A top layer spraying cleaning mechanism for processing crystalline silicon plates

Abstract

The application discloses a top layer spraying cleaning mechanism for processing crystalline silicon plates and relates to the technical field of crystalline silicon plate cleaning. The mechanism comprises a working frame, a conveying device and a cleaning assembly arranged on the working frame. The cleaning assembly comprises fixed frames fixedly connected to the working frame, adjusting holes arranged on the two fixed frames, adjusting blocks slidably connected to the two adjusting holes, a servo motor fixedly connected to one of the adjusting blocks, a rotating shell fixedly connected to the output shaft of the servo motor, two cleaning brushes rotatably connected to the rotating shell, bristles and rotating shafts of the cleaning brushes, two drive motors fixedly connected to the rotating shell, and output shafts of the two drive motors fixedly connected to the rotating shafts of the two cleaning brushes. The two cleaning brushes are switched. Compared with the single cleaning brush of the prior art, the mechanism can avoid the polluted cleaning brush continuously cleaning the crystalline silicon plate, thereby preventing the subsequent crystalline silicon plate from being secondarily polluted and ensuring the cleaning effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of crystalline silicon plate cleaning, in particular to a top surface layer spraying cleaning mechanism for crystalline silicon plate processing. BACKGROUND

[0002] As the core component of photovoltaic cells, the surface cleanliness of crystalline silicon plates directly affects the light absorption efficiency and power generation performance. According to industry standards, even tiny contaminants (such as silicon powder, oil stains, and particulate matter) can significantly reduce the conversion efficiency of crystalline silicon plates. Therefore, surface cleaning is a critical process during the processing of crystalline silicon plates. In the existing processing of crystalline silicon plates, cleaning is usually performed using a spraying and rolling brush integrated device. This device sprays cleaning agents through a spraying system and mechanically wipes the surface of the crystalline silicon plate with a rotating brush roll at the bottom to remove residual contaminants on the surface of the crystalline silicon plate.

[0003] However, the existing rolling brush structure continuously contacts contaminants during long-term operation, leading to the continuous accumulation of contaminants at the root of the brush, which in turn causes the secondary transfer of contaminants. This can result in incomplete cleaning of subsequent crystalline silicon plates. In addition, the crystalline silicon plate is located below the rolling brush, and the position of the rolling brush is usually fixed. This fixed design lacks the ability to adapt to changes in the thickness of the crystalline silicon plate. When processing crystalline silicon plates of different thicknesses, the contact pressure and gap between the rolling brush and the crystalline silicon plate cannot be adjusted, which may result in insufficient cleaning pressure or excessive pressure on the crystalline silicon plate. SUMMARY

[0004] To solve the above technical problems, the present application provides a top surface layer spraying cleaning mechanism for crystalline silicon plate processing.

[0005] The technical solution is as follows:

[0006] A top surface layer spraying cleaning mechanism for crystalline silicon plate processing, comprising a workbench, a conveying device is arranged on the workbench, and a cleaning assembly is also arranged on the workbench;

[0007] The cleaning assembly comprises two fixed seats fixedly connected to the two sides of the workbench, two fixed frames are fixedly connected to the two fixed seats, two adjusting holes are formed in the two fixed frames, an adjusting block is slidably connected inside each adjusting hole, a servo motor is fixedly connected to one of the adjusting blocks, a through hole is formed in the middle of each adjusting block, the output shaft of the servo motor passes through the through hole in the adjusting block and is fixedly connected to a rotating shell, two cleaning brushes are rotatably connected to the rotating shell, the cleaning brush comprises bristles and a rotating shaft, two drive motors are fixedly connected to the rotating shell, and the output shafts of the two drive motors are fixedly connected to the rotating shafts of the two cleaning brushes;

[0008] The rotating shell is provided with a cleaning assembly, which comprises a drain groove arranged in the middle of the rotating shell, a baffle fixedly connected to the middle of the groove wall of the drain groove, the baffle dividing the drain groove into two parts not communicated with each other, a connecting pipe fixedly connected to the drain groove on the side of the rotating shell away from the servo motor, and a drain pipe rotatably connected to the end of the connecting pipe away from the rotating shell.

