SEMICONDUCTOR PACKAGE TEST APPARATUS USING Peltier ELEMENT
By combining Peltier elements and temperature compensation modules, the problem of temperature non-uniformity in semiconductor packaging testing is solved, achieving more reliable and accurate temperature control, which is suitable for semiconductor packaging testing with multi-layer stacked structures.
Patent Information
- Application Number
- CN202380095581.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-01-09
- Filing Date
- 2023-12-13
- Publication Date
- 2025-10-24
AI Technical Summary
In semiconductor packaging testing, existing technologies struggle to maintain temperature uniformity between layers, leading to inaccurate testing and poor reliability.
The semiconductor packaging test device using Peltier elements contacts the semiconductor package through a Peltier cavity unit. Combined with a temperature compensation module and a water-cooling jacket, it achieves precise temperature control of the upper and lower parts of the semiconductor package, reducing temperature differences.
It improves the reliability and accuracy of semiconductor packaging testing, ensures that temperature differences between layers are minimized, and adapts to a wider range of ambient temperatures.
Smart Images
Figure CN120835997A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present invention relates to a device for testing a semiconductor package, and more particularly, to a device for testing a semiconductor package according to temperature change using a Peltier element, and a method for adjusting a test temperature of a semiconductor package. BACKGROUND
[0002] A wafer that has undergone various semiconductor manufacturing processes contains hundreds of thousands of integrated circuit chips, and each chip is separated after its characteristics are measured and assembled into a single package. Through this process, a single semiconductor package is completed. The completed semiconductor package must be able to operate normally in any environment. That is, it must be able to operate normally not only at room temperature but also at low or high temperatures. However, some semiconductor packages do not operate or operate abnormally at low or high temperatures, and these semiconductor packages are classified as defective products.
[0003] Semiconductor packages classified as defective products need to undergo a defect analysis process to determine the cause or location of defects in the semiconductor package. At this time, in order to perform defect analysis, the same environment as when a defect occurs in the semiconductor package needs to be provided. Therefore, when performing such a test, the environmental temperature needs to be heated or cooled as necessary to the semiconductor package. SUMMARY
[0004] TECHNICAL PROBLEM
[0005] The present invention aims to solve these problems, and the object of the present invention is to ensure that the temperature of the entire semiconductor package as a test object is uniform. This is because, when a semiconductor package integrated into a final product is used in an external environment, the temperature of each layer of the semiconductor package does not vary much, and thus, it is necessary to keep the temperature difference between the layers small.
[0006] MEANS FOR SOLVING THE PROBLEM
[0007] To achieve the above object, the present invention provides a semiconductor package test device using a Peltier element including a Peltier cavity unit that contacts an upper portion of a semiconductor package with a thermoelectric block of a first Peltier block including a Peltier element to change the temperature of the upper portion of the semiconductor package, a socket guide portion that is located on a test board to guide the semiconductor package, and a pad portion that is located on the test board, an upper portion of the pad portion having an electrical connection portion that is coupled to an input / output terminal of a lower portion of the semiconductor package,
[0008] The Peltier cavity unit can include one or more temperature compensation modules positioned on a lower side of the Peltier cavity unit to contact a portion of the test board outside the socket guide when the thermoelectric blocks are combined with the semiconductor package to change a lower temperature of the semiconductor package, and a first water cooling jacket positioned on an upper portion of the first Peltier block to cool the first Peltier block.
[0009] The temperature compensation modules can include a first temperature compensation module fixed on a lower side of the Peltier cavity unit, and a second temperature compensation module fixed on another lower side of the Peltier cavity unit.
[0010] The first and second temperature compensation modules can be positioned outside the socket guide when contacting the test board.
[0011] The first temperature compensation module can include a second Peltier block to radiate cold or heat to a portion of the test board, a second water cooling jacket positioned on an upper portion of the Peltier block to cool the Peltier block, and a first heat transfer plate positioned on a lower portion of the Peltier block to contact the portion of the test board.
[0012] The semiconductor package test apparatus using a Peltier element according to the present application can further include a gasket provided between the Peltier cavity unit and the socket guide to seal the same.
