Inverter tiling installation structure

Abstract

The invention, which relates to the technical field of the inverter installation structure, discloses an inverter tiling installation structure comprising a substrate, and the periphery of the substrate is fixedly provided with positioning grooves. According to the tiled mounting structure of the inverter, the DBC is welded on the substrate through soldering tin, the positioning grooves in the periphery of the substrate are used for welding and positioning the DBC, the welding position precision of the DBC is ensured through mechanical limiting of the positioning grooves, the MOS is bonded on the DBC through heat-conducting glue, and the back pins of the MOS are welded on the power board, so that the alignment qualification rate of the back pins of the MOS and a bonding pad of the power board is improved, and the production efficiency is improved. The PCB is fixed on the power board through the supporting columns, the flat design is adopted by the inverter flat-laying installation structure, the height is only 36 mm after vertical stacking is canceled, the PCB is arranged in an overhead mode through the supporting columns to release the wiring space, the power density is effectively improved, the reliability, the power density and the production yield of the inverter module are comprehensively improved, and the cost is reduced. The method is especially suitable for high-frequency application scenes with limited space, such as electric automobiles.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of inverter mounting structure, in particular to an inverter flat mounting structure. BACKGROUND

[0002] The vertical stack structure is a classic layout form of inverter module, and its core feature is that multiple layers of components are stacked along the Z-axis direction. The typical structure includes a bottom metal substrate, an intermediate layer DBC ceramic substrate bonded to the metal substrate by solder or heat-conducting adhesive, a top layer MOSFET / IGBT power device arranged in parallel or bridge circuit, and connected to the DBC surface copper layer by wire bonding or solder. The encapsulation layer is protected by silicon gel or epoxy resin filling, and the top is covered with a plastic shell.

[0003] However, the vertical stack layout results in a long heat conduction path, high interface thermal resistance between the MOS tube and the DBC substrate, uneven heat dissipation of the multi-layer structure, which easily causes local overheating. Moreover, the vertical stack design requires a reserved wire bending space (typical height > 50 mm), and the layered arrangement of power board and PCB leads to complex wiring, and the power density is generally low. SUMMARY

[0004] The purpose of the present application is to provide an inverter flat mounting structure to solve the problems raised in the background.

[0005] To achieve the above purpose, the present application provides the following technical scheme: an inverter flat mounting structure, comprising a substrate, the substrate is fixed with a positioning groove around, and the inner wall of the positioning groove is fixed with a flange, the inside of the positioning groove is welded and positioned with a DBC, and the MOS is bonded on the DBC through a heat-conducting adhesive, a power board is arranged on the MOS, and the power board is bolted on the connecting column around the substrate, a support column is fixed on the end of the power board, and a PCB is screwed on the support column.

[0006] Further, the MOS extends a pin on the back, and the MOS is welded and fixed with the power board through the pin.

[0007] Further, notches are symmetrically provided on both sides of the MOS, and the MOS is arranged side by side inside the bottom end of the heat dissipation bracket.

[0008] Further, end plates are integrally fixed at both ends of the heat dissipation bracket, and connecting clamping grooves are provided at the edge of the end plates, and the height of the connecting clamping grooves is higher than the opening top end of the positioning groove.

[0009] Further, a mounting buckle is integrally connected to the bottom end of the end plate, and the end plate is clamped and fixed with the flange of the inner wall of the positioning groove through the mounting buckle.

[0010] Further, the opposite faces of the end plates are fixedly connected with cross beams, and the back surfaces of the cross beams integrally extend with heat conduction fins, the oblique surfaces of the heat conduction fins are provided with avoiding grooves corresponding to the pins on the back surfaces of the MOS, and the heat conduction fins are attached to the power board and the PCB below to realize heat conduction.

[0011] Further, the top of the cross beam is arranged with heat dissipation fins at equal intervals along the length direction, and the cavities between the adjacent heat dissipation fins form convection channels.

[0012] Further, the bottom of the cross beam is provided with curved beams in pairs, the inner sides of the curved beams are fixedly provided with clamping blocks, and the curved beams realize self-locking by elastically deforming the clamping blocks and clamping them in the notches on the two sides of the MOS.

