Display module, manufacturing method thereof and electronic equipment

Abstract

The embodiment of the invention provides a display module, a manufacturing method thereof and electronic equipment, relates to the field of display, and aims to improve the integration of an under-screen sensor. The display module comprises a display panel and a composite structure, and the composite structure is located on the backlight side of the display panel. Wherein the composite structure comprises a protective layer, a metal layer and a sensing function layer, the metal layer is located on the side, away from the display panel, of the protective layer, the metal layer comprises first metal and wiring metal which are arranged on the same layer and spaced from each other, and the sensing function layer is connected with the wiring metal.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and its manufacturing method, and electronic equipment. Background Technology

[0002] In recent years, under-display sensor display technology has greatly enhanced the user's interactive experience and security, and has gradually become an industry trend. However, the integration of existing under-display sensors is poor and difficult, which not only affects the thinness and lightness of smart terminal devices, but also has some adverse effects on structure and manufacturing process. Summary of the Invention

[0003] In view of this, this application provides a display module and its manufacturing method, as well as an electronic device, to improve the integration of under-display sensors.

[0004] In a first aspect, embodiments of this application provide a display module, including a display panel and a composite structure, wherein the composite structure is located on the backlight side of the display panel; wherein the composite structure includes a protective layer, a metal layer and a sensing functional layer, the metal layer is located on the side of the protective layer away from the display panel, the metal layer includes a first metal and a wiring metal that are in the same layer and spaced apart from each other, and the sensing functional layer is connected to the wiring metal.

[0005] In this technical solution, the sensor signal lines in the sensor module and the metal that plays a role in heat dissipation in the SCF structure are formed by the same metal film layer. The sensor module has a high degree of integration, which not only eliminates the need for the FPC trace layer, but also, compared with the existing structure, it can be seen that in this solution, the sensing functional layer can be directly fixed to the SCF structure when it is connected to the sensor signal lines through the solder layer, without relying on the adhesive layer for bonding. Therefore, this solution can further eliminate the need for the adhesive layer.

[0006] On the one hand, this type of sensor module has significant advantages in terms of space occupancy and thickness, allowing for a substantial reduction in the overall thickness of the display module, which is beneficial for optimizing the thinness and lightness of smart terminal devices. On the other hand, this application directly bonds the sensing functional layer to the screen via welding, eliminating the need for an adhesive backing layer. This avoids the signal attenuation caused by the soft material of the adhesive backing layer. For example, when the sensing functional layer is used for pressure sensing, the adhesive backing layer can prevent it from weakening the transmitted pressure energy; or, when the sensing functional layer is used for sound sensing, the adhesive backing layer can prevent it from weakening the incoming sound signal. As a result, the signal attenuation received or emitted by the sensing functional layer is smaller, the SNR is significantly improved, and it is more conducive to improving the recognition accuracy of pressure, sound, etc. Moreover, the sensing functional layer is also closer to the screen, resulting in better signal quality.

[0007] Furthermore, during the fabrication of this display module, the incoming metal layer can be patterned to form the first metal and the wiring metal. Then, the sensing functional layer and the wiring metal are connected together to form a protective layer. At this point, the integrated structure of the sensor module and the SCF structure can be treated as a single, complete material, which is then directly bonded to the screen. This allows the SCF structure and sensor module to be bonded to the underside of the screen in a single bonding process. The bonding steps and equipment are identical to those used in the existing assembly line for bonding the SCF structure to the screen, eliminating the need for a separate bonding process for the sensor module and simplifying the process flow. Consequently, no additional bonding pressure needs to be applied to the SCF structure, ensuring pressure consistency and significantly reducing the risk of film printing and screen breakage, thereby increasing production line capacity.

[0008] It should be noted that this application does not simply remove the SCF structure at certain locations to avoid the sensor module. The embodiments of this application achieve the purpose of reducing the thickness of the sensor module itself by highly integrating the sensor module with the SCF structure. The protective layer in this application does not need to be patterned. The protective layer will cover the first metal, the trace metal, and the gap between the first metal and the trace metal, which not only ensures the relative position of the metal pattern, but also ensures the protective effect of the protective layer.

[0009] In one feasible implementation, the sensing functional layer is connected to the trace metal on the side of the metal layer away from the protective layer.

