Cleaning device for integrated circuit production

The integrated circuit manufacturing cleaning equipment utilizes a transfer grinding, chip cleaning, and wire bonding fume removal device. By using photoelectric conversion and turbine rotation to form a vortex water column to clean dust from the chip surface, it solves the problem that existing cleaning equipment cannot achieve comprehensive cleaning, improves the continuity of the manufacturing process and cleaning efficiency, avoids dust damage to chips, and saves energy.

CN120834044APending Publication Date: 2025-10-24JIANGSU LINGDONG CLOUD TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510741361.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-05
Publication Date
2025-10-24

AI Technical Summary

Technical Problem

Existing integrated circuit cleaning devices cannot achieve comprehensive cleaning in different manufacturing processes, which may lead to potential damage during subsequent testing and use.

Method used

A cleaning device for integrated circuit manufacturing has been designed, including a transfer and grinding device, a chip cleaning device, and a wire bonding fume removal device. It utilizes the principle of linear propagation and specular reflection of light for braking, and forms a vortex water column through photoelectric conversion and turbine rotation for cleaning. Combined with the wire bonding fume removal device to remove soot, it improves cleaning efficiency and energy utilization.

Benefits of technology

It improves the continuity and cleaning efficiency of integrated circuit manufacturing processes, avoids the impact of dust particles on chips, ensures the cleanliness of subsequent wire bonding processes, and saves energy consumption.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of integrated circuit cleaning, and discloses a cleaning device for integrated circuit production, which comprises a transfer grinding device, one side of the transfer grinding device is fixedly connected with a chip cleaning device, and one side of the chip cleaning device is fixedly connected with a welding wire smoke removal device. The transferring and grinding device is arranged to place chips in a disc and convey the chips to all manufacturing processes through a crawler belt, the continuity of the manufacturing processes is improved, special processes are processed to improve the chip manufacturing efficiency, the transferring and grinding device is provided with the chip cleaning device, light energy is converted into electric energy according to the photoelectric conversion principle, and the chip cleaning device is arranged on the transferring and grinding device. The energy utilization rate is increased, the integrated circuit chip is cleaned, the influence of dust particles on the chip in the follow-up wire welding process is avoided, the wire welding smoke removal device is arranged on one side of the chip cleaning device, fan blades are driven to rotate through power of the transferring and grinding device, the energy utilization rate is increased, and the overall cleaning efficiency of the device is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit cleaning, more particularly to a cleaning device for integrated circuit production. BACKGROUND

[0002] Integrated circuits are microelectronic devices that integrate multiple electronic components and their connections on a single or multiple small substrates, with characteristics such as miniaturization, low power consumption, intelligence, and high reliability. With the continuous progress of science and technology, the application field of integrated circuits is becoming more and more extensive, which plays an important role in promoting the development of electronic equipment. Due to its micro-precision characteristics, the control of the clean environment for integrated circuit manufacturing has strict requirements, so the integrated circuit cleaning device plays a crucial role in the manufacturing process of semiconductor integrated circuits. The integrated circuit cleaning device is used to ensure the cleanliness of the production environment to avoid impurities affecting the quality and performance of the finished integrated circuit. Common integrated circuit cleaning devices include wet chemical cleaning systems, megasonic cleaning tanks, rotary spray cleaning machines, epitaxial wafer cleaning machines, and batch immersion cleaning machines. The wet chemical cleaning system includes a set of wet chemical cleaning tanks and corresponding water tanks, which may be equipped with a spin-drying device. The silicon wafer is placed in a special basket, soaked in the chemical tank for a specified time, then taken out and rinsed in the water tank. The megasonic cleaning tank is a cleaning device that combines megasonic energy, which can significantly reduce the solution temperature and process time, improve the cleaning effect, and reduce the consumption of chemicals and wastewater. The rotary spray cleaning machine is a variant of immersion cleaning, which cleans the silicon wafer through rotation and spraying, suitable for cleaning large-area silicon wafers, and can improve cleaning uniformity and efficiency. The epitaxial wafer cleaning machine is designed for integrated circuit, LED epitaxial and chip manufacturing fields, using wet processing technology, with system cleanliness technology, uniformity technology, and wafer N2 drying technology as proprietary technology for processing different sizes and materials. The batch immersion cleaning machine is suitable for wafer cleaning in large-scale integrated circuit manufacturing and can handle millions of devices on the wafer that cannot be identified by optical microscopes. These cleaning devices are expensive and are used to clean finished integrated circuit chips, which cannot be used for cleaning during different processes in the manufacturing process. Incomplete cleaning in a single process can cause damage to subsequent testing and use. SUMMARY

