Embedded element circuit board and manufacturing method thereof

Abstract

The invention provides an embedded component circuit board and a manufacturing method thereof. The embedded component circuit board comprises a circuit substrate, a conductive structure, an electronic component and a thermoplastic insulating layer. The conductive structure is arranged in the circuit substrate and electrically connected to the circuit substrate, and the conductive structure is provided with a groove. The electronic component is disposed in the recess of the conductive structure and electrically connected to the conductive structure. The thermoplastic insulating layer covers the electronic element and the inner wall of the groove, and the surface of the thermoplastic insulating layer is flush with the surface of the circuit substrate. The thermal deformation temperature of the thermoplastic insulating layer ranges from 376 DEG C to 410 DEG C. Therefore, the thermoplastic insulating layer cannot deform due to heating, and can resist thermal stress caused by temperature rise when the circuit board is processed or operated.

Description

Technical Field

[0001] This invention relates to a circuit board, and more particularly to a circuit board with embedded components. Background Technology

[0002] In current silicon carbide (SiC) power modules, electronic components (e.g., bare dies or wafers) are mostly electrically connected to the internal circuitry layers via wire bonding. However, since most SiC power modules require high-frequency switching, the parasitic inductance caused by wire bonding becomes more severe, thus affecting the power module's performance. To improve parasitic inductance, power modules with embedded electronic components within the circuit board have been developed. However, embedding electronic components within the circuit board reduces the power module's heat dissipation rate. Therefore, when the heat generated by the electronic components raises the power module's temperature, the insulating layer surrounding the electronic components is easily damaged by the heat, further affecting the power module's performance. Summary of the Invention

[0003] Therefore, the present invention provides a circuit board with embedded components to improve the operating performance of the circuit board.

[0004] At least one embodiment of the present invention also provides a method for manufacturing the above-mentioned embedded component circuit board.

[0005] At least one embodiment of the present invention provides an embedded component circuit board, comprising a circuit board substrate, a conductive structure, electronic components, and a thermoplastic insulating layer. The conductive structure is disposed within the circuit board substrate and electrically connected to the circuit board substrate, and the conductive structure has a groove. The electronic component is disposed within the groove of the conductive structure and electrically connected to the conductive structure. The thermoplastic insulating layer covers the electronic component and the inner wall of the groove, and a first surface of the thermoplastic insulating layer is flush with a second surface of the circuit board substrate. The heat distortion temperature range of the thermoplastic insulating layer is between 376°C and 410°C.

[0006] In at least one embodiment of the present invention, the thickness of the thermoplastic insulating layer is greater than 10 μm.

[0007] In at least one embodiment of the present invention, the embedded component circuit board further includes two circuit layer structures. A circuit board is disposed between the circuit layer structures and electrically connected to the circuit board, and one of the circuit layer structures includes an insulating layer and a circuit layer. The insulating layer is disposed on the circuit board and covers a thermoplastic insulating layer. The circuit layer is disposed on the insulating layer, and the insulating layer is located between the circuit layer and the thermoplastic insulating layer.

[0008] In at least one embodiment of the present invention, the embedded component circuit board further includes a thermally conductive insulating layer. The thermally conductive insulating layer is disposed on the circuit board substrate. A conductive structure is located between the thermally conductive insulating layer and a second surface of the circuit board substrate.

[0009] In at least one embodiment of the present invention, the embedded component circuit board further includes an insulating material. The insulating material is disposed on the conductive structure and distributed between the conductive structure and the circuit board. The end face of the insulating material is flush with the second surface of the circuit board.

[0010] In at least one embodiment of the present invention, the embedded component circuit board further includes a metal sintered layer. The metal sintered layer is disposed on the conductive structure and located between the conductive structure and the electronic component.

