Modularized aluminum alloy heat dissipation device

Abstract

The invention relates to the technical field of heat dissipation devices, in particular to a modularized aluminum alloy heat dissipation device. Comprising a hood, a heat dissipation fan, a support, heat dissipation fins, a heat pipe and a heat dissipation base, an air supply mechanism is arranged on the hood close to the exhaust end of the heat dissipation fan, the air supply mechanism comprises an air inducing part and an air adjusting part, the air inducing part is communicated with the exhaust end of the heat dissipation fan, the air adjusting part is located on the heat dissipation base and attached to the air inducing part, and the heat pipe is arranged on the support. In the heat dissipation stage, the air adjusting part is responsible for adjusting the air outlet amount of the air inducing part according to the temperature of the central processing unit. Cold air at the exhaust end of the cooling fan is introduced into the exhaust box by means of the air inducing box, the ambient temperature around the central processing unit is sensed according to the memory spring, and the number of the opened exhaust outlets is automatically controlled in cooperation with the air adjusting plate so as to strengthen cooling, and transverse cold air and longitudinal air flow intersect and neutralize the temperature of the longitudinal air flow. The distance between cold air and the central processing unit can be shortened while heat on the heat dissipation fins is taken away, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation device technology, and more specifically, to a modular aluminum alloy heat dissipation device. Background Technology

[0002] Electronic components such as central processing units generate a lot of heat during normal operation. If the heat is not removed in time, it will accumulate and cause the temperature to rise, which will seriously affect the normal operation of electronic components. Existing heat sinks are usually divided into heat source contact modules (such as thermal conductive substrates), heat dissipation main modules (such as fin groups) and airflow control modules (such as fans).

[0003] Currently, Chinese Patent Publication No. CNCN101662921A discloses a heat dissipation device, including a heat sink, a fan, and an air guide shroud. The heat sink includes several spaced-apart heat dissipation fins, with airflow channels formed between the fins. The air guide shroud connects the fan and the heat sink, and includes a hollow frame and an opening connected to the frame. The opening is connected to the heat sink, and the frame is connected to the fan. The opening includes a first sidewall and a second sidewall, forming a space between the two sidewalls. The first and second sidewalls respectively cover two adjacent sides of the heat sink, and the space is connected to the airflow channels between the heat dissipation fins. Secondly, a computer device using this heat dissipation device is also disclosed. The fan draws airflow from two sides of the heat sink through the air guide shroud, increasing the air intake area and improving the overall heat dissipation effect of the computer device system.

[0004] In existing technologies, fans adjust their speed according to changes in the central processing unit's temperature to ensure normal operation of the equipment. However, for down-draft radiators, the fins closer to the central processing unit receive more heat. Regardless of whether the central processing unit is at a high or low temperature, the airflow blown by the fan towards the fins is always from top to bottom. This results in the topmost fins exchanging heat with the cool air first, making this part of the fins highly efficient. Meanwhile, the bottom fins exchange heat with the warmer cool air, resulting in low heat exchange efficiency and thus affecting the cooling effect. Summary of the Invention

[0005] This invention provides a modular aluminum alloy heat dissipation device. It utilizes an air intake box to draw cool air from the exhaust end of a cooling fan into the exhaust box. A memory spring senses the ambient temperature around the central processing unit (CPU) and, in conjunction with a fan control plate, automatically controls the number of exhaust vents opening to enhance cooling. Furthermore, the horizontal cool air and vertical airflow converge and neutralize the temperature of the vertical airflow. This not only removes heat from the heat dissipation fins but also shortens the distance between the cool air and the CPU, improving heat dissipation efficiency. This solves the problems mentioned in the background art, namely: To achieve the above objectives, the modular aluminum alloy heat dissipation device includes a shroud, a cooling fan, a support, heat dissipation fins, heat pipes, and a heat dissipation base. An air supply mechanism is provided on the shroud near the exhaust end of the cooling fan. The air supply mechanism includes an exhaust section and an air adjustment section. The exhaust section is connected to the exhaust end of the cooling fan, and the air adjustment section is located on the heat dissipation base and is fitted to the exhaust section. During the heat dissipation phase, the air adjustment section is responsible for adjusting the airflow of the exhaust section according to the temperature of the central processing unit. The exhaust section is used to laterally transport the cool air from the outside of the exhaust end to the inside of the heat dissipation fins, so as to interact with the longitudinal airflow blown into the heat dissipation fins by the cooling fan.

