Electronic device

Abstract

This application provides an electronic device. A first device module and a first heat dissipation component are disposed in the space of a first mid-frame. The first heat dissipation component actively dissipates heat from a first heat source in the first device module, and a portion of the first heat dissipation component is embedded within the first mid-frame. A second device module, a second heat dissipation component, and a battery are disposed in the space of a second mid-frame. The second device module is connected to the motherboard via an FPC passing through a folding hinge. The second heat dissipation module passively dissipates heat from a second heat source in the second device module. The power of the first heat source is greater than the power of the second heat source, and the maximum dimension of the first heat source along the thickness direction of the electronic device is smaller than the maximum dimension of the second heat source along the thickness direction of the electronic device. This application achieves aesthetic thinning and improved user comfort by arranging devices of different load levels and heights on opposite sides of the hinge according to their respective heat dissipation requirements.

Description

[0001] This application claims priority to Chinese Patent Application No. 202410557549.4, filed with the China National Intellectual Property Administration on April 30, 2024, entitled "Electronic Device," the entire contents of which are incorporated herein by reference. This application also claims priority to Chinese Patent Application No. 202422652226.1, filed with the China National Intellectual Property Administration on October 30, 2024, entitled "A Foldable Display Device," the entire contents of which are incorporated herein by reference. This application further claims priority to Chinese Patent Application No. 202411834192.6, filed with the China National Intellectual Property Administration on December 12, 2024, entitled "Electronic Device," the entire contents of which are incorporated herein by reference. This application also claims priority to Chinese Patent Application No. 202510443584.8, filed with the State Intellectual Property Office of China on April 9, 2025, entitled "Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and more particularly to an electronic device. Background Technology

[0003] For portable electronic devices such as smartphones, tablets, and computers, thinness and lightness are the development trends. Foldable electronic devices feature foldable screens, which provide a large-screen display effect when flattened, and their portability in the folded state makes them very popular with users. Foldable electronic devices consist of a first main body and a second main body that can be folded relative to each other. The first main body houses the motherboard and requires a relatively thick space to accommodate numerous core functional components and a heat dissipation architecture. The second main body primarily houses the battery and does not need to support larger components, so it is thinner. This design results in a significant thickness difference between the first and second main bodies. When the foldable screen electronic device is flattened and presents a large-screen usage form, the large thickness difference between the two main bodies affects the comfort of using the large-screen form and impacts the user experience. Therefore, how to design aesthetically pleasing and lightweight foldable screen electronic devices that can fully utilize the space between the two main bodies when the screen is flattened, thereby reducing the thickness difference, is a pressing issue that needs to be addressed. Summary of the Invention

[0004] This application provides an electronic device that effectively reduces the thickness difference between the two main bodies of the electronic device, which can be folded and unfolded, by arranging components of different load levels and heights on opposite sides of a hinge according to their respective heat dissipation requirements. One side employs active cooling with a fan embedded in the mid-frame to reduce the overall thickness. The components on the other side are connected to the motherboard via a segmented FPC passing through the folding hinge, achieving passive heat dissipation through the overall device's structural features. Through the stacking of the entire system, an ultra-thin design is achieved.

[0005] In a first aspect, embodiments of this application provide an electronic device, which includes a first mid-frame, a second mid-frame, a hinge, a screen, a first device module, a first heat dissipation assembly, a second device module, a second heat dissipation assembly, and a battery. The hinge connects the first mid-frame and the second mid-frame. The screen covers the first mid-frame, the hinge, and the second mid-frame. The first device module and the first heat dissipation assembly are disposed within the internal space of the electronic device where the first mid-frame is located. The first heat dissipation assembly is used to actively dissipate heat from a first heat source in the first device module. The second device module, the second heat dissipation assembly, and the battery are disposed within the internal space of the electronic device where the second mid-frame is located. The second device module is located between the battery and the hinge. The second heat dissipation module is used to passively dissipate heat from a second heat source in the second device module. The power of the first heat source is greater than the power of the second heat source, and the maximum dimension of the first heat source along the thickness direction of the electronic device is smaller than the maximum dimension of the second heat source along the thickness direction of the electronic device.

[0006] Active cooling can be understood as: directly forcing convection through fans or other devices (such as pumps) to accelerate the transfer of heat from the heat source (such as a chip) to the external environment. Passive cooling can be understood as: relying on the thermal conductivity of materials to allow heat to dissipate from the device surface into the environment through natural convection or radiation.

[0007] This application embodiment places the first device module and the second device module on opposite sides of the pivot in the first and second middle frames, respectively. The first device module, with higher heat generation power and a smaller thickness, undergoes active heat dissipation, while the second device module, with lower heat generation power and a larger thickness, undergoes passive heat dissipation. Compared to stacking both the first and second device modules on the first middle frame and performing active heat dissipation, this application embodiment places the thicker second device module on the second middle frame, reducing the overall thickness of the first middle frame and thus decreasing the thickness difference between the main body of the electronic device containing the first middle frame and the main body containing the second middle frame. By placing the first and second device modules on opposite sides of the pivot in the first and second middle frames, the first and second heat sources are dispersed within different parts of the electronic device. The environment in which the first and second heat sources are located has a suitable operating temperature, which helps ensure the working performance of the first and second heat sources and improves the temperature uniformity and heat dissipation efficiency of the electronic device. Furthermore, by placing the second device module between the battery and the hinge, the second device module and the hinge are arranged side by side without overlapping, which helps to control the thickness of the electronic device body where the second middle frame is located. Also, since the second device module and the hinge are close to each other, the hinge can also serve as a medium for passive heat dissipation of the second device module, which helps to improve heat dissipation efficiency.

[0008] In one embodiment of the first aspect, the second heat dissipation component conducts heat from the second device module to the rotating shaft. By conducting heat from the second device module to the rotating shaft via the second heat dissipation component, the rotating shaft and the second heat dissipation component are connected. The rotating shaft can participate in the heat dissipation of the second device module and can be considered as part of the second heat dissipation component. This embodiment increases the area of ​​the second heat dissipation component, which is beneficial for improving heat dissipation efficiency.

[0009] In one possible implementation, the nearest distance between the heating center of the second heat source and the edge of the rotating shaft is less than or equal to 5 cm. The heating center of the second heat source can be obtained by measurement. This solution constrains the nearest distance between the edge of the rotating shaft and the center of the second heat source in a specific implementation. By limiting the distance to less than or equal to 5 cm, it is beneficial to achieve better heat dissipation and also to ensure a compact structure of the devices arranged within the second frame, thus rationally arranging the space within the electronic device.

[0010] In one possible implementation, the edge of the hinge is the edge of the hinge's door panel adjacent to the second heat source, corresponding to the second mid-frame. The hinge's door panel is the panel adjacent to the screen side of the hinge. For example, in an electronic device, the hinge has a two-door panel structure, a left door panel and a right door panel, with one door panel (e.g., the right door panel) located on one side of the second mid-frame. In this case, the closest distance between the edge of the right door panel and the heating center of the second heat source is less than or equal to 5 cm. The hinge may also have three door panels or other numbers of door panels.

[0011] In one embodiment of the first aspect, the second heat dissipation component includes a heat sink and a heat-conducting structure. The second device module includes a second circuit board and a second heat source. The second heat source is disposed on the second circuit board, and the heat sink is located on the side of the second heat source away from the second circuit board. A portion of the heat-conducting structure is located between the heat sink and the rear cover of the electronic device. The portion of the heat-conducting structure and the rotating shaft are stacked together to transfer heat from the second heat source to the rotating shaft through the heat-conducting structure. In this embodiment, the heat transfer path of the second heat source is as follows: the heat dissipated by the second heat source passes sequentially through the heat sink, the heat-conducting structure, a portion of the second middle frame, and the rotating shaft. Heat can be dissipated through the rotating shaft. By stacking the portion of the heat-conducting structure and the rotating shaft, a heat-conducting path can be constructed between the rotating shaft and the heat sink within a limited space, which is beneficial for improving the heat dissipation efficiency of the electronic device while reasonably controlling the dimensions in the thickness direction of the electronic device. For example, the heat-conducting structure can be a graphite sheet.

[0012] In one embodiment, the heat sink can be a metal plate or a heat sink structure with heat dissipation fins. The heat sink can also be other types of heat dissipation structures such as a heat spreader, a combination of a metal plate and a heat pipe.

[0013] In one embodiment of the first aspect, the second circuit board and the second middle frame are connected by a thermally conductive medium. The screen of the electronic device is located on the side of the second middle frame facing away from the second circuit board. The thermally conductive structure is located between the heat sink and the back cover of the electronic device. That is, along the thickness direction of the electronic device, the screen, the second middle frame, the thermally conductive medium, the second circuit board, the second heat source, the heat sink, the thermally conductive structure, and the back cover can be stacked sequentially. This allows for the construction of a first heat transfer path consisting of the second heat source, the heat sink, the thermally conductive structure, and the hinge, as well as a second heat transfer path consisting of the second heat source, the second circuit board, the thermally conductive medium, the second middle frame, and the hinge. In this solution, the hinge can be considered as part of the second heat dissipation component. This solution is beneficial for improving the heat dissipation efficiency of the electronic device while reasonably controlling its dimensions in the thickness direction.

[0014] In one embodiment of the first aspect, the heat-conducting structure includes a first heat-conducting part and a second heat-conducting part, which are respectively located on opposite sides of the second heat source along the thickness direction of the electronic device. The first heat-conducting part is located between the heat sink and the back cover of the electronic device, and the second heat-conducting part is located between the second middle frame and the screen. The first heat-conducting part extends to overlap with the hinge along the thickness direction of the electronic device to form a first heat transfer path of the second heat source, the heat sink, the first heat-conducting part, and the hinge; or the first heat-conducting part extends to overlap with the battery along the thickness direction of the electronic device to form a second heat transfer path of the battery, the first heat-conducting part, and the back cover; or the second heat-conducting part extends to overlap with the battery along the thickness direction of the electronic device to form a third heat transfer path of the battery, the second middle frame, and the second heat-conducting part; or the second heat-conducting part extends to overlap with the hinge along the thickness direction of the electronic device to form a fourth heat transfer path of the second heat source, the heat sink, the second heat-conducting part, and the hinge. This solution can effectively utilize the inherent components of electronic devices, such as the hinge, back cover, and second mid-frame, to transfer the heat dissipated by the second device module and the battery. In other words, the hinge, back cover, and second mid-frame can participate in the heat dissipation of the second device module and also provide heat dissipation for the battery, thereby improving the heat dissipation efficiency of electronic devices.

[0015] In one embodiment of the first aspect, the second circuit board and the second mid-frame are connected by a thermally conductive medium, and the screen of the electronic device is disposed on the side of the heat sink away from the second circuit board. The second mid-frame is disposed on the side of the second device module away from the screen, and the screen, thermally conductive structure, heat sink, second heat source, second circuit board, thermally conductive medium, and second mid-frame can be stacked sequentially. This allows the first and second mid-frames to replace the position and function of the back cover; that is, the first and second mid-frames of the electronic device are located in the position of the back cover and act as the back cover, with the first and second mid-frames respectively spaced relative to a portion of the screen to form an accommodating space. This helps to ensure the heat dissipation efficiency of the electronic device while achieving a thinner and lighter design.

[0016] In one embodiment of the first aspect, a portion of the heat-conducting structure is located between the heat sink and the screen, and a portion of the heat-conducting structure is located between the hinge and the screen. This enables a first heat transfer path between the second heat source, the heat sink, the heat-conducting structure, and the hinge, and a second heat transfer path between the second heat source, the heat sink, the heat-conducting structure, and the screen. In this embodiment, the first and second mid-frames are positioned at the location of the electronic device's back cover, replacing the back cover and eliminating the space occupied by the back cover along the thickness direction of the electronic device. Simultaneously, it enables the transfer of heat dissipated by the second device module through the inherent components of the electronic device, ultimately achieving a thinner and lighter electronic device while ensuring the passive heat dissipation efficiency of the second device module.

[0017] In one embodiment of the first aspect, a portion of the heat-conducting structure is located between the second middle frame and the second circuit board, and a portion of the heat-conducting structure is located between the battery and the second middle frame. This forms a first heat transfer path for the second heat source, the second circuit board, the heat-conducting medium, the portion of the heat-conducting structure, and the second middle frame, as well as a second heat transfer path for the battery, another portion of the heat-conducting mechanism, and the second middle frame, thereby increasing the heat dissipation area of ​​the second device module and the battery and improving the heat dissipation efficiency of the electronic device.

[0018] In one embodiment of the first aspect, the heat-conducting structure includes a third heat-conducting part and a fourth heat-conducting part. The third heat-conducting part is located between the heat sink and the screen, and the fourth heat-conducting part is located between the second circuit board and the second mid-frame. The third heat-conducting part extends to overlap with the hinge along the thickness direction of the electronic device to form a first heat transfer path of the second heat source, the heat sink, the third heat-conducting part, and the hinge; or the fourth heat-conducting part extends to overlap with the battery along the thickness direction of the electronic device to form a second heat transfer path of the battery, the fourth heat-conducting part, and the second mid-frame. This embodiment provides two additional heat transfer paths by laying a fourth heat-conducting part between the battery and the second mid-frame. This embodiment improves the passive heat dissipation efficiency of the second heat source while ensuring the thinness and lightness of the electronic device. Furthermore, the two heat transfer paths allow the hinge and the second mid-frame to participate in the heat dissipation of the second device module and the battery, expanding the heat dissipation area of ​​the second device module and the battery, which is beneficial to improving the heat dissipation efficiency of the electronic device.

[0019] In one embodiment of the first aspect, the electronic device further includes a charging interface located on a second side of the second frame, with a second circuit board adjacent to the second side. The charging interface and the second circuit board are electrically connected. This solution integrates the charging interface onto the second circuit board, so that the second circuit board not only houses the second heat source but also the charging interface and the wiring connecting the charging interface. Alternatively, the second circuit board may also house electronic devices electrically connected to the charging interface. This integrated design helps improve the space utilization within the electronic device.

[0020] In one embodiment of the first aspect, the electronic device further includes a bracket and a bracket hinge. The bracket and bracket hinge are disposed in the second middle frame and located between the battery and the hinge. The bracket is connected to the bracket hinge and is capable of flipping relative to the second middle frame. The second device module and the bracket are distributed on both sides of the bracket hinge. Along the length direction of the electronic device, the bracket and the battery are offset and do not overlap. The bracket hinge and the battery are also offset and do not overlap. Along the thickness direction of the electronic device, the bracket and bracket hinge do not occupy the thickness direction space of the battery, which is beneficial to reducing the thickness of the electronic device. In one embodiment, the hinge and bracket hinge can form a "T-shaped" layout and surround the second heat source. The second heat dissipation component is used to conduct heat from the second heat source to the bracket hinge and hinge. The "T-shaped" layout and the architecture surrounding the second heat source are beneficial to improving the heat dissipation efficiency of the electronic device.

[0021] In one embodiment of the first aspect, the electronic device further includes a third device module. The maximum dimension of the third device module along the thickness direction of the electronic device is smaller than the maximum dimension of the first device module along the thickness direction of the electronic device. The third device module and the bracket are stacked along the thickness direction of the electronic device. Since the thickness of the third device module is smaller, its shared thickness space with the bracket helps to save internal space of the electronic device, achieving a thinner and lighter design. Furthermore, by stacking the third device module and the bracket, with the bracket connected to the bracket hinge and the bracket hinge connected to the second mid-frame, the heat generated by the functional devices within the third device module can be effectively dissipated through the bracket, the bracket hinge, and the hinge.

[0022] In one embodiment of the first aspect, the third device module includes a third circuit board and electronic devices disposed on the third circuit board. The third circuit board is connected to a second middle frame, and a support structure is provided between the electronic devices and the bracket. The support structure and the second middle frame together surround the third device module. This ensures that the third device module is not exposed during the bracket's flipping process. Simultaneously, it enhances the isolation of the third device module from the outside environment when the electronic device is in a folded state.

[0023] In one embodiment of the first aspect, a shielding structure is further provided between the electronic device and the bracket. The shielding structure is connected to the support structure, and the support structure, the shielding structure, and the bracket are stacked sequentially along the thickness direction of the electronic device. The shielding structure can be a metal sheet, used to shield the support structure and can also serve as a decorative element. Along the thickness direction of the electronic device, the screen, the second middle frame, the third circuit board, the electronic device, the support structure, and the bracket are stacked sequentially, i.e., a support structure is provided between the electronic device and the bracket. The support structure can be used to protect the third device module. Since the electronic device of the third device module is located between the support structure and the third circuit board, the support structure shields and protects the third device module and the electronic device, ensuring that the electronic device of the third device module is not exposed during the bracket's rotation.

[0024] In one embodiment of the first aspect, the electronic components on the third circuit board include at least one of capacitors, resistors, and inductors. This results in a lower load on the third component module, which helps to reduce the heat generated by the electronic device.

[0025] In one embodiment of the first aspect, the first heat source includes at least one of a CPU module and a power supply module; or the second heat source includes at least one of a charging management module, a battery management module, a DDR module, an RF chip, an audio PA, a speaker management module, a screen Tcon, and a screen management module. The CPU module or the power supply module can be used to ensure the normal functioning of the electronic device. For example, the charging management module can be used to connect to an external power source and provide sufficient current to the CPU module or the power supply module. The DDR module, the RF chip, the audio PA, or the screen Tcon all contribute to achieving high performance in the electronic device.

[0026] In one embodiment of the first aspect, the first heat dissipation component includes a vapor chamber and a fan. The vapor chamber is used to conduct heat from the first heat source to the fan. The first device module includes a first circuit board and a first heat source. Along the thickness direction of the electronic device, the first heat source is located between the first circuit board and the vapor chamber. A first gap space exists between the first circuit board and the first mid-frame, and a second gap space exists between the vapor chamber and the back cover of the electronic device. The screen of the electronic device is disposed on the side of the first mid-frame away from the first circuit board. When the first device module has a heat dissipation requirement, the fan can draw external cold air into the first mid-frame, i.e., the first receiving cavity, through an air inlet located on the side of the screen away from the pivot. The external cold air entering the first receiving cavity can carry away the heat emitted by the first heat source when it flows through it, and under the action of the flow field, it is discharged from the electronic device through multiple air outlets located on the second side and the first side of the first mid-frame, ultimately achieving active heat dissipation of the first heat source.

[0027] In one embodiment of the first aspect, the first heat dissipation component includes a heat sink and a thermal pad. Along the thickness direction of the electronic device, a first circuit board, a first heat source, a thermal pad, a heat sink, and a vapor chamber are sequentially stacked. The heat sink and thermal pad are used to improve heat dissipation efficiency along the active heat dissipation path. In one embodiment, the heat sink may be made of copper. The thermal pad may be thermally conductive gel or other types of thermally conductive media.

[0028] In one embodiment of the first aspect, the maximum dimension of the first heat source along the thickness direction of the electronic device is less than or equal to 2.5 mm; or, the maximum dimension of the second heat source along the thickness direction of the electronic device is greater than or equal to 2 mm. In this embodiment, the thinner first heat source occupies less internal space in the electronic device where the first middle frame is located, and by placing the thicker second heat source and the first heat source in two accommodating spaces on both sides of the pivot, it is beneficial to reduce the thickness difference of the main body of the electronic device on both sides of the pivot, while achieving a thinner and lighter electronic device.