[0011] The present invention also provides a method for manufacturing an embedded component circuit board, comprising providing a conductive structure having a groove; disposing an electronic component within the groove of the conductive structure; after disposing the electronic component within the groove, disposing a thermoplastic insulating layer on the conductive structure such that the thermoplastic insulating layer covers the electronic component and the groove, and the heat distortion temperature range of the thermoplastic insulating layer falls between 376°C and 410°C; providing an initial circuit board; after disposing the thermoplastic insulating layer on the conductive structure, disposing the conductive structure within the initial circuit board, wherein a first surface of the thermoplastic insulating layer is exposed on a second surface of the initial circuit board, and the first surface and the second surface are flush; and after disposing the conductive structure within the initial circuit board, patterning a first metal layer of the initial circuit board to form a circuit layer, and causing the initial circuit board to form a circuit board.

[0012] In at least one embodiment of the present invention, the method of manufacturing an embedded component circuit board further includes: attaching at least one insulating substrate to two opposing third surfaces of a circuit substrate to form two insulating layers, the circuit substrate being located between the insulating layers, and one of the insulating layers covering the electronic component and the recess; attaching second metal layers to the insulating layers, each insulating layer being located between one of the second metal layers and the circuit substrate; and after attaching the second metal layers to the insulating layers, patterning the second metal layers so that each second metal layer forms a second circuit layer electrically connected to the electronic component.

[0013] In at least one embodiment of the present invention, the method of manufacturing an embedded component circuit board further includes attaching a thermally conductive insulating layer to one of the second circuit layers of a circuit substrate. A conductive structure is located between the thermally conductive insulating layer and the thermoplastic insulating layer.

[0014] In at least one embodiment of the present invention, the provision of a conductive structure within an initial circuit substrate includes removing a portion of the initial circuit substrate to form an opening on the initial circuit substrate, the opening communicating with opposite sides of the initial circuit substrate; a bonding material is provided on a second surface of the initial circuit substrate, the bonding material covering the opening; after providing the bonding material, a conductive structure, electronic components, and a thermoplastic insulating layer are provided within the opening, the thermoplastic insulating layer being adhered to the bonding material, and a recessed surface of the conductive structure being provided within the opening opposite to the bonding material; after providing the conductive structure, electronic components, and thermoplastic insulating layer within the opening, an insulating material is provided within the opening such that the insulating material is distributed between the conductive structure and the initial circuit substrate; after providing the insulating material, the bonding material is removed to expose the thermoplastic insulating layer.

[0015] Based on the above, at least one embodiment of the present invention provides a thermoplastic insulating layer covering the surface of the electronic component and the conductive structure on the groove of the electronic component and the conductive structure. Since this thermoplastic insulating layer has a heat distortion temperature in the range of 376°C to 410°C, the thermoplastic insulating layer will not deform due to heat when the temperature of the thermoplastic insulating layer is raised by the heat generated by the electronic component. In this way, the covering of the electronic component by the thermoplastic insulating layer can be prevented from being damaged, thus providing sufficient insulation for the electronic component and helping to improve the operating performance of the circuit board with embedded electronic components. Attached Figure Description

[0016] The nature of the invention can be understood from the following detailed description and accompanying drawings. It should be noted that many features are not drawn to industry-standard scale. In fact, for clarity of discussion, the dimensions of various features may be arbitrarily increased or decreased.

[0017] Figure 1 A cross-sectional view of an embedded component circuit board according to at least one embodiment of the present invention is provided.

[0018] Figures 2A to 2B A cross-sectional view illustrating a method for manufacturing an embedded component circuit board according to at least one embodiment of the present invention.

[0019] Figures 3A to 3F A cross-sectional view illustrating a method for manufacturing an embedded component circuit board according to at least one embodiment of the present invention. Detailed Implementation

[0020] The present invention will be described in detail with reference to the following embodiments. It should be noted that the following description of the embodiments of the present invention is for illustrative purposes only and is not intended to disclose all embodiments exhaustively or to limit the specific embodiments of the invention. For example, the phrase "a first feature is formed on a second feature" in the description includes various implementations, encompassing both direct contact between the first and second features and additional features formed between the first and second features so that they are not in direct contact. Furthermore, the same element symbols used in the drawings and specification will, as far as possible, represent the same or similar elements.

