Multimedia sound box interconnection system
By using a four-level contact conductor cross-connection in the speaker audio cable, the complex wiring and data transmission delay issues of multimedia speaker interconnection systems are solved, enabling data communication between speakers and improving user experience and security.
Patent Information
- Application Number
- CN202410506574.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-10-28
AI Technical Summary
The wiring of existing multimedia speaker interconnection systems is complex, data transmission delays lead to a poor user experience, and there is a lack of direct data communication channels between speakers, which affects applications in complex scenarios.
A speaker audio cable is used to connect multimedia speakers. The speaker audio cable includes a first plug end, a second plug end and a connecting main line. The four-level contact conductors at the plug end are cross-connected through internal lines to achieve data communication between speakers.
It simplifies system wiring complexity, improves user experience, enables data communication between speakers, reduces signal interference, and enhances security.
Smart Images
Figure CN120855016A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of multimedia speaker technology, specifically relating to a multimedia speaker interconnection system. Background Technology
[0002] Multimedia speaker interconnection system is a device system that integrates audio playback, wireless connection and intelligent control functions. It not only provides a high-quality audio experience, but also makes it easy for users to connect with other devices and achieve more convenient operation through intelligent control. It is widely used in various scenarios.
[0003] Current multimedia speaker interconnection systems require each speaker to connect to a remote interaction device via its own audio cable. While this method facilitates speaker control, it leads to complex wiring, increases costs, and reduces deployment flexibility. Furthermore, data exchange between speakers is difficult under this method. Because each speaker connects independently to the remote interaction device, there is a lack of direct data communication channels. When coordinating playback from multiple speakers, the remote interaction device must act as an intermediary, increasing data transmission latency. This not only impacts user experience but also limits the application of multimedia speaker systems in complex scenarios. Summary of the Invention
[0004] The purpose of this application is to propose a multimedia speaker interconnection system to solve the technical problems of complex wiring and data transmission delay in existing multimedia speaker interconnection systems, which result in a poor user experience.
[0005] To address the aforementioned technical problems, this application provides a multimedia speaker interconnection system, which employs the following technical solution:
[0006] A multimedia speaker interconnection system includes a remote interaction device and several multimedia speakers. The remote interaction device connects to any one of the multimedia speakers. The multimedia speaker interconnection system also includes speaker audio cables for connecting the several multimedia speakers. The speaker audio cables include a first plug end, a second plug end, and a connecting main line. The connecting main line contains internal wires. Both the first plug end and the second plug end include four-pole contact conductors. The four-pole contact conductors of the first plug end and the four-pole contact conductors of the second plug end are cross-connected through the internal wires.
[0007] Furthermore, the four-level contact conductors of the first plug end sequentially include a first contact conductor, a second contact conductor, a third contact conductor, and a fourth contact conductor, with the first contact conductor being the outermost contact conductor of the first plug end; the four-level contact conductors of the second plug end include a fifth contact conductor, a sixth contact conductor, a seventh contact conductor, and an eighth contact conductor, with the fifth contact conductor being the outermost contact conductor of the second plug end; the first contact conductor is connected to the sixth contact conductor, the second contact conductor is connected to the fifth contact conductor, the third contact conductor is connected to the seventh contact conductor, and the fourth contact conductor is connected to the eighth contact conductor.
[0008] Furthermore, the multimedia speaker includes a signal processing chip, a Bluetooth chip, a signal conversion chip, a power amplifier chip, an analog signal switch, an audio speaker, and a headphone jack. The signal processing chip is connected to the Bluetooth chip, the signal conversion chip, and the analog signal switch. The analog signal switch is connected to the power amplifier chip. The power amplifier chip is connected to the audio speaker. The signal conversion chip is connected to the headphone jack. The headphone jack is compatible with the speaker's audio cable.
[0009] Furthermore, the headphone socket is provided with a jack, which includes a four-prong contact port and is compatible with the first or second plug end of the speaker audio cable.
