Substrate working machine and foreign matter suction method

Abstract

A substrate working machine is provided with: a static electricity eliminating device for eliminating static electricity; and a suction device which is disposed in the irradiation direction of the electrostatic eliminating device and sucks foreign matter.

Description

Technical Field

[0001] The present invention relates to a substrate working machine and the like equipped with a suction device for sucking foreign matter. Background Art

[0002] The following patent document describes a technique for sucking foreign matter by a suction device in a substrate working machine.

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2011-082438

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2008-103405 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] An object of the present invention is to appropriately suck foreign matter in a substrate working machine.

[0008] Means for solving problems

[0009] To solve the above-mentioned problems, this specification discloses a substrate working machine including: a static electricity removal device for removing static electricity; and a suction device disposed in the irradiation direction of the static electricity removal device for sucking foreign matter.

[0010] Effects of the Invention

[0011] According to the present disclosure, foreign matter can be appropriately attracted. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view showing an electronic component mounting device.

[0013] Figure 2 It is a side view showing the electronic component mounting device.

[0014] Figure 3 This is a top view showing component taping.

[0015] Figure 4 This is a side view showing a tape feeder.

[0016] Figure 5 It is a side view showing the electronic component mounting device.

[0017] Figure 6 It is a perspective view showing a dust collecting device and a spraying device.

[0018] Figure 7 It is a side view showing the electronic component mounting device.

[0019] Figure 8It is a side view showing the electronic component mounting device.

[0020] Figure 9 This is a graph showing the relationship between the operating time of the ion generator and the charged voltage of the electronic component.

[0021] Figure 10 This is a graph showing the relationship between the operating time of the ion generator and the charged voltage of the electronic component.

[0022] Figure 11 This is a graph showing the relationship between the operating time of the ion generator and the charged voltage of the electronic component. DETAILED DESCRIPTION

[0023] Hereinafter, as a mode for carrying out the present invention, embodiments of the present invention will be described in detail with reference to the drawings.

[0024] Figure 1 Figure 1 shows an electronic component mounting apparatus 10. The electronic component mounting apparatus 10 includes a system base 12 and two adjacent electronic component mounting machines (hereinafter sometimes simply referred to as "mounters") 16 on the system base 12. The direction in which the mounters 16 are arranged is referred to as the X-axis direction, and the horizontal direction perpendicular to this direction is referred to as the Y-axis direction.

[0025] Each mounting machine 16 mainly includes: a mounting machine body 20, a conveying device 22, a mounting head moving device (hereinafter sometimes referred to as "moving device") 24, a mounting head 26, a supply device 28, a parts camera 29, and a marking camera (see Figure 2 ) 30. Ion generator (refer to Figure 2 ) 32 and dust collecting fan (refer to Figure 2 ) 34. The mounting machine body 20 is composed of a frame 36 and a beam 38 mounted on the frame 36. Figure 1 In FIG, the cover covering the mounting machine 16 is omitted.

[0026] The conveying device 22 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are arranged on the frame 36 in a manner parallel to each other and extending in the X-axis direction. The two conveyor devices 40 and 42 respectively move the circuit board (see FIG. 1 ) supported by each conveyor device 40 and 42 by an electromagnetic motor (not shown). Figure 2 ) 48 is transported along the X-axis direction. In addition, the circuit substrate is held at a predetermined position by a substrate holding device (not shown).

[0027] The moving device 24 is an XY robot-type moving device. It is mounted on the beam 38 and includes an electromagnetic motor (not shown) that slides the slider 50 along the X-axis direction and an electromagnetic motor (not shown) that slides the slider 50 along the Y-axis direction. The mounting head 26 is mounted on the slider 50, and the two electromagnetic motors operate to move the mounting head 26 to any position on the frame 36.

[0028] The mounting head 26 mounts electronic components onto the circuit board 48. The mounting head 26 includes a suction nozzle 60 located on its lower end surface. The suction nozzle 60 is connected to a positive and negative pressure supply device (not shown) via negative and positive pressure air passages. The suction nozzle 60 uses negative pressure to hold the electronic component and uses positive pressure to release the held electronic component. Furthermore, the mounting head 26 includes a nozzle lifter (not shown) that raises and lowers the suction nozzle 60. This nozzle lifter allows the mounting head 26 to adjust the vertical position of the held electronic component.

