Preparation method of glass-based display unit and glass-based display unit

Abstract

The embodiment of the invention discloses a preparation method of a glass-based display unit and the glass-based display unit, and the preparation method of the glass-based display unit comprises the steps: firstly forming a circuit image groove in a substrate, then forming a circuit layer by using the circuit image groove, then connecting a display chip to the circuit layer, and then forming a glass-based packaging body. According to the preparation method of the glass-based display unit provided by the embodiment of the invention, the circuit layer is directly manufactured on the glass substrate, so that the problems of pressing brittleness and poor copper sheet adhesive force of a glass-based printed circuit board in the prior art are solved; and then the circuit layer is formed by utilizing the circuit pattern groove, stable adhesive force can be provided for the circuit layer through the circuit pattern groove, and the flatness and the heat dissipation performance of the glass-based display unit are provided.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of display devices, and in particular to a method for preparing a glass-based display unit and a glass-based display unit. Background Art

[0002] In display devices, glass substrates, as carriers for chip lead frames, can meet the high flatness, low thickness, and high dimensional stability requirements of chip packaging. However, conventional glass substrates suffer from weak bonding strength between the metal circuit layer and the glass substrate, making the metal layer prone to peeling or warping. This has hindered the development of glass-based display units, particularly glass-based Micro LED displays. Summary of the Invention

[0003] The Summary of the Invention introduces a series of simplified concepts that will be further described in the Detailed Description of the Invention. This section of the invention is not intended to limit the key features and essential features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention provides a method for preparing a glass-based display unit.

[0006] A second aspect of the present invention provides a glass-based display unit.

[0007] In view of this, according to a first aspect of an embodiment of the present application, a method for preparing a glass-based display unit is proposed, comprising:

[0008] providing a glass substrate;

[0009] forming a circuit pattern groove on the glass substrate;

[0010] forming a circuit layer through the circuit pattern grooves;

[0011] The display chip is connected to the circuit layer to form a glass-based package.

[0012] In a feasible implementation manner, the step of forming a circuit pattern groove on the glass substrate includes:

[0013] A plurality of circuit pattern grooves with a depth of 3 μm to 5 μm are formed on the glass substrate using a laser.

[0014] In a feasible implementation manner, the step of forming a circuit layer through the circuit pattern grooves includes:

[0015] spraying a conductive adhesive onto the glass substrate to form a conductive adhesive layer;

[0016] Polishing the glass substrate so that the conductive adhesive layer remains only in the circuit pattern groove;

[0017] forming a seed layer through the conductive adhesive layer;

[0018] The circuit layer is formed by preparing the seed layer.

[0019] In a feasible implementation manner, the step of spraying the conductive adhesive onto the glass substrate to form a conductive adhesive layer includes:

[0020] spraying conductive adhesive onto the glass substrate;

[0021] After the conductive adhesive is allowed to stand and level, the conductive adhesive is cured.

[0022] In a feasible embodiment, the step of forming the circuit layer by using the seed layer includes:

[0023] performing a roughening process on the circuit layer;

[0024] Applying ink onto the glass substrate and the circuit layer to form an ink layer;

[0025] The ink layer above the pad on the circuit layer is removed.

[0026] In a feasible implementation manner, before the step of connecting the display chip to the circuit layer, the method further includes:

[0027] opening a communication hole on the glass substrate;

[0028] A conductor is filled in the communication hole, and solder balls are implanted at both ends of the communication hole, so that the first surface of the glass substrate can be connected with the second surface.

[0029] In a feasible embodiment, the method for preparing a glass-based display unit further includes:

[0030] connecting the glass-based package to a printed circuit board;

[0031] The glass-based package body and the printed circuit board are packaged and cut as a whole to obtain a glass-based display unit.

[0032] According to a second aspect of an embodiment of the present application, a glass-based display unit is provided. The glass-based display unit is prepared by the method for preparing a glass-based display unit according to any of the above technical solutions. The glass-based display unit includes:

[0033] A glass substrate having a circuit pattern groove formed thereon;

[0034] A conductive adhesive layer, the conductive adhesive layer being disposed in the circuit pattern groove;

[0035] a circuit layer, the circuit layer being disposed on the glass substrate and connected to the conductive adhesive layer;

[0036] A display chip is connected to the circuit layer.

[0037] In a feasible embodiment, the glass-based display unit further includes: a communication hole, the communication hole being opened on the glass substrate and connecting the first surface and the second surface of the glass substrate;

[0038] A conductor is filled in the communication hole.