[0006] Secondly, the other end of the air intake box is connected to an air intake pipe, which is fixed to the support and bent downwards to connect to an exhaust box close to the side of the heat dissipation fins. The exhaust box has several horizontally arranged exhaust ports, which are used to guide the cold air in the air intake box to the space between adjacent heat dissipation fins to achieve mixing with the vertical hot air flow.

[0007] Furthermore, the air conditioning unit includes a memory spring mounted on the heat dissipation base. When the central processing unit is idle, the memory spring is in a soft phase and in an elongated state. When under load, the memory spring is in a hard phase and in a contracted state.

[0008] In the above technical solution, when the ambient temperature around the central processing unit is stable and the memory spring is in a stretched state, only a few exhaust vents are not blocked by the air regulating plate, while most exhaust vents are blocked. At this time, cold air is discharged from the open exhaust vents and mixes with the vertical airflow. As a result, the heat dissipation fins blown by the upper open exhaust vents are at a higher position, and the path that the cold air can flow through in the channel between the heat dissipation fins is longer, thereby removing more heat from the heat dissipation fins and improving the cooling effect.

[0009] Next, a regulating plate is fixedly connected to the top of the memory spring. The regulating plate is fitted to the exhaust vent and is used to adjust the number of exhaust vents according to changes in ambient temperature, thereby dynamically adjusting the airflow. In other words, during implementation, the number of exhaust vents increases from top to bottom, increasing the lateral airflow delivered to the channels between adjacent heat sink fins. This allows the cool air blown from the exhaust vents closest to the central processing unit to contact the central processing unit most quickly, thus improving the cooling effect on the central processing unit.

[0010] Compared with the prior art, the beneficial effects of the present invention are as follows: The cooling fan exhaust is drawn into the exhaust box by the air intake box. The ambient temperature around the central processing unit is sensed by the memory spring, and the number of exhaust vents opened is automatically controlled in conjunction with the air regulating plate to enhance cooling. The horizontal cooling air and the vertical airflow converge and neutralize the temperature of the vertical airflow. While removing heat from the heat sink fins, the distance between the cooling air and the central processing unit is shortened, improving heat dissipation efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the exploded structure of the cover and support of the present invention; Figure 3 This is a schematic diagram of the airflow direction structure inside the support of the present invention; Figure 4 This is a schematic diagram of the opening and closing principle of the exhaust vent of the present invention; Figure 5 This is a schematic diagram of the airflow direction structure inside the gas-gathering hood of the present invention; Figure 6 This is a schematic diagram of the heat dissipation structure assisted by heat sink fins in this invention.

[0012] The meanings of the labels in the diagram are as follows: 100. Chassis; 101. Cooling fan; 102. Support; 102a. Auxiliary air passage; 103. Cooling fins; 103a. Cooling channel; 104. Heat pipe; 105. Cooling base; 110. Air supply mechanism; 111. Air intake box; 112. Air intake duct; 113. Air exhaust box; 113a. Air exhaust port; 113b. Limiting plate; 114. Memory spring; 114a. Heat conduction plate; 115. Air regulating plate; 120. Air-concentrating hood; 121. Wide opening; 122. Bend. Detailed Implementation

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0014] In existing technologies, fans adjust their speed based on changes in the central processing unit's (CPU) temperature to ensure normal equipment operation. However, for down-draft heat sinks, the fins closer to the CPU receive more heat. Regardless of whether the CPU is at a high or low temperature, the airflow from the fan to the fins is always from top to bottom. This results in the top fins exchanging heat with the cool air first, leading to a high heat exchange rate. Meanwhile, the bottom fins exchange heat with the warmer air, resulting in low heat exchange efficiency and impacting cooling performance. Therefore, this invention provides a modular aluminum alloy heat dissipation device. (See attached image) Figures 1-3 As shown, the device includes a housing 100, a cooling fan 101, a support 102, cooling fins 103, a heat pipe 104, and a cooling base 105. During assembly, the housing 100 is first fixed to the support 102 with screws, and then the cooling base 105 is fixed to the central processing unit. In use, the cooling fan 101 controls its speed according to the temperature of the central processing unit to ensure the normal operation of the device through heat dissipation.

