the third reflection power of the MPCVD equipment.

[0025] Optionally, in one embodiment of this application, the preset number of times is multiple, and the number of third reflection powers is multiple;

[0026] Determining the target reflection power based on the current reflection power data specifically includes:

[0027] When the first reflection power, the second reflection power, and the third reflection power corresponding to the third position adjustment are all less than a preset threshold, a first difference between the second reflection power and the first reflection power is calculated, and a second difference between the third reflection power and the second reflection power is calculated. If both the first difference and the second difference are within a preset range, the minimum value among the first reflection power, the second reflection power, and the third reflection power is taken as the target reflection power; or when multiple consecutive third reflection powers are less than the preset threshold, the power difference between every two adjacent third reflection powers is calculated. If multiple power differences are within a preset range, the minimum value among the multiple consecutive third reflection powers is taken as the target reflection power; or

[0028] The minimum value among the first reflection power, the second reflection power, and the plurality of third reflection powers is taken as the target reflection power.

[0029] Optionally, in one embodiment of this application, adjusting the three pins to the target position according to the target reflection power specifically includes:

[0030] When the target reflection power is the third reflection power of the last time, the current position of the three pins corresponding to the third reflection power is taken as the target position;

[0031] When the target reflection power is not the same as the third reflection power of the last time, the target position of the three pins is determined according to the target reflection power, and the three pins are controlled to be adjusted to the target position.

[0032] Optionally, in one embodiment of this application, after adjusting the three pins to the target position according to the target reflection power, the method further includes:

[0033] Obtain the current process mode of the MPCVD equipment;

[0034] The target position is used as the set position corresponding to the current process mode, so that when the MPCVD equipment is in the current process mode again, the three pins will be adjusted to the corresponding set position.

[0035] A second aspect of this application also provides an impedance matching system for an MPCVD device, wherein the impedance matching system is applied to the impedance matching method for an MPCVD device as described in any of the above solutions; the impedance matching system for the MPCVD device includes:

[0036] The power acquisition module is used to acquire the initial reflected power of the MPCVD equipment during operation.

[0037] The power monitoring module is used to adjust the position of the three pins multiple times if the initial reflection power is greater than a preset threshold, so as to obtain the current reflection power data of the MPCVD equipment.

[0038] A power optimization module is used to determine a target reflection power based on the current reflection power data, wherein the target reflection power is less than the preset threshold.

[0039] The pin adjustment module is used to adjust the three pins to the target position according to the target reflection power, so as to complete the impedance matching of the MPCVD equipment.

[0040] A third aspect of this application also provides a terminal, wherein the terminal includes: a memory, a processor, and an impedance matching program for an MPCVD device stored in the memory and executable on the processor, wherein when the impedance matching program for the MPCVD device is executed by the processor, it implements the steps of the impedance matching method for the MPCVD device as described above.

[0041] A fourth aspect of this application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores an impedance matching program for an MPCVD device, and when the impedance matching program for the MPCVD device is executed by a processor, it implements the steps of the impedance matching method for the MPCVD device as described above.

[0042] Beneficial effects: This application provides an impedance matching method, system, terminal and medium for MPCVD equipment. By collecting the reflected power data of MPCVD equipment and electrically controlling the three pins to adjust their positions, the reflected power can be stably controlled, thereby ensuring efficient microwave energy transmission and achieving high-precision impedance matching. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the electric three-pin structure in the MPCVD equipment of this application;

[0045] Figure 2 This is a flowchart of a preferred embodiment of the impedance matching method for the MPCVD equipment of this application;

[0046] Figure 3 This is a structural diagram of a preferred embodiment of the impedance matching system of the MPCVD equipment in this application;

[0047] Figure 4 This is a structural diagram of a preferred embodiment of the terminal of this application.

[0048] Explanation of reference numerals in the attached figures:

[0049] 100. Power Acquisition Module; 200. Power Monitoring Module; 300. Power Optimization Module; 400. Pin Adjustment Module. Detailed Implementation

[0050] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only possible technical implementations of this application and not all possible implementations. Based on the embodiments in this application, those skilled in the art can obtain other embodiments without creative effort, and these embodiments are also within the protection scope of this application.

