Embedded image sensor packaging structure

Abstract

The utility model relates to the field of sensor packaging, in particular to an embedded image sensor packaging structure which comprises a substrate, an annular heat conduction groove and a heat dissipation assembly, heat is efficiently collected through a heat dissipation copper sheet, and heat is efficiently conducted through sintered silver paste. Heat absorbed by the heat dissipation copper sheet can be quickly transmitted to the vertical heat conduction through holes in the substrates, so that the heat is efficiently transmitted between the substrates, the heat dissipation path is expanded, the heat dissipation efficiency is improved, the electrical conduction between the heat dissipation copper sheet and the vertical heat conduction through holes is ensured, the electrical performance of the whole packaging structure is more stable and reliable, and the service life of the packaging structure is prolonged. The image sensor is simple in structure and convenient to use, signal interference and transmission loss are reduced, the quality and stability of output signals of the sensor are guaranteed, the trapezoidal waterproof dam is formed at the edge of the double-layer stepped infrared optical filter, the waterproof capacity can be further enhanced, water vapor is prevented from entering the image sensor from the edge of the optical filter, and it is guaranteed that the image sensor can work normally in a humid environment.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor packaging field especially relates to a kind of embedded image sensor packaging structure. BACKGROUND

[0002] An embedded image sensor packaging structure is to embed an image sensor chip into a multi-layer structure. By embedding the chip into a specific multi-layer structure, better heat dissipation, electrical connection and optimization of optical performance can be achieved. This packaging structure can better protect the chip, improve its reliability and stability, and adapt to various complex working environments.

[0003] After light enters the packaging structure, the microlens focuses the light onto the photosensitive area of the image sensor. By precisely designing the shape, size and spacing of the microlens, the light can be more evenly distributed on the photosensitive pixels, improving the photosensitive efficiency, enhancing the contrast and resolution of the image, reducing optical aberration and chromatic aberration, and thus improving the overall image quality.

[0004] Excessive temperature can increase the thermal noise of electronic components in the image sensor chip, causing the noise level in the image signal to rise, reducing the clarity and quality of the image, and causing problems such as speckles and blurring. High temperature can also accelerate the aging process of materials inside the image sensor chip, causing the performance of the chip to gradually degrade and shortening its service life. SUMMARY

[0005] To overcome the technical problems of excessive temperature increasing the thermal noise of electronic components in the image sensor chip, accelerating the aging process of materials inside the image sensor chip, causing the performance of the chip to gradually degrade, and shortening its service life,

[0006] The technical solution of the utility model is: an embedded image sensor packaging structure, including a substrate, and also including an annular heat-conducting groove and a heat dissipation component. The substrate has a heat dissipation component on its top, and an annular heat-conducting groove is opened on the top of the substrate. A high-thermal-conductivity composite material is arranged inside the annular heat-conducting groove. A heat dissipation copper sheet is arranged on the top of the high-thermal-conductivity composite material. A vertical heat-conducting through-hole is opened in the substrate. The heat dissipation copper sheet is connected to the vertical heat-conducting through-hole through sintered silver paste.

[0007] As a preferred embodiment, a groove is opened on the top of the substrate, and an image sensor chip is arranged inside the groove. The image sensor chip is flip-chip soldered inside the groove through micro-bumps.

[0008] As a preferred embodiment, a double-layer stepped infrared filter is arranged on the top of the photosensitive area of the image sensor chip.

[0009] As a preferred embodiment, the double-layer stepped infrared filter includes an upper filter and a lower support sheet. The two layers are fixed by silica spacers, forming an air cushion layer.

[0010] Preferably, the upper side of the double-layer stepped infrared filter is provided with a sealing layer, the sealing layer is made of ultraviolet curing low-stress epoxy resin, and the sealing layer forms a trapezoidal waterproof dam at the edge of the double-layer stepped infrared filter.

[0011] Preferably, the outer side of the sealing layer is provided with an optical window, a wedge-shaped air gap is formed between the edge of the double-layer stepped infrared filter and the optical window, and the inner wall of the wedge-shaped air gap is coated with a light-absorbing material layer.

[0012] Preferably, the lower surface of the optical window is provided with an anti-reflection coating.

[0013] The utility model discloses the beneficial effect: the utility model discloses the ingenious structure design, through the heat dissipation copper sheet high -efficient collection heat, through the efficient heat conduction of sintering silver paste, can the heat that heat dissipation copper sheet absorbed is rapidly transferred to the vertical heat conduction through hole inside the base plate, makes the efficient transmission of heat between the base plate, thereby expands the heat dissipation path, improves the heat dissipation efficiency, ensures that the electrical conduction between heat dissipation copper sheet and vertical heat conduction through hole, makes the whole packaging structure on the electrical performance more stable and reliable, help to reduce signal interference and transmission loss, guarantee the quality and stability of sensor output signal, through the trapezoidal waterproof dam formed at the edge of the double-layer stepped infrared filter, can further enhance waterproof capacity, prevent water vapor from entering the inside from the filter edge, ensure that image sensor can also work normally in the humid environment. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 The first three-dimensional structure schematic view of the utility model is shown;