[0003] In order to overcome the above-mentioned defects of the prior art, the present application provides a cleaning device for integrated circuit production to solve the problems existing in the background art.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solution: a cleaning device for integrated circuit production, comprising a transfer grinding device, one side of the transfer grinding device is fixedly connected with a chip cleaning device, one side of the chip cleaning device is fixedly connected with a solder wire smoke removal device.

[0005] Further, the forwarding grinding device includes a track rotating device, one end of the top of the track rotating device is screw connected with a chip placing disc, the front and back of the track rotating device are both welded with a connecting inner wall, the back of the two connecting inner walls are both nut connected with a main body shell, the top of the main body shell is welded with a grinding and scratching integrated machine, one side of the grinding and scratching integrated machine is electrically connected with three data line receiving lines, one end of the three data line receiving lines is electrically connected with a chip loading machine, the front and back of the chip loading machine are both welded with two electric strips, the front and back of the top of the grinding and scratching integrated machine are both pipeline connected with two telescopic rods, the bottom of the telescopic rod is pipeline connected with a power source box, the front of the main body shell is nut connected with a protective shell.

[0006] Further, the track rotating device includes a connecting shaft, both ends of the outer side of the connecting shaft are rotatably connected with solid turntables, the outer sides of the two solid turntables are fixedly connected with flexible tracks, one end of the outer side of the connecting shaft is rotatably connected with an inter-disc gear, one side of the inter-disc gear is fixedly connected with a starting gear, the back of the starting gear is rotatably connected with an engine, one side of the starting gear is fixedly connected with a side gear, the back of the side gear is welded with a rotating lever, the outer side of the rotating lever is rotatably sleeved with a bearing fixed buckle in the middle, one end of the rotating lever is rotatably connected with a chain rotating device, the back of the flexible track is fixedly connected with a connecting inner wall.

[0007] Further, the chain rotating device includes a prime mover shaft, one end of the outer side of the prime mover shaft is rotatably connected with a starting wheel, the outer side of the starting wheel is wrapped and connected with a transmission chain, one end of the transmission chain is internally sleeved with a twin wheel, the front of the twin wheel is rotatably connected with a medium device, the front of the medium device is rotatably connected with a fitting shaft in the middle, the side of the fitting shaft is rotatably connected with a final wheel, the side of the final wheel is wrapped and connected with a fan chain, one end of the fan chain is internally sleeved with a speed-up wheel, the front of the speed-up wheel is fixedly connected with a soldering wire smoke removing device.

[0008] Further, the chip placing disc includes a magnetic attraction block, the top of the magnetic attraction block is fixedly connected with a metal disc, the top of the metal disc is provided with a setting slot, the two sides of the magnetic attraction block are both electrically connected with an electricity transmission pipe, one end of the two electricity transmission pipes is both electrically connected with a fixed strip block, the top of one fixed strip block is welded with a mirror surface partition block.

