Heat dissipation module and electronic equipment

Abstract

The embodiment of the invention provides a heat dissipation module and electronic equipment, and relates to the technical field of heat dissipation of electronic products. The heat dissipation module comprises a temperature uniforming plate, the temperature uniforming plate comprises a first temperature uniforming plate body, at least one transition plate body and at least one second temperature uniforming plate body, the second temperature uniforming plate body is correspondingly connected with the first temperature uniforming plate body through the transition plate body, and the second temperature uniforming plate body extends in the direction away from the first temperature uniforming plate body. The first temperature-uniforming plate body and the second temperature-uniforming plate body have a height interval in the direction perpendicular to the plane where the first temperature-uniforming plate body is located, and the first temperature-uniforming plate body and the second temperature-uniforming plate body are used for being connected with to-be-cooled pieces with different heights respectively. Therefore, the applicability is improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic products, and in particular to a heat dissipation module and electronic device. Background Art

[0002] Laptops, as electronic products, are widely used in personal and business settings due to their thinness, lightness, and portability. Laptops are equipped with a cooling module that can dissipate heat from core components such as the processor and graphics processing unit.

[0003] In related technologies, the heat dissipation module includes a vapor chamber, which is a planar structure. By connecting the planar vapor chamber to the component that needs to be cooled, the heat generated by the component can be conducted to the vapor chamber. The heat conducted by the vapor chamber is then carried away by the fan inside the laptop, thereby achieving heat dissipation of the component.

[0004] However, due to the limited space inside a laptop, when different chips are installed at different heights, the planar vapor chamber cannot be connected to chips of different heights. This prevents the vapor chamber from simultaneously cooling multiple chips of different heights, thus reducing the applicability of the cooling module. Summary of the Invention

[0005] This application provides a heat dissipation module and an electronic device to solve the technical problem that heat dissipation modules with planar structures in related technologies cannot be connected to chips of different heights, thus failing to dissipate heat from multiple chips of different heights and reducing the applicability of the heat dissipation module.

[0006] In a first aspect, embodiments of this application provide a heat dissipation module, including a heat spreader. The heat spreader includes a first heat spreader body, at least one transition plate body, and at least one second heat spreader body. The second heat spreader body is connected to the first heat spreader body via the transition plate body. The second heat spreader body extends in a direction away from the first heat spreader body. The first heat spreader body and the second heat spreader body have a height gap along a direction perpendicular to the plane where the first heat spreader body is located. The first heat spreader body and the second heat spreader body are respectively used to connect to heat dissipation components of different heights.

[0007] In some embodiments, two second heat exchanger bodies are provided, and the two second heat exchanger bodies are respectively provided on opposite sides of the first heat exchanger body. The first heat exchanger body and the second heat exchanger body are parallel, and the two second heat exchanger bodies extend in the same direction. The transition plate body is inclinedly provided between the first heat exchanger body and the second heat exchanger body.

[0008] In some embodiments, the heat spreader includes a housing and a cover, wherein both the housing and the cover include:

[0009] The system comprises a first heat dissipation part, at least one connecting part, and at least one second heat dissipation part, wherein the second heat dissipation part is connected to the first heat dissipation part via the connecting part.

[0010] The first heat dissipation part, the connecting part, and the second heat dissipation part of the cover are respectively covered on the first heat dissipation part, the connecting part, and the second heat dissipation part of the housing, and the first heat dissipation part, the connecting part, and the second heat dissipation part of the cover are respectively connected to the first heat dissipation part, the connecting part, and the second heat dissipation part of the housing.

[0011] The first heat dissipation part of the cover and the first heat dissipation part of the shell together form the first heat spreader body, the connecting part of the cover and the connecting part of the shell together form the second heat spreader body, and the second heat dissipation part of the cover and the second heat dissipation part of the shell together form the second heat spreader body.

[0012] In some embodiments, a vacuum cavity is formed between the housing and the cover, and the vacuum cavity is used to fill a heat dissipation medium.

[0013] In some embodiments, a plurality of grooves are uniformly provided on the inner wall of the housing. The depth of the grooves is greater than or equal to 10 μm and less than or equal to 100 μm, and / or the width of the grooves is greater than or equal to 10 μm and less than or equal to 150 μm.