[0009] Further, the rotating shell comprises two semicircular hollow core columns connected with each other, one of the two semicircular hollow core columns is open upward, and the other is open downward, and the bristles of the cleaning brush are exposed from the lower opening of the rotating shell.

[0010] Further, the output shaft of the servo motor and the outer surface of the connecting pipe are both fixedly connected with a pushing disc, the top of the fixed frame is fixedly connected with two fixed sleeves at both ends, two lifting frames are slidingly connected to the two fixed sleeves, a lifting cover is fixedly connected between the two lifting frames, the lifting cover and one of the semicircular hollow core columns of the rotating shell can be combined into a complete hollow core column, and a water delivery pipe is fixedly connected to the top of the lifting cover.

[0011] Further, the inside of the lifting cover is fixedly connected with a plurality of scrapers arranged in a linear array.

[0012] Further, the drain groove is composed of a transverse through groove and a plurality of vertical through holes, the through groove is located at the connecting position of the two semicircular hollow core columns of the rotating shell, the through holes are communicated with the through groove, and the through holes are communicated with the two semicircular hollow core columns.

[0013] Further, two V-shaped grooves are arranged on each of the two pushing discs, the two V-shaped grooves are spaced apart by 180°, one side groove wall of the V-shaped groove is a vertical edge, and the other side groove wall is an inclined edge, the two lifting frames are both L-shaped, and the bottom of each of the two lifting frames is provided in a circular arc shape.

[0014] Further, an adjusting assembly is fixedly connected to each of the two fixed frames, the adjusting assembly comprises two fixed blocks fixedly connected to the outer surface of the fixed frame, two fixed blocks are arranged on each end of the fixed frame, a rotating hole is arranged in each of the fixed blocks, a threaded rod is rotatably connected in the rotating holes of the two fixed blocks, a handle is rotatably connected to the top end of the threaded rod after the top end of the threaded rod passes through the rotating hole of the top fixed block, the handle is L-shaped, a limiting groove block is fixedly connected to the top of the fixed frame, one end of the handle away from the threaded rod can be clamped with the limiting groove block, an adjusting block passes through the adjusting hole, the two fixed blocks are located on one side of the adjusting block passing through the adjusting hole, a through hole is arranged in the end of the adjusting block passing through the adjusting hole, a nut is fixedly installed in the through hole, and the threaded rod is in threaded connection with the nut.

[0015] As described above, the beneficial effects of the upper surface layer spray cleaning mechanism for processing crystalline silicon plates in the application are as follows:

[0016] By switching between two cleaning brushes, compared to the existing single cleaning brush that washes the silicon wafers for a long time, it can avoid the contaminated cleaning brush continuously cleaning the silicon wafers, which would cause secondary contamination of the silicon wafers and ensure the cleaning effect.

[0017] By setting up two switchable cleaning brushes, one of them can clean the silicon wafer while the other can clean itself. Compared to existing cleaning brushes that require the machine to be stopped for cleaning, this method can achieve automatic cleaning without stopping the machine, which improves cleaning efficiency. At the same time, it can avoid the accumulation of stains on the cleaning brush, ensuring that the cleaning brush keeps the silicon wafer clean when cleaning it. This reduces the situation where the cleaning of the silicon wafer is not thorough due to stains on the cleaning brush, and requires rework, thereby improving the quality of cleaning the silicon wafer.