[0013] The semiconductor package test apparatus using a Peltier element according to the present application can be configured such that the upper temperature of the semiconductor package is varied from -50°C to 150°C, and the internal temperature of the semiconductor package is varied from -40°C to 125°C.
[0014] Effects of the Invention
[0015] As described above, the semiconductor package test apparatus using a Peltier element according to one preferred embodiment of the present application minimizes a difference in internal interlayer temperature of a semiconductor package under test by controlling temperatures of both sides contacting the semiconductor package, thereby improving test reliability. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a schematic cross-sectional view of a structure of a conventional semiconductor package test apparatus.
[0017] Figure 2 is a schematic cross-sectional view of a semiconductor package test apparatus using a Peltier element according to an embodiment of the present application. DETAILED DESCRIPTION
[0018] To achieve the above object, there is provided a semiconductor package testing apparatus using a Peltier element including a Peltier cavity unit contacting an upper portion of a semiconductor package with a lower portion of a first Peltier block including a Peltier element to change a temperature of the upper portion of the semiconductor package, a socket guide portion located on a test board to guide the semiconductor package, and a pad portion located on the test board, an upper portion of the pad portion having an electrical connection portion coupled with input and output terminals of a lower portion of the semiconductor package,
[0019] The Peltier cavity unit can include one or more temperature compensation modules located at one side of a lower portion of the Peltier cavity unit to contact a portion of the test board outside the socket guide portion when the thermoelectric block is coupled with the semiconductor package to change a temperature of a lower portion of the semiconductor package, and a first water cooling jacket located at an upper portion of the first Peltier block to cool the first Peltier block.
[0020] The temperature compensation modules can include a first temperature compensation module fixed at one side of the lower portion of the Peltier cavity unit, and a second temperature compensation module fixed at the other side of the lower portion of the Peltier cavity unit.
[0021] The first and second temperature compensation modules can be located outside the socket guide portion when contacting the test board.
[0022] The first temperature compensation module can include a second Peltier block to radiate cold or heat to the portion of the test board, a second water cooling jacket located at an upper portion of the Peltier block to cool the Peltier block, and a first heat transfer plate located at a lower portion of the Peltier block to contact the portion of the test board.
[0023] The semiconductor package testing apparatus using a Peltier element can further include a gasket provided between the Peltier cavity unit and the socket guide portion to seal the same.
[0024] The semiconductor package testing apparatus using a Peltier element can be configured such that the changed temperature of the upper portion of the semiconductor package is -50°C to 150°C, and the internal temperature of the semiconductor package is -40°C to 125°C.
[0025] Embodiment
[0026] Hereinafter, preferred embodiments of the present application will be described in detail with reference to the accompanying drawings. In describing the present application, if it is considered that a detailed description of a known configuration or function will obscure the gist of the present application, the detailed description will be omitted. In addition, specific numerical values used to describe the embodiments of the present application are only examples.
[0027] Embodiments will be described in detail below with reference to the accompanying drawings. However, the scope of the present patent application is not limited or restricted by these embodiments. The same reference numerals in the drawings represent the same elements.
[0028] Figure 1 is a schematic cross-sectional view of the structure of a conventional semiconductor package testing apparatus.
[0029] The semiconductor package testing apparatus 100 can include a Peltier cavity unit 110 containing Peltier elements, a socket guide 150 on a testing plate 180 for guiding accurate positioning of a semiconductor package 160, a pad 170 on a lower portion of the semiconductor package 160 having an electrical connection for input and output of the semiconductor package 160 for determining whether the semiconductor package 160 produces accurate output in response to the input, the testing plate 180 on which the socket guide 150 and the pad 170 are placed, and a SUS plate 190 on a lower portion of the testing plate 190 made of stainless steel for supporting the Peltier cavity unit 110, the water cooling jacket 120, the Peltier block 130, the gasket 140, the socket guide 150, the semiconductor package 160, the pad 170, and the testing plate 180.