[0010] Furthermore, the four-level contact ports of the jack sequentially include a first port, a second port, a third port, and a fourth port, wherein the first port is an audio input port, the second port is an audio output port, the third port is a data signal transmission port, and the fourth port is a grounding port.
[0011] Furthermore, when the first plug end is inserted into the jack of the headphone socket, the first contact conductor contacts the first port, the second contact conductor contacts the second port, the third contact conductor contacts the third port, and the fourth contact conductor contacts the fourth port;
[0012] When the second plug end is inserted into the jack of the headphone socket, the fifth contact conductor contacts the first port, the sixth contact conductor contacts the second port, the seventh contact conductor contacts the third port, and the eighth contact conductor contacts the fourth port.
[0013] Furthermore, the multimedia speaker also includes a serial port half-duplex circuit, which includes a data transmitting end, a data receiving end, and a data signal transmission end. The serial port half-duplex circuit is connected to the Bluetooth chip through the data transmitting end and the data receiving end, and is connected to the headphone jack through the data signal transmission end.
[0014] Furthermore, the serial port half-duplex circuit also includes a first transistor and a second transistor, with the first transistor connected to the second transistor, the data transmitting end connected to the first transistor, and the data receiving end connected to the second transistor.
[0015] Furthermore, both the first transistor and the second transistor are bipolar transistors. The serial port half-duplex circuit also includes a first resistor, a second resistor, a third resistor, and a first power interface. The data receiving end is connected to one end of the first resistor, and the other end of the first resistor is connected to the base of the second transistor. The data transmitting end is connected to the collector of the first transistor. The second resistor and the third resistor are connected in series between the collector of the second transistor and the base of the first transistor, and the common terminal of the second resistor and the third resistor serves as the data signal transmission end. The emitters of the first transistor and the second transistor are both connected to ground. The first power interface is connected to the data transmitting end, the collector of the first transistor, and the collector of the second transistor.
[0016] Furthermore, it also includes a microphone, which is connected to the signal processing chip.
[0017] Compared with the prior art, the embodiments of this application have the following main advantages:
[0018] This application discloses a multimedia speaker interconnection system, belonging to the field of multimedia speaker technology. The multimedia speaker interconnection system of this application includes a remote interaction device and several multimedia speakers. The remote interaction device connects to any one of the multimedia speakers. It also includes speaker audio cables for connecting the multiple multimedia speakers. The speaker audio cable includes a first plug end, a second plug end, and a connecting main line. The connecting main line contains internal wires. Both the first and second plug ends include four-pole contact conductors, which are cross-connected through the internal wires. In this application, the remote interaction device only needs to connect to any one multimedia speaker, and the multimedia speakers are connected to each other via speaker audio cables, simplifying the system wiring complexity. By using speaker audio cables with four-pole contact conductors for connecting the multimedia speakers, and the four-pole contact conductors at both ends of the speaker audio cable being cross-connected through the internal wires, the audio signal output from the audio output end of one multimedia speaker can be input to the audio input end of another multimedia speaker through the speaker audio cable, realizing data communication between the speakers and improving the user experience. Attached Figure Description
[0019] To more clearly illustrate the solutions in this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 A schematic diagram of the structure of a speaker audio cable according to an embodiment of this application is shown;
[0021] Figure 2 This invention illustrates a schematic diagram of the internal wiring connections of the speaker audio cable in an embodiment of this application.
[0022] Figure 3 This illustration shows one of the connection diagrams of the multimedia speaker interconnection system in an embodiment of this application;
[0023] Figure 4 A connection diagram of the first multimedia speaker 100 in an embodiment of this application is shown;
[0024] Figure 5 This illustration shows a schematic diagram of the connection between the headphone socket and the serial port half-duplex circuit in an embodiment of this application.
[0025] Figure 6 A schematic diagram of the headphone female connector pin connection relationship in an embodiment of this application is shown;
[0026] Figure 7 This is shown as a second schematic diagram of the connection relationship of the multimedia speaker interconnection system in an embodiment of this application. Detailed Implementation
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.
