Temperature compensation method, temperature control method, and temperature control system for laser chip

Abstract

The application discloses a temperature compensation method, a temperature control method and a temperature control system of a laser chip, and relates to the technical field of laser chips. The temperature compensation method of the laser chip is used for a temperature control module, the temperature control module comprises a heat sink, a laser chip, a thermistor and a heating resistor, and the laser chip, the thermistor and the heating resistor are arranged on the heat sink. The method comprises the following steps: determining a target duty cycle; and compensating a target temperature based on the target duty cycle, so as to control the temperature of the laser chip by the heating resistor. The method can obtain an accurate target control temperature, and is convenient for subsequent accurate control of the temperature of the laser chip, so as to realize accurate locking of a wavelength.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser chips, and in particular to a temperature compensation method, a temperature control method and a temperature control system for a laser chip. BACKGROUND

[0002] The temperature control principle of a laser chip is that the measured temperature of a thermistor (such as an NTC (Negative Temperature Coefficient) thermistor) is taken as the temperature of the laser chip for temperature control, and the chip temperature is balanced through the adjustment of a heating resistor to achieve the locking of the output wavelength of the chip. However, due to the difference in spatial layout between the thermistor and the laser chip, the only heating source of the entire temperature control module is the heating resistor, which will result in a temperature gradient in the entire temperature control module. When the temperature control reaches a steady state, there is a temperature difference between the measured temperature and the real temperature of the laser chip, which will make the laser chip achieve the intended temperature control on the surface, but the real temperature of the laser chip does not reach the intended temperature, and the precise locking of the wavelength cannot be achieved. SUMMARY

[0003] The present application aims to provide a temperature compensation method, a temperature control method and a temperature control system for a laser chip to obtain an accurate target control temperature, facilitate the accurate control of the temperature of the laser chip, and achieve the precise locking of the wavelength.

[0004] In a first aspect, the present application provides a temperature compensation method for a laser chip, which is used in a temperature control module, the temperature control module comprising a heat sink, a laser chip, a thermistor and a heating resistor, the laser chip, the thermistor and the heating resistor being arranged on the heat sink, and the method comprising: determining a target duty cycle; compensating a target temperature based on the target duty cycle, so as to control the temperature of the laser chip by the heating resistor.

[0005] In some embodiments, the target temperature is compensated by the following formula:

[0006] Tnn = Tdc - 3.92ψ

[0007] wherein Tnn represents the compensated target temperature, Tdc represents the target temperature before compensation, and ψ represents the target duty cycle.

[0008] In some embodiments, the determination of the target duty cycle comprises: taking the control duty cycle used in the last temperature control period as the target duty cycle.

[0009] In some embodiments, a PID controller is used to control the temperature of the laser chip, and the target duty cycle is determined by the following formula:

[0010] ψ = Kp (Tdc - 3.92ψ00 - Tn) + TI (sum (Tdc - 3.92ψ00 - Tn))

[0011] wherein, ψ represents the target duty cycle, ψ00 represents a target duty cycle used in a previous temperature control period, Tn represents a measured temperature of the laser chip acquired by the thermistor, Tdc represents a target temperature before compensation, Kp and TI respectively represent a proportional coefficient and an integral coefficient in the PID controller, and sum() represents a sum function.

[0012] In a second aspect, an embodiment of the present application provides a temperature control method for a laser chip, which is used in a temperature control module, the temperature control module comprising a heat sink, a laser chip, a thermistor and a heating resistor, the laser chip, the thermistor and the heating resistor being arranged on the heat sink, and the method comprising: acquiring a measured temperature of the laser chip by the thermistor; obtaining a compensated target temperature by using the temperature compensation method for the laser chip in the first aspect; and performing temperature control on the laser chip by the heating resistor according to the measured temperature and the compensated target temperature.

