Wafer test socket, wafer test device and socket control method

Abstract

The application relates to the technical field of wafer testing, and discloses a wafer testing needle seat, a wafer testing device and a needle seat control method. The wafer testing needle seat comprises a base, a sliding seat, a first screw rod, a first driving piece, a connecting piece, a second screw rod, a second driving piece and a probe. The first driving piece is used for driving the first screw rod to rotate, so that the connecting piece and the second screw rod are lifted relative to the first screw rod, thereby lifting the sliding seat and the probe. The second driving piece is used for driving the second screw rod to rotate, so that the second screw rod is lifted relative to the connecting piece, thereby lifting the sliding seat and the probe. The wafer testing needle seat can realize micro-motion of the probe through two screw rods, and the micro-motion of one screw rod does not cause abrasion of the other screw rod. When the first screw rod or the second screw rod is abraded, the other screw rod can be used to continue driving the probe to micro-move, thereby effectively prolonging the overall service life of the screw rod transmission mechanism.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer testing, in particular to a wafer testing needle seat, a wafer testing device and a control method. BACKGROUND

[0002] In the step of wafer testing, the wafer is usually placed on a wafer stage, and then a probe is arranged above the wafer stage, the probe is lowered to realize the power-on test of the die on the wafer, and after the test is completed, the wafer stage drives the wafer to move so that another die is located below the probe, and the probe continues to be lowered to test the new die. In order to realize the repeated lifting and lowering of the probe, a screw rod transmission structure with better stability is selected, but in the related technology, there is a problem of low service life of the screw rod driving the probe to lift and lower. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a wafer testing needle seat which can improve the service life of the screw rod.

[0004] The present application also provides a wafer testing device and a control method having the above wafer testing needle seat.

[0005] The wafer testing needle seat according to the first aspect of the present application comprises a base, a sliding seat, a first screw rod, a first driving member, a connecting member, a second screw rod, a second driving member and a probe. The first driving member is fixedly arranged on the base. The sliding seat is slidably connected to the base in the vertical direction, the probe and the second driving member are fixedly arranged on the sliding seat, and the second screw rod is connected to the second driving member. The first screw rod and the second screw rod are distributed along the radial direction of the first screw rod and are both threadedly connected to the connecting member. The first driving member is used to drive the first screw rod to rotate, so that the connecting member and the second screw rod are lifted and lowered relative to the first screw rod, thereby lifting and lowering the sliding seat and the probe. The second driving member is used to drive the second screw rod to rotate, so that the second screw rod is lifted and lowered relative to the connecting member, thereby lifting and lowering the sliding seat and the probe.

[0006] According to the wafer test probe base provided by the first aspect of the present application, at least the following beneficial effects are achieved: two lead screws are provided, the first lead screw can drive the sliding seat and components such as the second driving member and the second lead screw on the sliding seat to move up and down as a whole, thereby achieving the up and down movement of the probe, and the first lead screw can not move, the second lead screw rotates to achieve the up and down movement of the sliding seat and other components, thereby achieving the up and down movement of the probe, so that the two lead screws can achieve the micro movement of the probe, and the micro movement of one lead screw will not cause wear to the other lead screw, when the first lead screw or the second lead screw is worn, the other lead screw can be used to continue to drive the probe to move, thereby effectively prolonging the service life of the lead screw transmission mechanism.

[0007] According to some embodiments of the present application, the first lead screw and the second lead screw have the same length, and the upper end surface of the first lead screw is flush with the upper end surface of the second lead screw.

[0008] According to some embodiments of the present application, the wafer test probe base further comprises a driving wheel, a driven wheel and a belt, the power end of the first driving member is connected to the driving wheel, the driven wheel is coaxially connected to the first lead screw, and the driving wheel and the driven wheel are in transmission connection.

[0009] According to some embodiments of the present application, the wafer test probe base further comprises two position sensors, the two position sensors are arranged on the base, and the position sensors are respectively used to detect the positions of the first lead screw and the second lead screw relative to the base.

[0010] According to the control method provided by the second aspect of the present application, the wafer test probe base in any one of the first aspect of the present application is controlled, the first lead screw has a plurality of first micro movement sections along the axial direction, the second lead screw has a plurality of second micro movement sections along the axial direction, the movement track of the probe has a micro movement section, and the control method comprises the following steps: driving the first lead screw and the second lead screw to move up and down relative to the connecting member, so that any one of the first micro movement sections or any one of the second micro movement sections is in threaded connection with the connecting member; and driving the first micro movement section or the second micro movement section in threaded connection with the connecting member to move up and down along the vertical direction, so that the probe moves up and down in the micro movement section.