[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0029] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
[0030] Please refer to the attached document. Figure 1-7 This application discloses a multimedia speaker interconnection system, including a remote interaction device 300 and several multimedia speakers. The remote interaction device 300 only needs to connect to any one multimedia speaker (such as the first multimedia speaker 100). The remote interaction device 300 can connect to any multimedia speaker via a USB cable or via wireless Bluetooth. The multimedia speaker interconnection system includes at least two multimedia speakers, which are connected to each other via speaker audio cables 1, simplifying the system wiring complexity. By using speaker audio cables 1 with four-pole contact conductors for connection between multimedia speakers, the four-pole contact conductors at both ends of the speaker audio cable are cross-connected through the internal wires of the audio cable 1, so that the audio signal output from the audio output terminal of one multimedia speaker can be input to the audio input terminal of another multimedia speaker through the speaker audio cable, realizing data communication between speakers and improving the user experience.
[0031] In one specific embodiment of this application, in a conference room setting, it is generally required that the audio signal transmission between various multimedia speakers minimize signal interference and improve confidentiality. Therefore, in a conference room setting, the multimedia speaker interconnection system also includes speaker audio cables 1. Please refer to... Figure 1 The speaker audio cable 1 is a 3.5mm audio cable, used for connecting multiple multimedia speakers. In this embodiment, the speaker audio cable 1 includes a first plug end 11, a second plug end 12, and a connecting main line 13. The connecting main line 13 contains internal wires. Both the first plug end 11 and the second plug end 12 include four-pole contact conductors, which are cross-connected through the internal wires.
[0032] In the embodiments of this application, please refer to Figure 2 The four-level contact conductors of the first plug end 11 include the first contact conductor PIN1, the second contact conductor PIN2, the third contact conductor PIN3 and the fourth contact conductor PIN4 in sequence. The first contact conductor PIN1 is the outermost contact conductor of the first plug end. The four-level contact conductors of the second plug end 12 include the fifth contact conductor PIN1', the sixth contact conductor PIN2', the seventh contact conductor PIN3' and the eighth contact conductor PIN4'. The fifth contact conductor PIN1' is the outermost contact conductor of the second plug end.
[0033] In this embodiment, the main connecting line 13 has four independent internal lines: a, b, c, and d. The first contact conductor PIN1 is connected to the sixth contact conductor PIN2' via internal line a; the second contact conductor PIN2 is connected to the fifth contact conductor PIN1' via internal line b; the third contact conductor PIN3 is connected to the seventh contact conductor PIN3' via internal line c; and the fourth contact conductor PIN4 is connected to the eighth contact conductor PIN4' via internal line d. The internal wiring configuration of the speaker audio cable is shown in the table below.
[0034] Table 1 Internal Wiring Methods for Speaker Audio Cables
[0035] First plug end 11 color Second plug end 12 Internal lines PIN1 White PIN2' a PIN2 red PIN1' b PIN3 yellow PIN3' c PIN4 black PIN4' d
[0036] In the embodiments of this application, please refer to Figure 1-3 When making a wired connection to the multimedia speaker, the first plug end 11 of the speaker audio cable 1 is inserted into the headphone socket 107 of the first multimedia speaker 100, and the second plug end 12 of the speaker audio cable 1 is inserted into the headphone socket 207 of the second multimedia speaker 200. The headphone sockets of the multimedia speakers are all provided with jacks that are compatible with the first plug end 11 or the second plug end 12 of the speaker audio cable 1, and the structure of the headphone sockets of all multimedia speakers is the same.
[0037] In this embodiment of the application, the headphone jack includes four contact ports, namely a first port, a second port, a third port and a fourth port, wherein the first port is the audio input port of the multimedia speaker, the second port is the audio output port of the multimedia speaker, the third port is the data signal transmission port of the multimedia speaker, and the fourth port is the grounding port of the multimedia speaker.
