Film forming device and method for transparent conductive film

Abstract

The invention relates to the technical field of transparent conductive film forming, and provides a transparent conductive film forming device and method.The transparent conductive film forming device comprises a feeding table base, a storage frame, a limiting side blocking frame, a feeding belt, a switching blocking frame and a machining table base, the storage frame is arranged on the feeding table base, and a plurality of substrates are stacked on the inner side of the storage frame. A plurality of substrates can be stacked and stored by arranging the storage frame to be matched with the limiting side blocking frame, the lowest substrate is moved out of the substrate outlet hole, and the height of the substrate outlet hole is larger than that of one substrate and smaller than that of two substrates, so that after the lowest substrate is sent out by a feeding belt for a certain distance, the lowest substrate can be moved out of the substrate outlet hole. The substrate at the bottom can still shield and limit the second substrate at the bottom, and the plurality of substrates can still be stably stacked and stored in the material storage frame in cooperation with the material storage frame, so that the film forming device can conveniently convey the plurality of substrates one by one for sputter coating, and is convenient to use.

Description

Technical Field

[0001] This invention relates to the field of transparent conductive film formation technology, and in particular to a transparent conductive film formation apparatus and method. Background Technology

[0002] Transparent conductive films are key materials in the optoelectronic field, widely used in touch screens, liquid crystal displays, solar cells, flexible electronic devices, and more. Existing coating technologies for transparent conductive films include sputtering coating, which involves a sputtering source. In the sputtering source, plasma bombardment of the target material causes atoms to be sputtered and deposited onto the substrate, offering advantages such as high film uniformity, strong adhesion, and the ability to deposit over large areas.

[0003] In conventional sputtering deposition of transparent conductive films, the substrate and sputtering source are positioned opposite each other within the deposition space. Target atoms or molecules are sputtered out and subsequently deposited onto the substrate surface to form a thin film. However, when depositing multiple transparent conductive films, the substrate needs to be continuously removed, the formed transparent conductive film removed, and then the substrate supplied for the next deposition process. This manual, continuous substrate supply is time-consuming. Therefore, this solution proposes a transparent conductive film deposition apparatus and method to address the aforementioned problems. Summary of the Invention

[0004] In view of this, the present invention proposes a film-forming apparatus and method for transparent conductive films, which solves the technical problem that in the existing process of forming multiple transparent conductive films, it is necessary to continuously remove the substrate, remove the transparent conductive film formed on the substrate, and then supply the substrate again for the next transparent conductive film forming process, which requires excessive time for manual substrate supply.

[0005] The technical solution of this invention is implemented as follows: This invention provides a film-forming apparatus for a transparent conductive film, comprising a feeding platform, a storage frame, a limiting side baffle, a feeding belt, a transfer baffle, and a processing platform, wherein,

[0006] A storage frame is disposed on the feeding platform, and multiple substrates are stacked inside the storage frame. A storage opening is provided on one side of the storage frame, and one end of the substrate extends out of the storage opening.

[0007] A limiting side baffle is provided on one side of the storage frame corresponding to the storage opening, and is used to restrict the substrate from detaching from the storage frame;

[0008] A feeding belt is rotatably mounted on the feeding platform. The top of the feeding platform has a first drop groove, and one side of the feeding platform has a threading hole that communicates with the first drop groove. The feeding belt passes around the threading hole and is located inside the first drop groove for conveying the substrate. The adjacent sides of the storage frame have interconnected outlet holes. The outlet holes are connected to the storage opening and the bottom of the storage frame for the substrate to pass through. The height of the substrate is H1, and the height of the outlet hole is H2, where H1 < H2 < 2H1. The width of the feeding belt is less than the width of the substrate.

[0009] A transfer baffle is rotatably mounted on the feeding platform and located on one side of the storage frame, for selectively blocking the substrate in the conveying direction of the feeding belt.

[0010] A processing table is disposed on one side of the storage frame, and the feed belt extends into the interior of the processing table, the processing table being used for sputtering coated substrates.

[0011] Based on the above technical solution, preferably, the top of the feeding platform has two first mounting slots, and the interior of the feeding platform has a connecting slot that communicates with the two first mounting slots. The adapter bracket is rotatably disposed inside the first mounting slot and rotates in the conveying direction of the feeding belt. The two adapter brackets are connected by a connecting frame, which is located inside the connecting slot. When the adapter bracket rotates, it rotates to the inside of the first mounting slot. One side wall of the adapter bracket is flush with the feeding belt, and the end of the adapter bracket extends to the processing platform.

