Substrate processing method, substrate processing apparatus and computer program product

Abstract

The present invention provides a substrate processing method, a substrate processing apparatus, and a computer program product capable of easily filling gaps between substrates with a chemical solution. The substrate processing method includes: a step of supplying a first chemical solution to a gap (G) between a first substrate (W1) and a second substrate (W2) at a peripheral edge portion (W3a) of a laminated substrate (W3) formed by bonding the first substrate (W1) and the second substrate (W2); a step in which a second chemical liquid different from the first chemical liquid is supplied to the gap (G) at the peripheral portion (W3a) so as to replace the first chemical liquid in the gap (G) with the second chemical liquid; and a step for solidifying the second chemical solution in the gap (G).

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing method, a substrate processing apparatus, and a computer program product. BACKGROUND

[0002] A substrate processing method is disclosed in Patent Literature 1, which includes a step of holding a laminated substrate, a step of preheating the laminated substrate, and a step of filling a protective material in a gap between the laminated substrates along an edge of the substrate.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: U.S. Patent No. 9508659 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present application provides a method, an apparatus, and a program that easily fill a chemical liquid in a gap between substrates at a peripheral edge portion of a laminated substrate.

[0008] MEANS FOR SOLVING THE PROBLEMS

[0009] In one example embodiment, a substrate processing method includes a step of supplying a first chemical liquid to a gap between a first substrate and a second substrate at a peripheral edge portion of a laminated substrate formed by joining the first substrate and the second substrate, a step of supplying a second chemical liquid different from the first chemical liquid to the gap at the peripheral edge portion to replace the first chemical liquid in the gap with the second chemical liquid, and a step of solidifying the second chemical liquid in the gap.

[0010] EFFECTS OF THE INVENTION

[0011] According to the present application, a method and an apparatus that easily fill a chemical liquid in a gap between substrates are provided. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a schematic plan view illustrating a schematic configuration of a substrate processing apparatus.

[0013] Figure 2 is a side view showing an example of a liquid processing module.

[0014] Figure 3 is a plan view briefly showing a liquid processing module.

[0015] Figure 4 (a) of is a view for explaining an action of a control device controlling a liquid processing module to supply a first chemical liquid. Figure 4 (b) of is a view for explaining an action of the control device controlling the liquid processing module to supply a second chemical liquid.

[0016] Figure 5 (a) is a diagram for explaining an example in which the gap is filled with the second chemical liquid using the first chemical liquid as a guide. Figure 5 (b) is a diagram for explaining an example of filling the deep part of the gap with the second chemical solution.

[0017] Figure 6 This is a diagram showing an example of a second nozzle including a guide member.

[0018] Figure 7 This is a diagram showing another example of the second nozzle including the guide member.

[0019] Figure 8 This is a diagram showing an example of supplying a medical solution using a guide member.

[0020] Figure 9 This is a diagram showing an example of supplying a chemical solution using an inert gas.

[0021] Figure 10 This is a diagram showing another example of supplying a chemical solution using a nozzle.

[0022] Figure 11 This is a diagram showing an example of hydrophilization treatment of a laminated substrate.

[0023] Figure 12 This is a diagram showing an example of a cleaning process for a laminated substrate.

[0024] Figure 13 It is a side view showing an example of a liquid processing module according to a modified example.

[0025] Figure 14 It is a side view showing another example of a liquid processing module according to a modified example.

[0026] Figure 15 This is a diagram showing an example of immersion of a laminated substrate in a reservoir liquid.

[0027] Figure 16 This is a diagram showing an example of supplying the second chemical liquid using a plurality of jet dispensers.

[0028] Figure 17 (a) is a side view showing an example of a guide member covering the peripheral edge portion of the stacked substrate. Figure 17 (b) is a plan view showing an example of a guide member covering the peripheral edge portion of the laminated substrate. Figure 17 (c) is a plan view showing another example of the guide member covering the peripheral edge portion of the laminated substrate.

[0029] Figure 18 (a) is a diagram showing the direct application of the second chemical solution to the gap using a supply brush. Figure 18(b) is a view showing that the second chemical solution is directly applied to the gap using the supply line.

[0030] Figure 19 (a) of FIG. 8 is a view showing an example of a side view of the rotation holding portion of the modification. Figure 19 (b) of FIG. 8 is a view showing an example of a side view of the rotation holding portion after the vacuum suction.

[0031] Figure 20 (a) is a plan view showing a state of the gap. Figure 20 (b) of FIG. 7 is a view schematically showing a filling degree of the second chemical solution in the gap after the second chemical solution is supplied to the gap. Figure 20 (c) of FIG. 7 is a view schematically showing a filling degree of the second chemical solution in the gap after one cycle is repeated.

[0032] Figure 21 (a) is a plan view showing a state of the gap. Figure 21 (b) of FIG. 6 is a view schematically showing a filling degree of the second chemical solution in the gap after the second chemical solution is supplied to the gap. Figure 21 (c) of FIG. 6 is a view schematically showing a filling degree of the second chemical solution in the gap after the process of rotating the stacked substrates at the second rotation speed is performed. Figure 21 (d) of FIG. 6 is a view schematically showing a filling degree of the second chemical solution in the gap after one cycle is repeated.

[0033] Figure 22 (a) of FIG. 5 is a view showing an example of the measurement of the peripheral portion by the detection portion. Figure 22 (b) of FIG. 5 is a view showing an example of the projected image.

[0034] Figure 23 FIG. 4 is a view showing an example of a hardware structure of the control device.

[0035] Figure 24 FIG. 3 is a flowchart showing an example of a substrate processing method performed by the liquid processing module of the embodiment by the control device.

[0036] Figure 25 FIG. 2 is a flowchart showing an example of a substrate processing method performed by the liquid processing module of the modification by the control device.

[0037] BRIEF DESCRIPTION OF REFERENCE NUMERALS

[0038] 1 … substrate processing apparatus; 31 … curing processing module (curing section); 6, 7 … nozzles; 63 … storage liquid; 91 … first chemical liquid supply section; 92 … second chemical liquid supply section; 964 … plunger; F1 … first chemical liquid; F2 … second chemical liquid; G … gap; W1 … first substrate; W2 … second substrate; W3 … laminated substrate; W1a … peripheral portion of the first substrate; W3a … peripheral portion of the laminated substrate. DETAILED DESCRIPTION

[0039] Hereinafter, a substrate processing apparatus according to the present embodiment will be described with reference to the drawings. In addition, in the present specification, elements having substantially the same functional configuration are denoted by the same reference numerals and repeated description is omitted.

[0040] [SUBSTRATE PROCESSING APPARATUS]

[0041] First, the structure of the substrate processing apparatus according to the present embodiment will be described. Figure 1 is a plan view schematically showing the outline structure of the substrate processing apparatus. The substrate processing apparatus 1 is an apparatus that fills a chemical liquid into a gap between a first substrate and a second substrate of a laminated substrate W3 in which the first substrate and the second substrate are bonded.

[0042] As shown in Figure 1 , the substrate processing apparatus 1 has a cassette station 2 that feeds in and out a cassette C in which a plurality of laminated substrates W3 are stored, and a processing station 3 that includes a plurality of various processing apparatuses that perform a prescribed processing on the laminated substrate W3. Also, the substrate processing apparatus 1 has a structure that connects the cassette station 2 and the processing station 3 in one body.

[0043] The cassette station 2 is provided with a plurality of cassette placement tables 21 and substrate conveying apparatuses 22 and 23. The cassette station 2 conveys the laminated substrate W3 between the cassette C placed on the cassette placement table 21 and the processing station 3 by the substrate conveying apparatus 22 or 23. Therefore, the substrate conveying apparatuses 22 and 23 each include a driving mechanism in the length direction, the width direction, the up-and-down direction, the direction around the vertical axis (θ direction), as needed, and can include a driving mechanism in all directions.

[0044] At least either one of the substrate conveying apparatuses 22 and 23 is capable of the exchange of the laminated substrate W3 with the cassette C, and is also capable of the exchange of the laminated substrate W3 with the processing station 3. In addition, the exchange of the laminated substrate W3 with the processing station 3 means, for example, the exchange of the laminated substrate W3 between the third block G3 and the exchange apparatus that the substrate conveying apparatus 33 in the processing station 3 described later is capable of reaching. The third block G3 can also include a plurality of exchange apparatuses (not shown) arranged in the up-and-down direction.

[0045] The processing station 3 is provided with a plurality of blocks, for example, a first block G1 and a second block G2. For example, a plurality of layers including the first block G1 and the second block G2 are stacked in the vertical direction. For example, on the front side ( Figure 1 The first block G1 is provided on the negative side of the X direction of the processing station 3. Figure 1 The second block G2 is provided on the positive X-direction side. In addition, the third block G3 may also be provided in the processing station 3.

