Display screen module and electronic equipment

Abstract

The invention relates to a display screen module and electronic equipment. The display screen module comprises a display panel, the display panel comprises a panel main body and a bending part connected with the panel main body, and the bending part is bent towards the non-display side of the display screen module relative to the panel main body; the first circuit board is electrically connected with the bending part; the second circuit board is electrically connected with the first circuit board; and the chip is electrically connected to the first circuit board.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of terminals, and in particular, to a display screen module and electronic device. BACKGROUND

[0002] Based on the COP (Chip On PI) screen packaging technology, an extremely narrow frame effect can be achieved, and the COP packaging technology has become the mainstream packaging method of various manufacturers. Conventionally, the COP packaging technology is to separately bond a part of a screen, a driving IC and a circuit board to the non-display side of the screen after being bent. SUMMARY

[0003] The present disclosure provides a display screen module and electronic device to solve the problems in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a display screen module is provided, comprising:

[0005] a display panel, the display panel comprising a panel main body and a bending portion connected to the panel main body, the bending portion being bent towards a non-display side of the display screen module relative to the panel main body;

[0006] a first circuit board, the first circuit board being electrically connected to the bending portion;

[0007] a second circuit board, the second circuit board being electrically connected to the first circuit board;

[0008] a chip, the chip being electrically connected to the first circuit board.

[0009] Optionally, the second circuit board is partially stacked with the first circuit board.

[0010] Optionally, the second circuit board is partially disposed on a side of the first circuit board away from the panel main body.

[0011] Optionally, the second circuit board protrudes relative to the first circuit board and covers a part of the bending portion.

[0012] Optionally, two sides of the second circuit board and the first circuit board are electrically connected.

[0013] Optionally, the first circuit board comprises a first main portion and a first flexible portion connected to the first main portion, the first main portion being electrically connected to the bending portion, and the first flexible portion being bent from the first main portion towards a direction away from the panel main body and being electrically connected to the second circuit board.

[0014] Optionally, the first main body part is a flexible plate, the first main body part comprises a lap joint area, a main body area and a transition area, the transition area connects the lap joint area and the main body area, the lap joint area is electrically connected with the bending part, the first flexible part is connected with the main body area, and the main body area is arranged close to the panel main body relative to the lap joint area.

[0015] Optionally, the second circuit board comprises a first step surface and a second step surface facing the first main body part, a height difference is arranged between the first step surface and the second step surface, the first step surface is arranged to face the main body area, and the second step surface is arranged to face the lap joint area.

[0016] Optionally, the display screen module further comprises a first cushion block, and the first cushion block is arranged between the main body area and the second circuit board.

[0017] Optionally, the chip is arranged on a side of the main body area facing the second circuit board, and the first cushion block avoids the chip.

[0018] Optionally, the second circuit board comprises a second main body part and a second flexible part connected with the second main body part, and the second main body part is partially stacked with the first circuit board.

[0019] The second flexible part is bent relative to the second main body part towards the first circuit board and is electrically connected with the first circuit board.

[0020] Optionally, the second flexible part is electrically connected to a side of the first circuit board facing the panel main body; or,

[0021] The second flexible part is electrically connected to a side of the first circuit board away from the panel main body.

[0022] Optionally, the chip is electrically connected to a side of the first circuit board facing the panel main body, and a part of the second circuit board is stacked on a side of the first circuit board away from the panel main body.

[0023] The display screen module further comprises a second cushion block, the second cushion block is arranged between the first circuit board and the panel main body, and the second cushion block avoids the chip.

[0024] Optionally, the display screen module further comprises a third cushion block, the third cushion block is arranged between the panel main body and the second cushion block, and the third cushion block covers the chip.

[0025] Optionally, the second circuit board is provided with an avoiding part.

[0026] The chip is electrically connected to a side of the first circuit board facing the second circuit board, and the chip is partially accommodated in the avoiding part.

[0027] Optionally, the avoiding part comprises a groove or a stepped accommodating cavity.

[0028] Optionally, the second circuit board part is arranged between the panel body and the first circuit board.

[0029] According to a second aspect of the embodiments of the present disclosure, an electronic device is provided, comprising the display screen module as described in any one of the above embodiments.

