A method, system, and apparatus for correcting component bonding errors.

Abstract

A method for correcting component bonding errors includes the following steps: setting an initial material position, a calibration piece, and a calibration plate with a bonding position; picking up the calibration piece from the initial material position and moving it to the bonding position along a motion path; obtaining the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration piece at the bonding position; picking up the calibration piece from the bonding position; correcting the motion path based on the X-axis error value and / or the Y-axis error value and / or the bonding installation angle error value; and returning the calibration piece to the initial material position. Furthermore, this invention also provides a system and apparatus corresponding to the above-described method for correcting component bonding errors. Compared with the prior art, the method, system, and apparatus for correcting component bonding errors of this invention can improve the efficiency of mass production and reduce the loss rate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a method, system, and apparatus for correcting component bonding errors. Background Technology

[0002] Component bonding, including chips, is a critical process in semiconductor packaging. Its purpose is to precisely and securely fix components onto lead frames, substrates, or PCBs, ensuring reliable electrical connections between the components and external circuits. Taking chip bonding onto a substrate as an example, the process includes the following steps: S1: Applying adhesive to the substrate; S2: Adsorbing the chip using a bonding head equipped with a vacuum chuck; S3: Placing the chip in the corresponding position on the substrate and pressing it in place to ensure full contact between the chip and the adhesive layer; S4: Heating and curing the substrate with the chip to ensure adhesion strength; S5: Performing post-processing such as wire bonding, molding, or flip-chip reflow.

[0003] With the miniaturization of electronic devices, the process of precisely placing the chip onto the corresponding position on the substrate has become increasingly important. For example, in wire bonding, there is only a 20–40 μm process window from the center of the pad to the center of the bonding finger. If the chip offset is slightly greater than 10 μm, it may cause "wire bonding misalignment" or "wire collision short circuit". However, existing bonding heads are usually driven by mechanical structures, which inevitably have processing errors of the components themselves and assembly errors, resulting in errors in their movement trajectory, which need to be corrected.

[0004] Therefore, some methods for correcting the bonding position of components have emerged in existing technologies. These methods generally employ a "vision + mechanical + algorithm + feedback" approach. First, a high-speed camera is used to coarsely locate the component visually during adsorption, capturing its adsorption state on the bonding head. Then, an algorithm calculates and rotates the component for initial rotation compensation. Next, after the bonding head moves the component to the corresponding bonding position on the substrate, a high-magnification camera simultaneously captures images of both the substrate and the component. Then, by comparing the captured images with standard images, the required offset for the component is calculated, including X-axis, Y-axis, and angular offsets. Finally, the bonding head is fine-tuned based on the required offset, thereby adjusting the bonding position of the component to meet expectations.

[0005] However, it has been found that the above-mentioned component bonding and calibration methods are often inefficient and cannot meet the requirements of mass production and high speed. Moreover, they are prone to component damage, which greatly increases the production cost of electronic products. Summary of the Invention

[0006] Based on this, the purpose of the present invention is to overcome the defects or deficiencies of the prior art and provide a method for correcting component bonding errors.

[0007] The technical solution adopted in this invention is as follows:

[0008] A method for correcting component bonding errors includes the following steps:

[0009] Set the initial material level, calibration parts, and calibration plate with a mating position;

[0010] The calibration piece is picked up from the initial material position and moved to the bonding position according to the movement path;

[0011] Obtain the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at the bonding position;

[0012] Pick up the calibration piece from the mating position;

[0013] The motion path is corrected based on the X-axis error value and / or the Y-axis error value and / or the fitting installation angle error value.

[0014] Place the calibration piece back into the initial position.

[0015] Compared with existing technologies, the component bonding error correction method of the present invention uses calibration parts to replace components and calibration boards to replace printed circuit boards, and pre-adjusts the motion path error of the bonding head. This eliminates the need for repeated correction of motion path errors during long-term mass production, improving actual production efficiency. Furthermore, replacing components with calibration parts and printed circuit boards with calibration boards during correction reduces the wear and tear on actual parts, saving costs.