[0013] In some embodiments, the performing temperature control on the laser chip by the heating resistor according to the measured temperature and the compensated target temperature comprises: generating a control duty cycle by a PID (Proportion Integration Differentiation) controller according to the measured temperature and the compensated target temperature; and performing temperature control on the laser chip by the heating resistor according to the control duty cycle.

[0014] In a third aspect, an embodiment of the present application provides a temperature control system for a laser chip, the system comprising: a temperature control module comprising a heat sink, a laser chip, a thermistor and a heating resistor, the laser chip, the thermistor and the heating resistor being arranged on the heat sink; and a controller connected with the thermistor and the heating resistor respectively, and used for executing the temperature control method for the laser chip in the second aspect.

[0015] In some embodiments, the number of the heating resistors is two, and the two heating resistors are arranged on two sides of the laser chip and the thermistor respectively.

[0016] In some embodiments, the temperature control module further comprises a thermal resistance layer, and the thermal resistance layer is arranged on a side of the heat sink away from the laser chip, the thermistor and the heating resistor.

[0017] In a fourth aspect, an electronic device is provided, which includes a memory, a processor, and a computer program stored in the memory, and when the computer program is executed by the processor, the method of the first aspect and / or the second aspect is implemented.

[0018] The temperature compensation method, the temperature control method, and the temperature control system of the laser chip provided in the embodiments of the present application first determine a target duty cycle, and then compensate a target temperature based on the target duty cycle, so that an accurate target control temperature can be obtained. When the laser chip is controlled in temperature by a heating resistor subsequently, accurate control of the temperature of the laser chip can be achieved, and thus accurate locking of the wavelength can be achieved.

[0019] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a flowchart of the temperature compensation method of the laser chip according to an embodiment of the present application;

[0021] Figure 2 is a structural schematic diagram of the temperature control module according to an embodiment of the present application;

[0022] Figure 3 is a relationship curve diagram of the temperature difference according to an embodiment of the present application;

[0023] Figure 4 is a temperature cloud chart of the temperature control module according to an example of the present application;

[0024] Figure 5 is a temperature control curve of the temperature control module according to an example of the present application;

[0025] Figure 6 is a relationship curve diagram of Tn and Ta according to an example of the present application; and Tn-Ta;

[0026] Figure 7 is an effect diagram of temperature control based on the target temperature compensated according to an example of the present application;

[0027] Figure 8 is a flowchart of the temperature control method of the laser chip according to an embodiment of the present application;

[0028] Figure 9 is a structural block diagram of the temperature control system of the laser chip according to an embodiment of the present application;

[0029] Figure 10 is a structural block diagram of the electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0030] Embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0031] The temperature compensation method, the temperature control method, the temperature control system and the electronic device of the embodiments of the present application are described below with reference to the drawings.

[0032] At present, there are few researches and solutions for the temperature difference between the measured temperature and the real temperature of the laser chip. Since the laser chip is too small, its real temperature cannot be accurately obtained by measurement, and there is no other high-accuracy temperature characterization method. Therefore, the present application proposes a temperature compensation method for a laser chip based on a duty cycle of a heating resistor of a temperature control module, to realize high-precision and high-response-speed temperature compensation control of the laser chip.

[0033] Figure 1 is a flowchart of the temperature compensation method for the laser chip of the embodiments of the present application.

[0034] In this embodiment, the temperature compensation method for the laser chip is used for a temperature control module 10. As shown in Figure 2 , the temperature control module 10 includes a heat sink 1, a laser chip 2, a thermistor 3 and a heating resistor 4, and the laser chip 2, the thermistor 3 and the heating resistor 4 are all arranged on the heat sink 1.

[0035] Among them, the thermistor 3 can be an NTC thermistor, which is used to measure the temperature of the laser chip 2 to obtain a measured temperature. The heat sink 1 can be an AIN (aluminum nitride) heat sink; the laser chip 2 is a non-refrigeration laser chip.

[0036] Exemplarily, referring to Figure 2 , the temperature control module 10 further includes a thermal resistance layer 5, which is arranged on the side of the heat sink 1 away from the laser chip 2, the thermistor 3 and the heating resistor 4, and plays a heat insulation role.