[0051] In related technologies, manual operation struggles to achieve high-precision adjustments to the three pin positions, resulting in low accuracy. This leads to inaccurate microwave reflection power adjustment, impacting the quality and consistency of diamond growth. When rapid adjustments to microwave reflection power are required based on process demands, manual operation is far slower than automated control systems, resulting in slow response times and missed optimal adjustment opportunities, affecting product quality. Prolonged fine-tuning can cause operator fatigue, especially with frequent adjustments, leading to high labor intensity, reduced efficiency, and increased error rates. Differences in individual operating habits and judgment standards make consistency difficult to guarantee, resulting in poor repeatability—a significant challenge for production processes requiring strict parameter control. Purely manual control typically lacks real-time data feedback, making it difficult for operators to understand the current working status and effects, hindering timely adjustments. In some situations, such as high-temperature, high-pressure, or hazardous environments, direct manual operation may pose a threat to operator health and safety. Compared to automated systems, manual control often requires more time to complete the same task, resulting in lower overall production efficiency. When operated manually, the response speed is slow, and it cannot respond in real time when the process changes dynamically (such as changes in gas composition, pressure, and temperature); the repeatability is poor, and the adjustment results vary greatly between different batches or different operators, affecting the stability of product quality; the labor intensity is high and there are safety hazards, as it is necessary to operate close to the microwave area when the equipment is running, which poses a risk of electromagnetic radiation.

[0052] As is understandable, MPCVD stands for Microwave Plasma Assisted Chemical Vapor Deposition. MPCVD equipment is a core component used for the growth of high-quality diamond thin films, achieving material deposition through microwave-excited plasma.

[0053] To address the problem of impedance mismatch in the medium microwave system caused by manual adjustment of the three pins in MPCVD equipment, this application collects the reflected power data of the MPCVD equipment and electrically controls the position adjustment of the three pins, thereby enabling stable control of the reflected power, ensuring efficient microwave energy transmission, and achieving high-precision impedance matching.

[0054] The technical solutions of this application will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0055] like Figure 1As shown, the MPCVD equipment described in the preferred embodiment of this application is equipped with an electric three-pin connector. Each pin connects to a transmission module consisting of a stepper motor and a coupling. The motor is fixed to a dedicated bracket on the outer wall of the waveguide, and the output shaft is connected to the original manual lead screw via a flexible coupling to achieve backlash-free transmission. Combined with a step angle motor with a minimum of 0.005492 degrees, high resolution can be achieved. This application employs a high-performance closed-loop stepper motor driver, supporting microstepping control (up to 64 microsteps), ensuring smooth and vibration-free operation, and possessing multi-axis synchronous control capabilities.

[0056] Furthermore, the pins, controlled by a motor, move up and down to adjust the microwave reflection path within the resonant cavity, optimizing plasma distribution. A connecting rod, a rigid component linking the three pins, ensures synchronized pin movement. A through-axis stepper motor, driven by a screw, moves the connecting rod up and down, achieving precise pin position adjustment (small lead, high accuracy). A limit ring, positioned on the outside of the connecting rod, prevents the pins from exceeding their travel range, protecting the equipment. In the cooling system, water-cooled copper pipes surround the pin area, circulating cooling water carrying away the heat generated by the high-temperature plasma, maintaining stable equipment temperature. Copper pipe clamps ensure reliable connection between the cooling pipes and the cavity, preventing leaks caused by vibration.

[0057] In this application, the three pins are arranged in an equilateral triangle with maximized spacing to improve positioning accuracy. The pin axes are perpendicular to the cavity axis to ensure the symmetry of microwave reflection. A stepper motor drives a connecting rod, causing the three pins to rise and fall synchronously, changing the distribution of the microwave field within the cavity, thereby controlling the density and uniformity of the plasma.

[0058] The impedance matching method for the MPCVD equipment described in the preferred embodiment of this application, such as... Figure 2 As shown, the impedance matching method for the MPCVD equipment includes the following steps:

[0059] In step S101, the initial reflection power of the MPCVD device during operation is obtained.