[0016] In one embodiment, obtaining the X-axis fitting error value and / or Y-axis fitting error value and / or fitting installation angle error value of the calibration component at the fitting position includes the following steps:

[0017] Obtain the actual bonding image of the calibration component at the bonding position;

[0018] By comparing the actual bonding image with the standard bonding image, the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at the bonding position are obtained.

[0019] Through the above implementation method, the X-axis fitting error value and / or the Y-axis fitting error value and / or the fitting installation angle error value can be obtained simultaneously, thereby improving the efficiency of correction.

[0020] In one embodiment, before obtaining the X-axis fitting error value and / or Y-axis fitting error value and / or fitting installation angle error value of the calibration component at the fitting position, the following steps are further included:

[0021] When the calibration component is in the picked-up state, the actual picking and installation angle of the calibration component is obtained and compared with the standard picking and installation angle to determine whether the error value of the picking and installation angle of the calibration component is within the tolerance range.

[0022] If so, the calibration component is moved to the fitting position along the motion path; otherwise, the calibration component is rotated around the R-axis according to the pickup installation angle error value to correct the pickup installation angle error of the calibration component, and then the calibration component is moved to the fitting position along the motion path.

[0023] Through the above implementation methods, the correction of angles and the correction of planar linear motion can be performed separately, thereby improving the accuracy of angle correction and planar linear motion correction.

[0024] In one embodiment, before returning the calibration piece to the initial position, the following steps are performed at least twice:

[0025] When the calibration component is in the picked-up state, the actual picking and installation angle of the calibration component is obtained and compared with the standard picking and installation angle to determine whether the error value of the picking and installation angle of the calibration component is within the tolerance range.

[0026] If so, the calibration component continues to move to the mating position according to the motion path; otherwise, the calibration component is rotated around the R-axis according to the pickup installation angle error value to correct the pickup installation angle error of the calibration component, and then the calibration component continues to move to the mating position according to the motion path.

[0027] Obtain the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at the bonding position;

[0028] Pick up the calibration piece from the mating position;

[0029] The motion path of the calibration component is corrected based on the X-axis error value and / or the Y-axis error value and / or the fitting installation angle error value.

[0030] The above implementation method can improve the motion path accuracy when the calibration component is moved to the same mating position.

[0031] In one embodiment, a plurality of mating positions are provided on the calibration plate;

[0032] The calibration pieces are picked up from the initial material position and moved to the respective mating positions according to their respective movement paths;

[0033] Obtain the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at each bonding position;

[0034] Pick up the calibration pieces from each mating position;

[0035] Error corrections are performed on each motion path based on the X-axis error value and / or the Y-axis error value and / or the fitting installation angle error value.

[0036] Through the above implementation method, the motion path to different fitting positions is corrected for errors to meet the needs of mass production.

[0037] Furthermore, to achieve the above-mentioned method for correcting component bonding errors, this invention also provides a system for correcting component bonding errors, overcoming the shortcomings of the prior art. The technical solution is as follows:

[0038] A system for correcting component bonding errors, comprising a method for performing the aforementioned component bonding error correction, including:

[0039] A moving module is used to move the calibration component, including moving the calibration component from the initial material position to the bonding position, and moving the calibration component from the bonding position back to the initial material position;

[0040] The bonding image capturing module is used to acquire the actual bonding image when the calibration part is located at the bonding position;

[0041] Storage module for storing standard bonding images;

[0042] The comparison module is used to compare the actual bonding image with the standard bonding image and obtain the X-axis bonding error value, the Y-axis bonding error value and the bonding installation angle error value;

[0043] An error correction module is used to correct the motion path of the moving module based on the X-axis fitting error value and / or the Y-axis fitting error value and / or the fitting installation angle error value.

[0044] Compared with the prior art, the component bonding error correction method of the present invention, which uses the above-mentioned component bonding error correction system, can improve the efficiency of mass production and reduce the damage of parts.

[0045] In one embodiment, the system for correcting component bonding errors further includes:

[0046] The image capture module is used to acquire the actual image captured when the calibration component is picked up by the moving module;

[0047] The storage module is also used for standard image pickup.

