A sheet-integrated platinum membrane heat flux sensor for a hypersonic shock tunnel

Abstract

The application discloses a sheet type integrated platinum film heat flow sensor for a hypersonic shock tunnel, which comprises a glass substrate in a sheet shape, a plurality of platinum thin film lines arranged on the surface of the glass substrate along the width direction of the glass substrate, and silver paste contacts corresponding to the platinum thin film lines arranged on the side edges of the glass substrate and electrically connected with the platinum thin film lines, wherein the end of the silver paste contact away from the platinum thin film line is used for welding a lead wire. The sheet type integrated platinum thin film line resistance sensor has the characteristics of high frequency response of a two-millimeter-diameter thin film sensor. After the thickness of the glass substrate as a sensor bearing substrate is reduced, the sensor can be applied to a particularly thin part of an aircraft for heat measurement, and a measurement point with a gradient range is formed on the glass substrate, so that the aerodynamic heat of the aircraft surface with a certain gradient can be measured.

Description

Technical Field

[0001] This invention relates to the field of heat flux sensor technology, and more specifically to a chip-integrated platinum film heat flux sensor for use in hypersonic shock tunnels. Background Technology

[0002] As an important method for measuring the aerodynamic thermal environment in shock tunnels, the measurement technology based on thin-film resistive thermal flux sensors has been continuously developed and innovated over the decades. On the one hand, in order to obtain more data per unit area, integration has become a trend in sensor technology development. On the other hand, in order to reduce measurement errors caused by sensor installation, sensor miniaturization has also been a research direction that has been continuously innovated, from the earliest 5mm diameter to 2mm diameter, with significant progress made in both thermistor manufacturing processes and silver paste coating processes.

[0003] Since the Φ2 glass cylinder end face is coated with a platinum film and serves as the measurement surface, the thickness and axial length of the model determine the sensor's volume and installation limitations. For example, when the aerodynamic thermal monitoring surface of the aircraft model tends to be planar and the aerodynamic thermal detection has a certain gradient region, it is impossible to install and detect using the existing Φ2 cylindrical sensor. Summary of the Invention

[0004] The purpose of this invention is to provide a chip-integrated platinum film heat flux sensor for hypersonic shock tunnels, in order to solve the problem that existing cylindrical sensors cannot be installed and used for detection when the aerodynamic thermal monitoring surface of the aircraft model is planar and the aerodynamic thermal detection has a certain gradient region.

[0005] To solve the above-mentioned technical problems, the present invention specifically provides the following technical solution:

[0006] A chip-integrated platinum film heat flux sensor for hypersonic shock tunnels, comprising:

[0007] A glass substrate, wherein the glass substrate is in the form of a sheet;

[0008] Platinum thin film lines, having multiple lines, are disposed on the surface of the glass substrate along the width direction of the glass substrate;

[0009] The glass substrate has silver paste contacts on its side that correspond one-to-one with each of the platinum thin film lines, and the platinum thin film lines are electrically connected to the silver paste contacts.

[0010] The end of the silver paste contact furthest from the platinum film wire is used for soldering the wire.

[0011] As a preferred embodiment of the present invention, the plurality of platinum thin film lines are sequentially formed into a first platinum thin film line region and a second platinum thin film line region on the glass substrate.

[0012] The platinum film lines in the first platinum film line region and the second platinum film line region are equally spaced, and the spacing between two adjacent platinum film lines in the first platinum film line region is smaller than the spacing between two adjacent platinum film lines in the second platinum film line region.

[0013] As a preferred embodiment of the present invention, the bottom of the silver paste contacts located at both ends of the platinum film line extends along the width direction of the glass substrate to form a silver paste line on the bottom surface of the glass substrate.

[0014] The width of the silver paste line located on the bottom surface of the glass substrate is less than half the width of the glass substrate.

[0015] As a preferred embodiment of the present invention, the glass substrate includes a rectangular body and a thin glass sheet mounted on the rectangular body, wherein the thin glass sheet has a retaining edge perpendicular to the thin glass sheet at its four edges.

