Optical module high and low temperature testing device

Abstract

The invention discloses an optical module high and low temperature testing device, and relates to the field of optical module high and low temperature testing. A lower die holder; a plurality of groups of temperature sensors are transversely arranged, and the temperature sensors are used for measuring the temperature of the optical module in a double-sided manner; the temperature sensor comprises a partition plate, a third air guide opening is formed in the middle of the supporting plate, temperature measuring blocks are symmetrically arranged on the surface of the supporting plate relative to the third air guide opening, a set of thermosensitive probes are embedded into each set of temperature measuring blocks, the two ends of each thermosensitive probe are exposed out of the corresponding temperature measuring block, and the outer ends of the thermosensitive probes are connected with wires. Data connectors are arranged at the two corners of the inner side of the surface of the partition plate, and the outer ends of the wires are electrically connected with the data connectors. An overturning assembly; the temperature sensor is provided with two groups of temperature measuring blocks, so that two temperature measuring stations are formed, and the overturning assembly is additionally arranged and can drive the optical module to rotate, so that after one side is tested, the other side faces downwards for testing, and double-side testing of the optical module is realized.

Description

Technical Field

[0001] This invention relates to the field of high and low temperature testing technology for optical modules, specifically a high and low temperature testing device for optical modules. Background Technology

[0002] In the field of optical communication, the performance stability and reliability of optical modules are key indicators, directly affecting the normal operation of the entire communication system. To ensure that optical modules can operate reliably in various practical application environments (such as different geographical climates or internal temperature ranges of the equipment), rigorous temperature cycling tests (temperature cycling tests or high and low temperature tests) are essential. The core purpose of this test is to accurately simulate the different temperature environments that optical modules may encounter. By actively changing their operating temperature, it comprehensively examines the stability and tolerance of various performance parameters (such as optical power, extinction ratio, receiver sensitivity, bit error rate, etc.) under temperature variation conditions, thereby assessing their long-term operational reliability in diverse practical application scenarios.

[0003] Currently, common optical module temperature rise and fall testing systems typically use a TEC (Thermal Design Temperature) chip as the core cooling and heating element. A typical system architecture involves mounting the TEC chip in a lower enclosure and placing the optical module under test directly on top of it. This design means that temperature changes are primarily introduced or exported through the bottom surface of the optical module.

[0004] However, this traditional bottom-contact temperature control solution has an inherent drawback: because the heat conduction path is mainly concentrated on the bottom surface of the optical module, the rate of temperature change and temperature gradient on the bottom surface are significantly greater than those on the top surface during heating and cooling. Current technologies typically only place temperature monitoring points on the bottom of the optical module and determine results based on the temperature data from this point. Therefore, single-sided temperature testing results are not comprehensive enough, and measurement accuracy needs improvement. Summary of the Invention

[0005] The purpose of this invention is to provide a high and low temperature testing device for optical modules to solve the problems raised in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high and low temperature testing device for optical modules, characterized in that it comprises: The lower housing has a hinged lid at the top; The lower mold base is located inside the lower housing. A liquid cooling component is installed at the bottom of the lower mold base, and multiple longitudinally distributed first air guide ports are opened on the surface of the lower mold base. The temperature sensor has multiple sets arranged laterally and is used to measure the temperature of the optical module from both sides. The temperature sensor includes a partition, and a partition is provided above the first air inlet of each set. A second air inlet is opened in the middle of the surface of the partition. The surface of the partition is symmetrically provided with pads about the second air inlet. A support plate is provided on the top of the two sets of pads. A third air inlet is opened in the middle of the support plate. Temperature measuring blocks are symmetrically provided on the surface of the support plate about the third air inlet. A set of thermal probes is embedded inside each set of temperature measuring blocks. The two ends of the thermal probes are exposed outside the temperature measuring blocks. The outer ends of the thermal probes are connected to wires. Data connectors are provided at the two corners on the inner side of the partition surface. The outer ends of the wires are electrically connected to the data connectors. The flipping component is horizontally positioned in the middle of the surface of the lower mold base. The flipping component is located on one side of multiple temperature sensors. The flipping component is used to flip the optical module from one set of temperature measuring blocks to another set of temperature measuring blocks to change the surface to be measured of the optical module. The temperature control unit includes multiple housing boxes, which are placed inside the lower mold base and above the liquid cooling component. The top and bottom of the housing boxes are open structures, and the side walls of the housing boxes are provided with air outlet slots. The inner wall of the housing box is equipped with a position adjustment component, which is connected to the TEC plate so that the cold and hot sides of the TEC plate face up alternately. The TEC plate is placed in the housing box to perform cooling or heating tests on the optical module. The bottom opening of the housing box is provided with a louvered sealing window.

[0007] Preferably, the temperature measuring block includes a lower base, the outer wall of which is covered with a plastic shell, a storage groove is formed on the top surface of the lower base, and a heat-conducting block is covered inside the storage groove and positioned by screws; the probe includes a first probe and a second probe, the first probe extends into the lower base from the outer wall to collect the temperature of the optical module, and the second probe penetrates the lower base to collect the ambient temperature.