[0021] Spatially relative terms, such as "lower," "below," "below," "above," and "above," are used here to simply describe the relationship between an element or feature as shown in the figure and another element or feature. These spatially relative terms cover not only the orientation depicted in the figure but also different orientations when using or operating the device. Furthermore, when the element is rotatable (rotating 90 degrees or other angles), the spatially relative descriptive terms used here can also be interpreted accordingly.

[0022] Furthermore, when using terms such as "approximately" or "about" to describe numbers or ranges, the term is intended to encompass numbers within a reasonable range and takes into account the natural differences that would be understood by those skilled in the art during the manufacturing process. A range of numbers encompasses a reasonable range including the described number; for example, within + / - 10% of the described number is based on known manufacturing tolerances that relate to the characteristics of the manufacturing feature. For instance, a material layer with a thickness of "approximately 5 nanometers" can cover a size range from 4.25 nanometers to 5.75 nanometers, where a manufacturing tolerance of + / - 15% for depositing the material layer is known to those skilled in the art. Moreover, reference numerals and / or designations may be repeated in various examples. This repetition is for simplicity and clarity and is not intended to indicate any relationship between the various embodiments and / or configurations discussed herein.

[0023] This invention provides a circuit board 100 with embedded components. Please refer to [reference needed]. Figure 1 The embedded component circuit board 100 includes a circuit board 120, a conductive structure 140, electronic components 160, and a thermoplastic insulating layer 180. The conductive structure 140 is disposed within the circuit board 120 and electrically connected to the circuit board 120. The circuit board 120 includes an insulating layer 122 and circuit layers 124a and 124b located on opposite sides of the insulating layer 122.

[0024] The conductive structure 140 has a recess 142, the opening of which faces one side of the circuit board 120. More specifically, the opening of the recess 142 faces the side of the circuit board 120 where the circuit layer 124a is provided. The conductive structure 140 can be a conductive element such as a copper block or a lead frame. Although each conductive structure 140 in this embodiment has only one recess 142, the invention is not limited thereto. In other embodiments, each conductive structure 140 may also have more than one recess 142, for example, two recesses 142.

[0025] Electronic component 160 is disposed within a recess 142 of conductive structure 140 and electrically connected to conductive structure 140. Electronic component 160 may be an unpackaged die, but the invention is not limited thereto. In other embodiments, electronic component 160 may also be a packaged chip. Electronic component 160 may further include a circuit layer 162 disposed on a plane 160f of electronic component 160. This circuit layer 162 includes a gate region 162g and a source region 162s. Furthermore, although not shown in the figures, circuit layer 162 also includes a drain region, and the pads (not shown) of the gate, source, and drain are all covered by a thermoplastic insulating layer 180.

[0026] Although only one electronic component 160 is provided in each groove 142 in this embodiment, the present invention is not limited thereto. In other embodiments, more than one electronic component 160 may be provided in each groove 142, for example, two electronic components 160. Furthermore, although... Figure 1 The embedded component circuit board 100 in this embodiment contains only two conductive structures 140, but the present invention is not limited thereto. In other embodiments, the embedded component circuit board 100 may also contain any number of conductive structures 140, such as one conductive structure 140 or three conductive structures 140.

[0027] The thermoplastic insulating layer 180 covers the electronic component 160 and the inner wall of the recess 142, and the surface 180s of the thermoplastic insulating layer 180 is flush with the surface 120f of the circuit board 120. Furthermore, the thermoplastic insulating layer 180 may also cover the surface 140s outside the recess 142 of the conductive structure 140. Notably, the material of the thermoplastic insulating layer 180 may include, for example, polyimide (PI), epoxy resin, inorganic fillers, or similar heat-resistant insulating materials, and the heat distortion temperature range of the thermoplastic insulating layer 180 falls between 376°C and 410°C.