[0009] Further, the chip cleaning device comprises a cleaning shell, a positive barrel is connected to the top nut of the cleaning shell, a water outlet gate is threadedly connected to the top of the positive barrel, three shunt pipes are threadedly connected to the top of the water outlet gate, a water storage column is connected to the top pipe of the three shunt pipes, an external power cord is electrically connected to one end of the top of the water outlet gate, the cleaning shell is electrically connected to one end of the external power cord, a water receiving tank is nut-connected to one side of the cleaning shell, two guide water pipes are connected to the top pipe of the water receiving tank, a bottom sheet is welded to the inside bottom of the water receiving tank, a gravity spring is welded to the top of the bottom sheet, a displacement plug is welded to the top of the gravity spring, a non-resistance guide sheet is electrically connected to the middle of the bottom of the displacement plug, an external pin is electrically connected to one side of the cleaning shell, a purple light emitter is electrically connected to one side of the inner wall of the cleaning shell, a horizontal converter is electrically connected to the other side of the inner wall of the cleaning shell, a turbine rotating machine is connected to the middle rotating shaft of the top of the positive barrel, an impeller is welded to the bottom of the turbine rotating machine, a side valve is arranged at the bottom of one side of the positive barrel, a reset spring is welded to the front of the side valve, a water discharge shell is welded to the bottom of one side of the positive barrel, and a reflection converter is electrically connected to the top of one side of the inner wall of the cleaning shell.

[0010] Further, the solder wire smoke removing device comprises a smoke inlet shell, an inlet frame is nut-connected to the front of the smoke inlet shell, a solder wire device is nut-connected to the front of the inlet frame, wind direction leaves are welded to the lower side of the inside of the inlet frame, a driving wheel shell is threadedly connected to the back of the smoke inlet shell, a smoke storage column is welded to the bottom of the smoke inlet shell, a smoke removing driving wheel is connected to the inner wall of the back of the driving wheel shell, a smoke removing fan blade is connected to one end of the front of the smoke removing driving wheel, a lengthening rod is connected to the other end of the front of the smoke removing driving wheel, a blocking shell is nut-connected to the bottom of the front of the driving wheel shell, and a chain rotating device is fixedly connected to one end of the lengthening rod.

[0011] The technical effects and advantages of the present application are as follows: 1. The present application places the chip in the tray through the transfer grinding device, and transmits it to each manufacturing process through the track, and brakes the track by using the straight line propagation and mirror reflection principle of light, which is beneficial to improve the continuity of the manufacturing process and the chip manufacturing efficiency.

[0012] 2. The present application is provided with a chip cleaning device in the transfer grinding device, which converts light energy into electric energy by using the photoelectric conversion principle, drives the turbine to rotate to form a vortex water column by using the converted electric energy, and cleans the dust on the surface of the chip by using the centrifugal force and impact force of the vortex water column, which is beneficial to improve the utilization rate of energy, clean the integrated circuit chip, and avoid the influence of dust particles on the chip in the subsequent soldering process.

[0013] 3. The chip cleaning device is provided with a solder wire smoke removing device on one side, the fan blades are rotated by the power of the transfer grinding device, the smoke in the soldering process is sucked away to avoid secondary pollution to the chip, the utilization rate of energy is further improved, and the overall cleaning efficiency of the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present application; Figure 2 It is a schematic diagram of the structure of the transfer grinding device of the present application; Figure 3 It is a schematic diagram of the structure of the track drive device of the present application; Figure 4 It is a schematic diagram of the structure of the chain rotating device of the present application; Figure 5 It is a schematic diagram of the structure of the chip placing disc of the present application; Figure 6 It is a schematic diagram of the structure of the chip cleaning device of the present application; Figure 7 It is a schematic diagram of the cross-sectional structure of the chip cleaning device of the present application; Figure 8 It is a schematic diagram of the structure of the solder wire smoke removing device of the present application.