[0011] According to the control method provided by the second aspect of the present application, at least the following beneficial effects are achieved: driving the first lead screw to rotate to make the first micro movement section of the first lead screw move, or driving the second lead screw to rotate to make the second micro movement section of the second lead screw move, both of which achieve the effect of making the probe move, and since the first micro movement section and the second micro movement section both have a plurality of sections, any one of the micro movement sections can be made to move relative to the connecting member by adjusting the rotation of the first lead screw and the second lead screw to achieve the technical effect of making the probe move, thereby improving the utilization rate of the lead screw and prolonging the service life of the lead screw.

[0012] According to some embodiments of the present application, the control method further comprises: adjusting the position of the probe, and making the probe initially located in the micro-motion range; and / or, controlling the first driving member to drive the first lead screw to rotate, so that the connecting member is lowered relative to the first lead screw, and controlling the second driving member to drive the second lead screw to rotate, so that the connecting member is lowered synchronously relative to the first lead screw and the second lead screw, and the probe is located in the micro-motion range.

[0013] According to some embodiments of the present application, the control method further comprises the following steps: according to the micro-motion times of all the first micro-motion sections and the second micro-motion sections in the connecting member, and making the micro-motion times of any first micro-motion section and the second micro-motion section in the connecting member equal.

[0014] According to some embodiments of the present application, the step of making the micro-motion times of any first micro-motion section and the second micro-motion section in the connecting member equal comprises: first controlling each first micro-motion section to micro-move n times in the connecting member in sequence, and then controlling each second micro-motion section to micro-move n times in the connecting member after all the first micro-motion sections have micro-moved n times in the connecting member, until all the second micro-motion sections have micro-moved n times in the connecting member.

[0015] According to some embodiments of the present application, before the step of controlling each first micro-motion section to micro-move n times in the connecting member in sequence, the control method further comprises: controlling the first driving member and the second driving member to rotate so that the connecting member moves to the uppermost first micro-motion section and the second micro-motion section, first controlling the uppermost first micro-motion section to micro-move n times in the connecting member, then controlling each first micro-motion section to micro-move n times in the connecting member in sequence from top to bottom until the lowermost first micro-motion section moves in the connecting member, controlling the second micro-motion sections to micro-move n times in the connecting member from bottom to top one by one until the uppermost second micro-motion section moves in the connecting member, and controlling the first lead screw and the second lead screw to synchronously ascend and descend relative to the connecting member except when the first micro-motion section or the second micro-motion section micro-moves in the connecting member.

[0016] The wafer testing device according to the third aspect of the embodiments of the present application comprises a wafer stage and the wafer testing probe base according to any one of the first aspect of the embodiments of the present application. The wafer stage is arranged below the probe, and the wafer stage is used to place a wafer.

[0017] According to the wafer testing device of the embodiment of the present application, the first micromotion section of the first screw rod is driven to move or the second micromotion section of the second screw rod is driven to move, both of which can achieve the effect of moving the probe, and since the first micromotion section and the second micromotion section both have multiple sections, any micromotion section can be moved relative to the connecting member by adjusting the rotation of the first screw rod and the second screw rod to achieve the technical effect of moving the probe, thereby improving the utilization rate of the screw rod, prolonging the service life of the screw rod, and effectively improving the overall service life of the wafer testing device using the wafer testing probe base and reducing the frequency of replacing the vulnerable parts.

[0018] Additional aspects and advantages of the present application will be described in the following description, become apparent from the following description, or be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The present application will be further described below in conjunction with the drawings and embodiments, wherein:

[0020] Figure 1 It is a perspective view of the wafer testing probe base in an embodiment of the present application;

[0021] Figure 2 It is an internal structure diagram of the wafer testing probe base in an embodiment of the present application;

[0022] Figure 3 It is a first state schematic diagram of the screw rod transmission structure in an embodiment of the present application;

[0023] Figure 4 It is a second state schematic diagram of the screw rod transmission structure in an embodiment of the present application;

[0024] Figure 5 It is a third state schematic diagram of the screw rod transmission structure in an embodiment of the present application.

