Touch module and electronic equipment

Abstract

The invention provides a touch module and electronic equipment. The touch module comprises a touch panel and a circuit board, the touch panel is provided with a touch area and a non-touch area, and the non-touch area comprises a wiring area and a binding area; the touch panel comprises a first silver paste layer and an isolation layer, the first silver paste layer comprises a plurality of first wires and a plurality of first bonding pads, the first wires are located in the wire area, the first bonding pads are located in the binding area, the first bonding pads and the first wires are connected in a one-to-one correspondence mode, the isolation layer is located on the side, close to the circuit board, of the first silver paste layer, and the isolation layer is provided with a plurality of through holes; conductive adhesive is arranged between the first bonding pad and the circuit board, the through hole is used for allowing the conductive adhesive to penetrate through, and the first bonding pad is electrically connected with the circuit board through the conductive adhesive. The isolation layer has a certain heat insulation capability, and is beneficial to reducing the heat receiving amount of the first silver paste layer, so that the deformation amount of the first silver paste layer caused by heating can be reduced, and the possibility that the first wire is fractured due to the influence of the segment difference is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of touch control, in particular to a touch module and an electronic device. BACKGROUND

[0002] In the related art, the non-touch area of the touch panel is provided with a silver paste layer. In the wiring area, the silver paste layer is configured as a plurality of silver paste lines, and the silver paste lines are used to connect with the touch electrodes in the touch area. In the binding area, the silver paste layer is configured as a plurality of pads, and each pad is connected with a corresponding silver paste line.

[0003] When the circuit board is bound with the touch panel, a conductive adhesive hot pressing process is usually used to electrically connect the pads with the circuit board through the conductive adhesive. However, in the process of hot pressing, the silver paste layer is prone to breakage, which makes the risk of breakage of the silver paste line higher. SUMMARY

[0004] The present application provides a touch module and an electronic device, which aims to reduce the risk of breakage of the silver paste line.

[0005] The specific technical solutions are as follows:

[0006] An embodiment of the first aspect of the present application provides a touch module, which comprises a touch panel and a circuit board, the touch panel has a touch area and a non-touch area, the non-touch area comprises a wiring area and a binding area; the touch panel comprises a first silver paste layer and an isolation layer, the first silver paste layer comprises a plurality of first wires and a plurality of first pads, the first wires are located in the wiring area, the first pads are located in the binding area, the first pads and the first wires are connected one by one, the isolation layer is located on the side of the first silver paste layer close to the circuit board, and the isolation layer is provided with a plurality of through holes; the first pads and the circuit board are provided with conductive adhesive therebetween, the through holes are used for the conductive adhesive to pass through, and the first pads are electrically connected with the circuit board through the conductive adhesive.

[0007] The touch module in the embodiment of the present application is provided with an isolation layer on the side of the first silver paste layer close to the circuit board. When the circuit board is bound with the touch panel, the isolation layer is between the circuit board and the first silver paste layer, and the isolation layer has a certain heat insulation capacity. Therefore, it is beneficial to reduce the heat received by the first silver paste layer, so as to reduce the deformation amount of the first silver paste layer caused by heat, thereby reducing the possibility of breakage of the first wire caused by the influence of the section difference and reducing the risk of breakage.

[0008] In some embodiments of the present application, the touch panel further comprises a first optical adhesive layer, the first optical adhesive layer and the isolation layer are located on the same side of the first silver paste layer, the first optical adhesive layer is located in the wiring area, and a gap is formed between the edge of the first optical adhesive layer and the binding area. The gap can provide a clearance for the hot-pressing mold during the hot-pressing process, so as to avoid the hot-pressing mold from contacting the first optical adhesive layer and causing deformation of the first optical adhesive layer.

[0009] In some embodiments of the present application, the isolation layer comprises a first isolation part and a second isolation part connected to each other, the first isolation part is located in the binding area, and the through hole is arranged in the first isolation part; the second isolation part is located in the gap and covers the first wiring located in the gap position. The first isolation part is located in the binding area and between the circuit board and the first silver paste layer, which can reduce the heat received by the first silver paste layer during hot-pressing. The second isolation part is arranged in the gap and covers the first wiring located in the gap position, so as to avoid the first wiring in the gap from being exposed to air, thereby improving the problems of easy oxidation and blackening and easy silver migration of the first wiring caused by exposure.