[0015] The figure marks are: 1, transfer grinding device; 101, track turning device; 1011, connecting shaft; 1012, solid turntable; 1013, inter-gear; 1014, starting gear; 1015, engine; 1016, side gear; 1017, turning lever; 1018, bearing fixing buckle; 1019, flexible track; 1010, chain turning device; 10101, driving shaft; 10102, driving wheel; 10103, transmission chain; 10104, twin wheel; 10105, medium device; 10106, fitting shaft; 10107, driven wheel; 10108, fan chain; 10109, speed-up wheel; 102, chip placement disc; 1021, magnetic block; 1022, metal disc; 1023, setting slot; 1024, power transmission pipe; 1025, fixed block; 1026, mirror surface isolation block; 103, connecting inner wall; 104, main body shell; 105, grinding and scratching integrated machine; 106, data line receiving; 107, chip loading machine; 108, electrical strip; 109, telescopic rod; 110, power source box; 111, protective shell; 2, chip cleaning device; 201, cleaning shell; 202, upright barrel; 203, water outlet gate; 204, shunt pipe; 205, water storage column; 206, external power line; 207, water receiving box; 208, guide water pipe; 209, negative; 210, gravity spring; 211, displacement plug; 212, non-resistance guide sheet; 213, external pin; 214, purple light emitter; 215, horizontal converter; 217, turbine turning machine; 218, impeller; 219, side valve; 220, reset spring; 221, water discharge shell; 222, reflection converter; 3, solder wire smoke removal device; 301, smoke inlet shell; 302, import frame; 303, solder wire device; 304, wind direction leaf; 305, driving wheel shell; 306, smoke storage column; 307, smoke removal power wheel; 308, smoke removal fan leaf; 309, blocking shell; 310, lengthening rod. DETAILED DESCRIPTION

[0016] The technical solutions in the present application will be described clearly and completely below in combination with the drawings in the present application. In addition, the forms of each structure described in the following embodiments are only examples, and the cleaning device for integrated circuit production involved in the present application is not limited to each structure described in the following embodiments. All other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present application.

[0017] Reference Figures 1 to 8 The present application provides a cleaning device for integrated circuit production, which comprises a transfer grinding device 1, one side of the transfer grinding device 1 is fixedly connected with a chip cleaning device 2, and one side of the chip cleaning device 2 is fixedly connected with a solder wire smoke removal device 3.

[0018] In one preferred embodiment, the transfer grinding device 1 includes a track rotating device 101, one end of the top of the track rotating device 101 is threadedly connected with a chip placement disc 102, the front and back of the track rotating device 101 are both welded with a connecting inner wall 103, the back of the two connecting inner walls 103 are both nut-connected with a main body shell 104, the top of the main body shell 104 is welded with a grinding and scratching integrated machine 105, one side of the grinding and scratching integrated machine 105 is electrically connected with three data line receiving lines 106, one end of the three data line receiving lines 106 is electrically connected with a chip loader 107, the front and back of the chip loader 107 are both welded with two electrical strips 108, the front and back of the top of the grinding and scratching integrated machine 105 are both pipeline-connected with two telescopic rods 109, the bottom of the telescopic rod 109 is pipeline-connected with a power source box 110, the front of the main body shell 104 is nut-connected with a protective shell 111.

[0019] In one preferred embodiment, the track rotating device 101 includes a connecting shaft 1011, both ends of the outer side of the connecting shaft 1011 are rotationally connected with solid turntables 1012, the outer sides of the two solid turntables 1012 are fixedly connected with flexible tracks 1019, one end of the outer side of the connecting shaft 1011 is rotationally connected with an inter-disc gear 1013, one side of the inter-disc gear 1013 is fixedly connected with a starting gear 1014, the back of the starting gear 1014 is rotationally connected with an engine 1015, one side of the starting gear 1014 is fixedly connected with a side gear 1016, the back of the side gear 1016 is welded with a rotating lever 1017, the outer side of the middle of the rotating lever 1017 is rotationally sleeved with a bearing fixing buckle 1018, one end of the rotating lever 1017 is rotationally connected with a chain rotating device 1010, the back of the flexible track 1019 is fixedly connected with a connecting inner wall 103.

[0020] In this embodiment, it needs to be specifically supplemented that the material of the flexible track 1019 is a flexible rubber, which is not easy to break. Both ends of the inner side of the flexible track 1019 are provided with the connecting shaft 1011 and the solid turntable 1012. The inter-disc gear 1013 is located at the back of the solid turntable 1012 and is not connected with the solid turntable 1012. The inter-disc gear 1013 is engaged with the starting gear 1014. The side gear 1016 is vertically arranged with the starting gear 1014. The side gear 1016 is engaged with the starting gear 1014. The bearing fixing buckle 1018 is used to fix the rotating lever 1017. The rotating lever 1017 is rotatable.

