Multi-chip frame plastic package power device

Abstract

The invention relates to the technical field of industrial automation, in particular to a multi-chip frame plastic package power device, which comprises a bottom plate, four plastic package bodies, two mounting assemblies and two connecting assemblies, and is characterized in that the four plastic package bodies are fixedly connected with the bottom plate, and the two mounting assemblies are respectively arranged in the corresponding plastic package bodies; the two connecting assemblies are respectively arranged in the corresponding plastic package bodies, the mounting assembly comprises three rectifier tubes, three first terminals and a first copper frame, mounting plates are uniformly arranged in the plastic package bodies, the three rectifier tubes are fixedly connected with the mounting plates and are arranged on the surfaces of the mounting plates, the three first terminals are fixedly connected with the plastic package plates, and the three first terminals are arranged on the surfaces of the plastic package bodies. The three first terminals are connected with the corresponding rectifier tubes, the first copper frame body is connected with the mounting plate and is located on one side of the mounting plate, and through the arrangement of the structure, the problems that in the prior art, automation of customers is not facilitated, mounting is troublesome, and efficiency is not high are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial automation, and in particular to a multi-chip frame plastic-sealed power device. Background Art

[0002] IGBT power devices are widely used in industrial automation, new energy, photovoltaics, and other fields. Application-wise, these devices are increasingly demanding in terms of cost, installation automation, and ease of use. Currently, the main inverter circuits in industrial control applications often utilize multiple IGBTs spliced ​​together to create different circuit topologies. This advantage stems from the maturity and low cost of IGBT technology.

[0003] However, the existing technology requires single-tube pins to be directly inserted into the PCB, then soldered, bent, coated with thermal grease, and then installed with a radiator. The entire process is not conducive to automation for customers, and the installation is cumbersome and inefficient. Summary of the Invention

[0004] The purpose of the present invention is to provide a multi-chip frame plastic package power device, which solves the problem that the existing technology is not conducive to customer automation, and the installation is complicated and inefficient.

[0005] To achieve the above-mentioned objectives, the present invention provides a multi-chip frame plastic-encapsulated power device, comprising a base plate, four plastic-encapsulated bodies, two mounting assemblies and two connecting assemblies, wherein the four plastic-encapsulated bodies are fixedly connected to the base plate and are located on the surface of the base plate, the two mounting assemblies are respectively arranged inside the corresponding plastic-encapsulated bodies, and the two connecting assemblies are respectively arranged inside the corresponding plastic-encapsulated bodies. The mounting assembly comprises three rectifier tubes, three first terminals and a first copper frame, and mounting plates are evenly arranged inside the plastic-encapsulated bodies. The three rectifier tubes are fixedly connected to the mounting plate and are arranged on the surface of the mounting plate. The three first terminals are fixedly connected to the plastic-encapsulated board and are located on one side of the plastic-encapsulated board. The three first terminals are connected to the corresponding rectifier tubes, and the first copper frame is connected to the mounting plate and is located on one side of the mounting plate.

[0006] Among them, the multi-chip frame plastic-encapsulated power device also includes a first brake FRD, a first brake IGBT, a second copper frame, a third copper frame and the fourth copper frame. The first brake FRD and the first brake IGBT are fixedly connected to the corresponding mounting plate and are respectively arranged on one side of the corresponding rectifier tube. The second copper frame and the third copper frame are connected to the first brake IGBT and are located on one side of the first brake IGBT. The fourth copper frame is connected to the first brake FRD and is located on one side of the first brake FRD.

[0007] The multi-chip frame plastic package power device further comprises a fifth copper frame, the fifth copper frame is fixedly connected with the corresponding plastic package body, and one side of the fourth cylinder frame.

[0008] The connecting assembly comprises three second brake FRDs, three second brake IGBTs, three second terminals and three sixth copper frames, the three second brake FRDs are fixedly connected with the corresponding mounting plates and located on one side of the mounting plates, the three second brake IGBTs are fixedly connected with the corresponding mounting plates and uniformly arranged on one side of the corresponding second brake FRD, and the three second terminals and the three sixth copper frames are arranged on two sides of the mounting plate.