[0012] Based on the above technical solutions, preferably, it also includes multiple soft storage pads, wherein,

[0013] Multiple storage pads are disposed inside the storage frame and distributed along the height of the storage frame. The spacing between two storage pads is adapted to the height of the substrate. When the substrate is stored inside the storage frame, the substrate squeezes the storage pads and causes the storage pads to deform and detach from the substrate.

[0014] Based on the above technical solutions, preferably, it also includes a first telescopic component and a support plate, wherein...

[0015] A connection hole is provided on one side of the storage frame, the connection hole is connected to the bottom of the storage frame, and the height of the connection hole is H3, H1 < H3 < 2H1. A connection gap is formed between the inner wall of the storage frame and the substrate.

[0016] A first telescopic component is disposed on the feeding platform, and a tray is disposed on the telescopic end of the first telescopic component and located inside the connecting hole. The tray is used to lift the substrate upward.

[0017] Based on the above technical solutions, a preferred embodiment also includes a base pad, wherein...

[0018] A bottom support pad is disposed inside the storage frame and located on the side of the storage frame away from the tray. The bottom end of the bottom support pad extends out of the outlet hole, and the opposite sides of the bottom support pad are in contact with the two substrates.

[0019] Based on the above technical solutions, preferably, the top of the processing table is provided with a second drop groove for the feeding belt to pass through, and the top of the processing table is provided with two heaters, which are located on opposite sides of the second drop groove, and the heaters are used to heat the substrate.

[0020] Based on the above technical solutions, preferably, the system also includes a first side clamping plate, a second side clamping plate, and a stop block, wherein...

[0021] The processing table has arc-shaped ends at both ends in the conveying direction of the feeding belt, and the processing table is provided with a first sliding groove and a second sliding groove. The first sliding groove and the second sliding groove are arranged adjacent to each other. The second sliding groove goes around the arc-shaped ends of the processing table and connects to the upper and lower sides of the processing table.

[0022] The first side clamp is slidably connected to the first sliding groove, and the second side clamp is slidably connected to the second sliding groove. Both the first side clamp and the second side clamp are used to clamp the substrate.

[0023] A stop block is provided on the processing table to block the second side clamping plate in the sliding direction of the second side clamping plate.

[0024] Based on the above technical solutions, the preferred embodiment further includes an outer casing, a coating sputtering source, a sealing cover, a sealing plate, and a second telescopic component, wherein...

[0025] The processing table is located inside the outer casing, and the outer casing has first material passage holes on opposite sides for the feeding belt and substrate to pass through.

[0026] A coating sputtering source is disposed inside the outer casing and positioned opposite the heater, for sputtering coating onto the substrate on the heater;

[0027] A sealing cover is disposed between the processing table and the top wall of the inner cavity of the outer casing. The coating sputtering source is located inside the sealing cover. Second material passage holes for the substrate to pass through are opened on opposite sides of the sealing cover.

[0028] A cover plate is slidably disposed on one side of the sealing cover corresponding to the second material passage hole, for sliding to block the second material passage hole;

[0029] The second telescopic component is located inside the outer casing and is used to adjust the sliding of the cover plate.

[0030] Based on the above technical solutions, preferably, the method also includes a discharge baffle and a drive roller, wherein...

[0031] A discharge baffle is provided on the side of the outer housing away from the feeding platform, and the discharge baffle includes a connecting part and a limiting part. The connecting part is fixedly connected to the outer housing. The side wall of the connecting part near the feeding belt is an inclined wall. The limiting part is provided on the side of the connecting part away from the outer housing and is used to limit and block the substrate.

[0032] The drive roller is rotatably mounted on the limiting part and is connected to the feed belt for transmission.

[0033] This invention also proposes a method for forming a transparent conductive film, which is accomplished using the aforementioned transparent conductive film forming apparatus, and includes the following steps:

[0034] S1. Stack multiple substrates inside the storage frame and adjust the adapter to rotate to block the bottom substrate, thus completing the storage process for multiple substrates.

[0035] S2. Adjust the rotation of the transfer bracket until it is disengaged from the bottom substrate. The bottom substrate is then fed out by the feed belt and moves toward the processing table.

[0036] S3. After the bottom substrate is sent out and detached from the storage frame, adjust the transfer stop to rotate to reset, and the transfer stop will block the next substrate.

[0037] S4. After the substrate is conveyed to the processing table by the feeder, the substrate is sputtered and coated at the processing table.