[0039] In a feasible embodiment, the glass-based display unit further includes:

[0040] a printed circuit board, the glass substrate being connected to the printed circuit board;

[0041] An ink layer is disposed on the glass substrate.

[0042] Compared with the prior art, the present invention has at least the following beneficial effects:

[0043] The method for preparing a glass-based display unit provided in an embodiment of the present application first forms a circuit pattern groove on a substrate, then utilizes the circuit pattern groove to form a circuit layer. The display chip is then connected to the circuit layer, and the glass-based package is then formed. The method for preparing a glass-based display unit provided in an embodiment of the present application directly forms the circuit layer on the glass substrate, resolving the issues of lamination brittleness and poor copper adhesion in conventional glass-based printed circuit boards. Furthermore, by forming a circuit pattern groove on the glass substrate and then utilizing the circuit pattern groove to form the circuit layer, the circuit pattern groove provides stable adhesion for the circuit layer, improving the flatness and heat dissipation of the glass-based display unit.

[0044] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0046] Figure 1 A schematic flowchart of a method for preparing a glass-based display unit according to an embodiment of the present application;

[0047] Figure 2 A schematic structural diagram of a glass-based display unit according to an embodiment of the present application;

[0048] Figure 3 This is a partial enlarged schematic diagram of the connection between the display chip and the glass substrate of a glass-based display unit according to an embodiment of the present application;

[0049] Figure 4 A schematic structural diagram showing an angle of forming a circuit pattern groove in a method for preparing a glass-based display unit according to an embodiment of the present application;

[0050] Figure 5 A schematic structural diagram showing another angle of forming a circuit pattern groove in a method for preparing a glass-based display unit according to an embodiment of the present application;

[0051] Figure 6 A schematic structural diagram of a circuit layer preparation method of a glass-based display unit according to an embodiment of the present application;

[0052] Figure 7 A schematic structural diagram of a connecting hole preparation method of a glass-based display unit according to an embodiment of the present application;

[0053] Figure 8 A schematic structural diagram of the connection between a display chip and a glass substrate in a method for preparing a glass-based display unit according to an embodiment of the present application;

[0054] Figure 9 This is a schematic structural diagram of the connection between a glass-based package and a printed circuit board in a method for preparing a glass-based display unit according to an embodiment of the present application.

[0055] in, Figures 2 to 9 The corresponding relationship between the reference numerals and component names is as follows:

[0056] 110 glass substrate, 120 circuit pattern groove, 130 circuit layer, 140 seed layer, 150 conductive adhesive layer, 160 ink layer, 170 connecting hole, 180 solder ball, 190 conductor part, 200 display chip, 210 tin layer, 220 printed circuit board. DETAILED DESCRIPTION

[0057] In the following description, a number of specific details are provided to provide a more thorough understanding of the technical solutions provided by the present invention. However, it is obvious to those skilled in the art that the technical solutions provided by the present invention can be implemented without one or more of these details.

[0058] It should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0059] Exemplary embodiments of the present invention will now be described in greater detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided to make the disclosure of the present invention thorough and complete and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art.

[0060] This application considers that Micro LED, as the mainstream of next-generation display technology, faces numerous challenges in its industrialization, such as low mass transfer yield, low substrate yield, and poor panel pixel uniformity. These issues have become key constraints on its development. Against this backdrop, a new packaging technology is needed to balance cost, yield, and compatibility. MiP technology has emerged as a result. The MiP technology principle involves transferring Micro LED chips to a substrate using transfer technology, encapsulating them, and cutting them into single or multi-chip chips. The small chips are then separated and mixed. The chip bonding process and screen surface lamination are then performed to complete the display. The substrate, serving as the chip lead frame, requires high flatness, low thickness, and high dimensional stability for packaging 2mil*4mil (RGB) chips. It also requires high thermal conductivity. Photosensitive glass substrates offer modified glass that can meet these requirements. A thickness of 20µm can significantly reduce the overall height after packaging, and the multi-chip configuration significantly increases the thrust of the MIP lamps. While the promise of glass substrates lies in their ability to support high-density interconnects, essential for next-generation electronics, this potential is currently limited by practical manufacturing processes. Adding multi-layer interconnect structures presents challenges, including managing glass brittleness, metal line adhesion, selecting suitable glass materials, crack resistance at glass edges, cutting large glass substrates, and dissipating heat and withstanding mechanical forces throughout the product's lifecycle. To enhance the bond between copper and glass, some researchers have used UV light to clean the glass surface before sputtering a metal layer, or by soaking the glass surface in chemical solutions to create a nanometer-thick metal oxide adhesion layer to improve the adhesion of electroplated copper. However, these methods rely on van der Waals forces, which are acceptable for PCB-grade glass substrates. However, these forces are less effective for substrate-grade circuits with finer lines (30 / 30µm). Furthermore, due to the smooth surface of glass, adhesion to copper metal is low, which can still lead to problems such as metal peeling and warping. Therefore, in order to improve the high flatness, high heat dissipation, lightness and fine circuit adhesion design of the Mip carrier, a reasonable technical solution is now formulated. The patent of this invention will develop the process and technical solution of the Mip glass-based carrier to improve the module flatness, heat dissipation and insufficient thrust of the Mip lamp beads, thereby enhancing the core competitiveness of the product.