[0048] The comparison module is also used to compare the actual picked image with the standard picked image and obtain the picking installation angle error value;

[0049] The error correction module is also used to correct the rotation of the moving module around the R-axis based on the pickup installation angle error value.

[0050] The above-described implementation methods can be used to correct the installation angle and planar linear motion, thereby improving the correction accuracy.

[0051] Furthermore, to achieve the aforementioned method for correcting component bonding errors, this invention also provides a device for correcting component bonding errors, overcoming the shortcomings of the prior art. The technical solution is as follows:

[0052] A device for correcting component bonding errors, comprising:

[0053] The work platform is divided into a work area and an initial material location.

[0054] A calibration plate is located in the working area, and the plate surface is provided with mating position patterns for identifying the mating positions;

[0055] The calibration component has positional graphics for identifying the X-axis and Y-axis positions and the mounting angles of rotation about the R-axis;

[0056] The bonding head is capable of picking up the calibration piece from the initial material position according to the movement path, moving the calibration piece to the bonding position pattern, and moving the calibration piece from the bonding position pattern to the initial material position;

[0057] A first camera is used to capture an actual bonding image of the calibration component when it is located in the bonding position pattern;

[0058] The controller is electrically connected to the bonding head and the first camera respectively, and can control the movement of the bonding head and the shooting of the first camera according to the above-mentioned component bonding error correction method.

[0059] Compared with the prior art, the component bonding error correction method of the present invention, which uses the above-mentioned component bonding error correction device, can improve the efficiency of mass production and reduce the damage of parts.

[0060] In one embodiment, the component bonding error correction device further includes a second camera electrically connected to the controller; the working platform is also divided into bottom shooting positions, and the second camera is located in the bottom shooting positions; the controller can control the second camera to shoot.

[0061] The above implementation method can be used to obtain the installation angle and correct the rotation error.

[0062] In one embodiment, the bonding head is provided with a mounting base, the first camera is located on the mounting base, and moves together with the bonding head.

[0063] The above implementation method enables immediate photography after the calibration part is placed on the mating pattern, thereby improving calibration efficiency.

[0064] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings. Attached Figure Description

[0065] Figure 1 This is a schematic diagram of the overall process of the component bonding error correction method of the present invention;

[0066] Figure 2 This is a flowchart illustrating the process of obtaining the installation angle error value when the calibration part is picked up, and determining whether the installation angle error value is within the tolerance range.

[0067] Figure 3 This is a schematic diagram of the process of obtaining the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value when the calibration part is at one of the bonding positions on the calibration plate.

[0068] Figure 4 This is a schematic diagram of the overall structure of the component bonding error correction system of the present invention;

[0069] Figure 5 This is a front view of the component bonding error correction device of the present invention.

[0070] Figure 6 This is a bottom view of the component bonding error correction device of the present invention.

[0071] Figure 7 This is a graph showing the change in X-axis accuracy before and after using the component bonding error correction method of the present invention;

[0072] Figure 8 This is a graph showing the change in Y-axis accuracy before and after using the component bonding error correction method of the present invention.

[0073] Reference numerals: 10, working platform; 11, working area; 12, initial material position; 13, bottom shooting position; 20, calibration plate; 21, bonding position graphic; 212, dot part; 212, identification frame; 30, calibration part; 40, bonding head; 41, suction cup; 42, mounting base; 50, first camera; 60, second camera. Detailed Implementation

[0074] The applicant, addressing the issues of low production efficiency and easy damage to components in existing component bonding processes, analyzed and studied the component bonding process. The findings revealed that while comparing captured images with standard images can improve component positioning accuracy, this method often requires multiple images of the component in the bonding position, followed by repeated adjustments before the bonding process can be completed. This prevents a one-step process and thus impacts bonding efficiency. Furthermore, the prolonged adsorption and repeated movement of components by the bonding head can also damage them. On the other hand, although mechanical parts have inherent processing and assembly errors, they are relatively wear-resistant. Once installed, the error in the movement path remains largely unchanged for a considerable period. Therefore, bonding heads driven by mechanical structures such as motors and gears exhibit minimal deviation in their movement path after assembly for a considerable time.