[0060] Specifically, after the MPCVD equipment is started, the system reads the initial reflected power in real time through the microwave detection module to determine the current impedance matching status.

[0061] In step S102, if the initial reflection power is greater than a preset threshold, the position of the three pins is adjusted multiple times to obtain the current reflection power data of the MPCVD device.

[0062] Specifically, if the initial reflected power exceeds a preset threshold, the automatic matching algorithm is triggered; otherwise, the system remains in standby mode. It is understood that users can customize the preset threshold to reflect the system's upper tolerance limit for reflected power. It is also understood that the preset threshold is a fixed value, the size of which is set according to actual requirements; it can be a percentage (e.g., 5%) or a fixed value, without specific limitations here.

[0063] In one possible implementation, the current reflection power data includes a first reflection power, a second reflection power, and a third reflection power. The positions of the three pins are adjusted a first time to obtain the first reflection power of the MPCVD device, wherein the first reflection power is less than the initial reflection power; the positions of the three pins are adjusted a second time to obtain the second reflection power of the MPCVD device; the positions of the three pins are adjusted a preset number of times to obtain at least one third reflection power of the MPCVD device.

[0064] In one possible implementation, before the first adjustment of the three pins' positions, historical data of the MPCVD device is acquired; based on the initial reflection power and the historical data, the adjustment direction of the three pins is determined, so that the positions of the three pins are adjusted for the first time according to the adjustment direction.

[0065] Specifically, the position of each pin is adjusted sequentially (e.g., slightly moved up or down), and the change in reflected power is observed. If the reflected power decreases after adjustment in a certain direction, it is marked as a favorable direction; if it increases, it is marked as an unfavorable direction. It can be understood that the three pins are adjusted simultaneously, and the feedback from the three directions is considered to select the globally optimal adjustment path.

[0066] In one possible implementation, during the first adjustment of the three pins, the three pins are controlled to adjust their front and middle sections by a fixed step size along the adjustment direction, and their tail sections are controlled to adjust their tail sections by a dynamic step size along the adjustment direction, thereby obtaining the first reflection power of the MPCVD equipment, wherein the fixed step size is greater than the dynamic step size. During the second adjustment, the three pins are controlled to adjust their front and middle sections by a fixed step size along the adjustment direction, and their tail sections are controlled to adjust their tail sections by a dynamic step size along the adjustment direction, thereby obtaining the second reflection power of the MPCVD equipment.

[0067] During the third adjustment, if the second reflection power is less than the first reflection power, the three pins are controlled to perform a third adjustment of the front-middle section position by a fixed step size along the adjustment direction, and the three pins are controlled to perform a third adjustment of the tail section position by a dynamic step size along the adjustment direction, to obtain the third reflection power of the MPCVD equipment; if the second reflection power is greater than the first reflection power, the three pins are controlled to perform a third adjustment of the front-middle section position by a fixed step size along the opposite direction of the adjustment direction, and the three pins are controlled to perform a third adjustment of the tail section position by a dynamic step size along the opposite direction of the adjustment direction, to obtain the third reflection power of the MPCVD equipment.

[0068] It can be understood that a fixed step size is a larger step size (such as 0.1 mm) used in the initial stage to quickly approach the optimal region; a dynamic step size is a step size that is gradually reduced (such as 0.01 mm) after approaching the optimal region to avoid oscillation.

[0069] Specifically, if the current reflection frequency is less than the previous reflection frequency, the adjustment continues in the current direction; if the current reflection frequency is greater than or equal to the previous reflection frequency, the adjustment is reversed or the step size is reduced.

[0070] In step S103, the target reflection power is determined based on the current reflection power data, wherein the target reflection power is less than the preset threshold.