[0025] Reference signs: wafer testing probe base 100, base 101, sliding seat 102, first driving member 103, second driving member 104, probe 105, first screw rod 201, connecting member 202, second screw rod 203, driving wheel 301, driven wheel 302, belt 303. DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0027] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by the upper, lower, front, rear, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0028] In the description of the present application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the sequence of technical features indicated.

[0029] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0030] In the description of the present application, the description of the reference terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0031] In the prior art, a single lead screw is often used to drive the probe to lift to realize wafer detection, but in the actual detection process, the lifting amplitude of the probe is very small, which is called micro-motion process in the industry. In the micro-motion process, the small amplitude lifting of the probe is understood as micro-motion. The interval of the lead screw and the external nut thread connection corresponding to the micro-motion process is the micro-motion interval. In the high-frequency lifting process, the wear of the micro-motion interval is relatively serious. When this interval is damaged, the whole lead screw cannot be used any more. However, the micro-motion interval usually only accounts for a part of the lead screw, the service life of the lead screw is short, and the utilization rate is low.

[0032] Reference Figure 2 And Figure 4The wafer test probe base 100 of the present application uses two screw rod linkage designs, and any one screw rod can drive the probe 105 to lift, thereby prolonging the service life of the screw rod transmission structure. Moreover, the two screw rods are not in synchronous motion, but the first screw rod 201 drives the second screw rod 203 and the sliding seat 102 where the second screw rod 203 is located to lift together, while the second screw rod 203 drives itself to lift. The double screw rods in the prior art are usually in synchronous motion, and the function is only to improve the structural strength.

[0033] Reference Figures 1 to 5 The wafer test probe base 100 according to the first aspect of the present application comprises a base 101, a sliding seat 102, a first screw rod 201, a first driving member 103, a connecting member 202, a second screw rod 203, a second driving member 104, and a probe 105. The first driving member 103 is fixedly arranged on the base 101. The sliding seat 102 is slidably connected to the base 101 in the vertical direction. The probe 105 and the second driving member 104 are fixedly arranged on the sliding seat 102. The second screw rod 203 is connected to the second driving member 104. The first screw rod 201 and the second screw rod 203 are spaced apart along the radial direction of the first screw rod 201 and are both threadedly connected to the connecting member 202. The first driving member 103 is used to drive the first screw rod 201 to rotate, so that the connecting member 202 and the second screw rod 203 are lifted or lowered relative to the first screw rod 201, thereby lifting or lowering the sliding seat 102 and the probe 105. The second driving member 104 is used to drive the second screw rod 203 to rotate, so that the second screw rod 203 is lifted or lowered relative to the connecting member 202, thereby lifting or lowering the sliding seat 102 and the probe 105. By arranging the first screw rod 201 and the second screw rod 203, the first screw rod 201 can drive the sliding seat 102 and the components thereon, such as the second driving member 104 and the second screw rod 203, to lift or lower as a whole, thereby lifting or lowering the probe 105. The second screw rod 203 can rotate to lift or lower itself and the sliding seat 102, thereby lifting or lowering the probe 105. In the process of lifting or lowering the probe 105, the first screw rod 201 can also not move. Therefore, the first screw rod 201 and the second screw rod 203 of the wafer test probe base 100 can both realize the micro-motion of the probe 105, and the micro-motion of the first screw rod 201 or the second screw rod 203 will not cause wear to the other screw rod. When the first screw rod 201 or the second screw rod 203 is worn out, the other screw rod can be used to continue driving the probe 105 to micro-move, thereby effectively prolonging the overall service life of the screw rod transmission mechanism.

[0034] It should be noted that the first screw rod 201 and the second screw rod 203 can each realize the specific principle of driving the lifting of the probe 105 without interfering with each other as follows. First, the movement principle of the first screw rod 201 is described. The first driving member 103 drives the first screw rod 201 to rotate. Since the connecting member 202 that is threadedly connected with the first screw rod 201 is also connected with the second screw rod 203 at a radial interval, the connecting member 202 cannot rotate and can only lift relative to the first screw rod 201, thereby driving the second screw rod 203 connected with the connecting member 202, the second driving member 104, the sliding seat 102, the probe 105 and other components connected in sequence to lift integrally. Next, the principle of the second screw rod 203 is described. The second driving member 104 drives the second screw rod 203 to rotate. Since the connecting member 202 cannot rotate, the second screw rod 203 can only lift relative to the connecting member 202, thereby driving the second driving member 104, the sliding seat 102, the probe 105 and other components connected in sequence to lift. Therefore, the second screw rod 203 does not need to rotate when the first screw rod 201 rotates, and the first screw rod 201 does not need to rotate when the second screw rod 203 rotates. The two can be independent of each other and can each have a micro-motion interval. Compared with the traditional structure, the micro-motion interval is larger, thereby improving the overall service life.