[0008] Preferably, the flipping assembly includes a horizontal plate and a docking cover. The horizontal plate is vertically disposed in the middle of the surface of the lower housing. Multiple temperature sensors are placed on one side of the horizontal plate. The horizontal plate is located at the top center of the first air vent. A flipping rod is vertically disposed on the side wall of the docking cover. A flipping shaft is vertically disposed at the inner end of the flipping rod. The flipping shaft is rotatably disposed inside the horizontal plate. A first driven gear is disposed on the outer wall of the flipping shaft. A first rack is horizontally slidably mounted on the side of the horizontal plate. The first rack meshes with each set of first driven gears. The end of the first rack is connected to a first drive rod. Each set of trays corresponds to a set of docking covers. The end of the optical module is inserted into the docking cover.

[0009] Preferably, the inside of the box cover is provided with a pressing unit, which includes an upper mold base, a second screw, and a guide rod. The second screw and the guide rod are symmetrically arranged on both sides of the inside of the box cover. The upper mold base is vertically slidably disposed inside the box cover. One end of the upper mold base is connected to the second screw, which is connected to a third motor. The other end of the upper mold base is connected to the guide rod. The bottom surface of the upper mold base is provided with a pressing block. When the box cover is closed, the pressing block presses down on the optical module.

[0010] Preferably, the system also includes an air guide assembly, which includes an air outlet pipe and a rubber sealing block. Each set of air outlet pipes has an air outlet pipe on its outer side wall. The bottom end of the air outlet pipe is an open structure. The top of the air outlet pipe is connected to the receiving box through an air outlet groove. The rubber sealing block is slidably placed in the air outlet groove. The interior of the rubber sealing block has a series groove for connecting the air outlet pipe and the receiving box. The temperature control unit includes the following modes: In the high-temperature test mode, the TEC plates are arranged horizontally with the hot side facing up and the cold side facing down. The cold air at the bottom of the TEC plates is conducted to the liquid cooling component through the sealed window, so that the liquid cooling component stores cold. When switching modes, the TEC sheet is placed at an angle inside the housing with the hot side facing up and the cold side facing down. The sealing window is closed, and the TEC sheet divides the housing into an upper chamber and a lower chamber. The hot air from the top of the lower mold base is discharged along the upper chamber, the lower chamber, and the air outlet pipe. The hot air first exchanges heat in the lower chamber and then contacts the liquid cooling component for heat exchange. In the low-temperature test mode, the TEC chips are arranged horizontally with the cold side facing up and the hot side facing down. The sealing window is opened, and the hot air at the bottom of the TEC chip comes into contact with the liquid cooling component for heat exchange.

[0011] Preferably, the position adjustment component includes a first slider and a second slider. The inner ends of the receiving box are symmetrically provided with a first vertical sliding groove and a second vertical sliding groove. The first slider is vertically slidably embedded in the inner end of the first vertical sliding groove. A first screw is vertically provided in the inner end of the first vertical sliding groove. The first slider is threadedly fitted onto the outer wall of the first screw. The second slider is vertically slidably embedded in the inner end of the second vertical sliding groove. The end of the first screw is connected to a first motor. A second motor for driving the TEC plate to flip is provided in the second slider.

[0012] Preferably, the position adjustment component further includes a rectangular protective frame, with a TEC plate in the center of the inner part of the protective frame, symmetrically arranged pivots on both sides of the short side of the protective frame, and a first conductive post flush with the long side of the protective frame. The inner wall of the receiving box is provided with a second conductive post that mates with the first conductive post. A rubber ring is provided at the top of the inner wall of the receiving box, and the rubber ring mates with the top surface of the protective frame.

[0013] Preferably, each rotating part of the sealing window is provided with a second driven gear, each set of second driven gears meshes with a second rack, the second rack is connected to a second drive rod, and the second drive rod is located on the outer wall of the receiving box; An operation window is provided on the side wall of the air outlet duct. One end of the rubber sealing block has a chamfered top structure, and the other end of the rubber sealing block has an inner baffle. One end of the inner baffle is connected to a linkage rod, which slides through the operation window and is connected to a second rack at its end.

[0014] Preferably, the liquid cooling component includes a heat exchange copper plate, which is placed in the cavity at the bottom of the lower mold base, at the bottom of the receiving box and the air outlet pipe, and the surface of the heat exchange copper plate is provided with multiple sets of laterally extending liquid storage pipes.