[0071] In one possible implementation, the preset number of times is multiple, and the number of third reflection powers is multiple. When the first reflection power, the second reflection power, and the third reflection power corresponding to the third position adjustment are all less than a preset threshold, a first difference between the second reflection power and the first reflection power is calculated, and a second difference between the third reflection power and the second reflection power is calculated. If both the first difference and the second difference are within a preset range, the minimum value among the first reflection power, the second reflection power, and the third reflection power is taken as the target reflection power; or when multiple consecutive third reflection powers are less than the preset threshold, the power difference between every two adjacent third reflection powers is calculated. If multiple power differences are within a preset range, the minimum value among the multiple consecutive third reflection powers is taken as the target reflection power; or

[0072] The minimum value among the first reflection power, the second reflection power, and the plurality of third reflection powers is taken as the target reflection power.

[0073] Specifically, if the reflected power is below the threshold for N consecutive times (e.g., 3 times) and the fluctuation is less than the tolerance range (e.g., ±1%), the iteration terminates; or if the maximum number of adjustment steps (e.g., 50 steps) is reached, the iteration terminates to prevent infinite loops.

[0074] In step S104, the three pins are adjusted to the target position according to the target reflection power to complete the impedance matching of the MPCVD equipment.

[0075] In one possible implementation, when the target reflection power is the last third reflection power, the current position of the three pins corresponding to the third reflection power is taken as the target position; when the target reflection power is not the last third reflection power, the target position of the three pins is determined according to the target reflection power, and the three pins are controlled to be adjusted to the target position.

[0076] Specifically, once the termination condition is met, the matching is considered complete, and the motor stops moving.

[0077] In one possible implementation, the current process mode of the MPCVD equipment is obtained; the target position is used as the set position corresponding to the current process mode, so that when the MPCVD equipment is in the current process mode again, the three pins are adjusted to the corresponding set position.

[0078] Specifically, after the matching is completed, the current position of the three pins and the adjustment parameters (such as step size and convergence time) are recorded and saved to the process database for later reuse.

[0079] The specific implementation of this application will be described below with reference to a specific application scenario.

[0080] In automatic matching mode, the MPCVD equipment is started, and the plasma is ignited. The system reads the current reflection power r. p If r p If the reflected power exceeds the threshold, the automatic matching algorithm is activated. The controller employs a "hill-climbing method," gradually adjusting the positions of the three pins to find the point of minimum reflected power. The hill-climbing method is a feedback-based successive approximation optimization algorithm. Its core idea is: "Adjust the pin positions in the direction that reduces reflected power, gradually moving downhill until no better direction can be found." It does not rely on a system model, is simple to implement, and is particularly suitable for engineering problems like microwave matching where the input-output relationship is complex and difficult to model. When r p Once the reflected power remains consistently below a threshold for a certain period, adjustment is stopped. This threshold is defined as the point where the reflected power on the touchscreen is low enough that the value does not "jump." The optimal parameters for this operation are recorded for reuse in subsequent processes.

[0081] In the preset process mode, users can save multiple sets of "process recipes" in advance, including the target positions and matching conditions of the three pins; they can call them with one click under the same process conditions to achieve quick matching.

[0082] In this application, dual hardware and software limits are set to prevent motor overshoot; the current position is automatically remembered in case of abnormal power failure; electromagnetic compatibility design is adopted, the motor cable is shielded twisted pair cable, and it is kept away from microwave path; the emergency stop button can immediately cut off the power supply to all motors.

[0083] This application significantly improves matching accuracy, enabling micron-level positioning with a stepper motor and stable control of reflection power within 1%. It boasts a fast response speed, reducing the matching time from 5-10 minutes manually to 30-60 seconds. The process exhibits high repeatability, with good consistency in matching results across different batches, enhancing the uniformity and quality stability of the diamond film. This application reduces reliance on manual labor and operational experience, lowering training costs. It supports intelligent integration, connecting to factory MES systems for remote monitoring and data traceability. This application enhances safety by preventing close-range operation in a microwave environment, reducing occupational health risks. Finally, it extends equipment lifespan and reduces the risk of magnetron damage due to high reflection power.

[0084] Next, referring to the accompanying drawings, the impedance matching system of the MPCVD equipment proposed according to the embodiments of this application is described, and the impedance matching method of the MPCVD equipment applied to any one of the above schemes is described.