[0014] In some embodiments, a capillary layer is provided on at least one of the inner wall of the groove and the inner bottom wall of the housing, and in the region between adjacent grooves.

[0015] In some embodiments, the capillary layer is provided in multiple layers, and the mesh count of the multiple capillary layers decreases sequentially along the direction close to the cover.

[0016] In some embodiments, a support member is further included, which is disposed between the housing and the cover, and the two ends of the support member are respectively connected to the housing and the cover.

[0017] In some embodiments, the support member includes support columns, and a plurality of support columns are provided between the first heat dissipation portion of the housing and the first heat dissipation portion of the cover, as well as between the second heat dissipation portion of the housing and the second heat dissipation portion of the cover; and / or, the support member includes support bars, and a plurality of support bars are provided between the connecting portion of the housing and the connecting portion of the cover, the support bars extending from the first heat dissipation portion toward the second heat dissipation portion.

[0018] Secondly, this application provides an electronic device, including a device body and a heat dissipation module disposed on the device body.

[0019] This application provides a heat dissipation module and an electronic device. The heat dissipation module provided by this application forms a height gap between a first heat spreader body and a second heat spreader body, so that the first heat spreader body and the second heat spreader body can be connected to heat dissipation components of different heights. This allows the same heat spreader to be used for multiple heat dissipation components of different heights, thereby indirectly improving the applicability of the heat dissipation module. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] Figure 1 This is a schematic diagram of the heat dissipation module provided in this application;

[0022] Figure 2 for Figure 1 A structural diagram from another angle;

[0023] Figure 3 Exploded view of the heat dissipation module provided in this application Figure 1 ;

[0024] Figure 4 Exploded view of the heat dissipation module provided in this application Figure 2 ;

[0025] Figure 5 for Figure 3 Structural schematic diagram of the middle shell and supporting components;

[0026] Figure 6 for Figure 3 A schematic diagram of the structure of the middle shell and the groove.

[0027] Explanation of reference numerals in the attached figures:

[0028] 100. Heat spreader; 101. First heat spreader body; 102. Transition plate body; 103. Second heat spreader body;

[0029] 110. First heat dissipation unit;

[0030] 120. Second heat dissipation section; 121. Height spacing;

[0031] 130. Connecting part;

[0032] 140. Shell; 141. Groove;

[0033] 150. Cover; 151. Vacuum cavity;

[0034] 160. Capillary layer;

[0035] 170. Support component; 171. Support column; 172. Support bar.

[0036] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. Detailed Implementation

[0037] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0038] In electronic devices such as laptops, heat dissipation modules ensure that the device will not be affected by overheating during operation, thus preventing performance loss or damage. Related heat dissipation modules include vapor chambers, which typically have a planar structure. These vapor chambers conduct heat rapidly to the components being cooled (such as processors and graphics cards) through direct contact. Subsequently, the heat on the vapor chamber is carried away by cooling devices such as fans inside the laptop, thereby achieving effective heat dissipation.

[0039] However, this planar vapor chamber has certain limitations when dealing with chips of different heights. Due to the limited internal space of laptops, chips and other electronic components are being compressed in size. When different chips are installed at different heights, the planar vapor chamber cannot make close contact with multiple chips of different heights at the same time, resulting in some chips not being able to dissipate heat effectively, thus reducing the overall applicability of the heat dissipation module.

[0040] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0041] Combination Figures 1 to 6This application provides a heat dissipation module, including a heat spreader 100. The heat spreader 100 includes a first heat spreader body 101, at least one transition plate body 102, and at least one second heat spreader body 103. The second heat spreader body 103 is connected to the first heat spreader body 101 via the transition plate body 102. The second heat spreader body 103 extends away from the first heat spreader body 101. The first heat spreader body 101 and the second heat spreader body 103 have a height gap 121 along a direction perpendicular to the plane where the first heat spreader body 101 is located. The first heat spreader body 101 and the second heat spreader body 103 are respectively used to connect to heat dissipation components of different heights.