[0029] In one embodiment of the first aspect, a first middle frame is stacked between the back cover and the screen of the electronic device. The first middle frame includes a fixedly connected bottom wall and a rib. The bottom wall has a through hole, and the rib is located outside the through hole. The rib protrudes from the bottom wall along the thickness direction of the electronic device and toward the back cover. The first heat dissipation component is mounted on the rib, and at least a portion of the heat dissipation component is located within the through hole. In this solution, the bottom wall of the middle frame has a through hole, and the bottom end of the heat dissipation component is built into the through hole, forming an embedded structure. Compared with the prior art structure where the bottom end of the heat dissipation component is directly attached to the bottom wall, the embedded structure can reduce the overall thickness of the electronic device. The rib protrudes along the thickness direction of the electronic device away from the bottom wall, which can enhance the local strength of the bottom wall and improve stability. Furthermore, the rib is located outside the through hole and can also be used to connect the heat dissipation component, playing a role in the installation and positioning of the heat dissipation component. This can prevent the heat dissipation component from shaking during the use of the electronic device and ensure the installation stability of the heat dissipation component.

[0030] In one embodiment of the first aspect, the electronic device further includes a reinforcing member fixed to the end of the bottom wall away from the rib, the reinforcing member covering the through hole. In this solution, the reinforcing member is fixedly connected to the bottom wall and can completely cover the through hole, playing a role in local reinforcement. This strengthens the structural strength of the bottom wall around the through hole, thereby improving the overall structural strength of the middle frame and ensuring the reliability of the screen.

[0031] In one embodiment of the first aspect, a mounting groove is recessed on the surface of the bottom wall opposite to the back cover, and the reinforcing member is fixed in the mounting groove. Using the mounting groove to install and fix the reinforcing member facilitates a thinner overall structure design and provides better support for the flatness of the screen.

[0032] In one embodiment of the first aspect, the heat dissipation assembly includes a fan housing and a fan rotation mechanism. The fan housing includes an upper cover, a lower cover, and a side panel. The upper cover, the lower cover, and the side panel together form an accommodating space. The fan rotation mechanism is installed within the accommodating space. The upper cover is provided with an air inlet, and the side panel is provided with an air outlet. The air inlet and the air outlet are respectively connected to the accommodating space. This solution constrains the specific design of the heat dissipation assembly housing and the fan shaft mechanism, and provides an arrangement scheme for the air inlet and air outlet. This solution is beneficial for achieving a thin design of electronic devices.

[0033] In one embodiment of the first aspect, an air intake channel is provided between the upper cover of the fan housing and the rear cover of the electronic device, and the air intake channel communicates with the air intake hole.

[0034] In one embodiment of the first aspect, at least a portion of the ribs are arranged around the through hole, and the sidewall of the fan housing is fixedly connected to the ribs.

[0035] In one embodiment of the first aspect, the upper cover includes an upper cover guide portion, and the lower cover includes a lower cover guide portion, wherein the upper cover guide portion and the lower cover guide portion are disposed opposite to each other along the thickness direction of the electronic device.

[0036] In one embodiment of the first aspect, the lower cover further includes a lower cover body, the lower cover guide portion being connected to the lower cover body and inclined relative to the lower cover body toward the direction of the upper cover.

[0037] In one embodiment of the first aspect, the upper cover further includes an upper cover body, the upper cover guide portion being connected to the upper cover body and inclined relative to the upper cover body in a direction away from the lower cover.

[0038] The lower cover guide portion and the lower cover body have an included angle α, which satisfies: 90°≤α≤170°.

[0039] In one embodiment of the first aspect, the top cover further includes a top cover reinforcement, at least a portion of the top cover body is connected to the top cover reinforcement, and the top cover reinforcement protrudes relative to the top cover body in a direction toward the rear cover of the electronic device.

[0040] In one embodiment of the first aspect, the upper cover body is provided with a connecting portion, the connecting portion is connected to the upper cover reinforcement portion, and the connecting portion is provided at both ends of the upper cover body along the width direction of the heat dissipation assembly, and the two connecting portions are respectively fixedly connected to the protruding rib.

[0041] In one embodiment of the first aspect, the edge of the lower cover includes a flat plate structure near the air outlet, and the edge region of the bottom wall of the first middle frame is adjacent to the air outlet and the edge of the lower cover. The edge region includes a guide slope that extends obliquely relative to the flat plate structure and is used to guide air from the air outlet into the outside of the fan housing through the receiving space of the fan housing.

[0042] In one embodiment of the first aspect, the upper cover of the fan housing has an air guiding structure near the edge of the air outlet. The air guiding structure includes a first part, a second part, and a third part connected in sequence. The second part extends at an angle relative to the first part. The diameter of the light outlet corresponding to the third part is larger than the diameter of the air outlet corresponding to the second part. The diameter of the air outlet corresponding to the second part is gradually expanding.

[0043] In one embodiment of the first aspect, the first portion is parallel to the surface of the flat plate structure of the lower cover, and the second portion is inclined at the same angle relative to the first portion as the air guide slope is inclined at the same angle relative to the flat plate structure.

[0044] In one embodiment of the first aspect, the electronic device further includes a flexible circuit board, and a groove is provided at the end of the lower cover away from the fan rotation mechanism, wherein at least a portion of the flexible circuit board is mounted in the groove.

[0045] In one embodiment of the first aspect, the heat sink is at least one of a metal plate, a heat sink structure with heat dissipation fins, a vapor chamber, or a combination of a metal plate and a heat pipe; or, the thermally conductive structure is a graphite sheet. This is beneficial for improving the active heat dissipation efficiency of the first device module through the heat sink and the passive heat dissipation efficiency of the second device module through the thermally conductive structure, ultimately achieving efficient heat dissipation of the electronic device.

[0046] In one embodiment of the first aspect, the electronic device further includes an electrical connection structure that passes through or across the pivot and is electrically connected between the first device module and the second device module. In one embodiment, the electrical connection structure is a flexible circuit board.

[0047] In one embodiment of the first aspect, the electrical connection structure includes at least one flexible circuit board, with both ends of the flexible circuit board connected to the first middle frame and the second middle frame, respectively. At least a portion of the flexible circuit board located between the first middle frame and the second middle frame is connected to the rotating shaft. The flexible circuit board is provided with at least one strip-shaped hole, the strip-shaped hole extending along a second direction, and at least a portion of the strip-shaped hole located between the first middle frame and the second middle frame, the second direction being perpendicular to the axial direction of the rotating shaft. By providing a strip-shaped hole on the flexible circuit board, this application can divide the portion of the flexible circuit board located between the first fixing part and the second fixing part into multiple transmission segments with smaller widths, thereby avoiding large twisting of the flexible circuit board during bending and thus improving the service life of the flexible circuit board.

[0048] In one embodiment of the first aspect, the flexible circuit board is divided into a plurality of transmission segments by the strip-shaped holes. These transmission segments are portions of the flexible circuit board located between the first and second middle frames. At least a portion of the transmission segments has a different width along the axial direction of the rotation axis. The edges of each transmission segment that connect with the first and second fixing portions have a small width in the second direction Y, which can be less than 15 mm, thereby reducing the amount of torsional deformation or even preventing torsional deformation altogether.

[0049] In one embodiment of the first aspect, the pivot includes a first door panel, a second door panel, a third door panel, and a hinge structure. The first door panel and the third door panel are located on opposite sides of the second door panel. The hinge structure faces the second door panel, and both the first door panel and the third door panel are rotatably connected to the hinge structure. The electrical connection structure includes a flexible circuit board, with both ends of the flexible circuit board fixed to the first middle frame and the second middle frame, respectively. The electronic device further includes a limiting structure located on the side of the flexible circuit board facing the second door panel, and the limiting structure covers at least a portion of the bendable portion. This solution enables the limiting structure to improve the mechanical properties of the flexible circuit board during the opening and closing of the foldable display device, and also to limit the abrupt changes in the shape of the flexible circuit board, effectively suppressing the problem of abrupt changes in shape during the opening and closing of the foldable display device, and further reducing the problem of abnormal noise generated during the opening and closing of the foldable display device.

[0050] In one embodiment of the first aspect, the electronic device includes a first fixing part and a second fixing part, the first fixing part fixing one end of the flexible circuit board to the first middle frame, the second fixing part fixing the other end of the flexible circuit board to the second middle frame, the portion of the flexible circuit board located between the first fixing part and the second fixing part having a segmented groove, the bendable portion located on opposite sides of the segmented groove including a first bendable portion and a second bendable portion; the limiting structure covers at least a portion of the first bendable portion and at least a portion of the second bendable portion.

[0051] A flexible circuit board containing segmented slots is also known as a segmented flexible circuit board. For segmented flexible circuit boards, the bendable portion of each segment may experience abrupt changes in shape. A limiting structure covering at least a portion of the first bendable portion and at least a portion of the second bendable portion can specifically limit these abrupt changes in shape within each segment of the flexible circuit board.

[0052] In one embodiment of the first aspect, the limiting structure includes a first limiting structure and a second limiting structure; the first limiting structure covers at least a portion of the first bendable portion, and the second limiting structure covers at least a portion of the second bendable portion; the first limiting structure and the second limiting structure are connected as a single unit. For segmented flexible circuit boards, the widths of the two flexible circuit boards on both sides of the segmented groove may be different, and the shape changes of different segments will also differ during the opening and closing of the foldable display device. In this way, the first limiting structure and the second limiting structure can respectively limit the shape changes of the first bendable portion and the second bendable portion. The integral design of the first limiting structure and the second limiting structure is more convenient for the processing and installation of the limiting structure.

[0053] In one embodiment of the first aspect, the flexible circuit board includes a first flexible substrate and a second flexible substrate stacked together, wherein the first flexible substrate is closer to the second door panel than the second flexible substrate; the elastic modulus of the first flexible substrate in the bendable portion is less than the elastic modulus of the second flexible substrate. The stiffness of the inner layer is less than that of the outer layer, which better adapts to the different bending radii of each layer and better cooperates with the limiting structure to restrict abrupt changes in the shape of the flexible circuit board.

[0054] In one embodiment of the first aspect, the flexible circuit board further includes a third flexible substrate, with the second flexible substrate located between the first and third flexible substrates; the elastic modulus of the second flexible substrate in the bendable portion is less than or equal to the elastic modulus of the third flexible substrate. This design facilitates the constraint of abrupt changes in the shape of the flexible circuit board. The stiffness of the inner layer is less than that of the middle and outer layers, and the stiffness of the middle layer is less than that of the outer layer. The different layers of the flexible circuit board have a gradient stiffness distribution, which can better cooperate with the limiting structure to restrict abrupt changes in the shape of the flexible circuit board.

[0055] In one embodiment of the first aspect, the electronic device further includes a support member, a first antenna sub-part, and a second antenna sub-part, all three of which are disposed within the internal space of the electronic device where the first mid-frame is located. An inner cavity and an air duct are formed between the rear cover of the electronic device and the first mid-frame. The support member and the first circuit board are both mounted in the inner cavity. The first antenna sub-part is fixed to the side of the support member facing the rear cover and electrically connected to the first circuit board to power the first antenna sub-part. The second antenna sub-part is fixed to the surface of the rear cover facing the mid-frame. The area of ​​the rear cover directly opposite the second antenna sub-part is a non-signal shielding area. The first antenna sub-part and the second antenna sub-part transmit antenna signals through coupling.

[0056] Secondly, embodiments of this application provide an electronic device, including a mid-frame, a back cover, a support member, a circuit board, a first antenna sub-part, and a second antenna sub-part. The back cover is fixed to one side of the mid-frame, and an inner cavity and air duct are formed between the back cover and the mid-frame. The support member and the circuit board are both installed in the inner cavity. The first antenna sub-part is fixed to the side of the support member facing the back cover and electrically connected to the circuit board to power the first antenna sub-part. The second antenna sub-part is fixed to the surface of the back cover facing the mid-frame. The area of ​​the back cover directly opposite the second antenna sub-part is a non-signal shielding area. The first antenna sub-part and the second antenna sub-part transmit antenna signals through coupling.

[0057] In this embodiment, the second sub-unit of the antenna is at least partially located on the inner surface of the rear cover and can transmit signals through the rear cover. The antenna radiator is housed within the rear cover, thus the second sub-unit does not occupy space in the air duct, ensuring sufficient airflow area for the fan exhaust channel. Therefore, this solution not only ensures the antenna's heat dissipation performance, but also provides a clear environment for the antenna within the electronic device's air duct, contributing to its performance. Consequently, this solution also guarantees the antenna's radiation performance, resulting in a superior bandwidth and radiation efficiency.

[0058] The circuit board is equipped with a power supply circuit, which can power the first sub-section of the antenna.

[0059] The non-signal shielding area can be made of non-conductive materials. These non-conductive materials can be glass fiber, ceramics, plastics, etc.

[0060] In some possible implementations, the second sub-section of the antenna is a flexible printed circuit board or a metal component. In this case, the structure of the second sub-section of the antenna is simple and easy to implement.

[0061] In some possible implementations, the second sub-section of the antenna is a conductive heat sink. In this embodiment, the electronic device reuses the heat sink as the second sub-section of the antenna. This not only retains the heat dissipation function of the heat sink, but also allows the air duct to remove heat from the heat sink, thereby removing heat from other components in the electronic device that are thermally connected to the heat sink, ensuring the heat dissipation performance of the electronic device. Furthermore, the antenna performance of the electronic device can be improved without adding additional structural components, making it easy to implement and cost-effective.

[0062] For example, the second sub-section of the antenna can be a graphite sheet. Graphite sheets are easy to cut, better meet heat dissipation and antenna design requirements, and are low in cost. The graphite sheet can be assembled and fixed to the back cover by means of adhesive bonding or other methods. Attached Figure Description

[0063] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiment of this application when it is in the unfolded state;

[0064] Figure 2 This is a schematic diagram of the structure of the electronic device provided in this application embodiment when it is in a folded state;

[0065] Figure 3 This is a top view of the electronic device provided in this application embodiment when it is in an unfolded state and without a back cover.

[0066] Figure 4 yes Figure 2 A schematic cross-sectional view of the electronic device shown.

[0067] Figure 5 This is a cross-sectional structural schematic diagram of an electronic device according to an embodiment of this application;

[0068] Figure 6 This is another cross-sectional view of the electronic device proposed in the embodiments of this application;

[0069] Figure 7 This is another cross-sectional view of the electronic device proposed in the embodiments of this application;

[0070] Figure 8This is another cross-sectional view of the electronic device proposed in the embodiments of this application;

[0071] Figure 9 This is a cross-sectional view of the electronic device in the unfolded state according to an embodiment of this application;

[0072] Figure 10 This is another cross-sectional view of the electronic device in the unfolded state according to an embodiment of this application;

[0073] Figure 11 This is another top view of the electronic device provided in this application embodiment when it is in a flattened state and without a back cover;

[0074] Figure 12 yes Figure 11 The diagram shows a cross-sectional view of the electronic device in a folded state.

[0075] Figure 13 A cross-sectional view of the electronic device provided in the embodiments of this application;

[0076] Figure 14 for Figure 13 A cross-sectional view of the electronic equipment in the picture from another perspective;

[0077] Figure 15 for Figure 13 A top view of the internal structure of electronic devices in the device;

[0078] Figure 16 This is a perspective view of the portion where the first middle frame and the fan are combined in an electronic device according to an embodiment of this application.

[0079] Figure 17 This is a perspective view of the portion where the first middle frame and the fan are combined in an electronic device according to an embodiment of this application;

[0080] Figure 18 This is an exploded perspective view of one direction of the portion where the first middle frame and the fan are combined in an electronic device according to an embodiment of this application;

[0081] Figure 19 This is an exploded perspective view of the portion where the first middle frame and the fan are combined in an electronic device according to an embodiment of this application;

[0082] Figure 20 This is a cross-sectional view of an assembly structure combining a first middle frame and a fan, according to one embodiment of this application.

[0083] Figure 21 yes Figure 20 An enlarged view of part I;

[0084] Figure 22 This is a partial schematic diagram of an electronic device provided in an embodiment of this application in a flattened state;

[0085] Figure 23 This is a schematic diagram of the structure of the flexible circuit board provided in the embodiments of this application;

[0086] Figure 24A This is a state diagram of the flexible circuit board provided in this application embodiment in use;

[0087] Figure 24B This is another state diagram of the flexible circuit board provided in the embodiments of this application in application;

[0088] Figure 25 This is a simulation diagram of the bending life of the flexible circuit board provided in this application;

[0089] Figure 26 This is a schematic diagram of an electronic device provided in one embodiment of this application;

[0090] Figure 27 This is a two-dimensional structural diagram of a foldable display device with an added limiting structure in the unfolded state, provided in an embodiment of this application. The flexible circuit board of the foldable display device includes segmented slots.

[0091] Figure 28A This is a two-dimensional structural diagram of a folding display device provided in one embodiment of this application from another angle. The sizes of the three limiting structures can be different.

[0092] Figure 28B yes Figure 28A A schematic diagram of another implementation of the middle limiting structure;

[0093] Figure 29 This is a schematic diagram of a partial structure of an electronic device provided in one embodiment of this application. Detailed Implementation

[0094] Explanation of some terms:

[0095] CPU: Central Processing Unit.

[0096] PA: Power Amplifier.

[0097] Tcon: Timing controller.

[0098] DDR: Double Data Rate Synchronous Dynamic Random Access Memory.

[0099] VC: Vapor Chamber, a heat exchange plate for a vacuum chamber.

[0100] Active cooling: Directly forces convection through fans or other devices (such as pumps) to accelerate the transfer of heat from heat sources (such as chips) to the external environment.

[0101] Passive heat dissipation: relies on the thermal conductivity of materials to allow heat to dissipate from the surface of the device into the environment through natural convection or radiation.

[0102] The following explains some of the terms used in the embodiments of this application.

[0103] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, such as a process, method, system, product, or apparatus comprising a series of steps or units, are not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0104] This application provides an electronic device, which can be any foldable terminal device such as a foldable screen mobile phone or a foldable PC. The electronic device has two main bodies that can be folded and unfolded relative to each other, enabling it to be used in both folded and unfolded states. The electronic device features a foldable screen, meaning the screen is flexible and foldable. In the folded state, the screen is folded relative to each other, resulting in a smaller size and easier portability. In the unfolded state, the screen is a large, flat display with a better viewing experience. In the unfolded state, the thickness difference between the two main bodies is small, contributing to a slim, aesthetically pleasing design and ease of use. If the thickness difference between the two main bodies is large, in the unfolded state, one side of the screen will be heavier than the other, affecting comfort and resulting in a poor user experience.

[0105] In one embodiment, the hinge mechanism of the electronic device connects the first housing and the second housing, and enables the first housing to be unfolded or folded relative to the second housing. The first housing, the second housing, and the hinge mechanism together support the flexible display screen (i.e., foldable screen) of the electronic device.

[0106] The layout of components within an electronic device affects its thickness. To minimize the thickness difference between the two folded main bodies of the electronic device, this embodiment arranges components of different load levels and heights according to their respective heat dissipation requirements (or space requirements) within the internal space of the two main bodies on opposite sides of the hinge, thus making full use of the overall space. This achieves a suitable thickness difference between the two main bodies, resulting in an aesthetically pleasing and slim electronic device that enhances user comfort and experience.

[0107] In one embodiment, the motherboard and its components are placed in one of the middle frames, while the taller components with lower load levels (these components are tall but have low power and do not require active cooling; passive cooling is sufficient for their operation) are placed in the other middle frame. This reduces the overall thickness of the electronic device containing the motherboard and decreases the thickness difference between the two components. This allows for reasonable control of the overall thickness of the electronic device while meeting heat dissipation requirements, thereby improving the user experience.

