Wafer test needle seat, wafer test device and needle seat control method

Abstract

The invention relates to the technical field of wafer testing, and discloses a wafer testing needle seat, a wafer testing device and a needle seat control method. The wafer test needle seat comprises a base, a sliding seat, a first screw rod, a first driving piece, a connecting piece, a second screw rod, a second driving piece and a probe. The first driving part is used for driving the first lead screw to rotate so that the connecting part and the second lead screw can ascend and descend relative to the first lead screw, and therefore the sliding seat and the probe can ascend and descend. And the second driving piece is used for driving the second screw rod to rotate, so that the second screw rod ascends and descends relative to the connecting piece, and the sliding seat and the probe ascend and descend. According to the wafer test needle seat, the two screw rods can realize the micro-motion of the probe, the micro-motion of one screw rod cannot cause abrasion to the other screw rod, and after the first screw rod or the second screw rod is abraded, the other screw rod can be used for continuously driving the probe to micro-motion, so that the overall service life of the screw rod transmission mechanism is effectively prolonged.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, specifically to a wafer testing probe holder, a wafer testing device, and a control method. Background Technology

[0002] In wafer testing, the wafer is typically placed on a stage, and a probe is placed on top of it. The probe descends to conduct an electrical test on the die on the wafer. After the test is completed, the stage rises and moves the wafer so that another die is located below the probe. The probe continues to descend to conduct an electrical test on the new die. In order to achieve repeated raising and lowering of the probe, a more stable lead screw drive structure is selected. However, the related technology has the problem of low service life of the lead screw that drives the probe to rise and fall. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a wafer test probe holder that can improve the service life of the lead screw.

[0004] The present invention also proposes a wafer testing device and control method having the above-mentioned wafer test pin holder.

[0005] According to a first aspect of the present invention, a wafer test probe holder includes: a base, a sliding seat, a first lead screw, a first driving member, a connector, a second lead screw, a second driving member, and a probe. The first driving member is fixedly disposed on the base. The sliding seat is slidably connected to the base in a vertical direction. The probe and the second driving member are fixedly disposed on the sliding seat. The second lead screw is connected to the second driving member. The first lead screw and the second lead screw are radially spaced apart from each other and are both threadedly connected to the connector. The first driving member drives the first lead screw to rotate, causing the connector and the second lead screw to rise and fall relative to the first lead screw, thereby causing the sliding seat and the probe to rise and fall. The second driving member drives the second lead screw to rotate, causing the second lead screw to rise and fall relative to the connector, thereby causing the sliding seat and the probe to rise and fall.

[0006] According to the first aspect of the present invention, the wafer test probe holder has at least the following beneficial effects: by providing two lead screws, a first lead screw and a second lead screw, the first lead screw can drive the sliding seat and its components, such as the second driving member and the second lead screw, to move up and down as a whole, thereby realizing the raising and lowering of the probe. Alternatively, the first lead screw can remain stationary, and the second lead screw can rotate to move itself and the sliding seat, thereby realizing the raising and lowering of the probe. Therefore, the wafer test probe holder has two lead screws that can realize the micro-movement of the probe, and the micro-movement of one lead screw will not cause wear to the other lead screw. When the first lead screw or the second lead screw wears out, the other lead screw can be used to continue to drive the micro-movement of the probe, effectively improving the overall service life of the lead screw transmission mechanism.

[0007] According to some embodiments of the present invention, the first lead screw and the second lead screw have the same length, and the upper end face of the first lead screw is flush with the upper end face of the second lead screw.

[0008] According to some embodiments of the present invention, the wafer test probe holder further includes a drive wheel, a driven wheel, and a belt. The power end of the first drive member is connected to the drive wheel, the driven wheel is coaxially connected to the first lead screw, and the drive wheel and the driven wheel are connected in a driving connection.

[0009] According to some embodiments of the present invention, the wafer test probe holder further includes two position sensors disposed on the base, and the position sensors are respectively used to detect the positions of the first lead screw and the second lead screw relative to the base.