[0038] In this embodiment, when the first plug end 11 is inserted into the headphone socket 107 of the first multimedia speaker 100, the first contact conductor PIN1 contacts the first port of the first multimedia speaker, the second contact conductor PIN2 contacts the second port of the first multimedia speaker, the third contact conductor PIN3 contacts the third port of the first multimedia speaker, and the fourth contact conductor PIN4 contacts the fourth port of the first multimedia speaker; when the second plug end 12 is inserted into the headphone socket 207 of the second multimedia speaker 200, the fifth contact conductor PIN1' contacts the first port of the second multimedia speaker, the sixth contact conductor PIN2' contacts the second port of the second multimedia speaker, the seventh contact conductor PIN3' contacts the third port of the second multimedia speaker, and the eighth contact conductor PIN4' contacts the fourth port of the second multimedia speaker.
[0039] The audio signal output by the first multimedia speaker 100 flows out from the second port (audio output port) of the headphone jack 107 of the first multimedia speaker 100, passes through the second contact conductor PIN2, and is transmitted through the internal wire b of the speaker audio cable, before entering the first port (audio input port) of the headphone jack 207 of the second multimedia speaker 200 via the fifth contact conductor PIN1'. The audio signal output by the second multimedia speaker 200 flows out from the second port (audio output port) of the headphone jack 207 of the second multimedia speaker 200, passes through the sixth contact conductor PIN2', and is transmitted through the internal wire a of the speaker audio cable, before entering the first port (audio input port) of the headphone jack 107 of the first multimedia speaker 100 via the first contact conductor PIN1, so that the audio signal output from the audio output terminal of one multimedia speaker can be input to the audio input terminal of another multimedia speaker through the speaker audio cable, realizing data communication between speakers and improving the user experience.
[0040] In this embodiment, the two contact conductors on the outer sides of the first plug end 11 and the second plug end 12 of the speaker audio cable 1 are cross-connected through internal wires. Specifically, the first contact conductor PIN1 is connected to the sixth contact conductor PIN2' through internal wire a, and the second contact conductor PIN2 is connected to the fifth contact conductor PIN1' through internal wire b. The speaker audio cable 1 is used to connect the first multimedia speaker 100 and the second multimedia speaker 200, so that the audio output port of the first multimedia speaker 100 is connected to the audio input port of the second multimedia speaker 200, and at the same time, the audio output port of the second multimedia speaker 200 is connected to the audio input port of the first multimedia speaker 100, thereby realizing the function of bidirectional transmission of audio signals between the two multimedia speakers.
[0041] In this embodiment, the multimedia speaker interconnection system is designed for conference room use and uses a wired connection to connect multimedia speakers. In this wired connection, a speaker audio cable with four-pole contact conductors is used to connect the multimedia speakers, allowing audio signals output from one multimedia speaker to be input to another via the audio cable, thus achieving bidirectional audio signal transmission between the two multimedia speakers. The first two poles of the four-pole contact conductors at both ends of the speaker audio cable are cross-connected through internal wires to achieve audio signal transmission between the multimedia speakers and ensure that multiple multimedia speakers can play audio synchronously. Wired transmission reduces signal interference and improves confidentiality.
[0042] In another specific embodiment of this application, the multimedia speaker interconnection system can adopt different speaker connection methods for different usage scenarios, including wired connection and wireless connection. For example, in outdoor usage scenarios, several multimedia speakers can be remotely wirelessly connected via Bluetooth, and these speakers can transmit signals via the TWS communication protocol. In the wireless connection mode, the multimedia speakers connect wirelessly via Bluetooth, allowing the outdoor use of the multimedia speakers to be unrestricted by space.
[0043] TWS (True Wireless Stereo) is a communication protocol for wireless audio transmission, allowing multimedia speakers to transmit signals wirelessly. This protocol, typically based on Bluetooth technology, enables speakers to break free from wired connections and achieve true wireless connectivity and audio transmission. Wireless connectivity provides users with greater flexibility and convenience, allowing them to place speakers without spatial limitations, easily adjusting speaker positions both indoors and outdoors as needed. Furthermore, the TWS protocol supports collaborative work between multiple speakers, enabling synchronized audio signal transmission and creating a wider, more immersive sound experience. In addition, the TWS protocol boasts high signal stability and transmission quality, ensuring audio signal clarity and consistency, enhancing the user's listening experience.