[0108] Specifically, in one embodiment, the functional components within the electronic device include a first type of component (a component with high load and medium height), a second type of component (a component with medium load and high height), and a third type of component (a component with low load and low height). Here, high load, medium load, and low load refer to a relative comparison of the power and heat generation parameters of the component in its operating state. Medium height, high height, and low height refer to the spatial dimensions occupied by the component in the thickness direction of the electronic device. In one embodiment, the first type of component is disposed within the space of the main body containing the first mid-frame and uses active heat dissipation. The second type of component is disposed within the space of the main body containing the second mid-frame and uses passive heat dissipation. The third type of component is disposed within the space of the main body containing the second mid-frame and positioned below the built-in support, which does not overlap with the battery, and also uses passive heat dissipation. Exemplarily, the first type of component includes, but is not limited to, a CPU module and a power supply module. The second type of component includes at least one of a charging management module, a DDR module, an RF chip, an audio PA, and a screen Tcon. The third type of component can be at least one of a resistor, a capacitor, and an inductor.

[0109] This application distributes the second type of device (tall device) and the first type of device (medium-height device) within the spaces of different mid-frames on both sides of the hinge. The first type of device is actively cooled, while the second type is passively cooled. Active cooling requires a larger space, while passive cooling does not. Therefore, by placing the medium-height first type of device requiring active cooling within one mid-frame space, and passively cooling the tall second type of device within the other mid-frame space, this application achieves a suitable, relatively small difference in thickness between the main body of the electronic device corresponding to the two mid-frames. Conversely, if both the first and second type of devices were arranged within the same mid-frame space, the thickness of the main body corresponding to that mid-frame would inevitably be larger, while the thickness of the other mid-frame would be smaller, resulting in a greater difference in thickness between the two mid-frames.

[0110] The electronic devices in this application embodiment can also be tablet computers, laptop computers, handheld devices with wireless communication capabilities, computing devices or other processing devices connected to a wireless modem, vehicle-mounted devices, electronic devices in 5G networks, or electronic devices in future evolved public land mobile networks (PLMNs), etc.

[0111] Figure 1 This is a schematic diagram of the electronic device 100 provided in the embodiments of this application when it is in the unfolded state. Figure 2 This is a schematic diagram of the electronic device 100 provided in this application embodiment when it is in a folded state. See also... Figure 1 and Figure 2 The electronic device 100 includes a first middle frame 1, a second middle frame 2, a hinge 3, and a rear cover 10. Both the first middle frame 1 and the second middle frame 2 can be used to house functional components of the electronic device 100, such as a central processing unit, circuit board, charging module, and battery. The first middle frame 1 and the second middle frame 2 are located on opposite sides of the hinge 3 and connected to it, allowing the first middle frame 1 and the second middle frame 2 to open and close via the hinge 3. A portion of the rear cover 10 is disposed on the first middle frame 1 and forms a first receiving cavity with the first middle frame 1, while another portion of the rear cover 10 is disposed on the second middle frame 2 and forms a second receiving cavity with the second middle frame 2. Both the first receiving cavity and the second receiving cavity can be used to house the functional components of the electronic device 100.

[0112] Combination Figure 1 and Figure 2As shown, in this embodiment, the direction of the axis of the rotating shaft 3 of the electronic device 100 is taken as the first direction X, and the length direction of the electronic device 100 is taken as the second direction Y, or the length direction of the first middle frame 1 and the second middle frame 2 is taken as the second direction Y, where the second direction Y is perpendicular to the first direction X. The thickness direction of the electronic device 100, the thickness direction of the first middle frame 1, and the thickness direction of the second middle frame 2 are all third directions Z, which are perpendicular to the plane formed by the first direction X and the second direction Y. The length, width, and thickness in this embodiment are for descriptive convenience only and do not imply any limitation on the dimensions. For example, the length can be greater than, equal to, or less than the width.

[0113] See Figure 1 The first middle frame 1 and the second middle frame 2 can be unfolded to a flattened state. When the electronic device 100 is in the flattened state, the screen 101 of the electronic device 100 is also flattened, which can maximize the display interface. In the flattened state, the electronic device 100 can be held in hand for operation, or it can be supported by a stand on any place where it can be placed, such as a desktop, without needing to be held by hand, which makes it convenient for users to operate the electronic device 100.

[0114] See Figure 2 The first middle frame 1 and the second middle frame 2 can be closed relative to each other to a folded state. When the electronic device 100 is in a folded state, the electronic device 100 has portability and is easy to carry.

[0115] like Figure 1 and Figure 2 As shown, in one possible implementation, the electronic device 100 is a folding device, comprising two main bodies capable of being folded and unfolded relative to each other. That is, the number of the first middle frame 1, the pivot 3, and the second middle frame 2 can all be one. The pivot 3 can be located between the first middle frame 1 and the second middle frame 2. When the electronic device 100 is in the folded state, the first middle frame 1 and the second middle frame 2 are folded relative to each other in a two-layer state (see reference). Figure 2 (As shown). Figure 2 In the illustrated embodiment, the electronic device 100 is an inward-folding device, and in the folded state, the screen 101 is located between the first middle frame 1 and the second middle frame 2. In other embodiments, the electronic device 100 can also be a tri-fold device, comprising three middle frames, any adjacent middle frames being connected by a hinge. Specifically, in the folded state, the tri-fold electronic device can be folded into an S-shape or a G-shape.

[0116] like Figure 1 and Figure 2As shown, in one possible implementation, the frame of the electronic device corresponding to the first middle frame 1 includes a first side 11A and a second side 11B. The first side 11A is parallel to the pivot 3. There are two second sides 11B, which are arranged opposite each other and connected between the pivot 3 and the first side 11A. In one implementation, the frame of the electronic device 100 is provided with an air inlet 12 and an air outlet 13. The air inlet 12 is located on the second side 11B, and the air inlet 12 is located on the second side 11B at a position closer to the first side 11A. In one implementation, the electronic device 100 has two air inlets 12, with one air inlet 12 provided on each second side 11B. The air outlet 13 is located on the first side 11A. In one implementation, there are two air outlets 13, which are arranged opposite each other and spaced apart on the first side 11A. The air inlet 12 and air outlet 13 have different opening directions, but they are located close to each other. Both can be positioned near the fan inside the electronic device 100, which helps ensure airflow exchange between the inside and outside of the electronic device 100, achieving efficient heat dissipation for various heat-generating components and ensuring the sustained and efficient operation of the electronic device 100. In one embodiment, the two air outlets 13 of the electronic device 100 have the same orientation; for example, both air outlets 13 are oriented in the second direction Y.

[0117] Combination Figure 1 and Figure 2As shown, in one possible implementation, the electronic device 100 is provided with a first charging interface 14 and a second charging interface 21. Optionally, the first charging interface 14 is located on the first side 11A, and the second charging interface 21 is located on the frame of the electronic device corresponding to the second middle frame 2. Specifically, the frame of the electronic device corresponding to the second middle frame 2 includes a third side 22A and a fourth side 22B. The third side 22A is parallel to the pivot 3, and there are two fourth sides 22B, which are arranged opposite to each other and connected between the pivot 3 and the third side 22A. The fourth side 22B extends along the second direction Y (i.e., the length direction of the electronic device 100), and the second charging interface 21 is located on the fourth side 22B near the pivot 3, that is, the distance between the second charging interface 21 and the pivot 3 is less than the distance between the second charging interface 21 and the third side 22A. The first charging interface 14 and the second charging interface 21 can be used to receive external power to charge the functional devices inside the electronic device. In one embodiment, the first charging interface 14 and the second charging interface 21 can be used interchangeably, and both have the same function. The first charging interface 14 or the second charging interface 21 can be selected for convenient plugging in of the charger depending on the different usage states of the electronic device. In another embodiment, the positions of the first charging interface 14 and the second charging interface 21 can be determined by the distribution of electronic components inside the first middle frame 1 and the second middle frame 2. By rationally setting the positions of the first charging interface 14 and the second charging interface 21, it is beneficial to improve the device integration of the electronic device 100, thereby saving internal space. In other embodiments, the electronic device 100 may also have only one charging interface.

[0118] Figure 3 This is a top view of the electronic device 100 provided in this application embodiment when it is in an unfolded state and without a back cover 10. Figure 4 yes Figure 2 The schematic diagram of the cross-sectional structure of the electronic device 100 shown is combined with... Figure 3 and Figure 4As shown, the electronic device 100 provided in this application embodiment includes a first device module 4, a first heat dissipation assembly 5, a second device module 6, a second heat dissipation assembly 7, an electrical connection structure 8, and a battery 9. Both the first device module 4 and the second device module 6 include a circuit board and functional devices, packaging structures, shielding structures, etc., disposed on the circuit board. In one embodiment, the first device module 4 is a first-type device (a device with high load and medium height), and the second device module 6 is a second-type device (a device with medium load and high height). The first device module 4 and the second device module 6 are distributed within two main bodies on either side of the hinge of the electronic device. The first heat dissipation assembly 5 provides active heat dissipation for the first device module 4, and the second heat dissipation assembly 7 provides passive heat dissipation for the second device module 6. Both the first heat dissipation assembly 5 and the second heat dissipation assembly 7 can include specific structural components within the electronic device, such as a hinge, a mid-frame, a back cover, or a device shielding cover. These structures are made of materials with high thermal conductivity and can all serve as part of the heat dissipation assembly. The electrical connection structure 8 is used to electrically connect the first device module 4 and the second device module 6. Specifically, Figure 3 The electrical connection structure is represented by a rectangular frame (8). Figure 4 The electrical connection structure 8 is represented by thicker lines. The electrical connection structure 8 passes through or across the pivot 3 and electrically connects the first device module 4 and the second device module 6. In one embodiment, the electrical connection structure 8 is an FPC (flexible printed circuit board).

[0119] In one embodiment, the electronic device includes a first circuit board, a second circuit board, and a flexible circuit board. The first circuit board is located in a first housing (the housing of the electronic device corresponding to the first middle frame 1). A first heating element is electrically connected to the first circuit board. The first heating element can be a first heat source. The first heating element and the first circuit board together constitute a first device module 4. The second circuit board is located in a second housing (the housing of the electronic device corresponding to the second middle frame 2). The second circuit board and the second heating element (which can be a second heat source) together constitute a second device module 6. The flexible circuit board (i.e., the electrical connection structure 8) is electrically connected to the first circuit board and the second circuit board.

[0120] See Figure 3 and Figure 4The first device module 4 and the first heat dissipation component 5 are both located in the first middle frame 1. Specifically, the first device module 4 and the first heat dissipation component 5 are both located in the first receiving cavity 15 formed by the rear cover 10 and the first middle frame 1. The first device module 4 includes a first heat source 41. Schematic, the first heat source 41 may include, but is not limited to, a CPU module or a power supply module. Optionally, the maximum dimension of the first heat source 41 along the thickness direction of the electronic device 100 is less than or equal to 2.5 mm. The dimension of the first heat source 41 along the thickness direction of the electronic device 100 includes the functional components (e.g., parts of chips or circuits), packaging structure, screen cover, etc., of the first heat source 41. The first heat dissipation component 5 may include, but is not limited to, a fan or a liquid cooling component. The first heat dissipation component 5 can be used to actively dissipate heat from the first device module 4. In one embodiment, the first heat dissipation component 5 includes a heat spreader 51 and a fan 52. A portion of the heat spreader 51 along the thickness direction of the electronic device 100 is stacked with the first heat source 41. The fan 52 may be located near the air outlet 13. In one possible implementation, the electronic device 100 contains two fans 52, meaning that each fan 52 is accompanied by an air inlet 12 and an air outlet 13. In another implementation, the heat spreader 51 includes a first portion 511 and a second portion 512 connected together. The first portion 511 is connected to the first heat source 41, and the second portion 512 is connected to the fans 52. The number of second portions 512 corresponds one-to-one with the number of fans 52. For example, in one implementation, there are two fans 52 and two second portions 512, distributed along a first direction X (i.e., the width direction of the electronic device 100) on opposite sides of the first portion 511. Figure 3 As shown, the heat spreader 51 is roughly T-shaped.

[0121] See Figure 3 In one embodiment, an active cooling solution is formed by combining a heat spreader 51 and a fan 52. The heat spreader 51 includes a hot end and a cold end. For example, the part of the first portion 511 that contacts the first heat source 41 is the hot end, and the part of the second portion 512 that is adjacent to the fan 52 is the cold end. When the first heat source 41 is working, since the first heat source 41 has high power, it generates a large amount of heat. For example, the temperature of the first heat source 41 in its working state can exceed 50 degrees Celsius. The heat energy of the first heat source 41 is transferred to the hot end of the heat spreader 51, causing the medium inside the heat spreader 51 to be heated and vaporized. The vaporized medium diffuses within the heat spreader 51 to the cold end, where it is cooled and becomes liquid (for example, at the location of the fan 52). The liquid medium is driven to the hot end through the structure (e.g., capillary structure) inside the heat spreader 51, forming a circulating cooling system.

[0122] See Figure 3 and Figure 4The second device module 6, the second heat dissipation component 7, and the battery 9 are all disposed in the second receiving cavity 23 formed by the rear cover 10 and the second middle frame 2. Optionally, the second device module 6 and the second heat dissipation component 7 are stacked along the third direction Z (thickness direction of the electronic device 100). The second device module 6 is arranged side by side with the battery 9 along the second direction Y (length direction of the electronic device 100), and the second device module 6 and the battery 9 do not overlap. In the thickness direction of the electronic device, there is no overlap between the two. In one embodiment, the second device module 6 and the battery 9 can be in contact. In another embodiment, a gap can also be maintained between the second device module 6 and the battery 9. The gap between the second device module 6 and the battery 9 can be filled with an elastic structure, such as foam, which can absorb the dimensional changes caused by the thermal expansion of the second device module 6 and the battery 9. The second heat dissipation component 7 can be fixed to the circuit board or fixed to the second middle frame 2 by fasteners (e.g., screws). For example, the position of the second device module 6 can also be fixed by fixing the second heat dissipation component 7 and the second middle frame 2 (by being clamped and fixed between the second heat dissipation component and the second middle frame in a stacking manner).

[0123] In one embodiment, the second device module 6 is located within the second middle frame 2 near the pivot 3, and the second device module 6 is situated between the battery 9 and the pivot 3 along the second direction Y (the length direction of the electronic device 100). The second device module 6 includes a second heat source 61, which may also be a second heat-generating component located within the second housing (the housing of the electronic device corresponding to the second middle frame 2). Indicatively, the second heat source 61 includes at least one of a charging management module, a battery management module, a DDR module, an RF chip, an audio PA, a speaker management module, a screen Tcon, and a screen management module. In one embodiment, the second heat source 61 is a charging management module, etc. Optionally, the maximum dimension of the second heat source 61 along the thickness direction of the electronic device 100 is greater than or equal to 2 mm, and the dimension of the second heat source 61 along the thickness direction of the electronic device 100 includes the functional components (chips), packaging structure, screen cover, etc., of the second heat source 61. The second heat dissipation component 7 can be used to passively dissipate heat from the second heat source 61 of the second device module 6. Indicatively, the second heat dissipation component 7 is made of a material with high thermal conductivity, such as metal or graphite sheet. The second heat dissipation component 7 can be used to conduct the heat from the second heat source 61 to components such as the circuit board, mid-frame, heat-conducting structure, heat sink, or pivot 3 of the electronic device 100. The heat is transferred to areas with lower heat on these components, thereby achieving passive heat dissipation of the second heat source 61.

[0124] This application utilizes the system space isolation characteristic of the upper and lower screens (i.e., the screen portions corresponding to the two mid-frames) of an electronic device with folding function to arrange some heat-generating devices, i.e., the second heat source 61, on the circuit board in the system space corresponding to the lower screen, thereby reducing the power consumption of the system space corresponding to the upper screen.

[0125] Specifically, this application adopts a distributed heat source architecture, placing the first heat source 41 (e.g., CPU and its power supply circuit, DDR and its power supply circuit), fans, etc., within the system space corresponding to the first middle frame (i.e., the system space on the main screen side). The second heat source (e.g., charging board, charging management module, battery management module, screen Tcon driver board, etc.) is placed within the system space corresponding to the second middle frame. This application can employ a cooling solution primarily based on air cooling and supplemented by natural cooling for the system space on the main screen side. Air cooling can also be understood as active cooling. For example, air cooling can employ a fan combined with a VC cooling solution, or a pump and amplifier combined with a VC cooling solution. The VC's heat dissipation effect carries the heat from the motherboard to the exhaust area, where the fan (or pump + amplifier) ​​blows the heat away.

[0126] This application embodiment achieves the distribution of heat-generating components (first heat source 41 and second heat source 61) in the first and second housings by setting at least one of the battery management module, speaker management module or screen management module in the second housing (the housing of the electronic device corresponding to the second middle frame 2). For example, the first heat-generating component (i.e., the first heat source 41) is located in the first housing and the second heat-generating component (i.e., the second heat source 61) is located in the second housing. This avoids the problem that when the first heat-generating component and the second heat-generating component are concentrated in the first housing, the first housing will overheat and the heat dissipation capacity of the second housing will not be fully utilized, thus affecting the overall heat dissipation effect of the electronic device.

[0127] See Figure 4 In one embodiment, the maximum dimension of the first device module 4 along the third direction Z is smaller than the maximum dimension of the second device module 6 along the third direction. The first device module 4 includes a first circuit board 42 and a first heat source 41 disposed on the first circuit board 42. The sum of the thickness of the first circuit board 42 and the maximum dimension H1 of the first heat source 41 along the third direction Z (i.e., the thickness direction of the electronic device 100) is equal to the maximum dimension of the first device module 4 along the third direction Z. The second device module 6 includes a second circuit board 62 and a second heat source 61 disposed on the second circuit board 62. The sum of the thickness of the second circuit board 62 and the maximum dimension H2 of the second heat source 61 along the third direction Z (i.e., the thickness direction of the electronic device 100) is equal to the maximum dimension of the second device module 6 along the third direction Z.

[0128] See Figure 4In one embodiment, the maximum dimension H1 of the first heat source 41 along the third direction Z (i.e., the thickness direction of the electronic device 100) is smaller than the maximum dimension H2 of the second heat source 61 along the third direction Z (i.e., the thickness direction of the electronic device 100). For example, the first heat source 41 may include multiple functional devices, and the second heat source 61 may also include multiple functional devices. The thickness of the functional device with the largest dimension along the third direction Z in the first heat source 41 is smaller than the thickness of the functional device with the largest dimension along the third direction Z in the second heat source 61. This embodiment only needs to constrain the functional device with the largest dimension in the first direction Z. It is understood that the second heat source 61 may also contain functional devices with smaller dimensions, and the dimensions of some functional devices in the first heat source 41 in the third direction Z may be larger than the dimensions of some functional devices in the second heat source 61 in the third direction Z.