[0061] like Figure 1 As shown, according to a first aspect of an embodiment of the present application, a method for preparing a glass-based display unit is proposed, comprising:

[0062] Step 101: providing a glass substrate;

[0063] Step 102: forming a circuit pattern groove on the glass substrate;

[0064] Step 103: forming a circuit layer through the circuit pattern grooves;

[0065] Step 104: Connect the display chip to the circuit layer to form a glass-based package.

[0066] The method for preparing a glass-based display unit provided in an embodiment of the present application first forms a circuit pattern groove on a substrate, then uses the circuit pattern groove to form a circuit layer 130. The display chip 200 is then connected to the circuit layer 130, and a glass-based package is then formed. The method for preparing a glass-based display unit provided in an embodiment of the present application directly forms the circuit layer 130 on the glass substrate 110, solving the problems of lamination brittleness and poor copper adhesion of the glass-based printed circuit board 220 in conventional technology. Furthermore, by forming a circuit pattern groove 120 on the glass substrate 110 and then using the circuit pattern groove 120 to form the circuit layer 130, the circuit pattern groove 120 provides stable adhesion for the circuit layer 130, thereby improving the flatness and heat dissipation of the glass-based display unit.

[0067] It can be understood that the glass-based package is a glass-based MiP (MiP, Micro LED-in-Package) package.

[0068] like Figures 2 to 9 As shown, in a feasible embodiment, the step of forming the circuit pattern grooves 120 on the glass substrate 110 includes: using a laser to form a plurality of circuit pattern grooves 120 with a depth of 3 μm to 5 μm on the glass substrate 110 .

[0069] This technical solution further provides specific steps for forming circuit pattern grooves 120 on the glass substrate 110. A laser can be used to form multiple circuit pattern grooves 120 with a depth of 3um to 5um on the glass substrate 110. This can ensure the processing accuracy of the circuit pattern grooves 120, facilitate the pattern transfer of the circuit pattern grooves 120, and reduce processing costs. By selecting circuit pattern grooves 120 with a depth of 3um to 5um, the printing efficiency of the grooves can be improved, and at the same time, it can be ensured that the circuit pattern grooves 120 provide stable adhesion to the circuit layer 130.

[0070] In some examples, in order to improve the processing efficiency of the circuit pattern groove 120, the laser may be a nanosecond laser.

[0071] In some examples, during the specific process of forming the circuit pattern groove 120 using a laser, positioning can be performed based on the glass substrate 110. The laser proofing image is maintained at a safety distance of at least 1mm from the edge of the glass substrate 110 to ensure that processing errors do not affect subsequent product processing. During the preparation of the circuit pattern groove 120, it is necessary to punch out the electroplating dot and electroplating lead images on the edge of the glass substrate 110 to facilitate the subsequent coating of conductive adhesive and provide a carrier for electroplating. The lead position is then interrupted by laser repair. The glass substrate 110 can then be photochemically processed using an ESI laser. This can instantly melt or vaporize a region of the glass substrate 110 in an extremely short time (typically using a nanosecond laser). Using a 2μm spot size, the 30 / 30μm photolithographic image can be transferred. The substrate damage depth is controlled to 3-5μm, which can serve as a corresponding container for the subsequent conductive adhesive. By selecting 3-5μm, the glass damage depth is relatively low, which can effectively improve printing efficiency. For example, the same location can be punched twice by laser. Finally, plasma cleaning is required. During plasma cleaning, a specific gas (argon, oxygen, carbon tetrachloride, etc.) is injected into a closed reaction chamber. Radio frequency energy is then applied to create an electric field in a low-pressure environment. This electric field ionizes the gas molecules, forming a plasma—an ionized gas containing electrons, ions, and free radicals. These high-energy active particles chemically react or physically collide with contaminants on the glass surface and residual matter from laser photocatalysis, breaking them down into volatile substances that are then extracted by a vacuum system, thereby cleaning the surface.