[0044] In the embodiments of this application, please refer to Figure 3-4 The multimedia speaker interconnection system includes at least two multimedia speakers. Taking the first multimedia speaker 100 as an example, the first multimedia speaker 100 includes at least a first signal processing chip 101, a first Bluetooth chip 102, a first signal conversion chip 103, a first power amplifier chip 104, a first analog signal switch 105, a first speaker 106, and a first headphone jack 107. The first signal processing chip 101 is connected to the first Bluetooth chip 102, the first signal conversion chip 103, and the first analog signal switch 105. The first analog signal switch 105 is connected to the first power amplifier chip 106. 4. The first power amplifier chip 104 is connected to the first speaker 106, and the first signal conversion chip 103 is connected to the first headphone jack 107. The first headphone jack 107 is compatible with the speaker audio cable 1. In addition, the first multimedia speaker interconnection system also includes a remote interaction device 300. The first multimedia speaker 100 also includes a first USB connector 110 and a first microphone 108. The remote interaction device 300 is connected to the first USB connector 110. The first USB connector 110 is connected to the first Bluetooth chip 102, and the first microphone 108 is connected to the first signal processing chip 101.
[0045] Further, please refer to Figure 5The first multimedia speaker 100 also includes a serial port half-duplex circuit 109, which includes a data transmitter UART1_RXD, a data receiver UART1_TXD, and a data signal transmission terminal UART_DATA. The serial port half-duplex circuit is connected to the first Bluetooth chip 102 through the data transmitter UART1_RXD and the data receiver UART1_TXD. The serial port half-duplex circuit 109 is connected to the third port (data signal transmission port of the multimedia speaker) of the first headphone jack 107 through the data signal transmission terminal UART_DATA.
[0046] Furthermore, the serial port half-duplex circuit 109 also includes a first transistor Q1 and a second transistor Q2, the first transistor Q1 is connected to the second transistor Q2, the data transmitting end UART1_RXD is connected to the first transistor Q1, and the data receiving end UART1_TXD is connected to the second transistor Q2.
[0047] Both the first transistor Q1 and the second transistor Q2 are bipolar transistors. The collector of the first transistor Q1 is connected to the data transmitting terminal UART1_RXD, and the base of the second transistor Q2 is connected to the data receiving terminal UART1_TXD. The base of the first transistor Q1 and the collector of the second transistor Q2 are connected to the data signal transmission terminal UART_DATA. The data signal transmission terminal UART_DATA is connected to the headphone jack. The emitters of the first transistor Q1 and the second transistor Q2 are grounded to GND. Both the first transistor Q1 and the second transistor Q2 are powered by power supply VCC1.
[0048] In one specific embodiment of this application, the serial port half-duplex circuit 109 further includes a first resistor R1, a second resistor R2, and a third resistor R3. The data receiving terminal UART1_TXD is connected to one end of the first resistor R1, and the other end of the first resistor R1 is connected to the base of the second transistor Q2. The second resistor R2 and the third resistor R3 are connected in series between the collector of the second transistor Q2 and the base of the first transistor Q1, and the common terminal of the second resistor R2 and the third resistor R3 serves as the data signal transmission terminal UART_DATA. The emitters of the first transistor Q1 and the second transistor Q2 are both connected to ground. The data transmitting terminal UART1_RXD is connected to the collector of the first transistor Q1 through a fourth resistor R4, and the data receiving terminal UART1_TXD is connected to one end of the first resistor R1 through a fifth resistor R5.