[0016] As a preferred embodiment of the present invention, the rectangular body includes a plurality of platinum film substrates connected in sequence for setting the platinum film lines, and an expansion joint is provided between two adjacent platinum film substrates, the expansion joint being able to extend and contract along the length direction of the thin glass sheet;

[0017] The ends of the platinum film substrates are provided with actuators, which are used to drive the multiple telescopic members to extend and contract synchronously along the length of the thin glass sheet.

[0018] As a preferred embodiment of the present invention, the driver includes a first driving part and a second driving part, wherein the first driving part is connected to one end of the integrally formed by the plurality of platinum film substrates;

[0019] The output end of the second drive unit is connected to the connection point between the integral formed by the plurality of platinum film substrates and the first drive unit;

[0020] The first driving unit utilizes the aerodynamic thermal changes to drive the expansion of multiple telescopic components along the length of the thin glass sheet.

[0021] The second driving unit is used to restore the plurality of platinum film substrates to the initial position where the telescopic member has not stretched or contracted, and then the second driving unit will follow the driving action of the first driving unit.

[0022] As a preferred embodiment of the present invention, the first driving part includes a sealing bladder, and guide plates are provided at both ends of the sealing bladder, the ends of the guide plates being slidably connected to the inner wall of the baffle.

[0023] The sealing bladder has a serrated cross-section on its side surface, and its interior is filled with a medium that can expand or contract with temperature changes.

[0024] As a preferred embodiment of the present invention, the second driving unit includes an electromagnetic driving base and an actuating member slidably mounted on the electromagnetic driving base, wherein the end of the actuating member away from the electromagnetic driving base is connected to the connection between the first driving unit and the platinum film substrate.

[0025] The electromagnetic drive base moves the actuator along the length of the thin glass sheet via electromagnetic drive.

[0026] In a preferred embodiment of the present invention, the bottom of the glass substrate is provided with a groove for cooperating with the silver paste line; a wiring groove is provided in the middle of the bottom surface of the glass substrate along the length direction of the glass substrate, and the wiring groove is connected to the groove.

[0027] Compared with the prior art, the present invention has the following advantages:

[0028] The chip-integrated platinum thin-film linear resistance sensor provided by this invention retains the advantages of a two-millimeter diameter thin-film sensor, namely, high-frequency response, up to 1MHz. Simultaneously, by reducing the thickness of the glass substrate serving as the sensor's support, the sensor can be applied to thermal measurement of particularly thin parts of aircraft, such as wing surfaces and control surfaces. Furthermore, the denser distribution of measurement points on the glass plate allows for application in areas with large heat flux gradients, such as separation and reattachment zones. Moreover, the position of the measurement points can be adjusted according to measurement needs, allowing for equidistant or arbitrary spacing, thereby enabling the measurement of aerodynamic heat on the aircraft surface with certain gradient distinctions. Attached Figure Description

[0029] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0030] Figure 1 A schematic diagram of the structure of a heat flow sensor based on a sheet-like glass substrate is provided for embodiments of the present invention;

[0031] Figure 2 Provided for embodiments of the present invention Figure 1 A schematic diagram of the structure of the bottom surface of the medium-sized glass substrate;

[0032] Figure 3A schematic diagram of a heat flow sensor with a thin glass sheet is provided for an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of a heat flow sensor having a first driving unit and a second driving unit is provided for embodiments of the present invention;

[0034] Figure 5 Provided for embodiments of the present invention Figure 4 A schematic diagram of the ideal assembly of the electromagnetic drive base and the actuator of the second drive unit.

[0035] The labels in the diagram represent the following:

[0036] 1-Glass substrate; 2-Platinum thin film line; 3-Silver paste contact; 4-First platinum thin film line area; 5-Second platinum thin film line area; 6-Silver paste line; 7-Rectangular body; 8-Thin glass sheet; 9-Side guard; 10-Wiring groove; 11-Wire groove;

[0037] 71-Platinum film substrate; 72-Telescopic component; 73-Actuator; 74-First driving part; 75-Second driving part; 741-Sealing bladder; 742-Guide plate; 751-Electromagnetic drive base; 752-Actuating component. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] like Figures 1 to 5 As shown, the present invention provides a chip-integrated platinum film heat flux sensor for hypersonic shock tunnels, comprising:

[0040] Glass substrate 1, glass substrate 1 is sheet-shaped;

[0041] Platinum thin film lines 2, having multiple lines, are disposed on the surface of the glass substrate 1 along the width direction of the glass substrate 1;

[0042] The glass substrate 1 has silver paste contacts 3 on its side that correspond one-to-one with each platinum thin film line 2, and the platinum thin film line 2 is electrically connected to the silver paste contacts 3.