[0015] To address the aforementioned issues, an air supply mechanism 110 is provided on the casing 100 near the exhaust end of the cooling fan 101. The air supply mechanism 110 includes an exhaust section and an air adjustment section. The exhaust section is connected to the exhaust end of the cooling fan 101, and the air adjustment section is located on the heat sink base 105 and is fitted to the exhaust section. During the heat dissipation phase, the air adjustment section is responsible for adjusting the airflow of the exhaust section according to the temperature of the central processing unit. The exhaust section is used to horizontally transport the cool air from the outside of the heat sink fins 103 to the inside, so as to interact with the longitudinal airflow blown by the cooling fan 101 into the heat sink fins 103, thereby achieving efficient heat dissipation.

[0016] It should be noted that: combining Figure 3 As shown, the exhaust end is below the cooling fan 101, and the air inlet is above the cooling fan 101. Under the action of the blades of the cooling fan 101, an airflow is formed from top to bottom. The airflow flows through the heat dissipation fins 103 and carries away the heat.

[0017] Next, the heat dissipation fins 103 near the bottom of the support 102 have notches, and a heat dissipation channel 103a for airflow is formed between the notches and the support 102. Therefore, when the cooling fan 101 stops working, the airflow from top to bottom disappears, and the heat dissipated by the central processing unit and the heat dissipation fins 103 is transferred upward. That is, the hot air moves upward and diffuses. After the hot air is blocked by the cooling fan 101, the diffused part of the hot air can be dissipated to the surroundings through the heat dissipation channel 103a, thereby improving the heat dissipation effect.

[0018] Conversely, when the cooling fan 101 is working, the heat generated by the central processing unit is transferred to several cooling fins 103 through the heat pipe 104. The cooling fins 103 can increase the contact area with the cold air, so as to dissipate heat from the central processing unit more quickly. When the cold air is delivered from the air inlet to the air outlet, part of the cold air is blown directly onto the cooling fins 103 to carry away the heat, while the other part of the cold air is delivered to the outside of the cooling fins 103 by the air intake.

[0019] At this time, based on Figure 3 Based on and combined Figure 4 As shown, the structure of the air intake section is disclosed. The air intake section includes an air intake box 111 located inside the exhaust end of the casing 100. The air intake box 111 is arc-shaped and has an open end. The opening of the air intake box 111 faces the longitudinal airflow formed at the exhaust end, so as to introduce the exhaust airflow into the air intake box 111 and deliver it to the side of the heat dissipation fins 103. Then, the other end of the air intake box 111 is connected to an air intake pipe 112. The air intake pipe 112 is fixed to the support 102, and the air intake pipe 112 is bent downward and connected to an exhaust box 113 close to the side of the heat dissipation fins 103. The exhaust box 113 has several horizontally arranged exhaust ports 113a. The exhaust ports 113a are used to guide the cold air in the air intake box 111 to the space between adjacent heat dissipation fins 103 so as to achieve mixing with the longitudinal hot airflow.

[0020] The specific heat dissipation working principle is as follows: When the cooling fan 101 is working, the blades of the cooling fan 101 rotate to transport external cold air from the intake end to the exhaust end. Since there are channels for airflow between adjacent heat dissipation fins 103, part of the formed longitudinal airflow blows directly onto the heat dissipation fins 103, realizing heat exchange between the cold air and the heat dissipation fins 103, thereby carrying away the heat on the heat dissipation fins 103. After the heat exchange, the temperature of the cold air rises and blows towards the central processing unit below, and after being blocked, it diffuses to the surroundings.

[0021] Meanwhile, a portion of the cold air is guided into the exhaust box 113 through the opening of the exhaust box 111 and the exhaust pipe 112. Since this portion of cold air has not undergone heat exchange with the heat dissipation fins 103, its temperature is lower than that of the cold air after heat exchange. Thus, this portion of cold air flows out through the exhaust port 113a towards the heat dissipation fins 103. At this time, a horizontal airflow flows out from the exhaust port 113a, while the airflow between the heat dissipation fins 103 after heat exchange is a vertical airflow. The two airflows mix, and the horizontal airflow neutralizes the temperature of the vertical airflow (see reference). Figure 5 As indicated by the middle arrows h1 and h2, which represent the lateral airflow direction, this reduces the temperature of the airflow blowing towards the central processing unit.