[0030] The technical solutions provided by the embodiments of the present disclosure can have the following beneficial effects:

[0031] As can be seen from the above embodiments, in the present disclosure, the chip is electrically connected to the first circuit board, so that each wire in the single-row wire of the bending part can be arranged in a line segment style, avoiding inclined wires, which is beneficial to save the length size, and the first circuit board can be designed as a multi-layer wire to further reduce the occupied space of the display screen module; at the same time, since the single-row wire of the bending part is arranged in a line segment style, the wire end of the bending part is a connection port, realizing the reuse of the display panel.

[0032] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0033] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0034] Figure 1 is a schematic diagram of a screen using COP packaging technology in the related art.

[0035] Figure 2 is a cross-sectional schematic diagram of Figure 1

[0036] Figure 3 is a wire schematic diagram of the packaging area in Figure 1

[0037] Figure 4 is a structural schematic diagram of a display screen module according to an exemplary embodiment.

[0038] Figure 5 is a cross-sectional schematic diagram of the display screen module in Figure 4

[0039] Figure 6 is a structural schematic diagram of another display screen module according to an exemplary embodiment.

[0040] Figure 7 is​​​Figure 6 Cross-sectional diagram of the display module.

[0041] Figure 8 This is one of the cross-sectional schematic diagrams of a display screen module according to an exemplary embodiment.

[0042] Figure 9 This is a second cross-sectional schematic diagram of a display screen module according to an exemplary embodiment.

[0043] Figure 10 This is a third cross-sectional schematic diagram of a display screen module according to an exemplary embodiment.

[0044] Figure 11 This is a fourth cross-sectional schematic diagram of a display screen module according to an exemplary embodiment.

[0045] Figure 12 This is a fifth cross-sectional schematic diagram of a display screen module according to an exemplary embodiment.

[0046] Figure 13 This is a sixth cross-sectional schematic diagram of a display screen module according to an exemplary embodiment. DETAILED DESCRIPTION

[0047] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0048] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0049] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining."

[0050] Figure 1 is a schematic diagram of a screen adopting COP packaging technology in the related art, Figure 2 is Figure 1 a cross-sectional schematic diagram. As shown in Figure 1 and Figure 2 , the bent packaging area 102 of the screen 101 is bonded to the circuit board 103, and the driving IC 104 is bonded in the packaging area 102. Generally, the wire of the packaging area 102 bent to the back is usually a single-row wire, and the width size M1 is relatively large, and the driving IC 104 needs to be electrically connected with each wire, and the width size of the driving IC 104 is usually smaller than that of the single-row wire. Therefore, as shown in Figure 3 , the distal wire of the packaging area 102 is usually inclined to realize the fan-shaped inward shrinkage, so as to reduce the width size M1 of the single-row wire to realize the connection with the driving IC 104. However, due to the inclination of the distal wire, the length size M2 of the single-row wire of the packaging area 102 is increased, which is not conducive to the miniaturization of the screen 101.

[0051] Based on this, the display screen module provided by the present disclosure includes a display panel 1, a first circuit board 2, a second circuit board 3 and a chip 4. As shown in Figure 4 and Figure 5 , the display panel 1 can include a substrate and a thin film transistor layer, and the display panel 1 can include a panel body 11 and a bent portion 12 connected to the panel body 11. The bent portion 12 can be bent towards the non-display side of the display screen module 100 relative to the edge of the panel body 11. Part of the bent portion 12 is arranged towards the back of the panel body 11, and part is arranged parallel to the panel body 11.

[0052] The first circuit board 2 is electrically connected to the bent portion 12, the second circuit board 3 is electrically connected to the first circuit board 2, and the chip 4 is electrically connected to the first circuit board 2. In this way, the signal sent by the terminal equipment controller of the display screen module can be sent to the first circuit board 2 through the second circuit board 3, transmitted to the chip 4 through the first circuit board 2, and further transmitted to the display panel 1 through the first circuit board 2, so as to realize the control of the screen.

[0053] As can be seen from the above embodiment, the chip 4 is electrically connected to the first circuit board 2 in the present disclosure, so that each wire in the single-row wire of the bent portion 12 can be arranged in a line segment style, avoiding the inclined wire, which is conducive to saving the length size. In addition, the first circuit board 2 can be designed as a multi-layer wire to further reduce the occupied space of the display screen module. At the same time, since the single-row wire of the bent portion 12 is arranged in a line segment style, the wire end of the bent portion 12 can be used as a connection port to realize the reuse of the display panel 1.