[0129] See Figure 4 The power of the first heat source 41 is greater than that of the second heat source 61, meaning that the heat generated by the first heat source 41 per unit time during operation is greater than that generated by the second heat source 61 per unit time during operation. The first heat source 41 needs to be actively cooled by the first heat dissipation component 5. Since the heat generated by the first heat source 41 during operation is relatively large, if the heat from the first heat source 41 is directly conducted to the screen or back cover of the electronic device, it will cause localized overheating of the electronic device, affecting the user experience (e.g., it will become too hot to touch) and also affecting the normal operation of the screen. Therefore, the first heat source 41 needs to be actively cooled. In a specific embodiment, along the thickness direction of the electronic device 100, the end of the first device module 4 furthest from the back cover 10 has a first gap G1 with the first middle frame 1. The first gap G1 forms thermal isolation between the first heat source 41 and the first middle frame 1, preventing heat from being conducted to the first middle frame 1, causing the position of the first middle frame 1 corresponding to the first heat source 41 to overheat, thereby affecting the lifespan and display of the screen 101. Along the thickness direction of the electronic device 100, the end of the first device module 4 furthest from the first middle frame 1 has a second distance G2 with the back cover 10. The second distance G2 forms a thermal isolation between the first heat source 41 and the back cover 10, preventing heat from being conducted to the back cover 10 and causing the position of the back cover 10 corresponding to the first heat source 41 to overheat, affecting the user experience (e.g., becoming too hot to touch). Therefore, in addition to the space occupied by the first device module 4 in the first receiving cavity 15 along the thickness direction of the electronic device 100, the first distance G1 and the second distance G2 also require additional space in the first receiving cavity 15 along the thickness direction of the electronic device 100.

[0130] See Figure 4The heat dissipation requirements of the second heat source 61 are lower than those of the first heat source 41. Passive cooling can meet the heat dissipation requirements of the second heat source 61. Passive cooling requires the second device module 6 and the second heat dissipation component 7 to be in close contact with the housing of the electronic device 100 along the thickness direction, or to have a small gap, the smaller the gap the better. That is, the smaller the gap, the easier it is for the heat dissipated by the second device module 6 and the second heat dissipation component 7 to be transferred to the housing of the electronic device and other components with heat dissipation capabilities. Finally, the heat is dissipated and the temperature is evenly distributed through the housing and these components. Along the thickness direction of the electronic device 100, the end of the second device module 6 away from the back cover 10 is connected to the second middle frame 2 through a thermally conductive medium 73. Most of the space in the second receiving cavity 23 along the thickness direction of the electronic device 100 is reserved for the second device module 6 and the second heat dissipation component 7, which can provide heat dissipation efficiency and is conducive to the design of a thinner electronic device.

[0131] In one embodiment, the rotating shaft 3 is connected to the second heat dissipation assembly 7, for example, Figure 4 In the cross-section shown, the second middle frame 2 is connected to the rotating shaft 3, and the second heat dissipation assembly 7 is indirectly connected through the second middle frame 2 and the rotating shaft 3. The second heat dissipation assembly 7 can conduct heat from the second device module 6 to the rotating shaft 3. In one embodiment, both the second middle frame 2 and the rotating shaft 3 have thermal conductivity. For example, both the second middle frame 2 and the rotating shaft 3 are made of metallic materials. For instance, the second middle frame 2 can be made of aluminum alloy, and the rotating shaft 3 can include metallic materials such as copper. In this solution, the rotating shaft 3 can participate in the heat dissipation of the second device module 6, and the rotating shaft 3 can be regarded as part of the second heat dissipation assembly 7. This embodiment is beneficial to improving the heat dissipation efficiency of the electronic device 100.

[0132] In one possible implementation, the closest distance between the heating center of the second heat source 61 and the edge of the rotating shaft 3 is less than or equal to 5 cm. The heating center of the second heat source 61 can be obtained by measurement. Illustratively, the heating center is located in a plane formed by the width direction (X direction) and thickness direction (Z direction) of the electronic device 100. The edge of the rotating shaft 3 is perpendicular to the plane along the length direction of the electronic device 100. This perpendicular distance is approximately the closest distance between the heating center of the second heat source 61 and the edge of the rotating shaft 3. This embodiment constrains the size range of the closest distance between the edge of the rotating shaft 3 and the heating center of the second heat source 61 in a specific implementation. The constraint of less than or equal to 5 cm facilitates better heat dissipation. This solution is advantageous in providing a shorter heat conduction path, namely the heat transfer path of the second heat source 61, the second heat dissipation component 7, the second middle frame 2, and the rotating shaft 3, thereby improving heat transfer efficiency. The constraint of the nearest distance between the heating center location and the edge of the rotating shaft 3, which is less than or equal to 5 cm, also facilitates the compact structure of the devices arranged in the second frame 2 and the reasonable layout of the space within the electronic device 100.

[0133] In one possible implementation, the edge of the pivot 3 is the edge of the door panel of the pivot 3 adjacent to the second heat source 61, corresponding to the second middle frame 2. The door panel of the pivot 3 is the panel on the side of the pivot 3 adjacent to the screen 101 of the electronic device 100. For example, in an electronic device 100, the pivot 3 has a two-door panel structure, namely a left door panel and a right door panel. For example, if one of the door panels (e.g., the right door panel) is disposed opposite to the second middle frame 2, then the closest distance between the edge of the right door panel and the heating center position of the second heat source 61 is less than or equal to 5 cm. Optionally, the pivot 3 may also have three door panels or other numbers of door panels.

[0134] Figure 5 This is a cross-sectional structural schematic diagram of an electronic device according to an embodiment of this application, see reference. Figure 5 In one embodiment, both the first heat source 41 and the second heat source 61 are disposed on the first middle frame 1, for example, both the first heat source 41 and the second heat source 61 are disposed on the first circuit board 42. The first heat dissipation assembly 5 actively dissipates heat from the first heat source 41 and the second heat source 61. Since the heat from the second heat source 61 and the heat from the first heat source 41 are concentrated within the first receiving cavity 15, the first spacing G1 and the second spacing G2 still need to maintain appropriate dimensions. Because the maximum dimension H2 of the second heat source 61 along the third direction Z is greater than the maximum dimension H1 of the first heat source 41 along the third direction Z, Figure 5 The thickness of the main body of the electronic device corresponding to the first middle frame 1 provided in the illustrated embodiment needs to be greater than [the thickness of the main body]. Figure 4The embodiment shown provides the thickness dimension of the main body of the electronic device corresponding to the first middle frame 1. Therefore, compared to Figure 4 The provided implementation methods Figure 5 In the embodiment shown, the thickness difference between the main bodies of the electronic devices on both sides of the rotating shaft 3 is greater.

[0135] Therefore, compared to Figure 5 The implementation method shown, Figure 4 In the illustrated embodiment, by placing the thicker second device module 6 in the second middle frame 2, the overall thickness of the main body of the electronic device containing the first middle frame 1 can be reduced. In the main body of the electronic device containing the first middle frame 1, along the thickness direction, the size of the first device module 4 and the thickness of the first heat dissipation component 5 are close. The size of the second device module 6 in the thickness direction is larger than the size of the first device module 4, and the size of the second device module 6 in the thickness direction is also larger than the thickness of the first heat dissipation component 5. Therefore, placing the second device module 6 in the second middle frame, compared to placing it in the first middle frame, may reduce the thickness direction dimension of the main body of the electronic device containing the first middle frame. Therefore, the embodiments of this application can reduce the thickness difference between the main body of the electronic device 100 containing the first middle frame 1 and the main body of the electronic device 100 containing the second middle frame 2. Furthermore, by placing the second device module 6 between the battery 9 and the pivot 3, the second device module 6 and the pivot 3 are arranged side by side, i.e., they do not overlap in the Z direction. This is beneficial for controlling the thickness of the main body of the electronic device 100 where the second middle frame 2 is located. Also, since the second device module 6 and the pivot 3 are adjacent, the pivot 3 can also serve as a medium for passive heat dissipation of the second device module 6. In other words, this application can use the pivot 3 for auxiliary heat dissipation, which is beneficial for improving heat dissipation efficiency.

[0136] For example, in this embodiment, the first device module 4, which has a higher load and lower thickness, employs active cooling and is located within the space of the electronic device containing the first mid-frame 1 on one side of the hinge 3. Active cooling is achieved through a first heat dissipation assembly 5, which includes a heat spreader 51 and a fan 52, among other core heat dissipation modules. The second device module 6, which has a lower load and higher thickness, employs passive cooling and is located within the space of the electronic device containing the second mid-frame 2 on the other side of the hinge 3. Passive cooling is achieved through a second heat dissipation assembly 7. This embodiment, by placing the first and second device modules within two different main bodies, avoids concentrating large-sized, thick devices within a single main body, reducing the thickness difference between the two main bodies, resulting in an aesthetically pleasing and lightweight design, and improving the performance of both the first and second device modules.

[0137] Figure 4The illustrated embodiment describes passive heat dissipation of the second device module 6 through the second heat dissipation component 7, based on... Figure 4 The implementation method shown, Figure 6 The embodiment shown provides a specific design for a second heat dissipation component 7. Figure 6 The implementation methods shown are the same as Figure 4 The difference in the embodiment shown lies in the specific structure of the second heat dissipation component 7.

[0138] Figure 6 This is another cross-sectional structural schematic diagram of the electronic device proposed in the embodiments of this application, see reference. Figure 6 In one possible implementation, the second heat dissipation component 7 includes a heat sink 71 and a heat-conducting structure 72. The heat sink 71 is stacked on the side of the second heat source 61 facing away from the second circuit board 62, and the heat-conducting structure 72 is located on the side of the heat sink 71 facing away from the second heat source 61, i.e., along the third direction Z, the second circuit board 62, the second heat source 61, the heat sink 71, and the heat-conducting structure 72 are stacked sequentially. The heat sink 71 can also be a heat dissipation bracket. In one implementation, the heat sink 71 has temperature uniformity performance. In one implementation, the heat sink 71 can be a metal plate or a heat sink structure with heat dissipation fins. The heat sink 71 can also be other types of heat dissipation structures such as a heat spreader, a combination of a metal plate and a heat pipe. Optionally, the heat sink 71 is plate-shaped. Along the third direction Z (the thickness direction of the electronic device 100), the heat sink 71 is located between the back cover 10 and the second device module 6. Along the second direction Y (the length direction of the electronic device 100), the heat sink 71 is located between the battery 9 and part of the second middle frame 2. In one embodiment, the heat sink 71 can be attached to or thermally connected to the side of the second heat source 61 opposite to the screen 101 (e.g., connected via a thermally conductive medium). The heat sink 71 can conduct heat from the second heat source 61 to other components of the electronic device 100, such as the second frame 2, the hinge 3, or the back cover 10.

[0139] In one embodiment, the heat sink 71 can be fixed to the circuit board by fasteners, such as screws, to the second middle frame 2. For example, by fixing the heat sink 71 to the second middle frame 2, the position of the second circuit board 62 where the second heat source 61 is located can also be fixed. The heat sink 71 and the second heat source 61 are connected by a thermally conductive medium to ensure that there is no significant thermal resistance between the second heat source 61 and the heat sink 71 (e.g., air; without a thermally conductive medium, air will exist where the second heat source 61 and the heat sink 71 cannot fully adhere, resulting in high air thermal resistance and affecting heat dissipation).

[0140] See Figure 6In one possible implementation, the heat-conducting structure 72 is sheet-shaped. Optionally, the heat-conducting structure 72 is a graphite sheet with a nanometer-level thickness. Along the third direction Z (the thickness direction of the electronic device 100), the heat-conducting structure 72 can be disposed on the side of the heat sink 71 facing away from the second heat source 61. In one implementation, part of the heat-conducting structure 72 is connected to the heat sink 71, and another part of the heat-conducting structure 72 is connected to the second middle frame 2. The heat-conducting structure 72 can improve the heat conduction between the heat sink 71 and the second middle frame 2. Along the third direction Z (the thickness direction of the electronic device 100), part of the second middle frame 2 and the pivot 3 are stacked. Since the heat-conducting structure 72 is connected to the second middle frame 2, the heat from the second heat source 61 can be transferred to the second middle frame 2 and the pivot 3 through the heat-conducting structure 72, which is beneficial to improving the heat dissipation efficiency of the electronic device 100. In one implementation, the heat-conducting structure 72 is attached to the inner surface of the back cover 10. To prevent the back cover 10 from overheating directly in front of the heat source, this solution uses a heat-conducting structure 72 to disperse the heat. Therefore, the heat-conducting structure 72 can achieve temperature uniformity in electronic devices.

[0141] The heat-conducting structure 72 provided by this solution can guide the heat from the second heat source 61 to other components of the electronic device 100, such as the second middle frame 2, the hinge 3, or the back cover 10, based on the heat sink 71. This achieves efficient heat dissipation without additionally occupying the Z-axis space of the electronic device 100 on the second middle frame 2 side, which is beneficial for realizing a thinner and lighter high-performance electronic device 100. In other embodiments, the heat-conducting structure 72 can also be a heat-conducting sheet, heat spreader, heat pipe, or other structure with thermal conductivity made of other materials. A suitable heat-conducting structure can be selected according to the space requirements inside the electronic device to achieve stacking in the thickness direction.

[0142] See Figure 6In one possible implementation, the second circuit board 62 and the second middle frame 2 are connected by a thermally conductive medium 73, and the side of the second middle frame 2 facing away from the second circuit board 62 is the screen 101 of the electronic device 100. Along the third direction Z (the thickness direction of the electronic device 100), the screen 101, the second middle frame 2, the thermally conductive medium 73, the second circuit board 62, the second heat source 61, the heat sink 71, the thermally conductive structure 72, and the back cover 10 are sequentially stacked. This embodiment, through the above layout, can form a first heat transfer path for the second heat source 61, the heat sink 71, the thermally conductive structure 72, the second middle frame 2, and the hinge 3, and a second heat transfer path for the second heat source 61, the second circuit board 62, the thermally conductive medium 73, and the second middle frame 2, enabling the hinge 3 and the second middle frame 2 to participate in the operation of the second heat dissipation assembly 7, thereby improving heat dissipation efficiency. It should be noted that the middle frame receives heat from the heat source; since the middle frame is a large-area structure, the heat can be dissipated through the middle frame, preventing heat from concentrating in one location and causing localized overheating of the screen 101. The mid-frame dissipates heat, achieving a uniform temperature and keeping the heat of the screen 101 within a suitable range to meet its usage requirements. In a specific implementation, a small gap exists between the mid-frame and the screen 101, providing thermal insulation. Alternatively, thermal insulation can be achieved between the screen 101 and the mid-frame by applying thermal insulation foam.

[0143] based on Figure 6 The embodiments shown in this application allow for more detailed design of the second heat dissipation component 7 to optimize the passive heat dissipation efficiency of the second device module 6. For example, the embodiments of this application can further refine the design. Figure 6 The structure of the second heat dissipation component 7 is optimized to improve heat dissipation efficiency by improving the heat transfer path between the second heat dissipation component 7 and other components of the electronic device.

[0144] Figure 7 This is another cross-sectional structural schematic diagram of the electronic device proposed in the embodiments of this application, see reference. Figure 7 , Figure 7 The implementation methods shown are the same as Figure 6The difference in the illustrated embodiments is that, in one possible embodiment, the heat-conducting structure 72 includes a first heat-conducting part 721 and a second heat-conducting part 722. The first heat-conducting part 721 is disposed between the heat sink 71 and the back cover 10. The first heat-conducting part 721 can be disposed on the inner side of the back cover 10 or on the heat sink 71. The second heat-conducting part 722 is disposed between the second middle frame 2 and the screen 101, that is, the second heat-conducting part 722 is disposed on the side of the second middle frame 2 away from the heat-conducting medium 73. The second heat-conducting parts 722 are stacked between the second middle frame 2 and the screen 101. The second heat-conducting part 722 disposed on the side of the second middle frame 2 away from the heat-conducting medium 73 extends along the second direction Y (the length direction of the electronic device 100) to overlap with a portion of the rotating shaft 3. In this embodiment, by providing a second heat-conducting part 722 between the hinge 3 and the screen 101, and a first heat-conducting part 721 between the hinge 3 and the back cover 10, the hinge 3 can participate in the heat dissipation of the second device module 6 through the connection between the second middle frame 2 and the hinge 3. This solution can form a first heat transfer path of the second heat source 61, heat sink 71, first heat-conducting part 721, second middle frame 2 and hinge 3, and a second heat transfer path of the second heat source 61, second circuit board 62, heat-conducting medium 73, second middle frame 2 and second heat-conducting part 722 and hinge 3. As can be seen from the above heat transfer paths, compared with Figure 6 The electronic device 100 shown in this embodiment enhances heat transfer efficiency by adding a second heat-conducting part 722.

[0145] In one embodiment, the heat-conducting structure 72 can be a graphite sheet with a small thickness, which is beneficial for improving heat dissipation efficiency within the limited space of the electronic device. This solution, by providing heat-conducting structures 72 on both opposite sides of the thickness direction of the second heat source 61, can more effectively conduct heat from the second heat source 61 to the hinge 3, improving the utilization rate of the hinge in heat dissipation. This embodiment, by laying a portion of the heat-conducting structure 72 between the second frame 2 and the screen 101, optimizes the heat transfer path between the heat dissipated by the second heat source 61 and the external environment, which is beneficial for improving the heat dissipation efficiency of the electronic device 100.

[0146] based on Figure 7 As shown in the embodiments, the present application embodiment can further design the heat conduction structure 72 of the second heat dissipation component 7 in more detail to optimize the passive heat dissipation efficiency of the second device module 6.

[0147] Figure 8 This is another cross-sectional view of the electronic device proposed in the embodiments of this application. Figure 8 The implementation methods shown are the same as Figure 7The difference in the illustrated embodiment is that a portion of the heat-conducting structure 72 is located on the inner surface of the back cover and extends to the second middle frame and the battery stack, respectively; a portion of the heat-conducting structure 72 is located between the second middle frame 2 and the screen 101 and extends to the hinge and the battery stack, respectively. See also... Figure 8 In one possible implementation, the heat-conducting structure 72 includes a first heat-conducting part 721 and a second heat-conducting part 722. The first heat-conducting part 721 extends along the second direction Y (the length direction of the electronic device) and is stacked with the battery 9. Along the third direction Z (the thickness direction of the electronic device), the screen 101, the second middle frame 2, the battery 9, and the first heat-conducting part 721 are stacked. This solution can form a first heat transfer path of the second heat source 61, the heat sink 71, the first heat-conducting part 721, and the pivot 3, and a second heat transfer path of the battery 9, the first heat-conducting part 721, and the back cover 10. In this embodiment, the second heat-conducting part 722 is located between the portion of the second middle frame 2 adjacent to the battery 9 and the screen 101, that is, along the thickness direction of the electronic device 100 (the Z direction in the figure), the screen 101, the second heat-conducting part 722, the second middle frame 2, the battery 9, and the partial heat-conducting structure 72 are stacked, that is, the battery 9 has partial heat-conducting structures 72 on both sides along the thickness direction of the electronic device 100. This solution can form a third heat transfer path between the battery 9, the second middle frame 2, and the second heat-conducting part 722. The three heat transfer paths formed by this solution can effectively utilize the inherent components of the electronic device 100, such as the hinge 3, the back cover 10, and the second middle frame 2, to transfer the heat dissipated by the second device module 6 and the battery 9. That is, the hinge 3, the back cover 10, and the second middle frame 2 can participate in the heat dissipation of the second device module 6, and also provide heat dissipation for the battery 9, thereby improving the heat dissipation efficiency of the electronic device 100.

[0148] See Figure 8 A portion of the second heat-conducting part 722 extends between the portion of the second middle frame 2 corresponding to the battery 9 and the screen 101. Another portion of the second heat-conducting part 722, along with a portion of the second middle frame 2, the second device module 6, and the second heat dissipation assembly 7, is stacked sequentially along the thickness direction (Z direction in the figure) of the electronic device 100. The second heat-conducting part 722, the hinge 3, a portion of the second middle frame 2, and the first heat-conducting part 721 are also stacked sequentially along the thickness direction (Z direction in the figure) of the electronic device 100. Along the thickness direction of the electronic device 100, both sides of the second heat source 61 have partial heat-conducting structures 72, i.e., a first heat-conducting part 721 and a second heat-conducting part 722 are respectively provided. Similarly, both sides of the battery 9 have partial heat-conducting structures 72, i.e., a first heat-conducting part 721 and a second heat-conducting part 722 are respectively provided. This solution provides a large-area first heat-conducting part 721 on the inner surface of the back cover 10 and a large-area second heat-conducting part 722 between the second middle frame 2 and the screen 101, which can improve the heat dissipation efficiency of the electronic device 100 while ensuring its thinness and lightness.