[0042] In this application, by forming a height gap 121 between the first heat exchanger body 101 and the second heat exchanger body 103, the first heat exchanger body 101 and the second heat exchanger body 103 can be connected to heat dissipation components of different heights, so that the same heat exchanger can be used for multiple heat dissipation components of different heights, thereby indirectly improving the applicability of the heat dissipation module.

[0043] There are two second heat exchanger bodies 103, which are respectively disposed on opposite sides of the first heat exchanger body 101. The first heat exchanger body 101 and the second heat exchanger body 103 are parallel, and the two second heat exchanger bodies 103 extend in the same direction. The transition plate body 102 is inclinedly disposed between the first heat exchanger body 101 and the second heat exchanger body 103.

[0044] In this application, by employing a transition plate body 102 and tilting it between the first heat exchange plate body 101 and the second heat exchange plate body 103, the first heat exchange plate body 101 and the second heat exchange plate body 103 are made parallel. This allows the first heat exchange plate body 101 and the second heat exchange plate body 103 to indirectly increase the connection area between them and the heat exchange plate body 101 and the heat exchange plate body 103 when they are connected to the heat exchange plate body 103, thereby indirectly improving the heat conduction efficiency of the first heat exchange plate body 101 and the second heat exchange plate body 103 on the heat exchange plate body, and thus improving the heat dissipation efficiency of the heat exchange plate body.

[0045] The heat spreader 100 includes a housing 140 and a cover 150, both of which include:

[0046] A first heat dissipation part 110, at least one connecting part 130 and at least one second heat dissipation part 120, wherein the second heat dissipation part 120 is connected to the first heat dissipation part 110 via the connecting part 130.

[0047] The first heat dissipation part 110, the connecting part 130, and the second heat dissipation part 120 of the cover 150 are respectively covered on the first heat dissipation part 110, the connecting part 130, and the second heat dissipation part 120 of the housing 140, and the first heat dissipation part 110, the connecting part 130, and the second heat dissipation part 120 of the cover 150 are respectively connected to the first heat dissipation part 110, the connecting part 130, and the second heat dissipation part 120 of the housing 140.

[0048] The first heat dissipation part 110 of the cover 150 and the first heat dissipation part 110 of the shell 140 together form the first heat spreader body 101. The connecting part 130 of the cover 150 and the connecting part 130 of the shell 140 together form the second heat spreader body 103. The second heat dissipation part 120 of the cover 150 and the second heat dissipation part 120 of the shell 140 together form the second heat spreader body 103.

[0049] In this embodiment, both the first heat dissipation part 110 and the second heat dissipation part 120 are rectangular. The width of the rectangular first heat dissipation part 110 is greater than the width of the rectangular second heat dissipation part 120, and the two second heat dissipation parts 120 are respectively disposed at one end of the opposite edges of the first heat dissipation part 110.

[0050] In other embodiments, the number and shape of the first heat dissipation part 110 and the second heat dissipation part 120 can be adaptively adjusted as needed. For example, when it is necessary to dissipate heat from four chips, three second heat dissipation parts 120 can be provided. The height of the three second heat dissipation parts 120 can be adjusted according to the height of the chips so that the three second heat dissipation parts 120 form a height gap 121 with the first heat dissipation part 110. The first heat dissipation part 110 and the three second heat dissipation parts 120 are respectively connected to the four chips so that the first heat dissipation part 110 and the three second heat dissipation parts 120 dissipate heat from four chips of different heights. According to the internal space of the laptop, the shape of the first heat dissipation part 110 and the second heat dissipation part 120 can be adjusted, for example, the first heat dissipation part 110 and the second heat dissipation part 120 can be set as circles, etc.

[0051] A vacuum cavity 151 is formed between the housing 140 and the cover 150, and the vacuum cavity 151 is used to fill the heat dissipation medium.

[0052] In this embodiment, the first heat dissipation part 110 and the second heat dissipation part 120 of the housing 140 are used to connect with the component to be cooled. The first heat dissipation part 110 and the second heat dissipation part 120 of the housing 140 are evaporation zones, and the first heat dissipation part 110 and the second heat dissipation part 120 of the cover 150 are condensation zones.