[0009] The multi-chip frame plastic package power device further comprises a seventh copper frame, the eighth cylinder frame is fixedly connected with the corresponding mounting plate and located on one side of the mounting plate.

[0010] The multi-chip frame plastic package power device of the application comprises a plastic package body, a mounting plate is uniformly arranged in the plastic package body, three rectifier tubes are fixedly connected with the mounting plate and arranged on the surface of the mounting plate, three first terminals are fixedly connected with the plastic package plate and located on one side of the plastic package plate, the three first terminals are connected with the corresponding rectifier tubes, a first copper frame body is connected with the mounting plate and located on one side of the mounting plate, and the surface of the corresponding mounting plate is provided with a plurality of rectifier tubes. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0012] Figure 1 It is a structural schematic diagram of the multi-chip frame plastic package power device of the application.

[0013] Figure 2 It is a structural schematic diagram of the A of the application Figure 1 .

[0014] Figure 3 It is a structural schematic diagram of the B of the application Figure 1 .

[0015] Figure 4 It is a structural schematic diagram of the C of the application Figure 1 .

[0016] 1-bottom plate, 2-plastic package, 3-first terminal, 4-first brake frd, 5-first brake igbt, 6-first copper frame, 7-second copper frame, 8-third copper frame, 9-fourth copper frame, 10-fifth copper frame, 11-second brake frd, 12-second brake igbt, 13-second terminal, 14-sixth copper frame, 15-seventh copper frame, 16-rectifier tube, 17-mounting plate. DETAILED DESCRIPTION

[0017] Embodiments of the present application are described below in detail with reference to the accompanying drawings, wherein the same or similar components or components having the same or similar functions are denoted by the same or similar reference numerals throughout. The embodiments described below by reference to the accompanying drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application.

[0018] Referring to Figures 1 to 4 The present application provides a multi-chip frame plastic package power device, comprising a bottom plate 1, four plastic packages 2, two mounting assemblies and two connecting assemblies, the four plastic packages 2 are fixedly connected with the bottom plate 1 and located on the surface of the bottom plate 1, the two mounting assemblies are respectively arranged in the corresponding plastic package 2, the two connecting assemblies are respectively arranged in the corresponding plastic package 2, the mounting assembly comprises three rectifier tubes 16, three first terminals 3 and a first copper frame 6, the inside of the plastic package 2 is uniformly provided with a mounting plate 17, the three rectifier tubes 16 are fixedly connected with the mounting plate 17 and arranged on the surface of the mounting plate 17, the three first terminals 3 are fixedly connected with the plastic package plate and located on one side of the plastic package plate, the three first terminals 3 are connected with the corresponding rectifier tube 16, and the first copper frame is connected with the mounting plate 17 and located on one side of the mounting plate 17.

[0019] In the present embodiment, the surface of the mounting plate 17 is provided with a plurality of rectifier tubes 16, which has high integration and reduces the number of materials compared with IGBT single tube, and can replace multiple single tubes, and is easy to install.

[0020] Further, the multi-chip frame plastic package power device further comprises a first brake frd 4, a first brake igbt 5, a second copper frame 7, a third copper frame 8 and a fourth copper frame 9, the first brake frd 4 and the first brake igbt 5 are fixedly connected with the corresponding mounting plate 17 and arranged on one side of the corresponding rectifier tube 16, the second copper frame 7 and the third copper frame 8 are connected with the first brake igbt 5 and located on one side of the first brake igbt 5, and the fourth copper frame 9 is connected with the first brake frd 4 and located on one side of the first brake frd 4.

[0021] In the embodiment, the first brake igbt 5 and the first brake frd 4 are integrated in the plastic package 2, and the first brake igbt 5 and the first brake frd 4 are designed with opposite polarities of upper and lower surfaces.