[0010] In some embodiments of the present application, the isolation layer further comprises a third isolation part connected to the second isolation part, the third isolation part is located on the side of the second isolation part away from the first isolation part; and the third isolation part is located between the first silver paste layer and the first optical adhesive layer. The isolation layer can not only reduce the deformation of the first silver paste layer when heated by heat insulation, but also can strengthen the strength of the first silver paste layer to a certain extent in the case of combination of the isolation layer and the first silver paste layer. Part of the isolation layer extends to the position where the first optical adhesive layer is located, so that the range of the strengthening effect of the isolation layer on the first silver paste layer can cover the position where the step is located, thereby further reducing the possibility of fracture of the first wiring caused by the influence of the step.

[0011] In some embodiments of the present application, the touch panel further comprises a PET film located on the side of the first silver paste layer away from the first optical adhesive layer, a second optical adhesive layer located on the side of the PET film away from the first optical adhesive layer, and a second silver paste layer located on the side of the second optical adhesive layer away from the PET film, the second silver paste layer comprising a plurality of second wirings; the touch panel further comprises a first touch electrode layer and a second touch electrode layer located in the touch area, the first wiring is electrically connected to the first touch electrode layer, and the second wiring is electrically connected to the second touch electrode layer. The PET film is arranged between the first silver paste layer and the second silver paste layer, and the PET film has good mechanical properties, so that the touch panel has good stretch resistance.

[0012] In some embodiments of the present application, the material of the isolation layer is a thermosetting resin or a UV resin.

[0013] In some embodiments of the present application, the thickness of the isolation layer is greater than or equal to 1 μm and less than or equal to 10 μm. By setting the thickness of the isolation layer to be greater than or equal to 1 μm and less than or equal to 10 μm, the heat received by the first silver paste layer in the hot-pressing process can be reduced more obviously, thereby reducing the risk of disconnection of the first trace, and the thickness of the touch module will not be increased significantly.

[0014] In some embodiments of the present application, the aperture size of the through hole is greater than or equal to 0.1 mm and less than or equal to 0.3 mm. By setting the aperture size of the through hole to be within the above range, the conductive adhesive can be filled into the through hole sufficiently, thereby establishing a stable electrical connection relationship between the first pad and the circuit board, and the isolation layer can have a relatively good heat insulation property.

[0015] In some embodiments of the present application, the distance between adjacent through holes is greater than or equal to 0.05 mm and less than or equal to 0.6 mm. By setting the distance between adjacent through holes to be within the above range, the isolation layer can have a good heat insulation effect and strength, and the first pad and the circuit board can have a good electrical connection stability.

[0016] Embodiments of the second aspect of the present application provide an electronic device, which includes the touch module of any one of the embodiments of the first aspect.

[0017] In the electronic device of the embodiments of the present application, the touch module is provided with the isolation layer on one side of the first silver paste layer, and the circuit board of the touch module is arranged on the side of the isolation layer away from the first silver paste layer. When the circuit board and the touch panel are bonded, the isolation layer is arranged between the circuit board and the first silver paste layer, and the isolation layer has a certain heat insulation capacity. Thus, the amount of heat received by the first silver paste layer can be reduced, thereby reducing the deformation amount of the first silver paste layer caused by heat, and the possibility of disconnection of the first trace caused by the segment difference can be reduced, thereby reducing the risk of disconnection. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A schematic diagram of a touch module according to an embodiment of the present application;

[0019] Figure 2 A schematic diagram of a touch module according to an embodiment of the present application (the circuit board is hidden);

[0020] Figure 3 A schematic diagram of a touch module according to an embodiment of the present application (the circuit board is hidden); Figure 1 A schematic diagram of a cross section A-A in an embodiment;

[0021] Figure 4Schematic top view of the isolation layer;

[0022] Figure 5 for Figure 1 Schematic diagram of section AA in another embodiment.