[0030] Also, the Peltier cavity unit 110 can include a water cooling jacket 120 on a heat dissipation side of a Peltier block 130 composed of one or more Peltier elements for cooling the Peltier block, a thermoelectric block 131 one side of which is combined with and fixed to the Peltier cavity unit 110 face-to-face with the Peltier block 130 and the other side of which is in face-to-face contact with a semiconductor package 160 as a testing object to enable heat transfer between the Peltier block 130 and the semiconductor package 160, and a gasket 140 provided between the Peltier cavity unit 110 and the socket guide 150 for sealing the thermoelectric block 131 when it is in contact with the semiconductor package 160.
[0031] Figure 2 is a schematic cross-sectional view of a semiconductor package testing apparatus using Peltier elements according to an embodiment of the present application.
[0032] The semiconductor package testing device 200 can include a Peltier cavity unit 210 containing a Peltier element, a socket guide 250 on a testing plate 280 for guiding accurate positioning of a semiconductor package 260, a pad portion 270 on a lower portion of the semiconductor package 260 having an electrical connection portion for input and output of the semiconductor package 260 for determining whether the semiconductor package 260 generates accurate output in response to input, the testing plate 280 on which the socket guide 250 and the pad portion 270 are placed, and a SUS plate 281 on a lower portion of the testing plate 290 made of stainless steel for supporting the Peltier cavity unit 210, a first water cooling jacket 220, a second Peltier block 230, a gasket 240, the socket guide 250, the semiconductor package 260, the pad portion 270, and the testing plate 280.
[0033] The Peltier cavity unit 210 can include a water cooling jacket 220 on a heat dissipation side of a first Peltier block 130 composed of one or more Peltier elements for cooling the Peltier block 230, a thermoelectric block 231 combined with the Peltier block 230 face-to-face on one side and fixed to the Peltier cavity unit 210, and in face-to-face contact with the semiconductor package 260 as a test object on the other side to enable heat transfer between the first Peltier block 230 and the semiconductor package 260, a gasket 240 provided between the Peltier cavity unit 210 and the socket guide 250 for sealing the thermoelectric block 231 when in contact with the semiconductor package 260, a first temperature compensation module 290 fixed to one side of the Peltier cavity unit 210 and in contact with one side of the testing plate 280 while being spaced apart from the outside of the socket guide 250 when the semiconductor package 260 is pressed by the thermoelectric block 231, and a second temperature compensation module 295 fixed to the other side of the Peltier cavity unit 210 and in contact with the other side of the testing plate 280 while being spaced apart from the outside of the socket guide 250 when the semiconductor package 260 is pressed by the thermoelectric block 231.
[0034] In an embodiment of the present application, the semiconductor package 260 is loaded into the inside of the testing chamber, the temperature of the Peltier block 130 inside the testing chamber is varied in the range of -50°C to 150°C, and then a current is applied to the semiconductor package 260. Thus, the internal temperature of the semiconductor package 260 can be maintained at -40°C to 125°C, which is not significantly different from the external temperature compared to the conventional method.
[0035] This current is applied when an electrical connection portion (not shown) formed on the pad portion 270 is connected to the input and output terminals of the semiconductor package 260. In this case, the input and output terminals of the semiconductor package 260 can be formed into a ball shape. The electrical connection portion can be recessed into the pad portion 270 so that the ball can be inserted therein, and the thermoelectric block 231 can be coupled to the upper surface of the semiconductor package 260 by pressing the thermoelectric block 231 against the upper surface of the semiconductor package 260 in a face-to-face manner.
[0036] The first Peltier block 230 can be composed of one or more Peltier elements, generating heat or cooling using the Peltier effect. The Peltier effect describes the phenomenon whereby when a potential difference is applied between two ends of an object, heat flows with the current, creating a temperature difference between the two ends. In other words, when current is applied, a temperature difference is generated, causing one end to heat up while the other end cools down.
[0037] like Figure 2 As shown, each Peltier element constituting the first Peltier block 230 may be equipped with a first electrode and a second electrode, and current may be supplied to the first electrode and the second electrode via an external interface. By swapping the polarity of the first electrode and the second electrode, heat or cold may be released downward (not shown in the figure).