[0149] based on Figure 8 In the illustrated embodiment, the first heat-conducting part 721 can cover only the area where the heat sink 71 and the battery 9 are located. That is, the first heat-conducting part 721 can be positioned away from the pivot 3 to save space in the pivot area. Similarly, the second heat-conducting part 722 can also cover only the areas of the second middle frame 2 other than the pivot 3. In other words, the second heat-conducting part 722 can also avoid the pivot 3 to save space in the pivot area. On both sides of the battery 9 along the third direction Z, the first heat-conducting part 721 and the second heat-conducting part 722 can each cover part or all of the battery 9. Therefore, this application does not restrict the specific arrangement of the heat-conducting structure 72; the heat-conducting structure 72 can be reasonably arranged according to the needs of specific application scenarios.

[0150] Figure 6 , Figure 7 and Figure 8 The illustrated embodiment describes a refined structure for the second heat dissipation component 7 to optimize the passive heat dissipation efficiency of the second device module 6. Based on this, the embodiments of this application can also improve... Figure 6 , Figure 7 and Figure 8 The position of the middle frame is adjusted to ensure the passive heat dissipation efficiency of the second device module 6 while achieving a thinner and lighter electronic device 100.

[0151] Figure 9 This is a cross-sectional view of the electronic device in a flattened state according to an embodiment of this application. (See attached diagram.) Figure 9 , Figure 9 The implementation methods shown are the same as Figure 6 , Figure 7 and Figure 8 The difference between the illustrated embodiments lies in the arrangement of the mid-frame. In one possible embodiment, a first mid-frame 1 and a second mid-frame 2 can be used to replace the position and function of the back cover. That is, the first mid-frame 1 and the second mid-frame 2 of the electronic device 100 are located in the position of the back cover and act as the back cover. The first mid-frame 1 and the second mid-frame 2 are respectively arranged with a gap relative to a portion of the screen 101 to form a receiving space, and the functional components inside the electronic device are arranged in this receiving space. Along the third direction Z (the thickness direction of the electronic device 100), the first mid-frame 1 is arranged on the side of the first device module 4 away from the screen 101. The screen 101, the first device module 4, the first heat dissipation component 5, and the first mid-frame 1 can be stacked sequentially. The screen 101 is arranged on the side of the heat sink 71 away from the second circuit board 62, and the second mid-frame 2 is arranged on the side of the second device module 6 away from the screen 101. The screen 101, the heat-conducting structure 72, the heat sink 71, the second heat source 61, the second circuit board 62, the heat-conducting medium 73, and the second mid-frame 2 can be stacked sequentially.

[0152] See Figure 9 In one embodiment, the second circuit board 62 and the second middle frame 2 can be connected by a thermally conductive medium 73 to realize a first heat transfer path of the second heat source 61, the second circuit board 62, the thermally conductive medium 73, and the second middle frame 2. A heat sink 71 is located between the second circuit board 62 and the screen 101. A portion of the thermally conductive structure 72 can be attached to the heat sink 71, i.e., a portion of the thermally conductive structure 72 is located between the heat sink 71 and the screen 101. A portion of the thermally conductive structure 72 can extend along the second direction Y (the length direction of the electronic device 100) to be attached to the pivot 3, i.e., a portion of the thermally conductive structure 72 is located between the pivot 3 and the screen 101. This realizes a second heat transfer path of the second heat source 61, the heat sink 71, the thermally conductive structure 72, and the pivot 3, and a third heat transfer path of the second heat source 61, the heat sink 71, the thermally conductive structure 72, and the screen 101. In this embodiment, the first middle frame 1 and the second middle frame 2 are set at the position of the back cover of the electronic device, which can replace the back cover and eliminate the space occupied by the back cover along the thickness direction of the electronic device 100. At the same time, it can transfer the heat dissipated by the second device module 6 through the inherent components of the electronic device 100, and finally achieve the thinning of the electronic device 100 while ensuring the passive heat dissipation efficiency of the second device module 6.

[0153] Figure 9 The illustrated embodiment, through the design of the positions of the first middle frame 1 and the second middle frame 2, can ensure the passive heat dissipation efficiency of the second device module 6 while achieving a thinner and lighter electronic device 100. This application Figure 10 The illustrated embodiment can also optimize the heat transfer path between the second heat dissipation component 7 and other components of the electronic device 100 by refining the specific configuration of the heat conduction structure 72, thereby improving heat dissipation efficiency.

[0154] Figure 10 This is another cross-sectional view of the electronic device in a flattened state according to an embodiment of this application. (See attached diagram.) Figure 10 This plan and Figure 9The illustrated implementation differs in the specific details of the heat-conducting structure 72. In one possible implementation, the heat-conducting structure 72 of the electronic device 100 in this embodiment includes a third heat-conducting part 723 and a fourth heat-conducting part 724. Along the third direction Z (the thickness direction of the electronic device 100), the fourth heat-conducting part 724 is located between the second middle frame 2 and the second circuit board 62, and the second circuit board 62, the heat-conducting medium 73, the fourth heat-conducting part 724, and the second middle frame 2 can be stacked sequentially. This can form a third heat transfer path of the second heat source 61, the second circuit board 62, the heat-conducting medium 73, the fourth heat-conducting part 724, and the second middle frame 2. In one implementation, the fourth heat-conducting part 724 can extend along the length direction of the electronic device 100 to the battery compartment area where the battery 9 is located, that is, the fourth heat-conducting part 724 and the battery 9 are stacked along the thickness direction of the electronic device 100, that is, there is a fourth heat-conducting part 724 between the battery 9 and the second middle frame 2. This can form a fourth heat transfer path of the battery 9, the fourth heat-conducting part 724, and the second middle frame 2. This embodiment achieves better performance by laying a fourth heat-conducting part 724 between the battery 9 and the second middle frame 2 compared to... Figure 9 The electronic device 100 shown in this embodiment has two additional heat transfer paths. This embodiment, while ensuring the thinness and lightness of the electronic device 100, can improve the passive heat dissipation efficiency of the second heat source 61. Furthermore, the aforementioned four heat transfer paths allow the hinge 3 and the second mid-frame 2 to participate in the heat dissipation of the second device module 6 and the battery 9, expanding the heat dissipation area of ​​the second device module 6 and the battery 9, which is beneficial to improving the heat dissipation efficiency of the electronic device 100.

[0155] Figure 3 In the illustrated embodiment, the area between the hinge 3 and the battery 9 is used to arrange the second device module 6 and the second heat dissipation component 7. The second circuit board 62 can be elongated and extend along the first direction X (parallel to the hinge). The second heat source 61 can be arranged at any position on the second circuit board 62. This application embodiment can also include a built-in bracket in the electronic device, which can support the electronic device when it is in a flattened state, facilitating use and improving comfort and user experience. See the detailed design for further details. Figure 11 The implementation method shown.

[0156] Figure 11 This is a top view diagram of the electronic device provided in this application embodiment when it is in a flattened state and without a back cover. This solution is similar to... Figure 3 The difference in the illustrated implementation lies in the addition of a bracket 103 and the integration of the charging circuit corresponding to the second charging interface 21 onto the second circuit board 62. (See also...) Figure 11In one possible implementation, the second charging interface 21 is located on the fourth side 22B of the second middle frame 2. The second circuit board 62 of the second device module 6 is adjacent to the fourth side 22B. A second heat source 61 is disposed on the second circuit board 62 along the thickness direction of the electronic device 100. The second circuit board 62 also includes a charging circuit and a connector, both of which are used to electrically connect the second charging interface 21, that is, the second charging interface 21 and the second circuit board 62 are electrically connected. This embodiment saves space in the second receiving cavity 23 of the electronic device 100 by electrically connecting the second heat source 61, the second circuit board 62 and the second charging interface 21 of the second device module 6 and integrating the second heat source 61, the second circuit board 62 and the second charging interface 21. The electronic device 100 also includes a bracket 103 and a bracket pivot 104. The bracket 103 is connected to the bracket pivot 104, so that the bracket 103 can rotate around the bracket pivot 104. The bracket 103 and the bracket shaft 104 are located between the battery 9 and the shaft 3, and the second device module 6 and the bracket 103 are distributed on both sides of the bracket shaft 104.

[0157] Figure 12 yes Figure 11 The diagram shown is a cross-sectional view of the electronic device in a folded state, combined with... Figure 11 and Figure 12 As shown, along the second direction Y (the length direction of the electronic device 100), the bracket 103 and the battery 9, and the bracket pivot 104 and the battery 9 are all staggered. That is, along the third direction Z (the thickness direction of the electronic device 100), the bracket 103 and the bracket pivot 104 do not occupy the Z-direction space of the battery 9, which helps to reduce the Z-direction space dimension of the electronic device 100 on the second middle frame 2 side. The back cover 10 has an opening to accommodate the bracket 103. When the bracket 103 is not in use, it is completely closed, and along the first direction X (the width direction of the electronic device 100), the bracket 103 can be on the same plane as the portion of the back cover 10 closest to the second middle frame 2. Figure 11 Taking the electronic device 100 in its unfolded state as an example, when the bracket 103 is needed, the bracket 103 rotates around the bracket pivot 104 to open. At this time, the bracket 103 can form a certain angle with the plane formed by the first direction X and the second direction Y. Schematic, the projection of the end of the bracket 103 in the open state away from the bracket pivot 104 along the thickness direction of the electronic device 100 can be shown as follows. Figure 11 The position of the dashed line pointed to by the middle dashed arrow.

[0158] Combination Figure 11 and Figure 12 As shown, in one possible implementation, the rotating shaft 3 and the support rotating shaft 104 can form a shape as shown in the figure. Figure 11The "T-shaped" layout shown surrounds the second heat source 61 of the electronic device 100. Specifically, the second device module 6 and the bracket 103 can be distributed on both sides of the bracket pivot 104, that is, the bracket pivot 104 can divide the second receiving cavity 23 into two sub-receiving cavities. The second device module 6 and the second heat dissipation component 7 are located in one of the sub-receiving cavities, and the bracket 103 can be stacked with the other sub-receiving cavity along the third direction Z (thickness direction of the electronic device 100). This allows the bracket 103, the second device module 6, and the second heat dissipation component 7 to be staggered along the width direction of the electronic device 100, that is, along the first direction. In other words, along the length direction of the electronic device 100, the bracket 103 and the bracket pivot 104 do not occupy additional Y-direction space on the second middle frame 2 side of the electronic device 100, which is beneficial to achieving high integration and miniaturization of the electronic device 100. In one embodiment, the second heat dissipation component 7 is used to conduct heat from the second heat source 61 to the bracket pivot 104. Since the second heat dissipation component 7 is located on the second middle frame 2, and the second middle frame 2 is connected to the rotating shaft 3 and the bracket rotating shaft 104, the heat dissipated by the second heat source 61 of the second device module 6 can be transferred sequentially along the second heat dissipation component 7 and the second middle frame 2 to the rotating shaft 3 and the bracket rotating shaft 104. The bracket rotating shaft 104 can participate in the heat dissipation of the second device module 6, expanding the heat dissipation area of ​​the second device module 6, which is beneficial to improving the heat dissipation efficiency of the electronic device 100. In one embodiment, the second middle frame 2, the rotating shaft 3, and the bracket rotating shaft 104 are all made of metal or other materials with good thermal conductivity, and all three have good thermal conductivity. In this embodiment, the heat of the second device module 6 is conducted to the bracket rotating shaft 104 through the second heat dissipation component 7, so that the thicker second device module 6 can achieve effective passive heat dissipation through the inherent components of the electronic device 100, without the need to set additional components for active heat dissipation, such as fans and liquid cooling components, which is beneficial to reducing the thickness of the electronic device 100.

[0159] Combination Figure 11 and Figure 12As shown, in one possible implementation, the electronic device 100 further includes a third device module 105. In one implementation, the third device module 105 is a third type of device (a device with low load and low height). The third device module 105 is located between the battery 9 and the rotating shaft 3, i.e., along the second direction Y (the length direction of the electronic device 100), the battery 9, the third device module 105, and the rotating shaft 3 are arranged sequentially. Along the first direction X (the width direction of the electronic device 100), the third device module 105 and the second device module 6 are arranged sequentially. Along the third direction Z (the thickness direction of the electronic device 100), the third device module 105 and the bracket 103 are stacked. The maximum dimension of the third device module 105 along the thickness direction of the electronic device 100 is smaller than the maximum dimension of the first device module 4 along the thickness direction of the electronic device 100. Optionally, the third device module 105 may include low-load devices such as resistors, capacitors, and inductors. In this embodiment, a third device module 105 is disposed within the space overlapping with the bracket 103 along the thickness direction of the electronic device 100. Since the thickness of the third device module 105 is small, it occupies a thickness space in the same area as the bracket 103, which helps to save internal space of the electronic device 100, thereby achieving a thinner and lighter electronic device 100. In addition, by stacking the third device module 105 and the bracket 103, and connecting the bracket 103 to the bracket pivot 104, which in turn connects to the second middle frame 2, the heat generated by the functional devices in the third device module 105 can be effectively dissipated through the bracket 103, the bracket pivot 104, and the pivot 3. This allows the bracket 103, the bracket pivot 104, and the pivot 3 to participate in the heat dissipation of the third device module 105, increasing the heat dissipation area of ​​the third device module 105 and improving the heat dissipation efficiency of the electronic device 100. For example, compared with the first device module 4 and the second device module 6, the third device module 105 has the lowest load and the smallest thickness. By placing the third device module 105 below the support 103 along the thickness direction of the electronic device 100, and the support 103 does not overlap with the battery 9, the space of the battery 9 can be unaffected, and no additional heat dissipation element is needed to dissipate heat from the third device module 105, which is beneficial to the thinning and lightening of the electronic device 100.

[0160] Combination Figure 11 and Figure 12As shown, in one possible implementation, the third device module 105 includes an electronic device 1051 and a third circuit board 1052. The electronic device 1051 is disposed on the third circuit board 1052, and the third circuit board 1052 can be connected to the second middle frame 2. Optionally, the electronic device 100 also includes a support structure 106 and a shielding structure 107. Along the third direction Z (the thickness direction of the electronic device 100), the support structure 106, the shielding structure 107, and a portion of the back cover 10 near the second middle frame 2 can be arranged sequentially. The support structure 106, the shielding structure 107, and the bracket 103 can also be arranged sequentially. The shielding structure 107 can be a metal sheet, used to shield the support structure 106 and can also serve as a decorative element. Along the thickness direction of the electronic device 100 (the Z direction in the figure), the screen 101, the second middle frame 2, the third circuit board 1052, the electronic device 1051, the support structure 106, and the bracket 103 are stacked sequentially, that is, the support structure 106 is provided between the electronic device 1051 and the bracket 103. The support structure 106 can be used to protect the third device module 105. The electronic device 1051 of the third device module 105 is located between the support structure 106 and the third circuit board 1052. By shielding and protecting the third device module 105 and the electronic device 1051, the electronic device 1051 of the third device module 105 will not be exposed when the bracket 103 is flipped.

[0161] Along the thickness direction of the electronic device 100, the support structure 106, the shielding structure 107, and the bracket 103 can be stacked sequentially, that is, the support structure 106 and the shielding structure 107 are provided between the electronic device 1051 and the bracket 103. The shielding structure 107 can make the exposed part of the support structure 106 more aesthetically pleasing during the rotation of the bracket 103, and can also enhance the isolation between the third device module 105 and the outside world.

[0162] See Figure 12In one possible implementation, the support structure 106 is flat. In another possible implementation, the support structure 106 can be stepped, and can cover structural components of different sizes. For example, the third device module 105 may have different heights, or the pivot or related structures of the second middle frame adjacent to the third device module 105 may have different sizes. The shielding structure 107 and the bracket 103 can also be stepped to adapt to the stepped multi-device structure. The stepped support structure 106, shielding structure 107, and bracket 103 not only fully fill the height difference caused by electronic devices 1051 of different sizes, but also do not occupy additional space in the second middle frame 2 along the thickness direction of the electronic device 100. The stepped bracket 103 also has stronger support strength, which is beneficial to the stability of the electronic device 100 when placed in any placeable area via the bracket 103, ultimately achieving efficient operation of the electronic device 100.

[0163] In one embodiment, the bracket 103 is made of metal. The support structure 106 is provided with a magnetic structure. The magnetic attraction between the magnetic structure and the bracket 103 can fix the position of the bracket 103 when it is in the closed state, preventing the bracket 103 from freely flipping over.

[0164] Combination Figure 11 as well as Figure 12 As shown, in one possible implementation, the first heat dissipation assembly 5 may include a heat spreader 51, a fan 52, a heat sink 53, and a thermal pad 54. Along the thickness direction of the electronic device 100 (Z direction in the figure), the screen 101, the first middle frame 1, the first circuit board 42, the first heat source 41, the thermal pad 54, the heat sink 53, the heat spreader 51, and the back cover 10 may be stacked sequentially. That is, along the thickness direction of the electronic device 100, the first heat source 41 is located between the first circuit board 42 and the heat spreader 51, and the first middle frame 1 connects to the screen 101 of the electronic device 100. The number of fans 52 is at least two, and at least two fans 52 may be respectively arranged on opposite sides of the heat spreader 51 along the width direction of the electronic device 100 (X direction in the figure). Optionally, the vapor chamber 51 may be provided with two support members on opposite sides along the width direction of the electronic device 100, and at least two fans 52 may be connected to the two support members. The fans 52 and the vapor chamber 51 together achieve active heat dissipation, and the heat sink 53 and the thermal pad 54 are used to improve heat dissipation efficiency along the active heat dissipation path. In one embodiment, the heat sink 53 may be made of copper. The thermal pad 54 may be thermally conductive gel or other types of thermally conductive media.

[0165] Figure 12The detailed architecture of the first heat dissipation component 5 shown in the embodiment, such as the arrangement of the heat sink 53 and the thermal pad 54 in the first heat dissipation component 5, can also be used in... Figures 4 to 10 In any of the possible implementation schemes shown.

[0166] Figure 11 and Figure 12 The solution shown, which involves installing the bracket 103 within the electronic device, can also be used in... Figures 4 to 10 In any of the possible implementation schemes shown.

[0167] In one embodiment, the first heat dissipation component provided in this application is mounted on the first middle frame. For example, the bottom of the first heat dissipation component can be directly attached to the bottom wall of the first middle frame. However, this structure has the problem of large thickness, which is not conducive to the overall thin design of the electronic device. Therefore, this application provides a specific embodiment by providing a through hole in the first middle frame to accommodate the first heat dissipation component, which is beneficial to the overall thin design of the electronic device. One embodiment of this application describes the connection structure between the fan and the middle frame, as well as the specific air outlet structure, as detailed below. Figure 13 , Figure 14 , Figure 15 The specific implementation shown in the following examples and other specific embodiments describe the connection structure of the fan and the middle frame, as well as the specific air outlet structure (such as...). Figures 16-21 (Specific implementation method shown).