[0029] The parts camera 29 is disposed between the conveying device 22 and the supply device 28 on the frame 36 in an upward-facing state. Thus, the parts camera 29 photographs the components held by the suction nozzle 60 of the mounting head 26. Figure 2 As shown, the marking camera 30 is mounted on the slider 50 in a downwardly oriented state and moves along the X-axis direction and the Y-axis direction together with the mounting head 26 .

[0030] The supply device 28 is a feeder type supply device, such as Figure 1 As shown, it is arranged at the front end of the frame 36. The supply device 28 has a tape feeder 70. The tape feeder 70 is detachably mounted at its lower end on a feeder mounting base 72, which is arranged at the front end of the frame 36.

[0031] The tape feeder 70 stores a tape containing electronic components, that is, a component tape, in a wound state, and feeds the component tape to a supply position, thereby supplying electronic components at the supply position. Figure 3 As shown, component tape 80 is composed of carrier tape 82, electronic components 84, and cover tape 86. Multiple receiving recesses 88 and feed holes 90 are formed at equal intervals in carrier tape 82. Electronic components 84 are received in receiving recesses 88. Furthermore, receiving recesses 88 containing electronic components 84 are covered by cover tape 86.

[0032] In addition, if Figure 4As shown, the tape feeder 70 consists of a tape reel (not shown), a feeder body 92, a delivery device 94, and a peeling device 96. The component tape 80 is wound around the tape reel. The component tape 80 is pulled from the tape reel and extends toward the upper end surface of the feeder body 92. The delivery device 94, which includes a sprocket 98, is built into the feeder body 92. The sprocket 98 engages with a feed hole 90 of the component tape 80 extending from the upper end surface of the feeder body 92. The sprocket 98 is rotated by the delivery device 94, thereby delivering the component tape 80 to a supply position 100 at the upper end surface of the feeder body 92.

[0033] In addition, in the component tape 80 extending along the upper end surface of the feeder body 92, the cover tape 86 is peeled off from the carrier tape 82 on the upstream side of the sprocket 98 engaged with the feed hole 90, and the peeled cover tape 86 is pulled by the peeling device 96. As a result, the cover tape 86 is peeled off from the carrier tape 82, and the receiving recess 88 of the carrier tape 82 is opened. Figure 4 In the embodiment, the position where the cover tape 86 is bent toward the peeling device 96 becomes a peeling position 102 of the cover tape 86. Then, the electronic component 84 is held by the suction nozzle 60 at the supply position 100 and taken out from the opened storage recess 88.

[0034] In addition, the carrier tape (hereinafter referred to as "waste tape") 86 from which the electronic components 84 have been taken out of the storage recess 88 is fed forward from the supply position 100 to the storage area. Figure 2 The waste tape is discharged through the duct 106 shown. The duct 106 is formed between the predetermined mounting position of the tape feeder 70 on the frame 36 and the parts camera 29, and opens toward the predetermined mounting position of the tape feeder 70. Therefore, the duct 106 opens toward the front end of the tape feeder 70 mounted on the feeder mounting base 72. Furthermore, the waste tape fed forward from the supply position 100 is discharged from the opening of the duct 106 into the interior of the duct 106.

[0035] In addition, if Figure 2 As shown, the mounting machine 16 is equipped with a front cover 110 that covers the front side of the mounting machine 16. An opening is formed between the front cover 110 and the feeder mounting table 72. The tape feeder 70 is inserted into the mounting machine 16 through this opening, thereby mounting the tape feeder 70 on the feeder mounting table 72. Furthermore, the front cover 110 is equipped with an ion generator 32. The ion generator 32 is a device that removes static electricity by irradiating ions. The ion generator 32 irradiates ions toward the supply position 100 of the tape feeder 70 mounted on the feeder mounting table 72. This removes static electricity from the electronic components 84 supplied at the supply position 100, allowing the tape feeder 70 to properly supply the electronic components 84.