[0072] like Figures 5 and 6 As shown, in a feasible embodiment, the steps of forming the circuit layer 130 through the circuit pattern groove 120 include: spraying conductive glue onto the glass substrate 110 to form a conductive glue layer 150; polishing the glass substrate 110 so that the conductive glue layer 150 remains only in the circuit pattern groove 120; forming a seed layer 140 through the conductive glue layer 150; and preparing the circuit layer 130 through the seed layer 140.

[0073] This technical solution further provides specific steps for preparing the circuit layer 130. First, conductive adhesive is sprayed onto the glass substrate 110 to form a conductive adhesive layer 150. The glass substrate 110 is then polished to remove excess conductive adhesive layer 150, leaving only the conductive adhesive layer 150 within the circuit pattern grooves 120. The conductive adhesive layer 150 is then used to form a seed layer 140, and the circuit layer 130 is formed through the seed layer 140. Based on this, the circuit layer 130 is prepared, using the circuit pattern grooves 120 as induction grooves, and the production of the circuit layer 130 is completed through conductive adhesive and horizontal electroplating. The adhesive strength of the resin matrix ensures that the circuit layer 130 formed by subsequent electroplating can adhere well to the glass substrate 110. The structure of the circuit pattern grooves 120 not only allows the conductive adhesive to adhere thereto, but also provides a stable adhesion structure for the subsequent circuit layer 130.

[0074] In a feasible embodiment, the step of spraying conductive adhesive onto the glass substrate 110 to form the conductive adhesive layer 150 includes: spraying the conductive adhesive onto the glass substrate 110; and curing the conductive adhesive after the conductive adhesive is allowed to stand and level.

[0075] In this technical solution, specific steps for spraying conductive adhesive are further provided, wherein the conductive adhesive is sprayed onto the glass substrate 110; after the conductive adhesive is allowed to stand and level, the conductive adhesive is cured. This can make the conductive adhesive layer 150 smoother, thereby making the glass-based display unit smoother, increasing the fit between the circuit layer 130 and the glass substrate 110, and further reducing the probability of the circuit layer 130 falling off or curling.

[0076] In some examples, the specific steps of preparing and forming the circuit layer 130 may include:

[0077] Electrostatic spraying: The conductive adhesive is diluted to a viscosity range of 10-15 mPa.s, and then the conductive adhesive is evenly sprayed onto the surface of the glass substrate 110 with a thickness of about 2-3 μm using an electrostatic spraying device. The conductive adhesive is allowed to stand and level, and then flows into the grooves 120 of the laser-printed circuit pattern.

[0078] Curing: The conductive adhesive is cured by UV laser;

[0079] Mechanical polishing: The surface is polished with high-flatness sand to remove the conductive glue on the surface, leaving only the conductive glue in the groove;

[0080] Ultrasonic cleaning: Use DI water washing and ultrasonic vibration to remove the conductive particles remaining on the surface after polishing;

[0081] Electroplating: Deposit a copper seed layer 140 of about 2-3 μm on the conductive adhesive by horizontal electroplating (low current and long deposition time: 0.5 ASF / 20 min); vertical electroplating thickens to 15 μm-18 μm;

[0082] Outer layer AOI scanning: Scan the substrate image and compare it with the design data, and output the location that needs repair;

[0083] Laser repair: Use laser to disconnect the electroplated leads from the design image; repair other abnormal locations such as residual copper.

[0084] Based on this, the processing accuracy of the circuit layer 130 can be guaranteed. At the same time, fixing the circuit layer 130 with the conductive adhesive can ensure the fixing strength of the circuit layer 130 and reduce the probability of delamination and curling of the circuit layer 130 and the glass substrate 110.

[0085] In some examples, the display chip 200 may be connected to the circuit layer 130 through a tin layer, making the connection of the display chip 200 more reliable.

[0086] In a feasible embodiment, the step of preparing the circuit layer 130 through the seed layer 140 includes: roughening the circuit layer 130; applying ink to the glass substrate 110 and the circuit layer 130 to form an ink layer 160; and removing the ink layer 160 above the pad on the circuit layer 130.

[0087] In this technical solution, after the preparation of the circuit layer 130 is completed, the circuit layer 130 can also be roughened; ink is applied to the glass substrate 110 and the circuit layer 130 to form an ink layer 160; the ink layer 160 above the pad on the circuit layer 130 is removed. Based on this, through the setting of the ink layer 160, on the one hand, the ink layer 160 can absorb or reflect part of the ambient light, reduce the interference of external light on the internal light of the display unit, improve the display effect of the display unit, and improve the contrast of the displayed content, so that the user can see the images and text on the screen more clearly; on the other hand, when the glass-based display unit is in the off state, the glass-based display unit can be made to have an integrated black effect, making the display screen like a complete black panel, which is more beautiful.

