Metal-doped carbon composite material heat dissipation film and low-temperature preparation method thereof

Abstract

The invention discloses a metal-doped carbon composite material heat dissipation film and a low-temperature preparation method thereof, and the metal-doped carbon composite material heat dissipation film comprises the following components by mass: 50-70 parts of a carbon composite material; 5 to 15 parts of a metal dopant; 3-10 parts of a functional additive; 10 to 30 parts of a substrate material; 1-5 parts of a conductive polymer; 0.5 to 2 parts of nano silicon dioxide; 0.5 to 2 parts of nano silver particles; 0.5 to 2 parts of graphdiyne; according to the invention, metal elements of copper, nickel and aluminum are doped in the carbon composite material, and boron nitride and silicon carbide functional additives are added, so that the heat dissipation performance and the mechanical performance of the heat dissipation film are obviously improved; in addition, the conductive polymer, the nano silicon dioxide, the nano silver particles and the graphdiyne are introduced, so that the conductivity, the flexibility, the heat resistance and the antibacterial property of the heat dissipation film are further optimized; and a low-temperature preparation process is adopted, so that the damage of high-temperature treatment to the structure of the carbon composite material is avoided, the energy consumption is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation materials technology, specifically a metal-doped carbon composite heat dissipation film and its low-temperature preparation method. Background Technology

[0002] With the increasing performance and miniaturization of electronic devices, heat dissipation has become a key factor restricting their development. Carbon composite materials have been widely studied for their heat dissipation properties due to their excellent thermal conductivity. However, carbon composite materials suffer from insufficient mechanical properties and poor bonding with substrate materials in practical applications. Existing methods for improving the performance of carbon composite materials by doping with metal elements typically require high-temperature processing, which not only increases energy consumption but may also lead to structural damage. Therefore, developing a method for preparing metal-doped carbon composite heat dissipation films at low temperatures is of significant practical importance. Summary of the Invention

[0003] In view of the above situation and to overcome the defects of the prior art, the present invention provides a metal-doped carbon composite heat dissipation film and its low-temperature preparation method, which effectively solves the problems mentioned in the background.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a metal-doped carbon composite heat dissipation film, comprising the following components in parts by mass:

[0005] Carbon composite material: 50-70 parts;

[0006] Metal dopant: 5-15 parts;

[0007] Functional additives: 3-10 parts;

[0008] Base material: 10-30 parts;

[0009] Conductive polymer: 1-5 parts;

[0010] Nano-silica: 0.5-2 parts;

[0011] Nano silver particles: 0.5-2 parts;

[0012] Graphdiyne: 0.5-2 parts.

[0013] Preferably, the metal dopant is a mixture of copper, nickel and aluminum, with a mass ratio of copper, nickel and aluminum of 1:1:1.

[0014] Preferably, the functional additive is a mixture of boron nitride and silicon carbide, with a mass ratio of boron nitride to silicon carbide of 2:1.

[0015] Preferably, the substrate material is polyimide.

[0016] Preferably, the conductive polymer is one of polyaniline, polypyrrole, or polythiophene.

[0017] A low-temperature preparation method for a metal-doped carbon composite heat dissipation film includes the following steps:

[0018] S1: Preparation of carbon composite material dispersion: Add carbon composite material to 400-600 mL of deionized water and use an ultrasonic dispersion device to perform ultrasonic dispersion treatment for 30-60 minutes to obtain a uniformly dispersed carbon composite material dispersion.

[0019] S2: Pretreatment of metal dopant: Dissolve the metal dopant in 80-120 mL of dilute hydrochloric acid solution with a concentration of 1.0-1.5 mol / L, stir evenly, and then add 150-250 mL of deionized water to dilute and obtain metal ion solution.

[0020] S3: Mixing and dispersing, the carbon composite material dispersion in step S1 is mixed with the metal ion solution in step S2, functional additives, conductive polymer, nano silica, nano silver particles and graphylene are added, and the mixture is stirred in a mixer at a speed of 1000-2000 r / min for 1-2 hours to ensure that all components are fully mixed and uniform.