[0053] In this application, a vacuum chamber 151 is used and filled with a heat dissipation medium. By utilizing the latent heat of phase change of the heat dissipation medium during evaporation and condensation, heat is rapidly absorbed and converted into vapor within the vacuum chamber 151. Subsequently, the vapor releases its latent heat and condenses into a liquid. This process not only achieves efficient heat transfer but also rapidly diffuses heat to the entire surface of the first heat dissipation part 110, the connecting part 130, and the second heat dissipation part 120. When the fan blows towards the heat spreader 100, uniform heat dissipation over a large area is achieved, thereby improving heat dissipation efficiency. In addition, the vacuum environment reduces thermal resistance and further improves heat conduction efficiency, enabling the heat spreader 100 to quickly dissipate the heat from the high-heat-load component in a short time, effectively reducing the temperature of the component and improving the stability and performance of the electronic device.

[0054] In this embodiment, deionized water is used as the heat dissipation medium. By removing minerals and impurities from the water, deionized water significantly reduces its conductivity, making it a good insulator and avoiding the risk of short circuits that may occur during the heat dissipation process of electronic devices. At the same time, deionized water has a high specific heat capacity and good thermal conductivity, which can efficiently absorb and transfer heat, thereby achieving rapid heat dissipation. In addition, the purity of deionized water reduces the risk of scale and corrosion, extending the service life of the heat dissipation module. Meanwhile, it is low in cost and environmentally friendly, making it suitable for widespread application in various heat dissipation scenarios.

[0055] In other embodiments, the heat dissipation medium may be replaced with ethanol.

[0056] In this embodiment, the first heat dissipation part 110, the second heat dissipation part 120, and the connecting part 130 of the housing 140 are integrally formed. Different numbers of the first heat dissipation part 110, the second heat dissipation part 120, and the connecting part 130 are formed by bending the housing 140 at different positions. The first heat dissipation part 110, the second heat dissipation part 120, and the connecting part 130 of the cover 150 are integrally formed. Different numbers of the first heat dissipation part 110, the second heat dissipation part 120, and the connecting part 130 are formed by bending the cover 150 at different positions.

[0057] Multiple grooves 141 are evenly arranged on the inner wall of the housing 140.

[0058] In this embodiment, the outer walls of the first heat dissipation part 110 and the second heat dissipation part 120 of the housing 140 are connected to the chip through a thermally conductive layer.

[0059] In this application, a groove 141 is provided on the inner wall of the housing 140 of the heat spreader 100. The groove 141 increases the surface area of ​​the inner wall of the heat spreader 100, thereby indirectly improving the heat conduction efficiency, so that the heat generated by the chip can be transferred to the interior of the heat spreader 100 more quickly. In addition, the groove 141 reduces the thermal resistance by reducing the thickness of the housing 140, so that heat can be conducted through the housing 140 more quickly, thereby further improving the heat transfer efficiency. At the same time, the groove 141 can enhance the capillary reflux capability, promote the circulation of the heat dissipation medium in the evaporation and condensation process, and further improve the heat dissipation performance.

[0060] In this embodiment, the groove 141 can be formed by chemical etching or laser etching.

[0061] In this embodiment, the cross-section of the groove 141 is rectangular; in other embodiments, the cross-section of the groove 141 may also be circular or the like.

[0062] The depth of the etched groove 141 is greater than or equal to 10 μm and less than or equal to 100 μm, and / or the width of the groove 141 is greater than or equal to 10 μm and less than or equal to 150 μm.

[0063] In this application, the size of the groove 141 directly affects the magnitude of capillary force. Appropriate depth and width can generate sufficient capillary force, enabling the heat dissipation medium to quickly absorb heat and evaporate, while also being able to condense smoothly and flow back to the evaporation zone, maintaining an efficient heat dissipation cycle. Secondly, the groove 141 within this size range can increase the surface area of ​​the inner wall of the heat spreader 100, thereby reducing thermal resistance and improving heat conduction efficiency, allowing the heat generated by the chip to be transferred to the interior of the heat spreader 100 more quickly. In addition, a reasonable groove 141 size can effectively prevent the heat dissipation medium from becoming excessively concentrated during the evaporation process, avoid local drying, ensure the uniform distribution of the heat dissipation medium, and maintain the long-term stable operation of the heat dissipation system.