[0028] Therefore, when the heat generated by the electronic component 160 raises the temperature of the thermoplastic insulating layer 180 to approximately 200°C to 250°C, the thermoplastic insulating layer 180 will not deform due to heat, thereby preventing damage to the coating of the electronic component 160 by the thermoplastic insulating layer 180. This reduces the likelihood of the temperature rise affecting the insulation effect of the thermoplastic insulating layer 180 on the electronic component 160. Furthermore, in this embodiment, the thickness of the thermoplastic insulating layer 180 can be greater than 10 μm, thereby improving the insulation effect on the electronic component 160.

[0029] The embedded component circuit board 100 also includes a metal sintered layer 110, which is disposed on the conductive structure 140 and located between the conductive structure 140 and the electronic component 160. In other words, the electronic component 160 is connected to the conductive structure 140 through the metal sintered layer 110. Notably, the metal sintered layer 110 may contain a metal material with a high thermal conductivity, such as silver, to improve the efficiency of heat conduction from the electronic component 160 to the conductive structure 140.

[0030] The embedded component circuit board 100 further includes a circuit layer structure 130a and a circuit layer structure 130b. The circuit layer structure 130a is located on the circuit layer 124a of the circuit substrate 120, and the circuit layer structure 130b is located on the circuit layer 124b of the circuit substrate 120. The circuit substrate 120 is disposed between the circuit layer structures 130a and 130b, and the circuit layer structures 130a and 130b are electrically connected to the circuit substrate 120. Each of these circuit layer structures 130a and 130b includes at least one insulating layer and at least one circuit layer.

[0031] In detail, the circuit layer structure 130a includes two insulating layers 132a and two circuit layers 134a. The lower insulating layer 132a is disposed on the circuit layer 124a of the circuit substrate 120 and covers the thermoplastic insulating layer 180. The lower circuit layer 134a is disposed on the lower insulating layer 132a and is located between the lower circuit layer 134a and the thermoplastic insulating layer 180. The upper insulating layer 132a and the upper circuit layer 134a are sequentially disposed on the lower circuit layer 134a, and the two circuit layers 134a are electrically connected to each other through a plurality of conductive vias 136a. In addition, the circuit layer 134a in the circuit layer structure 130a can be electrically connected to the gate region 162g and the source region 162s of the circuit layer 162 of the electronic component 160 through the plurality of conductive vias 136a.

[0032] On the other hand, the circuit layer structure 130b includes an insulating layer 132b and a circuit layer 134b, with the insulating layer 132b disposed on the circuit layer 124b of the circuit substrate 120. The circuit layer 134b is disposed on the insulating layer 132b, and the insulating layer 132b is located between the circuit layer 134b and the circuit substrate 120. Furthermore, the circuit layer 134b is electrically connected to the conductive structure 140 and the circuit layer 124b of the circuit substrate 120 through a plurality of conductive vias 136b.

[0033] It is worth mentioning that the embedded component circuit board 100 also includes a thermally conductive insulating layer 150, which is disposed on the circuit board 120. A conductive structure 140 is located between the thermally conductive insulating layer 150 and the surface 120f of the circuit board 120. In other words, the thermally conductive insulating layer 150 is disposed on the surface 120s of the circuit board 120 opposite to the surface 120f. In this embodiment, a circuit layer structure 130b may also exist between the thermally conductive insulating layer 150 and the circuit board 120.

[0034] In detail, the thermally conductive insulating layer 150 is a circuit layer structure 130b disposed on the circuit board 120, and the circuit layer 134b of the circuit layer structure 130b is located between the insulating layer 132b and the thermally conductive insulating layer 150. Furthermore, the embedded component circuit board 100 also includes a circuit layer 104 disposed on the thermally conductive insulating layer 150, and the thermally conductive insulating layer 150 is located between the circuit layer 104 and the circuit layer 134b of the circuit layer structure 130b. The thermally conductive insulating layer 150 may contain, for example, thermally conductive adhesive or the like.