[0037] As shown in Figure 1 , the temperature compensation method for the laser chip includes:

[0038] S11, determining a target duty cycle.

[0039] In this embodiment, the duty cycle is for the heating resistor, and when the laser chip is temperature controlled, a control duty cycle can be generated, and the heating resistor can heat the laser chip under the action of the control duty cycle to achieve temperature control of the laser chip. The target duty cycle can be the control duty cycle used in the last temperature control period, or can be iteratively obtained by using the target duty cycle in different temperature control periods.

[0040] It should be noted that in each temperature control period, the measured temperature of the laser chip is obtained by the thermistor, and the control duty cycle is generated by the PID controller or the PI controller according to the measured temperature and the target control temperature, and the heating resistor can be controlled to heat the laser chip based on the control duty cycle. For the first temperature control period, the target control temperature can be a set target temperature, and the target duty cycle can be 0; for the temperature control period after the first temperature control period, the target control temperature can be the compensated target temperature, and the target duty cycle can be determined as needed.

[0041] S12, compensating the target temperature based on the target duty cycle for temperature control of the laser chip by the heating resistor.

[0042] Wherein, the target temperature is a pre-set expected temperature that the laser chip actually reaches.

[0043] In some embodiments of the application, the target temperature is compensated by the following formula (1):

[0044] Tnn=Tdc-3.92ψ (1)

[0045] Wherein, Tnn represents the compensated target temperature, Tdc represents the target temperature before compensation, and ψ represents the target duty cycle.

[0046] Through a large number of test results, it is found that during the operation of the laser chip, as the ambient temperature decreases, the temperature difference between the measured temperature obtained by the thermistor and the true temperature of the laser chip will increase, and the relationship is basically linear. As shown in Figure 3 Figure 3 Wherein, Tn represents the measured temperature, Tc represents the true temperature of the laser chip, and Ta represents the ambient temperature. The specific reason is analyzed as follows:

[0047] The heat balance equation (dimensionless) of the laser chip temperature control module is constructed as follows:

[0048] (2)

[0049] Wherein, represents the dimensionless temperature of the temperature control module, ​represents the heating power of the heating resistor, and represents the temperature difference between Tn and Ta, represents the ambient temperature, represents the temperature of the thermal resistance layer. The rest are physical properties or convective heat transfer constants, including: represents the thermal conductivity of the temperature control module, represents the density of the temperature control module, represents the specific heat of the temperature control module, represents the convective heat transfer coefficient between the temperature control module and the environment, L represents the characteristic size of the heat sink, and x, y, and z represent the three-dimensional directions of the heat sink. As can be seen from equation (2), when the ambient temperature Ta decreases, the temperature difference ΔT increases, and the dimensionless temperature field remains unchanged. Since Tn-Tc is the product of ΔT and the corresponding dimensionless temperature, Tn-Tc also increases by the same multiple. That is, as the ambient temperature decreases, the temperature difference between the measured temperature and the actual temperature of the laser chip increases, and the relationship is linear, which is consistent with the test results.

[0050] Figure 4 is a temperature cloud map (simulation) of a temperature control module of an example of the present application, Figure 4 The lower the gray value (the darker the color), the lower the corresponding temperature. It can be seen that the measured temperature is significantly lower than the actual temperature of the laser chip. Figure 5 is a temperature control curve (simulation) of a temperature control module of an example of the present application. It can be seen that the actual temperature Tc of the laser chip is about 2°C higher than the measured temperature Tn.

[0051] From the above analysis, it can be seen that the temperature difference between the measured temperature and the actual temperature of the laser chip is caused by the temperature gradient existing in the temperature control module, and increases linearly with Tn-Ta. To maintain the balance of equation (2), Tn-Ta and are in a proportional relationship, that is, for a temperature control module with a fixed heat transfer structure, the proportional coefficient = / (Tn-Ta) is a fixed value, Figure 6 shows the simulation calculation results of the relationship between Tn-Ta and Tn-Tc. From the above analysis, the value of Tn-Tc can be calculated from Tn-Ta, and the value of Tn-Tc can also be calculated from .