[0038] S5. Repeat steps S2, S3, and S4 to complete the sputtering coating process for each of the multiple substrates.

[0039] The apparatus and method for forming the transparent conductive film of the present invention have the following advantages over the prior art:

[0040] (1) The film-forming apparatus of the transparent conductive film of this application can stack and store multiple substrates by setting a storage frame and a limiting side baffle. By setting the bottom substrate to move out from the plate outlet hole, and the height of the plate outlet hole is greater than the height of one substrate but less than the height of two substrates, the bottom substrate can still block and limit the second substrate below after being fed by the feeder belt for a certain distance. With the help of the storage frame, multiple substrates can still be stably stacked and stored inside the storage frame. By setting the width of the feeder belt to be less than the width of the substrate, the transfer baffle can still block and limit the substrate when the feeder belt is conveying the substrate. By setting the feeder belt to be located inside the first drop groove, the top surface of the feeder platform can simultaneously support the substrate when the feeder belt is conveying the substrate, thereby increasing the conveying stability of the substrate. Thus, the film-forming apparatus of this application can conveniently convey and sputter multiple substrates one by one for film deposition, making it convenient to use.

[0041] (2) By setting a transfer baffle at a position after the substrate has moved a short distance, the substrate is blocked and limited, so that a gap is formed between the bottom substrate and the second substrate below, which can be used for the tray. The tray is pushed upward by the first telescopic component, so that the tray lifts the other substrates except the bottom substrate, and a gap is formed between the bottom substrate and the second substrate below. This prevents the bottom substrate from rubbing against the second substrate below during the transport of the bottom substrate, thus preventing damage to the substrate. This makes it convenient to use.

[0042] (3) By setting multiple storage pads between each substrate, the multiple substrates are stacked and stored in the storage frame. The spacing of the storage pads prevents the multiple substrates from contacting each other during storage, thereby preventing wear on the substrates during the falling process. By setting storage openings extending from the ends of the substrates, the limiting side baffles can be used to position the substrates, thereby facilitating the substrates to fall in the center position. This allows a stable connection gap to be formed between the substrates and the storage pads, preventing the substrates from squeezing the root of the storage pads and causing abnormal deformation of the storage pads. This also prevents the storage pads from obstructing the normal falling of the substrates, making it convenient to use. By setting a bottom support pad with a plate outlet hole extending from its end, the bottom support pad can be placed between the bottom substrate and the second substrate below it, making it convenient to use. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a right perspective view of the film-forming apparatus for the transparent conductive film of the present invention;

[0045] Figure 2 This is a rear perspective view of the film-forming apparatus for the transparent conductive film of the present invention;

[0046] Figure 3 This is a left perspective view of the film-forming apparatus for the transparent conductive film of the present invention;

[0047] Figure 4 This is a right view of the film-forming apparatus for the transparent conductive film of the present invention;

[0048] Figure 5 The film-forming apparatus for the transparent conductive film of the present invention Figure 4 Cross-sectional view of the structure at point AA shown;

[0049] Figure 6 This is a three-dimensional schematic diagram of the structure of the feeding platform of the film-forming apparatus for the transparent conductive film of the present invention.

[0050] Figure 7 This is a perspective view of the feeding platform of the film-forming apparatus for the transparent conductive film of the present invention.

[0051] Figure 8 This is a perspective view of the material storage frame of the film-forming apparatus for the transparent conductive film of the present invention;

[0052] Figure 9 This is a three-dimensional schematic diagram of the structure of the processing table of the film-forming apparatus for the transparent conductive film of the present invention;

[0053] Figure 10 This is a schematic diagram showing the connection between the processing table and each clamping plate of the film-forming apparatus for the transparent conductive film of the present invention.

[0054] Figure 11 This is a perspective view of the processing platform of the film-forming apparatus for the transparent conductive film of the present invention.