[0010] According to a control method of a second aspect of the present invention, a wafer test probe holder is used to control any one of the first aspect embodiments. The first lead screw has multiple first micro-motion segments along its axial direction, and the second lead screw has multiple second micro-motion segments along its axial direction. The probe's motion trajectory has a micro-motion range. The control method includes: driving the first and second lead screws to move up and down relative to the connector, so that any of the first or second micro-motion segments is threadedly connected to the connector; and driving the first or second micro-motion segment threadedly connected to the connector to move slightly in the vertical direction, so that the probe moves up and down within the micro-motion range.

[0011] According to the control method of the second aspect of the present invention, at least the following beneficial effects are achieved: driving the first lead screw to rotate so that the first micro-motion segment of the first lead screw moves slightly, or driving the second lead screw to rotate so that the second micro-motion segment of the second lead screw moves slightly, both achieve the effect of making the probe move slightly. Since there are multiple first and second micro-motion segments, the technical effect of making the probe move slightly can be achieved by adjusting the rotation of the first and second lead screws so that any micro-motion segment moves slightly relative to the connecting member, thereby improving the utilization rate of the lead screw and extending the service life of the lead screw.

[0012] According to some embodiments of the present invention, the control method further includes: adjusting the position of the probe so that the probe is initially located within the micro-motion range; and / or controlling the first driving member to drive the first lead screw to rotate, so that the connecting member descends relative to the first lead screw; controlling the second driving member to drive the second lead screw to rotate, so that the connecting member descends synchronously relative to the first lead screw and the second lead screw, and so that the probe is located within the micro-motion range.

[0013] According to some embodiments of the present invention, the control method further includes the following steps: based on the number of micro-movements of all the first micro-movement segments and the second micro-movement segments within the connector, and ensuring that the number of micro-movements of any one of the first micro-movement segments and the second micro-movement segment within the connector is equal.

[0014] According to some embodiments of the present invention, the step of making the number of micro-movements of any first micro-segment and the second micro-segment in the connector equal includes: firstly, controlling each of the first micro-segments to micro-move n times in the connector in sequence; after all the first micro-segments have micro-move n times in the connector, then controlling each of the second micro-segments to micro-move n times in the connector, until all the second micro-segments have micro-move n times in the connector.

[0015] According to some embodiments of the present invention, before sequentially controlling each of the first micro-motion segments to micro-motion n times within the connector, the control method further includes: controlling the first driving member and the second driving member to rotate so that the connector moves to the uppermost first micro-motion segment and the second micro-motion segment; first controlling the uppermost first micro-motion segment to micro-motion n times within the connector; then sequentially controlling each of the first micro-motion segments to micro-motion n times within the connector until the lowermost first micro-motion segment completes its movement within the connector; controlling each of the second micro-motion segments to micro-motion n times within the connector from bottom to top until the uppermost second micro-motion segment completes its movement within the connector; except when the first micro-motion segment or the second micro-motion segment is micro-motion within the connector, controlling the first lead screw and the second lead screw to synchronously rise and fall relative to the connector.

[0016] A wafer testing apparatus according to a third aspect embodiment of the present invention includes a wafer stage and a wafer testing probe holder as described in any one of the first aspect embodiments. The wafer stage is disposed at intervals below the probes and is used to place wafers.

[0017] The wafer testing apparatus according to embodiments of the present invention has at least the following beneficial effects: driving the first lead screw to rotate, causing the first micro-motion segment of the first lead screw to move slightly, or driving the second lead screw to rotate, causing the second micro-motion segment of the second lead screw to move slightly, both achieve the effect of micro-motion of the probe. Since there are multiple first and second micro-motion segments, the technical effect of probe micro-motion can be achieved by adjusting the rotation of the first and second lead screws to make any micro-motion segment move slightly relative to the connector, thereby improving the utilization rate of the lead screw and extending its service life. The wafer testing apparatus using this wafer test probe holder can also effectively improve the overall service life and reduce the frequency of replacement of vulnerable parts.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a perspective view of a wafer test pin holder according to one embodiment of the present invention; Figure 2 This is an internal structural diagram of a wafer test pin holder in one embodiment of the present invention; Figure 3 This is a schematic diagram of the first state of the lead screw drive structure in one embodiment of the present invention; Figure 4 This is a schematic diagram of the second state of the lead screw drive structure in one embodiment of the present invention; Figure 5 This is a schematic diagram of the third state of the lead screw drive structure in one embodiment of the present invention.