[0054] Moreover, in the technical solution disclosed herein, two circuit boards, a first circuit board 2 and a second circuit board 3, are used to realize signal transmission. Compared with the solution of using a single circuit board and setting the chip 4 on the single circuit board, it is beneficial to set the first circuit board 2 and the second circuit board 3 to different materials, so as to facilitate the material of the first circuit board 2 to meet the material requirements in the bonding process of the chip 4 and the bonding process of the bending portion 12, thereby improving the bonding strength, and at the same time, the cost can be reduced by the material of the second circuit board 3.

[0055] In some embodiments, the second circuit board 3 can be partially stacked with the first circuit board 2, for example Figure 5 As shown in , the second circuit board 3 is partially stacked and arranged on the side of the first circuit board 2 away from the panel body 11; for another example, as shown in Figures 6-8 As shown, the second circuit board 3 is partially stacked on the side of the first circuit board 2 facing the panel body 11, that is, the second circuit board 3 can be partially arranged between the first circuit board 2 and the panel body 11. Based on this, the stacking arrangement between the first circuit board 2 and the second circuit board 3 is conducive to saving space in the length direction of the display module, that is, Figure 4 and Figure 6 In addition to being electrically connected to the first circuit board 2 for signal transmission, the second circuit board 3 also has some areas for arranging components and connecting to the main board. The areas on the second circuit board 3 used for arranging components and connecting to the main board do not need to be stacked with the first circuit board 2 to increase the degree of freedom of the second circuit board 3.

[0056] When the second circuit board 3 is stacked on the side of the first circuit board 2 away from the panel body 11, as shown in FIG. Figure 5 As shown, a portion of the second circuit board 3 can be protruded relative to the first circuit board 2 and cover a portion of the bent portion 12, thereby further saving the length space of the display screen module.

[0057] In the above-mentioned embodiments, the connection between the first circuit board 2 and the second circuit board 3 may be implemented in many different ways.

[0058] In some embodiments, as Figure 5 、 Figure 7 and Figure 8 As shown, the first circuit board 2 and the second circuit board 3 are electrically connected on one side thereof which is opposite to each other, which is convenient and simple and has relatively low connection difficulty.

[0059] In other embodiments, Figure 9 and Figure 10As shown, the second circuit board 3 includes a second main body part 31 and a second flexible part 32 connected to the second main body part 31, the second main body part 31 is partially stacked with the first circuit board 2, and the second flexible part 32 can be bent towards the first circuit board 2 relative to the second main body part 31, and realize electrical connection between the first circuit board 2 and the second circuit board 3. In this way, through the arrangement of the second flexible part 32, the freedom degree of the electrical connection position between the first circuit board 2 and the second circuit board 3 can be improved, and the assembly requirement is reduced.

[0060] For example, as shown in Figure 9 and Figure 10 , the second main body part 31 can be arranged on the side of the first circuit board 2 away from the panel body 11; in other embodiments, the second main body part 31 can also be arranged on the side of the first circuit board 2 facing the panel body 11; as shown in Figure 9 and Figure 10 , the second flexible part 32 is connected to the side of the first circuit board 2 facing the panel body 11, and in other embodiments, the second flexible part 32 can also be connected to the side of the first circuit board 2 away from the panel body 11, and the specific design can be as needed.

[0061] In still some embodiments, as shown in Figures 11-13 , the first circuit board 2 includes a first main body part 21 and a first flexible part 22 connected to the first main body part 21, the first main body part 21 is electrically connected with the bending part 12, and the first flexible part 22 is bent from the first main body part 21 away from the panel body 11, and the first flexible part 22 is electrically connected with the second circuit board 3. In this way, by virtue of the bendable advantage of the first flexible part 22, the connection freedom degree between the first circuit board 2 and the second circuit board 3 can be improved.

[0062] In some cases, the first main body part 21 can be a hard circuit board, and in other cases, the first main body part 21 can be a flexible board, i.e., the first circuit board 2 as a whole is a flexible circuit board. The first main body part 21 can include a lap zone 211, a main body zone 212, and a transition zone 213 connecting the lap zone 211 and the main body zone 212, the lap zone 211 is electrically connected with the bending part 12, the first flexible part 22 is connected with the main body zone 212, and the main body zone 212 is arranged closer to the panel body 11 relative to the lap zone 211. That is, as shown in Figure 12 and Figure 13 , the main body zone 212 can be sunken relative to the lap zone 211 towards the panel body 11, thereby saving space in the thickness direction of the display screen module, which is conducive to the miniaturization of the display screen module.