[0023] Description of reference numerals:

[0024] 10. Touch module;

[0025] 100. Touch panel;

[0026] 101. Touch area;

[0027] 102. Routing area; 103. Binding area;

[0028] 110, first silver paste layer; 111, first trace; 112, first pad;

[0029] 120, isolation layer; 121, first isolation portion; 122, second isolation portion; 123, third isolation portion; 125, through hole;

[0030] 130. First optical adhesive layer;

[0031] 140, PET film;

[0032] 150, second optical adhesive layer;

[0033] 160, second silver paste layer; 161, second trace;

[0034] 170. First touch electrode layer; 171. First touch electrode;

[0035] 180. Second touch electrode layer; 181. Second touch electrode;

[0036] 200, circuit board;

[0037] 300. Conductive adhesive. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0039] In the description of the present application, it needs to be understood that, if the orientation or position relationship indicated by the terms "upper", "lower", "left", "right" and the like is based on the orientation or position relationship shown in the drawings, it is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the position relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation of the present patent, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0040] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as implying or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0041] In the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for the purpose of illustration, and do not represent the only implementation.

[0043] In the related art, the non-touch area of the touch panel is provided with a silver paste layer. In the wiring area, the silver paste layer is configured as a plurality of silver paste lines, and the silver paste lines are used to connect with the touch electrodes in the touch area. In the binding area, the silver paste layer is configured as a plurality of pads, and each pad is connected with a corresponding silver paste line. When the circuit board is bound with the touch panel, the conductive adhesive hot pressing process is usually used to make the pads electrically connected with the circuit board through the conductive adhesive. However, in the process of implementing the hot pressing, the silver paste layer is prone to breakage, which makes the risk of short circuit of the silver paste line higher. The applicant of the present application has carried out a lot of research work and found the reason why the silver paste line is prone to short circuit. In the non-touch area, the optical adhesive layer and the PET film are usually placed below the silver paste layer, that is, the silver paste layer is arranged on the PET film, and the PET film is arranged on the optical adhesive layer. When the hot pressing process is implemented, the optical adhesive layer and the PET film are prone to local deformation under the action of high temperature and high pressure, which makes the optical adhesive layer and the PET film form a step at the junction position of the wiring area and the binding area. The silver paste has limited ductility, and the wiring formed by the silver paste is more prone to short circuit at the step.

[0044] The embodiment of the present application sets an isolation layer on the side of the silver paste layer close to the circuit board, and the isolation layer has a certain heat insulation capacity, which is beneficial to reduce the heat received by the silver paste layer, so as to reduce the deformation amount of the silver paste layer caused by heat, so as to reduce the possibility of breakage of the wiring formed by the silver paste.

[0045] Specifically, the first aspect of the present application provides a touch module 10. Figure 1 The schematic diagram of the touch module provided by an embodiment of the present application; Figure 2 The schematic diagram of the touch module provided by an embodiment of the present application (the circuit board is hidden); Figure 3 For Figure 1 The schematic diagram of the A-A section in an embodiment. As Figure 1 、 Figure 2 and Figure 3As shown, the touch module 10 in the embodiment of the present application includes a touch panel 100 and a circuit board 200. The touch panel 100 has a touch area 101 and a non-touch area, and the non-touch area includes a wiring area 102 and a binding area 103. The touch panel 100 includes a first silver paste layer 110 and a separation layer 120. The first silver paste layer 110 includes a plurality of first wirings 111 and a plurality of first pads 112. The first wirings 111 are located in the wiring area 102, and the first pads 112 are located in the binding area 103. The first pads 112 and the first wirings 111 are connected one by one. The separation layer 120 is located on a side of the first silver paste layer 110 close to the circuit board 200. The separation layer 120 is provided with a plurality of through holes 125. The conductive adhesive 300 is arranged between the first pads 112 and the circuit board 200. The through holes 125 are used for the conductive adhesive 300 to pass through. The first pads 112 are electrically connected to the circuit board 200 through the conductive adhesive 300.

[0046] Specifically, the first wirings 111 are silver paste wirings made by a silver paste printing process, and the first pads 112 are silver paste pads made by a silver paste printing process. The first wirings 111 are used to connect the touch electrodes of the touch area 101, and the first pads 112 are used to connect the circuit board 200, so as to realize the binding between the touch panel 100 and the circuit board 200. The circuit board 200 can be a PCB (Printed circuit board) or a PFC (Flexible Printed Circuit), and the latter has flexibility and can be selected according to actual needs.

[0047] It can be understood that a plurality of second pads can be arranged on the circuit board 200, and the second pads are arranged one by one corresponding to the first pads 112. In the case of binding the circuit board 200 and the touch panel 100, each first pad 112 is connected to a corresponding second pad through the conductive adhesive 300.