[0088] In some examples, forming the ink layer 160 may include the following specific steps:

[0089] Roughening: Roughening the surface of the copper layer of the circuit layer 130 to form a reddish-brown skin layer to improve the bonding strength with the ink;

[0090] Ink roller coating: the glass substrate 110 is coated with ink;

[0091] Pre-baking: roughly solidify the ink to make it have a certain hardness and be compatible with subsequent exposure;

[0092] Ink leveling: The ink surface is leveled by providing temperature, pressure and negative vacuum through a highly flat carrier, so that the height difference is controlled within 2-3um.

[0093] Exposure / development: remove the ink on the surface of the pad to preserve the position required for welding and subsequent punching;

[0094] Appearance inspection: Check the solder mask and other surface defects and repair them in time;

[0095] Character printing: print characters;

[0096] Baking board: Thoroughly cure solder mask ink and text ink;

[0097] Immersion tin: The pads that need to be soldered are surface treated to facilitate the subsequent soldering of chips.

[0098] In this technical solution, the pads on the circuit layer 130 are used to connect to the display chip 200 .

[0099] like Figure 7 As shown, in a feasible embodiment, before the step of connecting the display chip 200 to the circuit layer 130, it also includes: opening a connecting hole 170 on the glass substrate 110; filling the connecting hole 170 with a conductor 190, and implanting solder balls 180 at both ends of the connecting hole 170, so that the first surface of the glass substrate 110 can be connected to the second surface.

[0100] In this technical solution, before connecting the display chip 200 to the circuit layer 130, a connecting hole 170 can be first opened on the glass substrate 110, and then a conductor 190 is filled into the connecting hole 170. Finally, solder balls 180 are implanted at both ends of the through hole. The first and second surfaces of the glass substrate 110 can be electrically connected through the conductor 190 and the solder balls 180, so that the solder balls 180 can be connected to the circuit layer 130 and the connecting hole 170 can also be connected to the circuit layer 130. Based on this, the display chip 200 can be controlled and powered on.

[0101] In some examples, the specific steps of enabling the first surface of the glass substrate 110 to communicate with the second surface may include:

[0102] Punching: Punching a hole from one side of the glass substrate 110 where the solder pad is not engraved to the other side, and connecting it with the solder pad side to form a connecting hole 170;

[0103] Printing solder paste: Print solder paste on the punched area. Since the glass base layer is only 50um, printing can be done through a stepped steel mesh to ensure that the hole is filled with solder paste as a conductor 190;

[0104] Ball implantation / soldering: Solder balls 180 are implanted into the holes to ensure electrical continuity between the first and second surfaces of the glass substrate 110. The solder balls 180 are then soldered to the pads of the printed circuit board 220, thereby electrically connecting the display chip 200, the glass substrate 110, the solder balls 180, and the printed circuit board 220.

[0105] Electrical testing: electrical performance testing to ensure network connectivity;

[0106] FQC: Appearance inspection of finished products to facilitate subsequent packaging and warehousing.

[0107] like Figures 8 and 9 As shown, in a feasible embodiment, the preparation method of the glass-based display unit further includes: connecting the glass-based package body to the printed circuit board 220; packaging and cutting the whole formed by the glass-based package body and the printed circuit board 220 to obtain the glass-based display unit.

[0108] In this technical solution, after the preparation of the glass-based package is completed, the glass-based package can be connected to the printed circuit board 220 to complete the packaging of the display chip 200, the glass substrate 110 and the printed circuit board 220 (PCB board). Then, the whole formed by the glass-based package and the printed circuit board 220 is packaged and cut to obtain a glass-based display unit. The glass-based display unit can be used as a single or multi-in-one small lamp bead.

[0109] like Figures 1 to 9 As shown, according to the second aspect of the embodiment of the present application, a glass-based display unit is proposed. The glass-based display unit is prepared by the preparation method of the glass-based display unit as described in any of the above technical solutions. The glass-based display unit includes: a glass substrate 110, a circuit pattern groove 120 is formed on the glass substrate 110; a conductive adhesive layer 150, the conductive adhesive layer 150 is arranged in the circuit pattern groove 120; a circuit layer 130, the circuit layer 130 is arranged on the glass substrate 110 and connected to the conductive adhesive layer 150; and a display chip 200, the display chip 200 is connected to the circuit layer 130.