[0075] In response to the above findings, the applicant proposes a method for correcting component bonding errors, along with a corresponding system and apparatus, to improve component bonding efficiency, reduce damage rates during the bonding process, and thus lower semiconductor packaging costs. This component bonding error correction method primarily employs a pre-calibration approach. A calibration component replaces components such as chips, and a calibration board replaces the substrate and other component bonding objects. The calibration component is moved to the calibration board by the bonding head, and an image is captured. The captured image is then analyzed to obtain the motion error of the bonding head in planar motion and rotation around an axis. Finally, the motion path of the bonding head is corrected based on this motion error, ensuring high-precision bonding of components to the substrate each time. Furthermore, multiple cycles of "movement-image-comparison-adjustment-re-movement" can be used for correction, thereby improving the accuracy of error correction. Once error correction is complete, the correction process can be eliminated during a long period of mass production until errors are discovered during quality inspection or the production object needs to be changed, at which point correction is required again, thus improving production efficiency. In addition, the use of substitutes in the correction process reduces actual product loss.

[0076] The X-axis and Y-axis are defined as two mutually perpendicular and intersecting straight lines in the same plane, and the R-axis is defined as a straight line perpendicular to the same plane. The origin is the intersection of the X-axis, Y-axis, and R-axis. The following provides a detailed description of the component bonding error correction method of the present invention, as well as the corresponding bonding correction system and bonding correction device.

[0077] Please see Figure 1 The component bonding error correction method of the present invention includes the following steps:

[0078] Step S10: Set the calibration plate, calibration parts, and initial material level.

[0079] The calibration component is used to simulate the component, and the calibration board is used to simulate the printed circuit board of the component to be bonded.

[0080] Components include passive components (resistors, capacitors, etc.) and active components (CPU, memory chips, wafers, etc.). Depending on the circuit design, printed circuit boards have soldering positions, insertion positions, etc., for mounting components.

[0081] The calibration board is a flat plate, with the X and Y axes parallel to its surface and the R axis perpendicular to it. The size of the calibration board is no smaller than the working area of ​​the printed circuit board, and several mating positions corresponding to soldering and insertion positions are marked on its surface according to the mounting positions of the components.

[0082] The size and shape of the calibration parts correspond to the components. Since the correction is for planar errors, the components can also be simulated using a board.

[0083] The initial material position is set outside the calibration plate and is used to place the calibration parts during the initial calibration.

[0084] Step S20: Pick up the calibration part from the initial material position.

[0085] Methods for picking up calibration parts include using a bonding head equipped with a vacuum suction head to adsorb the calibration parts, and using a bonding head equipped with a robotic arm to grip the calibration parts.

[0086] Step S30: Obtain the installation angle error value when the calibration part is picked up, and determine whether the installation angle error value is within the tolerance range; if yes, then perform error correction on the installation angle before proceeding to step S40; otherwise, proceed directly to step S40.

[0087] If components have different mounting angles at different bonding positions on the printed circuit board, the mounting angle of the component can be measured after picking up the calibration part from the initial material position, and the picking angle error can be corrected. The mounting angle of the component is the angle between one of the component's reference lines and the X-axis and / or Y-axis when the component is projected along the R-axis onto the printed circuit board. For calibration parts, the mounting angle can be obtained by calibrating reference lines on the calibration part and measuring the angle between the reference lines and the X-axis or Y-axis. Please refer to [link to relevant documentation]. Figure 2 This includes the following steps:

[0088] Step S31: After picking up the calibration part from the initial material position, rotate the calibration part around the R axis according to the standard picking and installation angle.

[0089] The standard pick-up and mounting angle is the angle at which the reference line of a component relative to the X-axis and / or Y-axis meets the design requirements when the component is projected along the R-axis onto the printed circuit board.

[0090] Step S32: When the calibration part is in the picking state, obtain the actual picking and installation angle of the calibration part and compare it with the standard picking and installation angle to determine whether the error value of the picking and installation angle of the calibration part is within the tolerance range.