[0048] The touch module 10 in the embodiment of the present application is provided with the separation layer 120 on a side of the first silver paste layer 110 close to the circuit board 200. In the process of binding the circuit board 200 and the touch panel 100, the separation layer 120 is arranged between the circuit board 200 and the first silver paste layer 110. The separation layer 120 has a certain heat insulation capacity, which is beneficial to reduce the heat received by the first silver paste layer 110, so as to reduce the deformation amount of the first silver paste layer 110 caused by heat. Therefore, it is beneficial to reduce the possibility of the first wirings 111 being broken due to the influence of the segment difference, and reduce the risk of disconnection.

[0049] In some embodiments, as Figure 3As shown, the touch panel 100 further comprises a first optical adhesive layer 130, the first optical adhesive layer 130 and the isolation layer 120 are located on the same side of the first silver paste layer 110, the first optical adhesive layer 130 is located in the wiring area 102, and there is a gap between the edge of the first optical adhesive layer 130 and the binding area 103.

[0050] The first optical adhesive layer 130 is used to connect a cover plate, and the cover plate can be a glass cover plate, which can protect the touch panel 100 and has high light transmittance.

[0051] In this embodiment, the edge of the first optical adhesive layer 130 has a gap with the binding area 103, which can provide a space for the hot-pressing mold during the implementation of the hot-pressing process, so as to avoid the hot-pressing mold from contacting the first optical adhesive layer 130 and causing the deformation of the first optical adhesive layer 130.

[0052] It can be understood that the touch area 101 of the touch panel 100 is also usually provided with an optical adhesive layer for connecting the cover plate, and therefore, the optical adhesive layer can be additionally arranged in the touch area 101, or the first optical adhesive layer 130 can be extended to the touch area 101, so as to cover the touch area 101 and the wiring area 102 at the same time.

[0053] Figure 4 The top view of the isolation layer is shown in FIG. 12A, and the side view of the isolation layer is shown in FIG. 12B. Figure 3 、 Figure 4 As shown, in some embodiments, the isolation layer 120 comprises a first isolation part 121 and a second isolation part 122 connected to each other, the first isolation part 121 is located in the binding area 103, the through hole 125 is arranged in the first isolation part 121, the second isolation part 122 is located in the gap (the gap between the edge of the first optical adhesive layer 130 and the binding area 103), and covers the first wiring 111 located in the gap.

[0054] The gap between the edge of the first optical adhesive layer 130 and the binding area 103 is used to provide a space for the hot-pressing mold during the implementation of the hot-pressing process, however, the arrangement of the gap also exposes part of the structure of the first wiring 111 to the air, and in the case of high air humidity, the part of the first wiring 111 exposed to the air is easy to be oxidized and blackened, and silver migration phenomenon can also be caused, which can further cause the first wiring 111 made of silver paste to be broken.

[0055] In the embodiment, the isolation layer 120 includes a first isolation portion 121 and a second isolation portion 122. The first isolation portion 121 is located between the binding area 103 and the first silver paste layer 110, and functions to reduce the heat absorption of the first silver paste layer 110 during hot pressing. The second isolation portion 122 is arranged at the gap and covers the first trace 111 at the gap, so as to avoid the first trace 111 at the gap from being exposed to air, and thus improve the oxidation and blackening of the first trace 111 due to exposure.

[0056] Figure 5 For Figure 1 Fig. 4 is a schematic view of the cross section A-A in another embodiment. As shown in Fig. 4, in some embodiments, the isolation layer 120 further includes a third isolation portion 123 connected to the second isolation portion 122. The third isolation portion 123 is located on the side of the second isolation portion 122 away from the first isolation portion 121, and is located between the first silver paste layer 110 and the first optical adhesive layer 130. Figure 5

[0057] The isolation layer 120 not only reduces the deformation of the first silver paste layer 110 during heating by heat insulation, but also strengthens the strength of the first silver paste layer 110 to some extent when the isolation layer 120 is combined with the first silver paste layer 110. In the embodiment, the isolation layer 120 further includes the third isolation portion 123, which is located between the first silver paste layer 110 and the first optical adhesive layer 130. That is, a part of the isolation layer 120 extends to the position of the first optical adhesive layer 130. In this way, the range of the isolation layer 120 for strengthening the first silver paste layer 110 can cover the position of the step, so as to further reduce the possibility of the first trace 111 being broken due to the step.