[0018] By adjusting the height of the cleaning brush using the adjustable components, the cleaning pressure of the cleaning brush on the crystalline silicon panel can be adjusted, ensuring the effectiveness of the cleaning brush in washing the crystalline silicon panel. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the overall components of the present invention;

[0020] Figure 2 This is a three-dimensional schematic diagram of the work frame, conveying device, cleaning brush, and other components of the present invention;

[0021] Figure 3 This is a three-dimensional cross-sectional view of the overall components of the present invention;

[0022] Figure 4 This is a cross-sectional perspective view of the rotating shell, cleaning brush, drainage channel, and other components of the present invention.

[0023] Figure 5 For the present invention Figure 4 Enlarged schematic diagram of component A in the middle;

[0024] Figure 6 This is a three-dimensional schematic diagram of the lifting frame, lifting cover, and water supply pipe of the present invention;

[0025] Figure 7 This is a cross-sectional perspective view of the adjusting hole, adjusting block, threaded rod, and other components of the present invention.

[0026] Figure 8 This is a three-dimensional schematic diagram of the rotating shell, cleaning brush, connecting pipe, drain pipe, and other components of the present invention.

[0027] Figure 9 This is a three-dimensional schematic diagram of the connecting pipe, pushing plate, and other components of the present invention;

[0028] Figure 10 This is a three-dimensional schematic diagram of the components of the present invention, such as the pushing plate, the fixing sleeve, and the lifting frame;

[0029] Figure 11 For the present invention Figure 7 Enlarged schematic diagram of component B in the middle.

[0030] The reference numerals in the accompanying drawings of this invention are:

[0031] 1. Work frame; 2. Conveying device; 3. Crystalline silicon plate;

[0032] Cleaning components: 41. Mounting base; 42. Mounting bracket; 43. Adjustment hole; 44. Adjustment block; 45. Servo motor; 46. Rotating housing; 47. Cleaning brush; 48. Drive motor;

[0033] Cleaning components: 51. Drainage trough; 52. Baffle; 53. Connecting pipe; 54. Drain pipe; 55. Push plate; 56. Fixing sleeve; 57. Lifting frame; 58. Lifting cover; 59. Water supply pipe; 510. Scraper;

[0034] Adjustment components: 61. Fixing block; 62. Threaded rod; 63. Handle; 64. Limiting groove block. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] The embodiments provided by the present invention will be described in detail below:

[0037] like Figures 1 to 5 and Figures 7 to 9 As shown, a surface spray cleaning mechanism for processing crystalline silicon panels includes a work frame 1, on which a conveying device 2 for conveying crystalline silicon panels 3 is provided. The conveying device 2 can be a common synchronous belt conveyor line. The work frame 1 is provided with two sets of cleaning components for cleaning the crystalline silicon panels 3.

[0038] Each cleaning assembly includes two fixed seats 41 bolted to both sides of the work frame 1. Each fixed seat 41 is fixedly connected to a fixed bracket 42. Each fixed bracket 42 has an adjustment hole 43, and an adjustment block 44 is slidably connected inside each adjustment hole 43, allowing the adjustment block 44 to move linearly up and down within the adjustment hole 43. A servo motor 45 is fixedly connected to one of the adjustment blocks 44. Both adjustment blocks 44 have through holes in their middle sections. The output shaft of the servo motor 45 passes through the through hole on the adjacent adjustment block 44. A rotating housing 46 is fixedly connected to the output shaft of the servo motor 45. Two cleaning brushes 47 are rotatably connected to the rotating housing 46. Each cleaning brush 47 consists of bristles and a rotating shaft. Two drive motors 48 are bolted to the side of the rotating housing 46 closest to the servo motor 45. The output shafts of the two drive motors 48 are fixedly connected to the rotating shafts of the two cleaning brushes 47, respectively.

[0039] It should be noted that, referring to Figure 1 A rinsing device (not shown) is installed above the two cleaning components to spray cleaning agent onto the upper surface of the crystalline silicon plate 3.

[0040] like Figure 3 as well as Figure 8 As shown, the rotating housing 46 includes two connected semi-circular hollow columns with their openings facing away from each other, one opening facing upwards and the other facing downwards. The bristles of the cleaning brush 47 protrude from the lower opening of the rotating housing 46.