[0015] Preferably, the side of the lower mold base is connected to multiple sets of side tubes, which extend horizontally to the back of the lower housing; the inside of the side tubes is equipped with exhaust fans, and the ends of the side tubes are equipped with torsion spring hinged sealing plates; the side tubes are used to discharge hot air and condensate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The temperature sensor of the present invention has two sets of temperature measuring blocks, thus forming two temperature measuring stations, and a flipping component is added. The flipping component can drive the optical module to rotate, so that after one side is tested, the other side is tested downwards, realizing double-sided testing of the optical module. The temperature measuring block of this invention is designed with only the top part being a heat-conducting block, while the main body is made of engineering plastic with poor thermal conductivity. This reduces the impact of ambient temperature in other areas on the thermal probe. The heat-conducting block can serve as a heat-conducting structure, effectively transferring the temperature of the optical module to the thermal probe. The heat-conducting block can also provide impact protection for the thermal probe. When it is necessary to maintain the thermal probe, the heat-conducting block can be removed. The present invention designs a thermistor consisting of a first probe and a second probe. The first probe is used to monitor the internal temperature of the substrate, and the second probe is used to monitor the ambient temperature. The two temperature values ​​are compared to improve the accuracy of temperature testing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the high and low temperature testing device for optical modules of the present invention; Figure 2 This is a schematic diagram of the top view cross-sectional structure of the lower box body of the present invention; Figure 3 This is a schematic diagram of the side cross-sectional structure of the box cover of the present invention; Figure 4 This is a schematic diagram of the overall structure of the lower mold base of the present invention; Figure 5 This is a schematic diagram of the flip component structure of the present invention; Figure 6 This is a schematic diagram of the temperature sensor structure of the present invention; Figure 7 This is a schematic diagram of the side cross-sectional structure of the temperature sensor of the present invention; Figure 8This is a schematic diagram of the distribution structure of the first and second probes of the present invention; Figure 9 This is a schematic diagram of the overall structure of the housing and the air outlet pipe of the present invention; Figure 10 This is a top view cross-sectional diagram of the housing and air outlet pipe of the present invention; Figure 11 This is a schematic diagram of the protective frame connection structure of the present invention; Figure 12 This is a schematic diagram of the high and low temperature test state structure of the present invention.

[0018] Figure 13 This is a schematic diagram of the working state structure of the switching mode of the present invention.

[0019] Figure 14 This is a schematic diagram of the liquid cooling component structure of the present invention.

[0020] Figure label: 100. Lower housing; 110. Housing cover; 120. Lower pressing unit; 121. Upper mold base; 122. Pressing block; 123. Third motor; 124. Second screw; 125. Guide rod. 200. Lower mold base; 210. First air vent. 300. Temperature sensor; 310. Partition plate; 311. Second vent; 320. Pad; 330. Support plate; 331. Third vent; 340. Temperature measuring block; 341. Lower substrate; 342. Storage tank; 343. Heat-conducting block; 344. Plastic housing; 350. Thermistor; 351. First probe; 352. Second probe; 360. Wire; 370. Data connector. 400, Optical module 500. Flipping assembly; 510. Horizontal plate; 520. Docking cover; 530. Flipping rod; 540. Flipping shaft; 541. First driven gear; 550. First rack; 560. First drive rod. 600. Liquid cooling component; 610. Heat exchange copper plate; 620. Liquid storage tube; 630. Side round tube; 640. Exhaust fan; 650. Sealing plate. 700. Temperature control unit; 710. Receiving box; 711. First vertical slide groove; 712. Second vertical slide groove; 713. Air outlet duct; 714. Rubber ring; 715. Second conductive post; 716. Upper chamber; 717. Lower chamber; 720. Position adjustment component; 721. First slider; 722. First screw; 723. First motor; 724. Second slider; 725. Second motor; 730. Protective frame; 731. Rotating shaft; 732. First conductive post; 740. TEC plate; 750. Sealing window; 751. Second driven gear; 752. Second rack; 753. Second drive rod. 800. Air guide assembly; 810. Air outlet duct; 811. Operation window; 820. Inner baffle; 830. Rubber sealing block; 831. Series groove; 840. Linkage rod. Detailed Implementation

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example: This invention provides a technical solution for a high and low temperature testing device for optical modules, such as... Figures 1-14 As shown, it includes: a lower housing 1100, the top of which is hinged to a housing cover 110; The lower mold base 200 is placed inside the lower housing 1100. A liquid cooling component 600 is installed at the bottom of the lower mold base 200. Multiple longitudinally distributed first air guide ports 210 are opened on the surface of the lower mold base 200. Temperature sensor 300, which is arranged in multiple groups laterally, is used to measure the temperature of the optical module from both sides. Temperature sensor 300 includes partition plate 310. Each group of first air inlets 210 is provided with a partition plate 310 above it. A second air inlet 311 is opened in the middle of the surface of the partition plate 310. The surface of the partition plate 310 is symmetrically provided with pads 320 about the second air inlets 311. The top of the two groups of pads 320 is provided with a support plate 330. A third air inlet 331 is opened in the middle of the support plate 330. The surface of the support plate 330 is symmetrically provided with temperature measuring blocks 340 about the third air inlets 331. Each group of temperature measuring blocks 340 is embedded with a set of thermal probes 350. The two ends of the thermal probes 350 are exposed outside the temperature measuring blocks 340. The outer ends of the thermal probes 350 are connected to wires 360. Data connectors 370 are provided at the two corners on the inner side of the surface of the partition plate 310. The outer ends of the wires 360 are electrically connected to the data connectors 370. The flipping component 500 is horizontally disposed in the middle of the surface of the lower mold base 200. The flipping component 500 is disposed on one side of the multiple temperature sensors 300. The flipping component 500 is used to flip the optical module from one set of temperature measuring blocks 340 to another set of temperature measuring blocks 340 to change the test surface of the optical module. The temperature control unit 700 includes multiple housing boxes 710, which are placed inside the lower mold base 200 and above the liquid cooling component 600. The top and bottom of the housing boxes 710 are open structures, and the side walls of the housing boxes 710 are provided with air outlet slots 713. The inner wall of the housing box 710 is equipped with a position adjustment component 720, which is connected to the TEC plate 740 so that the cold side and the hot side of the TEC plate 740 alternately face upwards. The TEC plate 740 is placed inside the housing box 710 to perform cooling or heating tests on the optical module. The bottom opening of the housing box 710 is provided with a louvered sealing window 750.