[0020] Reference numerals: wafer test probe holder 100, base 101, slide seat 102, first drive member 103, second drive member 104, probe 105, first lead screw 201, connector 202, second lead screw 203, drive wheel 301, driven wheel 302, belt 303. Detailed Implementation

[0021] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0023] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0024] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0025] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] In existing technologies, a single lead screw is often used to drive the probe up and down to achieve wafer inspection. However, in actual inspection, the probe's up and down range is very small, which is called the micro-motion process in the industry. The small up and down range of the probe during the micro-motion process is understood as micro-motion. The area where the lead screw is threadedly connected to the external nut during the micro-motion process is called the micro-motion range. During high-frequency up and down processes, the wear of the micro-motion range is relatively severe. When this range is damaged, the entire lead screw can no longer be used. However, the micro-motion range usually only occupies a part of the lead screw, resulting in a short service life and low utilization rate of the lead screw.

[0027] refer to Figure 2 and Figure 4This invention proposes a wafer test probe holder 100, which uses a two-lead screw linkage design, allowing either lead screw to drive the probe 105 up and down, thus extending the service life of the lead screw transmission structure. Furthermore, the two lead screws are not synchronously moving; rather, the first lead screw 201 drives the second lead screw 203 and its corresponding sliding seat 102 to move up and down together, while the second lead screw 203 drives itself to move up and down. In existing technologies, dual lead screws typically move synchronously, their function being merely to improve structural strength.

[0028] refer to Figures 1 to 5 According to a first aspect embodiment of the present invention, a wafer test probe holder 100 includes: a base 101, a sliding seat 102, a first lead screw 201, a first drive member 103, a connector 202, a second lead screw 203, a second drive member 104, and a probe 105. The first drive member 103 is fixedly disposed on the base 101. The sliding seat 102 is slidably connected to the base 101 in a vertical direction. The probe 105 and the second drive member 104 are fixedly disposed on the sliding seat 102. The second lead screw 203 is connected to the second drive member 104. The first lead screw 201 and the second lead screw 203 are radially spaced apart along the first lead screw 201 and are both threadedly connected to the connector 202. The first drive member 103 is used to drive the first lead screw 201 to rotate, so that the connector 202 and the second lead screw 203 rise and fall relative to the first lead screw 201, thereby causing the sliding seat 102 and the probe 105 to rise and fall. The second driving member 104 is used to drive the second lead screw 203 to rotate, so that the second lead screw 203 rises and falls relative to the connecting member 202, thereby causing the sliding seat 102 and the probe 105 to rise and fall. By setting the first lead screw 201 and the second lead screw 203, the first lead screw 201 can drive the sliding seat 102 and its components such as the second driving member 104 and the second lead screw 203 to rise and fall as a whole, realizing the rise and fall of the probe 105. The second lead screw 203 achieves its own rise and fall and the rise and fall of the sliding seat 102 through rotation. During the rise and fall of the probe 105, the first lead screw 201 can also remain stationary. Therefore, both the first lead screw 201 and the second lead screw 203 of the wafer test probe holder 100 can realize the micro-movement of the probe 105, and the micro-movement of the first lead screw 201 or the second lead screw 203 will not cause wear to the other lead screw. When the first lead screw 201 or the second lead screw 203 wears out, the other lead screw can be used to continue to drive the probe 105 to move micro-movement, effectively improving the overall service life of the lead screw transmission mechanism.