[0055] In the diagram: 1. Feeding platform; 11. First tape drop groove; 12. Tape insertion hole; 13. First mounting groove; 131. Connecting groove; 14. Second mounting groove; 21. Storage frame; 211. Storage opening; 212. Discharge hole; 213. Connecting hole; 214. Connecting gap; 22. Limiting side baffle; 3. Feeding belt; 41. Adapter baffle; 42. Connecting frame; 43. Storage pad; 44. Base pad; 51. First telescopic component; 52. Pallet; 61. Processing platform; 6 11. Second drop groove; 612. First sliding groove; 613. Second sliding groove; 62. Heater; 71. First side clamp; 72. Second side clamp; 73. Stop block; 81. Outer housing; 811. First feed hole; 82. Coating sputtering source; 83. Sealing cover; 831. Second feed hole; 84. Cover plate; 841. Connecting rod; 85. Second telescopic component; 91. Discharge baffle; 911. Connecting part; 912. Limiting part; 92. Drive roller; 10. Substrate. Detailed Implementation

[0056] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0057] like Figures 1-11As shown, the film-forming apparatus for the transparent conductive film of the present invention includes a feeding platform 1, a storage frame 21, a limiting side baffle 22, a feeding belt 3, a transfer baffle 41, and a processing platform 61. The storage frame 21 is disposed on the feeding platform 1, and multiple substrates 10 are stacked inside the storage frame 21. A storage opening 211 is provided on one side of the storage frame 21, and one end of the substrate 10 extends out of the storage opening 211. The limiting side baffle 22 is disposed on one side of the storage opening 211 of the storage frame 21 to restrict the substrate 10 from detaching from the storage frame 21. The feeding belt 3 is rotatably disposed on the feeding platform 1. A first tape drop groove 11 is provided on the top of the feeding platform 1, and a tape insertion hole 12 communicating with the first tape drop groove 11 is provided on one side of the feeding platform 1. The feeding belt 3 winds around... The feeder belt 3 passes through the through hole 12 and is located inside the first drop groove 11 for conveying the substrate 10. The storage frame 21 has interconnected outlet holes 212 between adjacent sides. The outlet holes 212 are connected to the storage opening 211 and the bottom of the storage frame 21 for the substrate 10 to pass through. The height of the substrate 10 is H1, and the height of the outlet hole 212 is H2, where H1 < H2 < 2H1. The width of the feeder belt 3 is less than the width of the substrate 10. The adapter baffle 41 is rotatably mounted on the feeding table 1 and located on one side of the storage frame 21 for selectively blocking the substrate 10 in the conveying direction of the feeder belt 3. The processing table 61 is mounted on one side of the storage frame 21, and the feeder belt 3 extends into the interior of the processing table 61. The processing table 61 is used for sputtering the coated substrate 10.

[0058] In specific implementation, the wall of the first feed trough 11 is misaligned with one side of the stacked substrates 10 in the height direction. A first motor for driving the feed belt 3 to rotate and a second motor for driving the transfer stop 41 to rotate are provided on one side of the feeding table 1. A sputtering source 82 for sputtering coating the substrates 10 is provided at the processing table 61.

[0059] In practice, multiple substrates 10 are stacked inside the storage frame 21, and the adapter baffle 41 is rotated to block the bottom substrate 10, completing the storage process for the multiple substrates 10. At this time, the multiple substrates 10 are limited by the limiting side baffle 22 and stably stored inside the storage frame 21, while the bottom substrate 10 is not blocked by the limiting side baffle 22. Under the conveying action of the feeding belt 3, it moves outward a certain distance. At this time, the bottom substrate 10 has not completely detached from the storage frame 21 and still supports the substrates 10 above it, and is blocked by the adapter baffle 41; the adapter baffle 41 is rotated. After the bottom substrate 10 is detached, it is fed out by the feed belt 3 and moves toward the processing table 61. After the bottom substrate 10 is fed out and detached from the storage frame 21, the second substrate 10 moves downward to fit with the feed belt 3 and is fed out by the feed belt 3 for a certain distance. The transfer baffle 41 is adjusted to rotate to reset and the transfer baffle 41 blocks the next substrate 10. After the substrate 10 is transported to the processing table 61 by the feed belt 3, the substrate 10 is sputtered and coated at the processing table 61. The above steps are repeated to complete the sputtering and coating process of multiple substrates 10 one by one.

[0060] The transparent conductive film forming apparatus of this application can stack and store multiple substrates 10 by setting a storage frame 21 in conjunction with a limiting side baffle 22. By setting the bottom substrate 10 to move out from the exit hole 212, and the height of the exit hole 212 being greater than the height of one substrate 10 but less than the height of two substrates 10, the bottom substrate 10 can still block and limit the second substrate 10 below it after being fed a certain distance by the feed belt 3. In conjunction with the storage frame 21, multiple substrates 10 can still be stably stacked and stored. Inside the storage frame 21, by setting the width of the feeding belt 3 to be smaller than the width of the substrate 10, the transfer baffle 41 can still block and limit the substrate 10 when the feeding belt 3 is conveying the substrate 10. By setting the feeding belt 3 inside the first drop groove 11, the top surface of the feeding platform 1 can simultaneously support the substrate 10 when the feeding belt 3 is conveying the substrate 10, thereby increasing the conveying stability of the substrate 10. This makes the film forming apparatus of this application convenient for conveying and sputtering multiple substrates 10 one by one, and convenient to use.