[0023] The temperature measuring block 340 includes a lower base 341, the outer wall of which is covered with a plastic shell 344. A storage groove 342 is provided on the top surface of the lower base, and a heat-conducting block 343 is covered inside the storage groove. The heat-conducting block is positioned by screws. The thermal probe 350 includes a first probe 351 and a second probe 352. The first probe extends from the outer wall into the lower base to collect the temperature of the optical module, and the second probe penetrates the lower base to collect the ambient temperature.

[0024] In the above scheme: 1. The temperature sensor 300 has two sets of temperature measuring blocks 340, thus forming two temperature measuring stations. A flipping component 500 is added, which can drive the optical module to rotate, so that after one side is tested, the other side is tested downwards, realizing double-sided testing of the optical module. 2. The temperature measuring block 340 is designed with only the top as a heat-conducting block. The heat-conducting block is made of copper, while the main body is made of engineering plastic with poor thermal conductivity. This reduces the impact of ambient temperature in other areas on the thermal probe 350. The heat-conducting block can serve as a heat-conducting structure to effectively transfer the temperature of the optical module to the thermal probe. The heat-conducting block can also protect the thermal probe 350 from impact. When it is necessary to maintain the thermal probe 350, the heat-conducting block can be removed. 3. The thermal probe is designed to be divided into a first probe and a second probe. The first probe is used to monitor the internal temperature of the substrate, and the second probe is used to monitor the ambient temperature. The two temperature values ​​are compared to improve the accuracy of temperature testing.

[0025] 4. A liquid cooling component 600 is arranged at the bottom of the lower mold base 200. The liquid cooling component 600 can exchange heat, thereby reducing the heat of the box and dissipating the working heat of the TEC plate 740. 5. The position adjustment component 720 can control the TEC plate 740 to flip, so that one device can complete both cooling and heating without the need for relocation.

[0026] In this embodiment, the flipping assembly 500 includes a horizontal plate 510 and a docking cover 520. The horizontal plate 510 is vertically disposed in the middle of the surface of the lower housing 1100. Multiple sets of temperature sensors 300 are placed on one side of the horizontal plate 510. The horizontal plate 510 is located at the top of the middle of the first air vent 210. A flipping rod 530 is vertically disposed on the side wall of the docking cover 520. A flipping shaft 540 is vertically disposed at the inner end of the flipping rod 530. The flipping shaft 540 is rotatably disposed inside the horizontal plate 510. A first driven gear 541 is disposed on the outer wall of the flipping shaft 540. A first rack 550 is horizontally slidably mounted on the side of the horizontal plate 510. The first rack 550 is meshed with each set of first driven gears 541. The end of the first rack 550 is connected to a first drive rod 560. Each set of support plates 330 corresponds to a set of docking covers 520. The end of the optical module is inserted into the docking cover 520.

[0027] In the above scheme: The optical module is placed horizontally on the temperature measuring block 340. The end of the optical module is inserted into the docking cover 520. The inner wall of the docking cover 520 is provided with a rubber ring to perform interference positioning on the optical module. Both ends of the docking cover 520 are open, so that hot and cold air can be conducted to the docking part at the end of the optical module. During the flipping process, the first drive rod 560 drives the first rack 550 to translate, and the first rack 550 drives multiple sets of first driven gears 541 to rotate, thereby causing the flipping shaft 540 to rotate. The flipping shaft 540 drives the docking cover 520 to flip upward 180° through the flipping rod 530. In this way, the optical module is switched and placed on another set of temperature measuring blocks 340343, realizing the optical module face-changing. At the same time, a set of first racks 550 can drive multiple sets of first driven gears 541 to rotate, thereby enabling multiple sets of docking covers 520 to rotate by translating a set of first racks 550.

[0028] In this embodiment, the inside of the cover 110 is provided with a pressing unit 120. The pressing unit 120 includes an upper mold base 121, a second screw 124, and a guide rod 125. The second screw 124 and the guide rod 125 are symmetrically arranged on both sides of the inside of the cover 110. The upper mold base 121 is vertically slidably disposed inside the cover 110. One end of the upper mold base 121 is connected to the second screw 124, and the second screw 124 is connected to the third motor 123. The other end of the upper mold base 121 is connected to the guide rod 125. The bottom surface of the upper mold base 121 is provided with a pressing block 122. When the cover 110 is closed, the pressing block 122 presses down on the optical module 400.