[0064] A capillary layer 160 is provided on at least one of the inner wall of the groove 141 and the inner bottom wall of the housing 140, and in the area between adjacent grooves 141.

[0065] A capillary layer 160 is provided on the inner wall of the groove 141 and the inner bottom wall of the shell 140, and in the area between adjacent grooves 141.

[0066] In this application, the capillary layer 160 can significantly enhance the return flow capability of the heat dissipation medium. The micropore structure inside the capillary layer 160 generates a strong capillary force, ensuring that the heat dissipation medium can quickly return to the inner wall of the housing 140 after condensation on the inner wall of the cover 150, thereby maintaining an efficient heat dissipation cycle. The combination of the capillary layer 160 and the groove 141 further increases the surface area of ​​the inner wall of the housing 140, improves the heat conduction efficiency, and enables the heat generated by the chip to be transferred to the interior of the heat spreader 100 more quickly and diffused evenly.

[0067] In this embodiment, the capillary layer 160 can be produced using a sintering process. The sintering process involves filling a mold with metal powder and sintering it at a high temperature to form a porous capillary layer 160 with a uniform pore structure. The advantage of this method is that it allows for precise control of porosity and pore size, thereby optimizing capillary force and thermal conductivity. The sintered capillary layer 160 exhibits good mechanical strength and thermal stability, making it suitable for applications with high heat loads and requiring high-precision heat dissipation.

[0068] In some embodiments, the capillary layer 160 can also be made using a braiding process, which involves weaving metal wires into a mesh structure to form the capillary layer 160. The advantage of this process is that it is relatively simple to manufacture, has a low cost, and can flexibly adjust the braiding density to adapt to different heat dissipation requirements. The braided capillary layer 160 has good flexibility and plasticity, can adapt to complex geometries, and is suitable for heat dissipation systems that require customized design.

[0069] In some embodiments, the capillary layer 160 may also employ a foam metal process, which manufactures foam metal through chemical or physical methods to form a capillary layer 160 with a three-dimensional porous structure. The advantage of this process is that it can produce a structure with high specific surface area and high porosity, thereby providing strong capillary force and efficient thermal conductivity. The three-dimensional structure of the foam metal helps to distribute heat evenly and reduce local overheating, making it particularly suitable for applications with high heat flux density.

[0070] In some embodiments, the capillary layer 160 is provided with multiple layers, and the mesh count of the multiple capillary layers 160 decreases sequentially along the direction close to the cover 150.

[0071] In this embodiment, the capillary layer 160 is provided in two layers, and the mesh count of the capillary layer 160 near the inner bottom wall of the housing 140 is higher than that of the capillary layer 160 far from the inner bottom wall of the housing 140.

[0072] In this application, the high-mesh capillary layer 160 close to the heat-dissipating component can quickly absorb and disperse the heat generated by the component. Utilizing its small pore size and high capillary force, it rapidly transfers heat to the heat dissipation medium, promoting the evaporation of the heat dissipation medium. As heat is transferred away from the chip, the gradually decreasing mesh size of the capillary layer 160 provides a larger pore size, which helps reduce the flow resistance of the heat dissipation medium and ensures that the heat dissipation medium can flow back to the inner wall of the housing 140 more smoothly, maintaining an efficient heat dissipation cycle. This high-to-low mesh size distribution not only optimizes the heat transfer path but also improves the heat dissipation efficiency and uniformity of the entire vapor chamber 100.

[0073] The heat dissipation module also includes a support member 170, which is disposed between the housing 140 and the cover 150, with both ends of the support member 170 connected to the housing 140 and the cover 150 respectively.

[0074] In this application, the support member 170 can ensure a stable distance between the housing 140 and the cover 150, thereby maintaining the structural integrity of the heat spreader 100 and preventing deformation caused by changes in external pressure or internal working fluid pressure; the support member 170 can enhance the overall mechanical strength of the heat spreader 100, enabling it to withstand higher pressure and load, and extend its service life.