[0046] A plurality of liquid processing modules 4 are provided in the first block G1. The liquid processing module 4 supplies a chemical liquid to the gap between the first substrate and the second substrate in the stacked substrate W3. A plurality of curing processing modules 31 (curing units) are provided in the second block G2. The curing processing module 31 performs a process of curing the chemical liquid supplied to the gap between the first substrate and the second substrate using the liquid processing module 4. For example, in the case where the chemical liquid is a heat-curing type, the curing processing module 31 may also be a heat treatment module for heating the stacked substrate W3. The heat treatment module, for example, has a hot plate that supports the stacked substrate W3, and cures the stacked substrate W3 using a heater built into the hot plate. In the case where the chemical liquid is a light-curing type, the curing processing module 31 may also be a light irradiation module that irradiates the gap between the first substrate and the second substrate with energy rays such as UV light. In the case where the chemical liquid is a gas-curing type, the curing processing module 31 may also be a gas supply module that supplies an inert gas to the gap between the first substrate and the second substrate.

[0047] like Figure 1 As shown, a substrate transport area 32 is formed in the area sandwiched between the first block G1 and the second block G2 when viewed from above. A substrate transport device 33, for example, is disposed in the substrate transport area 32. The substrate transport device 33 includes a transport arm that is movable in, for example, the X direction, the Y direction, the θ direction, and the vertical direction. The substrate transport device 33 is movable within the substrate transport area 32 to transport the stacked substrate W3 to designated devices within the surrounding first block G1, second block G2, and third block G3.

[0048] The substrate processing apparatus 1 can further include a polishing device, a trimming device, a patterned film forming device, a developing processing device, and an interface block. The polishing device, for example, polishes the surfaces of the first substrate and the second substrate after the chemical solution is cured in the gap of the laminated substrate W3. Thus, the polishing device can also adjust the thickness of the laminated substrate W3. The trimming device, for example, trims the outer edge portion of the laminated substrate W3 by polishing or the like after polishing by the polishing device. The patterned film forming device, for example, forms a patterned film such as a resist film on the laminated substrate W3. The developing processing device, for example, removes a portion of the patterned film exposed by the exposure device to form a concave-convex pattern as a mask. The polishing device, the trimming device, the patterned film forming device, the developing processing device, and the like can be provided in any of the first block Gl, the second block G2, and the third block G3. In the case where the patterned film forming device and the developing processing device are included, the substrate processing apparatus 1 can further have an interface station that interfaces the laminated substrate W3 between the exposure device.

[0049] The above substrate processing apparatus 1 is provided with a control device 100. The control device 100 is, for example, a computer having a program storage section (not shown). A program for controlling the processing of the laminated substrate W3 in the substrate processing apparatus 1 is stored in the program storage section. In addition, a program for controlling the operation of the drive system of the above-described various processing devices, the conveying devices, and the like to achieve the filling processing of the chemical solution in the substrate processing apparatus 1 is also stored in the program storage section. Further, the above-described programs can be recorded in a storage medium H readable by a computer, and installed in the control device 100 from the storage medium H.

[0050] The control device 100 controls the substrate conveying devices 22, 23, 33 to take out the laminated substrate W3 from the cassette C placed on the cassette placement table 21 and to feed it into the liquid processing module 4. Next, the control device 100 controls the liquid processing module 4 to fill the chemical solution in the gap between the first substrate and the second substrate, and controls the substrate conveying device 33 to feed the laminated substrate W3 out of the liquid processing module 4 and into the curing processing module 31. Next, the control device 100 controls the curing processing module to cure the chemical solution filled in the gap between the first substrate and the second substrate. Next, the control device 100 controls the substrate conveying devices 33, 22, 23 to feed the laminated substrate W3 out of the curing processing module 31 and to feed it back into the cassette C.

[0051] Hereinafter, the structure of the liquid processing module 4 that easily fills the chemical solution in the gap between the first substrate and the second substrate will be exemplified.

[0052] [LIQUID PROCESSING MODULE]

[0053] Figure 2is a side view showing an example of a liquid processing module. The liquid processing module 4 includes a liquid medicine supply section. The liquid medicine supply section holds a laminated substrate W3 in which a first substrate Wl and a second substrate W2 are bonded, in a manner that the first substrate Wl is positioned above the second substrate W2, supplies liquid medicine to a peripheral edge portion Wla of the first substrate Wl, and causes the liquid medicine to move from the peripheral edge portion Wla of the first substrate Wl to a gap G between the first substrate Wl and the second substrate W2. The liquid medicine supply section has a first liquid medicine supply section 91 and a second liquid medicine supply section 92. In the liquid processing module 4, it is not necessary to cause the liquid medicine to reach the gap with high precision, and thus it is possible to suppress the influence of warping of the laminated substrate W3 or the like, and it is possible to easily fill the liquid medicine in the gap G. In addition, the first substrate Wl and the second substrate W2 can be bonded by fusion bonding, anode bonding, or the like, without the aid of an adhesive, or can be bonded with the aid of an adhesive (see the adhesive AD in Figure 4 and Figure 5 ).

[0054] The first liquid medicine supply section 91 supplies first liquid medicine to the gap G from a peripheral edge portion W3a of the laminated substrate W3 in which the first substrate Wl and the second substrate W2 are bonded. The second liquid medicine supply section 92 supplies second liquid medicine to the gap G from the peripheral edge portion W3a, to replace the first liquid medicine in the gap G with the second liquid medicine that is different from the first liquid medicine. Thus, by supplying the first liquid medicine to the gap before the second liquid medicine to be cured, it is possible to easily fill the second liquid medicine in the gap G with the first liquid medicine in the gap G as a guide.

[0055] The liquid processing module 4 includes, for example, a rotation holding section 5, a first nozzle 6, a second nozzle 7, a nozzle moving mechanism 8, the first liquid medicine supply section 91, and the second liquid medicine supply section 92.

[0056] The rotation holding section 5 holds and rotates the laminated substrate W3. The rotation holding section 5 has, for example, a holding section 51 and a rotation driving section 52. The holding section 51 supports a central portion of the laminated substrate W3 that is horizontally arranged with the first substrate Wl facing upward, and holds the laminated substrate W3 by, for example, vacuum suction or the like. The rotation driving section 52 is, for example, an actuator that uses an electric motor or the like as a power source. Figure 3 is a plan view that briefly shows the liquid processing module. The rotation driving section 52 rotates the holding section 51 around a vertical rotation center RC in accordance with an instruction from a control device 100. Thus, the laminated substrate W3 is rotated around the rotation center RC.

[0057] The first nozzle 6 releases the first chemical liquid. The first chemical liquid supply unit 91 supplies the first chemical liquid to the first nozzle 6. The second nozzle 7 releases the second chemical liquid. The second chemical liquid supply unit 92 supplies the second chemical liquid to the second nozzle 7. The first chemical liquid supply unit 91 and the second chemical liquid supply unit 92 include a supply path for supplying chemical liquids, a supply source for the chemical liquids, and a pump for transporting the chemical liquids. For example, the first chemical liquid supply unit 91 drives the pump according to an instruction from the control device 100 to supply the first chemical liquid to the first nozzle 6. Similarly, the second chemical liquid supply unit 92 drives the pump according to an instruction from the control device 100 to supply the second chemical liquid to the second nozzle 7.

[0058] The nozzle moving mechanism 8 moves the first nozzle 6 and the second nozzle 7 to desired positions, for example, based on instructions from the control device 100. For example, the nozzle moving mechanism 8 arranges the first nozzle 6 at a position where it can supply the first chemical liquid to the gap G. For example, the nozzle moving mechanism 8 arranges the first nozzle 6 so that it is directed from obliquely above toward the upper surface of the peripheral portion W1a of the first substrate W1 in a direction away from the rotation center RC of the stacked substrate W3. As a result, the first chemical liquid released from the first nozzle 6 is supplied from obliquely above to the upper surface of the peripheral portion W1a of the first substrate W1 in a direction away from the rotation center RC of the stacked substrate W3. The first chemical liquid supplied to the upper surface of the peripheral portion W1a moves to the gap G via the outer peripheral surface of the first substrate W1.

[0059] For example, the nozzle moving mechanism 8 positions the second nozzle 7 so that it can supply the second chemical liquid to the gap G. For example, the nozzle moving mechanism 8 positions the second nozzle 7 so that it is directed from obliquely above toward the upper surface of the peripheral edge W1a of the first substrate W1, away from the rotation center RC of the stacked substrate W3. As a result, the second chemical liquid released from the second nozzle 7 is supplied from obliquely above to the upper surface of the peripheral edge W1a of the first substrate W1, away from the rotation center RC of the stacked substrate W3. The second chemical liquid supplied to the upper surface of the peripheral edge W1a moves to the gap G via the outer peripheral surface of the first substrate W1.