[0029] In the above scheme: 1. The pressure block 122 can press down on the top surface of the positioning optical module to ensure the stability of the optical module during testing; 2. When the flipping component 500 needs to drive the optical module to flip, the third motor 123 drives the second screw 124 to rotate, so that the upper mold base 121 and the pressure block 122 are lifted. The guide rod 125 can guide the movement of the upper mold base 121. After the upper mold base 121 is lifted a certain distance, a gap is left for the optical module to flip, which will not affect the flipping action of the optical module. After the optical module is flipped, the pressure block 122 moves downward to press and position the top surface of the optical module.

[0030] When switching between high and low temperature tests, the TEC chip needs to dissipate heat quickly and return to its initial state. To achieve this, the following solution is proposed: In this embodiment, an air guide assembly 800 is also included, which includes an air outlet pipe 810 and a rubber sealing block 830. Each set of air outlet pipes 810 has an air outlet pipe 810 on its outer side wall. The bottom end of the air outlet pipe 810 is an open structure. The top of the air outlet pipe 810 is connected to the receiving box 710 through an air outlet groove 713. The rubber sealing block 830 is slidably placed in the air outlet groove 713. The interior of the rubber sealing block 830 has a series groove 831 for connecting the air outlet pipe 810 and the receiving box 710. In the above scheme: 1. The air outlet duct 810 is used as an auxiliary exhaust channel and is used in the switching mode; 2. The opening and closing of the air outlet duct 713 is controlled by a sliding rubber sealing block 830. When the rubber sealing block 830 extends to the receiving box 710, the connecting groove 831 can connect the receiving box 710 and the air outlet duct 810 in series, so that the airflow can be discharged through the air outlet duct 810.

[0031] In this embodiment, the temperature control unit 700 includes the following modes: In the high-temperature test mode, the TEC plate 740 is arranged horizontally with the hot side facing up and the cold side facing down. The cold air at the bottom of the TEC plate 740 is conducted to the liquid cooling component 600 through the sealing window 750, so that the liquid cooling component 600 stores cold air. In the switching mode, the TEC plate 740 is placed at an angle inside the receiving box 710 with the hot side facing up and the cold side facing down. The sealing window 750 is closed, and the TEC plate 740 divides the receiving box 710 into an upper chamber 716 and a lower chamber 717. The hot air from the top of the lower mold base 200 is discharged along the upper chamber 716, the lower chamber 717 and the air outlet 810. The hot air first exchanges heat in the lower chamber 717 and then contacts the liquid cooling component 600 for heat exchange. In the low-temperature test mode, the TEC plate 740 is arranged horizontally with the cold side facing up and the hot side facing down. The sealing window 750 is opened, and the hot air at the bottom of the TEC plate 740 comes into contact with the liquid cooling component 600 for heat exchange.

[0032] In the above scheme: After the TEC chip 740 undergoes heating testing, its hot side (R side) retains high temperature and its cold side (C side) retains low temperature. The testing device needs to wait for the TEC chip 740 to return to room temperature before proceeding to the next step of flipping it for cooling testing. This waiting time affects testing efficiency. To solve this problem, the following solution is proposed: The position adjustment component 720 can drive the TEC chip 740 to flip, so that the cold side and the hot side face up alternately. In this way, the optical module can be switched between high and low temperature testing without having to place it in high temperature equipment and low temperature equipment for testing separately. Specifically, the working process of TEC chip 740 consists of three steps: The first step is to conduct a high-temperature test. In this case, the hot side of the TEC chip 740 is facing up and the cold side is facing down. The purpose of the first step of the high-temperature test is to ensure that the cold side is facing down so that the cold air can be directly conducted downwards to the liquid cooling component 600, which will freeze the liquid cooling component 600 at a low temperature, thereby storing the cold air, ensuring the subsequent cooling effect, and reducing cooling energy consumption. The second step is to switch modes. This is an intermediate process from high-temperature testing to low-temperature testing. During this process, the TEC plate 740 needs to be flipped and adjusted, and the heat of the chamber also needs to be discharged to prepare for the subsequent low-temperature test. Based on the characteristic that the TEC plate 740 needs to be flipped and adjusted after the heating test, in the switching mode, the TEC plate 740 is set to be in an inclined state with the hot side facing up and the cold side facing down. The bottom of the housing box 710 is closed and the air guide component 800 is opened, so that the inclined TEC plate 740 can divide the housing box 710 into independent upper chamber 716 and lower chamber 717. During exhaust and heat dissipation, the hot air inside the chamber can be discharged along the upper chamber 716, lower chamber 717, series groove 831, and exhaust pipe 810. This allows the airflow to adhere to the TEC plate 740 to the greatest extent. The airflow passing over the hot surface of the TEC plate 740 can quickly remove the heat from the hot surface of the TEC plate 740. Then the airflow gathers in the lower chamber 717, where the cold air generated in the first step still remains. By utilizing the cold air in the lower chamber 717 and the downward-facing cold surface of the TEC plate 740, the hot air can be quickly exchanged, which can reduce the temperature of the hot air and increase the temperature of the cold surface, reduce the temperature difference between the hot and cold surfaces, and speed up the recovery of the TEC plate 740 to its initial state. After the hot air is discharged through the exhaust pipe 810, it can come into contact with the liquid cooling component 600. At this time, the liquid cooling component is heated and thawed once to cool the hot air.