[0035] The embedded component circuit board 100 also includes an insulating material 170 disposed on the conductive structure 140 and distributed between the conductive structure 140 and the circuit board 120. In this embodiment, there is a gap between the side surface (not shown) of the conductive structure 140 and the inner side surface (not shown) of the circuit board 120, and the insulating material 170 fills this gap. The material of the insulating material 170 may include, for example, epoxy resin. Notably, the end face 170e of the insulating material 170 is flush with the surface 120f of the circuit board 120.

[0036] It is worth mentioning that, although not shown in Figure 1However, the embedded component circuit board 100 may also include at least one solder mask. The solder mask may cover the upper circuit layers 134a and 104, and expose a portion of the upper circuit layers 134a and 104. Alternatively, the embedded component circuit board 100 may also include non-plating through holes 190 (NPTH). The non-plating through holes 190 connect opposite sides of the embedded component circuit board 100 for securing with screws or other similar fastening components, allowing the embedded component circuit board 100 to be fixed to other components (e.g., circuit boards).

[0037] This invention provides a method for manufacturing an embedded component circuit board. Taking an embedded component circuit board 100 as an example, this manufacturing method may include the following steps: Figures 2A to 2B as well as Figures 3A to 3F The steps are shown below. Please refer to the instructions. Figure 2A First, a conductive structure 140 is provided, and this conductive structure 140 includes a groove 142. The groove 142 can be formed on the conductive structure 140 by means of, for example, mechanical (e.g., CNC machining) or laser grooving. Next, an electronic component 160 is disposed within the groove 142 of the conductive structure 140.

[0038] The step of setting the electronic component 160 within the groove 142 of the conductive structure 140 includes: setting a metal sintered material (not shown) at the bottom of the groove 142, and setting the electronic component 160 on the metal sintered material. Next, the metal sintered material is heated to adhere between the bottom of the groove 142 and the electronic component 160 to form a metal sintered layer 110 connecting the electronic component 160 and the groove 142.

[0039] After placing the electronic component 160 in the groove 142, please refer to... Figure 2B A thermoplastic insulating layer 180 is provided on the conductive structure 140 to cover the electronic component 160 and the recess 142. The thermoplastic insulating layer 180 can be formed on a portion of the conductive structure 140 and the electronic component 160 by, for example, spray coating and drying. Notably, in this embodiment, the thermoplastic insulating layer 180 can completely cover the surface of the electronic component 160 (including the side surface and the top surface).

[0040] Please refer to Figure 3AThe method of manufacturing the embedded component circuit board 100 further includes providing an initial circuit board 320'. The initial circuit board 320' includes an insulating layer 122 and a double metal layer 324, with the insulating layer 122 sandwiched between the double metal layers 324. In this embodiment, these metal layers 324 may be metal foils (e.g., copper foil) and are respectively attached to opposite sides of the insulating layer 122.

[0041] After the thermoplastic insulating layer 180 is applied to the conductive structure 140, the conductive structure 140 is placed within the initial circuit board 320'. Please refer to the following: Figures 3A to 3B This step includes removing a portion of the initial circuit board 320' by means of, for example, mechanical cutting, to form an opening 305 on the initial circuit board 320', and the opening 305 connects opposite sides of the initial circuit board 320'. Although two openings 305 are formed in this embodiment, the invention is not limited thereto, and in other embodiments, any number of openings 305 (e.g., one opening or three openings) may be formed on the initial circuit board 320'.

[0042] Next, as Figure 3B As shown, a bonding material 307 is provided on the surface 320s of the initial circuit board 320', and the bonding material 307 covers the opening 305. The bonding material 307 can be an adhesive tape (e.g., polyethylene terephthalate tape) or something similar. After the bonding material 307 is provided, it will be passed through... Figures 2A to 2B The conductive structure 140, electronic component 160, and thermoplastic insulating layer 180 formed by a series of steps are disposed within the opening 305. The thermoplastic insulating layer 180 is attached to the bonding material 307, and the groove 142 of the conductive structure 140 is disposed within the opening 305 facing the bonding material 307.