[0052] Assuming , the following equation (3) is obtained:

[0053] (3)

[0054] ​Wherein, Tcn represents the real temperature of the laser chip after compensation, Tdc represents the target temperature before compensation, and Tnn represents the target temperature after compensation. The following formulas (4)-(6) are obtained by continuing to calculate:

[0055] (4)

[0056] (5)

[0057] (6)

[0058] Formula (6) is the final temperature compensation formula, which is obtained by substituting the specific values of , into the formula, and considering that is calculated from the duty cycle of the heating resistor, and the final formula (1) is obtained. Wherein, , can be obtained by measurement and calibration, and the relationship between the duty cycle and the heating power is a proportional relationship, which can also be obtained by measurement and calibration.

[0059] As an embodiment, the target duty cycle is determined, including: taking the control duty cycle used in the last temperature control period as the target duty cycle.

[0060] As another embodiment, the target duty cycle is determined by the following formula (7):

[0061] ψ=Kp(Tdc-3.92ψ00-Tn)+TI(sum(Tdc-3.92ψ00-Tn)) (7)

[0062] Wherein, ψ represents the target duty cycle, ψ00 represents the target duty cycle used in the last temperature control period, Tn represents the measured temperature of the laser chip obtained by the thermistor, Tdc represents the target temperature before compensation, Kp and TI represent the proportional coefficient and integral coefficient in the PID controller respectively, and sum() represents the sum function. Alternatively, the function sum() in the above formula (7) can also be omitted, that is, ψ=Kp(Tdc-3.92ψ00-Tn)+TI(Tdc-3.92ψ00-Tn).

[0063] Taking the PID control as an example, in the actual temperature control process of the laser chip, in each measured temperature feedback control period (i.e. temperature control period), the compensation method of the above formula (1) contains the following two:

[0064] 1) Explicit compensation

[0065] PID control, before calculating the control duty ratio of the heating resistor each time, uses the control duty ratio of the heating resistor calculated in the last temperature control period to calculate the updated control temperature in the current temperature control period (i.e. the target temperature after compensation). This compensation method is simple to calculate, but the compensation accuracy is poorer than implicit compensation because the control duty ratio of the heating resistor calculated in the last temperature control period is used.

[0066] 2) Implicit compensation

[0067] PID control, before calculating the control duty ratio of the heating resistor each time, uses the control duty ratio of the heating resistor calculated in the current temperature control period to calculate the updated control temperature in the current temperature control period. Because the control duty ratio of the heating resistor calculated in the current temperature control period has not been obtained, the target duty ratio is determined by using the iteration method of formula (7). This compensation method can control the convergence residual within 10e-7~10e-6.

[0068] Figure 7 A temperature compensation effect (simulation) is shown, the compensation example is based on an ambient temperature of-5℃ and a target temperature of 65℃, and the explicit compensation method is used. It can be seen that the actual temperature of the laser chip can be accurately controlled at 65℃ in this example.

[0069] Figure 8 is a flowchart of the temperature control method of the laser chip according to an embodiment of the present application.

[0070] In this embodiment, the temperature control method of the laser chip is used for a temperature control module. As shown in Figure 2 , the temperature control module 10 includes a heat sink 1, a laser chip 2, a thermistor 3 and a heating resistor 4, and the laser chip 2, the thermistor 3 and the heating resistor 4 are all arranged on the heat sink 1.

[0071] As shown in Figure 8 , the temperature control method of the laser chip includes:

[0072] S81, obtaining a measured temperature of the laser chip through the thermistor.

[0073] S82, determining a target temperature after compensation.

[0074] The target temperature after compensation is obtained by using the temperature compensation method of the laser chip according to the above embodiment.