[0110] The glass-based display unit provided in the embodiment of the present application is prepared by the preparation method of the glass-based display unit of any of the above-mentioned technical solutions, so the glass-based display unit has all the beneficial effects of the preparation method of the glass-based display unit of the above-mentioned technical solutions.

[0111] The glass-based display unit provided in the embodiment of the present application includes a glass substrate 110, a conductive adhesive layer 150, a circuit layer 130, and a display chip 200. The conductive adhesive layer 150 is filled in the circuit pattern groove 120 to ensure the flatness and filling strength of the conductive adhesive layer 150. The circuit layer 130 is then connected to the conductive adhesive layer 150. The adhesive strength of the resin matrix ensures that the circuit layer 130 can be well adhered to the glass substrate 110, which can reduce the probability of delamination and curling of the circuit layer 130.

[0112] In a feasible embodiment, the glass-based display unit further includes: a connecting hole 170 , which is opened on the glass substrate 110 and connects the first surface and the second surface of the glass substrate 110 ; and a conductor 190 , which is filled in the connecting hole 170 .

[0113] In this technical solution, a connecting hole 170 can also be formed on the glass substrate 110, and a conductive member can be filled in the connecting hole 170. Based on this, the glass-based display unit can use the conductive member and the connecting hole 170 to achieve conductivity between the first and second surfaces of the glass substrate 110, thereby facilitating the control, communication and power-on of the display chip 200.

[0114] In a feasible embodiment, the glass-based display unit further includes: a printed circuit board 220 , to which the glass substrate 110 is connected; and an ink layer 160 , which is disposed on the glass substrate 110 .

[0115] In this technical solution, the glass-based display unit may further include a printed circuit board 220 and an ink layer 160. The provision of the printed circuit board 220 facilitates control of the display chip 200. Through the provision of the ink layer 160, on the one hand, the ink layer 160 can absorb or reflect part of the ambient light, reduce the interference of external light on the internal light of the display unit, improve the display effect of the display unit, and improve the contrast of the displayed content, so that the user can see the images and text on the screen more clearly; on the other hand, when the glass-based display unit is in the off state, the glass-based display unit can be made to have an integrated black effect, making the display screen like a complete black panel, which is more beautiful.

[0116] Example

[0117] The method for preparing a glass-based display unit provided in the embodiment of the present application includes the following process steps:

[0118] The preparation process of the glass-based package body is as follows: glass substrate 110 sorting and processing → laser printing (glass damage depth 3-5um) → plasma cleaning → electrostatic spraying (conductive glue) → standing / curing → mechanical polishing → ultrasonic cleaning → electroplating → outer layer AOI → laser repair (removal of electroplating guide wires) → ultra-roughening → ink roller coating → pre-baking → leveling → exposure → development → appearance inspection → inkjet printing → baking plate → tinning → punching → steel screen printing → ball planting / soldering → electrical testing → FQC → packaging, which is to encapsulate and cut the whole formed by the glass-based package body and the printed circuit board 220, and obtain the specific process steps of the glass-based display unit.

[0119] Preparation of glass-based display units: chip sorting and pretreatment → PCB substrate processing (plasma treatment + ultrasonic water washing) → steel screen printing → die bonding (chip mounting) → reflow soldering → packaging material injection → curing → cutting → testing and sorting → final inspection and warehousing.

[0120] The specific process steps for forming the circuit pattern groove 120 on the glass substrate 110 are: glass substrate 110 sorting and processing → laser printing (glass damage depth 3-5 μm) → plasma cleaning.

[0121] Among them, electrostatic spraying (conductive glue) → standing / curing → mechanical polishing → ultrasonic cleaning → electroplating → outer layer AOI → laser repair (removing electroplating guide lines) are the specific process steps for forming the circuit layer 130 through the circuit pattern groove 120.

[0122] The specific process steps of forming the ink layer 160 include super-roughening → ink rolling → pre-baking → leveling → exposure → development → appearance inspection → inkjet printing → baking → tinning.

[0123] Punching→stencil printing→ball planting / soldering→electrical testing→FQC→packaging are specific process steps for enabling the first surface and the second surface of the glass substrate 110 to be connected to form a glass-based package.

[0124] The implementation process specifically includes:

[0125] Laser printing: 1. Positioning is done based on the edge of the glass substrate 110. The laser proofing image is kept at a safety distance of at least 1mm from the edge of the board to ensure that processing errors do not affect subsequent product processing;

[0126] 2. Use ESI laser to photochemically process the glass substrate 110. In a very short time (usually using nanosecond laser), a local area of ​​the glass substrate 110 is instantly melted or vaporized. A 2um spot is used to achieve the transfer of the 30 / 30um photolithography image. The depth of the substrate damage is controlled at 3-5um, which can serve as a corresponding container for the subsequent conductive glue. (The low depth of the glass damage can effectively improve printing efficiency. Two shots are sufficient for the same position.)