[0091] The methods for obtaining the pickup and installation angle error value of the calibration part include: taking a picture of the calibration part located on the bonding head along the R-axis direction to obtain an actual pickup image, superimposing the actual pickup image with a standard pickup image, and taking the angle between the two images on the same reference line as the pickup and installation angle error value; or, measuring the angle between the actual pickup image and the standard pickup image relative to the X-axis, and taking the difference between the two images as the pickup and installation angle error value. The standard pickup image is the image of the calibration part when it is picked up by the bonding head and rotated around the R-axis, and the actual installation angle meets the design requirements, i.e., the actual installation angle is within the tolerance range.

[0092] In this embodiment, the bonding head is adsorbed from above the calibration piece. During shooting, the bonding head moves the calibration piece above the camera, and the camera shoots the image upwards, thereby obtaining the actual captured image.

[0093] Step S33: If the picking and mounting angle error value of the calibration part is not within the tolerance range, rotate the calibration part around the R axis according to the picking and mounting angle error value to correct the error of the picking and mounting angle, and then execute step S40; otherwise, directly execute step S40.

[0094] The bonding head is driven to rotate around the R-axis based on the pickup and installation angle error value, so that the pickup and installation angle of the calibration part is within the tolerance range of the standard pickup and installation angle.

[0095] Step S40: Place the calibration piece onto one of the mating positions on the calibration plate.

[0096] The calibration component is placed on one of the mating positions of the calibration plate by means of mechanical structures such as motors, gears and shafts driving the mating head to move linearly in the plane along the X-axis and / or Y-axis and to rotate around the R-axis.

[0097] Step S50: Obtain the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value when the calibration part is at one of the bonding positions on the calibration plate. This may include the following steps:

[0098] Step S51: Obtain the actual bonding image of the calibration part at one of the bonding positions on the calibration plate.

[0099] The method for obtaining an actual bonding image of the calibration component at one of the bonding positions on the calibration plate includes: taking a picture of the calibration component located at one of the bonding positions on the calibration plate along the R-axis direction to obtain an actual bonding image.

[0100] In this embodiment, the calibration component is placed above one of the bonding positions on the calibration plate. When taking pictures, the camera is moved above the calibration plate and the camera is pointing downwards to take pictures, thereby obtaining the actual bonding image.

[0101] Step S52: By comparing the actual bonding image and the standard bonding image, obtain the X-axis bonding error value, Y-axis bonding error value, and bonding angle error value, respectively. The standard bonding image is the image when the calibration part is bonded to the bonding position, and the X-axis bonding error value, Y-axis bonding error value, and bonding angle error value meet the design requirements; that is, the image when the X-axis bonding error value, Y-axis bonding error value, and bonding angle error value are within the tolerance range.

[0102] In this embodiment, the X-axis bonding error value, Y-axis bonding error value, and bonding angle error value can be obtained respectively through the following methods:

[0103] Two mutually perpendicular and intersecting reference lines, a first reference line and a second reference line, are set on the calibration component. The intersection point of the first reference line and the second reference line is the reference point. Therefore, in the standard bonding image, the first reference line, the second reference line, and the reference point are the standard first reference line, the standard second reference line, and the standard reference point, respectively; in the actual bonding image, the first reference line, the second reference line, and the reference point are the actual first reference line, the actual second reference line, and the actual reference point, respectively, thus obtaining:

[0104] The X-axis fitting error value is the distance between the actual reference point and the standard reference point in the X-axis direction; the Y-axis fitting error value is the distance between the actual reference point and the standard reference point in the Y-axis direction; the fitting angle error value is the angle between the actual first reference line and the standard first reference line.

[0105] Step S60: Pick up the calibration piece from one of the mating positions on the calibration plate.

[0106] Step S70: Determine whether the X-axis mating error value and / or Y-axis mating error value and / or mating angle error value are within the tolerance range; if so, correct the error of the calibration part's motion path according to the X-axis mating error value and / or Y-axis mating error value and / or mating angle error value, and then execute step S80; otherwise, directly execute step S80.

[0107] The errors in the calibration component's motion path include errors in the X-axis direction, errors in the Y-axis direction, and contact angle errors around the R-axis.