[0043] It is worth mentioning that the width w1 of the opening 305 is greater than the width w2 of the conductive structure 140, and the difference between the width w1 of the opening 305 and the width w2 of the conductive structure 140 is greater than 0.5 mm. Therefore, a gap (not shown) will be formed between the inner surface 305s of the opening 305 and the side surface 140f of the conductive structure 140.

[0044] After the conductive structure 140, electronic component 160, and thermoplastic insulating layer 180 are provided within the opening 305, an insulating material 170 is provided within the opening 305 such that the insulating material 170 is distributed between the conductive structure 140 and the initial circuit board 320'. That is, the insulating material 170 is provided within the aforementioned gap.

[0045] After the insulating material 170 is applied, the bonding material 307 is removed to expose the thermoplastic insulating layer 180. Specifically, the surface 180s of the thermoplastic insulating layer 180 is exposed to the surface 320s of the initial circuit board 320', and surface 180s is flush with surface 320s. Furthermore, the surface 320s of the initial circuit board 320' is also flush with the end face 170e of the insulating material 170.

[0046] Although not shown in the figure, after the conductive structure 140 is disposed within the initial circuit substrate 320', the metal layer 324 of the initial circuit substrate 320' is patterned by means of, for example, photolithography and etching, to form circuit layers 124a and 124b (shown in the figure). Figure 1 In this way, the initial circuit board 320' can be formed as shown. Figure 1 The circuit board 120 is shown in the figure.

[0047] Please refer to Figure 3C At least one insulating substrate 302 is bonded to two opposite surfaces 120f and 120s of the circuit board 120 by thermoforming, to form insulating layers 132a and 132b (marked on...). Figure 1 The circuit board 120 is located between insulating layers 132a and 132b, and insulating layer 132a covers electronic component 160 and recess 142. The insulating substrate may be a film containing a material with a low coefficient of thermal expansion (CTE), and in order to improve the insulation effect of insulating layers 132a and 132b, in some embodiments, the number of insulating substrates 302 attached to each surface (i.e., surface 120f or 120s) of the circuit board 120 may be two or more.

[0048] In addition, the manufacturing method of the embedded component circuit board 100 also includes bonding a metal layer 304 onto the insulating layers 132a and 132b respectively by thermo-press bonding. The insulating layer 132a is located between one of the metal layers 304 and the circuit board 120, while the insulating layer 132b is located between the other metal layer 304 and the circuit board 120.

[0049] Next, please refer to Figure 3D In the bonding metal layer 304 (shown in Figure 3CFollowing this, multiple conductive holes 136a and 136b, as well as conductive hole 306, are formed on the metal layer 304 by mechanical grinding, mechanical drilling, and electroplating, and a plugging material 306t is filled into the conductive hole 306. After the electroplating process, the metal layer 304 is patterned by, for example, photolithography and etching to form circuit layers 134a and 134b. The circuit layer 134a is electrically connected to the electronic component 160 through the conductive hole 136a.

[0050] Next, please refer to Figure 3E At least one insulating substrate 302' is bonded to the circuit layer 134a by thermoforming to form another insulating layer 132a (marked as shown in the diagram). Figure 1 This insulating layer 132a also covers the electronic component 160 and the groove 142, and in order to improve the insulating effect of the insulating layer 132a, in some embodiments, the number of insulating substrates 302' may be more than two.

[0051] Of particular note, in this embodiment, the manufacturing method of the embedded component circuit board 100 further includes bonding a thermally conductive insulating layer 150 onto the circuit layer 134b. A conductive structure 140 is located between the thermally conductive insulating layer 150 and the thermoplastic insulating layer 180. In addition, this step further includes bonding a metal layer 304' onto the upper insulating layer 132a and the thermally conductive insulating layer 150 respectively by thermoforming. The upper insulating layer 132a is located between one of the metal layers 304' and the circuit layer 134a, while the thermally conductive insulating layer 150 is located between another metal layer 304' and the circuit layer 134b.