[0168] Figure 13 This is a cross-sectional view of an electronic device provided according to one embodiment of this application. Figure 13 The connection structure between the first heat dissipation component and the first middle frame is shown in a cross-section. Figure 13 The transverse direction of the cross-sectional view shown is the first direction X (i.e., the axial direction of the rotating shaft of the electronic device). Figure 13 The longitudinal direction of the cross-sectional view is the third direction Z (i.e., the thickness direction of the electronic device); Figure 14 for Figure 13 A cross-sectional view of the electronic equipment in the picture from another perspective. Figure 14 The specific structure of the fan housing and the locations of the air inlet and outlet are shown. Figure 14 The transverse direction of the cross-sectional view shown is the second direction Y (i.e., the length direction of the electronic device, which is perpendicular to the first direction X). Figure 14 The longitudinal direction of the cross-sectional view is the third direction Z (i.e., the thickness direction of the electronic device); Figure 15 for Figure 13 A top view of the internal structure of electronic devices in the device. Figure 15 The structure connecting the fan housing and the mid-frame is shown. Figure 15The transverse direction of the cross-sectional view shown is the first direction X (i.e., the axial direction of the rotating shaft of the electronic device). Figure 15 The longitudinal direction of the cross-sectional view shown is the second direction Y (i.e., the length direction of the electronic device).

[0169] like Figure 13 As shown, the electronic device includes a back cover 10, a screen 101, a first middle frame 1, and a first heat dissipation component 5. The first middle frame 1 is stacked between the back cover 10 and the screen 101. The first middle frame 1 includes a bottom wall 31 and a rib 32 that are fixedly connected. The bottom wall 31 is provided with a through hole 311. The rib 32 is located outside the through hole 311. The rib 32 protrudes from the bottom wall 31 along the thickness direction Z of the electronic device and toward the back cover 10. The first heat dissipation component 5 is installed on the rib 32. At least a portion of the first heat dissipation component 5 is located inside the through hole 311.

[0170] The first middle frame 1 is mainly used to mount various electronic components of the electronic device. The first heat dissipation assembly 5 is used to assist in heat dissipation of the heat-generating electronic components. A through hole 311 is provided on the bottom wall 31 of the first middle frame 1, and the bottom end of the first heat dissipation assembly 5 is embedded within the through hole 311, forming an embedded structure. Compared to the existing technology where the bottom end of the first heat dissipation assembly 5 is directly attached to the bottom wall 31, the embedded structure can reduce the overall thickness of the electronic device. Figure 13 As shown, the rib 32 protrudes from the bottom wall along the thickness direction Z of the electronic device and toward the rear cover 10. The rib 32 can enhance the local strength of the bottom wall 31 and improve stability. The rib 32 is located outside the through hole 311 and can also be used to connect the first heat dissipation component 5. It plays a role in the installation and positioning of the first heat dissipation component 5, which can prevent the first heat dissipation component 5 from shaking during the use of the electronic device and ensure the installation stability of the first heat dissipation component 5.

[0171] The bottom wall 31 and the rib 32 can be an integral structure or a separate structure; this embodiment does not impose any restrictions on this.

[0172] It should be noted that, in order to minimize the damage to the structural strength of the first middle frame 1 caused by the through hole 311, the area of ​​the through hole 311 should not be too large, and should be slightly larger than the area of ​​the first heat dissipation component 5.

[0173] In one specific embodiment, such as Figure 13 As shown, the electronic device provided in this application embodiment also includes a reinforcing member 5A, which is fixed to the end of the bottom wall 31 away from the protruding rib 32 and covers the through hole 311.

[0174] The first middle frame 1 provides some support and protection for the screen 101. When a through hole 311 is provided on the bottom wall 31, stress concentration is likely to occur around the through hole 311, and the reduced load-bearing area will also reduce the structural strength of the first middle frame 1, thereby affecting the reliability of the screen 101. Therefore, it is necessary to provide a reinforcing member 5A to reinforce the first middle frame 1 by opening the hole. Figure 13 As shown, the reinforcing member 5A is fixedly connected to the bottom wall 31 and can completely cover the through hole 311, playing a role in local reinforcement. It can strengthen the structural strength of the bottom wall 31 around the through hole 311, thereby improving the overall structural strength of the first middle frame 1 and ensuring the reliability of the screen 101.

[0175] The reinforcing member 5A can be made of a material with high structural strength and resistance to deformation, such as copper, aluminum, titanium, or stainless steel. This embodiment does not impose any limitations on this material. The thickness of the reinforcing member 5A can be 0.1mm to 0.2mm to ensure that the structural strength of the bottom wall 31 is effectively improved. Specifically, it can be 0.1mm, 0.12mm, 0.15mm, or 0.2mm, or other values ​​within the above range. No limitation is imposed here.

[0176] Furthermore, the reinforcing member 5A can be fixedly connected to the bottom wall 31 by adhesive bonding, specifically, as shown below. Figure 13 As shown, a mounting groove 31A can be made on the bottom wall 31. Specifically, the mounting groove 31A is recessed on the surface of the bottom wall 31 away from the rear cover 10. Glue 5A1 is applied into the mounting groove, and then the reinforcing member 5A is placed in the mounting groove 31A to complete the bonding.

[0177] In one specific embodiment, such as Figure 13 and Figure 14 As shown, the first heat dissipation component 5 includes a fan housing and a fan rotation mechanism 520. The fan housing includes an upper cover 501, a lower cover 502, and a side panel 503. The upper cover 501, the lower cover 502, and the side panel 503 together form an accommodating space 504. The fan rotation mechanism 520 is installed in the accommodating space 504. The upper cover 501 is provided with an air inlet 505, and the side panel 503 is provided with an air outlet 506. The air inlet 505 and the air outlet 506 are respectively connected to the accommodating space 504.

[0178] In this embodiment, the first heat dissipation component 5 adopts air cooling. Low-temperature cold air enters the housing space 504 from the air inlet 505 and comes into contact with the fan rotation mechanism 520. The fan blades of the fan rotation mechanism 520 accelerate the air flow by rotating, forming an airflow. The airflow can flow from the air outlet 506 to the heat-generating electronic components and exchange heat with the electronic components, thereby assisting the electronic components in heat dissipation.

[0179] In one specific implementation, refer to Figure 13 and Figure 14 The side enclosure 503 is not set to surround the fan rotating mechanism 520 on all four sides, but rather to surround the fan rotating mechanism 520 on three sides. This increases the area of ​​the air outlet 506, thereby ensuring that the airflow from the accommodating space 504 to the heat-generating electronic components is large enough, thus improving the heat dissipation effect of the first heat dissipation component 5.

[0180] Furthermore, this embodiment does not limit the number of fans (including fan rotation mechanism 520 and fan housing). When the heat dissipation requirements of electronic devices are large, a dual-fan structure can be adopted to improve the heat dissipation performance of electronic devices.

[0181] In one specific embodiment, such as Figure 14 As shown, there is an air inlet channel 507 between the upper cover 501 and the rear cover 10, and the air inlet channel 507 is connected to the air inlet hole 505.

[0182] There is a gap between the upper cover 501 and the rear cover 10 to form an air intake channel 507. Low-temperature cold air from the outside can flow from the air intake channel 507 to the air intake hole 505. Compared with the prior art, which opens a hole in the rear cover 10 as the air intake channel 507, this embodiment ensures that the integrity and structural strength of the rear cover 10 are not compromised.

[0183] In one specific embodiment, at least a portion of the ribs 32 are provided around the through hole 311, and the side panel 503 is fixedly connected to the ribs 32. Specifically, the outer surface of the side panel 503 is provided with a hanging ear structure 503A, and the fan housing is fixed to the ribs 32 by the hanging ear structure 503A.

[0184] Please refer to this together. Figure 13 and Figure 15 A portion of the raised ribs 32 are arranged around the through hole 311, forming a three-sided surrounding structure. This enhances the structural strength of the bottom wall 31 surrounding the through hole 311 while avoiding the location of the air outlet 506, ensuring smooth airflow from the first heat dissipation component 5. The hanging lug structure 503A of the side panel 503 can extend towards the direction close to the raised rib 32 and overlap the end of the raised rib 32. Figure 13 and Figure 15 As shown, along the width direction X of the first heat dissipation component 5, the hanging ear structures 503A on both sides of the side circumference 503 are fixedly connected to the protruding rib 32 by fasteners 5015, which improves the installation stability of the first heat dissipation component 5.

[0185] In addition, such as Figure 15 As shown, another part of the rib 32 can extend along the length direction Y of the first heat dissipation component 5 to improve the structural strength of other positions of the bottom wall 31, thereby improving the overall strength of the first middle frame 1.

[0186] In one specific embodiment, such as Figure 14 As shown, the upper cover 501 includes an upper cover guide portion 5011, and the lower cover 502 includes a lower cover guide portion 5021. Along the thickness direction Z of the electronic device, the upper cover guide portion 5011 and the lower cover guide portion 5021 are disposed opposite to each other.

[0187] The upper cover guide portion 5011 and the lower cover guide portion 5021 are arranged opposite to each other along the thickness direction Z of the electronic device, forming a guide channel. This guide channel is connected to the air outlet 506 and is used to guide the airflow from the air outlet 506 to the heat-generating electronic component, ensuring that the first heat dissipation component 5 can smoothly dissipate air.

[0188] Specifically, such as Figure 14 As shown, the lower cover 502 also includes a lower cover body 5022, the lower cover guide portion 5021 is connected to the lower cover body 5022 and is inclined relative to the lower cover body 5022 toward the direction closer to the upper cover 501; and / or, the upper cover 501 also includes an upper cover body 5012, the upper cover guide portion 5011 is connected to the upper cover body 5012 and is inclined relative to the upper cover body 5012 toward the direction away from the lower cover 502.

[0189] The lower cover body 5022 and the upper cover body 5012 together with the side wall 503 form an accommodating space 504. The lower cover guide part 5021 is close to the air outlet 506 and is used to guide the airflow at the air outlet 506. Specifically, the lower cover guide part 5021 is inclined relative to the lower cover body 5022 towards the direction closer to the upper cover 501 to form a slope structure, so that the airflow can rise up along the slope and flow to the heat-generating electronic components, ensuring that the airflow in the accommodating space 504 can flow out smoothly and avoid the first heat dissipation component 5 from being obstructed by the bottom wall 31.

[0190] And / or, the upper cover guide portion 5011 is located near the air outlet 506 and is used to cooperate with the lower cover guide portion 5021 for guiding. Specifically, the upper cover guide portion 5011 is inclined relative to the upper cover body 5012 in a direction away from the lower cover 502, thus forming a sloping structure. Compared with the structure extending in the horizontal direction, the sloping structure of the upper cover guide portion 5011 can increase the air outlet area of ​​the first heat dissipation component 5, increase the air volume, and further improve the heat dissipation effect of the first heat dissipation component 5.

[0191] In one specific embodiment, such as Figure 14 As shown, there is an included angle α between the lower cover guide portion 5021 and the lower cover body 5022, and the included angle α satisfies: 90°≤α≤170°. The included angle α can be 90°, 120°, 130°, 150°, 165° or 170°, or other values ​​within the above range, which are not limited here.

[0192] In this embodiment, if the included angle α is too small (e.g., less than 90°), the exhaust area of ​​the first heat dissipation component 5 will be insufficient, resulting in a small exhaust volume and affecting the heat dissipation effect of the first heat dissipation component 5. If the included angle α is too large (e.g., greater than 170°), the lower cover guide portion 5021 will be close to horizontal, and its guiding effect will be too small, failing to ensure that the airflow can rise to the height above the bottom wall 31 and flow to the heat-generating electronic components, which will also affect the heat dissipation effect of the first heat dissipation component 5. Therefore, when the included angle α between the lower cover guide portion 5021 and the lower cover body 5022 is 90° to 170°, it can ensure that the first heat dissipation component 5 has smooth airflow and a sufficient air volume.

[0193] In one specific embodiment, such as Figure 14 As shown, the upper cover 501 also includes an upper cover reinforcement 5013. At least a portion of the upper cover body 5012 is connected to the upper cover reinforcement 5013. The upper cover reinforcement 5013 protrudes relative to the upper cover body 5012 in the direction toward the rear cover 10 of the electronic device (also in the direction away from the lower cover 502).

[0194] The upper cover reinforcement 5013 protrudes relative to the upper cover body 5012 in the direction toward the rear cover 10 of the electronic device, which can play a role in local reinforcement, improve the structural strength of the upper cover body 5012 connected thereto, and thus improve the strength of the first heat dissipation component 5, thereby improving the compression resistance of the first heat dissipation component 5.

[0195] The upper cover reinforcement 5013 and the upper cover body 5012 can be an integral structure or a separate structure; this embodiment does not impose any limitation on this. The thickness of the upper cover reinforcement 5013 can be 0.4mm to 0.8mm to ensure that the structural strength of the upper cover body 5012 is effectively improved. Specifically, it can be 0.4mm, 0.5mm, 0.6mm, or 0.8mm, or other values ​​within the above range; no limitation is imposed here.

[0196] In one specific embodiment, such as Figure 15 As shown, the upper cover body 5012 is provided with a connecting portion 5014, which is connected to the upper cover reinforcement portion 5013. Along the width direction X of the first heat dissipation assembly 5, both ends of the upper cover body 5012 are provided with connecting portions 5014, and the two connecting portions 5014 are respectively fixedly connected to the protruding rib 32. For example, the connecting portion 5014 and the upper cover reinforcement portion 5013 can be an integral structure. The upper cover reinforcement portion 5013 is a strip-shaped structure with its length direction in the first direction X, and the connecting portions 5014 are located at both ends of the upper cover reinforcement portion 5013 along its length direction. The connecting portion 5014 is equivalent to the structure where both ends of the upper cover reinforcement portion 5013 protrude and extend to the periphery of the upper cover. It overlaps with the protruding rib 32 through the connecting portion 5014 and is connected to the first middle frame 1 using fasteners.

[0197] In this embodiment, along the first direction X (the axial direction of the rotating shaft of the electronic device), the two connecting parts 5014 are respectively fixedly connected to the protruding rib 32, which can further improve the installation stability of the first heat dissipation assembly 5. Figure 15 As shown, the connecting part 5014 is connected to the upper cover reinforcement part 5013, and the connecting part 5014 connects the protruding ribs 32 located on both sides of the first heat dissipation component 5 to form a ring-shaped reinforcement structure, which can further play a reinforcing role, improve the structural strength of the first middle frame 1, and at the same time, make the force on the protruding ribs 32 more uniform, thus improving the structural stability of the protruding ribs 32.

[0198] The connecting part 5014 can be fixedly connected to the protruding rib 32 by fastener 5015. The fastener 5015 can be a screw or other connecting parts, and the embodiment does not limit this.

[0199] In one specific embodiment, the electronic device further includes a flexible circuit board 6A, and a groove is provided at the end of the lower cover 502 away from the fan rotation mechanism 520, that is, a groove is provided on the outer surface of the lower cover 502. At least a portion of the flexible circuit board 6A is mounted in the groove.

[0200] One end of the flexible circuit board 6A is connected to the first heat dissipation component 5, and the other end is connected to the motherboard of the electronic device, such as... Figure 13 As shown, a groove can be made at the end of the lower cover 502 away from the fan rotation mechanism 520 (for example, by etching process), and then the flexible circuit board 6A is installed in the groove, that is, the flexible circuit board 6A is embedded in the bottom wall of the lower cover 502. Compared with the prior art solution of directly attaching the flexible circuit board 6A to the bottom wall of the lower cover 502, the thickness of the electronic device can be reduced, which is conducive to the thinning of the electronic device.

[0201] In summary, the electronic device provided in this embodiment can reduce the thickness of the electronic device without affecting the heat dissipation effect of the first heat dissipation component 5. At the same time, by setting the reinforcing member 5A and the upper cover reinforcing part 5013, the structural strength of the first middle frame 1 is improved, thereby improving the reliability of the first heat dissipation component 5 and the screen 101, and ensuring that the fan and the screen 101 will not fail during the use of the electronic device.

[0202] Figures 16 to 21 This is a schematic diagram of the portion where the first middle frame and the fan are combined, according to one embodiment of this application. This embodiment is similar to... Figures 13 to 15 The specific structures of the provided embodiments are slightly different. For example, the upper and lower covers of the fan housing have different structures, especially the upper and lower covers at the air outlet.

[0203] Figure 16This is a perspective view of the portion where the first middle frame and the fan are combined in an electronic device according to an embodiment of this application. Figure 17 yes Figure 16 A three-dimensional schematic diagram of the structure shown from another direction. Figure 18 yes Figure 17 The diagram shows a three-dimensional exploded view of the structure. Figure 19 yes Figure 18 A three-dimensional exploded view of the structure shown from another direction.

[0204] See Figure 16 , Figure 17 , Figure 18 and Figure 19 In one embodiment, the first middle frame 1 is provided with a through hole 311, the shape of which matches the shape of the fan 52. Specifically, the first middle frame 1 includes a bottom wall 31 and a protruding rib 32, the protruding rib 32 protruding from the bottom wall 31, and the protruding rib 32 enclosing a space for accommodating the fan 52 and matching its shape. In one embodiment, as... Figures 16-18 As shown, the bottom wall 31 includes a top surface 31S1 and a bottom surface 31S2. In the electronic device, the top surface 31S1 faces the rear cover of the electronic device, and the bottom surface 31S2 faces the screen of the electronic device. A rib 32 protrudes from the top surface, and a mounting groove 31A is recessed on the bottom surface of the bottom wall 31, surrounding the through hole 311. The shape of the outer edge of the mounting groove 31A is the same as the shape of the outer contour of the reinforcing member 5A. Figure 17 As shown, in one embodiment, the reinforcing member 5A is located in the mounting groove 31A and is fixedly connected to the bottom wall 31, and the surface of the reinforcing member 5A and the surface of the bottom wall 31 can be flush and coplanar.

[0205] In one embodiment, the surface of the lower cover 502 of the fan 52 housing that faces away from the upper cover 501 can be fitted with the reinforcing member 5A (the two can be fixed by adhesive, or they can be in direct contact). In other embodiments, a spacer can be provided between the surface of the lower cover 502 facing away from the upper cover 501 and the surface of the reinforcing member 5A. For example, the spacer can be foam or the like, and the spacer can be used to buffer the vibration of the fan.

[0206] In one embodiment, the surface of the lower cover 502 facing away from the upper cover 501 may be provided with a groove 502A, which is used to mount a flexible circuit board. The flexible circuit board can be attached to or in contact with the reinforcing member 5A.

[0207] Figure 20 This is a cross-sectional view of an assembly structure combining a first middle frame and a fan, according to one embodiment of this application. Figure 21 yes Figure 20 An enlarged view of part I. See also Figure 20 and Figure 21In one embodiment, the lower cover 502 of the fan 52 housing is flat, and the edge of the lower cover 502 corresponding to the air outlet 506 includes a flat structure, which is close to the air outlet. The edge of the lower cover 502 corresponding to the air outlet 506 is adjacent to the edge region 17 of the bottom wall 31 of the first middle frame 1. The lower cover 502 includes a side end face 502S1, which faces the first middle frame 1 and the edge region 17. The edge region 17 includes a side end face 17S1, which faces the side end face 502S1 of the lower cover 502. In one embodiment, there is a gap between the side end face 17S1 of the edge region and the side end face 502S1 of the lower cover 502. In another embodiment, the side end face 17S1 of the edge region and the side end face 502S1 of the lower cover 502 can also be in contact. The bottom surface of the edge region 17 is recessed with a mounting groove 31A, and the edge of the reinforcing member 5A is located within the mounting groove 31A and overlaps with the edge region 17. In one embodiment, the edge region 17 has an air guiding slope 31B, which extends obliquely relative to the flat plate structure, and is used to guide the air in the receiving space of the fan housing from the air outlet to the outside of the housing.