[0085] Figure 3 This is a structural diagram of the impedance matching system of the MPCVD device according to an embodiment of this application.

[0086] like Figure 3 As shown, the impedance matching system of the MPCVD equipment includes: a power acquisition module 100, a power monitoring module 200, a power optimization module 300, and a pin adjustment module 400.

[0087] Specifically, the power acquisition module 100 is used to acquire the initial reflected power when the MPCVD equipment is working;

[0088] The power monitoring module 200 is used to adjust the position of the three pins multiple times if the initial reflection power is greater than a preset threshold, so as to obtain the current reflection power data of the MPCVD equipment.

[0089] The power optimization module 300 is used to determine the target reflection power based on the current reflection power data, wherein the target reflection power is less than the preset threshold.

[0090] The pin adjustment module 400 is used to adjust the three pins to the target position according to the target reflection power in order to complete the impedance matching of the MPCVD equipment.

[0091] Figure 4 A structural diagram of a terminal provided in an embodiment of this application. The terminal may include:

[0092] The memory 501, the processor 502, and the computer program stored on the memory 501 and capable of running on the processor 502.

[0093] When the processor 502 executes the program, it implements the impedance matching method for the MPCVD device provided in the above embodiments.

[0094] Furthermore, the terminal also includes:

[0095] Communication interface 503 is used for communication between memory 501 and processor 502.

[0096] The memory 501 is used to store computer programs that can run on the processor 502.

[0097] Memory 501 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0098] If the memory 501, processor 502, and communication interface 503 are implemented independently, then the communication interface 503, memory 501, and processor 502 can be interconnected via a bus to complete communication between them. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EIS) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of representation, Figure 4 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0099] Optionally, in a specific implementation, if the memory 501, processor 502, and communication interface 503 are integrated on a single chip, then the memory 501, processor 502, and communication interface 503 can communicate with each other through an internal interface.

[0100] Processor 502 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement embodiments of this application.

[0101] This embodiment also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the impedance matching method for the MPCVD device described above.

[0102] One embodiment of this application provides a computer program product, including a computer program that, when executed by a processor, implements the features described in this application. Figure 2 The impedance matching method for MPCVD equipment provided in any of the corresponding embodiments.

[0103] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0104] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0105] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or N executable instructions for implementing custom logic functions or processes, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as should be understood by those skilled in the art to which embodiments of this application pertain.

[0106] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable storage medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable storage medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable storage medium could be paper or other suitable media on which the program can be printed, since the program can be obtained electronically by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0107] It should be understood that the various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0108] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0109] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0110] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

[0111] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method of impedance matching of an MPCVD apparatus, characterized by, The impedance matching method of the MPCVD device comprises: acquiring initial reflected power when the MPCVD device is working; if the initial reflected power is greater than a preset threshold, adjusting the positions of three pins for multiple times to obtain current reflected power data of the MPCVD device; determining a target reflected power according to the current reflected power data, wherein the target reflected power is less than the preset threshold; adjusting the three pins to target positions according to the target reflected power to complete impedance matching of the MPCVD device; the current reflected power data comprises first reflected power, second reflected power and third reflected power; the adjusting the positions of the three pins for multiple times to obtain the current reflected power data of the MPCVD device specifically comprises: adjusting the positions of the three pins for the first time to obtain the first reflected power of the MPCVD device, wherein the first reflected power is less than the initial reflected power; adjusting the positions of the three pins for the second time to obtain the second reflected power of the MPCVD device; adjusting the positions of the three pins for a preset number of times to obtain at least one third reflected power of the MPCVD device; the adjusting the positions of the three pins for the first time to obtain the first reflected power of the MPCVD device further comprises: acquiring historical data of the MPCVD device; determining an adjustment direction of the three pins according to the initial reflected power and the historical data to adjust the positions of the three pins for the first time according to the adjustment direction; the adjusting the positions of the three pins for the first time to obtain the first reflected power of the MPCVD device specifically comprises: controlling the three pins to adjust the positions of the first middle section for the first time by a fixed step length and controlling the three pins to adjust the positions of the tail section for the first time by a dynamic step length in the adjustment direction to obtain the first reflected power of the MPCVD device, wherein the fixed step length is greater than the dynamic step length; the adjusting the positions of the three pins for the second time to obtain the second reflected power of the MPCVD device specifically comprises: controlling the three pins to adjust the positions of the second middle section for the second time by a fixed step length and controlling the three pins to adjust the positions of the tail section for the second time by a dynamic step length in the adjustment direction to obtain the second reflected power of the MPCVD device; the adjusting the positions of the three pins for a preset number of times to obtain at least one third reflected power of the MPCVD device specifically comprises: if the second reflected power is less than the first reflected power, controlling the three pins to adjust the positions of the third middle section for the third time by a fixed step length and controlling the three pins to adjust the positions of the tail section for the third time by a dynamic step length in the adjustment direction to obtain the third reflected power of the MPCVD device; If the second reflected power is greater than the first reflected power, a third front-middle-stage position adjustment of the three pins is controlled in a reverse direction of the adjustment direction by a fixed step, and a third tail-stage position adjustment of the three pins is controlled in a reverse direction of the adjustment direction by a dynamic step, to obtain a third reflected power of the MPCVD device.