[0021] S4: Coating of the substrate material: Dissolve the substrate material in 80-120 mL of organic solvent to prepare a solution with a concentration of 10-20%; uniformly coat the mixture from step S3 onto the surface of the polyimide solution to form a composite coating;

[0022] S5: Low-temperature curing. Place the coated composite coating in a low-temperature curing oven and cure it for 2-4 hours at a temperature of 100-150℃ to make the composite coating and the substrate material bond tightly together to form a metal-doped carbon composite heat dissipation film.

[0023] S6: Post-processing: Take out the cured heat dissipation film, wash it with deionized water for 10-20 minutes to remove residual impurities on the surface, and then dry it in an oven at 60-80℃ for 1-2 hours. After drying, the final metal-doped carbon composite heat dissipation film is obtained.

[0024] Preferably, in the preparation of the S1: carbon composite material dispersion, the ultrasonic dispersion treatment has a power of 300-500W and a frequency of 20-40kHz.

[0025] Preferably, in step S4, the coating of the substrate material uses an organic solvent selected from dimethylformamide and DMF.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] This invention significantly improves the heat dissipation and mechanical properties of the heat dissipation film by doping copper, nickel and aluminum metal elements into the carbon composite material and adding boron nitride and silicon carbide functional additives. In addition, the introduction of conductive polymer, nano-silica, nano-silver particles and graphylene further optimizes the conductivity, flexibility, heat resistance and antibacterial properties of the heat dissipation film.

[0028] The low-temperature preparation process avoids the damage to the carbon composite material structure caused by high-temperature treatment, reduces energy consumption, and improves production efficiency. Detailed Implementation

[0029] The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] This invention provides a metal-doped carbon composite heat dissipation film, comprising the following components in parts by weight:

[0031] Carbon composite material: 50-70 parts;

[0032] Metal dopants: 5-15 parts; improve the heat dissipation performance and mechanical properties of the heat dissipation film;

[0033] Functional additives: 3-10 parts;

[0034] Base material: 10-30 parts;

[0035] Conductive polymer: 1-5 parts; used to further improve the conductivity and flexibility of the heat dissipation film;

[0036] Nano-silica: 0.5-2 parts; used to enhance the mechanical strength and heat resistance of heat dissipation films;

[0037] Nano silver particles: 0.5-2 parts; used to improve the thermal conductivity and antibacterial properties of the heat dissipation film;

[0038] Graphdiyne: 0.5-2 parts, used to enhance the thermal conductivity and chemical stability of heat dissipation films.

[0039] In this embodiment, the metal dopant is a mixture of copper, nickel, and aluminum, with a mass ratio of 1:1:1.

[0040] The functional additive in this embodiment is a mixture of boron nitride and silicon carbide, with a mass ratio of boron nitride to silicon carbide of 2:1.

[0041] The base material in this embodiment is polyimide.

[0042] The conductive polymer in this embodiment is one of polyaniline, polypyrrole, or polythiophene.

[0043] A low-temperature preparation method for a metal-doped carbon composite heat dissipation film includes the following steps:

[0044] S1: Preparation of carbon composite material dispersion: Add carbon composite material to 400-600 mL of deionized water and use an ultrasonic dispersion device to perform ultrasonic dispersion treatment for 30-60 minutes to obtain a uniformly dispersed carbon composite material dispersion; ultrasonic dispersion fully disperses the carbon composite material to avoid agglomeration, thereby improving its uniformity in subsequent steps.

[0045] S2: Pretreatment of metal dopant: Dissolve the metal dopant in 80-120 mL of dilute hydrochloric acid solution with a concentration of 1.0-1.5 mol / L, stir well, and then add 150-250 mL of deionized water to dilute and obtain a metal ion solution; the metal is dissolved into an ionic state by dilute hydrochloric acid solution, which facilitates the subsequent doping reaction;

[0046] S3: Mixing and dispersing. The carbon composite material dispersion from step S1 is mixed with the metal ion solution from step S2. Functional additives, conductive polymers, nano-silica, nano-silver particles, and graphylene are added. The mixture is stirred in a mixer at a speed of 1000-2000 r / min for 1-2 hours to ensure that all components are fully and uniformly mixed. Stirring ensures that the metal ions, functional additives, conductive polymers, nano-silica, nano-silver particles, and graphylene are uniformly distributed in the carbon composite material, thereby improving the overall performance of the heat dissipation film.