[0033] The third step is to perform a low-temperature test. In this mode, the cold side of the TEC chip 740 faces upward and the hot side faces downward. The cold side can cool the optical module to achieve low-temperature testing. Meanwhile, the air outlet 713 is closed and the bottom of the housing 710 is open, allowing the hot air generated by the hot side to be discharged directly downward. The hot air comes into contact with the liquid cooling component 600, which undergoes secondary thawing and heat exchange to ensure the working stability of the TEC chip 740 in this mode.

[0034] To achieve lifting and flipping control of the TEC chip 740, in this embodiment, the position adjustment component 720 includes a first slider 721 and a second slider 724. The inner ends of the receiving box 710 are symmetrically provided with a first vertical sliding groove 711 and a second vertical sliding groove 712. The first slider 721 is vertically slidably embedded in the inner end of the first vertical sliding groove 711. A first screw 722 is vertically provided inside the inner end of the first vertical sliding groove 711. The first slider 721 is threadedly fitted onto the outer wall of the first screw 722. The second slider 724 is vertically slidably embedded in the inner end of the second vertical sliding groove 712. The end of the first screw 722 is connected to a first motor 723. A second motor 725 is provided inside the second slider 724 to drive the TEC chip 740 to flip.

[0035] The position adjustment component 720 also includes a rectangular protective frame 730. A TEC plate 740 is provided in the center of the interior of the protective frame 730. Rotating shafts 731 are symmetrically provided on both sides of the short side of the protective frame 730. A first conductive post 732 is provided flush with the long side of the protective frame 730. A second conductive post 715 is provided on the inner wall of the receiving box 710 to cooperate with the first conductive post 732. A rubber ring 714 is provided on the top of the inner wall of the receiving box 710, and the rubber ring 714 is in contact with the top surface of the protective frame 730.

[0036] In the above scheme: During the lifting and lowering motion, the first motor 723 drives the first screw 722 to rotate, which in turn drives the first slider 721 to move along the first screw 722, and the second slider 724 to move along the second vertical slide groove 712. The first slider 721 and the second slider 724 drive the protective frame 730 to lift and lower. When it is lifted and lowered to the designated position, the second motor 725 in the second slider 724 drives the rotating shaft 731 to rotate, so that the protective frame 730 rotates and flips over, or can be kept in the tilted state of the switching mode. When the protective frame 730 is raised to the top, the top surface of the protective frame 730 is pressed and sealed with the rubber ring 714, thus preventing cold or hot air from flowing back into the housing 710. When the protective frame 730 is raised, lowered, or flipped, the first conductive post 732 separates from the second conductive post 715. When the protective frame 730 is raised to a horizontal state, the first conductive post 732 and the second conductive post 715 come into contact and conduct electricity.

[0037] To control the sealing window 750, in this embodiment, each rotating part of the sealing window 750 is provided with a second driven gear 751. Each set of second driven gears 751 meshes with a second rack 752, and the second rack 752 is connected to a second drive rod 753. The second drive rod 753 is located on the outer wall of the receiving box 710. An operation window 811 is provided on the side wall of the air outlet duct 810. One end of the rubber sealing block 830 has a chamfered top structure, and the other end of the rubber sealing block 830 is provided with an inner baffle 820. One end of the inner baffle 820 is connected to a linkage rod 840, and the linkage rod 840 slides through the operation window 811 and its end is connected to the second rack 752.

[0038] In the above scheme: 1. The second drive rod 753 can push the second rack 752 to translate, thereby driving the second driven gear 751 to rotate. The second driven gear 751 drives the window piece inside the corresponding sealing window 750 to rotate, thereby realizing the opening and closing control of the sealing window 750. 2. When the second rack 752 moves, it can also drive the rubber sealing block 830 to move through the linkage rod 840; when the second rack 752 moves and drives the window in the sealing window 750 to rotate and close, it will drive the linkage rod 840 to move along the operating window 811, thereby driving the rubber sealing block 830 to extend into the receiving box 710 until the inner baffle 820 abuts against the receiving box 710. When the second drive rod 753 drives the sealing window 750 to open via the second rack 752, it will push the rubber sealing block 830 into the receiving box 710 via the linkage rod 840.

[0039] 3. One end of the rubber sealing block has a chamfered structure, which can increase the contact and fit between the rubber sealing block and the tilted TEC sheet.

[0040] In this embodiment, the liquid cooling component 600 includes a heat exchange copper plate 610, which is placed in the cavity at the bottom of the lower mold base 200. The heat exchange copper plate 610 is placed at the bottom of the receiving box 710 and the air outlet pipe 810. The surface of the heat exchange copper plate 610 is provided with multiple sets of laterally extending liquid storage pipes 620. The side of the lower mold base 200 is connected to multiple sets of side round tubes 630, and the side round tubes 630 extend horizontally to the back of the lower box 1100; the interior of the side round tubes 630 is provided with an exhaust fan 640, and the end of the side round tubes 630 is provided with a sealing plate 650 hinged by a torsion spring; the side round tubes 630 are used to exhaust hot air and condensate.