[0021] In one preferred embodiment, the chain rotating device 1010 comprises a driving shaft 10101, one end of the outer side of which is connected with a driving wheel 10102, the outer side of which is wrapped with a transmission chain 10103, one end of which is connected with a twin wheel 10104, the front side of which is connected with a medium device 10105, the front side of which is connected with a fitting shaft 10106, the side of which is connected with a driven wheel 10107, the side of which is wrapped with a fan chain 10108, one end of which is connected with a speed-up wheel 10109, the front side of which is fixedly connected with the wire bonding smoke removal device 3.

[0022] In this embodiment, it needs to be specifically supplemented that the rotating rod 1017 is formed integrally with the driving shaft 10101, the fitting shaft 10106 penetrates the medium device 10105, the fitting shaft 10106 penetrates the driven wheel 10107, the diameter of the speed-up wheel 10109 is half of the diameter of the driven wheel 10107, and the speed-up wheel 10109 is used for speed-up effect, and the rotating speed of the speed-up wheel 10109 is twice of the rotating speed of the driven wheel 10107.

[0023] In one preferred embodiment, the chip placement disc 102 comprises a magnetic block 1021, the top of which is fixedly connected with a metal disc 1022, the top of which is provided with a setting groove 1023, the two sides of the magnetic block 1021 are electrically connected with an electric transmission pipe 1024, one end of the two electric transmission pipes 1024 is electrically connected with a fixed strip block 1025, and the top of one fixed strip block 1025 is welded with a mirror isolation block 1026.

[0024] In this embodiment, it needs to be specifically supplemented that the magnetic block 1021 and the metal disc 1022 are connected by magnetic force adsorption.

[0025] In one preferred implementation, the chip cleaning device 2 comprises a cleaning shell 201, the top nut of the cleaning shell 201 is connected with a positive barrel 202, the top of the positive barrel 202 is threadedly connected with a water outlet gate 203, the top of the water outlet gate 203 is threadedly connected with three shunt pipes 204, the top pipe of the three shunt pipes 204 is connected with a water storage column 205, one end of the water outlet gate 203 is electrically connected with an external wire 206, one end of the external wire 206 is electrically connected with the cleaning shell 201, one side of the cleaning shell 201 is nut-connected with a water receiving tank 207, the top of the water receiving tank 207 is pipe-connected with two guide water pipes 208, the inside bottom of the water receiving tank 207 is welded with a bottom sheet 209, the top of the bottom sheet 209 is welded with a gravity spring 210, the top of the gravity spring 210 is welded with a displacement plug 211, the middle of the bottom of the displacement plug 211 is electrically connected with a non-resistance guide sheet 212, one side of the cleaning shell 201 is electrically connected with an external pin 213, one side of the inner wall of the cleaning shell 201 is electrically connected with a purple light emitter 214, the other side of the inner wall of the cleaning shell 201 is electrically connected with a horizontal converter 215, the middle of the top of the positive barrel 202 is pivotally connected with a turbine rotating machine 217, the bottom of the turbine rotating machine 217 is welded with an impeller 218, the bottom of one side of the positive barrel 202 is provided with a side valve 219, the front of the side valve 219 is welded with a reset spring 220, the bottom of one side of the positive barrel 202 is welded with a water discharge shell 221, the top of one side of the inner wall of the cleaning shell 201 is electrically connected with a reflection converter 222.

[0026] In this embodiment, it needs to be specifically supplemented that the non-resistance guide sheet 212 is located in the gravity spring 210 without contact with the gravity spring 210, and the non-resistance guide sheet 212 is a pure conductor without resistance, which is used to short the external pin 213, the purple light emitter 214 and the horizontal converter 215 are located on a horizontal line, the side valve 219 is in close contact with the positive barrel 202, there is no gap between the two by the reset spring 220, the side valve 219 blocks the water seepage in the positive barrel 202, and the side valve 219 and the reset spring 220 are located in the water discharge shell 221.