[0108] For example, based on the comparison results, the X-axis bonding error is greater than 1 unit length, the Y-axis bonding error is less than 1 unit length, and the bonding angle error is 1° clockwise. During error correction, after picking up the calibration part, the bonding head rotates 1° counterclockwise. When moving from the initial material position to one of the bonding positions on the calibration plate, the distance the bonding head moves in the X-axis direction decreases by 1 unit length, and the distance it moves in the Y-axis direction increases by 1 unit length.

[0109] Step S80: Place the calibration part back into the initial position.

[0110] Step S90: Repeat steps S30 to S80 to obtain the X-axis bonding error value, Y-axis bonding error value, and bonding installation angle error value of the calibration part as it moves from the initial material position to each bonding position. Based on these values, the movement path of the calibration part from the initial material position to each bonding position is corrected one by one until the X-axis error value, Y-axis error value, and bonding installation angle error value of all bonding positions on the calibration plate are within the tolerance range. The bonding error correction work is then completed.

[0111] Furthermore, to improve the accuracy of the installation angle correction and to automatically verify the correction results, for the same mating position, steps S30 to S70 can be executed twice or more in a loop along the same motion path.

[0112] It is worth noting that although the fitting and installation angle error value can be obtained in step S50 and corrected in subsequent steps, since the installation angle has already been picked up and corrected in step S30, the fitting and installation angle error value obtained in step S50 will be significantly reduced, and may even require no further adjustment. This means that step S70 basically only needs to correct the error of planar linear motion, thereby reducing the difficulty of error correction in step S70. Adding step S30 serves to separate the correction of rotational error and planar linear motion error into different steps, reducing the difficulty of error correction.

[0113] Please see Figure 7 and Figure 8 After using the component bonding error correction method of the present invention, the printed circuit boards produced in large quantities were inspected and it was found that, compared with the design requirements, the positional deviation of the components after they were installed on the printed circuit board was greatly reduced in both the X-axis and Y-axis directions, the accuracy fluctuation was controlled within a small tolerance range, and the component bonding error was greatly reduced.

[0114] In addition, for the above-mentioned component bonding error correction method, please refer to [link / reference needed]. Figure 4 The present invention also provides a component bonding error correction system, comprising:

[0115] The moving module is used to move the calibration part or component from the initial material position to one of the mating positions on the calibration plate, and to move the calibration part back from one of the mating positions on the calibration plate to the initial material position. The moving module is capable of performing actions including translation along the X-axis and Y-axis in a plane, and rotation about the R-axis.

[0116] The bonding image capturing module is used to capture the actual bonding image when the calibration part is located at one of the bonding positions on the calibration plate.

[0117] The image capture module is used to capture the actual image captured when the calibration component is picked up by the moving module.

[0118] The storage module is used to store standard bonding images and standard pickup images;

[0119] The comparison module is used to compare the actual bonding image with the standard bonding image, and to compare the actual pickup image with the standard pickup image, and to obtain the X-axis bonding error value, Y-axis bonding error value, bonding installation angle error value, and pickup installation angle error value.

[0120] The error correction module is used to correct the errors in the motion path of the moving module based on the X-axis fitting error value, Y-axis fitting error value, fitting installation angle error value, and picking installation angle error value.

[0121] Specifically, please refer to the following: Figure 5 and Figure 6 The present invention provides a device for correcting component bonding error, including a working platform 10, a calibration plate 20, a calibration component 30, a bonding head 40, a first camera 50, a second camera 60, and a controller (not shown).

[0122] In one embodiment, the work platform 10 has a work surface divided into a work area 11 for placing the calibration plate 20, an initial material position 12 for placing the calibration component 30, and a bottom shooting position 13 for mounting the second camera 60. The initial material position 12 and the bottom shooting position 13 are located outside the work area 11. Preferably, the initial material position 12 is located next to the bottom shooting position 13 to reduce the travel distance of the bonding head 40.

[0123] The calibration plate 20 is fixed on the workbench and located within the work area 11. The upper surface of the calibration plate 20 has several mating position patterns 21 for identifying mating positions. These patterns can be arranged in a matrix with uniform spacing on the calibration plate 20, or distributed according to the specific positions of the components on the printed circuit board. Each mating position pattern 21 includes a dot portion 211 and an identification frame 212. The size of the dot portion 211 is such that it can be identified by the naked eye or a camera, and the identification frame 212 surrounds the outside of the dot portion 211. Preferably, the identification frame 212 is square, with its sides parallel to the X-axis and Y-axis, respectively.