[0022] Furthermore, considering that the ambient temperature around the CPU remains stable with minimal temperature fluctuations when the CPU is idle, resulting in reduced heat transfer to the heat sink 103, the number of exhaust vents 113a opening is controlled by the airflow adjustment unit to regulate the lateral airflow towards the heat sink 103; now, returning to... Figure 4 As shown, the structure of the air conditioning unit is disclosed. The air conditioning unit includes a memory spring 114 disposed on the heat sink base 105. When the central processing unit is idle, the memory spring 114 is in a soft phase and in an elongated state. When under load, the memory spring 114 is in a hard phase and in a contracted state. On the other hand, an air conditioning plate 115 is fixedly connected to the top of the memory spring 114. The air conditioning plate 115 is fitted with the exhaust port 113a and is used to adjust the number of exhaust ports 113a according to changes in ambient temperature, so as to dynamically adjust the air volume.

[0023] That is, when the ambient temperature around the central processing unit is stable, the memory spring 114 is in a stretched state (i.e., Figure 4 As shown in the diagram, only a few exhaust vents 113a are not blocked by the air regulating plate 115, while most exhaust vents 113a are blocked. At this time, cold air is discharged from the open exhaust vents 113a and mixes with the vertical airflow. As a result, the heat dissipation fins 103 blown by the upper open exhaust vents 113a are at a higher position, and the cold air can flow through a longer path in the channel between the heat dissipation fins 103, thereby removing more heat from the heat dissipation fins 103 and improving the cooling effect.

[0024] Secondly, when the central processing unit is under load and the ambient temperature rises above the phase change temperature, the heat dissipation base 105 is fixedly connected to the bottom of the heat conduction plate 114a, which is connected to the bottom of the memory spring 114 and can transfer the temperature of the central processing unit to the memory spring 114, causing the memory spring 114 to deform. As a result, the memory spring 114 contracts and pulls the air regulating plate 115 downward. During this process, a limiting plate 113b is fixedly provided on the side wall of the exhaust box 113. The limiting plate 113b is used to cause the air regulating plate 115 to move along a preset longitudinal direction, increasing the number of exhaust vents 113a from top to bottom and increasing the lateral air volume delivered to the channel between adjacent heat dissipation fins 103. This allows the cold air blown out of the exhaust vents 113a near the central processing unit to contact the central processing unit more quickly, thereby improving the cooling effect on the central processing unit.

[0025] In other words, the cool air from the exhaust end of the cooling fan 101 is introduced into the exhaust box 113 by the air intake box 111. Then, the ambient temperature around the central processing unit is sensed by the memory spring 114, and the number of exhaust vents 113a opened is automatically controlled by the air regulating plate 115 to enhance cooling. Furthermore, the horizontal cool air and the vertical airflow converge and neutralize the temperature of the vertical airflow. While removing heat from the heat sink 103, the distance between the cool air and the central processing unit is also shortened, thus improving the heat dissipation efficiency.

[0026] Furthermore, based on Figure 5 Based on and combined Figure 6 As shown, an air-gathering shroud 120 is fixedly installed on the outside of the casing 100. The connection between the air-gathering shroud 120 and the casing 100 has a wide opening 121 corresponding to the impeller of the cooling fan 101. The end of the air-gathering shroud 120 is connected to a downwardly bent pipe 122. The bent pipe 122 is used to transport the radial airflow generated by the impeller to the outside of the support 102, so that an air curtain is formed on the outside of the support 102; that is, when the impeller rotates (refer to...), Figure 2 As shown), air enters the impeller axially (that is, longitudinally as shown above). Under centrifugal force, the air is thrown out and turns into radial flow (perpendicular to the axis, that is, transverse), passing through... Figure 5 , Figure 6 The middle arrow indicates that the impeller delivers air through the wide opening 121, into the bend 122, and then through the bend 122 to the outside of the support 102.