[0041] In the above scheme: the side tube 630 can connect the inside of the lower mold base 200 with the outside. When heat needs to be dissipated, the exhaust fan 640 works and can blow open the sealing plate 650. The heat above the heat exchange copper plate 610 is dissipated through the side tube 630. The liquid in the liquid storage tube 620 can be frozen and thawed. When heat dissipation is not required, the sealing plate 650 closes the side tube 630 under the action of the torsion spring. When the hot air comes into contact with the liquid storage tube 620 to cool down, some of the gas will liquefy. The lower box 1100 can be inverted so that the side tube 630 faces downward and the sealing plate 650 is opened to allow the liquid to drain.

[0042] Each drive lever in this invention is exemplarily an electric lever.

[0043] In specific implementation of this invention: S1, Optical Module 400 Positioning: Insert the end of the optical module 400 into the docking cover 520, and the end stop of the optical module 400 overlaps with the temperature measuring block 340. The cover 110 is closed, and the pressure block 122 presses down on the top surface of the optical module; S2, High Temperature Test Mode: The TEC plate 740 is horizontally arranged with the hot side facing up and the cold side facing down. The sealing window 750 is opened, and the rubber sealing block 830 is retracted into the vent pipe to seal the vent slot. Hot air passes through the first vent 210, the second vent 311 and the third vent 331 and is transmitted to the top of the lower base to heat the optical module. The thermistor collects the surface temperature of the optical module. During high-temperature testing, the cold air generated by the cold surface is conducted through the sealed window 750 to the liquid storage tube 620, where it condenses. S3, Switch Mode: The TEC sheet 740 is adjusted to an inclined state with the hot side facing up and the cold side facing down. The sealing window 750 at the bottom of the receiving box 710 is closed, and the rubber sealing block 830 extends out into the receiving cavity. The inclined TEC sheet 740 divides the receiving box 710 into an independent upper chamber 716 and a lower chamber 717. When the exhaust fan 640 is started, hot air is discharged through the upper chamber 716, lower chamber 717, series groove 831, air outlet pipe and side round pipe 630. The liquid storage pipe performs heat exchange and cooling treatment on the hot air flowing through it. During the exhaust heat dissipation process, the TEC plate 740 returns to its initial state. S4, Low Temperature Test Mode: The TEC sheet 740 is horizontally arranged with the cold side facing up and the hot side facing down. The sealing window 750 is opened, and the rubber sealing block 830 is put into the air outlet duct 810 and seals the air outlet slot 713. The hot air generated by the hot surface passes through the sealing window 750 and is then conducted to the liquid storage pipe 620, where the liquid storage pipe 620 performs heat exchange and cooling treatment on the hot air. S5, Face-changing test: The upper mold base 121 drives the pressure block 122 to lift up to leave an adjustment gap; the flipping component 500 drives the optical module to flip, so that the temperature measuring surface of the optical module changes; then repeat S2-S4.

[0044] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high and low temperature testing device for optical modules, characterized in that, include: The lower housing has a hinged lid at the top; The lower mold base is located inside the lower housing. A liquid cooling component is installed at the bottom of the lower mold base, and multiple longitudinally distributed first air guide ports are opened on the surface of the lower mold base. The temperature sensor has multiple sets arranged laterally and is used to measure the temperature of the optical module from both sides. The temperature sensor includes a partition, and a partition is provided above the first air inlet of each set. A second air inlet is opened in the middle of the surface of the partition. The surface of the partition is symmetrically provided with pads about the second air inlet. A support plate is provided on the top of the two sets of pads. A third air inlet is opened in the middle of the support plate. Temperature measuring blocks are symmetrically provided on the surface of the support plate about the third air inlet. A set of thermal probes is embedded inside each set of temperature measuring blocks. The two ends of the thermal probes are exposed outside the temperature measuring blocks. The outer ends of the thermal probes are connected to wires. Data connectors are provided at the two corners on the inner side of the partition surface. The outer ends of the wires are electrically connected to the data connectors. The flipping component is horizontally positioned in the middle of the surface of the lower mold base. The flipping component is located on one side of multiple temperature sensors. The flipping component is used to flip the optical module from one set of temperature measuring blocks to another set of temperature measuring blocks to change the surface to be measured of the optical module. The temperature control unit includes multiple sets of receiving boxes, which are placed inside the lower mold base and above the liquid cooling component. The top and bottom of the receiving boxes are open structures, and the side walls of the receiving boxes are provided with air outlet slots. The inner wall of the housing is equipped with a position adjustment component, which is connected to the TEC chip so that the cold and hot sides of the TEC chip face up alternately. The TEC chip is placed inside the housing to perform cooling or heating tests on the optical module. The bottom opening of the housing is equipped with a louvered sealing window.

2. The high and low temperature testing device for optical modules according to claim 1, characterized in that: The temperature measuring block includes a lower base, the outer wall of which is covered with a plastic shell, and a storage groove is opened on the top surface of the lower base. A heat-conducting block is covered inside the storage groove and is positioned by screws. The probe includes a first probe and a second probe. The first probe extends into the lower base from the outer wall to collect the temperature of the optical module, and the second probe penetrates the lower base to collect the ambient temperature.