[0013] Further, the front surface of the cross beam is provided with an organism, and the back surfaces of the two ends of the organism are fixedly connected with connecting buckles, the two ends of the organism are provided with openings, and the organism is fixedly connected with the connecting buckle slots on the edges of the end plates through the connecting buckles on the two ends.

[0014] Further, the organism is built-in with a micro motor, the power supply connector connected to the micro motor controller is electrically connected with the corresponding module of the power board, and the rotating end of the micro motor is fixedly connected with an impeller.

[0015] The application provides an inverter flat installation structure, which has the following beneficial effects. 1. In use, the DBC is welded on the substrate by soldering, the positioning grooves around the substrate are used for DBC welding positioning, the mechanical positioning of the positioning grooves ensures the welding position accuracy of the DBC, the MOS is attached to the DBC by heat-conducting adhesive, and the pins on the back surface of the MOS are welded on the power board, thereby improving the pin-to-pad alignment yield of the MOS back surface and the power board, and the PCB is fixed on the power board by the support column.

[0016] 2. In use, the application realizes forced convection by the heat dissipation bracket and the impeller, the heat conduction fins on the back surface of the heat dissipation bracket expand the heat dissipation surface to the power board and the PCB to form a composite heat dissipation system of conduction and convection, and the composite multi-path heat dissipation design principle effectively solves the problem of high interface thermal resistance between the MOS and the DBC without affecting the overall height of the flat structure.

[0017] 3, when using the application, the MOS of the application is installed in the curved beam arranged at the bottom of the cross beam, the heat dissipation support is installed in the positioning groove, and the radiator body is installed on the front of the cross beam, all of which are connected through buckles, without the need of screws, which greatly improves the installation efficiency, at the same time, the welding positioning of the DBC in the positioning groove improves the alignment accuracy of the MOS and the DBC, and also improves the alignment qualification rate of the pins on the back of the MOS and the pads of the power plate. BRIEF DESCRIPTION OF DRAWINGS

[0018] Fig. 1 It is a schematic diagram of the overall structure of the device of the application; Fig. 2 It is a schematic diagram of the explosion structure of the device of the application; Fig. 3 It is a schematic diagram of the partial structure of the device of the application; Fig. 4 It is a schematic diagram of the overall structure of the heat dissipation support of the application; Fig. 5 It is a schematic diagram of the partial structure of the heat dissipation support of the application; Fig. 6 It is a schematic diagram of the partial structure of the heat dissipation support of the application.

[0019] In the figure: 1, base plate; 2, positioning groove; 3, flange; 4, DBC; 5, MOS; 6, pin; 7, notch; 8, power plate; 9, support column; 10, PCB; 11, heat dissipation support; 12, end plate; 13, connecting buckle; 14, mounting buckle; 15, cross beam; 16, heat conduction sheet; 17, avoiding groove; 18, heat dissipation fin; 19, curved beam; 20, clamping block; 21, body; 22, connecting buckle; 23, micro motor; 24, power supply connector; 25, impeller. DETAILED DESCRIPTION