[0060] like Figure 3 As shown, the nozzle moving mechanism 8 can also, for example, arrange the first nozzle 6 and the second nozzle 7 so as to be tilted in the radial direction of the stacked substrate W3. In this case, the first nozzle 6 and the second nozzle 7 can also be tilted in a manner that is in the rotation direction from the radial direction of the stacked substrate W3 toward the peripheral portion W1a. The nozzle moving mechanism 8 can move the first nozzle 6 and the second nozzle 7 separately, or they can move simultaneously. For example, the nozzle moving mechanism 8 uses an electric motor or the like as a power source to move the first nozzle 6 and the second nozzle 7 along a horizontal straight line. In this case, the nozzle moving mechanism 8 can also move the first nozzle 6 and the second nozzle 7 while fixing the directions of the first nozzle 6 and the second nozzle 7.

[0061] The control device 100 can also cause the liquid processing module 4 to perform a process of supplying a liquid to the peripheral portion Wla of the first substrate Wl while the layered substrate W3 formed by bonding the first substrate Wl to the second substrate W2 is held in a horizontal state with the first substrate Wl positioned above the second substrate W2, and moving the liquid from the peripheral portion Wla of the first substrate Wl to the gap G between the first substrate Wl and the second substrate W2. The control device 100 can also cause the liquid processing module 4 to perform a process of supplying a first liquid to the gap G at the peripheral portion W3a of the layered substrate W3 formed by bonding the first substrate Wl to the second substrate W2, and a process of supplying a second liquid to the gap G to replace the first liquid in the gap G with the second liquid different from the first liquid.

[0062] For example, the control device 100 controls the rotation holding portion 5 to hold the layered substrate W3 in a horizontal state and rotate the layered substrate W3 in a manner that the first substrate Wl is positioned above the second substrate W2. The control device 100 can also control the nozzle moving mechanism 8 and the first liquid supply portion 91 to supply the first liquid from the first nozzle 6 to the gap G in a region through which the peripheral portion W3a of the layered substrate W3 passes due to rotation of the layered substrate W3 while rotating the layered substrate W3. The region includes a position through which the peripheral portion W3a of the layered substrate W3 passes and its surroundings. Similarly, the control device 100 can also control the nozzle moving mechanism 8 and the second liquid supply portion 92 to supply the second liquid from the second nozzle 7 to the gap G in the region while rotating the layered substrate W3. Thus, it is possible to easily fill the second liquid without displacing the first nozzle 6 as a supply source of the first liquid and the second nozzle 7 as a supply source of the second liquid along the circumferential direction of the layered substrate W3.

[0063] The control device 100 can also control the rotation holding portion 5 to rotate the layered substrate W3 at a rotational speed at which centrifugal force generated by rotation does not hinder movement of the second liquid to the gap G during the supply of the first liquid and the second liquid. It is possible to simultaneously achieve easiness of the supply of the first liquid and the second liquid by rotating the layered substrate W3, and easiness of movement of the first liquid and the second liquid into the gap G. For example, the control device 100 can set the rotational speed during the supply of the first liquid and the second liquid to be 60 rpm or less, or 10 rpm or more and 60 rpm or less. The control device 100 can also set the rotational speed during the supply of the first liquid to be different from the rotational speed during the supply of the second liquid.

[0064] For example, with reference to Figure 4 and Figure 5, the control device 100 controls the liquid processing module 4 to supply the liquid medicine in more detail. The control device 100 controls the liquid processing module 4 to supply the first liquid medicine F1 from the first nozzle 6 to the gap G. Figure 4 As shown in (a), the control device 100 causes the nozzle moving mechanism 8 to arrange the first nozzle 6 so as to face away from the rotation center RC of the stacked substrate W3 from obliquely above toward the upper surface of the peripheral portion W1a of the first substrate W1. Thereafter, the control device 100 supplies the first chemical liquid from the first chemical liquid supply unit 91 to the first nozzle 6. Thus, the first chemical liquid is supplied to the upper surface of the peripheral portion W1a of the first substrate. The first chemical liquid F1 supplied to the upper surface W1b moves from the upper surface W1b to the gap G via the peripheral surface W1c of the first substrate W1. In this way, the chemical liquid F1 can be supplied from the peripheral surface W1c without being affected by the warping of the stacked substrate W3.

[0065] Next, the control device 100 controls the liquid processing module 4 to supply the second chemical liquid F2 from the second nozzle 7 to the gap G. Figure 4 As shown in (b), the control device 100 causes the nozzle moving mechanism 8 to arrange the second nozzle 7 in a manner such that it faces away from the rotation center RC of the stacked substrate W3 and from obliquely upward toward the upper surface of the peripheral portion W1a of the first substrate W1. Thereafter, the control device 100 supplies the second chemical liquid from the second chemical liquid supply unit 92 to the second nozzle 7. As a result, the second chemical liquid is supplied to the upper surface of the peripheral portion W1a of the first substrate W1. Figure 5 As shown in (a) of FIG. 1 , the second chemical solution F2 supplied to the upper surface W1 b moves from the upper surface W1 b to the gap G via the outer peripheral surface W1 c of the first substrate W1 .

[0066] like Figure 5 As shown in (b), the first chemical liquid F1 filling the gap G is replaced by the second chemical liquid F2. By supplying the first chemical liquid F1 to the gap G before the second chemical liquid F2, the first chemical liquid F1 in the gap G can be used as a guide to facilitate the filling of the second chemical liquid F2 into the gap G. As described above, the second chemical liquid F2 filling the gap G is solidified by the solidification processing module 31.

[0067] The surface tension of the first chemical liquid F1 can be lower than the surface tension of the second chemical liquid F2. In this case, the first chemical liquid F1, acting as a guide, can easily penetrate deep into the gap G. Therefore, filling with the second chemical liquid F2 is easy. The surface tension of the first chemical liquid can be 30 mN / m or lower. This refers to the surface tension of a 0.1% solution, i.e., 0.1 g of solute and 99.9 g of solvent. The surface tension of the first chemical liquid can be between 10 mN / m and 50 mN / m. In this case, the first chemical liquid F1 can more easily penetrate deep into the gap G.

[0068] The first liquid F1 can also contain a diluent. The first liquid F1 can contain at least either of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether. The first liquid F1 can contain only polyethylene glycol monomethyl ether acetate, only polyethylene glycol monomethyl ether, or both. Since the liquid described above has a low surface tension, the first liquid F1 can more easily penetrate into the deep part of the gap G.

[0069] The viscosity of the second liquid F2 can also be higher than that of the first liquid F1. Viscosity indicates the ease of flow of an object, and thus the second liquid F2 is less likely to flow than the first liquid F1. In this case, the second liquid F2 having a higher viscosity than the first liquid F1 is filled into the gap G using the guiding effect of the first liquid F1, and thus the strength of the peripheral portion W3a of the laminated substrate W3 can be improved. The viscosity of the second liquid F2 can be 5 cP (centipoise) or more and 40 cP or less. In contrast, the viscosity of the first liquid F1 can be 1 cP or more and 5 cP or less.

[0070] The second liquid F2 can also be a liquid material that is cured by heat. The second liquid F2 is cured by heat treatment, and thus the second liquid F2 filled into the gap G can be easily cured to the deep part of the gap G. The second liquid F2 can also be, for example, SOG (Spin-On Glass). The second liquid F2 can also be an organic polymer solution containing a glass component such as silicon dioxide (SiO2). The second liquid F2 can also be a resist.

[0071] The liquid processing module 4 can also be configured to be able to promote the movement of the second liquid F2 from the peripheral portion W1a of the first substrate W1 to the gap G using a guide member. Referring to Figures 6-9 An example of liquid supply using a guide will be described.

[0072] As Figure 6As shown, the liquid processing module 4 may further include a guide component 72. When the second nozzle 7 supplies the second liquid medicine F2 to the peripheral portion W1a, the guide component 72 is opposite to the upper surface W1b. Thus, the second liquid medicine F2 released by the second nozzle 7 is supplied between the upper surface W1b and the guide component 72. The guide component 72 may also be formed integrally with the second nozzle 7. For example, the guide component 72 is provided in a manner surrounding the liquid medicine flow path 71 of the second nozzle 7, and has a flat guide surface 72a surrounding the opening of the liquid medicine flow path 71. The control device 100 may also utilize the second nozzle 7 to supply the second liquid medicine F2 between the upper surface W1b and the guide component 72 in a state in which the guide component 72 is opposite to the upper surface W1b. For example, the control device 100 moves the second nozzle 7 to a position in which the guide surface 72a of the guide component 72 is opposite to the upper surface W1b, and starts to release the liquid medicine from the liquid medicine flow path 71. In this case, the guide member 72 suppresses the second chemical liquid F2 from rising upward, thereby promoting the movement of the second chemical liquid F2 toward the outer peripheral surface W1 c.