[0036] A dust collection fan 34 is provided above the ion generator 32 on the front cover 110. The dust collection fan 34 operates to eject air from the interior of the mounting machine 16 to the exterior of the mounting machine 16, thereby discharging foreign matter from the interior of the mounting machine 16 to the exterior of the mounting machine 16. The dust collection fan 34 is always in operation while the mounting machine 16 is in operation.

[0037] In the mounting machine 16, the mounting head 26 performs mounting work on the circuit substrate 48 conveyed by the conveyor device 22 through the above-mentioned structure. Specifically, the circuit substrate 48 is conveyed to the working position by the conveyor device 22 and is fixedly held at this position by the substrate holding device. Next, the marking camera 30 moves above the circuit substrate 48 and photographs the circuit substrate 48. At this time, based on the photographed data, information related to the holding position of the circuit substrate 48, etc. is calculated. In addition, the tape feeder 70 feeds the component tape 80 through the feeding device 94 and supplies the electronic component 84 at the supply position 100. Then, the mounting head 26 moves above the supply position 100 of the tape feeder 70 and sucks and holds the electronic component 84 with the suction nozzle 60. Next, the mounting head 26 moves above the part camera 29 and photographs the electronic component 84 held by the suction nozzle 60. At this time, based on the photographed data, information related to the holding posture of the electronic component 84, etc. is calculated. Then, the mounting head 26 moves to above the circuit substrate 48 and mounts the electronic component 84 on the circuit substrate 48. At this time, the orientation and posture of the electronic component 84 held by the suction nozzle 60 are corrected based on the holding position of the circuit substrate 48 and the holding posture of the electronic component 84, and the electronic component 84 is mounted on the circuit substrate 48.

[0038] In this manner, in the mounting machine 16, the electronic component 84 is supplied at the supply position 100 of the tape feeder 70, held by the suction nozzle 60, and mounted on the circuit board 48. At this time, at the supply position 100 of the tape feeder 70, as described above, the static electricity on the electronic component 84 is removed by the ionizer 32, thereby ensuring that the suction nozzle 60 properly holds the electronic component 84. However, when the ionizer 32 irradiates ions, there is a possibility that air flow, that is, airflow, is generated in the direction of ion irradiation, causing foreign matter such as dust and dirt to flow into the conveyor device 22.

[0039] Specifically, in the tape feeder 70, in order to open the receiving recess 88 receiving the electronic component 84, the cover tape 86 is peeled off from the carrier tape 82 at the peeling position 102. Figure 5As shown, fiber foreign matter 112 is generated on carrier tape 82. In recent years, paper tapes have been used instead of embossed tapes for carrier tape 82, particularly in light of SDGs. With paper tapes, fiber foreign matter 112 is more likely to be generated when cover tape 86 is peeled off. Furthermore, peeling point 102, where fiber foreign matter 112 is generated on carrier tape 82, is located in the direction of ion irradiation by ion generator 32. Therefore, fiber foreign matter 112 generated at peeling point 102 is carried by airflow 120 from ion generator 32 toward conveyor 22. Furthermore, fiber foreign matter 112 on carrier tape 82 can be generated not only at peeling point 102 but also when carrier tape 82 slides against tape feeder 70 during component braid 80 feed. Furthermore, fiber foreign matter 112 can also be generated when scrap tape is discharged into duct 106 due to sliding contact between the tape and duct 106. In addition, the belt feeder 70 and the pipe 106 are also located in the irradiation direction of the ions irradiated by the ion generator 32, so the fiber foreign matter 112 generated by the sliding contact between the component braiding and the matching tape also flows toward the conveying device 22 through the airflow 120 of the ion generator 32.