[0047] S4: Coating of the substrate material: Dissolve the substrate material in 80-120 mL of organic solvent to prepare a solution with a concentration of 10-20%; uniformly coat the mixture from step S3 onto the surface of the polyimide solution to form a composite coating; Polyimide, as a substrate material, has good mechanical properties and thermal stability, and can be combined with carbon composite materials to form a high-performance heat dissipation film.

[0048] S5: Low-temperature curing. The coated composite coating is placed in a low-temperature curing oven and cured at 100-150℃ for 2-4 hours to ensure a tight bond between the composite coating and the substrate material, forming a heat dissipation film of metal-doped carbon composite material. The low-temperature curing process can effectively avoid the damage of high temperature to the carbon composite material structure and reduce energy consumption.

[0049] S6: Post-processing. Take out the cured heat dissipation film, wash it with deionized water for 10-20 minutes to remove residual impurities on the surface, and then dry it in an oven at 60-80℃ for 1-2 hours. After drying, the final metal-doped carbon composite heat dissipation film is obtained. The purpose of cleaning and drying is to remove surface impurities and ensure the purity and performance of the heat dissipation film.

[0050] In this embodiment, S1: the preparation of the carbon composite material dispersion, the ultrasonic dispersion treatment power is 300-500W and the frequency is 20-40kHz.

[0051] S4 of this embodiment: coating of the substrate material, the organic solvent being one of dimethylformamide and DMF.

[0052] Example 1:

[0053] A metal-doped carbon composite heat dissipation film comprises the following components in parts by weight:

[0054] Carbon composite material: 50 parts;

[0055] Metal dopant: 5 parts;

[0056] Functional additives: 3 parts;

[0057] Base material: 10 parts;

[0058] Conductive polymer: 1 part;

[0059] Nano-silica: 0.5 parts;

[0060] Nano silver particles: 0.5 parts;

[0061] Graphdiyne: 0.5 parts.

[0062] In this embodiment, the metal dopant is a mixture of copper, nickel, and aluminum, with a mass ratio of 1:1:1.

[0063] The functional additive in this embodiment is a mixture of boron nitride and silicon carbide, with a mass ratio of boron nitride to silicon carbide of 2:1.

[0064] The base material in this embodiment is polyimide.

[0065] The conductive polymer in this embodiment is one of polyaniline, polypyrrole, or polythiophene.

[0066] A low-temperature preparation method for a metal-doped carbon composite heat dissipation film includes the following steps:

[0067] S1: Preparation of carbon composite material dispersion: The carbon composite material was added to 400 mL of deionized water and ultrasonically dispersed for 30 minutes using an ultrasonic dispersion device to obtain a uniformly dispersed carbon composite material dispersion.

[0068] S2: Pretreatment of metal dopant: Dissolve the metal dopant in 80 mL of 1.0 mol / L dilute hydrochloric acid solution, stir well, and then add 150 mL of deionized water to dilute and obtain metal ion solution.

[0069] S3: Mixing and dispersing, the carbon composite material dispersion in step S1 is mixed with the metal ion solution in step S2, functional additives, conductive polymer, nano silica, nano silver particles and graphylene are added, and the mixture is stirred in a mixer at a speed of 1000 r / min for 1 hour to ensure that all components are fully mixed and uniform.

[0070] S4: Coating of the substrate material: Dissolve the substrate material in 80 mL of organic solvent to prepare a 10% solution; uniformly coat the mixture from step S3 onto the surface of the polyimide solution to form a composite coating;

[0071] S5: Low-temperature curing. Place the coated composite coating in a low-temperature curing oven and cure it at 100°C for 2 hours to ensure that the composite coating is tightly bonded to the substrate material and form a metal-doped carbon composite heat dissipation film.

[0072] S6: Post-processing: Take out the cured heat dissipation film, wash it with deionized water for 10 minutes to remove residual impurities on the surface, and then dry it in an oven at 60°C for 1 hour. After drying, the final metal-doped carbon composite heat dissipation film is obtained.