[0052] Next, please refer to Figure 3F In the bonding metal layer 304' (illustrated in Figure 3E Following this, multiple conductive holes 136a are formed on the metal layer 304' by mechanical grinding, mechanical drilling, and electroplating. In addition, after the electroplating process, the metal layer 304' is patterned by, for example, photolithography and etching to form another circuit layer 134a (illustrated in...). Figure 1 ) and line layer 104 (shown in Figure 1 ).

[0053] Although not shown in the figures, the manufacturing method of the embedded component circuit board 100 in this embodiment further includes, after patterning the metal layer 304' to form another circuit layer 134a and circuit layer 104, forming non-plated vias 190 in the circuit substrate 120, circuit layers 134a and 134b, circuit layer 104, insulating layers 132a and 132b, and thermally conductive insulating layer 150 by means of, for example, mechanical drilling. Thus, a generally formed... Figure 1The illustrated embedded component circuit board 100.

[0054] In summary, by applying a thermoplastic insulating layer to the recesses of electronic components and conductive structures, covering the surface of the electronic components and part of the conductive structures, the adhesion between the electronic components (and the conductive structures) and the overlying circuit layers is improved. Since the thermoplastic insulating layer's heat distortion temperature range falls within a certain range, when the temperature of the thermoplastic insulating layer rises to approximately 200°C to 250°C due to heat generated by the electronic components or heat provided during circuit board manufacturing processes (e.g., thermoforming), the thermoplastic insulating layer will not deform due to heat and can resist thermal stress caused by the temperature rise. Therefore, the thermoplastic insulating layer's coverage of the electronic components is not compromised, and it still provides sufficient insulation for the electronic components, thereby improving the yield of circuit boards with embedded electronic components.

[0055] In addition, placing a thermally conductive insulating layer on one side of the conductive structure can increase the rate at which heat generated by electronic components is transferred to the external environment through the conductive structure, thereby improving the heat dissipation efficiency of the circuit board containing embedded electronic components. This reduces the amount of heat accumulating on the electronic components, preventing them from malfunctioning due to overheating and helping to extend their lifespan.

[0056] Although the embodiments of the present invention have been disclosed above, they are not intended to limit the embodiments of the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the embodiments of the present invention. Therefore, the protection scope of the embodiments of the present invention shall be determined by the appended claims.

[0057]

Explanation of symbols

[0058] 100: Embedded component circuit board

[0059] 104, 124a, 124b, 134a, 134b, 162: Line Layer

[0060] 110: Metal sintered layer

[0061] 120: Circuit board

[0062] 120f, 120s, 140s, 140f, 180s, 305s, 320s: Surface

[0063] 122, 132a, 132b: Insulation layer

[0064] 130a, 130b: Line layer structure

[0065] 136a, 136b, 306: Conductive vias

[0066] 140: Conductive structure

[0067] 142: Groove

[0068] 150: Thermally conductive insulating layer

[0069] 160: Electronic components

[0070] 160f: Plane

[0071] 162g: Gate region

[0072] 162s: Source Region

[0073] 170: Insulating materials

[0074] 170e: End face

[0075] 180: Thermoplastic insulation layer

[0076] 190: Non-plated through hole

[0077] 302, 302': Insulating substrate

[0078] 304, 304', 324: Metal layer

[0079] 305: Opening

[0080] 306t: Pore plugging material

[0081] 307: Bonding material

[0082] 320': Initial circuit board

[0083] w1, w2: Width.

Claims

1. A circuit board with embedded components, characterized in that, Include: Circuit board; A conductive structure is disposed within the circuit substrate and electrically connected to the circuit substrate, wherein the conductive structure has a groove; An electronic component is disposed within the groove of the conductive structure and is electrically connected to the conductive structure; as well as A thermoplastic insulating layer covers the electronic component and the inner wall of the groove, and the first surface of the thermoplastic insulating layer is flush with the second surface of the circuit board. The heat distortion temperature range of the thermoplastic insulating layer is between 376°C and 410°C.