[0063] For the scheme that the main body zone 212 is arranged closer to the panel body 11 relative to the lap zone 211, in some embodiments, as shown in Figure 13As shown, one side of the second circuit board 3 facing the main body area 212 can be provided in a planar manner, and in the case where the second circuit board 3 is also stacked with the lap joint area 211, a first cushion block 5 can be arranged between the main body area 212 and the second circuit board 3 to support the second circuit board 3, and at the same time, a gap can be left between the second circuit board 3 and the main body area 212 through the support of the first cushion block 5, which is conducive to arranging the chip 4 on the side of the main body area 212 facing the second circuit board 3, and the first cushion block 5 avoids the arrangement of the chip 4, so that the first cushion block 5 can be used for buffering protection, and the assembly space of the chip 4 is formed by the sinking of the main body area 212, without occupying additional thickness size.

[0064] In other embodiments, as shown in Figure 12 The second circuit board 3 includes a first step surface 33 and a second step surface 34 facing the first main body part 21, and a height difference is arranged between the first step surface 33 and the second step surface 34, the first step surface 33 is arranged towards the main body area 212, and the second step surface 34 is arranged towards the lap joint area 211, so that the sinking space of the main body area 212 relative to the lap joint area 211 can be converted into the thickness space of the second circuit board 3 corresponding to the main body area 212, which is conducive to the multi-layer design of this area and reduces the size of the second circuit board 3 in the direction perpendicular to the thickness direction.

[0065] In the above various embodiments, as shown in Figure 10 , Figure 11 and Figure 12 The chip 4 can be electrically connected to the side of the first circuit board 2 facing the panel main body 11, and specifically, the chip 4 can be connected to the side of the first main body part 21 facing the panel main body 11, and the second circuit board 3 is arranged on the side of the first circuit board 2 away from the panel main body 11, and the display screen module can further include a second cushion block 6 arranged between the first circuit board 2 and the panel main body 11, and the second cushion block 6 can avoid the chip 4, such as the second cushion block 6 being an entire cushion block provided with an opening or a groove, or the display screen module can include a plurality of second cushion blocks 6 arranged around the chip 4, so as to prevent interference between the display panel 1 and the chip 4 on the one hand, and to protect the chip 4 by buffering the impact on the display panel 1 on the other hand.

[0066] As shown in Figure 12 The two sides of the second cushion block 6 can be directly bonded with the first circuit board 2 and the panel main body 11; in other embodiments, in order to further protect the chip 4, still as shown in Figure 10 and Figure 11As shown, the display module further comprises a third cushion block 7, which is arranged between the second cushion block 6 and the panel body 11, and covers the chip 4. In this way, on the one hand, the third cushion block 7 can further achieve buffering, and on the other hand, the third cushion block 7 can protect the chip 4 when falling or colliding, so as to avoid the chip 4 from being impacted. In subsequent maintenance, the chip 4 and the first circuit board 2 can be reused, thereby reducing the maintenance cost.

[0067] In the above various embodiments, the first cushion block 5, the second cushion block 6 and the third cushion block 7 can be flexible members, such as foam or rubber members or plastic members or silica gel members. When the chip 4 is arranged on the side of the first circuit board 2 away from the panel body 11, the second cushion block 6 or the third cushion block 7 can also be arranged between the first circuit board 2 and the panel body 11. Of course, when the second circuit board 3 is arranged between the first circuit board 2 and the panel body 11, the second cushion block 6 or the third cushion block 7 can also be arranged between the second circuit board 3 and the panel body 11, which can be designed as needed.

[0068] In the above various embodiments, as shown in Figure 5 , Figure 8 and Figure 9 , the chip 4 can be electrically connected to the side of the first circuit board 2 facing the second circuit board 3. The second circuit board 3 is provided with a avoiding portion 35, and the chip 4 can be partially accommodated in the avoiding portion 35. In this way, by arranging the avoiding portion 35, the thickness of the display module can be avoided due to the arrangement of the chip 4, which is beneficial to the integration and miniaturization of the display module. The avoiding portion 35 can be a groove, or the avoiding portion 35 can be a stepped accommodation cavity. Whether the second circuit board 3 is partially arranged between the first circuit board 2 and the panel body 11, or the first circuit board 2 is partially arranged between the second circuit board 3 and the panel body 11, the avoiding portion 35 can be formed on the second circuit board 3 as needed. For details, please refer to the foregoing embodiments, which will not be described here.