[0061] Preferably, the telescopic components in this application are all cylinders.

[0062] In a preferred embodiment, the top of the feeding platform 1 has two first mounting slots 13, and the inside of the feeding platform 1 has a connecting slot 131 that communicates with the two first mounting slots 13. The adapter bracket 41 is rotatably disposed inside the first mounting slot 13 and rotates in the conveying direction of the feeding belt 3. The two adapter brackets 41 are connected by a connecting frame 42, which is located inside the connecting slot 131. When the adapter bracket 41 rotates, it rotates to the inside of the first mounting slot 13, and one side wall of the adapter bracket 41 is flush with the feeding belt 3. The end of the adapter bracket 41 extends to the processing platform 61.

[0063] This design allows the adapter 41 to be supported under the substrate 10 when it rotates to detach from the substrate 10. After the adapter 41 rotates, its end extends to the processing table 61, thereby improving the stability of the substrate 10 during transport between the feeding table 1 and the processing table 61.

[0064] In a preferred embodiment, a plurality of storage pads 43 are also included. The plurality of storage pads 43 are disposed on the inner side of the storage frame 21 and distributed in the height direction of the storage frame 21. The spacing between two storage pads 43 is adapted to the height of the substrate 10. When the substrate 10 is stored inside the storage frame 21, the substrate 10 squeezes the storage pads 43 and causes the storage pads 43 to deform and detach from the substrate 10.

[0065] By setting multiple storage pads 43 between each substrate 10, the multiple substrates 10 are stacked and stored in the storage frame 21. The spacing of the storage pads 43 prevents the multiple substrates 10 from contacting each other during storage, thereby preventing the substrates 10 from being worn during the falling process.

[0066] It also includes a first telescopic component 51 and a tray 52. ​​A connecting hole 213 is provided on one side of the storage frame 21, which connects to the bottom of the storage frame 21. The height of the connecting hole 213 is H3, where H1 < H3 < 2H1. A connecting gap 214 is formed between the inner wall of the storage frame 21 and the substrate 10. The first telescopic component 51 is disposed on the feeding platform 1, and the tray 52 is disposed on the telescopic end of the first telescopic component 51 and located inside the connecting hole 213. The tray 52 is used to lift the substrate 10 upward.

[0067] In practice, a second mounting groove 14 is provided on one side of the feeding platform 1, and the first telescopic component 51 is disposed inside the second mounting groove 14.

[0068] By setting the adapter baffle 41 at a position after the substrate 10 has moved a short distance, the substrate 10 is blocked and limited, thereby creating a gap between the bottom substrate 10 and the second substrate 10 below it, which allows the support plate 52 to be placed. The first telescopic member 51 pushes the support plate 52 upward, thereby lifting the other substrates 10 except the bottom substrate 10. This creates a gap between the bottom substrate 10 and the second substrate 10 below it, preventing the bottom substrate 10 from rubbing against the second substrate 10 below it during transport, thus avoiding damage to the substrate 10 and facilitating its use.

[0069] By setting a storage opening 211 extending from the end of the substrate 10, the limiting side baffle 22 can easily position the substrate 10, thereby facilitating the substrate 10 to fall at the center position. This allows a stable connection gap 214 to be formed between the substrate 10 and the storage pad 43, preventing the substrate 10 from squeezing the root of the storage pad 43 and causing abnormal deformation of the storage pad 43. This also prevents the storage pad 43 from obstructing the normal fall of the substrate 10, making it convenient to use.

[0070] It also includes a bottom support pad 44, which is disposed inside the storage frame 21 and located on the side of the storage frame 21 away from the tray 52. ​​The bottom end of the bottom support pad 44 extends out of the tray hole 212, and the opposite sides of the bottom support pad 44 are in contact with the two substrates 10.

[0071] By providing a base support pad 44, and extending a plate outlet hole 212 from the end of the base support pad 44, the base support pad 44 can be placed between the bottom substrate 10 and the second substrate 10 below it in conjunction with the support plate 52, making it convenient to use.