2. The embedded component circuit board according to claim 1, characterized in that, The thickness of the thermoplastic insulating layer is greater than 10 μm.

3. The embedded component circuit board according to claim 1, characterized in that, Also includes: Two circuit layer structures, wherein a circuit substrate is disposed between the circuit layer structures and electrically connected to the circuit substrate, and one of the circuit layer structures includes: An insulating layer is disposed on the circuit board and covers the thermoplastic insulating layer; as well as A circuit layer is disposed on the insulating layer, wherein the insulating layer is located between the circuit layer and the thermoplastic insulating layer.

4. The embedded component circuit board according to claim 1, characterized in that, Also includes: A thermally conductive insulating layer is disposed on the circuit substrate, wherein the conductive structure is located between the thermally conductive insulating layer and the second surface of the circuit substrate.

5. The embedded component circuit board according to claim 1, characterized in that, Also includes: An insulating material is disposed on the conductive structure and distributed between the conductive structure and the circuit board, wherein the end face of the insulating material is flush with the second surface of the circuit board.

6. The embedded component circuit board according to claim 1, characterized in that, Also includes: A sintered metal layer is disposed on the conductive structure and located between the conductive structure and the electronic component.

7. A method for manufacturing a circuit board with embedded components, characterized in that, Include: A conductive structure is provided, and the conductive structure has a groove; An electronic component is disposed within the groove of the conductive structure; After the electronic component is placed in the groove, a thermoplastic insulating layer is placed on the conductive structure so that the thermoplastic insulating layer covers the electronic component and the groove, wherein the heat distortion temperature of the thermoplastic insulating layer falls between 376°C and 410°C. Provide initial circuit board; After the thermoplastic insulating layer is disposed on the conductive structure, the conductive structure is disposed within the initial circuit substrate, wherein the first surface of the thermoplastic insulating layer is exposed on the second surface of the initial circuit substrate, and the first surface is flush with the second surface. as well as After the conductive structure is disposed within the initial circuit substrate, the first metal layer of the initial circuit substrate is patterned to form a circuit layer, and the initial circuit substrate is formed into a circuit substrate.

8. The method according to claim 7, characterized in that, Also includes: At least one insulating substrate is attached to each of the two opposite third surfaces of the circuit substrate to form two insulating layers, wherein the circuit substrate is located between the insulating layers, and one of the insulating layers covers the electronic component and the groove. A second metal layer is attached to each of the two insulating layers, and each of the insulating layers is located between one of the second metal layers and the circuit board. as well as After the second metal layer is bonded to the insulating layer, the second metal layer is patterned so that each of the second metal layers forms a second circuit layer, wherein the second circuit layer is electrically connected to the electronic component.

9. The method according to claim 8, characterized in that, Also includes: A thermally conductive insulating layer is bonded to one of the second circuit layers of the circuit substrate, wherein the conductive structure is located between the thermally conductive insulating layer and the thermoplastic insulating layer.

10. The method according to claim 7, characterized in that, The conductive structure is disposed within the initial circuit substrate, including: A portion of the initial circuit board is removed to form an opening in the initial circuit board, and the opening communicates with opposite sides of the initial circuit board; A bonding material is disposed on the second surface of the initial circuit board, and the bonding material covers the opening; After the bonding material is provided, the conductive structure, the electronic component, and the thermoplastic insulating layer are disposed in the opening, wherein the thermoplastic insulating layer is attached to the bonding material, and the groove surface of the conductive structure is disposed in the opening relative to the bonding material; After the conductive structure, the electronic component, and the thermoplastic insulating layer are disposed within the opening, an insulating material is disposed within the opening such that the insulating material is distributed between the conductive structure and the initial circuit board. as well as After the insulating material is applied, the bonding material is removed to expose the thermoplastic insulating layer.

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