[0029] It should be noted that the specific principles by which the first lead screw 201 and the second lead screw 203 can each drive the lifting and lowering of the probe 105 without interfering with each other are as follows: First, the movement principle of the first lead screw 201: The first driving member 103 drives the first lead screw 201 to rotate. Since the connecting member 202, which is threaded to the first lead screw 201, is also radially spaced and connected to the second lead screw 203, it cannot rotate and can only move up and down relative to the first lead screw 201. This drives the second lead screw 203 connected to the connecting member 202, as well as the second driving member 104, the sliding seat 102, the probe 105, and other components connected in sequence, to move up and down as a whole. Second, the principle of the second lead screw 203: The second driving member 104 drives the second lead screw 203 to rotate. Since the connecting member 202 cannot rotate, the second lead screw 203 can only move up and down relative to the connecting member 202, thereby driving the second driving member 104, the sliding seat 102, the probe 105, and other components connected in sequence to move up and down. Therefore, when the first lead screw 201 rotates, the second lead screw 203 does not need to rotate, and when the second lead screw 203 rotates, the first lead screw 201 does not need to rotate. The two can operate independently of each other, and each can have its own micro-motion range. Compared with the traditional structure, it has more micro-motion range, thereby improving the overall service life.

[0030] It should be noted that, in some embodiments of the present invention, the first lead screw 201, the connecting member 202, and the second lead screw 203 can be as follows: Figure 1 and Figure 2 The components are arranged radially at intervals and have two threaded holes on the connector 202 for threaded connection with both. Alternatively, the second lead screw 203 can be hollow, and a sleeve structure can be used to connect each component to the first lead screw 201 or the second lead screw 203, which can also achieve the technical effect of dual drive.

[0031] It should be noted that the radially spaced distribution of the first lead screw 201 and the second lead screw 203 is a preferred option, because the probe 105 is usually located on the side of the entire base 101. Therefore, the radially spaced distribution of the first lead screw 201 and the connected first drive member 103, the second lead screw 203 and the connected second drive member 104 makes it easier for the probe 105 to be located on the side of the two lead screws in the horizontal direction. Furthermore, the spaced arrangement makes the structure of the connector 202 and the sliding seat 102 simpler and facilitates the installation of the probe 105.

[0032] refer to Figures 3 to 5 In some embodiments of the present invention, the first lead screw 201 and the second lead screw 203 have the same length, and the upper end face of the first lead screw 201 is flush with the upper end face of the second lead screw 203. This allows the micro-movement strokes of the two lead screws to be consistent, facilitating... Figures 3 to 5 The top-to-bottom synchronous motion shown improves the utilization rate of the threads on the lead screw.

[0033] refer to Figure 2 and Figure 3 In some embodiments of the present invention, the wafer test probe holder 100 further includes a driving wheel 301, a driven wheel 302, and a belt 303. The power end of the first driving member 103 is connected to the driving wheel 301, and the driven wheel 302 is coaxially connected to the first lead screw 201. The driving wheel 301 and the driven wheel 302 are connected in a transmission connection. This allows for more flexible installation of the first driving member 103, for example, it can be installed as follows: Figure 1 The structures shown are spaced apart from the second drive member 104 to avoid interference between the lifting and lowering process of the second drive member 104 and other components. In some embodiments, a transmission structure using a synchronous belt and a synchronous pulley can also be used to change the position of the first drive member 103.

[0034] In some embodiments of the present invention, the wafer test probe holder 100 further includes two position sensors disposed on the base 101. The position sensors are used to detect the positions of the first lead screw 201 and the second lead screw 203 relative to the base 101. The position sensors can take many forms, such as photosensors or infrared sensors. By setting sensors and fixing sensing plates to both the first lead screw 201 and the second lead screw 203, the lifting distance of the first lead screw 201 or the second lead screw 203 can be determined, thereby determining the current height of the probe 105, which facilitates the determination of the probe height during subsequent wafer testing.