[0020] The embodiments of the application will be further described in detail below with reference to the drawings and examples. The following examples are used to illustrate the application, but cannot be used to limit the scope of the application Please refer to Figs. 1-2 The application provides a technical solution: an inverter flat installation structure, comprising a base plate 1, the base plate 1 is fixed with a positioning groove 2 around, and the inner wall of the positioning groove 2 is fixed with a flange 3, the inside of the positioning groove 2 is welded and positioned with a DBC 4, and the DBC 4 is adhered with a MOS 5 through heat-conducting adhesive, a power plate 8 is arranged on the MOS 5, and the power plate 8 is bolted on the connecting column around the base plate 1, the end of the power plate 8 is fixed with a support column 9, and the support column 9 is screwed with a PCB 10, the back of the MOS 5 extends a pin 6, and the MOS 5 is welded and fixed with the power plate 8 through the pin 6, notches 7 are symmetrically arranged on both sides of the MOS 5, and the MOS 5 is arranged in parallel at the bottom of the heat dissipation support 11; The specific operation is as follows, the DBC4 is welded on the substrate 1 by soldering, the positioning groove 2 around the substrate 1 is used for DBC4 welding positioning, the mechanical limiting of the positioning groove 2 ensures the welding position accuracy of the DBC4, the MOS 5 is adhered on the DBC4 by heat-conducting adhesive, and the MOS 5 back pin 6 is welded on the power plate 8, thereby improving the MOS 5 back pin 6 and the power plate 8 pad alignment qualified rate, the PCB 10 is fixed on the power plate 8 by the support column 9, the inverter flat installation structure of the application adopts a flat design, and the height after canceling vertical stacking is only 36mm, the PCB 10 is arranged in an overhead layout by the support column 9 to release wiring space, and the power density is effectively improved, the scheme comprehensively improves the reliability, power density and production yield of the inverter module, and is especially suitable for high-frequency application scenarios such as electric vehicles and other space-limited scenarios; Please refer to Figs. 3-6 The end plate 12 is integrally fixed at both ends of the heat dissipation support 11, and the connecting clamping groove 13 is formed in the edge of the end plate 12, and the height of the connecting clamping groove 13 is higher than the opening top end of the positioning groove 2. The mounting buckle 14 is integrally connected to the bottom end of the end plate 12, and the end plate 12 is fixed and connected with the flange 3 of the inner wall of the positioning groove 2 through the mounting buckle 14. The opposite surfaces of the two side end plates 12 are fixedly connected with the cross beam 15, and the cross beam 15 integrally extends the heat dissipation sheet 16 on the back surface. The inclined surface of the heat dissipation sheet 16 is provided with an avoiding groove 17 corresponding to the back pin 6 of the MOS 5, and the heat dissipation sheet 16 is attached to the power plate 8 and the PCB 10 below to realize heat conduction. The cross beam 15 is arranged with the heat dissipation fins 18 at the top along the length direction at equal intervals, and the cavities between the adjacent heat dissipation fins 18 form a convection channel. The curved beams 19 are arranged in pairs at the bottom of the cross beam 15, the clamping blocks 20 are fixed in the curved beams 19, and the curved beams 19 are self-locked by buckling the clamping blocks 20 in the notches 7 on both sides of the MOS 5 through the elastic deformation of the material itself; Specific operation as follows, the whole fishbone-shaped structure of the heat dissipation support 11, the heat dissipation support 11 both sides end plate 12 through the installation buckle 14 and the flange 3 of the inner wall of the positioning groove 2 is connected and fixed, the crossbeam 15 front body 21 through two end connecting buckle 22 and the connecting buckle slot 13 of the edge of the end plate 12 buckle connection fixed, the crossbeam 15 bottom is provided with a pair of curved beam 19, when installing MOS 5 only need to push along the side, the curved beam 19 through the elastic deformation of its material will the clamping block 20 buckle in the notch 7 of the both sides of MOS 5 realizes self-locking, and the surface of MOS 5 is coated with heat-conducting glue, which not only fixes the device but also increases the heat dissipation area, at the same time, the cavity forms a convection channel, which strengthens the natural convection heat dissipation. The installation of MOS 5 in the pair of curved beams 19 at the bottom of the crossbeam 15, the installation of the heat dissipation support 11 in the positioning groove 2 and the installation of the radiator body 21 on the front of the crossbeam 15 are all connected through buckles, without screws, which greatly improves the installation efficiency. At the same time, through the limiting and positioning of the positioning groove 2 on the installation position of MOS 5, the welding positioning of DBC 4 is improved, which improves the alignment accuracy of MOS 5 and DBC 4 and also improves the alignment qualification rate of the pins 6 on the back of MOS 5 and the pads of power plate 8. Please refer to Figs. 3-6 , the crossbeam 15 is provided with the body 21, and the body 21 is fixedly connected with the connecting buckle 22 at the both ends of the back, the body 21 is provided with openings at both ends, and the body 21 is buckled and fixed through the connecting buckle slot 13 of the edge of the end plate 12 by the two end connecting buckles 22, the body 21 is built-in with a micro motor 23, and the power supply connector 24 connected to the controller of the micro motor 23 is electrically connected to the corresponding module of the power plate 8, and the rotating end of the micro motor 23 is fixedly connected with an impeller 25. Specific operation as follows, the heat dissipation support 11 is composed of two side end plates 12 and a middle crossbeam 15, the crossbeam 15 is arranged with heat dissipation fins 18 at the top along the length direction at equal intervals, the cavities between adjacent heat dissipation fins 18 form convection channels, the heat-conducting sheet 16 extending from the back of the crossbeam 15 expands the heat dissipation surface to the power plate 8 and the PCB 10, and the body 21 in the front of the crossbeam 15 is installed with an impeller 25 driven by a micro motor 23. The application forms a composite heat dissipation system of conduction and convection by forced convection of the heat dissipation support 11 and the impeller 25, and the heat-conducting sheet 16 on the back of the heat dissipation support 11 expands the heat dissipation surface to the power plate 8 and the PCB 10. The composite multi-path heat dissipation design principle effectively solves the problem of high interface thermal resistance between MOS 5 and DBC 4 without affecting the overall height of the flat structure.