[0027] At this time, since an auxiliary gas channel 102a is formed in the horizontal direction at the top of the support 102 and the exhaust box 113, when the mixed gas is obstructed, it will disperse along the central processing unit to the surrounding areas (see reference). Figure 5 (The middle arrows f1 and f2 point to), and the diffused hot air will flow upward. At this time, due to the downward airflow formed in the channel between the heat dissipation fins 103, the surrounding air will be forced to move closer to the heat dissipation fins 103 under the action of negative pressure. This will draw in the already dissipated hot air and affect the heat dissipation. Thus, the auxiliary air channel 102a is used to supply the bent pipe 122 to transport air to the inside of the exhaust box 113, providing additional cold air for the heat dissipation fins 103 to achieve auxiliary heat dissipation of the heat dissipation fins 103.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A modular aluminum alloy heat dissipation device, comprising a shroud (100), a cooling fan (101), a support (102), cooling fins (103), a heat pipe (104), and a heat dissipation base (105), characterized in that: An air supply mechanism (110) is provided on the shroud (100) near the exhaust end of the cooling fan (101). The air supply mechanism (110) includes an air intake section and an air adjustment section. The air intake section is connected to the exhaust end of the cooling fan (101). The air adjustment section is located on the heat sink base (105) and is attached to the air intake section. During the heat dissipation stage, the air adjustment section is responsible for adjusting the air volume of the air intake section according to the temperature of the central processing unit. The air intake section is used to transport the cold air from the exhaust end from the outside of the heat sink fins (103) to the inside laterally, so as to form an interaction with the longitudinal airflow blown by the cooling fan (101) into the heat sink fins (103).

2. The modular aluminum alloy heat dissipation device according to claim 1, characterized in that: The heat dissipation fins (103) near the bottom of the support (102) have notches, and a heat dissipation channel (103a) for airflow is formed between the notches and the support (102).

3. The modular aluminum alloy heat dissipation device according to claim 1, characterized in that: The air intake section includes an air intake box (111) located inside the exhaust end of the casing (100). The air intake box (111) is arc-shaped and has an open end. The opening of the air intake box (111) faces the longitudinal airflow formed at the exhaust end, so as to introduce the exhaust airflow into the air intake box (111) and deliver it to the side of the heat dissipation fins (103).

4. The modular aluminum alloy heat dissipation device according to claim 3, characterized in that: The other end of the air intake box (111) is connected to an air intake pipe (112). The air intake pipe (112) is fixed to the support (102), and the air intake pipe (112) is bent downward to connect to an exhaust box (113) close to the side of the heat dissipation fins (103). The exhaust box (113) has several horizontally arranged exhaust ports (113a). The exhaust ports (113a) are used to guide the cold air in the air intake box (111) to the space between adjacent heat dissipation fins (103) so as to achieve mixing with the longitudinal hot air flow.

5. The modular aluminum alloy heat dissipation device according to claim 1, characterized in that: The air conditioning unit includes a memory spring (114) disposed on the heat dissipation base (105). When the central processing unit is idle, the memory spring (114) is in a soft phase and in an elongated state. When it is under load, the memory spring (114) is in a hard phase and in a contracted state.

6. The modular aluminum alloy heat dissipation device according to claim 5, characterized in that: The memory spring (114) is fixedly connected to the top of the air regulating plate (115). The air regulating plate (115) is fitted with the exhaust port (113a) and is used to adjust the number of air outlets (113a) according to the change of ambient temperature, so as to realize dynamic adjustment of air volume.

7. The modular aluminum alloy heat dissipation device according to claim 5, characterized in that: A heat-conducting plate (114a) is fixedly connected to the bottom of the heat sink base (105). The heat-conducting plate (114a) is connected to the bottom of the memory spring (114) and can transfer the temperature of the central processing unit to the memory spring (114), causing the memory spring (114) to deform.

8. The modular aluminum alloy heat dissipation device according to claim 6, characterized in that: A limiting plate (113b) is fixedly installed on the side wall of the exhaust box (113). The limiting plate (113b) is used to cause the air regulating plate (115) to move longitudinally.

9. The modular aluminum alloy heat dissipation device according to claim 1, characterized in that: An air-gathering hood (120) is fixedly installed on the outside of the hood (100). The air-gathering hood (120) has a wide opening (121) at the connection with the hood (100) corresponding to the impeller of the cooling fan (101). The end of the air-gathering hood (120) is connected to a downwardly bent pipe (122). The bent pipe (122) is used to transport the radial airflow formed by the impeller to the outside of the support (102), so that an air curtain is formed on the outside of the support (102).

10. The modular aluminum alloy heat dissipation device according to claim 9, characterized in that: An auxiliary air channel (102a) is formed on the top horizontal direction of the support (102) and the exhaust box (113). The auxiliary air channel (102a) is used to supply air to the inside of the exhaust box (113) via the bend (122) to achieve auxiliary heat dissipation of the heat dissipation fins (103).

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