[0049] The serial port half-duplex circuit 109 also includes a first power interface VCC1. The first power interface VCC1 is connected to the data transmission terminal UART_DATA, the collector of the first transistor Q1, and the collector of the second transistor Q2. Specifically, the first power interface VCC1 is connected between the fifth resistor R5 and the first resistor R1 via a sixth resistor R6; the first power interface VCC1 is connected to the collector of the second transistor Q2 via a seventh resistor R7; and the first power interface VCC1 is connected to the collector of the first transistor Q1 via an eighth resistor R8. The data signal transmission terminal UART_DATA is connected between the second resistor R2 and the third resistor R3 via a ninth resistor R9.
[0050] In the above embodiment, the serial port half-duplex circuit 109 is used to realize communication between two multimedia speakers. The communication content includes volume status synchronization, button UI function synchronization, serial communication data, etc. The data sending end is used for serial communication data transmission, and the data receiving end is used for serial communication data reception.
[0051] For specific embodiments of this application, please refer to Figure 5 and Figure 6 The headphone female connector 107 has 6 pins. Pin 1 is grounded (GND), pin 2 is connected to the UART_DATA terminal of the serial half-duplex circuit, pins 3 and 5 are connected to the audio input port AUX_IN of the multimedia speaker, and pins 4 and above are connected to the audio output port AUX_OUT of the multimedia speaker. When no speaker audio cable is inserted, pins 4 and 6 of the headphone female connector are connected together, and pin 6 (serial communication detection pin UART_AUX_DET) is at a low level. After the speaker audio cable is inserted, pins 4 and 6 of the headphone female connector are disconnected, and pin 6 (serial communication detection pin UART_AUX_DET) becomes high. The Bluetooth chip detects that pin 6 (serial communication detection pin UART_AUX_DET) has changed from low to high. At this time, the two multimedia speakers communicate via serial half-duplex through the third contact conductor PIN3 and the seventh contact conductor PIN3' of the speaker audio cable. The communication includes volume status synchronization, button UI function synchronization, etc.
[0052] In a specific embodiment of this application, the multimedia speaker interconnection system further includes a tenth resistor R10, an eleventh resistor R11, a twelfth resistor R12, and a capacitor C1. One end of the tenth resistor R10 is connected to pin 4 of the headphone female connector 107, and the other end of the tenth resistor R10 is grounded. One end of the eleventh resistor R11 is connected to pin 6 of the headphone female connector 107, and the other end of the eleventh resistor R11 is connected to both the capacitor C1 and the twelfth resistor R12. The other end of the capacitor C1 is grounded, and the other end of the twelfth resistor R12 is connected to the second power interface VCC2.
[0053] In a specific embodiment of this application, the multimedia speaker interconnection system further includes an electrostatic discharge (ESD) protection circuit. The ESD protection circuit consists of four ESD protection diodes, including ESD1, ESD2, ESD3, and ESD4. ESD1 is connected to pin 6 of the headphone socket 107, ESD2 is connected to pin 4 of the headphone socket 107, ESD3 is connected to pin 3 of the headphone socket 107, and ESD4 is connected to pin 2 of the headphone socket 107. The ESD protection circuit is used to prevent electrostatic discharge (ESD) from damaging the headphone socket and the connected audio equipment.
[0054] For specific embodiments in this application, please refer to [link / reference]. Figure 3 In a conference room setting, users can connect to the first multimedia speaker 100 via the remote interaction device 300 using either USB cable 2 (USB communication mode) or Bluetooth mode 3. In conference mode, the remote interactive voice signal emitted by the remote interaction device 300 is transmitted via USB cable 2 or Bluetooth to the first Bluetooth chip 102. The first Bluetooth chip 102 transmits the signal to the first signal processing chip 101, which performs echo cancellation before transmitting it to the first analog signal switch 105. The first analog signal switch 105 transmits the signal to the first power amplifier chip 104, which amplifies the signal before transmitting it to the first speaker 106 for playback. Simultaneously, the first signal processing chip 101 also transmits the signal to the first signal conversion chip 103, which performs digital-to-analog conversion before transmitting it to the first headphone jack 107, and then transmits it to another speaker via a 3.5mm audio cable. The second headphone female connector 207 of the conference speaker transmits data to the second signal conversion chip 203. After analog-to-digital conversion, the second signal conversion chip 203 transmits the data to the second signal processing chip 201. The second signal processing chip 201 transmits the data to the second analog signal switch 205. The second analog signal switch 205 transmits the data to the second power amplifier chip 204. After amplification, the second power amplifier chip 204 transmits the data to the second speaker 206 for playback. Users can also connect to the second multimedia speaker 200 via a remote interactive device 300 through a USB cable (USB communication mode) or Bluetooth mode. The signal communication between the second multimedia speaker 200 and the first multimedia speaker 100 is the same as above, and will not be described again here.