[0021] In summary, when using the inverter flat installation structure: Firstly, the DBC4 is welded on the substrate 1 by soldering, the positioning groove 2 around the substrate 1 is used for welding positioning of the DBC4, the mechanical limiting of the positioning groove 2 ensures the welding position accuracy of the DBC4, the MOS 5 is adhered on the DBC4 by heat-conducting adhesive, and the back pin 6 of the MOS 5 is welded on the power plate 8, thereby improving the pad alignment qualification rate of the back pin 6 of the MOS 5 and the power plate 8, and the PCB 10 is fixed on the power plate 8 by the support column 9, the inverter flat installation structure of the application adopts a flat design, and the height after canceling the vertical stacking is only 36 mm, the PCB 10 is arranged in an air-supported manner by the support column 9 to release the wiring space, and the power density is effectively improved, the scheme comprehensively improves the reliability, power density and production yield of the inverter module, and is especially suitable for high-frequency application scenarios such as electric vehicles and space-limited scenarios; Secondly, the heat dissipation support 11 is in a fishbone shape as a whole, the end plates 12 at two sides of the heat dissipation support 11 are fixed by clamping and fixing of the flanges 3 on the inner walls of the positioning grooves 2 through the installation buckles 14, the front machine body 21 of the cross beam 15 is fixed by buckling and fixing of the connecting buckles 22 at two ends and the connecting buckle grooves 13 at edges of the end plates 12 through the two ends, the curved beams 19 are arranged in pairs at the bottom of the cross beam 15, when the MOS 5 is installed, it only needs to be pushed in along the lateral direction, the clamping blocks 20 are buckled and fixed in the notches 7 at two sides of the MOS 5 through elastic deformation of the material of the curved beams 19 to realize self-locking, and the MOS 5 is coated with heat-conducting adhesive on the surface to fix the device and increase the heat dissipation area, meanwhile, the cavities form convection channels to strengthen natural convection heat dissipation, the installation of the MOS 5 in the curved beams 19 arranged in pairs at the bottom of the cross beam 15, the installation of the heat dissipation support 11 in the positioning grooves 2 and the installation of the radiator machine body 21 on the front of the cross beam 15 are all connected through buckling, without the need for screw locking, which greatly improves the installation efficiency, at the same time, the welding positioning of the DBC4 in the positioning groove 2 through the limiting and positioning of the MOS 5 installation position improves the alignment accuracy of the MOS 5 and the DBC4 and the pad alignment qualification rate of the back pin 6 of the MOS 5 and the power plate 8; Finally, the heat dissipation support 11 is composed of the end plates 12 at two sides and the cross beam 15 in the middle, the heat dissipation fins 18 are arranged at equal intervals along the length direction at the top of the cross beam 15, the cavities between adjacent heat dissipation fins 18 form convection channels, the heat-conducting plates 16 extended at the back of the cross beam 15 expand the heat dissipation surface to the power plate 8 and the PCB 10, the impeller 25 driven by the micro motor 23 is installed in the front machine body 21 of the cross beam 15, the heat dissipation support 11 cooperates with the forced convection of the impeller 25, meanwhile, the heat-conducting plates 16 at the back of the heat dissipation support 11 expand the heat dissipation surface to the power plate 8 and the PCB 10 to form a composite heat dissipation system of conduction plus convection, the composite multi-path heat dissipation design principle effectively solves the problem of high interface thermal resistance between the MOS 5 and the DBC4 without affecting the overall height of the flat structure.