[0035] It should be noted that in some embodiments of the present application, the first screw rod 201, the connecting member 202 and the second screw rod 203 can be distributed at a radial interval as shown in Figure 1 and Figure 2 and can be threadedly connected with two threaded holes provided on the connecting member 202. Alternatively, the second screw rod 203 can be hollow, and then a sleeve structure is used to connect each component to the first screw rod 201 or the second screw rod 203, which can also achieve the technical effect of double driving.

[0036] It should be noted that the radial interval distribution of the first screw rod 201 and the second screw rod 203 is a preferred scheme. Since the probe 105 is usually arranged on the side relative to the entire base 101, the radial interval distribution of the first screw rod 201 and the first driving member 103 connected thereto, the second screw rod 203 and the second driving member 104 connected thereto can facilitate the arrangement of the probe 105 on the side of the two screw rods in the horizontal direction. The interval arrangement can make the structure of the connecting member 202 and the sliding seat 102 more simple, and facilitate the installation of the probe 105.

[0037] Referring to Figures 3 to 5 , in some embodiments of the present application, the first screw rod 201 and the second screw rod 203 have the same length, and the upper end surface of the first screw rod 201 is flush with the upper end surface of the second screw rod 203. The stroke of the two screw rods that can be micro-moved is consistent, which facilitates the synchronous movement from top to bottom as shown in Figures 3 to 5 , thereby improving the utilization rate of the threads on the screw rods.

[0038] Reference Figure 2 and Figure 3 In some embodiments of the present application, the wafer test needle seat 100 further comprises a driving wheel 301, a driven wheel 302 and a belt 303, the power end of the first driving member 103 is connected to the driving wheel 301, the driven wheel 302 is coaxially connected to the first lead screw 201, and the driving wheel 301 is in transmission connection with the driven wheel 302. In this way, the position of the first driving member 103 can be more flexibly installed, for example, it can be distributed with the second driving member 104 and other structures as shown in the figure, avoiding the lifting process of the second driving member 104 from interfering with other components. In some embodiments, the transmission structure of synchronous belt and synchronous wheel can also be used to change the position of the first driving member 103. Figure 1

[0039] In some embodiments of the present application, the wafer test needle seat 100 further comprises two position sensors, which are arranged on the base 101, and the position sensors are respectively used to detect the positions of the first lead screw 201 and the second lead screw 203 relative to the base 101. The position sensor has various forms, for example, it can be arranged in the form of light-sensitive sensing or infrared sensing, etc. By arranging the sensor and fixing the sensor sheet to the first lead screw 201 and the second lead screw 203 respectively, the lifting distance of the first lead screw 201 or the lifting distance of the second lead screw 203 can be determined, so that the height of the probe 105 can be determined, which is convenient for the subsequent judgment of the height of the probe in the wafer test process.

[0040] Reference Figures 3 to 5 According to the control method of the second aspect of the present application, the wafer test needle seat 100 of any one of the first aspect of the present application is controlled, the first lead screw 201 has a plurality of first micro-motion sections along the axial direction, the second lead screw 203 has a plurality of second micro-motion sections along the axial direction, and the probe 105 has a micro-motion section on the movement track. The control method comprises: driving the first lead screw 201 and the second lead screw 203 to lift relative to the connecting member 202, so that any first micro-motion section or any second micro-motion section is in threaded connection with the connecting member 202. The first micro-motion section or the second micro-motion section in threaded connection with the connecting member 202 is driven to micro-move along the vertical direction, so that the probe 105 is lifted in the micro-motion section. Driving the first lead screw 201 to rotate to make the first micro-motion section of the first lead screw 201 micro-move, or driving the second lead screw 203 to rotate to make the second micro-motion section of the second lead screw 203 micro-move, both of which achieve the effect of making the probe 105 micro-move. Since the first micro-motion section and the second micro-motion section both have a plurality of sections, any micro-motion section can be made to micro-move relative to the connecting member 202 by adjusting the rotation of the first lead screw 201 and the second lead screw 203, so as to realize the micro-motion of the probe 105, thereby effectively improving the utilization rate of the lead screw and prolonging the service life of the lead screw. ​