[0073] like Figure 7 As shown, the liquid processing module 4 may further include a guide component 74. When the second nozzle 7 supplies the second liquid medicine F2 to the peripheral portion W1a, the guide component 74 is opposite to the peripheral surface W1c of the first substrate W1. Thus, the second liquid medicine F2 released by the second nozzle 7 is supplied between the peripheral surface W1c and the guide component 74. The guide component 74 may also be formed integrally with the second nozzle 7. The guide component 74 may also be arranged adjacent to the liquid medicine outlet path 73 in a direction farther away from the rotation center RC than the liquid medicine flow path 71. The front end of the guide component 74 may also be released, for example, below the end face of the second nozzle 7 in the vertical direction and located between the peripheral surface W1c and the gap G. The control device 100 may also use the second nozzle 7 to supply the second liquid medicine F2 between the peripheral surface W1c and the guide component 74 in a state in which the guide component 74 is opposite to the peripheral surface W1c. For example, the control device 100 moves the second nozzle 7 to a position where the guide member 74 faces the peripheral surface W1c, and starts releasing the chemical liquid from the chemical liquid flow path 71. In this case, by suppressing the movement of the second chemical liquid F2 away from the rotation center RC of the stacked substrate W3, the movement of the second chemical liquid F2 into the gap G can be promoted.

[0074] like Figure 8As shown, the liquid processing module 4 may further include a guide component 75. The guide component 75 is disposed around the stacked substrate W3 and has a guide surface 75a that supports the first liquid chemical F1 from below. The guide surface 75a is inclined so as to gradually increase in height as it moves away from the stacked substrate W3. The front end of the guide surface 75a is located between the first substrate W1 and the second substrate W2 at a position closest to the stacked substrate W3. The area between the first substrate W1 and the second substrate W2 is, for example, between the center of the thickness of the first substrate W1 and the center of the thickness of the second substrate W2. The guide component 75 promotes the movement of the first liquid chemical F1 and the second liquid chemical F2 toward the gap G via the inclined guide surface 75a. The control device 100 may also control the nozzle moving mechanism 8 and the first liquid chemical supply unit 91 to supply the first liquid chemical F1 from the first nozzle 6 toward the guide surface 75a. Similarly, the control device 100 may also control the nozzle moving mechanism 8 and the second liquid chemical supply unit 92 to supply the second liquid chemical F2 from the second nozzle 7 toward the guide surface 75a.

[0075] The liquid processing module 4 may further include a gas supply unit 93. Figure 9 As shown, the gas supply unit 93 includes, for example, a gas nozzle 931 that releases an inert gas from the outside toward the gap G around the stacked substrate W3; and a gas supply source 932 that supplies an inert gas GS to the gas nozzle 931. After supplying the second chemical liquid F2 to the gap G, the control device 100 controls the gas supply unit 93 to push the second chemical liquid F2 further into the gap G. The inert gas GS is, for example, a nitrogen-containing gas. The inert gas can be used to push the second chemical liquid F2 deeper into the gap G. The control device 100 can also control the gas supply unit 93 to use the guide member 75 to push the second chemical liquid F2 further into the gap G. In this case, the control device 100 releases the inert gas GS from the gas nozzle 931 toward the guide surface 75a. As a result, the inert gas GS flows along the guide surface 75a to the gap G, pushing the second chemical liquid F2 into the gap.

[0076] In the above, the second nozzle 7 supplies the second chemical liquid F2 to the upper surface W1b of the first substrate W1. However, the liquid processing module 4 may also be configured to supply the second chemical liquid F2 to the outer peripheral surface W1c of the first substrate W1. Figure 10 As shown, the nozzle moving mechanism 8 is positioned outside the peripheral edge W1a of the first substrate W1, with the second nozzle 7 positioned so as to face the peripheral surface W1c from obliquely above. Consequently, the second chemical liquid F2 released from the second nozzle 7 is supplied obliquely above to the peripheral surface W1c. The second chemical liquid F2 supplied to the peripheral surface W1c moves into the gap G. By supplying the second chemical liquid F2 from obliquely above, it is possible to prevent the second chemical liquid F2 from bouncing back (splashing) toward the second nozzle 7, which serves as the supply source.

[0077] The liquid processing module 4 can also be configured to be capable of performing a hydrophilic treatment on the peripheral portion W3a of the layered substrate W3 before the first liquid F1 is supplied. For example, as shown in Figure 11 The liquid processing module 4 can also have a hydrophilic treatment portion 94. The hydrophilic treatment portion 94 can also perform a hydrophilic treatment by irradiating the peripheral portion W3a with an energy ray El. The hydrophilic treatment portion 94 can also be a UV irradiation device that performs a hydrophilic treatment by irradiating the peripheral portion W3a with ultraviolet rays. The hydrophilic treatment portion 94 can also be a plasma irradiation device that performs a hydrophilic treatment by irradiating the peripheral portion W3a with plasma rays. The control device 100 performs the hydrophilic treatment before the first liquid F1 is supplied to the gap G. By increasing the hydrophilicity of the peripheral portion W3a of the layered substrate W3, the first liquid F1 and the second liquid F2 can be more easily filled in the gap G.

[0078] Sometimes a portion of the second liquid F2 supplied to the peripheral portion Wla of the first substrate Wl does not move to the gap G and remains on the peripheral portion Wla. The liquid processing module 4 can also be configured to be capable of supplying a cleaning liquid for cleaning the second liquid F2 that remains on the peripheral portion Wla of the first substrate Wl like this. For example, as shown in Figure 12 The liquid processing module 4 can also have a cleaning liquid supply portion 95. The cleaning liquid supply portion 95 includes, for example, a cleaning liquid nozzle 951 that releases a cleaning liquid around the layered substrate and a cleaning liquid supply source 952 that supplies the cleaning liquid to the cleaning liquid nozzle 951. The control device 100 adjusts, for example, the angle of the cleaning liquid nozzle 951 so that the cleaning liquid nozzle 951 supplies the cleaning liquid from the obliquely upper surface Wlb in a direction away from the rotation center RC of the layered substrate W3. The control device 100 controls the cleaning liquid supply portion 95 to start supplying the cleaning liquid at least after the second liquid F2 is supplied to the gap G. The control device 100 can also start supplying the cleaning liquid in the middle of supplying the second liquid F2 to the gap G or after the second liquid F2 is supplied to the gap G. The cleaning liquid can also be the same liquid as the first liquid F1. That is, the cleaning liquid can contain at least either of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether. By the cleaning treatment, the remaining of the second liquid F2 on the peripheral portion Wla of the first substrate Wl does not need to be considered, and thus the second liquid F2 can be sufficiently supplied to be easily filled in the gap G.

[0079] When the cleaning liquid is supplied, the control device 100 holds the stacked substrate W3 horizontally with the first substrate Wl on top of the second substrate W2 by the rotation holding section 5 and rotates the stacked substrate W3. The control device 100 can also make the rotation speed of the stacked substrate W3 when the cleaning liquid is supplied to the peripheral portion Wla of the first substrate Wl higher than the rotation speed of the stacked substrate W3 when the second liquid F2 is supplied to the peripheral portion Wla and moved to the gap G. The rotation holding section 5 can also rotate the stacked substrate W3 at a rotation speed of 60 rpm or higher. The rotation holding section 5 can also rotate the stacked substrate W3 at a rotation speed of 500 rpm to 2000 rpm, for example. In this case, the cleaning liquid can be inhibited from entering the gap G, and the peripheral portion Wla of the first substrate Wl can be cleaned.

[0080] Sometimes a part of the second liquid F2 supplied to the peripheral portion Wla of the first substrate Wl moves to the peripheral portion W2a of the second substrate W2 through the gap G. The liquid processing module 4 can also be configured to be able to supply a cleaning liquid that cleans the second liquid F2 remaining on the peripheral portion W2a of the second substrate W2. The control device 100 can adjust the angle of the cleaning liquid nozzle 951, for example, to supply the cleaning liquid from the obliquely downward direction to the upper surface of the second substrate W2 in a direction away from the rotation center RC of the stacked substrate W3. The control device 100 can start supplying the cleaning liquid after the second liquid F2 is supplied to the gap G, for example. In this case, the remaining of the second liquid F2 on the peripheral portion W2a of the second substrate W2 does not need to be considered, and the second liquid F2 can be sufficiently supplied to easily fill the gap G.

[0081] As described above, the control device 100 can easily fill the second liquid F2 to the gap G with the first liquid F1 in the gap G as a guide by supplying the first liquid Fl to the gap G in advance before the second liquid F2 to be cured is supplied by controlling the liquid processing module 4. This effect is not necessarily limited to the case where the second liquid F2 is supplied to the gap G by moving the second liquid F2 from the peripheral portion Wla of the first substrate Wl to the gap G between the first substrate Wl and the second substrate W2. The liquid processing module 4 can also be configured to be able to directly supply the second liquid F2 to the gap G. For example, the liquid processing module can supply the second liquid F2 from a nozzle in a manner that the second liquid F2 discharged from the nozzle (e.g., a nozzle of a spray dispenser described later) directly reaches the gap G. In this case, the second liquid F2 can be more reliably filled in the gap G. In the following description, the liquid processing module that directly supplies the second liquid F2 to the gap G is described. The description is given with the supply of the second liquid F2 as an example, but can also be applied to the supply of the first liquid Fl.