[0043] The end of the silver paste contact 3 furthest from the platinum film wire 2 is used for soldering the wire.

[0044] In this invention, the specific measurement principle of the plate-integrated platinum film heat flow sensor constructed using a glass substrate 1 is as follows: the measuring point is the effective element of the sensor, and the effective element of the platinum film wire resistance thermometer is the platinum film wire 2. The platinum metal film is plated on a non-metallic material (glass or ceramic). When the platinum metal film is subjected to aerodynamic heat, the resistance of the platinum metal film changes, and the change in resistance reflects the surface temperature change process.

[0045] The resistive sensor 2 with integrated platinum thin film wire 2 provided in this invention still retains the advantages of φ2 thin film sensors, namely, high frequency response (up to 1MHz). Furthermore, by reducing the thickness of the glass substrate, the sensor can be applied to heat measurement in particularly thin parts of aircraft, such as wing surfaces and control surfaces.

[0046] Meanwhile, the distribution of measuring points on the glass slide is densified, which can be used in areas with large heat flux gradients, such as separation and reattachment zones; and the position of the measuring points can be adjusted according to measurement needs, which can be equal spacing or arbitrary spacing, with the minimum interval reaching 1mm.

[0047] However, in actual measurement processes, to obtain as much detailed measurement as possible of the impact of supersonic shock wave speed changes on airfoil heat distribution during different hypersonic shock wave wind tunnel experiments—that is, the faster the shock wave speed, the faster the temperature rise per unit length on the aircraft's airfoil or control surfaces—multiple platinum thin film lines 2 of this invention are sequentially formed into a first platinum thin film line region 4 and a second platinum thin film line region 5 on a glass substrate 1. The platinum thin film lines 2 within the first platinum thin film line region 4 and the second platinum thin film line region 5 are evenly spaced, and the distance between two adjacent platinum thin film lines 2 within the first platinum thin film line region 4 is smaller than the distance between two adjacent platinum thin film lines 2 within the second platinum thin film line region 5. In other words, various shock wave speeds are measured by setting platinum thin film line line regions 2 with different spacing values ​​on the same glass substrate 1.

[0048] In addressing the issue of facilitating the installation of heat flow sensors on wing surfaces and control surfaces, this invention extends the bottom of the silver paste contacts 3 located at both ends of the platinum film line 2 along the width direction of the glass substrate 1 to form a silver paste line 6 on the bottom surface of the glass substrate 1. The width of the silver paste line 6 located on the bottom surface of the glass substrate 1 is less than half the width of the glass substrate 1. The silver paste line 6 extends the connection distance between the welding wire and the platinum film line 2, facilitating the routing of the welding wire.

[0049] Furthermore, in this invention, the glass substrate 1 includes a rectangular body 7 and a thin glass sheet 8 mounted on the rectangular body 7. The thickness of the thin glass sheet 8 is controlled between 0.1 and 0.2 mm. The purpose is to uniformly heat each platinum thin film line 2 to improve the data acquisition accuracy of the platinum film heat flow sensor. This is mainly because the platinum thin film lines 2 of existing platinum film heat flow sensors are fused to the substrate surface through multiple sintering processes. The sintering process may produce uneven protrusions, which hinder the transmission of shock waves on the sensor surface. This will cause abnormal temperature rise in the platinum thin film lines 2 and result in errors in the acquired data.

[0050] Of course, in the process of preparing the heat flow sensor proposed in this invention, it is necessary to first sinter the platinum thin film wire 2 with the surface of the rectangular body 7, and then sinter the rectangular body 7 and the thin glass sheet 8. During the sintering process, the upper surface of the thin glass sheet 8 is pressed by an arc-shaped mold with the curvature of the target control surface or wing surface. In this way, the thin glass sheet 8 can be attached to the surface of the rectangular body 7, and the thin glass sheet 8 can be accurately matched with the control surface or wing surface of the target aircraft.