[0040] When the electronic component 84 is supplied at the supply position 100 of the tape feeder 70, the mounting head 26 moves to the upper side of the supply position 100 and holds the electronic component 84 by the suction nozzle 60. When the electronic component 84 is held by the suction nozzle 60, the mounting head 26 moves to the upper side of the conveyor 22 and mounts the electronic component 84 held by the suction nozzle 60 on the circuit board 48. At this time, the mounting head 26 moves from the upper side of the tape feeder 70 ( Figure 5 The position of the mounting head 26 shown by the dotted line) is directed upwards from the conveying device 22 ( Figure 5 The mounting head 26 (shown by the solid line in the middle) moves, generating an air flow, i.e., airflow 130, in the direction of movement of the mounting head 26. Therefore, the fiber foreign matter 112 generated at the stripping position 102 and the fiber foreign matter 112 generated by the sliding contact between the component braid and the tape are carried toward the conveyor 22 by the airflow 130 of the mounting head 26.

[0041] In this way, if foreign fiber matter 112 and the like from carrier tape 82 flows onto conveyor device 22, there is a risk that the electronic component 84 cannot be properly mounted on circuit board 48. In view of this situation, in mounting machine 16, a dust collector 150 is provided in the direction of ionizer 32 irradiation, that is, in the direction of airflow 120 from ionizer 32, and a spray device 152 is provided near dust collector 150. "Provided adjacently" encompasses both adjacently positioned with no gap and adjacently positioned with a gap.

[0042] like Figure 6As shown, the dust collecting device 150 has a suction pipe 160. The suction pipe 160 is composed of a pipe body 162 and a pair of suction nozzles 164. The pipe body 162 is a roughly cylindrical pipe, which is arranged on the upper surface of the pipe 106 in a posture extending along the X direction. In addition, the length dimension of the pipe body 162 is roughly the same as the length dimension of the pipe 106 in the X direction. In addition, the pair of suction nozzles 164 are roughly L-shaped and fixed to both ends of the pipe body 162. In addition, the pair of suction nozzles 164 open in the Y direction toward the arrangement position of the tape feeder 70. In addition, the dust collecting device 150 has a suction pump (not shown), which is connected to the suction pipe 160. With such a structure, the suction pump is operated and the suction pipe 160 sucks air from the openings of the pair of suction nozzles 164, thereby collecting foreign matter and the like.

[0043] The ejection device 152 also includes an ejection pipe 170. The ejection pipe 170 is a roughly cylindrical tube and is disposed on the upper surface of the duct 106 on the tape feeder 70 side of the suction pipe 160, extending in the X direction. The length of the ejection pipe 170 is approximately the same as the length of the duct 106 in the X direction. Furthermore, the ejection pipe 170 is formed with a plurality of ejection holes 172 along its length, and these plurality of ejection holes 172 open upward from the tape feeder 70. The ejection device 152 also includes an ejection pump (not shown) connected to the ejection pipe 170. With this structure, the ejection pump operates, causing the ejection pipe 170 to eject air from the plurality of ejection holes 172 toward the tape feeder 70. In addition, the spray device 152 is arranged between the tape feeder 70 and the parts camera 29, that is, between the tape feeder 70 and the conveying device 22, so the spray device 152 can also be said to spray air in the direction away from the conveying device 22.

[0044] In this way, the flow of the fiber foreign matter 112 of the carrier tape 82 into the conveying device 22 can be suppressed by arranging the dust collecting device 150 and the ejecting device 152 on the upper surface of the duct 106. In detail, in the dust collecting device 150, when the mounting machine 16 is operating, the dust collecting pump is always in operation, sucking air at a pair of suction nozzles 164 of the suction pipe 160. In addition, in the ejecting device 152, when the electronic component is held by the mounting head 26, specifically, during the period from the start of the adsorption of the electronic component by the suction nozzle 60 to the completion of the adsorption of the electronic component, the ejecting pump is in operation, and air is ejected from the plurality of ejecting holes 172 of the ejecting pipe 170. Therefore, as Figure 7As shown, when the mounting head 26 holds electronic components, air is ejected from the ejector 152 toward the top of the tape feeder 70, generating an airflow 180. The airflow 180 generated by the ejector 152 pushes against the airflow 120 of the ionizer 32 and separates into two directions above and below the airflow 120 of the ionizer 32, blowing away fiber foreign matter 112 generated by the tape feeder 70 and the like toward the top and bottom of the ionizer 32. As mentioned above, a dust collection fan 34 is provided above the ionizer 32, and the dust collection fan 34 is always operating during operation of the mounting machine 16. Therefore, the fiber foreign matter 112 flowing toward the top of the ionizer 32 is discharged to the outside of the mounting machine 16 by the dust collection fan 34. Furthermore, the ionizer 32 is built into the front cover 110, and the tape feeder 70 is mounted to the feeder mounting base 72 through an opening below the front cover 110. Therefore, a gap exists between the lower end of the front cover 110 and the upper surface of the tape feeder 70. Thus, a gap exists between the lower end of the front cover 110 and the upper surface of the tape feeder 70 below the ion generator 32, and the fiber foreign matter 112 flowing toward the bottom of the ion generator 32 is discharged to the outside of the mounting machine 16 through this gap.