[0208] In one embodiment, the edge of the upper cover 501 adjacent to the air outlet 506 is a guide structure 501A. The guide structure 501A includes a first part 5016, a second part 5017, and a third part 5018 connected in sequence. In one embodiment, the first part 5016, the second part 5017, and the third part 5018 are an integral structure, such as an integral sheet metal part. The central area of ​​the first part 5016 and the upper cover 501 are coplanar, which can be understood as the first part 5016 and the central area of ​​the upper cover 501 together forming a flat plate structure. The first part 5016 may be perpendicular to the thickness direction of the first middle frame 1. The second part 5017 extends obliquely relative to the first part 5016. The third part 5018 may be parallel to the first part 5016, and the diameter of the air outlet 506 corresponding to the third part 5018 is larger than the diameter of the air outlet 506 corresponding to the first part 5016. The diameter of part of the air outlet 506 corresponding to the second part 5017 is gradually widening.

[0209] In one embodiment, the first portion 5016 is parallel to the inner surface of the lower cover 502, and the angle at which the second portion 5017 is tilted relative to the first portion 5016 can be the same as the angle at which the air guide slope 31B is tilted relative to the inner surface of the lower cover 502.

[0210] In one embodiment, the edges of the upper cover 501 and the lower cover 502 of the fan housing are aligned along the thickness direction of the electronic device.

[0211] Figures 13-21 Any of the possible implementations shown can be applied to Figures 4 to 12In any of the possible implementation schemes shown.

[0212] For foldable display devices, the aforementioned distributed heat source design may increase the demand for cross-axial communication between components on both sides of the hinge, leading to a sharp increase in the number of signal lines on the flexible printed circuit board (FPC), potentially resulting in a wider FPC. However, due to the assembly tolerances of the FPC, an excessively wide FPC will twist in its width direction during the folding process, severely impacting its bending lifespan. For clarity, let's define the length direction of the FPC as the second direction Y. In electronic devices, the length direction of the FPC is perpendicular to the axis of the hinge. Let's define the width direction of the FPC as the first direction X (also the axis of the hinge). The first direction X is perpendicular to the second direction Y. The FPC will twist in the second direction Y, causing compression at one end and stretching at the other. Both twisting issues severely affect the bending lifespan of the FPC.

[0213] This application embodiment, by setting strip holes on the flexible circuit board, can divide the portion of the flexible circuit board located between the first and second middle frames into multiple transmission segments with smaller widths, thereby avoiding excessive twisting of the flexible circuit board during bending and thus improving the service life of the flexible circuit board.

[0214] Figure 22 This is a partial schematic diagram of an electronic device provided in an embodiment of this application in a flattened state, with reference to... Figure 22 , Figure 22 An exemplary illustration shows the connection state of some parts at the pivot assembly location inside a foldable phone. The electronic device includes a first middle frame 1, a second middle frame 2, a flexible circuit board 102, and a pivot 3. The screen can be supported above the first middle frame 1, the second middle frame 2, and the pivot 3. The flexible circuit board 102 can pass through the pivot 3, and the two ends of the flexible circuit board 102 can be connected to the first middle frame 1 and the second middle frame 2, respectively.

[0215] Figure 23 This is a schematic diagram of the structure of the flexible circuit board provided in the embodiments of this application; Figure 24A This is a state diagram of the flexible circuit board provided in this application embodiment in use. Figure 24B This is another state diagram of the flexible circuit board 102 provided in this application embodiment in application.

[0216] Reference Figure 23 The flexible circuit board has at least one slot 11E extending in the first direction X. The slot 11E divides the wider middle portion of the flexible circuit board into multiple narrower transmission segments 13E. Figure 23As shown, by providing two strip-shaped holes 11E, the middle portion of the flexible circuit board is divided into three transmission segments 13E of unequal width, which can also be of equal width. To ensure the integral integrity of the flexible circuit board, the strip-shaped holes 11E do not penetrate through both ends of the flexible circuit board along the second direction Y. That is, the two ends of the flexible circuit board remain an integral structure, only the middle area is divided into multiple transmission segments 13E, and the two ends of the multiple transmission segments 13E are interconnected to form an integral structure. This facilitates the fixed connection between the flexible circuit board and the first and second middle frames.

[0217] Reference Figure 23 , Figure 24A and Figure 24B The electronic device provided in this application includes a first fixing part 2E, a rotating part 4E, a second fixing part 3E, and at least one flexible circuit board 102. The second fixing part 3E and the first fixing part 2E are respectively located on both sides of the rotating part 4E along the second direction Y, and the first fixing part 2E and the second fixing part 3E can rotate relative to the rotating part 4E. The first fixing part 2E and the second fixing part 3E can be the housing, mid-frame, etc. of the electronic device, or they can be fixing structures independent of the housing or mid-frame. Functional devices can be arranged on the first fixing part 2E and the second fixing part 3E. For a foldable phone, the rotating part 4E can be... Figure 22 At least a portion of the rotating shaft 3 shown, the first fixing part 2E and the second fixing part 3E are rotatably connected to the rotating shaft 3, allowing the first fixing part 2E and the second fixing part 3E to rotate relative to the rotating shaft 3. Exemplarily, the first fixing part 2E and the second fixing part 3E can also be independent structural components, such as metal sheets. The first fixing part 2E and the second fixing part 3E can be mounted on the housing or frame of the electronic device, thereby strengthening the connection and structural strength of the flexible circuit board 102.

[0218] The first fixing part 2E fixes one end of the flexible circuit board to the first middle frame, and the second fixing part 3E fixes the other end of the flexible circuit board to the second middle frame. This can be understood as the first fixing part 2E and the second fixing part 3E overlapping with both ends of the flexible circuit board, respectively. Figure 24A and Figure 24B In the embodiment shown, the first fixing part 2E and the second fixing part 3E cover both ends of the strip hole 11E, and also cover both ends of the flexible circuit board.

[0219] Reference Figure 24BBy providing a strip-shaped hole 11E between the first fixing part 2E and the second fixing part 3E, the strip-shaped hole 11E can divide the portion of the flexible circuit board 102 located between the first fixing part 2E and the second fixing part 3E into multiple transmission segments 13E. This allows each transmission segment 13E to have a small width; for example, the width of each transmission segment 13E in the first direction X can be controlled to within 15mm. Different transmission segments 13E can have the same width or different widths. During the folding process of the electronic device, the smaller width of the transmission segment 13E makes it less prone to twisting.

[0220] Reference Figure 24B Even if there is twisting in the transmission segment 13E, the amount of twisting H2 in the second direction Y can be controlled within 1.5mm due to the small width of the transmission segment 13E. Furthermore, since the two adjacent transmission segments 13E are separated by the strip hole 11E, the states of the two adjacent transmission segments 13E do not affect each other. The small amount of twisting has a negligible impact on the fatigue life of the flexible circuit board 102.

[0221] Figure 25 This is a simulation diagram of the bending life of the flexible circuit board provided in this application, for reference. Figure 25 The flexible circuit board with strip holes has a lifespan of 198,000 cycles.

[0222] Therefore, in this embodiment, by providing a strip-shaped hole 11E on the flexible circuit board 102, the portion of the flexible circuit board 102 located between the first fixing part 2E and the second fixing part 3E can be divided into multiple transmission segments 13E with smaller widths. This can prevent the flexible circuit board 102 from twisting significantly during the folding of the electronic device, thereby improving the service life of the flexible circuit board 102.

[0223] The width of the slot 11E along the first direction X can be greater than or equal to 1 mm, thereby ensuring that the twisting amount of the flexible circuit board 102 is fully absorbed through the slot 11E, ensuring the overall stability of the flexible circuit board 102. Of course, in some other application scenarios, the width of the slot 11E may be less than 1 mm, and this embodiment does not impose any restrictions on this.

[0224] As a specific implementation method, refer to Figure 23 , Figure 24A and Figure 24B The length of the strip hole 11E in the second direction Y is greater than or equal to the distance between the first fixing part 2E and the second fixing part 3E.

[0225] Among them, reference Figure 24A and Figure 24BThe first fixing part 2E can be fixedly connected to the edge of the first middle frame adjacent to the pivot, and the second fixing part 3E can be fixed to the edge of the second middle frame adjacent to the pivot. The first fixing part 2E and the second fixing part 3E are arranged opposite to each other on both sides of the pivot. The inner edge 21E of the first fixing part 2E is the edge of the first fixing part 2E facing the pivot, and the inner edge of the second fixing part 3E is the edge of the second fixing part 3E facing the pivot. The part of the flexible circuit board 102 that is prone to twisting is located at the position where the flexible circuit board 102 is aligned with the inner edge 21E of the first fixing part 2E, and the inner edge 21E of the first fixing part 2E is the edge of the first fixing part 2E facing the side of the second fixing part 3E. Similarly, the part of the flexible circuit board 102 that is prone to twisting is also located at the position where the flexible circuit board 102 is aligned with the inner edge 31E of the second fixing part 3E, and the inner edge 31E of the second fixing part 3E is the edge of the second fixing part 3E facing the side of the first fixing part 2E. In this embodiment, by making the length of the strip hole 11E in the second direction Y greater than or equal to the distance between the first fixing part 2E and the second fixing part 3E, it can be ensured that the end of the strip hole 11E can extend to the inner edge 21E of the first fixing part 2E and the inner edge 31E of the second fixing part 3E. This allows two adjacent transmission segments 13E to be separated by the strip hole 11E at the positions of the inner edge 21E of the first fixing part 2E and the inner edge 31E of the second fixing part 3E. This ensures that each transmission segment 13E has a small width at the position aligned with the inner edge 21E of the first fixing part 2E and the inner edge 31E of the second fixing part 3E, and that each transmission segment 13E does not affect the others. This effectively reduces the amount of twisting and improves the service life of the flexible circuit board 102.

[0226] Figures 22 to 25 All the possible implementations shown can be applied to Figures 4 to 21 The various implementation methods shown are illustrated. In a specific embodiment, the flexible circuit board is passed through the shaft to achieve electrical connection to the devices distributed on both sides of the shaft. However, this method of passing the flexible circuit board through the shaft may cause rattling noise from the flexible circuit board at the shaft location during the folding process of the electronic device. How to solve the abnormal noise generated during the opening and closing of foldable display devices is a pressing problem. To solve the problem of abnormal noise generated by the bendable portion of the flexible circuit board during the large-angle opening and closing of the foldable display device, the problem of abrupt changes in the shape of the bendable portion must first be addressed. Abrupt changes in the shape of the structure can be limited by introducing new structures.

[0227] The flexible circuit board 102 described in the following embodiments can be a specific solution of the electrical connection structure 8 disclosed in the foregoing embodiments. It can also be understood that, in electronic devices, the electrical connection structure 8 includes the flexible circuit board 102.

[0228] Figure 26This is a schematic diagram of an electronic device provided in one embodiment of this application. Figure 26 The horizontal extension direction is the second direction Y (the length direction of the electronic device), and the vertical extension direction is the third direction Z (the thickness direction of the electronic device). See also... Figure 26 In one embodiment, the hinge (or hinge assembly, hinge structure) of the electronic device includes a first door panel 201, a second door panel 202, a third door panel 203, and a hinge structure 205. The electronic device includes a flexible circuit board 102 and a limiting structure 300. The flexible circuit board 102 passes through the hinge, and the limiting structure 300 specifically limits the flexible circuit board 102 at the hinge position, which can solve the problem of abnormal noise generated by the bendable part of the flexible circuit board during the large-angle opening and closing of the folding display device. The first door panel 201 and the third door panel 203 are located on opposite sides of the second door panel 202. The hinge structure 205 is located on one side of the second door panel 202. The hinge structure 205 can be part of the hinge of the electronic device and is directly opposite the second door panel 202. Both the first door panel 201 and the third door panel 203 are rotatably connected to the hinge structure 205. Along the direction from the second door panel 202 to the first door panel 201, the flexible circuit board 102 includes a first fixing part B1 and a bendable first portion A1 connected to the first fixing part. The first fixing part B1 is fixed to the side of the second door panel facing the hinge structure 205. A limiting structure 300 is provided on the side of the flexible circuit board 102 facing the second door panel 202, and the limiting structure 300 covers at least a portion of the bendable first portion A1.

[0229] In one possible implementation, the limiting structure 300 is connected to the second door panel 202 and the flexible circuit board 102. This application does not limit the fixing process of the limiting structure 300 to the second door panel 202 and the flexible circuit board 102. For example, the limiting structure 300 can be directly connected to the second door panel 202 and the flexible circuit board 102 via an adhesive layer. A hot-pressing process can be used, which can be understood as converting the adhesive layer into a semi-solid state with adhesive properties at a certain temperature, thereby bonding the limiting structure 300 to the flexible circuit board 102.

[0230] It is understood that the first fixing part B1 in this embodiment is the part connecting the flexible circuit board 102 and the second door panel 202. Due to the physical properties of the flexible circuit board 102, each segment of the flexible circuit board 102 has bendable characteristics. The bendable part in this embodiment specifically refers to the part that will undergo a sudden change in shape during the opening and closing of the foldable display device. Structurally, the bendable part is usually located in the part of the flexible circuit board 102 that connects to the first fixing part B1. For example, such as... Figure 26 As shown, the bendable portion includes a first bendable portion A1 and a second bendable portion A2.

[0231] During the large-angle opening and closing process of the foldable display device, the bendable part is subjected to an extrusion force pointing towards the rotation center and an elastic force to restore its own shape. The limiting structure 300 exerts a force on the flexible circuit board 102, which can balance the elastic force and extrusion force of the first bendable part A1 of the flexible circuit board 102, limit the deformation of the flexible circuit board 102, effectively suppress the problem of abrupt shape change during the opening and closing of the foldable display device, thereby reducing the problem of abnormal noise generated during the large-angle opening and closing of the foldable display device.

[0232] Figure 27 This is a two-dimensional structural diagram of a foldable display device with an added limiting structure in its unfolded state, according to an embodiment of this application. Figure 27 The direction of the horizontal extension is the second direction Y (the length direction of the electronic device), and the direction of the vertical extension is the third direction Z (the thickness direction of the electronic device). Figure 27 In the embodiment shown, the flexible circuit board 102 is compared to Figure 26 The illustrated implementation is more specific. The flexible circuit board of the electronic device provided in this application includes segmented slots.

[0233] Figure 28A This is a two-dimensional structural diagram of a foldable display device provided in one embodiment of this application from another angle. The sizes of the three limiting structures can be different. Figure 28B yes Figure 28A A schematic diagram of another implementation of the middle limit structure. Figure 28A and Figure 28B In the middle, the direction of horizontal extension is the second direction Y, and the direction of vertical extension is the first direction X (the axis of the rotating shaft 3).

[0234] In one possible implementation, such as Figure 28A As shown, the first bendable portion is in the first direction ( Figure 27 The dimension of the first bendable part in the X direction is S1, and the dimension of the second bendable part in the first direction X is S2. S1 and S2 are not equal. The first limiting structure 301 in the second direction (shown in the X direction) Figure 27 The dimension in the Y direction is h1, and the dimension of the second limiting structure 302 in the second direction is h2. h1 and h2 are not equal. The first direction X is parallel to the length direction of the hinge structure (the first direction is also the axial direction), and the second direction Y is parallel to the arrangement direction of the first door panel, the second door panel, and the third door panel.

[0235] The dimension in the first direction X is defined as the width, and the dimension in the second direction Y is defined as the length. When the widths of the two flexible circuit boards on either side of the segmented slot are different, the shape changes of the two flexible circuit boards during the opening and closing process of the foldable display device will also be different. Moreover, the narrower the flexible circuit board, the greater the elastic force or extrusion force generated during the opening and closing process of the foldable display device, and the longer the limiting structure required.

[0236] In one possible implementation, combining Figure 27 and Figure 28B The first segment 102a includes a first bendable portion A11, the second segment 102b includes a first bendable portion A12, and the third segment 102c includes a first bendable portion A13. The limiting structure 300 includes a first limiting structure 301, a second limiting structure 302, and a third limiting structure 303. The first limiting structure 301 includes a first block 3011 and a second block 3012, the second limiting structure 302 includes a third block 3021 and a fourth block 3022, and the third limiting structure 303 includes a fifth block 3031 and a sixth block 3032. The first block 3011 covers at least a portion of the first bendable portion A11, the third block 3021 covers at least a portion of the first bendable portion A12, and the fifth block 3031 covers at least a portion of the first bendable portion A13. The first bendable portion A11 is in a first direction ( Figure 28A The dimension of the first bendable part in the X direction is S1, the dimension of the second segment in the first direction is S2, and the dimension of the third segment in the first bendable part in the first direction is S3. The first block 3011 in the second direction (… Figure 28A The dimension of the first block (3012) in the Y direction is h11, the dimension of the second block (3012) in the second direction is h21, and the dimension of the third block (3021) in the second direction is h31. Since S1 < S2 < S3, h11 > h21 > h31.

[0237] In one possible implementation, when the flexible circuit board is a multilayer flexible circuit board, each layer of the flexible circuit board has a flexible substrate. For example, the multilayer flexible circuit board includes two layers stacked together. The inner layer is a first layer, including a first flexible substrate. The outer layer is a second layer, including a second flexible substrate. Ignoring other layers within the flexible circuit board, the first and second flexible substrates are stacked, and in position, the first flexible substrate is closer to the second door panel than the second flexible substrate. For example, the inner layer is adjacent to the door panel, and the outer layer is farther from the door panel.

[0238] In other examples, the elastic modulus of the first flexible substrate of the bendable portion is equal to the elastic modulus of the second flexible substrate.

[0239] In other examples, the elastic modulus of the first flexible substrate of the bendable portion is less than that of the second flexible substrate.

[0240] In other words, the inner layer uses a first flexible substrate with a lower elastic modulus, while the other layers use a second flexible substrate with a higher elastic modulus. For example, the elastic modulus of the first flexible substrate is less than 4 GPa, and the elastic modulus of the second flexible substrate is greater than 6 GPa. This means the stiffness of the inner layer is lower than that of the other layers, which reduces the probability of abrupt changes in the shape of the inner layer, thereby reducing the probability of abrupt changes in the shape of the flexible circuit board and the probability of abnormal noises during the opening and closing of the foldable display device.

[0241] For example, a multilayer flexible circuit board includes three layers: an inner layer, a middle layer, and an outer layer. For instance, the inner layer is adjacent to a door panel, and the outer layer is away from the door panel. The inner layer uses a first flexible substrate with an elastic modulus of 3 GPa. The middle and outer layers use a second flexible substrate with an elastic modulus of 6.5 GPa.

[0242] In one possible implementation, the flexible circuit board further includes a third flexible substrate, with the second flexible substrate located between the first and third flexible substrates. The elastic modulus of the second flexible substrate in the bendable portion is less than or equal to the elastic modulus of the third flexible substrate.

[0243] In other words, the inner layer uses a first flexible substrate with a low elastic modulus, the middle layer uses a second flexible substrate with a high elastic modulus, and the outer layer uses a third flexible substrate. For example, the elastic modulus of the first flexible substrate is less than 4 GPa, the elastic modulus of the second flexible substrate is greater than 4 GPa and less than 6 GPa, and the elastic modulus of the third flexible substrate is greater than 6 GPa.

[0244] In this way, the stiffness of the inner layer is less than that of the middle and outer layers, and the stiffness of the middle layer is less than that of the outer layer. The stiffness of different layers of the flexible circuit board adopts a gradient distribution. This can reduce the probability of abrupt changes in the shape of the inner layer, thereby reducing the probability of abrupt changes in the shape of the flexible circuit board and the probability of abnormal noises during the opening and closing of the foldable display device.