[0022] It should be noted that, in this text, the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, so that a process, method, article or apparatus that includes a list of elements not only includes those elements, but also includes other elements not explicitly listed, or inherent to such process, method, article or apparatus.

[0023] The principles and implementation manners of the present application are described by applying specific examples in this text, and the above example description is only for helping to understand the method of the present application and its core idea. The above is only the preferred implementation manner of the present application, and it should be noted that, due to the limitedness of the expression, there are objectively infinite specific structures, and for the ordinary skilled in the art, on the premise of not departing from the principle of the present application, a number of improvements, refinements or changes can be made, or the above technical features can be combined in a proper way; these improvements, refinements, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, shall be regarded as the protection scope of the present application.

Claims

1. An inverter tiled installation structure comprising a substrate (1), characterized in that, The substrate (1) is fixed with a positioning groove (2) around, and the inner wall of the positioning groove (2) is fixed with a flange (3), the inside of the positioning groove (2) is welded with a DBC (4), and the MOS (5) is adhered on the DBC (4) through a heat-conducting adhesive, the MOS (5) is provided with a power plate (8) on the top, and the power plate (8) is bolted on the connecting column around the substrate (1), the power plate (8) is fixed with a support column (9) at the end, and the PCB (10) is screwed on the support column (9).

2. The inverter tiling installation structure according to claim 1, wherein The MOS (5) extends with a pin (6) on the back, and the MOS (5) is welded and fixed with the power plate (8) through the pin (6).

3. The inverter tile mounting structure of claim 2, wherein, The MOS (5) is symmetrically provided with a notch (7) on both sides, and the MOS (5) is arranged side by side in the inside bottom end of the heat dissipation bracket (11).

4. The inverter tiling structure of claim 3, wherein, The end plate (12) is integrally fixed at both ends of the heat dissipation bracket (11), and the connecting clamping groove (13) is provided at the edge of the end plate (12), and the height of the connecting clamping groove (13) is higher than the opening top end of the positioning groove (2).

5. The inverter tile mounting structure of claim 4, wherein, The end plate (12) is integrally connected with the mounting buckle (14) at the bottom, and the end plate (12) is fixed with the flange (3) in the inner wall of the positioning groove (2) through the mounting buckle (14).

6. The inverter tile mounting structure of claim 5, wherein, The opposite surface of the end plate (12) is fixedly connected with a cross beam (15), and the back of the cross beam (15) integrally extends a heat-conducting sheet (16), the oblique surface of the heat-conducting sheet (16) is provided with an avoiding groove (17) corresponding to the back pin (6) of the corresponding MOS (5), and the heat-conducting sheet (16) is attached to the power plate (8) and the PCB (10) below to realize heat conduction.

7. The inverter tile mounting structure of claim 6, wherein, The top of the cross beam (15) is arranged with heat dissipation fins (18) at equal intervals along the length direction, and the cavities between adjacent heat dissipation fins (18) form convection channels.

8. The inverter tile mounting structure of claim 7, wherein, The cross beam (15) is provided with a curved beam (19) at the bottom, and the curved beam (19) is fixed with a clamping block (20) inside, and the curved beam (19) is buckled in the notch (7) on both sides of the MOS (5) through the elastic deformation of its own material to realize self-locking.

9. The inverter tile mounting structure of claim 8, wherein, The front of the cross beam (15) is provided with an organism (21), and the back of the organism (21) is fixedly connected with a connecting buckle (22) at both ends, the organism (21) is provided with openings at both ends, and the organism (21) is fixedly connected with the connecting buckle (22) at both ends and the connecting clamping groove (13) at the edge of the end plate (12).

10. The inverter tile mounting structure of claim 9, wherein, The organism (21) is provided with a micro motor (23), and the power supply connector (24) connected to the micro motor (23) controller is electrically connected to the corresponding module of the power plate (8), and the rotating end of the micro motor (23) is fixedly connected with an impeller (25).

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