[0051] The thin glass sheet 8 has vertical baffles 9 around its perimeter to ensure that the rectangular main body 7 can be installed as a whole on the control surface or wing surface of the target aircraft.

[0052] The above-mentioned method, which involves setting platinum film lines 2 with various spacing values ​​on the same glass substrate 1 to measure various shock wave velocities, can obtain temperature rise measurements with certain set parameters, i.e., measurements of the relationship between various shock wave velocities and temperature rise. However, the structure is relatively fixed. In response to various changes during the experiment, it is necessary to either replace the platinum film heat flux sensor or set more than three different spacings of platinum film line areas on the control surface or wing surface of the target aircraft per unit length. Obviously, each of these methods cannot meet the requirements for high-precision measurement. Furthermore, if the conduction length of the heat flux sensor is long, the platinum film heat flux sensor cannot represent the structural strength of the control surface or wing surface of the target aircraft, thus failing to significantly improve the data acquisition accuracy. Therefore, in this invention, the rectangular body 7 includes a plurality of platinum film substrates 71 connected in sequence for setting platinum film lines 2, and a telescopic member 72 is provided between two adjacent platinum film substrates 71. The telescopic member 72 can extend and retract along the length direction of the thin glass sheet 8. The ends of the plurality of platinum film substrates 71 are provided with a driver 73, which is used to drive the plurality of telescopic members 72 to extend and retract synchronously along the length direction of the thin glass sheet 8.

[0053] That is, on the structure of the glass substrate 1 described above, an adjustable spacing between multiple platinum thin film lines 2 is constructed. For this purpose, the actuator 73 includes a first driving part 74 and a second driving part 75. The first driving part 74 is connected to one end of the integral formed by multiple platinum film substrates 71. The output end of the second driving part 75 is connected to the connection between the integral formed by multiple platinum film substrates 71 and the first driving part 74.

[0054] The first drive unit 74 utilizes the aerodynamic heat change to drive the expansion of multiple telescopic members 72 along the length of the thin glass sheet 6; the second drive unit 75 is used to restore multiple platinum film substrates 71 to the initial position where the telescopic members 72 have not expanded or contracted, and then the second drive unit 75 will follow the drive action of the first drive unit 74.

[0055] In order to achieve multiple measurements during the experiment, the relative positions of multiple platinum film substrates 71 need to change, and the multiple platinum film substrates 71 also need to be able to return to their initial positions. However, since the first drive unit 74 in this invention can be driven according to the increase of aerodynamic heat on the surface of the aircraft, the second drive unit 75 needs to minimize the resistance generated by the first drive unit 74 during the drive.

[0056] Although the existing micro motor can achieve the function of the second drive unit 75, in actual operation, it is necessary to control the micro motor with the first drive unit 74 through synchronous electrical signals. Furthermore, when the micro motor moves in the opposite direction, there is resistance from the helical rotation between the screw and the drive unit, which affects the drive action of the first drive unit 74 when the aerodynamic heat on the surface of the aircraft increases.

[0057] However, linear motors cannot be ideally scaled down to fit the dimensions of the heat flow sensor in this invention, and scaling down the structure is quite difficult.

[0058] This invention achieves the measurement point (spacing distribution of platinum film lines) of the heat flow sensor by coordinating the actuator 73 and aerodynamic heat generation. This allows for adaptive changes in the spacing between multiple platinum film lines 2. Specifically, when the aerodynamic heat on the aircraft surface increases, the aerodynamic heat change per unit distance on the aircraft surface is significant. The actuator 73 compresses (provides a force along the length of the glass substrate 1) multiple telescopic members 72, thereby bringing multiple platinum film substrates 71 closer together and reducing the spacing between the platinum film lines 2 on the multiple platinum film substrates 71. Conversely, the telescopic members 72 are stretched.