[0075] S83, controlling the temperature of the laser chip through the heating resistor according to the measured temperature and the target temperature after compensation.

[0076] In some embodiments of the present application, the temperature control of the laser chip by the heating resistor according to the measured temperature and the compensated target temperature comprises: generating a control duty ratio according to the measured temperature and the compensated target temperature by the PID control; and controlling the temperature control of the laser chip by the heating resistor according to the control duty ratio.

[0077] Exemplarily, the PID control described above can be replaced by a PID control.

[0078] Figure 9 is a structural block diagram of the temperature control system of the laser chip according to an embodiment of the present application.

[0079] As shown in Figure 9 , the temperature control system 900 of the laser chip comprises a temperature control module 10 and a controller 20.

[0080] The temperature control module 10 comprises a heat sink 1, a laser chip 2, a thermistor 3 and a heating resistor 4, and the laser chip 2, the thermistor 3 and the heating resistor 4 are all arranged on the heat sink 1; the controller 20 is connected with the thermistor 3 and the heating resistor 4 respectively, and is used for executing the temperature control method of the laser chip according to the above embodiments.

[0081] Exemplarily, referring to Figure 9 , the number of the heating resistors 4 is two, and the two heating resistors 4 are arranged on both sides of the laser chip 2 and the thermistor 3.

[0082] Exemplarily, referring to Figure 9 , the temperature control module 10 further comprises a thermal resistance layer 5, and the thermal resistance layer 5 is arranged on the side of the heat sink 1 away from the laser chip 2, the thermistor 3 and the heating resistor 4.

[0083] Figure 10 is a structural block diagram of an electronic device according to an embodiment of the present application.

[0084] As shown in Figure 10 , the electronic device 500 comprises a processor 501 and a memory 503. The processor 501 and the memory 503 are connected, for example, through a bus 502. Optionally, the electronic device 500 can further comprise a transceiver 504. It should be noted that in actual applications, the transceiver 504 is not limited to one, and the structure of the electronic device 500 does not constitute a limitation on the embodiments of the present application.

[0085] The processor 501 can be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other programmable logic device, transistor logic device, hardware component, or any combination thereof. It can implement or execute various exemplary logical blocks, modules and circuits described in combination with the present disclosure. The processor 501 can also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, and the like.

[0086] The bus 502 can include a path for transmitting information between the above-mentioned components. The bus 502 can be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, or the like. The bus 502 can be divided into an address bus, a data bus, a control bus, and the like. For ease of representation, Figure 10 In the figure, only one thick line is used, but it does not mean that there is only one bus or only one type of bus.

[0087] The memory 503 is used to store a computer program corresponding to the temperature compensation method of the laser chip and / or the temperature control method of the laser chip of the above-mentioned embodiments of the present disclosure, which is controlled and executed by the processor 501. The processor 501 is used to execute the computer program stored in the memory 503 to realize the content shown in the foregoing method embodiments.

[0088] Figure 10 The electronic device 500 shown is only an example and should not limit the functions and use range of the embodiments of the present disclosure.

[0089] In summary, the temperature compensation method, the temperature control method, the temperature control system and the electronic device of the embodiments of the present disclosure, when performing temperature compensation, first determine a target duty cycle, and then compensate a target temperature based on the target duty cycle, to obtain an accurate target control temperature. When performing temperature control, the compensated target temperature is used as a control temperature, that is, a target duty cycle is generated based on a measured temperature and the compensated target temperature, and a laser chip is controlled in temperature by a heating resistor based on the control duty cycle, so that accurate control of the temperature of the laser chip can be realized, and further precise locking of the wavelength can be realized.

[0090] It should be noted that the logical and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a list of executable instructions for implementing logic functions, and can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor- containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions, or a combination of the instruction execution system, apparatus, or device. For the purposes of this specification, a "computer-readable medium" can be any apparatus that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. The computer-readable medium can be a product of the manufacturing and / or processing, and / or an article of manufacture. More specific examples (a non-exhaustive list) of the computer-readable medium include the following: an electronic connection having one or more wires (electronic devices), a portable computer diskette (magnetic devices), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber (optical devices), and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted, or otherwise processed in a suitable manner, if necessary, and stored in a computer memory.