[0072] In a preferred embodiment, the top of the processing table 61 is provided with a second drop groove 611 through which the feeding belt 3 passes, and the top of the processing table 61 is provided with two heaters 62, which are located on opposite sides of the second drop groove 611. The heaters 62 are used to heat the substrate 10.

[0073] By setting the feed belt 3 to pass through the second drop groove 611, it is convenient for the heater 62 to heat the substrate 10. The heater 62 is set as an extension of the feed belt 3. Since the width of the feed belt 3 is smaller than the width of the substrate 10, the heater 62 can heat the substrate 10 from both sides of the feed belt 3, which is convenient to use.

[0074] In a preferred embodiment, the system further includes a first side clamping plate 71, a second side clamping plate 72, and a stop block 73. The processing table 61 has arc-shaped ends at both ends in the conveying direction of the feeding belt 3. The processing table 61 has a first sliding groove 612 and a second sliding groove 613. The first sliding groove 612 and the second sliding groove 613 are arranged adjacent to each other. The second sliding groove 613 bypasses the arc-shaped ends of the processing table 61 and connects to the upper and lower sides of the processing table 61. The first side clamping plate 71 is slidably connected to the first sliding groove 612, and the second side clamping plate 72 is slidably connected to the second sliding groove 613. Both the first side clamping plate 71 and the second side clamping plate 72 are used to clamp the substrate 10. The stop block 73 is disposed on the processing table 61 and is used to block the second side clamping plate 72 in the sliding direction of the second side clamping plate 72.

[0075] In practice, there are two second-side clamping plates 72 and two first-side clamping plates 71, which are respectively disposed on opposite sides of the substrate 10.

[0076] In practice, the second side clamping plate 72 is located below the processing table 61 to avoid obstructing the movement of the substrate 10 to the heater 62. After the substrate 10 moves to the heater 62, the second side clamping plate 72 and the first side clamping plate 71 are adjusted to slide toward the substrate 10 to complete the clamping process of the substrate 10. By clamping the substrate 10, the stability of the substrate 10 position is improved, which facilitates stable sputtering coating process on the substrate 10.

[0077] The first side clamp 71 and the second side clamp 72 are provided as extensions of the feed belt 3. Since the width of the feed belt 3 is smaller than the width of the substrate 10, the first side clamp 71 and the second side clamp 72 can clamp the substrate 10 from all four sides. By providing a stop block 73 to block the second side clamp 72, it is convenient for the second side clamp 72 to position and block the substrate 10 from the discharge side during the conveying process, thereby facilitating the clamping of the substrate 10 at the sputtering coating position of the processing table 61.

[0078] In a preferred embodiment, the system further includes an outer housing 81, a coating sputtering source 82, a sealing cover 83, a cover plate 84, and a second telescopic component 85. The processing table 61 is disposed inside the outer housing 81, and the outer housing 81 has first material passage holes 811 on opposite sides for the feeding belt 3 and the substrate 10 to pass through. The coating sputtering source 82 is disposed inside the outer housing 81 and is positioned opposite the heater 62 for sputter coating the substrate 10 on the heater 62. The sealing cover 83 is disposed between the processing table 61 and the top wall of the inner cavity of the outer housing 81, with the coating sputtering source 82 located inside the sealing cover 83. The sealing cover 83 has second material passage holes 831 on opposite sides for the substrate 10 to pass through. The cover plate 84 is slidably disposed on one side of the corresponding second material passage hole 831 of the sealing cover 83 for sliding to block the second material passage hole 831. The second telescopic component 85 is disposed inside the outer housing 81 for adjusting the sliding of the cover plate 84.

[0079] In practice, the two cover plates 84 are connected by a connecting rod 841. This design allows for the driving of the two cover plates 84 to be completed with only one second telescopic component 85.

[0080] In specific implementation, the substrate 10 moves into the interior of the sealing cover 83 through the first feed hole 811 and the second feed hole 831. After the substrate 10 is clamped by the side clamp, the cover plate 84 is moved to cover the second feed hole 831 by the second telescopic component 85, so that the inner cavity of the sealing cover 83 can form a sealed space. The formation of the sealed space makes it convenient to draw the interior of the sealing cover 83 into a vacuum, which facilitates the sputtering source 82 to perform sputtering film formation in a vacuum environment, making it convenient to use.