[0041] It should be noted that the first micro-motion section and the second micro-motion section are Figures 3 to 5 The screw portions of the first screw rod 201 and the second screw rod 203 shown in the schematic diagram are divided into a plurality of micro-motion sections along the axial direction according to the micro-motion distance, and the micro-motion section is the wear position of the connection between the screw rod and the connecting piece 202 during the micro-motion of the slide stage.

[0042] It should be noted that in some embodiments of the present application, the control method further comprises determining the highest point and the lowest point that the first screw rod 201 can move relative to the connecting piece 202, and the highest point and the lowest point that the second screw rod 203 can move, by using the position sensor, and obtaining Figure 5 The total displaceable length S is shown, and S is divided into a plurality of first micro-motion sections or second micro-motion sections according to the micro-motion distance, and a coordinate value is assigned, so that the plurality of micro-motion sections can be micro-worn after the first screw rod 201 or the second screw rod 203 moves, and the utilization rate of the screw rod is improved.

[0043] It should be noted that the total displaceable length S is less than the total length of the screw rod, because a part of the micro-motion distance is reserved at the uppermost and lowermost positions of the thread to prevent damage to the screw rod during micro-motion.

[0044] In some embodiments of the present application, the control method further comprises adjusting the position of the probe 105 so that the probe 105 is located in the micro-motion interval in the initial state; and / or, controlling the first driving member 103 to drive the first screw rod 201 to rotate, so that the connecting piece 202 descends relative to the first screw rod 201, and controlling the second driving member 104 to drive the second screw rod 203 to rotate, so that the connecting piece 202 descends synchronously relative to the first screw rod 201 and the second screw rod 203, and the probe 105 is located in the micro-motion interval. The probe 105 can not be raised or lowered during the switching process of the micro-motion section, so that the probe 105 always moves in the preset micro-motion interval, preventing the slide stage and the probe 105 from being too close or too far apart to affect wafer detection. For example, if only the first micro-motion section of the first screw rod 201 is switched, and the second screw rod 203 is not adjusted, the whole body is raised relative to the first screw rod 201, which will cause the probe 105 to be displaced downward as a whole, and although the first micro-motion section is switched, the distance between the slide stage and the probe 105 is too close, which cannot be detected smoothly, and the height of the probe 105 or the slide stage needs to be adjusted separately, which is very troublesome. Therefore, the first screw rod 201 and the second screw rod 203 are Figures 3 to 5 synchronously raised and lowered as shown, which can avoid this problem, and the height of the probe 105 does not change during the switching process of the micro-motion section, and the distance between the slide stage and the probe 105 does not need to be adjusted again.

[0045] It should be noted that the process of synchronous lifting can occur simultaneously or the first lead screw 201 can be adjusted first and then the second lead screw 203 is adjusted, and the synchronous lifting refers to that the first lead screw 201 and the second lead screw 203 move the same distance in the vertical direction relative to the connecting piece 202.

[0046] In some embodiments of the present application, the control method further comprises the following steps: according to the number of times of micro-movement of all the first micro-movement sections and the second micro-movement sections in the connecting piece 202, and making the number of times of micro-movement of any first micro-movement section and second micro-movement section in the connecting piece 202 equal. The first lead screw 201 and the second lead screw 203 can be uniformly worn, and when one of the micro-movement sections is damaged, it means that the area of the first lead screw 201 or the second lead screw 203 that can be micro-moved is basically not usable, and the thread section that can be micro-moved on the whole lead screw is utilized. The number of times of micro-movement of the first micro-movement section and the second micro-movement section in the connecting piece 202 can be obtained in various ways in the automatic control process, for example, the controller can record when executing the micro-movement command, or manually input the number of times of micro-movement to the controller each time the micro-movement is executed.