[0245] For example, a multilayer flexible circuit board has three layers: an inner layer, a middle layer, and an outer layer. For instance, the inner layer is adjacent to the door panel, and the outer layer is away from the door panel. The inner layer uses a first flexible substrate with an elastic modulus of 3 GPa. The middle layer uses a second flexible substrate with an elastic modulus of 5 GPa. The outer layer uses a third flexible substrate with an elastic modulus of 6.5 GPa.

[0246] For example, a multilayer flexible circuit board has four layers: an inner layer, a first middle layer, a second middle layer, and an outer layer. The inner layer uses a first flexible substrate with an elastic modulus of 3 GPa. The first and second middle layers both use a second flexible substrate with an elastic modulus of 5 GPa. The outer layer uses a third flexible substrate with an elastic modulus of 6.5 GPa.

[0247] Figures 26 to 28B The embodiments described can be applied to Figures 4 to 25In any of the possible implementations shown. Figures 26 to 28B The embodiment described above addresses the issue of abnormal noise caused by the abrupt change in the shape of the flexible circuit board during the large-angle opening and closing of a foldable display device. It provides a specific structural design for the flexible circuit board of the foldable display device, solving the problems of abrupt change in the shape of the bendable part of the flexible circuit board and abnormal noise generated during the large-angle opening and closing process.

[0248] Figure 29 This is a schematic diagram of a partial structure of an electronic device provided in one embodiment of this application. Figure 29 The specific antenna configuration within the electronic device 100 involves mounting a portion of the antenna radiator on a support (such as the acoustic cavity housing of an audio module), and mounting the other portion on a rear cover. The antenna signal is transmitted through coupling between these two radiators. The antenna radiator faces the fan's exhaust channel without obstructing it, ensuring efficient heat dissipation and facilitating a slimmer design for the electronic device.

[0249] See Figure 29 In one embodiment, the electronic device includes a mid-frame F1, a support F7, a circuit board F8, a first antenna sub-part 91, and a second antenna sub-part 92. An inner cavity F4 and an air duct F5 are formed between the rear cover and the mid-frame F1. Both the circuit board F8 and the support F7 are mounted in the inner cavity F4. The first antenna sub-part 91 is fixed to the side of the support F7 facing the rear cover and electrically connected to the circuit board F8. In one embodiment, the circuit board F8 has a radio frequency (RF) chip, which is electrically connected to the first antenna sub-part 91 via an RF cable to power the first antenna sub-part 91. The second antenna sub-part 92 is fixed to the surface of the rear cover facing the mid-frame F1, and can be a patch structure attached to the inner surface of the rear cover. The area of ​​the rear cover used to mount the second antenna sub-part is a non-signal shielding area, i.e., an insulating material, allowing signals to pass through. The non-signal shielding area can be made of a non-conductive material, such as fiberglass, ceramic, or plastic. The first and second sub-sections of the antenna are coupled together to transmit electromagnetic wave signals, and together they constitute the radiator of the antenna.

[0250] In this design, the second sub-unit of the antenna is at least partially located on the inner surface of the rear cover and can transmit signals through the rear cover. The antenna radiator is housed within the rear cover, ensuring that the second sub-unit does not occupy the space of the air duct F5, thus guaranteeing the airflow area of ​​the fan F6 exhaust channel. Therefore, this design not only ensures the antenna's heat dissipation performance, but the air duct F5 also provides a clear environment for the antenna, contributing to its performance. Consequently, this design also guarantees the antenna's radiation performance, resulting in a superior bandwidth and radiation efficiency.

[0251] In one embodiment, a power supply circuit is provided on the circuit board F8, which can power the first sub-section 91 of the antenna.

[0252] In some possible implementations, the second sub-section 92 of the antenna is a flexible printed circuit board or a metal component. In this case, the structure of the second sub-section of the antenna is simple and easy to implement.

[0253] In some possible implementations, the second sub-part 92 of the antenna is a conductive heat sink. For example, the second sub-part 92 can be a graphite sheet, which is easy to cut, better meets heat dissipation and antenna design requirements, and is low in cost. The graphite sheet can be assembled and fixed to the back cover by means of bonding or other methods. The graphite sheet is designed in the shape of an antenna radiator to ensure that its electrical length meets the antenna radiation requirements. In this embodiment, the electronic device reuses the heat sink as the second sub-part of the antenna. This not only retains the heat dissipation function of the heat sink, but also allows the air duct F5 to remove heat from the heat sink, thereby removing heat from other components in the electronic device that are thermally connected to the heat sink, ensuring the heat dissipation performance of the electronic device. Furthermore, the antenna performance of the electronic device can be improved without adding additional structural components, making it easy to implement and low in cost.

[0254] In some embodiments, the second sub-part 92 of the antenna may include a first part 921 and a second part 922. The second part 922 is connected to the first part 921. The first part 921 is positioned facing the air duct F5. Along the thickness direction of the electronic device, the second part 922 faces the first sub-part 91 of the antenna on the support member F7. This facing design facilitates a suitable spacing and is beneficial for signal coupling. The area of ​​the first part 921 is larger than the area of ​​the second part 922. The facing of the second part 922 and the first sub-part 91 can be understood as follows: the vertical projection of the second part 922 onto the plane where the first sub-part 91 is located at least partially covers the first sub-part 91 of the antenna, or the vertical projection of the second part 922 onto the plane where the first sub-part 91 is located and the first sub-part 91 of the antenna have at least a partially overlapping area. This ensures that the spacing between them meets the requirements for electromagnetic wave signal coupling.

[0255] Figure 29 The described implementation method can also be applied to Figures 4 to 28B Any of the possible implementations provided.

[0256] For example, with Figure 3 The illustrated embodiment is an example. Figure 3In the illustrated embodiment, an air duct is provided between the fan 52 and the air outlet 13. An audio module is provided between the first circuit board 42 and the frame of the electronic device. The audio module includes a sound cavity shell and an audio device (e.g., a speaker) disposed within the sound cavity shell. The sound cavity shell is made of insulating material. The sound cavity shell can be a support member, on which a first sub-part of an antenna is disposed. The first sub-part of the antenna has a metal patch structure and can be attached to the support member or integrally formed with the support member. A second sub-part 92 of the antenna is attached to the inner surface of the back cover of the electronic device. The second part of the second sub-part of the antenna is directly opposite the first sub-part of the antenna, and the distance between them meets the requirements for electromagnetic wave signal coupling.

[0257] In summary, firstly, embodiments of this application provide an electronic device that effectively reduces the thickness of the electronic device while ensuring its high performance by arranging components of different load levels and heights on opposite sides of a hinge according to their respective heat dissipation requirements. Specifically, this application places the motherboard and its first heat source in the first middle frame, and the power management module (or charging management module) as the second heat source in the second middle frame, achieving a better spatial layout that facilitates the thinning of the electronic device.

[0258] Secondly, the embodiments of this application achieve the thinning of electronic devices by using an assembly structure of a fan and a mid-frame, embedding the fan into the mid-frame through a through hole, and supporting the fan with a reinforcing plate.

[0259] Thirdly, this application segments a large flexible circuit board by setting strip holes on the flexible circuit board. Specifically, the portion of the flexible circuit board located between the first fixing part and the second fixing part can be divided into multiple transmission segments with smaller widths, thereby avoiding large twisting of the flexible circuit board during bending and thus improving the service life of the flexible circuit board.

[0260] Fourthly, the specific embodiments of this application solve the problem of abnormal noise in the flexible circuit board through-shaft scheme by setting a limiting structure at the pivot position. The limiting structure can improve the mechanical performance of the flexible circuit board and limit the abrupt changes in the shape of the flexible circuit board, effectively suppressing the problem of abrupt changes in shape during the opening and closing of the folding display device, and further reducing the problem of abnormal noise generated during the opening and closing of the folding display device.

[0261] Fifthly, this application sets a portion of the antenna patch structure (i.e., the second sub-part of the antenna) at the air outlet of the fan, and uses a support component of the motherboard accessory (such as the insulating shell in the audio module) to mount another portion of the antenna patch structure (i.e., the first sub-part of the antenna) and feeds the second portion of the antenna patch structure. The antenna radiation performance is achieved through the coupling between the two patch structures. A portion of the antenna patch structure is set on the inner surface of the back cover of the electronic device and faces the air outlet, so that the antenna structure does not occupy the air outlet and ensures heat dissipation efficiency.

[0262] The improvements mentioned above together constitute the ultra-thin and high-performance characteristics of electronic devices. Any of the different aspects mentioned above can be combined or implemented independently.

[0263] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: A first middle frame, a second middle frame, a hinge, and a screen, wherein the hinge connects the first middle frame and the second middle frame so that the first middle frame and the second middle frame can be opened or closed relative to each other; the screen covers the first middle frame, the hinge, and the second middle frame; A first device module and a first heat dissipation component are disposed in the internal space of the electronic device where the first middle frame is located. The first heat dissipation component is used to actively dissipate heat from the first heat source in the first device module. The second device module, the second heat dissipation component, and the battery are disposed in the internal space of the electronic device where the second middle frame is located. The second heat dissipation component is used to passively dissipate heat from the second heat source in the second device module. The power of the first heat source is greater than the power of the second heat source. The maximum dimension of the first heat source along the thickness direction of the electronic device is smaller than the maximum dimension of the second heat source along the thickness direction of the electronic device. The second heat dissipation component includes a heat sink and a heat-conducting structure. The second device module includes a second circuit board and a second heat source. The second heat source is disposed on the second circuit board. The heat sink is located on the side of the second heat source away from the second circuit board. Part of the heat-conducting structure is located between the heat sink and the back cover of the electronic device. Part of the heat-conducting structure and the rotating shaft are stacked together to transfer the heat of the second heat source to the rotating shaft through the heat-conducting structure.

2. The electronic device of claim 1, wherein, The second device module is located between the battery and the rotating shaft.

3. The electronic device of claim 1, wherein, The nearest distance between the heating center of the second heat source and the edge of the rotating shaft is less than or equal to 5 cm.

4. The electronic device of claim 3, wherein, The edge of the pivot is the edge of the door panel of the pivot corresponding to the second middle frame, adjacent to the second heat source.

5. The electronic device of claim 1 or 2, wherein, The second circuit board and the second middle frame are connected by a thermally conductive medium. The screen of the electronic device is disposed on the side of the second middle frame away from the second circuit board. The thermally conductive structure is located between the heat sink and the back cover of the electronic device.

6. The electronic device of claim 1 or 2, wherein, The electronic device further includes a charging interface located on the second side of the second frame, with the second circuit board adjacent to the second side. The charging interface and the second circuit board are electrically connected, and the extension direction of the second side is perpendicular to the axis of rotation.

7. The electronic device of any of claims 1-3, wherein, The electronic device also includes a bracket and a bracket pivot. The bracket and the bracket pivot are disposed in the second middle frame and located between the battery and the pivot. The bracket is connected to the bracket pivot and can be rotated. The second device module and the bracket are distributed on both sides of the bracket pivot.

8. The electronic device of claim 7, wherein, The electronic device further includes a third device module. The maximum dimension of the third device module along the thickness direction of the electronic device is smaller than the maximum dimension of the first device module along the thickness direction of the electronic device. The third device module and the bracket are stacked along the thickness direction of the electronic device.

9. The electronic device of claim 8, wherein, The third device module includes a third circuit board and electronic devices disposed on the third circuit board. The third circuit board is connected to the second middle frame. A support structure is provided between the electronic devices and the bracket. The support structure and the second middle frame together surround the third device module.

10. The electronic device of claim 9, wherein, A shielding structure is also provided between the electronic device and the bracket. The shielding structure is connected to the support structure. The support structure, the shielding structure, and the bracket are stacked sequentially along the thickness direction of the electronic device.

11. The electronic device of claim 9, wherein, The electronic components on the third circuit board include at least one of capacitors, resistors, and inductors.

12. The electronic device according to claim 1 or 2, characterized in that, The first heat source includes at least one of a CPU module and a power supply module; or The second heat source includes at least one of the following: a charging management module, a DDR module, an RF chip, an audio PA, a speaker management module, a screen Tcon, and a screen management module.

13. The electronic device according to claim 1 or 2, characterized in that, The first heat dissipation component includes a heat spreader and a fan. The heat spreader is used to conduct heat from the first heat source to the fan. The first device module includes a first circuit board and the first heat source. Along the thickness direction of the electronic device, the first heat source is located between the first circuit board and the heat spreader. There is a first gap between the first circuit board and the first mid-frame. There is a second gap between the heat spreader and the back cover of the electronic device. The screen of the electronic device is disposed on the side of the first mid-frame away from the first circuit board.

14. The electronic device of claim 13, wherein, The first heat dissipation component includes a heat sink and a thermal pad. Along the thickness direction of the electronic device, the first circuit board, the first heat source, the thermal pad, the heat sink, and the heat spreader are stacked in sequence.

15. The electronic device of claim 14, wherein, The first middle frame is stacked between the back cover and the screen of the electronic device. The first middle frame includes a bottom wall and a rib that are fixedly connected. The bottom wall is provided with a through hole. The rib is located outside the through hole. The rib protrudes from the bottom wall along the thickness direction of the electronic device and toward the back cover. The first heat dissipation component is installed on the rib. At least a portion of the heat dissipation component is located in the through hole.

16. The electronic device of claim 15, wherein, The electronic device further includes a reinforcing member, which is fixed to the bottom wall at the end away from the rib and covers the through hole.

17. The electronic device of claim 16, wherein, The bottom wall has a recessed mounting groove on the surface opposite to the rear cover, and the reinforcing member is fixed in the mounting groove.

18. The electronic device of claim 15, wherein, The heat dissipation assembly includes a fan housing and a fan rotation mechanism. The fan housing includes an upper cover, a lower cover, and a side panel. The upper cover, the lower cover, and the side panel together form an accommodating space. The fan rotation mechanism is installed in the accommodating space. The upper cover is provided with an air inlet, and the side panel is provided with an air outlet. The air inlet and the air outlet are respectively connected to the accommodating space.

19. The electronic device of claim 18, wherein, An air intake channel is provided between the upper cover of the fan housing and the rear cover of the electronic device, and the air intake channel is connected to the air intake hole.

20. The electronic device of claim 18, wherein, At least a portion of the ribs are arranged around the through hole, and the sidewall of the fan housing is fixedly connected to the ribs.

21. The electronic device according to claim 18, characterized in that, The upper cover includes an upper cover guide portion, and the lower cover includes a lower cover guide portion. The upper cover guide portion and the lower cover guide portion are disposed opposite to each other along the thickness direction of the electronic device.

22. The electronic device according to claim 21, characterized in that, The lower cover also includes a lower cover body, the lower cover guide portion is connected to the lower cover body, and is inclined relative to the lower cover body toward the direction of the upper cover; And / or, the upper cover further includes an upper cover body, the upper cover guide portion being connected to the upper cover body and inclined relative to the upper cover body in a direction away from the lower cover.

23. The electronic device of claim 22, wherein, The lower cover guide portion and the lower cover body have an included angle α, which satisfies: 90°≤α≤170°.

24. The electronic device according to claim 22, characterized in that, The top cover also includes a top cover reinforcement portion, at least a portion of the top cover body is connected to the top cover reinforcement portion, and the top cover reinforcement portion protrudes relative to the top cover body in the direction toward the rear cover of the electronic device.

25. The electronic device of claim 24, wherein, The upper cover body is provided with a connecting part, which is connected to the upper cover reinforcement part. Along the width direction of the heat dissipation component, both ends of the upper cover body are provided with the connecting part, and the two connecting parts are respectively fixedly connected to the protruding rib.

26. The electronic device of claim 18, wherein, The edge of the lower cover includes a flat plate structure, which is close to the air outlet of the fan. The edge area of ​​the bottom wall of the first middle frame is adjacent to the air outlet and the edge of the lower cover. The edge area includes a guide slope, which extends obliquely relative to the flat plate structure. The guide slope is used to guide the air in the receiving space of the fan housing from the air outlet to the outside of the housing.

27. The electronic device of claim 26, wherein, The upper cover of the fan housing has an air guiding structure near the edge of the air outlet. The air guiding structure includes a first part, a second part, and a third part connected in sequence. The second part extends at an angle relative to the first part. The diameter of the air outlet corresponding to the third part is larger than the diameter of the air outlet corresponding to the second part. The diameter of the air outlet corresponding to the second part is gradually expanding.

28. The electronic device of claim 27, wherein, The first portion is parallel to the surface of the flat plate structure of the lower cover, and the second portion is tilted at the same angle as the air guide slope is tilted at the same angle as the flat plate structure.

29. The electronic device of any of claims 18-28, wherein, The electronic device also includes a flexible circuit board, and a groove is provided at the end of the lower cover away from the fan rotation mechanism, and at least a portion of the flexible circuit board is installed in the groove.

30. The electronic device of claim 1 or 2, wherein, The heat sink is at least one of the following: a metal plate, a heat sink structure with heat dissipation fins, a heat spreader, or a combination of a metal plate and a heat pipe; or, the heat-conducting structure is a graphite sheet.

31. The electronic device of claim 1 or 2, wherein, The electronic device further includes an electrical connection structure that passes through or across the pivot and is electrically connected between the first device module and the second device module.

32. The electronic device of claim 31, wherein, The electrical connection structure includes at least one flexible circuit board, with its two ends connected to the first middle frame and the second middle frame, respectively. At least a portion of the flexible circuit board located between the first middle frame and the second middle frame is connected to the rotating shaft. The flexible circuit board is provided with at least one strip hole, which extends along a second direction, and at least a portion of the strip hole is located between the first middle frame and the second middle frame. The second direction is perpendicular to the axial direction of the rotating shaft.

33. The electronic device of claim 32, wherein, The flexible circuit board is divided into multiple transmission segments by the strip-shaped holes. The multiple transmission segments are portions of the flexible circuit board located between the first middle frame and the second middle frame. At least some of the multiple transmission segments have different widths along the axial direction of the rotation axis.

34. The electronic device of claim 31, wherein, The pivot includes a first door panel, a second door panel, a third door panel, and a hinge structure. The first door panel and the third door panel are located on opposite sides of the second door panel. The hinge structure faces the second door panel, and both the first door panel and the third door panel are rotatably connected to the hinge structure. The electrical connection structure includes a flexible circuit board, with both ends of the flexible circuit board fixed to the first middle frame and the second middle frame, respectively. The electronic device also includes a limiting structure located on the side of the flexible circuit board facing the second door panel, and the limiting structure covers at least a portion of the bendable portion of the flexible circuit board.

35. The electronic device of claim 34, wherein, The flexible circuit board includes a first flexible substrate and a second flexible substrate stacked together, wherein the first flexible substrate is closer to the second door panel than the second flexible substrate. The elastic modulus of the first flexible substrate of the bendable portion is less than that of the second flexible substrate.

36. The electronic device of claim 13, wherein, The electronic device further includes a support, a first antenna sub-part, and a second antenna sub-part, all of which are disposed within the internal space of the electronic device where the first middle frame is located. An inner cavity and an air duct are formed between the rear cover of the electronic device and the first middle frame. The support and the first circuit board are both installed in the inner cavity. The first antenna sub-part is fixed to the side of the support facing the rear cover and is electrically connected to the first circuit board to power the first antenna sub-part. The second antenna sub-part is fixed to the surface of the rear cover facing the middle frame. The area of ​​the rear cover directly opposite the second antenna sub-part is a non-signal shielding area. The first antenna sub-part and the second antenna sub-part transmit antenna signals through coupling.

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