[0073] In this embodiment, S1: Preparation of carbon composite material dispersion, the ultrasonic dispersion treatment power is 300W and the frequency is 20kHz.

[0074] S4 of this embodiment: coating of the substrate material, the organic solvent being one of dimethylformamide and DMF.

[0075] Example 2:

[0076] A metal-doped carbon composite heat dissipation film comprises the following components in parts by weight:

[0077] Carbon composite material: 70 parts;

[0078] Metal dopant: 15 parts;

[0079] Functional additives: 10 parts;

[0080] Base material: 30 parts;

[0081] Conductive polymer: 5 parts;

[0082] Nano silica: 2 parts;

[0083] Nano silver particles: 2 parts;

[0084] Graphdiyne: 2 parts.

[0085] In this embodiment, the metal dopant is a mixture of copper, nickel, and aluminum, with a mass ratio of 1:1:1.

[0086] The functional additive in this embodiment is a mixture of boron nitride and silicon carbide, with a mass ratio of boron nitride to silicon carbide of 2:1.

[0087] The base material in this embodiment is polyimide.

[0088] The conductive polymer in this embodiment is one of polyaniline, polypyrrole, or polythiophene.

[0089] A low-temperature preparation method for a metal-doped carbon composite heat dissipation film includes the following steps:

[0090] S1: Preparation of carbon composite material dispersion: The carbon composite material was added to 600 mL of deionized water and ultrasonically dispersed for 60 minutes using an ultrasonic dispersion device to obtain a uniformly dispersed carbon composite material dispersion.

[0091] S2: Pretreatment of metal dopant: Dissolve the metal dopant in 120 mL of 1.5 mol / L dilute hydrochloric acid solution, stir well, and then add 250 mL of deionized water to dilute and obtain metal ion solution.

[0092] S3: Mixing and dispersing, the carbon composite material dispersion in step S1 is mixed with the metal ion solution in step S2, functional additives, conductive polymer, nano silica, nano silver particles and graphylene are added, and the mixture is stirred in a mixer at a speed of 2000 r / min for 2 hours to ensure that all components are fully mixed and uniform.

[0093] S4: Coating of the substrate material: Dissolve the substrate material in 80-120 mL of organic solvent to prepare a 20% solution; uniformly coat the mixture from step S3 onto the surface of the polyimide solution to form a composite coating;

[0094] S5: Low-temperature curing. The coated composite coating is placed in a low-temperature curing oven and cured at 150°C for 4 hours to ensure that the composite coating is tightly bonded to the substrate material and form a metal-doped carbon composite heat dissipation film.

[0095] S6: Post-processing: Take out the cured heat dissipation film, wash it with deionized water for 20 minutes to remove residual impurities on the surface, and then dry it in an oven at 80°C for 2 hours. After drying, the final metal-doped carbon composite heat dissipation film is obtained.

[0096] In this embodiment, S1: Preparation of carbon composite material dispersion, the ultrasonic dispersion treatment power is 500W and the frequency is 40kHz.

[0097] S4 of this embodiment: coating of the substrate material, the organic solvent being one of dimethylformamide and DMF.

[0098] Example 3:

[0099] A metal-doped carbon composite heat dissipation film comprises the following components in parts by weight:

[0100] Carbon composite material: 60 parts;

[0101] Metal dopant: 10 parts;

[0102] Functional additives: 6.5 parts;

[0103] Base material: 20 parts;

[0104] Conductive polymer: 3 parts;

[0105] Nano-silica: 1.2 parts;

[0106] Nano silver particles: 1.2 parts;

[0107] Graphdiyne: 1.2 parts.

[0108] In this embodiment, the metal dopant is a mixture of copper, nickel, and aluminum, with a mass ratio of 1:1:1.

[0109] The functional additive in this embodiment is a mixture of boron nitride and silicon carbide, with a mass ratio of boron nitride to silicon carbide of 2:1.

[0110] The base material in this embodiment is polyimide.

[0111] The conductive polymer in this embodiment is one of polyaniline, polypyrrole, or polythiophene.