[0055] In a specific embodiment of this application, both the first microphone 108 of the first multimedia speaker 100 and the second microphone 208 of the second multimedia speaker 200 can pick up the local audio signal from the conference room and upload it to the corresponding signal processing chip for processing. The number of the first microphone 108 and the second microphone 208 can be set according to actual usage requirements. For example, the number of both the first microphone 108 and the second microphone 208 can be set to four. Taking the first microphone 108 picking up the local audio signal from the conference room as an example, after picking up the local audio signal, the first microphone 108 sends it to the first signal processing chip 101 for environmental noise cancellation processing, and then sends the processed local audio signal to the first Bluetooth chip 102. The first Bluetooth chip 102 transmits the signal to the remote interactive device 300 via USB cable or Bluetooth. Taking the second microphone 208 of the second multimedia speaker 200 picking up the local voice signal of the conference room as an example, after the second microphone 208 picks up the local voice signal, it sends it to the second signal processing chip 201 for environmental noise cancellation processing. The second signal processing chip 201 transmits it to the second signal conversion chip 203. The second signal conversion chip 203 transmits it to the second headphone jack 207 after digital-to-analog conversion. Then, it transmits it to the first headphone jack 107 of the first multimedia speaker 100 connected to the remote interactive device through a 3.5mm audio cable. The first headphone jack 107 transmits it to the first signal conversion chip 103. The first signal conversion chip 103 transmits it to the first signal processing chip 101 after analog-to-digital conversion. The first signal processing chip 101 transmits it to the first Bluetooth chip 102. The first Bluetooth chip 102 transmits it to the remote interactive device 300 through a USB cable or Bluetooth.
[0056] In another specific embodiment of this application, please continue to refer to Figure 7 In the scenario of listening to music, the user can connect the remote interactive device 300 to the first multimedia speaker 100 via USB cable 2 (USB communication mode) or Bluetooth mode 3. The first multimedia speaker 100 and the second multimedia speaker 200 are connected via Bluetooth TWS protocol mode 4. The first multimedia speaker 100 can transmit the audio signal of the remote interactive device to the second multimedia speaker 200 through TWS signal transmission. The first multimedia speaker 100 and the second multimedia speaker 200 simultaneously amplify the audio signal of the remote interactive device and output it through their respective speakers, so that the first multimedia speaker 100 and the second multimedia speaker 200 can play music synchronously.
[0057] In the above embodiments, the multimedia speaker interconnection system of this application can adopt different speaker connection methods for different usage scenarios, including wired connection and wireless connection. In the wired connection method, a speaker audio cable with four-pole contact conductors is used to connect multimedia speakers, so that the audio signal output from one multimedia speaker can be input to another multimedia speaker through the speaker audio cable. The four-pole contact conductors at both ends of the speaker audio cable are cross-connected through the internal wires of the audio cable to realize the audio signal transmission between multimedia speakers and ensure that multiple multimedia speakers can play audio synchronously. Wired transmission can reduce signal interference and improve confidentiality. In the wireless connection method, the multimedia speakers are wirelessly connected via Bluetooth, so that the outdoor use of multimedia speakers is not limited by space.
[0058] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.
Claims
1. A multimedia speaker interconnection system, comprising a remote interaction device and a plurality of multimedia speakers, characterized in that, The remote interactive device connects to any one of the multimedia speakers. The multimedia speaker interconnection system also includes a speaker audio cable. The speaker audio cable is used for connecting several multimedia speakers. The speaker audio cable includes a first plug end, a second plug end, and a connecting main line. The connecting main line is provided with an internal wire. Both the first plug end and the second plug end include a four-pole contact conductor. The four-pole contact conductors of the first plug end and the four-pole contact conductors of the second plug end are cross-connected through the internal wire.