[0035] refer to Figures 3 to 5 According to a control method of a second aspect of the present invention, a wafer test probe holder 100 of any one of the first aspects of the embodiments is used to control the probe. A first lead screw 201 has multiple first micro-motion segments along the axial direction, a second lead screw 203 has multiple second micro-motion segments along the axial direction, and the probe 105 has a micro-motion range on its movement trajectory. The control method includes: driving the first lead screw 201 and the second lead screw 203 to move up and down relative to the connector 202, so that any one of the first micro-motion segments or any one of the second micro-motion segments is threadedly connected to the connector 202; and driving the first or second micro-motion segment threadedly connected to the connector 202 to move slightly in the vertical direction, so that the probe 105 moves up and down within the micro-motion range. Driving the first lead screw 201 to rotate causes the first micro-motion segment of the first lead screw 201 to move slightly, or driving the second lead screw 203 to rotate causes the second micro-motion segment of the second lead screw 203 to move slightly, both achieve the effect of micro-motion of the probe 105. Since there are multiple first and second micro-motion segments, the rotation of the first lead screw 201 and the second lead screw 203 can be adjusted to make any micro-motion segment move slightly relative to the connecting member 202, thereby achieving micro-motion of the probe 105, which effectively improves the utilization rate of the lead screw and helps to extend the service life of the lead screw.

[0036] It should be noted that the first micro-motion segment and the second micro-motion segment are... Figures 3 to 5 In the schematic diagram shown, the screw sections of the first lead screw 201 and the second lead screw 203 are divided into multiple micro-motion segments along the axial direction according to the micro-motion distance. The micro-motion segments are the connection wear points between the lead screw and the connecting piece 202 during the micro-motion process of the stage.

[0037] It should be noted that, in some embodiments of the present invention, the control method further includes using a position sensor to determine the highest and lowest points that the first lead screw 201 can move relative to the connecting member 202, and the highest and lowest points that the second lead screw 203 can move to, thereby obtaining... Figure 5 The total displacement length S shown is divided into multiple first micro-segments or second micro-segments according to the micro-motion distance, and then assigned coordinate values. This allows the first lead screw 201 or the second lead screw 203 to move, enabling multiple micro-segments to undergo micro-motion wear and improving the utilization rate of the lead screw.

[0038] It should be noted that the total length of the displacement S is less than the total length of the screw, because a certain amount of micro-movement distance must be reserved at the top and bottom of the thread to prevent damage to the screw during micro-movement.

[0039] In some embodiments of the present invention, the control method further includes: adjusting the position of the probe 105 so that the probe 105 is initially located within the micro-motion range; and / or controlling the first driving member 103 to drive the first lead screw 201 to rotate, so that the connector 202 descends relative to the first lead screw 201; controlling the second driving member 104 to drive the second lead screw 203 to rotate, so that the connector 202 descends synchronously relative to the first lead screw 201 and the second lead screw 203, and so that the probe 105 is located within the micro-motion range. This ensures that the probe 105 does not rise or fall during the switching of the micro-motion segment, allowing the probe 105 to always move within the preset micro-motion range, preventing the wafer stage from being too close or too far from the probe 105 and affecting wafer inspection. For example, if only the first micro-motion segment of the first lead screw 201 is switched, while the second lead screw 203 is not adjusted, the overall height relative to the first lead screw 201 will rise, causing the probe 105 to shift downwards. Even though the first micro-motion segment has been switched, the distance between the stage and the probe 105 becomes too close, hindering successful detection. The height of either the probe 105 or the stage needs to be adjusted separately, which is very cumbersome. Therefore, if the first lead screw 201 and the second lead screw 203 are... Figures 3 to 5 The synchronous lifting shown can avoid this problem, so that the height of probe 105 does not change during the switching of the micro-motion segment, and there is no need to adjust the distance between the stage and probe 105.

[0040] It should be noted that the synchronous lifting process can occur simultaneously, or the first lead screw 201 can be adjusted first and then the second lead screw 203 can be adjusted. Synchronous lifting means that the first lead screw 201 and the second lead screw 203 move the same distance in the vertical direction relative to the connecting piece 202.

[0041] In some embodiments of the present invention, the control method further includes the following steps: determining the number of micro-movements of all first and second micro-movement segments within the connector 202, and ensuring that the number of micro-movements of any first and second micro-movement segment within the connector 202 is equal. This allows for uniform wear of the first lead screw 201 and the second lead screw 203. When one of the micro-movement segments is damaged, it indicates that the micro-moving area on the first lead screw 201 or the second lead screw 203 is essentially no longer usable, utilizing the micro-moving threaded segments throughout the entire lead screw. The number of micro-movements of the first and second micro-movement segments within the connector 202 can be obtained in various ways during automated control, such as recording it by the controller when executing a micro-movement command, or manually inputting the number of micro-movements to the controller each time a micro-movement is executed.