[0127] 3. It is necessary to print the electroplating dots and electroplating lead images on the edge of the board to provide a carrier for electroplating after subsequent coating of conductive glue, and then interrupt the lead position through laser repair.

[0128] Plasma cleaning: Specific gases (argon, oxygen, carbon tetrachloride, etc.) are injected into a closed reaction chamber. Radio frequency energy is then applied to create an electric field in a low-pressure environment. This electric field ionizes the gas molecules, forming a plasma—an ionized gas containing electrons, ions, and free radicals. These high-energy active particles chemically react or physically collide with contaminants and laser-induced residues on the glass surface, breaking them down into volatile substances that are then extracted by a vacuum system, thereby cleaning the surface.

[0129] Electrostatic spraying: Dilute the conductive adhesive to 10-15 MPa.s and spray it evenly onto the surface of the glass substrate 110 with a thickness of about 2-3 μm using an electrostatic spraying device. Allow it to level and flow into the laser-printed grooves.

[0130] Curing: The conductive adhesive is cured by UV laser;

[0131] Mechanical polishing: The surface is polished with high-flatness sand to remove the conductive adhesive on the surface, leaving only the conductive adhesive in the circuit pattern groove 120;

[0132] Ultrasonic cleaning: Use DI water washing and ultrasonic vibration to remove the conductive particles remaining on the surface after polishing;

[0133] Electroplating: Deposit a copper seed layer 140 of about 2-3 μm on the conductive adhesive by horizontal electroplating (low current and long deposition time: 0.5 ASF / 20 min); vertical electroplating thickens to 15 μm-18 μm;

[0134] Outer layer AOI scanning: Scan the substrate image and compare it with the design data, and output the location that needs repair;

[0135] Laser repair: Use laser to cut off the electroplated leads and the design image; repair other abnormal positions such as residual copper;

[0136] Ultra-roughening: Roughening the copper surface of the circuit layer 130 to form a reddish-brown skin layer to enhance the bonding strength with the ink;

[0137] Ink roller coating: coating the surface of substrate with ink;

[0138] Pre-baking: roughly solidify the ink to make it have a certain hardness and be compatible with subsequent exposure;

[0139] Ink leveling: The ink surface is leveled by providing temperature, pressure and negative vacuum through a highly flat carrier, so that the height difference is controlled within 2-3um.

[0140] Exposure / development: remove the ink on the surface of the pad to preserve the position required for welding and subsequent punching;

[0141] Appearance inspection: Check the solder mask and other surface defects and repair them in time;

[0142] Character printing: print characters;

[0143] Baking board: Thoroughly cure solder mask ink and text ink;

[0144] Immersion tin: Surface treatment of pads to be soldered, subsequent soldering

[0145] Punching: Punching a hole from one side of the carrier board without the circuit pad to the other side, and connecting it with the pad side to form a connecting hole 170;

[0146] Printing solder paste: Print solder paste on the punched area. Since the glass base layer is only 50um, printing can be done through a stepped steel mesh to ensure that the hole is filled with solder paste.

[0147] Ball implantation / soldering: implanting the solder balls 180 into the holes to ensure electrical continuity between the first and second surfaces of the glass substrate 110, and subsequently soldering the solder balls 180 to the PCB pads to complete the electrical connection between the chip, substrate, solder balls 180, and PCB.

[0148] Electrical testing: electrical performance testing to ensure network connectivity;

[0149] FQC: Appearance inspection of finished products to facilitate subsequent packaging and warehousing.

[0150] The method for preparing a glass-based display unit provided in the embodiments of the present application provides a new glass-based carrier plate process route and solution:

[0151] 1. Through laser induced etching combined with electrostatic spraying of conductive adhesive and electroplating of copper, circuits are made on the glass substrate, replacing the problems of glass-based PCB pressing brittleness and poor copper adhesion.

[0152] Second, through laser drilling combined with solder paste printing and ball planting process, the copper convex process of the BT carrier board is eliminated, solving the MIP lamp bead pin welding problem and the via conduction problem.

[0153] The inductive grooves formed by laser printing are then combined with conductive adhesive and horizontal electroplating to complete the production of circuit layer 130. The adhesive strength of the resin matrix ensures that the subsequent electroplated circuit layer 130 adheres well to the glass surface. The groove structure not only allows the conductive adhesive to adhere, but also provides a stable adhesion structure for subsequent circuits.