[0038] like Figure 2 As shown, the lower portion of each Peltier element is cooled, while the upper portion is heated. By configuring the Peltier elements in multiple stages, the thermoelectric block 231 can be further cooled. Heat is generated in the upper portion of the Peltier elements, which is then discharged to the exterior of the Peltier chamber unit 210 via cooling water flowing into the water-cooling jacket 220, thereby cooling the heat.
[0039] Figure 2 Only the heat dissipation at the top of the Peltier element is shown. If the polarity of the first and second electrodes is reversed, the top of the Peltier element generates cooling energy, while the bottom generates heat. This heat is then transferred to the semiconductor package 260 via the thermoelectric block 231. At this point, because the temperature of the cooling water in the water-cooling jacket 220 is higher than that of the top of the Peltier element, the cooling energy at the top of the Peltier element is also discharged to the outside of the Peltier chamber unit 210.
[0040] Furthermore, the socket guides 250 secure the position of the semiconductor package 260 within the test chamber. There are at least two pairs of socket guides 250 that guide the four sides of the semiconductor package 260 and ensure that the electrical connections formed on the pads 270 are properly connected to the semiconductor package 260.
[0041] The semiconductor package testing device using the Peltier element according to an embodiment of the present invention is different from the conventional technology in that a first temperature compensation module 290 and a second temperature compensation module 295 may be further provided on the lower outer periphery of the Peltier chamber unit.
[0042] With the advancement of information processing technology, there is an increasing demand for higher performance semiconductors, and the current trend in technology development is to improve semiconductor performance by stacking multiple layers of packaging structures in the same area. In particular, for memory semiconductors, multi-layer stacked NAND flash memory is an indicator of technological prowess, and for non-memory semiconductors, 3D semiconductors such as FinFet or GAA (Gate-All-Around) are being continuously developed.
[0043] Also, as the amount of data per semiconductor package processing increases, more reliable performance testing is required, and such semiconductor reliability testing accounts for a significant proportion of semiconductor post-processing.
[0044] The conventional temperature test using a Peltier element is performed by heating or cooling to a critical temperature by directly contacting the upper surface of the semiconductor. However, in this case, a temperature difference occurs between the upper portion of the semiconductor close to the Peltier element and the lower portion close to the test board. To solve this problem, an embodiment of the present invention constructs a new temperature compensation module using the test board located at the lower portion of the semiconductor for additional heating and cooling, thereby minimizing the test temperature difference between the upper and lower layers of the semiconductor, thereby further improving the reliability of the temperature test.
[0045] The first temperature compensation module 290 according to an embodiment of the present invention can be configured with a second water cooling jacket 291 in which cooling water can flow, a second Peltier block 292 located below the second water cooling jacket 291 and composed of one or more Peltier elements, which supplies cold from the lower portion thereof to the test board 280 when supplying cold to the semiconductor package 260 from the thermoelectric block 231, and supplies heat from the lower portion thereof to the test board 280 when supplying heat to the semiconductor package 260 from the thermoelectric block 231, and a first heat transfer plate 293 located below the second Peltier block 292 and in contact with the test board 280 to transfer cold or heat emitted from the second Peltier block 292 to the test board 280.
[0046] This first temperature compensation module 290 is fixed to one side of the Peltier cavity unit 210, and when the thermoelectric block 231 applies pressure to the upper surface of the semiconductor package 260 with a certain pressure so that the electrical connection portion of the pad portion 270 is bonded to the lower surface of the semiconductor package 260, the first heat transfer plate 293 of the first temperature compensation module 290 can operate in close contact with the test board 280.
[0047] As previously described, when cold is applied to the semiconductor package 260 from the thermoelectric block 231 coupled to the upper portion of the semiconductor package 260, the temperature of the lower portion of the semiconductor package 260 can be higher than that of the upper portion of the semiconductor package 260. At this time, if cold is also emitted from the lower portion of the second Peltier block 292 provided in the first temperature compensation module 290 and transferred to the test board 280, the cold is transferred to the lower portion of the semiconductor package 260 through the test board 280 and the SUS plate 281 thereunder, thereby reducing the temperature deviation between the upper and lower portions of the semiconductor package 260, thereby achieving more reliable temperature testing. At this time, heat is emitted from the upper portion of the second Peltier block 292, and the cooling water circulating in the second water cooling jacket 291 discharges the heat to the outside of the Peltier cavity unit 210.