[0082] For example, Figure 13The liquid processing module 4A shown includes a jet dispenser 96 in place of the second nozzle 7. The jet dispenser 96 has a cylinder 961, a nozzle 962, a liquid reservoir 963, a plunger 964, and a plunger drive section 965. The cylinder 961 extends along a line leading to the gap G around the stacked substrate W3. The cylinder 961 is, for example, a cylindrical container that houses the second chemical liquid F2. The nozzle 962 is provided at an end of the cylinder 961 that faces the stacked substrate W3. The nozzle 962 releases the second chemical liquid F2 toward the gap G. The liquid reservoir 963 houses the second chemical liquid F2 and supplies it to the cylinder 961. The liquid reservoir 963 supplies the second chemical liquid F2 from a liquid supply port provided in the cylinder 961, for example, via a tube for liquid supply. The plunger 964 reciprocates within the cylinder 961. By moving the plunger 964 in a direction away from the nozzle 962, the pressure within the cylinder 961 decreases, and the chemical liquid is supplied from the liquid reservoir 963 into the cylinder 961. By moving the plunger 964 toward the nozzle 962, the pressure within the cylinder 961 increases, and the second chemical liquid F2 is released from the nozzle 962.

[0083] The control device 100 can also repeatedly perform the process of supplying the second chemical liquid F2 to the gap G and the process of replenishing the second chemical liquid F2 from the liquid reservoir 963 by reciprocating the plunger 964 using the plunger drive section 965. In this case, the supply of the second chemical liquid F2 is interrupted, and on the other hand, the second chemical liquid F2 is sent at high speed, whereby the second chemical liquid F2 can be more reliably filled in the gap G. For example, the control device 100 can output a drive signal of a prescribed frequency to the plunger drive section 965, and the plunger drive section 965 reciprocates the plunger 964 in accordance with the drive signal.

[0084] Figure 14 is a side view of another example of a liquid processing module that is a modification. In Figure 14 In the example of FIG. 10, the rotary holding section 5 rotates the stacked substrate W3 held by the holding section 51 vertically, and rotates the stacked substrate W3 around a horizontal axis of rotation. In correspondence with this, the jet dispenser 96 is disposed vertically above the stacked substrate W3, and releases the second chemical liquid F2 toward the gap G vertically below.

[0085] As Figure 15As shown, the liquid processing module 4A can also be configured to be able to supply the second reagent solution F2 to the gap G by immersing a portion of the laminated substrate W3 in a storage solution. For example, the liquid processing module 4A can also include a storage section 63 that constitutes a storage solution instead of the second nozzle 7. The storage section 63 is open upward and stores the second reagent solution F2 supplied from a second reagent solution supply section 92. The laminated substrate W3 is disposed so that the lower side of the peripheral portion W3a is immersed in the stored second reagent solution F2 in the storage section 63, and the laminated substrate W3 is rotated about a horizontal rotation axis. Thereby, the peripheral portion W3a is immersed in the storage solution all around. The second reagent solution F2 as the storage solution is permeated into the gap G by capillary phenomenon. During the period of being immersed in the storage solution, more second reagent solution F2 is supplied to the peripheral portion W3a, and thus the second reagent solution F2 can be more sufficiently filled in the gap G.

[0086] The liquid processing module 4A can also be configured to be able to perform: a first group of supply to supply the second reagent solution F2 all around at a prescribed period; and a second group of supply to supply the second reagent solution F2 all around at the prescribed period different in phase from the first group of supply. The different in phase means that the position at which the second reagent solution F2 is supplied to the peripheral portion W3a in the first group of supply and the position at which the second reagent solution F2 is supplied to the peripheral portion W3a in the second group of supply are different from each other in the circumferential direction. The liquid processing module 4A can also be configured to be able to perform the first group of supply and the second group of supply at two positions arranged in the circumferential direction, respectively. For example, as shown in (a) of FIG. 17, the liquid processing module 4A can include two jet distributors 96A, 96B arranged in the circumferential direction. The jet distributors 96A, 96B are configured similarly to the above-described jet distributor 96. By causing the period during which the first group of supply is performed and the period during which the second group of supply is performed to at least partially overlap, the supply period of the second reagent solution F2 to the gap G can be shortened. Figure 16

[0086] The liquid processing module 4A can also be configured to be able to perform: a first group of supply to supply the second reagent solution F2 all around at a prescribed period; and a second group of supply to supply the second reagent solution F2 all around at the prescribed period different in phase from the first group of supply. The different in phase means that the position at which the second reagent solution F2 is supplied to the peripheral portion W3a in the first group of supply and the position at which the second reagent solution F2 is supplied to the peripheral portion W3a in the second group of supply are different from each other in the circumferential direction. The liquid processing module 4A can also be configured to be able to perform the first group of supply and the second group of supply at two positions arranged in the circumferential direction, respectively. For example, as shown in (a) of FIG. 17, the liquid processing module 4A can include two jet distributors 96A, 96B arranged in the circumferential direction. The jet distributors 96A, 96B are configured similarly to the above-described jet distributor 96. By causing the period during which the first group of supply is performed and the period during which the second group of supply is performed to at least partially overlap, the supply period of the second reagent solution F2 to the gap G can be shortened.

[0087] The liquid processing module 4A can also be configured to be able to supply the second reagent solution F2 while covering the supply position of the second reagent solution F2 with a guide member. For example, as shown in (a) of FIG. 17, the liquid processing module 4A has a guide member 641 instead of the jet distributor 96. In (a) of FIG. 17, the guide member 641 is disposed so as to cover the supply position of the second reagent solution F2. The guide member 641 is disposed so as to cover the supply position of the second reagent solution F2 in the first group of supply and the second group of supply. Thereby, the second reagent solution F2 can be prevented from being splashed or scattered. Figure 17 Figure 17In the example of FIG. 6, the rotation holding portion 5 horizontally arranges the laminated substrate W3. The guide member 641 is configured to cover the outer peripheral faces W1c, W2c, the upper face W1b of the first substrate W1, and the upper face W2b of the second substrate W2 at a portion of the peripheral edge portion W3a of the laminated substrate W3. For example, the guide member 641 has a portion 641a that covers the outer peripheral faces W1c, W2c, a portion 641b that covers the upper face W1b of the first substrate W1, and a portion 641c that covers the upper face W2b of the second substrate W2. The second chemical liquid supply portion 92 supplies the second chemical liquid F2 into the guide member 641. For example, the guide member 641 has a chemical liquid supply port 641d at the portion 641a in the circumferential direction of the laminated substrate W3. The second chemical liquid supply portion 92 supplies the second chemical liquid F2 into the guide member 641 from the supply port 641d. The second chemical liquid F2 supplied into the guide member 641 is held between the portions 641a, 641b, 641c by, for example, surface tension, and the peripheral edge portion W3a is in contact with the held second chemical liquid F2. Thus, the second chemical liquid F2 is supplied to the gap G.

[0088] The liquid processing module 4A can also have a guide member 642 and a suction machine 643. The guide member 642 is arranged at a position opposite the guide member 641 in the circumferential direction of the laminated substrate W3. The guide member 642, like the guide member 641, covers the outer peripheral faces W1c, W2c, the upper face W1b of the first substrate W1, and the upper face W2b of the second substrate W2 at a portion of the peripheral edge portion W3a. For example, the guide member 642 has a portion 642a that covers the outer peripheral faces W1c, W2c, a portion 642b that covers the upper face W1b of the first substrate W1, and a portion 642c that covers the upper face W2b of the second substrate W2, and has a suction port 642d at the portion 642a. As Figure 17 As shown in (b) of FIG. 6, for example, the suction port 642d is arranged at the center of the portion 642a in the circumferential direction of the laminated substrate W3. The suction machine 643 sucks gas in the guide member 642 from the suction port 642d. With the guide member 641, the guide member 642, and the suction machine 643, a gas flow is generated in the peripheral edge portion W3a in the circumferential direction from the supply port 641d to the suction port 642d. With this gas flow, as Figure 17 As shown in (c) of FIG. 6, the second chemical liquid F2 supplied to the supply port 641d spreads in the circumferential direction and is supplied to the gap G in a larger area.

[0089] The liquid processing module 4A can also be configured to supply the second chemical liquid F2 with a supply member for directly applying the second chemical liquid F2 to the gap G. As Figure 18 As shown in (a) of FIG. 7, the liquid processing module 4A can also have a supply member 651. In Figure 18In example (a), supply member 651 is a brush. Supply member 651 is positioned near gap G, with the second chemical liquid F2 attached to its bristles. In this state, control device 100 controls rotation and holding unit 5 to rotate laminated substrate W3 while holding it horizontally. This allows second chemical liquid F2, attached to the bristles of supply member 651, to be supplied to gap G.