[0124] The calibration component 30 can be a square plate with a position graphic (not labeled) on its upper side surface for identifying the X-axis, Y-axis position and the angle between the X-axis or Y-axis. In one embodiment, the position graphic includes a square and several irregular shapes of different sizes with a chamfer. The position of the calibration component 30 and the installation angle after rotation around R can be identified by the chamfer and the edge of the square.

[0125] The bonding head 40 is located above the work platform 10 and is equipped with a suction cup 41 for adsorbing the calibration part 30 and a mounting base 42. The first camera 50 is mounted on the mounting base 42. The mounting base 42 is driven to move by a motor or the like, thereby causing the first camera 50 to move together with the bonding head 40. The camera of the first camera 50 can capture the actual bonding image from below. The bonding head 40 can pick up the calibration part 30 and move it to the bonding position pattern 21 according to a certain motion trajectory.

[0126] The second camera 60 is located at the bottom shooting position 13, and its camera is able to shoot upwards to capture actual images.

[0127] The controller is a computer with a central processing unit, as is common in the prior art. It has the functions of storing and executing algorithm calculations and outputting results, as well as controlling other devices. The first camera 50, the second camera 60, and the bonding head 40 are electrically connected to the controller to control the movement of the bonding head 40 between the initial material position 12, the bottom shooting position 13, and the working area 11, and to capture actual bonding images and actual pickup images. Based on the actual bonding images and actual pickup images, the X-axis bonding error value, Y-axis bonding error value, bonding installation angle error value, and pickup installation angle error value are calculated by the algorithm.

[0128] During operation, the motion path includes the path from the initial material position to the bottom shooting position, from the bottom shooting position to each bonding position, and from each bonding position back to the initial material position. Under the control of the controller, the bonding head 40 moves to the initial material position 12 and picks up the calibration part 30; then the bonding head 40 moves above the second camera 50, the second camera 50 takes a picture, acquires the actual picked-up image and sends it to the controller, the controller compares it, and drives the bonding head 40 to rotate around the R-axis according to the picking installation angle error value, adjusting the installation angle of the calibration part 30 on the bonding head 40; then the bonding head 40 is driven to move above one of the bonding positions on the calibration plate 20, and the calibration part 30 is placed in that bonding position. The driving mounting base 42 drives the first camera 50 to move above the bonding position to take a picture, acquire the actual bonding image, and send it to the controller for comparison, obtaining the X-axis bonding error value, Y-axis bonding error value and bonding installation angle error value. Finally, repeat the above process multiple times until a calibration piece 30 is placed at least once on all mating positions for calibration and compensation.

[0129] Compared with the prior art, the method, system, and apparatus for correcting component bonding errors of the present invention have the following advantages:

[0130] 1. Using alternative pre-calibration can improve the efficiency of actual production and reduce the wear and tear of actual parts;

[0131] 2. It can correct the accuracy of installation angle and planar motion separately, thereby improving the accuracy of installation angle and planar motion;

[0132] 3. The calibration process is highly automated and can perform verification automatically.

[0133] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application. The singular forms “a,” “the,” and “the” used in the embodiments and claims of this application are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that, unless otherwise stated, “a plurality” means two or more; the terms “first,” “second,” “third,” etc., are used only to distinguish and not to describe a particular order or sequence, nor should they be construed as indicating or implying relative importance. The term “and / or” as used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description relates to drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of this application, those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0134] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A method for correcting component bonding errors, characterized in that, Includes the following steps: Set the initial material level, calibration parts, and calibration plate with a mating position; The calibration piece is picked up from the initial material position. While the calibration piece is in the picked-up state, the actual picking and installation angle of the calibration piece is obtained and compared with the standard picking and installation angle to determine whether the error value of the picking and installation angle of the calibration piece is within the tolerance range. If so, the calibration component continues to move to the mating position according to the motion path; otherwise, the calibration component is rotated around the R-axis according to the pickup installation angle error value, the pickup installation angle error of the calibration component is corrected, and then the calibration component is moved to the mating position according to the motion path. Obtain the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at the bonding position; Pick up the calibration piece from the mating position; The motion path is corrected based on the X-axis error value and / or the Y-axis error value and / or the fitting installation angle error value. Place the calibration piece back into the initial position.