[0027] In a preferred embodiment, the soldering wire smoke removing device 3 comprises a smoke inlet shell 301, the front nut of the smoke inlet shell 301 is connected with an inlet frame 302, the front nut of the inlet frame 302 is connected with a soldering wire device 303, the lower side of the inside of the inlet frame 302 is welded with a wind direction leaf 304, the back of the smoke inlet shell 301 is threadedly connected with a driving wheel shell 305, the bottom of the smoke inlet shell 301 is welded with a smoke storage column 306, the inner wall of the back of the driving wheel shell 305 is connected with a smoke removing driving wheel 307 through a rotating shaft, one end of the front of the smoke removing driving wheel 307 is connected with a smoke removing fan blade 308 through a rotating shaft, the other end of the front of the smoke removing driving wheel 307 is connected with a lengthening rod 310 through a rotating shaft, the bottom of the front of the driving wheel shell 305 is nut-connected with a blocking shell 309, and one end of the lengthening rod 310 is fixedly connected with a chain rotating device 1010.

[0028] In this embodiment, it is particularly necessary to supplement that the soldering wire device 303 is used for chip soldering wire.

[0029] The working principle of the present application is as follows: the chip slice is sequentially subjected to the processes of grinding, scribing, assembling and wire bonding by the transferring and grinding device 1, the ultraviolet light emitter 214 is arranged in the chip cleaning device 2, the ultraviolet light emitter 214 emits ultraviolet light, the horizontal converter 215 receives the ultraviolet light and converts it into electric energy by photoelectric effect for the engine 1015, the chip placing disc 102 is used for placing the chip slice, part of the current of the horizontal converter 215 is transmitted to the magnetic block 1021 to generate an electromagnetic field, the magnetic block 1021 is attracted to the metal disc 1022 under the action of the magnetic force and places the chip slice in the setting groove 1023, the starting gear 1014 rotates under the action of the engine 1015, the starting gear 1014 is engaged with the disc gear 1013, the disc gear 1013 rotates and drives the solid disc 1012 to rotate, the crawler rotating device 101 rotates as a whole to transmit the chip placing disc 102 to each process, the chip slice is subjected to the processes of grinding and scribing in the grinding and scribing machine 105 and is subjected to the process of assembling in the assembling machine 107, when the chip placing disc 102 moves to the chip cleaning device 2, the light emitted by the ultraviolet light emitter 214 is blocked by the mirror block 1026, the horizontal converter 215 cannot receive the light and cannot convert the light energy into electric energy, at this time, the transferring and grinding device 1 stops rotating, the magnetic field of the magnetic block 1021 disappears and cannot produce the adsorption effect on the metal disc 1022, the chip placing disc 102 stops in the chip cleaning device 2 and the magnetic block 1021 loses the magnetic force, the mirror block 1026 reflects the pipeline of the ultraviolet light emitter 214 to the reflection converter 222 at an inclined angle and the reflection converter 222 receives the pipeline and converts it into electric energy, the electric energy is transmitted to the positive barrel 202, the positive barrel 202 generates a magnetic field by the current flowing through the positive barrel 202 by electromagnetic effect, the magnetic force of the magnetic field of the positive barrel 202 tightly adsorbs the metal disc 1022 to the bottom of the positive barrel 202, in addition, the reflection converter 222 conducts the current to the water outlet gate 203 through the external wire 206, at this time, the water in the water storage column 205 flows into the positive barrel 202 through the shunt pipe 204, the turbine rotating machine 217 is connected to the water outlet gate 203, the turbine rotating machine 217 starts to rotate to drive the impeller 218 to rotate, the water column in the positive barrel 202 generates a centrifugal force under the rotating action of the impeller 218, the vortex formed by the centrifugal force washes away the dust of the chip in the metal disc 1022, the impeller 218 continuously rotates, the positive barrel 202 generates extrusion to the inner wall of the positive barrel 202 when the centrifugal force of the water column in the positive barrel 202 reaches the maximum state, the side valve 219 is extruded to the reset spring 220 under the action of the thrust, at this time, a gap is formed between the side valve 219 and the inner wall of the positive barrel 202, the water flows into the reset spring 220 through the gap and flows into the water receiving tank 207 through the guide water pipe 208, the water amount in the water receiving tank 207 continuously increases, when the water in the positive barrel 202 flows into the water receiving tank 207, the gravity of the water extrudes the gravity spring 210 through the displacement plug 211, the unblocked guide piece 212 moves downward until contacting the external pin 213,The circuit of the reflecting converter 222 is shorted, at this time the transfer grinding device 1 is driven by the motor, the turbine motor 217 is not powered and stops working, the positive barrel 202 loses electromagnetic force, the metal disc 1022 falls back to the magnetic block 1021 under the action of gravity, the transfer grinding device 1 continues to drive the chip placement disc 102, leaves the chip cleaning device 2, the horizontal converter 215 receives light energy to form electric energy to replace the motor to supply power to the transfer grinding device 1, the chip placement disc 102 moves to the wire bonding smoke removal device for wire bonding process, the side gear 1016 is engaged with the starting gear 1014 to brake, the side gear 1016 drives the starting wheel 10102 through the rotating lever 1017, the starting wheel 10102 drives the twin wheel 10104 through the transmission chain 10103, and the speed-up wheel 10109 is rotated and speeded up, and then the smoke removal power wheel 307 drives the smoke removal fan blade 308 to rotate, forming air pressure in the smoke inlet shell 301 to suck the smoke of the wire bonding into the smoke inlet shell 301 and to the smoke storage column 306 through the air flow to collect, the process uses the principle of straight line propagation and mirror reflection of light to brake the device and convert energy, saves power for the working process of the cleaning device, and cleans the chip before the wire bonding process, prevents dust from damaging the integrated circuit.