[0041] Specifically, during the cleaning of the crystalline silicon plate 3, the rinsing device is activated, spraying cleaning agent downwards. Simultaneously, the conveying device 2 and the drive motor 48 are also activated. Figure 1 As shown, the conveying device 2 conveys from left to right, and the output shaft of the drive motor 48 drives the cleaning brush 47 to rotate. At this time, the crystalline silicon plate 3 moves from left to right with the conveying device 2. The crystalline silicon plate 3 passing the bottom of the cleaning brush 47 will be washed by the rotating cleaning brush 47. The upper surface of the crystalline silicon plate 3 can be cleaned by the cleaning brush 47 in conjunction with the rinsing device.

[0042] After a period of cleaning with a single brush 47, contaminants will accumulate at the base of the bristles. To avoid secondary contamination, the two brushes 47 should be swapped so that a clean brush 47 can perform the cleaning work. Specifically, refer to... Figure 6As shown, when the servo motor 45 starts, its output shaft drives the rotating housing 46 to rotate 180 degrees counterclockwise. The rotating housing 46 then drives the cleaning brushes 47 to rotate counterclockwise synchronously, causing the top cleaning brush 47 to rotate to the bottom and the bottom cleaning brush 47 to rotate to the top. By swapping the positions of the two cleaning brushes 47, compared to the existing method of using a single cleaning brush 47 to clean the silicon wafer 3 for an extended period, it avoids the secondary contamination of the silicon wafer 3 caused by prolonged contact between a single cleaning brush 47 and the contaminated silicon wafer 3. The interval between the swapping of the two cleaning brushes 47 can be set according to the actual situation. The interval between the swapping is the starting interval of the servo motor 45. Each time the servo motor 45 starts, its output shaft rotates 180 degrees.

[0043] like Figures 1 to 10 As shown, a cleaning assembly for cleaning the bristles of the two cleaning brushes 47 is provided on the rotating housing 46. The cleaning assembly includes a drainage groove 51 located in the middle of the rotating housing 46. The drainage groove 51 is located at the connection position of the two semi-circular hollow columns of the rotating housing 46. The drainage groove 51 consists of a horizontal through groove and multiple vertical through holes. The through holes are connected to the through groove and the two semi-circular hollow columns. A baffle 52 is fixedly connected to the middle of the groove wall of the drainage groove 51. A connecting pipe 53 is fixedly connected to the side of the rotating housing 46 away from the servo motor 45. A drain pipe 54 is rotatably connected to the end of the connecting pipe 53 away from the rotating housing 46. Pushing discs 55 are fixedly connected to the output shaft of the servo motor 45 and the outer surface of the connecting pipe 53. Fixed sleeves 56 are fixedly connected to both ends of the top of the fixed frame 42. Lifting frames 57 are slidably connected to both fixed sleeves 56. A lifting cover 58 is fixedly connected between the two lifting frames 57 by bolts. A water supply pipe 59 is fixedly connected to the top of the lifting cover 58, and multiple scrapers 510 arranged in a linear array are installed inside the lifting cover 58.

[0044] It should be noted that the baffle 52 divides the drainage trough 51 into upper and lower parts, which are not connected. The end of the baffle 52 near the connecting pipe 53 extends into the interior of the connecting pipe 53, preventing sewage from being discharged directly downwards into the semi-circular hollow column at the bottom of the rotating shell 46 during the sewage discharge process, and guiding the sewage to flow into the connecting pipe 53. The connecting pipe 53 is connected to the transverse through-slot of the drainage trough 51, and the end of the connecting pipe 53 away from the rotating shell 46 passes through the through-hole of the nearby adjusting block 44. The drainage pipe 54 can be connected to a sewage collection tank to collect sewage for centralized treatment.