[0022] Further, the multi-chip frame plastic package power device further comprises a fifth copper frame 10, the fifth copper frame 10 is fixedly connected with the corresponding plastic package 2, and one side of the fourth cylinder frame.

[0023] In the embodiment, the fifth copper frame 10 is arranged to facilitate installation and connection with other elements.

[0024] Further, the connection assembly comprises three second brake frds, three second brake igbts 12, three second terminals 13 and three sixth copper frames 14, the three second brake frds are fixedly connected with the corresponding mounting plate 17 and located on one side of the mounting plate 17, the three second brake igbts 12 are fixedly connected with the corresponding mounting plate 17 and evenly arranged on one side of the corresponding second brake frd, and the three second terminals 13 and the three sixth copper frames 14 are arranged on both sides of the mounting plate 17 respectively.

[0025] In the embodiment, the plastic package 2 has the same pin appearance size, and the second brake frd and the second brake igbt 12 in the inverter lower bridge are designed with opposite polarities of upper and lower surfaces.

[0026] Further, the multi-chip frame plastic package power device further comprises a seventh copper frame 15, the eighth cylinder frame is fixedly connected with the corresponding mounting plate 17 and located on one side of the mounting plate 17.

[0027] In the embodiment, the seventh copper pipe frame is arranged to facilitate installation.

[0028] The above only discloses one preferred embodiment of the present application, of course, cannot limit the scope of the present application, those skilled in the art can understand that the above-mentioned embodiment can realize all or part of the process, and the equivalent changes made according to the claims of the present application still belong to the scope covered by the present application.

Claims

1. A multi-chip frame plastic package power device comprising a bottom plate, characterized in that, It also includes four plastic packages, two mounting assemblies and two connecting assemblies, four said plastic packages are fixedly connected with the bottom plate and located on the surface of the bottom plate, two said mounting assemblies are respectively arranged in the inside of the corresponding said plastic package, and two said connecting assemblies are respectively arranged in the inside of the corresponding said plastic package. The mounting assembly comprises three rectifier tubes, three first terminals and a first copper frame, the inside of the plastic package is uniformly provided with a mounting plate, three said rectifier tubes are fixedly connected with the mounting plate and arranged on the surface of the mounting plate, three said first terminals are fixedly connected with the plastic package plate and located on one side of the plastic package plate, three said first terminals are connected with the corresponding said rectifier tube, and the first copper frame is connected with the mounting plate and located on one side of the mounting plate.

2. The multi-chip frame plastic package power device of claim 1, characterized in that, The multi-chip frame plastic package power device further comprises a first brake frd, a first brake igbt, a second copper frame, a third copper frame and a fourth copper frame, the first brake frd and the first brake igbt are fixedly connected with the corresponding mounting plate and arranged on one side of the corresponding rectifier tube respectively, the second copper frame and the third copper frame are connected with the first brake igbt and located on one side of the first brake igbt, and the fourth copper frame is connected with the first brake frd and located on one side of the first brake frd.

3. The multi-chip frame plastic package power device of claim 2, characterized in that, The multi-chip frame plastic package power device further comprises a fifth copper frame, the fifth copper frame is fixedly connected with the corresponding plastic package and located on one side of the fourth cylinder frame.

4. The multi-chip frame plastic package power device of claim 3, characterized in that, The connecting assembly comprises three second brake frds, three second brake igbts, three second terminals and three sixth copper frames, three said second brake frds are fixedly connected with the corresponding said mounting plate and located on one side of the mounting plate, three said second brake igbts are fixedly connected with the corresponding said mounting plate and uniformly arranged on one side of the corresponding said second brake frd, three said second terminals and three sixth copper frames are arranged on both sides of the mounting plate respectively.

5. The multi-chip frame plastic package power device of claim 4, characterized in that, The multi-chip frame plastic package power device further comprises a seventh copper frame, the eighth cylinder frame is fixedly connected with the corresponding said mounting plate and located on one side of the mounting plate.

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