[0047] In some embodiments of the present application, the step of making the number of times of micro-movement of any first micro-movement section and second micro-movement section in the connecting piece 202 equal comprises: first controlling each first micro-movement section to micro-move n times in the connecting piece 202 in sequence, and then controlling each second micro-movement section to micro-move n times in the connecting piece 202 after all the first micro-movement sections have micro-moved n times in the connecting piece 202, until all the second micro-movement sections have micro-moved n times in the connecting piece 202. When all the micro-movement sections of the first lead screw 201 are operated to a certain extent and then switched to the second lead screw 203, the logic is more simple and direct, which is convenient for program control. In some embodiments, the step of making the number of times of micro-movement of any first micro-movement section and second micro-movement section in the connecting piece 202 equal has various forms, and the first micro-movement section and the second micro-movement section can also be alternately operated, or the first micro-movement section can be switched after all the second micro-movement sections are micro-moved, or the first micro-movement section or the second micro-movement section can be randomly selected for micro-movement and recorded, and it is only necessary to ensure that the number of times of micro-movement of each micro-movement section is close to or equal. N indicates that the probe 105 is lifted n times, and each lifting means that a die test is performed. In the micro-movement process, the micro-movement section will be greatly worn after the lead screw reciprocates a certain number of times, and the lead screw needs to be replaced or switched to a new micro-movement section. N times represent a numerical range in which the lead screw reciprocates a certain number of times without being damaged, for example, n can be preset to be between 300 and 800, and preferably can be set to 500, that is, the micro-movement section can be switched to a new micro-movement section after being lifted five hundred times.

[0048] In some embodiments of the present application, before the n times of micro-movement of each first micro-movement section in the connecting member 202 is sequentially controlled, the control method further comprises: controlling the first driving member 103 and the second driving member 104 to rotate to move the connecting member 202 to the uppermost first micro-movement section and the second micro-movement section, controlling the uppermost first micro-movement section to move n times in the connecting member 202 first, then sequentially controlling each first micro-movement section to move n times in the connecting member 202 from top to bottom until the lowermost first micro-movement section moves in the connecting member 202, and controlling the second micro-movement section to move n times in the connecting member 202 from bottom to top until the uppermost second micro-movement section moves in the connecting member 202, and controlling the first lead screw 201 and the second lead screw 203 to synchronously ascend and descend relative to the connecting member 202 except when the first micro-movement section or the second micro-movement section is moving in the connecting member 202. The switching process of the micro-movement section can be made more natural, and the first micro-movement section is used from the uppermost first micro-movement section first. During the switching process of the first micro-movement section from top to bottom, the second lead screw 203 and the first lead screw 201 also ascend synchronously, so that when the lowermost first micro-movement section is used, the lowermost second micro-movement section in the second lead screw 203 is also connected with the connecting member 202. At this time, the use of the second micro-movement section is switched upward one by one to realize a cycle, and the first lead screw 201 and the second lead screw 203 are stopped and replaced when a certain first micro-movement section or second micro-movement section is damaged.

[0049] The wafer testing device according to the third aspect of the present application comprises a wafer testing needle seat 100 according to any one of the first aspect of the present application and a wafer stage. The wafer stage is arranged below the probe 105 and is used to place a wafer. The first micro-movement section of the first lead screw 201 is driven to rotate to move, or the second micro-movement section of the second lead screw 203 is driven to rotate to move, to realize the micro-movement of the probe 105. Since the first micro-movement section and the second micro-movement section both have multiple micro-movement sections, any micro-movement section can be adjusted to move relative to the connecting member 202 by adjusting the rotation of the first lead screw 201 and the second lead screw 203 to achieve the technical effect of the micro-movement of the probe 105, thereby improving the utilization rate of the lead screw and prolonging the service life of the lead screw. The wafer testing device using the wafer testing needle seat 100 can also effectively improve the overall service life and reduce the frequency of replacement of vulnerable parts.