[0090] like Figure 18 As shown in (b), the supply member 652 can also be a linear member. The supply member 652 is positioned near the gap G, with the second chemical liquid F2 adhering to its surface. In this state, the control device 100 controls the rotation holding unit 5 to rotate the stacked substrate W3 while holding it horizontally. This allows the second chemical liquid F2 adhering to the surface of the supply member 652 to be supplied to the gap G.

[0091] The liquid processing module 4A may also be configured to be able to perform (processing) in a state where the horizontally arranged stacked substrate W3 is bent so that the periphery of the stacked substrate W3 becomes higher than the center of the stacked substrate W3. Figure 19 As shown, the liquid processing module 4, 4A may also have a rotating holding portion 5A instead of the rotating holding portion 5. The rotating holding portion 5A has a support plate 510 and a suction port 520. The support plate 510 extends horizontally around the entire circumference of the rotation center and supports the stacked substrate W3 from below. The support plate 510 has a support wall 511. The support wall 511 is formed around the entire circumference of the periphery of the upper surface 51a of the support plate 510 and bulges upward from the upper surface 51a. The stacked substrate W3 is supported by the support wall 511. The stacked substrate W3 is supported by the support wall 511, and a space SP is formed between the upper surface 51a and the stacked substrate W3. The suction port 520 opens at the center of the upper surface 51a. When the stacked substrate W3 is adsorbed on the upper surface 51a, the gas in the space SP is sucked out from the suction port 520. As a result, the portion of the laminated substrate W3 located inward of the support wall 511 is attracted by the upper surface 51a, causing the laminated substrate W3 to bend so that the periphery of the laminated substrate W3 is higher than the center of the laminated substrate W3. While the laminated substrate W3 is bent in this manner, the rotating holding unit 5 rotates the laminated substrate W3, and the jet distributor 96 supplies the second chemical liquid F2 into the gap G. The jet distributor 96 may also be tilted obliquely downward in accordance with the bending of the laminated substrate W3.

[0092] The control device 100 can also control the liquid treatment module 4, 4A to supply the second chemical liquid F2 to the gap G in multiple repetitions of the process, and then control the solidification treatment module 31 to solidify the second chemical liquid F2. For example, the control device 100 can also control the liquid treatment module 4, 4A to supply the second chemical liquid F2 to the peripheral portion Wla of the first substrate Wl in multiple repetitions of the process and move the second chemical liquid F2 from the peripheral portion Wla to the gap G. Thereafter, the control device 100 can control the solidification treatment module 31 to solidify the second chemical liquid F2. In the case where the process of supplying the second chemical liquid F2 to the gap G is set as one cycle, a portion where the second chemical liquid F2 is not filled in one cycle can also be filled with the second chemical liquid F2 by repeating the same cycle. Thus, the second chemical liquid F2 can be more sufficiently filled.

[0093] Figure 20 is a plan view showing the state of the gap G. As shown in (a) of Figure 20 is filled in the gap G formed in the peripheral portion W3a of the laminated substrate W3. In the above one cycle, a non-filled portion BR is sometimes left in a state where it is enclosed inside the gap G in a bubble shape. In this case, by temporarily increasing the rotation speed of the laminated substrate W3, the second chemical liquid F2 is filled in the non-filled portion BR as shown in (b) of Figure 20 Figure 20

[0094] The control device 100 can also control the liquid treatment module 4, 4A to perform the process of supplying the first chemical liquid Fl to the gap G and the process of supplying the second chemical liquid F2 to the gap G in multiple repetitions, and then control the solidification treatment module 31 to solidify the second chemical liquid F2. By repeating the process of supplying the first chemical liquid Fl to the gap G together, the second chemical liquid F2 can be more sufficiently filled.

[0095] The control device 100 can also control the liquid treatment module 4, 4A to temporarily increase the rotation speed of the laminated substrate W3 at the time of supplying the second chemical liquid F2 after the process of supplying the second chemical liquid F2 is performed and before the process is performed next time. For example, the control device 100 can also control the rotation holding portion 5 to rotate the laminated substrate W3 at a second rotation speed higher than the rotation speed of the laminated substrate W3 at the time of supplying the second chemical liquid F2.

[0096] Figure 21 is a plan view showing the state of the gap G. As shown in (a) of Figure 21 is filled in the gap G formed in the peripheral portion W3a of the laminated substrate W3. In the above one cycle, a non-filled portion BR is sometimes left in a state where it is enclosed inside the gap G in a bubble shape. In this case, by temporarily increasing the rotation speed of the laminated substrate W3, the second chemical liquid F2 is filled in the non-filled portion BR as shown in (b) of Figure 20 Figure 21 ​​​As shown in (c) of FIG. 9, the unfilled site BR extends to the outside (further outside than the peripheral portion W3a of the laminated substrate W3) due to the centrifugal force of rotation and opens to the outside. Therefore, in the next cycle, as shown in (d) of FIG. 9, the second liquid F2 can be easily filled in the unfilled site BR. Figure 21

[0097] In a case where the liquid processing module 4, 4A repeatedly performs the process of supplying the first liquid F1 and the process of supplying the second liquid F2, the control device 100 can also control the liquid processing module 4, 4A to temporarily increase the rotational speed at the time of supplying the second liquid F2 after the process of supplying the second liquid F2 is performed and before the process of supplying the first liquid F1 is performed.

[0098] The control device 100 can also perform the process of controlling the solidification processing module 31 to solidify the second liquid F2 after the liquid processing module 4, 4A is controlled to repeatedly perform the process of supplying the second liquid F2 to the gap G and the process of temporarily increasing the rotational speed of the laminated substrate W3 a plurality of times. For example, the control device 100 can also perform the process of controlling the solidification processing module 31 to solidify the second liquid F2 after the liquid processing module 4, 4A is controlled to repeatedly perform the process of supplying the first liquid F1 to the gap G, the process of supplying the second liquid F2 to the gap G, and the process of rotating the laminated substrate W3 at the second rotational speed a plurality of times. By repeatedly performing the process of temporarily increasing the rotational speed of the laminated substrate W3 a plurality of times, it is possible to more reliably fill the unfilled site BR with the second liquid F2.

[0099] The control device 100 can also be configured to be able to control the liquid processing module 4, 4A based on the state of the second liquid F2 in the gap G. For example, the liquid processing module 4, 4A can also include a detection portion 98 that detects the shape and size of the peripheral portion W3a of the laminated substrate W3. Figure 22 is a diagram showing an example of measurement of the peripheral portion by the detection portion. The detection portion 98 can also be, for example, a projection image measuring device. As shown in (a) of FIG. 10, the detection portion 98 can detect the shape and size of the peripheral portion W3a of the laminated substrate W3. As shown in (b) of FIG. 10, the detection portion 98 can detect the shape and size of the unfilled site BR. Figure 22 ​As illustrated in (a), the detection section 98 can also include a light projecting section 981 and a light receiving section 982. The light projecting section 981 and the light receiving section 982 are arranged so as to sandwich a portion of the peripheral edge section W3a in the direction along the layered substrate W3 (tangential direction). Light emitted from the light projecting section 981 is incident on the light receiving section 982 through the peripheral edge section W3a. The light receiving section 982 includes, for example, a screen. A shadow of the peripheral edge section W3a is projected on the screen of the light receiving section 982. The light receiving section 982 generates data of the projected image. The control device 100 can also detect the state (height, shape, and size, etc.) of the peripheral edge section W3a based on the data generated by the light receiving section 982. As examples of the state of the peripheral edge section W3a, the height of the peripheral edge section W3a of the layered substrate W3, the shape of the peripheral edge section W3a, the thickness of the peripheral edge section W1a of the first substrate W1, the thickness of the peripheral edge section W2a of the second substrate W2, the thickness of the gap G, the inclination angle of the peripheral edge section W1a, and the inclination angle of the peripheral edge section W2a, etc. can be given.

[0100] Figure 22 (b) is a diagram illustrating an example of the projected image. The control device 100 can also detect the position (e.g., height) of the gap G in the vertical direction, for example, from the projected image. The control device 100 can also control the position of the supply of the second chemical liquid F2, i.e., the position of the supply of the second chemical liquid F2 from the nozzle 962 to the gap G, based on the detection result of the position of the gap G. For example, the control device 100 can also control the nozzle moving mechanism 8 so that the position of the nozzle 962 coincides with the position of the gap G. In this case, by dynamically adapting the position of the supply of the second chemical liquid F2 to the detection result of the position of the gap G, the second chemical liquid F2 can be more reliably supplied to the gap.