[0045] Each of the two pushing discs 55 has two V-shaped grooves, spaced 180° apart. One side of each V-shaped groove is vertical, and the other side is inclined. This allows the lifting frame 57 to quickly enter the groove from the vertical side and slide out from the inclined side. Both lifting frames 57 are L-shaped with rounded bottoms to facilitate sliding within the V-shaped grooves of the pushing discs 55. The lifting cover 58 is similar in shape to the semi-circular hollow column of the rotating shell 46, meaning the lifting cover 58 and one semi-circular hollow column of the rotating shell 46 can be combined to form a complete hollow cylinder. The water supply pipe 59 consists of multiple vertical pipes and a horizontal pipe connecting all the vertical pipes. The vertical pipes of the water supply pipe 59 are connected to the interior of the lifting cover 58, and one end of the horizontal pipe is connected to a water pump.

[0046] Specifically, during the rotation of the aforementioned rotating shell 46, the rotating shell 46 will drive the connecting pipe 53 to rotate synchronously, as shown in the figure. Figure 9 and Figure 10As shown, the rotation of the output shaft of the servo motor 45 and the connecting pipe 53 will drive the two pushing disks 55 to rotate counterclockwise synchronously. When the pushing disks 55 rotate counterclockwise, the bottom of the lifting frame 57 will slide along the inclined side of the V-shaped groove at the top of the pushing disk 55 to the outer circumference of the pushing disk 55. Through the pushing action of the pushing disks 55, the lifting frame 57 moves upward inside the fixed sleeve 56. The lifting frame 57 will drive the lifting cover 58 to move upward synchronously. Therefore, when the rotating shell 46 drives the cleaning brush 47 to change, the lifting cover 58 will disengage from the semi-circular hollow column at the top of the rotating shell 46. That is, the lifting cover 58 will not block the rotating shell 46 from driving the two cleaning brushes 47 to change. When the rotating shell 46 rotates 180 degrees, that is, the rotating shell 46 drives the cleaning brush 47 that was originally located at the bottom to move... After reaching the top, the push plate 55 also rotates 180 degrees. The V-shaped groove on the push plate 55, which has rotated to the top, aligns with the lifting frame 57. Under the action of gravity, the lifting frame 57 moves downward inside the fixed sleeve 56 and inserts into the V-shaped groove. The lifting cover 58 also moves downward and combines with the semi-circular hollow column of the rotating shell 46, which has rotated to the top, to form a sealed full-circular hollow column. At this time, the cleaning brush 47, which has rotated to the top, is located inside the full-circular hollow column. The cleaning brush 47 cleans in the sealed space. The water pump sprays water into the sealed space formed by the lifting cover 58 and the semi-circular hollow column of the rotating shell 46 through the water pipe 59. At this time, the drive motor 48 is not turned off. The output shaft of the drive motor 48 will drive the cleaning brush 47 to rotate. During the rotation of the cleaning brush 47, the water sprayed out will clean the cleaning brush 47 360°. In summary, by using two switchable cleaning brushes 47, one brush can clean the silicon wafer 3 while the other cleans itself. Compared to existing cleaning brushes 47 that require machine shutdown for cleaning, this method allows for automatic cleaning of the brushes 47 without stopping the machine, improving cleaning efficiency. It also prevents the accumulation of dirt on the brushes 47, ensuring they remain clean when cleaning the silicon wafer 3. This reduces the likelihood of incomplete cleaning and rework due to dirt on the brushes 47, thus improving the quality of cleaning the silicon wafer 3.

[0047] It should be noted that during the rotation of the sweeping brush 47, its bristles will come into contact with the scraper 510 inside the lifting cover 58. The scraper 510 can scrape off the dirt on the sweeping brush 47, and then, under the action of water flow, the dirt is flushed into the drain trough 51. The scraper 510 ensures that the sweeping brush 47 can be cleaned more effectively. The sewage entering the drain trough 51 is guided by the baffle 52 to flow into the connecting pipe 53, and finally discharged outward into the sewage collection tank through the drain pipe 54.