3. The optical module high and low temperature testing device according to claim 1, characterized in that: The flipping assembly includes a horizontal plate and a docking cover. The horizontal plate is vertically positioned in the middle of the lower housing surface. Multiple temperature sensors are placed on one side of the horizontal plate. The horizontal plate is positioned at the top center of the first air inlet. A flipping rod is vertically provided on the side wall of the docking cover. A flipping shaft is vertically provided at the inner end of the flipping rod. The flipping shaft is rotatably positioned inside the horizontal plate. A first driven gear is provided on the outer wall of the flipping shaft. A first rack is slidably mounted laterally on the side of the horizontal plate. The first rack meshes with each set of first driven gears. The end of the first rack is connected to a first drive rod. Each set of trays corresponds to a set of docking covers. The end of the optical module is inserted into the docking cover.

4. The optical module high and low temperature testing device according to claim 1, characterized in that: The box cover is equipped with a pressing unit inside. The pressing unit includes an upper mold base, a second screw, and a guide rod. The second screw and the guide rod are symmetrically arranged on both sides of the inside of the box cover. The upper mold base is vertically slidably arranged inside the box cover. One end of the upper mold base is connected to the second screw, and the second screw is connected to a third motor. The other end of the upper mold base is connected to the guide rod. The bottom surface of the upper mold base is equipped with a pressure block. When the box cover is closed, the pressure block presses down on the optical module.

5. The high and low temperature testing device for optical modules according to claim 1, characterized in that: It also includes an air guide assembly, which includes an air outlet pipe and a rubber sealing block. Each set of air outlet pipes has an air outlet pipe on its outer side wall. The bottom end of the air outlet pipe is an open structure. The top of the air outlet pipe is connected to the receiving box through an air outlet groove. The rubber sealing block is slidably placed in the air outlet groove. The inside of the rubber sealing block is opened with a series groove for connecting the air outlet pipe and the receiving box. The temperature control unit includes the following modes: In the high-temperature test mode, the TEC plates are arranged horizontally with the hot side facing up and the cold side facing down. The cold air at the bottom of the TEC plates is conducted to the liquid cooling component through the sealed window, so that the liquid cooling component stores cold. When switching modes, the TEC sheet is placed at an angle inside the housing with the hot side facing up and the cold side facing down. The sealing window is closed, and the TEC sheet divides the housing into an upper chamber and a lower chamber. The hot air from the top of the lower mold base is discharged along the upper chamber, the lower chamber, and the air outlet pipe. The hot air first exchanges heat in the lower chamber and then contacts the liquid cooling component for heat exchange. In the low-temperature test mode, the TEC chips are arranged horizontally with the cold side facing up and the hot side facing down. The sealing window is opened, and the hot air at the bottom of the TEC chip comes into contact with the liquid cooling component for heat exchange.

6. The optical module high and low temperature testing device according to claim 5, characterized in that: The position adjustment component includes a first slider and a second slider. The inner ends of the receiving box are symmetrically provided with a first vertical sliding groove and a second vertical sliding groove. The first slider is vertically slidably embedded in the inner end of the first vertical sliding groove. A first screw is vertically provided in the inner end of the first vertical sliding groove. The first slider is threadedly fitted onto the outer wall of the first screw. The second slider is vertically slidably embedded in the inner end of the second vertical sliding groove. The end of the first screw is connected to a first motor. A second motor is provided in the second slider to drive the TEC plate to flip.

7. The high and low temperature testing device for optical modules according to claim 6, characterized in that: The position adjustment component also includes a rectangular protective frame, with a TEC plate in the center of the inner part of the protective frame, symmetrically arranged pivots on both sides of the short side of the protective frame, and a first conductive post flush with the long side of the protective frame. The inner wall of the receiving box is provided with a second conductive post that mates with the first conductive post. A rubber ring is provided at the top of the inner wall of the receiving box, and the rubber ring mates with the top surface of the protective frame.

8. The high and low temperature testing device for optical modules according to claim 7, characterized in that: Each rotating part of the sealing window is provided with a second driven gear, and each set of second driven gears meshes with a second rack. The second rack is connected to a second drive rod, and the second drive rod is located on the outer wall of the receiving box. An operation window is provided on the side wall of the air outlet duct. One end of the rubber sealing block has a chamfered top structure, and the other end of the rubber sealing block has an inner baffle. One end of the inner baffle is connected to a linkage rod, which slides through the operation window and is connected to a second rack at its end.

9. The high and low temperature testing device for optical modules according to claim 8, characterized in that: The liquid cooling component includes a heat exchange copper plate, which is placed in the cavity at the bottom of the lower mold base. The heat exchange copper plate is placed at the bottom of the receiving box and the air outlet pipe. The surface of the heat exchange copper plate is provided with multiple sets of laterally extending liquid storage pipes.

10. The optical module high and low temperature testing device according to claim 1, characterized in that: The side of the lower mold base is connected to multiple sets of side tubes, which extend horizontally to the back of the lower housing; the inside of the side tubes is equipped with exhaust fans, and the ends of the side tubes are equipped with torsion spring hinged sealing plates; the side tubes are used to exhaust hot air and condensate.

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