[0045] Thus, when the electronic components are held by the mounting head 26, the ejection device 152 is operated, thereby discharging the fiber foreign matter 112 generated in the tape feeder 70 and the like to the outside of the mounting machine 16. However, it is difficult to discharge all the fiber foreign matter 112 generated in the tape feeder 70 and the like to the outside of the mounting machine 16 by the operation of the ejection device 152, and the fiber foreign matter 112 may remain above the tape feeder 70. Figure 8 As shown, there is a possibility that the fiber foreign matter 112 remaining above the tape feeder 70 will be blown toward the conveyor 22 by at least one of the airflow 120 from the ionizer 32 and the airflow 130 from the mounting head 26. However, in the dust collector 150, the dust collection pump is constantly operating while the mounting machine 16 is operating, sucking air through the pair of suction nozzles 164 of the suction pipe 160. Therefore, the dust collector 150 constantly draws air from above the tape feeder 70, thereby generating an airflow 190 through the dust collector 150. At this time, the fiber foreign matter 112 remaining above the tape feeder 70 is sucked into the dust collector 150 by the airflow 190 of the dust collector 150. Thus, the dust collector 150 sucks the fiber foreign matter 112 generated in the tape feeder 70 and the like, effectively preventing the fiber foreign matter 112 from flowing into the conveyor 22. That is, by arranging the dust collecting device 150 between the stripping position 102 , which is the main generation position of the fiber foreign matter 112 , and the conveying device 22 , it is possible to effectively suppress the fiber foreign matter 112 generated at the stripping position 102 from flowing into the conveying device 22 .

[0046] Specifically, when the dust collector 150 was not in operation and the ejector 152 was operated at a discharge rate of X (L / min) only when electronic components were being sucked, 254 foreign particles were collected in the conveyor 22. Furthermore, when the dust collector 150 was not in operation but the air discharge rate of the ejector 152 was increased and the ejector 152 was operated at a discharge rate of X + 50 (L / min) only when electronic components were being sucked, 73 foreign particles were collected in the conveyor 22. Thus, increasing the air discharge rate of the ejector 152 reduced the number of foreign particles in the conveyor 22 by 71.2% ({(254 - 73) / 254} × 100). Furthermore, when the dust collector 150 was always in operation and the ejector 152 was operated at a discharge rate of X + 50 (L / min) only when electronic components were being sucked, 42 foreign particles were collected in the conveyor 22. By keeping dust collector 150 constantly operating and increasing the air ejection rate from ejector 152, the amount of foreign matter in conveyor 22 can be reduced by 83.4% ({(254 - 42) / 254} × 100). By keeping dust collector 150 and ejector 152 operating, the influx of foreign matter into conveyor 22 can be effectively suppressed.

[0047] The number of foreign matter in the conveyor 22 described above is measured using a dust sampler (foreign matter collection sheet) and a dust collector (foreign matter investigation kit). Two dust samplers were placed on the upper surface of the conveyor 22 support plate (not shown), and the collection time was two hours. Furthermore, the number of foreign matter was measured while component tape 80 was passed through a tray filled with paper scraps, with foreign matter constantly attached to the tape.