[0112] A low-temperature preparation method for a metal-doped carbon composite heat dissipation film includes the following steps:

[0113] S1: Preparation of carbon composite material dispersion: The carbon composite material was added to 500 mL of deionized water and ultrasonically dispersed for 45 minutes using an ultrasonic dispersion device to obtain a uniformly dispersed carbon composite material dispersion.

[0114] S2: Pretreatment of metal dopant: Dissolve the metal dopant in 100 mL of 1.3 mol / L dilute hydrochloric acid solution, stir well, and then add 200 mL of deionized water to dilute and obtain metal ion solution.

[0115] S3: Mixing and dispersing, the carbon composite material dispersion in step S1 is mixed with the metal ion solution in step S2, functional additives, conductive polymer, nano silica, nano silver particles and graphylene are added, and the mixture is stirred in a mixer at a speed of 1500 r / min for 1.5 hours to ensure that all components are fully mixed and uniform.

[0116] S4: Coating of the substrate material: Dissolve the substrate material in 100 mL of organic solvent to prepare a 15% solution; uniformly coat the mixture from step S3 onto the surface of the polyimide solution to form a composite coating;

[0117] S5: Low-temperature curing. The coated composite coating is placed in a low-temperature curing oven and cured at 125°C for 3 hours to ensure that the composite coating is tightly bonded to the substrate material and form a metal-doped carbon composite heat dissipation film.

[0118] S6: Post-processing: Take out the cured heat dissipation film, wash it with deionized water for 15 minutes to remove residual impurities on the surface, and then dry it in an oven at 70°C for 1.5 hours. After drying, the final metal-doped carbon composite heat dissipation film is obtained.

[0119] In this embodiment, S1: Preparation of carbon composite material dispersion, the ultrasonic dispersion treatment power is 400W and the frequency is 30kHz.

[0120] S4 of this embodiment: coating of the substrate material, the organic solvent being one of dimethylformamide and DMF.

[0121] Example 4:

[0122] A metal-doped carbon composite heat dissipation film comprises the following components in parts by weight:

[0123] Carbon composite materials: 53 parts;

[0124] Metal dopant: 7 parts;

[0125] Functional additives: 4 parts;

[0126] Base material: 13 parts;

[0127] Conductive polymer: 2 parts;

[0128] Nano-silica: 0.7 parts;

[0129] Nano silver particles: 0.7 parts;

[0130] Graphdiyne: 0.7 parts.

[0131] In this embodiment, the metal dopant is a mixture of copper, nickel, and aluminum, with a mass ratio of 1:1:1.

[0132] The functional additive in this embodiment is a mixture of boron nitride and silicon carbide, with a mass ratio of boron nitride to silicon carbide of 2:1.

[0133] The base material in this embodiment is polyimide.

[0134] The conductive polymer in this embodiment is one of polyaniline, polypyrrole, or polythiophene.

[0135] A low-temperature preparation method for a metal-doped carbon composite heat dissipation film includes the following steps:

[0136] S1: Preparation of carbon composite material dispersion: The carbon composite material was added to 430 mL of deionized water and ultrasonically dispersed for 35 minutes using an ultrasonic dispersion device to obtain a uniformly dispersed carbon composite material dispersion.

[0137] S2: Pretreatment of metal dopant: Dissolve the metal dopant in 90 mL of 1.1 mol / L dilute hydrochloric acid solution, stir well, and then add 1600 mL of deionized water to dilute and obtain metal ion solution.

[0138] S3: Mixing and dispersing, the carbon composite material dispersion in step S1 is mixed with the metal ion solution in step S2, functional additives, conductive polymer, nano silica, nano silver particles and graphylene are added, and the mixture is stirred in a mixer at a speed of 1200 r / min for 1.2 hours to ensure that all components are fully mixed and uniform.

[0139] S4: Coating of the substrate material: Dissolve the substrate material in 90 mL of organic solvent to prepare a 12% solution; uniformly coat the mixture from step S3 onto the surface of the polyimide solution to form a composite coating;

[0140] S5: Low-temperature curing. The coated composite coating is placed in a low-temperature curing oven and cured at 110°C for 2.2 hours to ensure that the composite coating is tightly bonded to the substrate material and forms a metal-doped carbon composite heat dissipation film.