[0058] In some embodiments, the touch panel 100 further includes a PET film 140, a second optical adhesive layer 150, and a second silver paste layer 160. The PET film 140 is located on the side of the first silver paste layer 110 away from the first optical adhesive layer 130. The second optical adhesive layer 150 is located on the side of the PET film 140 away from the first optical adhesive layer 130. The second silver paste layer 160 is located on the side of the second optical adhesive layer 150 away from the PET film 140, and includes a plurality of second traces 161. The touch panel 100 further includes a first touch electrode layer 170 and a second touch electrode layer 180 located in the touch area 101. The first trace 111 is electrically connected to the first touch electrode layer 170, and the second trace 161 is electrically connected to the second touch electrode layer 180.

[0059] ​The first touch electrode layer 170 can include a plurality of first touch electrodes 171, and the second touch electrode layer 180 can include a plurality of second touch electrodes 181. The first traces 111 are electrically connected with the first touch electrode layer 170, so as to transmit electrical signals to the first touch electrodes 171 in the first touch electrode layer 170. The second silver paste layer 160 includes a plurality of second traces, and the second traces are electrically connected with the second touch electrode layer 180, so as to transmit electrical signals to the second touch units in the second touch electrode layer 180. In addition, the PET film 140 is arranged between the first silver paste layer 110 and the second silver paste layer 160, and the PET film 140 has good mechanical properties, so that the touch panel 100 has good tensile resistance.

[0060] In some embodiments, the material of the isolation layer 120 is a thermosetting resin or a UV curing resin. Exemplarily, the thermosetting resin can be an acrylic resin, a silicone resin, etc. The UV curing resin can be a UV pure acrylic resin, a UV epoxy resin, a UV silicone oligomer, etc. In the case that the material of the isolation layer 120 is a thermosetting resin, the isolation layer 120 can be formed by first spraying and then heating. In the case that the material of the isolation layer 120 is a UV curing resin, the isolation layer 120 can be formed by first spraying and then irradiating with a UV lamp.

[0061] In some embodiments, the thickness of the isolation layer 120 is greater than or equal to 1 μm and less than or equal to 10 μm. If the thickness of the isolation layer 120 is too small, its heat insulation performance will be less obvious, so that the heat absorption of the first silver paste layer 110 in the hot pressing process cannot be significantly reduced. If the thickness of the isolation layer 120 is too large, it will cause the overall thickness of the touch module 10 to increase significantly. By setting the thickness of the isolation layer 120 to be greater than or equal to 1 μm and less than or equal to 10 μm, the heat absorption of the first silver paste layer 110 in the hot pressing process can be significantly reduced, thereby reducing the risk of disconnection of the first traces 111, and the overall thickness of the touch module 10 will not increase significantly.

[0062] In some embodiments, the aperture size of the through hole 125 is greater than or equal to 0.1 mm and less than or equal to 0.3 mm. If the aperture size of the through hole 125 is too small, it can cause the conductive glue 300 to be difficult to fill the through hole 125 sufficiently, thereby causing the first pad 112 to be electrically connected to the circuit board 200 poorly. If the aperture size of the through hole 125 is too large, it can affect the heat insulation of the isolation layer 120. In the present embodiment, the aperture size of the through hole 125 is greater than or equal to 0.1 mm and less than or equal to 0.3 mm. Through a large number of experiments, it is verified that the aperture size of the through hole 125 in the above range can not only enable the conductive glue 300 to fill the through hole 125 sufficiently, thereby establishing a stable electrical connection relationship between the first pad 112 and the circuit board 200, but also can ensure that the isolation layer 120 has relatively good heat insulation.

[0063] In some embodiments, the distance between adjacent through holes 125 is greater than or equal to 0.05 mm and less than or equal to 0.6 mm. If the distance between adjacent through holes 125 is too small, it can cause the number of through holes 125 to be too large, which can not only affect the heat insulation performance of the isolation layer 120, but also can cause the strength of the isolation layer 120 to be low, which can cause the isolation layer 120 to be difficult to enhance the first silver paste layer 110. Conversely, if the distance between adjacent through holes 125 is too large, it can cause the number of through holes 125 to be too small, which can cause the conductive glue 300 between the first pad 112 and the corresponding second pad to be too small, thereby affecting the stability of the electrical connection between the first pad 112 and the circuit board 200. In the present embodiment, the distance between adjacent through holes 125 is greater than or equal to 0.05 mm and less than or equal to 0.6 mm. Through a large number of experiments, it is verified that the distance between adjacent through holes 125 in the above range can not only enable the isolation layer 120 to have good heat insulation and strength, but also can enable the first pad 112 and the circuit board 200 to have good electrical connection stability.