[0048] Furthermore, the ejector 152 ejects air toward the tape feeder 70, while the dust collector 150 draws air in from the direction of the tape feeder 70. In other words, the airflow from the ejector 152 and dust collector 150 has little effect on the conveyor 22. This ensures proper mounting of electronic components onto circuit boards. Specifically, when the dust collector 150 is not activated and the ejector 152 is operated at a discharge rate of X (L / min) only for electronic component pickup, the mounting accuracy is X: 2.8, Y: 4.3, and Q: 2.4. Furthermore, when the dust collector 150 is not activated and the air discharge rate of the ejector 152 is increased, operating the ejector 152 at a discharge rate of X + 50 (L / min) only for electronic component pickup, the mounting accuracy is X: 2.2, Y: 3.3, and Q: 2.3. Furthermore, when dust collector 150 is always operating and ejector 152 is operated at a discharge rate of X + 50 (L / min) only when sucking electronic components, the mounting accuracy is X: 3.0, Y: 4.4, and Q: 2.6. This ensures that electronic components can be mounted on circuit boards properly even with dust collector 150 and ejector 152 operating.

[0049] In addition, in the ejection device 152, air is ejected only when the electronic components are held by the mounting head 26. Thus, foreign matter can be removed without damaging the static elimination performance of the ion generator 32. That is, the irradiation of ions from the ion generator 32 is affected by the ejection of air only when the electronic components are held by the mounting head 26, but the irradiation of ions from the ion generator 32 is not affected by the ejection of air except when the electronic components are held by the mounting head 26. Therefore, the static electricity of the electronic components at the supply position 100 of the tape feeder 70 can be appropriately removed by the ion generator 32. Specifically, Figure 9 The relationship between the operating time of the ion generator 32 and the charged voltage of the electronic component is shown when the dust collector 150 is not operated and the ejection device 152 is operated at an ejection rate X (L / min) only when the electronic component is adsorbed. Figure 10 The figure shows the relationship between the operating time of the ionizer 32 and the charged voltage of the electronic component when the dust collector 150 is not operated and the air ejection rate of the ejection device 152 is increased, and the ejection device 152 is operated at an ejection rate of X+50 (L / min) only when the electronic component is adsorbed. Figure 11 The figure shows the relationship between the operating time of the ion generator 32 and the charged voltage of the electronic component when the dust collector 150 is always operating and the ejection device 152 is operated at an ejection rate of X+50 (L / min) only when the electronic component is adsorbed. Figures 9 to 11It can be seen that, by ejecting air only when the electronic component is held by the mounting head 26 , the ejection device 152 can remove foreign matter without impairing the static elimination performance of the ionizer 32 .

[0050] Incidentally, in the above embodiment, the mounting machine 16 is an example of a substrate processing machine. The conveying device 22 is an example of a conveying device. The mounting head 26 is an example of a holding device. The ion generator 32 is an example of a static elimination device. The tape feeder 70 is an example of a tape feeder 70. The component tape 80 is an example of a component tape. The cover tape 86 is an example of a cover tape. The supply position 100 is an example of a supply position. The peeling position 102 is an example of a peeling position. The dust collection device 150 is an example of a suction device. The ejection device 152 is an example of an ejection device.

[0051] As described above, in the present embodiment described above, the following effects are achieved.

[0052] The mounting machine 16 includes an ionizer 32 for removing static electricity and a dust collector 150 disposed in the direction in which the ionizer 32 irradiates ions. The dust collector 150 attracts the fiber foreign matter 112. Thus, the dust collector 150 can appropriately attract the fiber foreign matter 112 that is carried by the airflow 120 of the ionizer 32.

[0053] Furthermore, in the above embodiment, the ionizer 32 removes static electricity from the electronic components 84 supplied by the tape feeder 70 at the supply position 100, and the dust collector 150 is disposed downstream of the supply position 100 in the direction of ion irradiation by the ionizer 32. Thus, the dust collector 150 can appropriately attract the fiber foreign matter 112 generated in the tape feeder 70.

[0054] Furthermore, in the above-described embodiment, the conveyor device 22 that conveys the circuit board 48 is disposed downstream of the dust collector 150 in the direction of ion irradiation from the ion generator 32. Consequently, the dust collector 150 can suction the fiber foreign matter 112 caused by the airflow 120 of the ion generator 32 before it reaches the conveyor device 22, thereby suppressing the generation of foreign matter around the conveyor device 22.