[0091] It should be understood that aspects of the application can be implemented in hardware, software, firmware or combinations thereof. In the above embodiments, various steps or methods can be implemented in software or firmware that is stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any of the following technologies, known in the art, or combinations thereof, can be used: a discrete logic circuit having logic gates for implementing logic functions upon data signals, an application specific integrated circuit having appropriate combinational logic gates, a programmable gate array (PGA), a field programmable gate array (FPGA), or the like.

[0092] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in one or more embodiments or examples.

[0093] In the description of the application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0094] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0095] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0096] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0097] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and cannot be understood as a limitation on the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A temperature compensation method for a laser chip, characterized in that, For a temperature control module, the temperature control module includes a heat sink, a laser chip, a thermistor, and a heating resistor, wherein the laser chip, the thermistor, and the heating resistor are all disposed on the heat sink, and the method includes: Determine the target duty cycle; The target temperature is compensated based on the target duty cycle in order to control the temperature of the laser chip through the heating resistor; The target temperature is compensated using the following formula: Tnn=Tdc-3.92ψ Where Tnn represents the target temperature after compensation, Tdc represents the target temperature before compensation, and ψ represents the target duty cycle.

2. The temperature compensation method for a laser chip according to claim 1, characterized in that, Determining the target duty cycle includes: The control duty cycle used in the previous temperature control cycle is taken as the target duty cycle.

3. The temperature compensation method for a laser chip according to claim 1, characterized in that, The laser chip temperature is controlled using a PID controller; the target duty cycle is determined by the following formula: ψ=Kp(Tdc-3.92ψ00-Tn)+TI(sum(Tdc-3.92ψ00-Tn)) Wherein, ψ represents the target duty cycle, ψ00 represents the target duty cycle used in the previous temperature control cycle, Tn represents the measured temperature of the laser chip obtained through the thermistor, Tdc represents the target temperature before compensation, Kp and TI represent the proportional coefficient and integral coefficient in the PID controller, respectively, and sum() represents the sum function.

4. A method for temperature control of a laser chip, characterized in that, For a temperature control module, the temperature control module includes a heat sink, a laser chip, a thermistor, and a heating resistor, wherein the laser chip, the thermistor, and the heating resistor are all disposed on the heat sink, and the method includes: The temperature of the laser chip is obtained through the thermistor; The compensated target temperature is obtained using the temperature compensation method for the laser chip as described in any one of claims 1-3; The laser chip is temperature controlled by the heating resistor based on the measured temperature and the compensated target temperature.

5. The temperature control method for a laser chip according to claim 4, characterized in that, The step of controlling the temperature of the laser chip via the heating resistor based on the measured temperature and the compensated target temperature includes: A PID controller is used to generate a control duty cycle based on the measured temperature and the compensated target temperature. The temperature of the laser chip is controlled by controlling the heating resistor according to the control duty cycle.

6. A temperature control system for a laser chip, characterized in that, The system includes: The temperature control module includes a heat sink, a laser chip, a thermistor, and a heating resistor, wherein the laser chip, the thermistor, and the heating resistor are all disposed on the heat sink; The controller is connected to the thermistor and the heating resistor respectively, and is used to execute the temperature control method of the laser chip as described in claim 4 or 5.

7. The temperature control system for the laser chip according to claim 6, characterized in that, There are two heating resistors, which are respectively disposed on both sides of the laser chip and the thermistor.

8. The temperature control system for the laser chip according to claim 6, characterized in that, The temperature control module also includes a thermal resistance layer, which is disposed on the side of the heat sink away from the laser chip, the thermistor and the heating resistor.

9. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored on the memory, which, when executed by the processor, implements the method as described in any one of claims 1-5.

Images