[0101] The control device 100 can also adjust the supply parameter of the second chemical liquid F2 based on the detection result of the state of the second chemical liquid F2. The supply parameter can be the number of repetitions of the above-described cycle, can be the time of the supply of the first chemical liquid F1 or the second chemical liquid F2, or can be the supply amount of the second chemical liquid F2 (e.g., the supply amount per unit time or the length of the supply time). By dynamically adapting the supply parameter of the second chemical liquid F2 to the detection result of the state of the second chemical liquid F2, the second chemical liquid F2 can be more reliably supplied to the gap G.

[0102] For example, the control device 100 can also detect the degree of filling of the second chemical liquid F2 into the gap G based on the state of the second chemical liquid F2, and adjust the supply amount of F2 based on the degree of filling. For example, the control device 100 can also calculate the proportion of the area of the second chemical liquid F2 to the area of the gap G on the image as the degree of filling.

[0103] In the program storage section of the control device 100, a program for controlling the treatment of the stacked substrates W3 in the liquid treatment module 4, 4A and the heat treatment device can also be stored. The control device 100 described above is constituted by one or more control computers. Figure 23 is a diagram showing an example of the hardware structure of the control device. For example, the control device 100 has the circuit 150 shown in Figure 23 . The circuit 150 has one or more processors 151, a memory 152, a storage 153, and an input / output port 154. The storage 153 has, for example, a hard disk or the like, a storage medium that can be read by a computer. The storage medium stores a program for causing the control device 100 to execute a substrate treatment method using the liquid treatment module 4, 4A and the heat treatment device. The storage medium can also be a nonvolatile semiconductor memory, a removable medium such as a magnetic disk and an optical disk, or the like. The storage medium can be a storage medium that can be read by a computer.

[0104] The memory 152 temporarily stores the program loaded from the storage medium of the storage 153 and the operation result of the processor 151. The processor 151 executes the program described above by cooperating with the memory 152, thereby constituting each functional module described above. The input / output port 154 performs input / output of electrical signals between each section of the processing station 3 according to the instruction from the processor 151. The control device 100 can also be constituted by a plurality of control computers. The hardware structure of the control device 100 is not necessarily limited to constituting each functional module by a program. For example, each functional module of the control device 100 can also be constituted by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) in which the dedicated logic circuit is integrated.

[0105] [Substrate Treatment Flow]

[0106] As an example of the substrate treatment method, a substrate treatment flow executed by the control device 100 is exemplified. Figure 24 is a flowchart showing an example of the substrate treatment flow executed by the control device. Figure 24 The flowchart shown in Figure 24As shown, the control device 100 sequentially executes the steps ST1 to ST13. In the step ST1, before the first liquid F1 is supplied, the hydrophilic treatment section 94 performs the hydrophilic treatment on the peripheral portion W3a of the layered substrate W3. In the step ST2, the control device 100 detects the shape of the peripheral portion W3a of the layered substrate W3 based on the image input from the detection section 98. In the step ST3, the control device 100 determines whether adjustment of the supply parameter of at least one of the first liquid F1 and the second liquid F2 is required based on the detection result of the shape of the peripheral portion W3a. In the case where adjustment of the supply parameter is required (step ST3: Yes), in the step ST4, the control device 100 adjusts the supply parameter. For example, in the case where the thickness of the gap G is thicker than the reference value, the control device 100 sets the supply amount of the first liquid F1 and the second liquid F2 to be larger.

[0107] Next, the control device 100 executes the step ST5. In the case where adjustment of the supply parameter is not required (step ST3: No), the control device 100 executes the step ST5 without executing the step ST4. In the step ST5, the control device 100 controls the liquid processing module 4 to supply the first liquid F1 to the first substrate W1 and move the first liquid F1 to the gap G. Next, in the step ST6, the control device 100 controls the liquid processing module 4 to supply the second liquid F2 to the first substrate W1 and move the second liquid F2 to the gap G, replacing the first liquid F1 in the gap G with the second liquid F2. Next, in the step ST7, the control device 100 temporarily increases the rotation speed of the layered substrate W3. For example, the control device 100 increases the rotation speed of the layered substrate W3 to the above-mentioned second rotation speed and then returns to the rotation speed before the increase. Next, in the step ST8, the control device 100 detects the state of the second liquid F2 supplied to the gap G based on the image input from the detection section 98. In the step ST9, the control device 100 determines whether adjustment of the supply amount of at least one of the first liquid F1 and the second liquid F2 is required based on the detection result of the state of the second liquid F2. In the case where adjustment of the supply amount is required (step ST9: Yes), in the step ST10, the control device 100 adjusts the supply amount. Next, the control device 100 executes the step ST11. In the step ST9, in the case where it is determined that adjustment of the supply amount is not required, the control device 100 executes the step ST11 without executing the step ST10. In the step ST11, it is confirmed whether the filling of the second liquid F2 to the gap G reaches the target degree based on the detection result of the state of the second liquid F2. In the case where it is determined that the filling of the second liquid F2 to the gap G is insufficient (step ST11: No), the control device 100 returns the process to the step ST5. Thus, the steps ST5 to ST9 are repeated.

[0108] In a case where it is determined that the filling of the second chemical liquid F2 into the gap G reaches the target degree (step ST11: YES), in step ST12, the control device 100 controls the liquid processing module 4 to supply the cleaning liquid from the cleaning liquid supply part 95 to the peripheral portion W3a of the stacked substrate W3. Next, in step ST13, the control device 100 controls the solidification processing module 31 to solidify the second chemical liquid F2. The above is the end of the substrate processing flow.

[0109] Figure 25 is a flowchart of another example of a substrate processing step performed by the control device. Figure 25 The flowchart illustrated is an example of a case where the control device 100 controls the liquid processing module 4A to directly supply the second chemical liquid F2 to the gap G. First, the control device 100 performs step ST21. In step ST21, the control device 100 detects the position of the gap G from the image input from the detection part 98. The control device 100 can also generate a profile indicating the relationship between the rotation angle of the stacked substrate W3 and the position of the gap G by sequentially detecting the position of the gap G while rotating the stacked substrate W3 with the rotation holding part 5.

[0110] After that, the control device 100 performs ST22 to ST34 similarly to ST1 to ST13. In ST27 corresponding to ST6, the liquid processing module 4A supplies the second chemical liquid F2 to the gap G. During this period, the control device 100 can also control the nozzle moving mechanism 8 based on the above profile to adjust the position of the spray distributor 96 according to the rotation angle of the stacked substrate W3.

[0111] The above describes the embodiments and modified examples of the present application, but the present application is not necessarily limited to the above-described embodiments and modified examples, and various modifications can be made within the scope of the gist thereof.

[0112] The above-described embodiments and modified examples can also be appropriately combined. For example, the guide members 72, 74 described in Figure 6 and Figure 7 may also be provided in the spray distributor 96 in the liquid processing module 4A. For example, the rotation holding part 5A described in Figure 19 may also be applied to the liquid processing module 4. In the substrate processing flow performed on the liquid processing module 4 described in Figure 24 , steps ST1 to ST4, step ST9, and step ST10 can also not be performed. In the substrate processing flow performed on the liquid processing module 4A described in Figure 25 , steps ST21 to ST25, step ST30, and step ST31 can also not be performed.

[0113] The above-described embodiments and modified examples include the following configurations.

[0114] [1] A substrate processing method comprising:

[0115] a step of supplying a first chemical liquid to a gap between a first substrate and a second substrate at a peripheral portion of a laminated substrate formed by joining the first substrate and the second substrate;

[0116] a step of supplying a second chemical liquid different from the first chemical liquid to the gap at the peripheral portion to replace the first chemical liquid in the gap with the second chemical liquid; and

[0117] a step of solidifying the second chemical liquid in the gap.

[0118] [2] The substrate processing method according to [1], wherein

[0119] in the step of supplying the first chemical liquid to the gap, the first chemical liquid is supplied to the gap while rotating the laminated substrate, in a region through which the peripheral portion of the laminated substrate passes due to the rotation of the laminated substrate,

[0120] in the step of supplying the second chemical liquid to the gap, the second chemical liquid is supplied to the gap while rotating the laminated substrate, in a region through which the peripheral portion of the laminated substrate passes due to the rotation of the laminated substrate.

[0121] [3] The substrate processing method according to [2], wherein

[0122] the second chemical liquid is solidified after the step of supplying the first chemical liquid to the gap and the step of supplying the second chemical liquid to the gap are repeated a plurality of times.

[0123] [4] The substrate processing method according to [2] or [3], wherein

[0124] the laminated substrate is further rotated at a second rotational speed higher than the rotational speed of the laminated substrate when the second chemical liquid is supplied, after the second chemical liquid is supplied and before the first chemical liquid is supplied.

[0125] [5] The substrate processing method according to [4], wherein

[0126] the second chemical liquid is solidified after the step of supplying the first chemical liquid to the gap, the step of supplying the second chemical liquid to the gap, and the step of rotating the laminated substrate at the second rotational speed are repeated a plurality of times.