[0055] In the above embodiment, the tape feeder 70 feeds electronic components 84 from the component tape 80 from which the cover tape 86 has been removed. Furthermore, the tape feeder 70 is provided with a dust collector 150 for attracting fiber foreign matter 112 between the position where the cover tape 86 is removed from the component tape 80 and the conveyor 22. Consequently, if fiber foreign matter 112 is generated when the cover tape 86 is removed from the component tape 80, the dust collector 150 can attract the fiber foreign matter 112 before it reaches the conveyor 22.

[0056] Furthermore, in the above embodiment, the ejection device 152 that ejects gas in a direction away from the conveying device 22 is disposed near the dust collecting device 150. This effectively prevents the fiber foreign matter 112 from flowing into the conveying device 22.

[0057] In the above embodiment, the ejection device 152 is operated only when the electronic component 84 is held from the tape feeder 70 by the mounting head 26. This allows removal of foreign matter without impairing the static elimination performance of the ion generator 32.

[0058] The present invention is not limited to the above-described embodiment and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, an ionizer 32 is used as a static elimination device to eliminate static electricity by irradiation with ions. Alternatively, static electricity can be eliminated by irradiation with weak X-rays, α-rays, β-rays, ultraviolet rays, or the like.

[0059] Furthermore, in the above-described embodiment, the dust collecting device 150 and the ejecting device 152 are provided. However, at least one of the dust collecting device 150 and the ejecting device 152 may be provided.

[0060] In the above embodiment, the ejection device 152 operates when the electronic component 84 is held by the mounting head 26 from the tape feeder 70 . However, the ejection device 152 may operate at other times, for example, when the cover tape 86 is peeled off from the component tape 80 .

[0061] In addition, in the above embodiment, the dust collecting device 150 and the ejecting device 152 are arranged on the duct 106 , but they may be arranged at other locations, such as the arrangement frame 36 .

[0062] In the above embodiment, the tape feeder 70 is used to supply components from the component tape 80 containing the electronic components 84 in the containing recess 88. However, a tape feeder may be used to supply components from a component tape obtained by taping the leads of lead components.

[0063] Description of Reference Numerals

[0064] 16: Mounting machine (substrate work machine) 22: Conveyor device 26: Mounting head (holding device) 32: Ion generator (static removal device) 70: Tape feeder 80: Component tape 86: Cover tape 100: Supply position 102: Peeling position 150: Dust collector (suction device) 152: Spray device.

Claims

1. A substrate processing machine comprising: Anti-static device to remove static electricity; and The suction device is arranged in the irradiation direction of the static electricity removal device and attracts foreign matter.

2. The substrate working machine according to claim 1, wherein: The substrate working machine includes a tape feeder for supplying components at a supply position. The static electricity removal device removes static electricity from the components at the supply position. The suction device is disposed on the downstream side of the supply position in the irradiation direction of the static electricity removal device.

3. The substrate working machine according to claim 2, wherein: The substrate handling machine includes a conveying device for conveying substrates. The conveying device is disposed on the downstream side of the suction device in the irradiation direction of the static electricity removal device.

4. A substrate processing machine comprising: A tape feeder feeds components from a component tape with the cover tape stripped off; a conveying device for conveying a substrate; and The suction device is disposed between a peeling position where the cover tape is peeled off from the component tape in the tape feeder and the conveyor device, and sucks foreign matter.

5. The substrate working machine according to claim 3 or 4, wherein: The substrate working machine includes a blowout device, which is disposed near the suction device and blows gas in a direction away from the conveying device.

6. The substrate working machine according to claim 5, wherein: The ejection device operates only when the components are held from the tape feeder by the holding device.

7. The substrate working machine according to claim 1, wherein: The suction device is always in operation when the substrate working machine is operating.

8. A method for attracting foreign matter, comprising: attracting the foreign matter by using a suction device disposed in an irradiation direction of a static electricity removal device for removing static electricity.

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