[0064] The second aspect of the present application provides an electronic device, which includes the touch module 10 in any of the above embodiments. The electronic device can be any device with a control function, such as a tablet computer, a mobile phone, an electronic reader, a detection device, a processing device, a vehicle-mounted device, a wearable device, etc.

[0065] In the electronic device in the embodiments of the present application, the touch control module 10 is provided with an isolation layer 120 on the side of the first silver paste layer 110 close to the circuit board 200. When the circuit board 200 and the touch panel 100 are bonded, the isolation layer 120 is isolated between the circuit board 200 and the first silver paste layer 110. The isolation layer 120 has a certain heat insulation capacity. In this way, it is beneficial to reduce the heat received by the first silver paste layer 110, so as to reduce the deformation amount of the first silver paste layer 110 caused by heat. Therefore, it is beneficial to reduce the possibility of the first trace 111 being broken due to the influence of the segment difference, and reduce the risk of disconnection.

[0066] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A touch module (10), characterized in that, The touch panel (100) has a touch area (101) and a non-touch area, and the non-touch area includes a wiring area (102) and a binding area (103). The touch panel (100) includes a first silver paste layer (110) and an isolation layer (120), the first silver paste layer (110) includes a plurality of first wires (111) and a plurality of first pads (112), the first wires (111) are located in the wiring area (102), the first pads (112) are located in the binding area (103), the first pads (112) and the first wires (111) are connected one by one, and the isolation layer (120) is located on the side of the first silver paste layer (110) close to the circuit board (200). The first pads (112) and the circuit board (200) are provided with conductive adhesive (300), the through holes (125) are used for allowing the conductive adhesive (300) to pass through, and the first pads (112) are electrically connected with the circuit board (200) through the conductive adhesive (300).

2. The touch module (10) according to claim 1, characterized in that, The touch panel (100) further includes a first optical adhesive layer (130), the first optical adhesive layer (130) and the isolation layer (120) are located on the same side of the first silver paste layer (110), and the first optical adhesive layer (130) is located in the wiring area (102).

3. The touch module (10) according to claim 2, characterized in that, The isolation layer (120) includes a first isolation part (121) and a second isolation part (122) connected with each other, the first isolation part (121) is located in the binding area (103), and the through holes (125) are arranged in the first isolation part (121). The second isolation part (122) is located in the gap and covers the first wires (111) in the gap position.

4. The touch module (10) according to claim 3, characterized in that: The isolation layer (120) further includes a third isolation part (123) connected with the second isolation part (122), and the third isolation part (123) is located on the side, away from the first isolation part (121), of the second isolation part (122). The third isolation part (123) is located between the first silver paste layer (110) and the first optical adhesive layer (130).

5. The touch module (10) according to claim 2, characterized in that, The touch panel (100) further includes: A PET film (140) located on the side, away from the first optical adhesive layer (130), of the first silver paste layer (110); A second optical adhesive layer (150) located on the side, away from the first optical adhesive layer (130), of the PET film (140); A second silver paste layer (160) located on the side, away from the PET film (140), of the second optical adhesive layer (150), and the second silver paste layer (160) includes a plurality of second wires (161). The touch panel (100) further comprises a first touch electrode layer (170) and a second touch electrode layer (180) located in the touch area (101), the first trace (111) is electrically connected with the first touch electrode layer (170), and the second trace (161) is electrically connected with the second touch electrode layer (180).

6. The touch module (10) according to any one of claims 1 to 5, characterized in that, The material of the isolation layer (120) is thermosetting resin or UV resin.

7. The touch module (10) according to any one of claims 1 to 5, characterized in that, The thickness of the isolation layer (120) is greater than or equal to 1 μm and less than or equal to 10 μm.

8. The touch module (10) according to any one of claims 1 to 5, characterized in that The aperture size of the through hole (125) is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.

9. The touch module (10) according to any one of claims 1 to 5, characterized in that The interval between adjacent through holes (125) is greater than or equal to 0.05 mm and less than or equal to 0.6 mm.

10. An electronic device, comprising: The touch module (10) comprises any one of claims 1 to 9. The touch module (10) comprises any one of claims 1 to 9.

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