[0081] In a preferred embodiment, the system further includes a discharge baffle 91 and a drive roller 92. The discharge baffle 91 is disposed on the side of the outer housing 81 away from the feeding platform 1, and the discharge baffle 91 includes a connecting part 911 and a limiting part 912. The connecting part 911 is fixedly connected to the outer housing 81, and the side wall of the connecting part 911 near the feeding belt 3 is an inclined wall. The limiting part 912 is disposed on the side of the connecting part 911 away from the outer housing 81 and is used to limit and block the base plate 10. The drive roller 92 is rotatably disposed on the limiting part 912 and is connected to the feeding belt 3 for transmission.

[0082] By setting a discharge baffle 91 at the discharge section of the processing table 61 to limit the substrate 10, the stability of the substrate 10 discharge is increased. The discharge baffle 91 includes a connecting part 911 and a limiting part 912. The side wall of the connecting part 911 near the feed belt 3 is an inclined wall, which facilitates the positioning of the substrate 10 onto the feed belt 3 for delivery. After delivery, the substrate 10 is stably blocked and limited by the limiting part 912, thereby increasing the stability of the substrate 10 discharge and making it convenient to use.

[0083] This invention also proposes a method for forming a transparent conductive film, which is accomplished using the aforementioned transparent conductive film forming apparatus, and includes the following steps:

[0084] Step 1: Stack multiple substrates 10 inside the storage frame 21, and adjust the adapter baffle 41 to rotate to block the bottom substrate 10, thus completing the storage process of multiple substrates 10.

[0085] Step 2: Adjust the adapter baffle 41 to rotate until it is disengaged from the bottom substrate 10. The bottom substrate 10 is fed out by the feed belt 3 and moves toward the processing table 61. At this time, multiple substrates 10 are limited by the limiting side baffle 22 and stably stored inside the storage frame 21. The bottom substrate 10 is not blocked by the limiting side baffle 22. Under the conveying action of the feed belt 3, it moves outward a certain distance. At this time, the bottom substrate 10 is not completely disengaged from the storage frame 21 and still supports the substrate 10 above it. It is blocked by the adapter baffle 41.

[0086] Step 3: After the bottom substrate 10 is sent out and detached from the storage frame 21, the second substrate 10 moves down to fit with the feeding belt 3 and is sent out a distance by the feeding belt 3. The transfer baffle 41 is adjusted to rotate to reset and the transfer baffle 41 blocks the next substrate 10.

[0087] Step 4: After the substrate 10 is conveyed to the processing table 61 by the feed belt 3, the substrate 10 is sputtered and coated at the processing table 61.

[0088] Step 5: Repeat steps 2, 3, and 4 to complete the sputtering coating process on each of the multiple substrates 10.

[0089] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A film-forming apparatus for a transparent conductive film, characterized in that: It includes a feeding platform, a storage frame, a limiting side guard, a feeding belt, a transfer guard, and a processing platform, among which, A storage frame is disposed on the feeding platform, and multiple substrates are stacked inside the storage frame. A storage opening is provided on one side of the storage frame, and one end of the substrate extends out of the storage opening. A limiting side baffle is provided on one side of the storage frame corresponding to the storage opening, and is used to restrict the substrate from detaching from the storage frame; A feeding belt is rotatably mounted on the feeding platform. The top of the feeding platform has a first drop groove, and one side of the feeding platform has a threading hole that communicates with the first drop groove. The feeding belt passes around the threading hole and is located inside the first drop groove for conveying the substrate. The adjacent sides of the storage frame have interconnected outlet holes. The outlet holes are connected to the storage opening and the bottom of the storage frame for the substrate to pass through. The height of the substrate is H1, and the height of the outlet hole is H2, where H1 < H2 < 2H1. The width of the feeding belt is less than the width of the substrate. A transfer baffle is rotatably mounted on the feeding platform and located on one side of the storage frame, for selectively blocking the substrate in the conveying direction of the feeding belt. A processing table is disposed on one side of the storage frame, and the feed belt extends into the interior of the processing table, the processing table being used for sputtering coated substrates.

2. The film-forming apparatus for the transparent conductive film as described in claim 1, characterized in that: The top of the feeding platform has two first mounting slots, and the inside of the feeding platform has a connecting slot that communicates with the two first mounting slots. The adapter is rotatably disposed inside the first mounting slot and rotates in the conveying direction of the feeding belt. The two adapters are connected by a connecting frame, which is located inside the connecting slot. When the adapter rotates, it rotates to the inside of the first mounting slot. One side wall of the adapter is flush with the feeding belt, and the end of the adapter extends to the processing platform.