2. The method of impedance matching of an MPCVD apparatus according to claim 1, wherein, The preset number of times is multiple, and the number of the third reflected powers is multiple. The method further includes: When the first reflected power, the second reflected power, and the third reflected power corresponding to the third position adjustment are all less than a preset threshold, a first difference between the second reflected power and the first reflected power is calculated, and a second difference between the third reflected power and the second reflected power is calculated. If the first difference and the second difference are both within a preset range, a minimum value among the first reflected power, the second reflected power, and the third reflected power is taken as the target reflected power; or when the continuous multiple third reflected powers are all less than the preset threshold, a power difference between each adjacent two of the continuous multiple third reflected powers is calculated. If the multiple power differences are all within the preset range, a minimum value among the continuous multiple third reflected powers is taken as the target reflected power; or A minimum value among the first reflected power, the second reflected power, and the multiple third reflected powers is taken as the target reflected power.

3. The method of impedance matching of an MPCVD apparatus according to claim 2, wherein, The method further includes: When the target reflected power is the third reflected power of the last time, a current position of the three pins corresponding to the third reflected power is taken as the target position. When the target reflected power is not the third reflected power of the last time, a target position of the three pins is determined according to the target reflected power, and the three pins are controlled to be adjusted to the target position.

4. The method of impedance matching of an MPCVD apparatus according to claim 3, wherein, The method further includes: A current process mode of the MPCVD device is obtained. The target position is taken as a set position corresponding to the current process mode, so that the three pins are adjusted to the corresponding set position when the MPCVD device is in the current process mode next time.

5. An impedance matching system of an MPCVD apparatus, characterized by, The impedance matching system of the MPCVD device is applied to the impedance matching method of the MPCVD device according to any one of claims 1-4. The impedance matching system of the MPCVD device includes: A power acquisition module is configured to obtain an initial reflected power of the MPCVD device when the MPCVD device is working. A power monitoring module is configured to control the position of the three pins to be adjusted multiple times if the initial reflected power is greater than a preset threshold, to obtain current reflected power data of the MPCVD device. A power optimization module is configured to determine a target reflected power according to the current reflected power data, wherein the target reflected power is less than the preset threshold. A pin adjustment module is configured to adjust the three pins to a target position according to the target reflected power, to complete the impedance matching of the MPCVD device.

6. A terminal, characterized by comprising: The terminal comprises a memory, a processor, and an MPCVD device impedance matching program stored on the memory and executable on the processor, the MPCVD device impedance matching program, when executed by the processor, implementing the steps of the MPCVD device impedance matching method according to any one of claims 1-4.

7. A computer-readable storage medium, characterized in that, The computer readable storage medium stores an MPCVD device impedance matching program, the MPCVD device impedance matching program, when executed by the processor, implementing the steps of the MPCVD device impedance matching method according to any one of claims 1-4.

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