2. The method for correcting component bonding errors according to claim 1, characterized in that, Obtaining the X-axis fitting error value and / or Y-axis fitting error value and / or fitting installation angle error value of the calibration component at the fitting position includes the following steps: Obtain the actual bonding image of the calibration component at the bonding position; By comparing the actual bonding image with the standard bonding image, the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at the bonding position are obtained.

3. The method for correcting component bonding errors according to claim 1, characterized in that, Before returning the calibration piece to the initial position, the following steps shall be performed at least twice: When the calibration component is in the picked-up state, the actual picking and installation angle of the calibration component is obtained and compared with the standard picking and installation angle to determine whether the error value of the picking and installation angle of the calibration component is within the tolerance range. If so, the calibration component continues to move to the mating position according to the motion path; otherwise, the calibration component is rotated around the R-axis according to the pickup installation angle error value to correct the pickup installation angle error of the calibration component, and then the calibration component continues to move to the mating position according to the motion path. Obtain the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at the bonding position; Pick up the calibration piece from the mating position; The motion path of the calibration component is corrected based on the X-axis error value and / or the Y-axis error value and / or the fitting installation angle error value.

4. The method for correcting component bonding errors according to claim 1, characterized in that: Several mating positions are provided on the calibration plate; The calibration pieces are picked up from the initial material position and moved to the respective mating positions according to their respective movement paths; Obtain the X-axis bonding error value and / or Y-axis bonding error value and / or bonding installation angle error value of the calibration component at each bonding position; Pick up the calibration pieces from each mating position; Error corrections are performed on each motion path based on the X-axis error value and / or the Y-axis error value and / or the fitting installation angle error value.

5. A system for correcting component bonding errors, used to perform the method for correcting component bonding errors as described in claim 1, characterized in that: include: A moving module is used to move the calibration component, including moving the calibration component from the initial material position to the bonding position, and moving the calibration component from the bonding position back to the initial material position; The image capture module is used to acquire the actual image captured when the calibration component is picked up by the moving module; the bonding image capture module is used to acquire the actual bonding image when the calibration component is located at the bonding position. The storage module is used to store standard picked-up images and standard bonding images; The comparison module is used to compare the actual picked-up image with the standard picked-up image and obtain the picking installation angle error value, and to compare the actual bonding image with the standard bonding image and obtain the X-axis bonding error value, the Y-axis bonding error value and the bonding installation angle error value. An error correction module is used to correct the rotation of the moving module around the R-axis based on the pickup installation angle error value, and to correct the movement path of the moving module based on the X-axis fitting error value and / or the Y-axis fitting error value and / or the fitting installation angle error value.

6. A device for correcting component bonding errors, characterized in that, include: The work platform is divided into a work area, an initial material position, and a bottom shooting position. A calibration plate is located in the working area, and the plate surface is provided with mating position patterns for identifying the mating positions; The calibration component has positional graphics for identifying the X-axis and Y-axis positions and the mounting angles of rotation about the R-axis; The bonding head is capable of picking up the calibration piece from the initial material position according to the movement path, moving the calibration piece to the bonding position pattern, and moving the calibration piece from the bonding position pattern to the initial material position; A first camera is used to capture an actual bonding image of the calibration component when it is located in the bonding position pattern; The second camera, located at the bottom shooting position, is used to capture an actual image of the calibration component when it is positioned at the bonding head. The controller is electrically connected to the bonding head, the first camera, and the second camera, respectively. The method for correcting component bonding errors according to claim 1 can control the movement of the bonding head and the first and second cameras to take pictures.

7. The device for correcting component bonding errors according to claim 6, characterized in that: The bonding head is provided with a mounting base, and the first camera is located on the mounting base and moves together with the bonding head.

Images