3. The film-forming apparatus for the transparent conductive film as described in claim 1, characterized in that: It also includes multiple storage pads, among which, Multiple storage pads are disposed inside the storage frame and distributed along the height of the storage frame. The spacing between two storage pads is adapted to the height of the substrate. When the substrate is stored inside the storage frame, the substrate squeezes the storage pads and causes the storage pads to deform and detach from the substrate.

4. The film-forming apparatus for the transparent conductive film as described in claim 3, characterized in that: It also includes a first telescopic component and a tray, wherein, A connection hole is provided on one side of the storage frame, the connection hole is connected to the bottom of the storage frame, and the height of the connection hole is H3, H1 < H3 < 2H1. A connection gap is formed between the inner wall of the storage frame and the substrate. A first telescopic component is disposed on the feeding platform, and a tray is disposed on the telescopic end of the first telescopic component and located inside the connecting hole. The tray is used to lift the substrate upward.

5. The film-forming apparatus for the transparent conductive film as described in claim 4, characterized in that: It also includes a base pad, among which, A bottom support pad is disposed inside the storage frame and located on the side of the storage frame away from the tray. The bottom end of the bottom support pad extends out of the outlet hole, and the opposite sides of the bottom support pad are in contact with the two substrates.

6. The film-forming apparatus for the transparent conductive film as described in claim 1, characterized in that: The processing table has a second drop groove on its top for the feeding belt to pass through, and two heaters are provided on the top of the processing table. The two heaters are located on opposite sides of the second drop groove, and the heaters are used to heat the substrate.

7. The film-forming apparatus for the transparent conductive film as described in claim 6, characterized in that: It also includes a first side clamp, a second side clamp, and a stop block, wherein, The processing table has arc-shaped ends at both ends in the conveying direction of the feeding belt, and the processing table is provided with a first sliding groove and a second sliding groove. The first sliding groove and the second sliding groove are arranged adjacent to each other. The second sliding groove goes around the arc-shaped ends of the processing table and connects to the upper and lower sides of the processing table. The first side clamp is slidably connected to the first sliding groove, and the second side clamp is slidably connected to the second sliding groove. Both the first side clamp and the second side clamp are used to clamp the substrate. A stop block is provided on the processing table to block the second side clamping plate in the sliding direction of the second side clamping plate.

8. The film-forming apparatus for the transparent conductive film as described in claim 7, characterized in that: It also includes an outer casing, a coating sputtering source, a sealing cover, a cover plate, and a second telescopic component, among which, The processing table is located inside the outer casing, and the outer casing has first material passage holes on opposite sides for the feeding belt and substrate to pass through. A coating sputtering source is disposed inside the outer casing and positioned opposite the heater, for sputtering coating onto the substrate on the heater; A sealing cover is disposed between the processing table and the top wall of the inner cavity of the outer casing. The coating sputtering source is located inside the sealing cover. Second material passage holes for the substrate to pass through are opened on opposite sides of the sealing cover. A cover plate is slidably disposed on one side of the sealing cover corresponding to the second material passage hole, for sliding to block the second material passage hole; The second telescopic component is located inside the outer casing and is used to adjust the sliding of the cover plate.

9. The film-forming apparatus for the transparent conductive film as described in claim 8, characterized in that: It also includes a discharge baffle and a drive roller, among which, A discharge baffle is provided on the side of the outer housing away from the feeding platform, and the discharge baffle includes a connecting part and a limiting part. The connecting part is fixedly connected to the outer housing. The side wall of the connecting part near the feeding belt is an inclined wall. The limiting part is provided on the side of the connecting part away from the outer housing and is used to limit and block the substrate. The drive roller is rotatably mounted on the limiting part and is connected to the feed belt for transmission.

10. A method for forming a transparent conductive film, characterized in that: The process is completed using the film-forming apparatus of any one of claims 1 to 9, comprising the following steps: S1. Stack multiple substrates inside the storage frame and adjust the adapter to rotate to block the bottom substrate, thus completing the storage process for multiple substrates. S2. Adjust the rotation of the transfer bracket until it is disengaged from the bottom substrate. The bottom substrate is then fed out by the feed belt and moves toward the processing table. S3. After the bottom substrate is sent out and detached from the storage frame, adjust the transfer stop to rotate to reset, and the transfer stop will block the next substrate. S4. After the substrate is conveyed to the processing table by the feeder, the substrate is sputtered and coated at the processing table. S5. Repeat steps S2, S3, and S4 to complete the sputtering coating process for each of the multiple substrates.

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