High-photosensitive resin for PCB (printed circuit board) circuit ink and preparation method of high-photosensitive resin

By leveraging the synergistic effect of novel acrylate monomers and composite photoinitiators, a uniform cross-linked network is constructed, solving the problems of insufficient photosensitivity and uneven cross-linked network in traditional photosensitive resins in high-density interconnect technology. This achieves high photosensitivity, excellent chemical resistance, and superior thermomechanical properties, meeting the needs of sub-5 μm level circuit manufacturing.

CN120842476APending Publication Date: 2025-10-28ZHEJIANG CHUANGYING NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202511210324.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-27
Publication Date
2025-10-28

AI Technical Summary

Technical Problem

Traditional photosensitive resins suffer from insufficient photosensitivity and uneven cross-linking networks in high-density interconnect technology, failing to meet the requirements of sub-5 μm level circuit manufacturing. Furthermore, existing optimization schemes have not effectively addressed the insufficient synergistic effect among the components of the material system.

Method used

By employing the synergistic effect of novel acrylate monomers and composite photoinitiators, a uniform crosslinking network is constructed. By optimizing polymerization process parameters, molecular weight distribution is ensured and resin stability is enhanced.

Benefits of technology

It achieves high photosensitivity, excellent chemical resistance and superior thermomechanical properties, meeting the material requirements of high-density interconnect technology and ensuring the reliability and accurate replication of circuit boards in complex environments.

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Abstract

The invention belongs to the technical field of high polymer materials, and particularly relates to high photosensitive resin for PCB circuit ink and a preparation method of the high photosensitive resin. The method comprises the following steps: 1) uniformly mixing an ester compound, an acid ester compound and polyphenol in proportion to prepare a premixed monomer; 2) mixing the composite photoinitiator and the premixed monomer in proportion, and stirring to prepare a precursor; 3) uniformly mixing the precursor and a carboxylic acid compound in proportion, and stirring to prepare an optimized base material; and 4) deaerating the optimized base material under reduced pressure, and filtering to prepare the high-photosensitive resin. According to the invention, a novel PCB circuit ink photosensitive resin system with high sensitivity, high resolution, excellent chemical resistance and excellent thermal mechanical properties is successfully developed through a multi-dimensional collaborative strategy of molecular structure design, photo-initiation system optimization, cross-linked network construction and process parameter control; and a key material support is provided for sustainable development of a high-density interconnection technology.
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