2. The multimedia speaker interconnection system as described in claim 1, characterized in that, The four-stage contact conductors of the first plug end sequentially include a first contact conductor, a second contact conductor, a third contact conductor, and a fourth contact conductor, with the first contact conductor being the outermost contact conductor of the first plug end; the four-stage contact conductors of the second plug end include a fifth contact conductor, a sixth contact conductor, a seventh contact conductor, and an eighth contact conductor, with the fifth contact conductor being the outermost contact conductor of the second plug end; the first contact conductor is connected to the sixth contact conductor, the second contact conductor is connected to the fifth contact conductor, the third contact conductor is connected to the seventh contact conductor, and the fourth contact conductor is connected to the eighth contact conductor.
3. The multimedia speaker interconnection system as described in claim 2, characterized in that, The multimedia speaker includes a signal processing chip, a Bluetooth chip, a signal conversion chip, a power amplifier chip, an analog signal switch, a speaker, and a headphone jack. The signal processing chip is connected to the Bluetooth chip, the signal conversion chip, and the analog signal switch. The analog signal switch is connected to the power amplifier chip. The power amplifier chip is connected to the speaker. The signal conversion chip is connected to the headphone jack. The headphone jack is compatible with the speaker's audio cable.
4. The multimedia speaker interconnection system as described in claim 3, characterized in that, The headphone socket is provided with a jack, which includes a four-prong contact port and is compatible with the first or second plug end of the speaker audio cable.
5. The multimedia speaker interconnection system as described in claim 4, characterized in that, The four-level contact ports of the jack include a first port, a second port, a third port, and a fourth port in sequence. The first port is an audio input port, the second port is an audio output port, the third port is a data signal transmission port, and the fourth port is a grounding port.
6. The multimedia speaker interconnection system as described in claim 5, characterized in that, When the first plug end is inserted into the jack of the headphone socket, the first contact conductor contacts the first port, the second contact conductor contacts the second port, the third contact conductor contacts the third port, and the fourth contact conductor contacts the fourth port; When the second plug end is inserted into the jack of the headphone socket, the fifth contact conductor contacts the first port, the sixth contact conductor contacts the second port, the seventh contact conductor contacts the third port, and the eighth contact conductor contacts the fourth port.
7. The multimedia speaker interconnection system as described in claim 3, characterized in that, The multimedia speaker also includes a serial port half-duplex circuit, which includes a data transmitting end, a data receiving end, and a data signal transmission end. The serial port half-duplex circuit is connected to the Bluetooth chip through the data transmitting end and the data receiving end, and is connected to the headphone jack through the data signal transmission end.
8. The multimedia speaker interconnection system as described in claim 7, characterized in that, The serial port half-duplex circuit further includes a first transistor and a second transistor, with the first transistor connected to the second transistor, the data transmitting end connected to the first transistor, and the data receiving end connected to the second transistor.
9. The multimedia speaker interconnection system as described in claim 8, characterized in that, Both the first transistor and the second transistor are bipolar transistors. The serial port half-duplex circuit further includes a first resistor, a second resistor, a third resistor, and a first power interface. The data receiving end is connected to one end of the first resistor, and the other end of the first resistor is connected to the base of the second transistor. The data transmitting end is connected to the collector of the first transistor. The second resistor and the third resistor are connected in series between the collector of the second transistor and the base of the first transistor, and the common terminal of the second resistor and the third resistor serves as the data signal transmission end. The emitters of the first transistor and the second transistor are both connected to ground. The first power interface is connected to the data transmitting end, the collector of the first transistor, and the collector of the second transistor.
10. The multimedia speaker interconnection system as described in claim 3, characterized in that, It also includes a microphone, which is connected to the signal processing chip.