[0059] Furthermore, there are many existing structures or technical means that can realize the above-mentioned first driving part 74 in this invention. In order to accurately describe its implementation process, this invention provides a specific embodiment. The first driving part 74 includes a sealing bladder 741. Guide plates 742 are provided at both ends of the sealing bladder 741. The ends of the guide plates 742 are slidably connected to the inner wall of the baffle 7. The side surface of the sealing bladder 741 has a serrated cross section. In order to realize the contraction of the sealing bladder 741 along the length direction of the thin glass sheet 8, the interior of the sealing bladder 741 is filled with a medium that can expand or contract with temperature changes. That is, the expansion coefficient of the medium filled in the sealing bladder 741 during the experiment should be suitable for the temperature rise range in the shock tunnel experiment.

[0060] Furthermore, the main purpose of the second driving unit 75 in this invention is to achieve a driving action opposite to that of the first driving unit 74, thereby restoring the plurality of platinum film substrates 71 to the set initial spacing (or the driving stroke of the second driving unit 75 is greater than that of the first driving unit 74).

[0061] To address the aforementioned issue that the second drive unit 75 might affect the drive function of the first drive unit 74, a specific embodiment of the second drive unit 75 is provided. The second drive unit 75 includes an electromagnetic drive base 751 and an actuator 752 slidably mounted on the electromagnetic drive base 751. The end of the actuator 752 away from the electromagnetic drive base 751 is connected to the connection between the first drive unit 74 and the platinum film substrate 71. The electromagnetic drive base 751 moves along the length direction of the thin glass sheet 8 via the electromagnetic drive actuator 752.

[0062] In other words, the second driving unit 75 in this invention can be driven by electromagnetic drive. Since the electromagnetic drive is not energized, the actuator 752 is completely free in the direction of movement as long as there is a restriction on the direction of movement. Its resistance can be determined by the smoothness between the actuator 752 and the electromagnetic drive base 751.

[0063] Specifically, the electromagnetic drive base 751 can be a hollow cylindrical structure, and the actuating element 752 is axially mounted on the axis of the electromagnetic drive base 751. The actuating element 752 is specifically a permanent magnet, and an electromagnetic coil is provided on the inner wall of the hollow cylindrical structure. The diameter of the hollow cylindrical structure can be controlled to be 3-4 mm, or even smaller.

[0064] Furthermore, the bottom of the glass substrate 1 in this invention is provided with a wire groove 11 that mates with the silver paste line 6; a wiring groove 10 is provided in the middle of the bottom surface of the glass substrate 1 along the length direction of the glass substrate 1, and the wiring groove 10 communicates with the wire groove 11. The purpose is that the wiring groove 10 can be used for routing soldered wires, and in the installation of the first driving part 74 and the second driving part 75 described above, the second driving part 75 can be installed in the wiring groove 10.

[0065] Additionally, the substrate thickness of the integrated chip sensor in this invention can be reduced to 1mm, making it suitable for heat measurement in thinner areas such as aircraft wings and control surfaces. By integrating multiple measuring points with a minimum spacing of 1mm onto a 1mm thick glass plate, and with the position and spacing of these measuring points arbitrarily designed, and the measuring point size being 0.1×4mm, the limitations of the Φ2 sensor in terms of thickness (>5mm) and spacing (>2mm) are overcome. The sensor is 1mm thick, integrates multiple measuring points, and the spacing can be as small as 1mm.

[0066] The first drive unit 74 can be consistent with the platinum film substrate 71 in terms of structural parameters (thickness and width), while the thickness of the second drive unit 75 can be controlled to be around 2-3 mm. However, the overall thickness of the platinum film substrate 71 can be controlled to be around 1 mm. In other words, the structure of the second drive unit 75 does not affect the overall installation of the sensor on the control surface or the wing surface of the aircraft.

[0067] The above embodiments are merely exemplary embodiments of this application and are not intended to limit this application. The scope of protection of this application is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions to this application within its substance and scope of protection, and such modifications or equivalent substitutions should also be considered to fall within the scope of protection of this application.