[0075] The support member 170 includes support columns 171, and multiple support columns 171 are provided between the first heat dissipation part 110 of the housing 140 and the first heat dissipation part 110 of the cover 150, as well as between the second heat dissipation part 120 of the housing 140 and the second heat dissipation part 120 of the cover 150.

[0076] In this embodiment, the support column 171 is cylindrical. One end of the cylindrical support column 171 is connected to the first heat dissipation part 110 and the second heat dissipation part 120 of the housing 140, and the other end of the cylindrical support column 171 is connected to the first heat dissipation part 110 and the second heat dissipation part 120 of the cover 150. A plurality of support columns 171 are evenly distributed between the first heat dissipation part 110 of the housing 140 and the first heat dissipation part 110 of the cover 150, as well as between the second heat dissipation part 120 of the housing 140 and the second heat dissipation part 120 of the cover 150.

[0077] In this application, by using multiple support columns 171, the contact area between the support column 171 and the heat dissipation medium is indirectly increased. The support column 171 can transfer the heat from the bottom wall of the housing 140 to the heat dissipation medium, thereby further improving the heat conduction efficiency of the heat spreader 100. Furthermore, the use of support columns 171 results in a simple structure and improves the support strength for the housing 140 and the cover 150.

[0078] The support member 170 includes support bars 172. Multiple support bars 172 are provided between the connecting portion 130 of the housing 140 and the connecting portion 130 of the cover 150. The support bars 172 extend from the first heat dissipation portion 110 toward the second heat dissipation portion 120.

[0079] In this embodiment, three support bars 172 are provided between the connecting portion 130 of the housing 140 and the connecting portion 130 of the cover 150. The three support bars 172 are parallel and spaced apart. One side of the support bar 172 is connected to the connecting portion 130 of the housing 140, and the other side of the support bar 172 is connected to the connecting portion 130 of the cover 150.

[0080] In this application, since the connecting part 130 is inclinedly disposed between the first heat dissipation part 110 and the second heat dissipation part 120, the contact area between the connecting part 130 of the housing 140 and the connecting part 130 of the cover 150 is indirectly increased by the use of the support bar 172, thereby indirectly improving the strength of the connecting part 130.

[0081] This application also provides an electronic device, including a device body and a heat dissipation module of any of the above embodiments disposed on the device body.

[0082] The specific structure of the heat dissipation module has been described in detail in the above embodiments, and will not be repeated here.

[0083] In this embodiment, the electronic device is a laptop computer; in other embodiments, the electronic device may also be an electric vehicle, an energy storage system, or a mobile phone.

[0084] The electronic device provided in this application, by setting a heat dissipation module, connects the outer walls of the first heat dissipation part 110 and the second heat dissipation part 120 of the housing 140 to the component to be cooled via a heat-conducting layer. Because the connecting part 130 of the housing 140 and the connecting part 130 of the cover 150 are inclinedly disposed between the first heat dissipation part 110 and the second heat dissipation part 120 of the housing 140 and the first heat dissipation part 110 and the second heat dissipation part 120 of the cover 150, a height gap 121 is formed between the first heat-dissipating plate body 101 and the second heat-dissipating plate body 103, allowing the first heat dissipation part 110 and the second heat dissipation part 120 of the housing 140 to the component to be cooled at different heights. This allows the same heat spreader 100 to be used for multiple components with different heights, thereby indirectly improving the applicability of the heat dissipation module. When the component generates heat, the heat generated by the component can be conducted to the heat dissipation medium through the heat-conducting layer, the bottom wall of the housing 140, the groove 141 and the capillary layer 160 in sequence. At this time, the heat dissipation medium evaporates and moves towards the top wall of the cover 150. The cooling fan in the electronic device can carry away the heat generated by the heat spreader 100, so that the heat dissipation medium condenses and returns to the inner bottom wall of the housing 140 and the groove 141 through the capillary layer 160, thereby circulating heat dissipation and improving the heat dissipation efficiency of the component.