[0048] like Figures 8 to 11As shown, both fixed brackets 42 are fixedly connected to an adjustment component for adjusting the cleaning pressure of the cleaning brush 47 on the silicon wafer 3. The adjustment component includes a fixed block 61 fixedly connected to the outer surface of the fixed bracket 42. Each fixed bracket 42 has two fixed blocks 61 at both ends. Each fixed block 61 has a rotating hole. A threaded rod 62 is rotatably connected in the rotating holes of the two fixed blocks 61. The top end of the threaded rod 62 passes through the rotating hole of the top fixed block 61 and is rotatably connected to a handle 63. The handle 63 is L-shaped. A limiting groove block 64 is fixedly connected to the top of the fixed bracket 42. The end of the handle 63 away from the threaded rod 62 can be engaged with the limiting groove block 64.

[0049] It should be noted that one end of the adjusting block 44 protrudes through the adjusting hole 43, and the two fixing blocks 61 are located on the side of the adjusting block 44 protruding through the adjusting hole 43. A through hole is opened on the end of the adjusting block 44 protruding through the adjusting hole 43, and a nut is fixedly installed in the through hole. The threaded rod 62 is threadedly connected to the nut.

[0050] For silicon wafers 3 of different thicknesses, the height of the cleaning brush 47 needs to be adjusted to regulate the cleaning pressure of the cleaning brush 47 on the silicon wafer 3. Specifically, the operator rotates the two handles 63 180 degrees so that neither handle 63 is engaged with the limiting slot 64. Then, the operator holds the two handles 63 and rotates them, causing the two handles 63 to drive the two threaded rods 62 to rotate on the fixed block 61. At this time, the two threaded rods 62 will cooperate with the threaded holes on the two adjusting blocks 44, causing the two adjusting blocks 44 to move up and down inside the corresponding adjusting holes 43. The up and down movement of the two adjusting blocks 44 will also drive the servo motor 45 and the connecting pipe 53 to move up and down synchronously. In turn, the connecting pipe 53 and the servo motor 45 simultaneously drive the rotating shell 46 to move up and down. The up and down movement of the rotating shell 46 will drive the cleaning brush 47 to move up and down synchronously, thereby adjusting the cleaning pressure of the cleaning brush 47 on the silicon wafer 3 and ensuring the effectiveness of the cleaning brush 47 in cleaning the silicon wafer 3.

[0051] After adjusting the vertical position of the sweeping brush 47, the operator flips the handle 63 again, causing it to engage with the limiting slot 64 once more. This engagement prevents the threaded rod 62 from rotating, thus locking the positions of the adjusting block 44, servo motor 45, connecting pipe 53, rotating housing 46, and sweeping brush 47, ensuring the brush 47's position is fixed after adjustment. The flipped handle 63 must align with the limiting slot 64 for proper engagement. If misalignment occurs, the handle 63 needs slight rotation to engage with the limiting slot 64. Since the thread pitch of the threaded rod 62 is small, slight rotation will not significantly affect the height of the sweeping brush 47.