Claims

1. A chip-integrated platinum film heat flux sensor for hypersonic shock tunnels, characterized in that, include: A glass substrate (1), wherein the glass substrate (1) is sheet-shaped; The platinum thin film line (2) has multiple lines and is disposed on the surface of the glass substrate (1) along the width direction of the glass substrate (1); The glass substrate (1) is provided with silver paste contacts (3) corresponding to each of the platinum thin film lines (2) on its side, and the platinum thin film lines (2) are electrically connected to the silver paste contacts (3). The end of the silver paste contact (3) away from the platinum film wire (2) is used for welding the wire; The bottom of the silver paste contacts (3) located at both ends of the platinum film line (2) extends along the width direction of the glass substrate (1) to form a silver paste line (6) on the bottom surface of the glass substrate (1). The width of the silver paste line (6) located on the bottom surface of the glass substrate (1) is less than half the width of the glass substrate (1); The glass substrate (1) includes a rectangular body (7) and a thin glass sheet (8) mounted on the rectangular body (7). The thin glass sheet (8) has a retaining edge (9) perpendicular to the thin glass sheet (8) on its four sides. The rectangular body (7) includes a plurality of platinum film substrates (71) connected in sequence for setting the platinum film line (2), and a telescopic member (72) is provided between two adjacent platinum film substrates (71). The telescopic member (72) can extend and contract along the length direction of the thin glass sheet (8). Among them, the ends of the multiple platinum film substrates (71) are provided with drivers (73), which are used to drive the multiple telescopic members (72) to extend and contract synchronously along the length direction of the thin glass sheet (8).

2. The chip-integrated platinum film heat flux sensor for hypersonic shock tunnels according to claim 1, characterized in that, Multiple platinum thin film lines (2) are sequentially formed on the glass substrate (1) into a first platinum thin film line region (4) and a second platinum thin film line region (5). The platinum film lines (2) in the first platinum film line region (4) and the second platinum film line region (5) are equally spaced, and the distance between two adjacent platinum film lines (2) in the first platinum film line region (4) is smaller than the distance between two adjacent platinum film lines (2) in the second platinum film line region (5).

3. A chip-integrated platinum film heat flux sensor for hypersonic shock tunnels according to claim 1, characterized in that, The driver (73) includes a first driving part (74) and a second driving part (75), wherein the first driving part (74) is connected to one end of the integrally formed of the plurality of platinum film substrates (71); The output end of the second drive unit (75) is connected to the connection between the integral formed by the plurality of platinum film substrates (71) and the first drive unit (74); The first driving part (74) utilizes the aerodynamic heat change to drive the expansion of multiple telescopic members (72) along the length direction of the thin glass sheet (8) to extend. The second drive unit (75) is used to restore the plurality of platinum film substrates (71) to the initial position where the telescopic member (72) has not stretched or stretched, and then the second drive unit (75) will follow the drive action of the first drive unit (74).

4. A chip-integrated platinum film heat flux sensor for hypersonic shock tunnels according to claim 3, characterized in that, The first driving part (74) includes a sealing bladder (741), and guide plates (742) are provided at both ends of the sealing bladder (741). The ends of the guide plates (742) are slidably connected to the inner wall of the baffle (9). The sealing bladder (741) has a serrated cross-section on its side surface, and the interior of the sealing bladder (741) is filled with a medium that can expand or contract with temperature changes.

5. A chip-integrated platinum film heat flux sensor for hypersonic shock tunnels according to claim 3, characterized in that, The second drive unit (75) includes an electromagnetic drive base (751) and an actuator (752) slidably mounted on the electromagnetic drive base (751). The end of the actuator (752) away from the electromagnetic drive base (751) is connected to the connection between the first drive unit (74) and the platinum film substrate (71). The electromagnetic drive base (751) drives the actuator (752) to move along the length of the thin glass sheet (8) via electromagnetic drive.

6. A chip-integrated platinum film heat flux sensor for hypersonic shock tunnels according to claim 1, characterized in that, The bottom of the glass substrate (1) is provided with a wire groove (11) that cooperates with the silver paste line (6); a wiring groove (10) is provided in the middle of the bottom surface of the glass substrate (1) along the length direction of the glass substrate (1), and the wiring groove (10) is connected to the wire groove (11).

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