[0127] [6] The substrate processing method according to any one of [1] to [5], wherein

[0128] In the step of solidifying the second chemical liquid, the second chemical liquid is solidified by heat treatment.

[0129] [7] The substrate processing method according to any one of [1] to [6], wherein

[0130] The surface tension of the first chemical liquid is lower than or equal to the surface tension of the second chemical liquid.

[0131] [8] The substrate processing method according to [7], wherein

[0132] The surface tension of the first chemical liquid is lower than or equal to 30 mN / m.

[0133] [9] The substrate processing method according to any one of [1] to [8], wherein

[0134] The first chemical liquid contains at least either one of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether.

[0135]

[10] The substrate processing method according to any one of [1] to [9], wherein

[0136] The viscosity of the second chemical liquid is higher than the viscosity of the first chemical liquid.

[0137]

[11] The substrate processing method according to any one of [1] to

[10] , wherein

[0138] The step of supplying the second chemical liquid to the gap includes a step of supplying the second chemical liquid to the peripheral portion of the first substrate while rotating the stacked substrates while maintaining the stacked substrates in a horizontal state with the first substrate positioned above the second substrate, and moving the second chemical liquid from the peripheral portion of the first substrate to the gap.

[0139]

[12] The substrate processing method according to any one of [1] to

[11] , wherein

[0140] The step of supplying the first chemical liquid to the gap includes a step of supplying the first chemical liquid to the peripheral portion of the first substrate while rotating the stacked substrates while maintaining the stacked substrates in a horizontal state with the first substrate positioned above the second substrate, and moving the first chemical liquid from the peripheral portion of the first substrate to the gap.

[0141]

[13] The substrate processing method according to any one of [1] to

[10] , wherein

[0142] In the step of supplying the second chemical liquid to the gap, the second chemical liquid is supplied from a nozzle in such a manner that the second chemical liquid discharged from the nozzle directly reaches the gap.

[0143]

[14] The substrate processing method according to

[13] , wherein

[0144] The step of supplying the second chemical solution to the gap includes a step of periodically supplying the second chemical solution by reciprocating movement of a plunger.

[0145]

[15] The substrate processing method according to

[14] , wherein

[0146] The step of supplying the second chemical solution to the gap includes a first group of supply that supplies the second chemical solution in a whole cycle with a prescribed period, and a second group of supply that supplies the second chemical solution in a whole cycle with the prescribed period at a different phase from the first group of supply.

[0147]

[16] The substrate processing method according to any one of [1] to

[15] , wherein

[0148] The step of supplying the second chemical solution to the gap is performed in a state where the laminated substrate horizontally arranged is bent so that the periphery of the laminated substrate is higher than the center of the laminated substrate.

[0149]

[17] The substrate processing method according to any one of [1] to

[16] , wherein

[0150] In the step of supplying the second chemical solution to the gap, the periphery of the laminated substrate is immersed in the stored second chemical solution while the laminated substrate is rotated.

[0151]

[18] The substrate processing method according to any one of [1] to

[17] , further comprising:

[0152] a step of detecting a position of the gap in a direction perpendicular to the laminated substrate; and

[0153] a step of controlling a supply position of the second chemical solution based on a result of the detection of the position of the gap.

[0154]

[19] A substrate processing apparatus comprising:

[0155] a first chemical solution supply portion that supplies a first chemical solution to a gap between a first substrate and a second substrate at a periphery of a laminated substrate in which the first substrate and the second substrate are bonded;

[0156] a second chemical solution supply portion that supplies a second chemical solution different from the first chemical solution to the gap at the periphery to replace the first chemical solution in the gap with the second chemical solution; and

[0157] a solidification portion that solidifies the second chemical solution in the gap.

[0158]

[20] A computer program product including a substrate processing program which, when executed by a processor, implements the substrate processing method described in any one of [1] to

[18] .

Claims

1. A method of processing a substrate, characterized by, Comprising: a step of supplying a first chemical solution to a gap between the first substrate and the second substrate from a peripheral portion of a laminated substrate formed by joining the first substrate and the second substrate; a step of supplying a second chemical solution different from the first chemical solution to the gap from the peripheral portion of the laminated substrate to replace the first chemical solution in the gap with the second chemical solution; and a step of solidifying the second chemical solution in the gap.

2. The substrate processing method according to claim 1, wherein: in the step of supplying the first chemical solution to the gap, the first chemical solution is supplied to the gap while rotating the laminated substrate, in a region through which the peripheral portion of the laminated substrate passes due to the rotation of the laminated substrate, in the step of supplying the second chemical solution to the gap, the second chemical solution is supplied to the gap while rotating the laminated substrate, in a region through which the peripheral portion of the laminated substrate passes due to the rotation of the laminated substrate.

3. The substrate processing method according to claim 2, wherein: after repeating the step of supplying the first chemical solution to the gap and the step of supplying the second chemical solution to the gap a plurality of times, the second chemical solution is solidified.

4. The substrate processing method according to claim 2 or 3, further comprising a step of rotating the laminated substrate at a second rotational speed higher than the rotational speed of the laminated substrate at the time of supplying the second chemical solution, after the supply of the second chemical solution and before the supply of the first chemical solution.

5. The substrate processing method according to claim 4, wherein: after repeating the step of supplying the first chemical solution to the gap, the step of supplying the second chemical solution to the gap, and the step of rotating the laminated substrate at the second rotational speed a plurality of times, the second chemical solution is solidified.

6. The substrate processing method according to any one of claims 1 to 3, wherein: in the step of solidifying the second chemical solution, the second chemical solution is solidified by heat treatment.

7. The substrate processing method according to any one of claims 1 to 3, wherein: the first chemical solution has a surface tension lower than that of the second chemical solution.

8. The substrate processing method according to claim 7, wherein: the first chemical solution has a surface tension of 30 mN / m or lower.

9. The substrate processing method according to any one of claims 1 to 3, wherein: the first chemical solution contains at least either of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether.

10. The substrate processing method according to any one of claims 1 to 3, wherein: the second chemical solution has a viscosity higher than that of the first chemical solution.

11. The substrate processing method according to any one of claims 1 to 3, wherein: the step of supplying the second chemical solution to the gap includes a step of supplying the second chemical solution to a peripheral portion of the first substrate while rotating the laminated substrate horizontally with the first substrate positioned above the second substrate, to move the second chemical solution from the peripheral portion of the first substrate to the gap. ​ ​ 12. The substrate processing method according to any one of claims 1 to 3, wherein: the step of supplying the first chemical solution to the gap includes a step of supplying the first chemical solution to a peripheral portion of the first substrate while rotating the stacked substrate while maintaining the stacked substrate in a horizontal state with the first substrate positioned above the second substrate, and moving the first chemical solution from the peripheral portion of the first substrate to the gap.

13. The substrate processing method according to any one of claims 1 to 3, wherein: in the step of supplying the second chemical solution to the gap, the second chemical solution is supplied from a nozzle in a manner such that the second chemical solution discharged from the nozzle reaches the gap directly.

14. The substrate processing method according to claim 13, wherein: the step of supplying the second chemical solution to the gap includes a step of periodically supplying the second chemical solution using reciprocating motion of a plunger.

15. The substrate processing method according to claim 14, wherein: the step of supplying the second chemical solution to the gap includes: a first group of supplies that supplies the second chemical solution in a prescribed period at a whole circumference; and a second group of supplies that supplies the second chemical solution in the prescribed period at a whole circumference at a different phase from the first group of supplies.

16. The substrate processing method according to any one of claims 1 to 3, wherein: the step of supplying the second chemical solution to the gap is performed in a state in which a horizontally disposed stacked substrate is curved in a manner such that a peripheral edge of the stacked substrate is higher than a center of the stacked substrate.

17. The substrate processing method according to any one of claims 1 to 3, wherein: in the step of supplying the second chemical solution to the gap, a peripheral portion of the stacked substrate is immersed in the second chemical solution stored while rotating the stacked substrate.

18. The method according to any one of claims 1 to 3, wherein further comprising: a step of detecting a position of the gap in a direction perpendicular to the stacked substrate; and a step of controlling a supply position of the second chemical solution based on a result of the detection of the position of the gap. including:

19. A substrate processing apparatus, characterized by, a first chemical solution supply portion that supplies a first chemical solution to a gap between a first substrate and a second substrate at a peripheral portion of a stacked substrate formed by joining the first substrate and the second substrate; a second chemical solution supply portion that supplies a second chemical solution different from the first chemical solution to the gap at the peripheral portion to replace the first chemical solution in the gap with the second chemical solution; and a solidification portion that solidifies the second chemical solution in the gap.

20. A computer program product, wherein: the computer program product includes a substrate processing program that, when executed by a processor, implements the substrate processing method according to any one of claims 1 to 3. ​ ​

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