[0030] The above only describes the preferred embodiments of the present application and is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A cleaning device for integrated circuit production, comprising a transfer scratching device (1), characterized in that, The transfer grinding device (1) is fixedly connected with a chip cleaning device (2) on one side, and the chip cleaning device (2) is fixedly connected with a solder wire smoke removing device (3) on one side.

2. The cleaning apparatus for integrated circuit production according to claim 1, wherein: The transfer grinding device (1) includes a track rotating device (101), one end of the top of the track rotating device (101) is threadedly connected with a chip placing disc (102), the front and back surfaces of the track rotating device (101) are both welded with a connecting inner wall (103), the back surfaces of the two connecting inner walls (103) are both nut-connected with a main body shell (104), the top of the main body shell (104) is welded with a grinding and scratching integrated machine (105), one side of the grinding and scratching integrated machine (105) is electrically connected with three data line receiving lines (106), one end of the three data line receiving lines (106) is electrically connected with a chip mounting machine (107), the front and back surfaces of the chip mounting machine (107) are both welded with two electrical strips (108), the front and back ends of the top of the grinding and scratching integrated machine (105) are both pipeline-connected with two telescopic rods (109), the bottom of the telescopic rod (109) is pipeline-connected with a power source box (110), and the front surface of the main body shell (104) is nut-connected with a protective shell (111).

3. The cleaning apparatus for integrated circuit production as claimed in claim 2, wherein: The track rotating device (101) includes a connecting shaft (1011), both ends of the outer side of the connecting shaft (1011) are rotatably connected with solid turntables (1012), the outer sides of the two solid turntables (1012) are fixedly connected with flexible tracks (1019), one end of the outer side of the connecting shaft (1011) is rotatably connected with an inter-disc gear (1013), one side of the inter-disc gear (1013) is fixedly connected with a starting gear (1014), the back surface of the starting gear (1014) is rotatably connected with an engine (1015), one side of the starting gear (1014) is fixedly connected with a side gear (1016), the back surface of the side gear (1016) is welded with a rotating rod (1017), the outer side of the middle of the rotating rod (1017) is rotatably sleeved with a bearing fixing buckle (1018), one end of the rotating rod (1017) is rotatably connected with a chain rotating device (1010), and the back surface of the flexible track (1019) is fixedly connected with a connecting inner wall (103).