[0141] S6: Post-processing: Take out the cured heat dissipation film, wash it with deionized water for 12 minutes to remove residual impurities on the surface, and then dry it in an oven at 65°C for 1.2 hours. After drying, the final metal-doped carbon composite heat dissipation film is obtained.

[0142] In this embodiment, S1: Preparation of carbon composite material dispersion, the ultrasonic dispersion treatment power is 350W and the frequency is 25kHz.

[0143] S4 of this embodiment: coating of the substrate material, the organic solvent being one of dimethylformamide and DMF.

[0144] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0145] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation thin film made of metal-doped carbon composite material, characterized in that, The ingredients include the following parts by weight: Carbon composite material: 50-70 parts; Metal dopant: 5-15 parts; Functional additives: 3-10 parts; Base material: 10-30 parts; Conductive polymer: 1-5 parts; Nano-silica: 0.5-2 parts; Nano silver particles: 0.5-2 parts; Graphdiyne: 0.5-2 parts.

2. The heat dissipation thin film of metal-doped carbon composite material according to claim 1, characterized in that, The metal dopant is a mixture of copper, nickel, and aluminum, with a mass ratio of copper, nickel, and aluminum of 1:1:

1.

3. The heat dissipation thin film of metal-doped carbon composite material according to claim 1, characterized in that, The functional additive is a mixture of boron nitride and silicon carbide, with a mass ratio of boron nitride to silicon carbide of 2:

1.

4. The heat dissipation thin film of metal-doped carbon composite material according to claim 1, characterized in that, The substrate material is polyimide.

5. The heat dissipation thin film of metal-doped carbon composite material according to claim 1, characterized in that, The conductive polymer is one of polyaniline, polypyrrole, or polythiophene.

6. A low-temperature preparation method for a heat dissipation thin film of a metal-doped carbon composite material, characterized in that, Includes the following steps: S1: Preparation of carbon composite material dispersion: Add carbon composite material to 400-600 mL of deionized water and use an ultrasonic dispersion device to perform ultrasonic dispersion treatment for 30-60 minutes to obtain a uniformly dispersed carbon composite material dispersion. S2: Pretreatment of metal dopant: Dissolve the metal dopant in 80-120 mL of dilute hydrochloric acid solution with a concentration of 1.0-1.5 mol / L, stir evenly, and then add 150-250 mL of deionized water to dilute and obtain metal ion solution. S3: Mixing and dispersing, the carbon composite material dispersion in step S1 is mixed with the metal ion solution in step S2, functional additives, conductive polymer, nano silica, nano silver particles and graphylene are added, and the mixture is stirred in a mixer at a speed of 1000-2000 r / min for 1-2 hours to ensure that all components are fully mixed and uniform. S4: Coating of the substrate material: Dissolve the substrate material in 80-120 mL of organic solvent to prepare a solution with a concentration of 10-20%; uniformly coat the mixture from step S3 onto the surface of the polyimide solution to form a composite coating; S5: Low-temperature curing. Place the coated composite coating in a low-temperature curing oven and cure it for 2-4 hours at a temperature of 100-150℃ to make the composite coating and the substrate material bond tightly together to form a metal-doped carbon composite heat dissipation film. S6: Post-processing: Take out the cured heat dissipation film, wash it with deionized water for 10-20 minutes to remove residual impurities on the surface, and then dry it in an oven at 60-80℃ for 1-2 hours. After drying, the final metal-doped carbon composite heat dissipation film is obtained.

7. The low-temperature preparation method of a metal-doped carbon composite heat dissipation film according to claim 6, characterized in that, The preparation of the S1: carbon composite material dispersion involves ultrasonic dispersion with a power of 300-500W and a frequency of 20-40kHz.

8. The low-temperature preparation method of a metal-doped carbon composite heat dissipation film according to claim 6, characterized in that, S4: The coating of the substrate material, wherein the organic solvent is one of dimethylformamide and DMF.