[0042] In some embodiments of the present invention, the step of ensuring that the number of micro-movements of any first micro-segment and the second micro-segment within the connector 202 is equal includes: firstly, sequentially controlling each first micro-segment to micro-move n times within the connector 202; after all the first micro-segments have micro-moved n times within the connector 202, then controlling each second micro-segment to micro-move n times within the connector 202, until all the second micro-segments have micro-moved n times within the connector 202. Switching to the second lead screw 203 after all the micro-segments of the first lead screw 201 have operated to a certain extent is simpler and more direct, facilitating program control. In some embodiments, there are multiple steps to ensure that the number of micro-movements of any first micro-segment and the second micro-segment within the connector 202 is equal. These could include alternating operation of the first and second micro-segments, switching to the first micro-segment after all the second micro-segments have micro-moved, or randomly selecting and recording the micro-movements of either the first or second micro-segment to ensure that the number of micro-movements of each micro-segment is close to or equal to the number of micro-movements. n refers to the number of times the probe 105 rises and falls. Each rise and fall means that a grain test is performed. During the micro-motion process, after the lead screw rises and falls a certain number of times, the micro-motion section will have significant wear, and the lead screw needs to be replaced or a new micro-motion section needs to be switched. n times represents the range of values ​​for the lead screw to move back and forth a certain number of times without damage. For example, n can be preset between 300 and 800, and preferably can be set to 500, that is, after the same micro-motion section rises and falls 500 times, a new micro-motion section can be switched.

[0043] In some embodiments of the present invention, before sequentially controlling each first micro-motion segment to micro-motion n times within the connector 202, the control method further includes: controlling the first driving member 103 and the second driving member 104 to rotate so that the connector 202 moves to the uppermost first micro-motion segment and the second micro-motion segment; first controlling the uppermost first micro-motion segment to micro-motion n times within the connector 202; then sequentially controlling each first micro-motion segment to micro-motion n times within the connector 202 until the lowermost first micro-motion segment completes its movement within the connector 202; and controlling each second micro-motion segment to micro-motion n times within the connector 202 from bottom to top until the uppermost second micro-motion segment completes its movement within the connector 202. Except when the first or second micro-motion segment is micro-motion within the connector 202, the first lead screw 201 and the second lead screw 203 are controlled to rise and fall synchronously relative to the connector 202. This allows for a more natural switching process for the micro-segments. It starts by using the first micro-segment from the top down. As the first micro-segment is switched from top to bottom, the second lead screw 203 and the first lead screw 201 also rise synchronously. Therefore, when the first micro-segment at the bottom is finished, the second micro-segment at the bottom of the second lead screw 203 is also connected to the connector 202. At this point, the second micro-segment is switched upwards one by one to achieve a cycle until a first micro-segment or a second micro-segment is damaged. Then, the process stops and the first lead screw 201 and the second lead screw 203 are replaced.

[0044] According to a third aspect embodiment of the present invention, a wafer testing apparatus includes a wafer stage and a wafer testing probe holder 100 as described in any of the first aspect embodiments. The wafer stage is spaced below the probe 105 and is used to place the wafer. Driving a first lead screw 201 to rotate causes a micro-motion in its first micro-motion segment, or driving a second lead screw 203 to rotate causes a micro-motion in its second micro-motion segment, achieves micro-motion of the probe 105. Since there are multiple first and second micro-motion segments, the micro-motion effect of the probe 105 can be achieved by adjusting the rotation of the first and second lead screws 201 and 203 to make any micro-motion segment micro-motion relative to the connector 202, thereby improving the utilization rate of the lead screw and extending its service life. The wafer testing apparatus using the wafer testing probe holder 100 can also effectively improve its overall service life and reduce the frequency of replacement of vulnerable components.