[0154] The method for preparing a glass-based display unit provided in the embodiments of the present application has at least the following beneficial effects:

[0155] 1. Improve the flatness, high heat dissipation, lightness and fine circuit adhesion design of the glass-based display unit. A reasonable technical solution is now formulated. The preparation method of the glass-based display unit provided in the embodiment of this application is particularly suitable for the development of MIP glass-based carrier board process and technical solutions, improving the module flatness, heat dissipation and MIP lamp bead thrust deficiency and other abnormalities, thereby enhancing the core competitiveness of the product.

[0156] Second, by combining laser-induced etching, electrostatic spraying of conductive adhesive, and copper electroplating, circuits can be fabricated on a glass substrate, eliminating issues such as brittle lamination and poor copper adhesion on glass-based PCBs. Laser drilling, solder paste printing, and ball placement eliminate the copper bumping process on BT substrates, solving issues such as soldering pins on MIPs and via-hole conductivity.

[0157] Third, design the laser-printed grooves 120 for the circuit pattern. Then, through conductive adhesive and horizontal electroplating, complete the fabrication of the circuit layer 130. The resin matrix's adhesive strength ensures that the subsequent electroplated circuit layer 130 adheres well to the glass surface. The groove structure not only allows the conductive adhesive to adhere, but also provides a stable adhesion structure for subsequent circuits.

[0158] In the present invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless expressly limited otherwise. Terms such as "installed," "connected," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; "connected" can mean a direct connection or an indirect connection through an intermediary. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0159] In the description of the present invention, it should be understood that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0160] Throughout this specification, terms such as "one embodiment," "some embodiments," and "specific embodiments" mean that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0161] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A method for preparing a glass-based display unit, characterized in that: include: providing a glass substrate; forming a circuit pattern groove on the glass substrate; forming a circuit layer through the circuit pattern grooves; The display chip is connected to the circuit layer to form a glass-based package.

2. The method for preparing a glass-based display unit according to claim 1, wherein: The step of forming a circuit pattern groove on the glass substrate comprises: A plurality of circuit pattern grooves with a depth of 3 μm to 5 μm are formed on the glass substrate using a laser.

3. The method for preparing a glass-based display unit according to claim 1, wherein: The step of forming a circuit layer through the circuit pattern groove includes: spraying a conductive adhesive onto the glass substrate to form a conductive adhesive layer; Polishing the glass substrate so that the conductive adhesive layer remains only in the circuit pattern groove; forming a seed layer through the conductive adhesive layer; The circuit layer is formed by preparing the seed layer.

4. The method for preparing a glass-based display unit according to claim 3, wherein: The step of spraying the conductive adhesive onto the glass substrate to form a conductive adhesive layer comprises: spraying conductive adhesive onto the glass substrate; After the conductive adhesive is allowed to stand and level, the conductive adhesive is cured.

5. The method for preparing a glass-based display unit according to claim 4, wherein: After the step of forming the circuit layer by using the seed layer, the following steps are included: performing a roughening process on the circuit layer; Applying ink onto the glass substrate and the circuit layer to form an ink layer; The ink layer above the pad on the circuit layer is removed.

6. The method for preparing a glass-based display unit according to claim 1, wherein: Before the step of connecting the display chip to the circuit layer, the method further includes: opening a communication hole on the glass substrate; A conductor is filled in the communication hole, and solder balls are implanted at both ends of the communication hole, so that the first surface of the glass substrate can be connected with the second surface.

7. The method for preparing a glass-based display unit according to any one of claims 1 to 6, characterized in that: Also includes: connecting the glass-based package to a printed circuit board; The glass-based package body and the printed circuit board are packaged and cut as a whole to obtain a glass-based display unit.

8. A glass-based display unit, characterized in that: The glass-based display unit is prepared by the method for preparing a glass-based display unit according to any one of claims 1 to 7, and the glass-based display unit comprises: A glass substrate having a circuit pattern groove formed thereon; A conductive adhesive layer, the conductive adhesive layer being disposed in the circuit pattern groove; a circuit layer, the circuit layer being disposed on the glass substrate and connected to the conductive adhesive layer; A display chip is connected to the circuit layer.

9. The glass-based display unit according to claim 8, wherein: Also includes: a connecting hole, the connecting hole being formed on the glass substrate and connecting the first surface and the second surface of the glass substrate; A conductor is filled in the communication hole.

10. The glass-based display unit according to claim 8 or 9, characterized in that: Also includes: a printed circuit board, the glass substrate being connected to the printed circuit board; An ink layer is disposed on the glass substrate.

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