[0015] Figure 2 The first cross section three-dimensional structure schematic view of the utility model is shown;

[0016] Figure 3 The first partial three-dimensional structure schematic view of the utility model is shown;

[0017] Figure 4 The second partial three-dimensional structure schematic view of the utility model is shown;

[0018] Figure 5 The third partial three-dimensional structure schematic view of the utility model is shown;

[0019] Explanation of reference signs: 101, substrate; 102, annular heat conduction groove; 103, high-thermal-conductivity composite material; 104, heat dissipation copper sheet; 105, vertical heat conduction through hole; 106, sintered silver paste; 107, image sensor chip; 108, micro bump; 109, double-layer stepped infrared filter; 110, upper filter; 111, lower support sheet; 112, silica spacer column; 201, air buffer layer; 202, sealing layer; 203, trapezoidal waterproof dam; 204, optical window; 205, wedge-shaped air gap; 206, light-absorbing material layer; 207, anti-reflection coating. DETAILED DESCRIPTION

[0020] The utility model is further explained below in combination with the drawings and examples.

[0021] Please refer to Figures 1-5 The utility model provides an embedded image sensor packaging structure, including substrate 101, still including annular heat conduction groove 102 and heat dissipation assembly, the top of substrate 101 is provided with heat dissipation assembly, the top of substrate 101 is opened with annular heat conduction groove 102, the inside of annular heat conduction groove 102 is provided with high-thermal-conductivity composite material 103, the top of high-thermal-conductivity composite material 103 is provided with heat dissipation copper sheet 104, the inside of substrate 101 is opened with vertical heat conduction through hole 105, heat dissipation copper sheet 104 is connected with vertical heat conduction through hole 105 through sintered silver paste 106, through heat dissipation copper sheet 104 high -efficient collection heat, through the efficient heat conduction of sintered silver paste 106, can the heat that heat dissipation copper sheet 104 absorbed is quickly transmitted to the vertical heat conduction through hole 105 inside substrate 101, makes the efficient transmission of heat between substrate 101, thereby expands the heat dissipation path, improves the heat dissipation efficiency, ensures the electrical conduction between heat dissipation copper sheet 104 and vertical heat conduction through hole 105, makes the whole packaging structure be more stable and reliable on electrical performance, help to reduce signal interference and transmission loss, guarantee the quality and stability of sensor output signal.

[0022] Please refer to Figures 2-5In the embodiment, a groove is formed on the top of the substrate 101, the image sensor chip 107 is arranged in the groove, the image sensor chip 107 is flip-chip soldered in the groove through the micro-bump 108, the photosensitive area of the image sensor chip 107 is provided with the double-layer stepped infrared filter 109, the double-layer stepped infrared filter 109 includes the upper filter 110 and the lower support sheet 111, the two layers are fixed through the silicon dioxide spacer column 112 to form an air buffer layer 201, the image sensor chip 107 is flip-chip soldered in the groove through the micro-bump 108, so that a direct and short-distance electrical connection is formed between the image sensor chip 107 and the substrate 101, the signal transmission path is shortened, the signal transmission delay and loss are reduced, the speed and quality of signal transmission are improved, and it is ensured that the image sensor chip 107 can quickly and accurately transmit the collected image signals to other circuits on the substrate 101 for processing, the optical coupling between the upper filter 110 and the lower support sheet 111 can be reduced through the air buffer layer 201, the reflection and scattering of light between the two layers are reduced, so that the filtering precision and efficiency of the infrared filter are improved, and it is helpful to more accurately filter out unnecessary infrared light, so that the photosensitive area of the image sensor chip 107 receives more pure visible light, and the color restoration degree and clarity of the image are improved.

[0023] Please refer to Figures 2-4 In the embodiment, the double-layer stepped infrared filter 109 is provided with a sealing layer 202, the sealing layer 202 is made of ultraviolet curing type low-stress epoxy resin, the sealing layer 202 forms a trapezoidal waterproof dam 203 at the edge of the double-layer stepped infrared filter 109, the outer side of the sealing layer 202 is provided with an optical window 204, a wedge-shaped air gap 205 is formed between the edge of the double-layer stepped infrared filter 109 and the optical window 204, the inner wall of the wedge-shaped air gap 205 is coated with an adsorbing material layer 206, and the lower surface of the optical window 204 is provided with an anti-reflection coating 207. The internal structure of the double-layer stepped infrared filter 109 and the image sensor chip 107 below can be effectively protected through the sealing layer 202, the waterproof ability can be further enhanced through the trapezoidal waterproof dam 203 formed at the edge of the double-layer stepped infrared filter 109, and water vapor is prevented from entering the inside from the edge of the filter, so that the image sensor can normally work in a humid environment. The anti-reflection coating 207 can effectively reduce the reflection of light on the surface of the optical window 204, so that more light can pass through the optical window 204 to the photosensitive area of the image sensor chip 107, thereby improving the sensitivity and imaging quality of the image sensor, and reducing the energy loss and image brightness unevenness caused by light reflection.