[0085] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A heat dissipation module, characterized in that, The device includes a heat exchange plate (100), which includes a first heat exchange plate body (101), at least one transition plate body (102), and at least one second heat exchange plate body (103). The second heat exchange plate body (103) is connected to the first heat exchange plate body (101) through the transition plate body (102). The second heat exchange plate body (103) extends in a direction away from the first heat exchange plate body (101). The first heat exchange plate body (101) and the second heat exchange plate body (103) have a height gap (121) in a direction perpendicular to the plane where the first heat exchange plate body (101) is located. The first heat exchange plate body (101) and the second heat exchange plate body (103) are respectively used to connect to heat dissipation components of different heights.

2. The heat dissipation module according to claim 1, characterized in that, Two second temperature equalization plate bodies (103) are provided, and the two second temperature equalization plate bodies (103) are respectively provided on opposite sides of the first temperature equalization plate body (101). The first temperature equalization plate body (101) and the second temperature equalization plate body (103) are parallel, and the two second temperature equalization plate bodies (103) extend in the same direction. The transition plate body (102) is inclinedly provided between the first temperature equalization plate body (101) and the second temperature equalization plate body (103).

3. The heat dissipation module according to claim 1, characterized in that, The temperature distribution plate (100) includes a shell (140) and a cover (150), both the shell (140) and the cover (150) comprising: The system comprises a first heat dissipation part (110), at least one connecting part (130), and at least one second heat dissipation part (120), wherein the second heat dissipation part (120) is connected to the first heat dissipation part (110) via the connecting part (130); The first heat dissipation part (110), the connecting part (130), and the second heat dissipation part (120) of the cover (150) are respectively covered on the first heat dissipation part (110), the connecting part (130), and the second heat dissipation part (120) of the housing (140), and the first heat dissipation part (110), the connecting part (130), and the second heat dissipation part (120) of the cover (150) are respectively connected to the first heat dissipation part (110), the connecting part (130), and the second heat dissipation part (120) of the housing (140); The first heat dissipation portion (110) of the cover (150) and the first heat dissipation portion (110) of the shell (140) together form the first heat spreader body (101), the connecting portion (130) of the cover (150) and the connecting portion (130) of the shell (140) together form the second heat spreader body (103), and the second heat dissipation portion (120) of the cover (150) and the second heat dissipation portion (120) of the shell (140) together form the second heat spreader body (103).

4. The heat dissipation module according to claim 3, characterized in that, A vacuum cavity (151) is formed between the housing (140) and the cover (150), and the vacuum cavity (151) is filled with a heat dissipation medium.

5. The heat dissipation module according to claim 4, characterized in that, The inner wall of the housing (140) is uniformly provided with a plurality of grooves (141). The depth of the grooves (141) is greater than or equal to 10 μm and less than or equal to 100 μm, and / or the width of the grooves (141) is greater than or equal to 10 μm and less than or equal to 150 μm.

6. The heat dissipation module according to claim 5, characterized in that, A capillary layer (160) is provided on at least one of the inner wall of the groove (141) and the inner bottom wall of the housing (140) and in the region between adjacent grooves (141).

7. The heat dissipation module according to claim 6, characterized in that, The capillary layer (160) is provided in multiple layers, and the mesh count of the multiple capillary layers (160) decreases sequentially along the direction close to the cover (150).

8. The heat dissipation module according to any one of claims 3-7, characterized in that, It also includes a support member (170), which is disposed between the housing (140) and the cover (150), and the two ends of the support member (170) are respectively connected to the housing (140) and the cover (150).

9. The heat dissipation module according to claim 8, characterized in that, The support member (170) includes support columns (171), and a plurality of support columns (171) are provided between the first heat dissipation part (110) of the housing (140) and the first heat dissipation part (110) of the cover (150) and the second heat dissipation part (120) of the housing (140) and the second heat dissipation part (120) of the cover (150), and / or, the support member (170) includes support bars (172), and a plurality of support bars (172) are provided between the connecting part (130) of the housing (140) and the connecting part (130) of the cover (150), and the support bars (172) extend from the first heat dissipation part (110) toward the second heat dissipation part (120).

10. An electronic device, characterized in that, It includes a device body and a heat dissipation module as described in any one of claims 1-9, disposed on the device body.

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