4. The cleaning apparatus for integrated circuit production as claimed in claim 3, wherein: The chain rotating device (1010) includes a prime mover shaft (10101), a first gear (10102) is connected to one end of the outer side of the prime mover shaft (10101), a transmission chain (10103) is connected to the outer side of the first gear (10102), a twin gear (10104) is connected to one end of the transmission chain (10103), a medium device (10105) is connected to the front of the twin gear (10104), a fitting shaft (10106) is connected to the front of the medium device (10105), a last gear (10107) is connected to the side of the fitting shaft (10106), a fan chain (10108) is connected to the side of the last gear (10107), a speed-up gear (10109) is connected to one end of the fan chain (10108), and a wire welding smoke removing device (3) is fixedly connected to the front of the speed-up gear (10109).

5. The cleaning apparatus for integrated circuit production as recited in claim 2, wherein: The chip placement tray (102) includes a magnetic block (1021), a metal tray (1022) is fixedly connected to the top of the magnetic block (1021), a setting groove (1023) is arranged on the top of the metal tray (1022), electric transmission pipes (1024) are electrically connected to the two sides of the magnetic block (1021), fixed strip blocks (1025) are electrically connected to one end of the two electric transmission pipes (1024), and a mirror surface separation block (1026) is welded on the top of one fixed strip block (1025).

6. The cleaning apparatus for integrated circuit production as recited in claim 1, wherein: The chip cleaning device (2) includes a cleaning shell (201), the top nut of the cleaning shell (201) is connected with a positive barrel (202), the top of the positive barrel (202) is threadedly connected with a water outlet gate (203), the top of the water outlet gate (203) is threadedly connected with three shunt pipes (204), the top pipe of the three shunt pipes (204) is connected with a water storage column (205), one end of the water outlet gate (203) is electrically connected with an external power line (206), one end of the external power line (206) is electrically connected with the cleaning shell (201), one side of the cleaning shell (201) is nut-connected with a water receiving tank (207), the top pipe of the water receiving tank (207) is connected with two guide water pipes (208), the bottom of the inner side of the water receiving tank (207) is welded with a bottom sheet (209), the top of the bottom sheet (209) is welded with a gravity spring (210), the top of the gravity spring (210) is welded with a displacement plug (211), the middle of the bottom of the displacement plug (211) is electrically connected with a non-resistance guide sheet (212), one side of the cleaning shell (201) is electrically connected with an external pin (213), one side of the inner wall of the cleaning shell (201) is electrically connected with a purple light emitter (214), the other side of the inner wall of the cleaning shell (201) is electrically connected with a horizontal converter (215), the middle rotating shaft of the top of the positive barrel (202) is connected with a turbine rotating machine (217), the bottom of the turbine rotating machine (217) is welded with an impeller (218), the bottom of one side of the positive barrel (202) is provided with a side valve (219), the front of the side valve (219) is welded with a return spring (220), the bottom of one side of the positive barrel (202) is welded with a water discharge shell (221), the top of one side of the inner wall of the cleaning shell (201) is electrically connected with a reflection converter (222).

7. The cleaning apparatus for integrated circuit production as recited in claim 1, wherein: The solder wire smoke removing device (3) includes a smoke inlet shell (301), the front nut of the smoke inlet shell (301) is connected with an inlet frame (302), the front nut of the inlet frame (302) is connected with a solder wire device (303), the lower side of the inner side of the inlet frame (302) is welded with a wind direction leaf (304), the back of the smoke inlet shell (301) is threadedly connected with a driving wheel shell (305), the bottom of the smoke inlet shell (301) is welded with a smoke storage column (306), the inner wall of the back of the driving wheel shell (305) is rotatably connected with a smoke removing driving wheel (307), one end of the front of the smoke removing driving wheel (307) is rotatably connected with a smoke removing fan blade (308), the other end of the front of the smoke removing driving wheel (307) is rotatably connected with a lengthening rod (310), the bottom of the front of the driving wheel shell (305) is nut-connected with a blocking shell (309), one end of the lengthening rod (310) is fixedly connected with a chain rotating device (1010).