[0045] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A wafer test probe holder, characterized in that, include: The base, sliding seat, first lead screw, first driving component, connecting component, second lead screw, second driving component, and probe; The first driving component is fixedly mounted on the base; The sliding seat is slidably connected to the base in the vertical direction, the probe and the second driving member are fixedly disposed on the sliding seat, and the second lead screw is connected to the second driving member; The first lead screw and the second lead screw are distributed at radial intervals along the first lead screw and are both threadedly connected to the connecting piece; The first driving member is used to drive the first lead screw to rotate, so that the connecting member and the second lead screw rise and fall relative to the first lead screw, thereby causing the sliding seat and the probe to rise and fall; The second driving member is used to drive the second lead screw to rotate, so that the second lead screw rises and falls relative to the connecting member, thereby causing the sliding seat and the probe to rise and fall.

2. The wafer test probe holder according to claim 1, characterized in that, The first lead screw and the second lead screw have the same length, and the upper end face of the first lead screw is flush with the upper end face of the second lead screw.

3. The wafer test probe holder according to claim 1, characterized in that, The wafer test probe holder also includes a drive wheel, a driven wheel, and a belt. The power end of the first drive unit is connected to the drive wheel, the driven wheel is coaxially connected to the first lead screw, and the drive wheel and the driven wheel are connected in a transmission connection.

4. The wafer test probe holder according to claim 1, characterized in that, The wafer test probe holder also includes two position sensors, which are disposed on the base. The position sensors are used to detect the positions of the first lead screw and the second lead screw relative to the base.

5. A pin holder control method for controlling the wafer test pin holder according to any one of claims 1 to 4, characterized in that, The first lead screw has multiple first micro-motion segments along the axial direction, the second lead screw has multiple second micro-motion segments along the axial direction, the probe's motion trajectory has micro-motion intervals, and the control method includes: The first lead screw and the second lead screw are driven to rise and fall relative to the connecting member, so that the connecting member moves to either the first micro-motion segment or either the second micro-motion segment; The first or second micro-motion segment, which is threadedly connected to the connector, is driven to move slightly in the vertical direction, so that the probe moves up and down within the micro-motion range.

6. The control method according to claim 5, characterized in that, The control method further includes: Adjust the position of the probe so that the probe is initially located within the micro-motion range; And / or, control the first drive member to drive the first lead screw to rotate, so that the connecting member descends relative to the first lead screw, and control the second drive member to drive the second lead screw to rotate, so that the connecting member descends synchronously relative to the first lead screw and the second lead screw, and so that the probe is located within the micro-motion range.

7. The control method according to claim 5, characterized in that, The control method further includes the following steps: based on the number of micro-movements of all the first micro-movement segments and the second micro-movement segments within the connector, and ensuring that the number of micro-movements of any one of the first micro-movement segments and the second micro-movement segment within the connector is equal.

8. The control method according to claim 7, characterized in that, The step of making the number of micro-movements of any first micro-segment and the second micro-segment within the connector equal includes: firstly, controlling each of the first micro-segments to micro-move n times within the connector in sequence; after all the first micro-segments have micro-move n times within the connector, then controlling each of the second micro-segments to micro-move n times within the connector, until all the second micro-segments have micro-move n times within the connector.

9. The control method according to claim 8, characterized in that, Before sequentially controlling each of the first micro-motion segments to micro-motion n times within the connector, the control method further includes: controlling the first driving member and the second driving member to rotate so that the connector moves to the uppermost first micro-motion segment and the second micro-motion segment; first controlling the uppermost first micro-motion segment to micro-motion n times within the connector; then sequentially controlling each of the first micro-motion segments to micro-motion n times within the connector until the lowermost first micro-motion segment completes its movement within the connector; and sequentially controlling each of the second micro-motion segments to micro-motion n times within the connector from bottom to top until the uppermost second micro-motion segment completes its movement within the connector; except when the first micro-motion segment or the second micro-motion segment is micro-motion within the connector, controlling the first lead screw and the second lead screw to synchronously rise and fall relative to the connector.

10. A wafer testing apparatus, characterized in that, include: Wafer test pin holder as claimed in any one of claims 1 to 4; A wafer carrier stage is disposed at intervals below the probe and is used to place wafers.

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