[0069] Based on the display module provided in the above various embodiments, the present disclosure further provides an electronic device, which comprises the display module according to any one of the above embodiments. The electronic device can include a mobile phone terminal, a tablet terminal or a wearable terminal, etc.

[0070] Other embodiments of the present disclosure will be readily apparent to those skilled in the art upon considering the description herein, with the disclosure intended to cover any alternatives, modifications, or equivalents falling within the scope of the disclosure and including those falling within the general principles of the present disclosure and including those that are obvious once disclosed. The description and examples are to be considered exemplary only, with the true scope and spirit of the present disclosure indicated by the following claims.

[0071] It should be understood that the present disclosure is not limited to the precise construction that has been described above and shown in the accompanying drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A display screen module, characterized by The display panel comprises a panel body and a bending portion connected with the panel body, the bending portion bends towards a non-display side of the display screen module relative to the panel body; The first circuit board is electrically connected with the bending portion; The second circuit board is electrically connected with the first circuit board; The chip is electrically connected with the first circuit board. The second circuit board is stacked with the first circuit board.

2. The display module of claim 1, wherein, The second circuit board is arranged on a side of the first circuit board away from the panel body.

3. The display screen module according to claim 2, wherein: The second circuit board protrudes relative to the first circuit board and covers a part of the bending portion.

4. The display module of claim 3, wherein, The second circuit board and the first circuit board are electrically connected on two opposite sides.

5. The display module of claim 1, wherein, The first circuit board comprises a first main portion and a first flexible portion connected with the first main portion, the first main portion is electrically connected with the bending portion, and the first flexible portion bends from the first main portion towards a direction away from the panel body and is electrically connected with the second circuit board.

6. The display module of claim 1, wherein, The first main portion is a flexible board, the first main portion comprises a lap region, a main body region and a transition region, the transition region connects the lap region and the main body region, the lap region is electrically connected with the bending portion, the first flexible portion is connected with the main body region, and the main body region is arranged close to the panel body relative to the lap region.

7. The display module of claim 6, wherein, The second circuit board comprises a first step surface and a second step surface towards the first main portion, a height difference is arranged between the first step surface and the second step surface, the first step surface is arranged towards the main body region, and the second step surface is arranged towards the lap region.

8. The display module of claim 7, wherein, A first pad is arranged between the main body region and the second circuit board.

9. The display module of claim 7, wherein, The chip is arranged on a side of the main body region towards the second circuit board, and the first pad avoids the chip.

10. The display module of claim 9, wherein, The second circuit board comprises a second main portion and a second flexible portion connected with the second main portion, and the second main portion is stacked with the first circuit board.

11. The display module of claim 1, wherein, The second flexible portion bends relative to the second main portion towards the first circuit board and is electrically connected with the first circuit board. The second flexible portion is electrically connected on a side of the first circuit board towards the panel body; or 12. The display module of claim 11, wherein, The second flexible portion is electrically connected on a side of the first circuit board away from the panel body. The chip is electrically connected on a side of the first circuit board towards the panel body, and the second circuit board is partially stacked on a side of the first circuit board away from the panel body.

13. The display module of claim 2, wherein: The display screen module further comprises a second pad arranged between the first circuit board and the panel body, and the second pad avoids the chip. A third pad is arranged between the panel body and the second pad, and the third pad covers the chip.

14. The display module of claim 13, wherein, The second circuit board is provided with an avoiding portion; 15. The display module of claim 1, wherein, The chip is electrically connected on a side of the first circuit board towards the second circuit board, and the chip is partially accommodated in the avoiding portion. The avoiding portion comprises a groove or a stepped accommodating cavity.

16. The display module of claim 15, wherein, ​ 17. The display module of claim 1, wherein, The second circuit board portion is disposed between the panel body and the first circuit board.

18. An electronic device, comprising: The display screen module comprises the display screen module as claimed in any one of claims 1-17.

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