[0024] In the working process, the heat absorbed by the heat dissipation copper sheet 104 is quickly transmitted to the vertical heat conduction through hole 105 inside the substrate 101 through the efficient heat dissipation of the sintered silver paste 106, the efficient transmission of heat between the substrate 101, thereby expanding the heat dissipation path and improving the heat dissipation efficiency, ensuring the electrical conduction between the heat dissipation copper sheet 104 and the vertical heat conduction through hole 105, making the entire packaging structure more stable and reliable in electrical performance, helping to reduce signal interference and transmission loss, and ensuring the quality and stability of the sensor output signal. The image sensor chip 107 is flip-chip soldered inside the groove through the micro-bump 108, forming a direct and short-distance electrical connection between the image sensor chip 107 and the substrate 101, shortening the signal transmission path, reducing signal transmission delay and loss, and improving signal transmission speed and quality, ensuring that the image sensor chip 107 can quickly and accurately transmit the collected image signal to other circuits on the substrate 101 for processing. The air buffer layer 201 can reduce the optical coupling between the upper filter 110 and the lower support sheet 111, reduce the reflection and scattering of light between the two layers, thereby improving the filtering precision and efficiency of the infrared filter, helping to more accurately filter out unwanted infrared light, allowing the image sensor chip 107 to receive more pure visible light, improving the color reproduction and clarity of the image. The sealing layer 202 can effectively protect the internal structure of the double-layer stepped infrared filter 109 and the image sensor chip 107 below, and the trapezoidal waterproof dam 203 formed at the edge of the double-layer stepped infrared filter 109 can further enhance the waterproof capability and prevent water vapor from entering the interior from the filter edge, ensuring that the image sensor can work normally in a humid environment. The anti-reflective coating 207 can effectively reduce the reflection of light on the surface of the optical window 204, allowing more light to pass through the optical window 204 to the photosensitive area of the image sensor chip 107, thereby improving the sensitivity and imaging quality of the image sensor, reducing energy loss and image brightness unevenness caused by light reflection.

[0025] Through the above steps, the heat absorbed by the heat dissipation copper sheet 104 is quickly transmitted to the vertical heat conduction through hole 105 inside the substrate 101 through the efficient heat dissipation of the sintered silver paste 106, the efficient transmission of heat between the substrate 101, thereby expanding the heat dissipation path and improving the heat dissipation efficiency, ensuring the electrical conduction between the heat dissipation copper sheet 104 and the vertical heat conduction through hole 105, making the entire packaging structure more stable and reliable in electrical performance, helping to reduce signal interference and transmission loss, and ensuring the quality and stability of the sensor output signal.

Claims

1. An embedded image sensor package structure comprising a substrate (101), characterized in that: Also include annular heat conduction groove (102) and heat dissipation assembly, the upper portion of the substrate (101) is provided with heat dissipation assembly, the upper portion of the substrate (101) is provided with annular heat conduction groove (102), the inside of annular heat conduction groove (102) is provided with high thermal conductivity composite material (103), the upper portion of high thermal conductivity composite material (103) is provided with heat dissipation copper sheet (104), the inside of substrate (101) is provided with vertical heat conduction through hole (105), heat dissipation copper sheet (104) and vertical heat conduction through hole (105) are connected through sintering silver paste (106).

2. The embedded image sensor package structure of claim 1, wherein: The upper portion of the substrate (101) is provided with a recess, the inside of the recess is provided with an image sensor chip (107), the image sensor chip (107) is flip-chip soldered in the inside of the recess through a micro-bump (108).

3. The embedded image sensor package structure of claim 2, wherein: The photosensitive area of the image sensor chip (107) is provided with a double-layer stepped infrared filter (109) above.

4. The embedded image sensor package structure of claim 3, wherein: The double-layer stepped infrared filter (109) includes an upper filter (110) and a lower support sheet (111), and the two layers are fixed through a silica spacing column (112) to form an air buffer layer (201).

5. The embedded image sensor package structure of claim 4, wherein: The upper portion of the double-layer stepped infrared filter (109) is provided with a sealing layer (202), the sealing layer (202) adopts ultraviolet curing type low stress epoxy resin, and the sealing layer (202) forms a trapezoidal waterproof dam (203) at the edge of the double-layer stepped infrared filter (109).

6. The embedded image sensor package structure of claim 5, wherein: The outside of the sealing layer (202) is provided with an optical window (204), and the edge of the double-layer stepped infrared filter (109) and the optical window (204) form a wedge-shaped air gap (205), and the inner wall of the wedge-shaped air gap (205) is coated with an absorbing material layer (206).

7. The embedded image sensor package structure of claim 6, wherein: The lower surface of the optical window (204) is provided with an anti-reflection coating (207).

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