[0048] Conversely, when heat is applied to the semiconductor package 260 from the thermoelectric block 231 coupled to the upper portion of the semiconductor package 260, the temperature of the lower portion of the semiconductor package 260 can be lower than that of the upper portion of the semiconductor package 260. At this time, if heat is also emitted from the lower portion of the second Peltier block 292 provided in the first temperature compensation module 290 and transferred to the test board 280, the heat is transferred to the lower portion of the semiconductor package 260 through the test board 280 and the SUS plate 281 thereunder, thereby reducing the temperature deviation between the upper and lower portions of the semiconductor package 260, thereby achieving more reliable temperature testing. At this time, cold is emitted from the upper portion of the second Peltier block 292, and the second water cooling jacket 291 transfers the cold to the outside of the Peltier cavity unit 210.
[0049] The first temperature compensation module 290 is fixed to one side of the lower portion of the Peltier cavity unit 210 so as to move together at the same time when the Peltier cavity unit 210 is opened and closed.
[0050] The second temperature compensation module 295 according to an embodiment of the present application can be configured with a third water cooling jacket 296 in which cooling water can flow, a third Peltier block 297 located below the third water cooling jacket 296 and composed of one or more Peltier elements, which supplies cold from the lower portion thereof to the test board 280 when cold is supplied to the semiconductor package 260 from the thermoelectric block 231, and which supplies heat from the lower portion thereof to the test board 280 when heat is supplied to the semiconductor package 260 from the thermoelectric block 231, and a second heat transfer plate 298 located below the third Peltier block 297 and in contact with the test board 280 to transfer cold or heat emitted from the third Peltier block 297 to the test board 280.
[0051] The second temperature compensation module 290 is fixed to the other lower side of the Peltier cavity unit 210, and when the thermoelectric block 231 applies pressure to the upper surface of the semiconductor package 260 with a certain pressure so that the electrical connection part of the pad part 270 is combined to the lower surface of the semiconductor package 260, the second heat transfer plate 298 of the second temperature compensation module 295 can work in close contact with the test board 280.
[0052] As previously described, when cold is applied to the semiconductor package 260 from the thermoelectric block 231 combined to the upper portion of the semiconductor package 260, the temperature of the lower portion of the semiconductor package 260 can be higher than that of the upper portion of the semiconductor package 260. At this time, if cold is also emitted from the lower portion of the third Peltier block 297 provided in the second temperature compensation module 295 and transferred to the test board 280, the cold is transferred to the lower portion of the semiconductor package 260 through the test board 280 and the SUS plate 281 thereunder, thereby reducing the temperature deviation between the upper and lower portions of the semiconductor package 260, thereby achieving more reliable temperature testing. At this time, heat is emitted from the upper portion of the third Peltier block 297, and the cooling water circulating in the third water cooling jacket 296 discharges the heat to the outside of the Peltier cavity unit 210.
[0053] On the contrary, when heat is applied to the semiconductor package 260 from the thermoelectric block 231 combined to the upper portion of the semiconductor package 260, the temperature of the lower portion of the semiconductor package 260 can be lower than that of the upper portion of the semiconductor package 260. At this time, if heat is also emitted from the lower portion of the third Peltier block 297 provided in the second temperature compensation module 295 and transferred to the test board 280, the heat is transferred to the lower portion of the semiconductor package 260 through the test board 280 and the SUS plate 281 thereunder, thereby reducing the temperature deviation between the upper and lower portions of the semiconductor package 260, thereby achieving more reliable temperature testing. At this time, cold is emitted from the upper portion of the third Peltier block 292, and the third water cooling jacket 291 transfers the cold to the outside of the Peltier cavity unit 210.