[0052] It should be noted that when the servo motor 45 and the connecting pipe 53 move downward, the two pushing plates 55 also move downward. Under the action of gravity, the lifting frame 57 will move downward on the fixed sleeve 56 until it comes into contact with the pushing plates 55. The lifting cover 58 will also move downward synchronously. Therefore, the lifting cover 58 can always contact the semi-circular hollow column at the top of the rotating shell 46.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A surface spray cleaning mechanism for processing crystalline silicon panels, comprising a work frame (1) and a conveying device (2) disposed on the work frame (1), characterized in that, The work rack (1) is also equipped with a cleaning component; The cleaning assembly includes two fixed seats (41) fixedly connected to both sides of the work frame (1). Each fixed seat (41) is fixedly connected to a fixed frame (42). Each fixed frame (42) is provided with an adjustment hole (43). An adjustment block (44) is slidably connected inside each adjustment hole (43). A servo motor (45) is fixedly connected to one of the adjustment blocks (44). A through hole is provided in the middle of each of the two adjustment blocks (44). The output shaft of the servo motor (45) passes through the through hole on the adjustment block (44) and is fixedly connected to a rotating shell (46). Two cleaning brushes (47) are rotatably connected to the rotating shell (46). Each cleaning brush (47) includes bristles and a rotating shaft. Two drive motors (48) are fixedly connected to the rotating shell (46). The output shafts of the two drive motors (48) are fixedly connected to the rotating shafts of the two cleaning brushes (47) respectively. A cleaning assembly is provided on the rotating housing (46). The cleaning assembly includes a drainage trough (51) opened in the middle of the rotating housing (46). A baffle (52) is fixedly connected to the middle of the wall of the drainage trough (51). The baffle (52) divides the drainage trough (51) into two parts that are not connected to each other. A connecting pipe (53) connected to the drainage trough (51) is fixedly connected to the side of the rotating housing (46) away from the servo motor (45). A drain pipe (54) is rotatably connected to the end of the connecting pipe (53) away from the rotating housing (46). The rotating shell (46) includes two connected semi-circular hollow columns, one of which has an opening facing upwards and the other has an opening facing downwards. The bristles of the cleaning brush (47) protrude from the lower opening of the rotating shell (46). The output shaft of the servo motor (45) and the outer surface of the connecting pipe (53) are both fixedly connected to the push plate (55). The top two ends of the fixed frame (42) are fixedly connected to the fixed sleeve (56). The two fixed sleeves (56) are slidably connected to the lifting frame (57). The two lifting frames (57) are fixedly connected to the lifting cover (58). The lifting cover (58) and a semi-circular hollow column of the rotating shell (46) can be combined to form a complete hollow cylinder. The top of the lifting cover (58) is fixedly connected to the water supply pipe (59). The lifting cover (58) has multiple scrapers (510) arranged in a linear array inside.

2. The upper surface spray cleaning mechanism for processing crystalline silicon substrates according to claim 1, characterized in that, The drainage trough (51) consists of a horizontal through groove and multiple vertical through holes. The through groove is located at the connection point of the two semi-circular hollow columns of the rotating shell (46). The through holes are connected to the through groove and to the two semi-circular hollow columns.

3. The upper surface spray cleaning mechanism for processing crystalline silicon substrates according to claim 1, characterized in that, Two V-shaped grooves are provided on each of the two push plates (55), with the two V-shaped grooves spaced 180° apart. One side of the groove wall is a vertical side and the other side is a slanted side. Both lifting frames (57) are L-shaped, and the bottom of both lifting frames (57) is set as an arc.

4. The upper surface spray cleaning mechanism for processing crystalline silicon panels according to claim 1, characterized in that, An adjustment assembly is fixedly connected to each of the two fixed frames (42). The adjustment assembly includes two fixed blocks (61) fixedly connected to the outer surface of the fixed frame (42). Each fixed frame (42) has two fixed blocks (61) at both ends. Each fixed block (61) has a rotating hole. A threaded rod (62) is rotatably connected to the rotating holes of the two fixed blocks (61). The top end of the threaded rod (62) passes through the rotating hole of the top fixed block (61) and is rotatably connected to a handle (63). The hand (63) is L-shaped. The top of the fixed frame (42) is fixedly connected to the limiting groove block (64). The end of the handle (63) away from the threaded rod (62) can be engaged with the limiting groove block (64). One end of the adjusting block (44) passes through the adjusting hole (43). Two fixed blocks (61) are located on the side where the adjusting block (44) passes through the adjusting hole (43). A through hole is opened on the end of the adjusting block (44) that passes through the adjusting hole (43). A nut is fixedly installed in the through hole. The threaded rod (62) is threadedly connected to the nut.

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