[0050] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application. Furthermore, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A wafer test socket, characterized by, The application relates to a wafer test probe base, which comprises a base, a sliding base, a first screw rod, a first driving part, a connecting part, a second screw rod, a second driving part and a probe. The first driving part is fixedly arranged on the base. The sliding base is slidably connected to the base in the vertical direction, the probe and the second driving part are fixedly arranged on the sliding base, and the second screw rod is connected with the second driving part. The first screw rod and the second screw rod are spaced apart along the radial direction of the first screw rod and are both threadedly connected with the connecting part. The first driving part is used for driving the first screw rod to rotate, so that the connecting part and the second screw rod are lifted relative to the first screw rod, thereby lifting the sliding base and the probe. The second driving part is used for driving the second screw rod to rotate, so that the second screw rod is lifted relative to the connecting part, thereby lifting the sliding base and the probe. The first screw rod has a plurality of first micro-motion sections along the axial direction, the second screw rod has a plurality of second micro-motion sections along the axial direction, and the probe has a micro-motion interval in the movement track. The connecting part can be lifted relative to the first screw rod to be threadedly connected with any first micro-motion section and to be micro-moved in the vertical direction, thereby lifting the probe in the micro-motion interval, and the second screw rod can be lifted relative to the connecting part to make any second micro-motion section threadedly connected with the connecting part and micro-moved in the vertical direction, thereby lifting the probe in the micro-motion interval. The first screw rod and the second screw rod have the same length, and the upper end surface of the first screw rod is flush with the upper end surface of the second screw rod.

2. The wafer test socket of claim 1, wherein, The wafer test probe base further comprises a driving wheel, a driven wheel and a belt, the power end of the first driving part is connected with the driving wheel, the driven wheel is coaxially connected with the first screw rod, and the driving wheel is in transmission connection with the driven wheel.

3. The wafer test socket of claim 1, wherein, The wafer test probe base further comprises two position sensors, the two position sensors are arranged on the base, and the position sensors are respectively used for detecting the positions of the first screw rod and the second screw rod relative to the base.

4. The wafer test socket of claim 1, wherein, The first screw rod has a plurality of first micro-motion sections along the axial direction, the second screw rod has a plurality of second micro-motion sections along the axial direction, and the probe has a micro-motion interval in the movement track, and the control method comprises the following steps:

5. A method of controlling a pin block for testing a wafer, the method comprising: controlling the pin block of any one of claims 1 to 4, wherein The first screw rod and the second screw rod are driven to be lifted relative to the connecting part, so that the connecting part is moved to any first micro-motion section or any second micro-motion section; The first micro-motion section or the second micro-motion section threadedly connected with the connecting part is driven to be micro-moved in the vertical direction, so that the probe is lifted in the micro-motion interval. The control method further comprises the following steps:

6. The control method according to claim 5, characterized by The position of the probe is adjusted, and the probe is located in the micro-motion interval in the initial state; And / or, the first driving part is controlled to drive the first screw rod to rotate, the connecting part is controlled to be lowered relative to the first screw rod, the second driving part is controlled to drive the second screw rod to rotate, the connecting part is controlled to be synchronously lowered relative to the first screw rod and the second screw rod, and the probe is located in the micro-motion interval. ​ 7. The control method according to claim 5, characterized by, The control method further comprises the following steps: according to the number of times of micro-movement of all the first micro-movement sections and the second micro-movement sections in the connecting member, and making the number of times of micro-movement of any first micro-movement section and the second micro-movement section in the connecting member equal.

8. The control method according to claim 7, characterized by The step of making the number of times of micro-movement of any first micro-movement section and the second micro-movement section in the connecting member equal comprises: first controlling each first micro-movement section to micro-move n times in the connecting member in sequence, and then controlling each second micro-movement section to micro-move n times in the connecting member after all the first micro-movement sections have micro-moved n times in the connecting member, until all the second micro-movement sections have micro-moved n times in the connecting member.

9. The control method according to claim 8, characterized by, Before the step of controlling each first micro-movement section to micro-move n times in the connecting member in sequence, the control method further comprises: controlling the first driving member and the second driving member to rotate to make the connecting member move to the uppermost first micro-movement section and the second micro-movement section, first controlling the uppermost first micro-movement section to micro-move n times in the connecting member, then controlling each first micro-movement section to micro-move n times in the connecting member in sequence from top to bottom until the lowermost first micro-movement section moves in the connecting member, and controlling the second micro-movement sections to micro-move n times in the connecting member from bottom to top one by one until the uppermost second micro-movement section moves in the connecting member, and controlling the first screw and the second screw to ascend and descend synchronously relative to the connecting member except when the first micro-movement section or the second micro-movement section micro-moves in the connecting member.

10. A wafer testing apparatus characterized by comprising: Comprise: The wafer test needle seat of any one of claims 1 to 4; The slide stage is arranged below the probe in a spaced manner, and the slide stage is used to place a wafer. The slide stage is arranged below the probe in a spaced manner, and the slide stage is used to place a wafer.

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