[0054] The second Peltier block 292 and the third Peltier block 297 can each be composed of one or more Peltier elements, which generate heat or cold using the Peltier effect. The Peltier effect refers to a phenomenon in which heat is generated along with the flow of electric current when a potential difference is applied to both ends of an object, thereby generating a temperature difference between the both ends. In other words, when electric current is applied, a temperature difference is generated, which heats one end and cools the other end.
[0055] As shown in FIG. 2, the second Peltier block 292 and the third Peltier block 297 can be provided in the second temperature compensation module 290, and the second temperature compensation module 290 can be fixed to the other lower side of the Peltier cavity unit 210. Figure 2 As shown in FIG. 2, the second Peltier block 292 and the third Peltier block 297 can be provided in the second temperature compensation module 290, and the second temperature compensation module 290 can be fixed to the other lower side of the Peltier cavity unit 210.
[0056] A second temperature compensation module 295 is fixed to the other side of the lower portion of the Peltier cavity unit 210 and moves simultaneously with the Peltier cavity unit 210 when the Peltier cavity unit 210 is opened and closed.
[0057] Although the present application has been described and illustrated with respect to the specific embodiments, it should be understood by those skilled in the art that various changes in form and details can be made without departing from the technical spirit of the present application defined by the following claims.
[0058] Industrial applicability
[0059] The present application provides a semiconductor package testing device using a Peltier element, including a Peltier cavity unit which contacts a thermoelectric block including a first Peltier block of a Peltier element with an upper portion of a semiconductor package to change the temperature of the upper portion of the semiconductor package, a socket guide portion which is provided on a testing board to guide the semiconductor package, and a pad portion which is provided on the testing board, the pad portion having an electrical connection portion which is coupled to an input / output terminal of a lower portion of the semiconductor package.
[0060] The Peltier cavity unit can include one or more temperature compensation modules which are provided on one side of the lower portion of the Peltier cavity unit and contact a portion of the testing board on the outside of the socket guide portion to change the temperature of the lower portion of the semiconductor package when the thermoelectric block is coupled to the semiconductor package, and a first water cooling jacket which is provided on the upper portion of the first Peltier block and cools the first Peltier block.
Claims
1. A semiconductor package testing apparatus using a Peltier element, comprising: a Peltier cavity unit contacting an upper portion of a semiconductor package with a lower portion of a first Peltier block including a Peltier element to change a temperature of the upper portion of the semiconductor package; a socket guide provided on a test board to guide the semiconductor package; and a pad provided on the test board, an upper portion of the pad having an electrical connection portion coupled with input and output terminals of a lower portion of the semiconductor package, wherein the Peltier cavity unit comprises: one or more temperature compensation modules provided on one side of a lower portion of the Peltier cavity unit to contact a portion of the test board outside of the socket guide when the lower portion of the Peltier block is coupled with the semiconductor package to change a temperature of a lower portion of the semiconductor package; and a first water cooling jacket provided on and cooling an upper portion of the first Peltier block. 2.The semiconductor package testing apparatus using the Peltier element according to claim 1, wherein: the temperature compensation modules comprise: a first temperature compensation module fixed on one side of the lower portion of the Peltier cavity unit; and a second temperature compensation module fixed on the other side of the lower portion of the Peltier cavity unit, the first and second temperature compensation modules are provided outside of the socket guide when contacting the test board. the first temperature compensation module comprises:
3. The semiconductor package testing apparatus using a Peltier element according to claim 2, wherein a second Peltier block to radiate cold or heat to the portion of the test board; a second water cooling jacket provided on and cooling an upper portion of the Peltier block; and a first heat transfer plate provided on a lower portion of the Peltier block to contact the portion of the test board. 4.The semiconductor package testing apparatus using the Peltier element according to claim 1, further comprising: a gasket provided between the Peltier cavity unit and the socket guide to seal them. 5.The semiconductor package testing apparatus using the Peltier element according to claim 2, wherein: the second temperature compensation module comprises: a third Peltier block to radiate cold or heat to the portion of the test board; a third water cooling jacket provided on and cooling an upper portion of the Peltier block; and a second heat transfer plate provided on a lower portion of the Peltier block to contact the portion of the test board.