[0010] That is, the sensing functional layer and the protective layer are located on opposite sides of the metal layer. In the manufacturing process of this type of display module, the sensing functional layer is first connected to one side of the metal layer, and then the protective layer is formed on the other side of the metal layer. With this structure, the thickness of the protective layer between the display panel and the metal layer is uniform at all locations, and the protective and shock absorption properties of the protective layer are good at all locations.

[0011] In one feasible implementation, the sensing functional layer is connected to the trace metal on the side of the metal layer near the display panel, and the protective layer covers the sensing functional layer.

[0012] In this structure, the sensing functional layer and the protective layer are located on the same side of the metal layer. During the manufacturing process, the sensing functional layer is first connected to one side of the metal layer, and then a protective layer covering the sensing functional layer is formed on the same side. In this structure, the protective layer covers the sensing functional layer, thus preventing it from being contaminated by moisture or other impurities. Furthermore, when the sensing functional layer does not need to sense light signals, the protective layer can use light-shielding foam to provide all-around light protection, preventing stray light such as ambient light from reaching the sensing functional layer. Moreover, in this structure, the sensing functional layer is closer to the screen, and the signals it receives or emits do not need to penetrate the metal layer, resulting in better signal quality. The overall thickness of the integrated sensor module and SCF structure is also thinner.

[0013] Furthermore, in this structure, the sensing functional layer is located above the metal layer and is not blocked by the metal layer. The sensing functional layer can also receive light signals incident from the outside of the display panel and / or emit light signals to the outside of the display panel, thereby realizing the detection function based on the light signals. The functions that the sensing functional layer can realize are more diversified.

[0014] In one feasible implementation, the trace metal includes a first connecting end and a trace portion, the first connecting end being connected to the sensing functional layer, wherein the distance between the first connecting end and the first metal is greater than the distance between the trace portion and the first metal.

[0015] The sensing functional layer is mostly connected to the trace metal by solder. The first connection end is a solder pad. By setting a larger distance between the first connection end and the surrounding first metal, the risk of short circuit between the solder and the first metal can be reduced, thereby avoiding different trace metals from being short-circuited together through the first metal, and improving the working reliability of the sensor module.

[0016] Furthermore, the distance between the first connecting end and the first metal is d1, 0.2mm≤d1≤0.4mm, and the distance between the wiring part and the first metal is d2, 0.1mm≤d2≤0.3mm.

[0017] Considering the potential solder overflow range, d1 is set between 0.2mm and 0.4mm. Even if solder overflows, it will only overflow into the gap between the first connection end and the first metal, without contacting the first metal. Furthermore, with d1 and d2 within the above range, the spacing between the first metal and the trace metal is reasonable and not excessive. Given a fixed trace metal width and length, more metal can be retained as the first metal, improving its heat dissipation and support effects.

[0018] In one feasible implementation, the first metal includes a perforation, with a gap between the perforation and the outer edge of the first metal, and the wiring metal is located within the perforation. In this structure, the first metal is a single, continuous, closed pattern, which does not affect heat transfer and allows the first metal to still achieve superior heat dissipation performance.

[0019] In one feasible embodiment, the composite structure further includes a reinforcing sheet located on the side of the metal layer away from the display panel and on the side of the sensing functional layer away from the display panel. Specifically, when the sensing functional layer is connected to the trace metal on the side of the metal layer away from the protective layer, the reinforcing sheet is bonded to the sensing functional layer via a pressure-sensitive adhesive layer. When the sensing functional layer is connected to the trace metal on the side of the metal layer closer to the display panel, the reinforcing sheet is bonded to the trace metal via a pressure-sensitive adhesive layer, specifically to a first connecting end of the trace metal.

[0020] Unlike existing structures, the sensing functional layer in this application is directly connected to the metal layer. Regardless of whether the sensing functional layer is located on the side of the metal layer closer to the display panel or away from the display panel, the reinforcing sheet will be located below the sensing functional layer. The reinforcing sheet can improve the strength of the sensor module and provide better support for the sensing functional layer.

[0021] In one feasible implementation, the metal layer includes multiple trace metals, each trace metal including a first connection end and a second connection end, the first connection end being connected to the sensing functional layer; the metal layer has an interface area, and the second connection ends of the multiple trace metals are all located in the interface area, that is, the second connection ends of the multiple trace metals are close to each other to facilitate the connection of the multiple trace metals to the port of the processor.

[0022] In one feasible implementation, the sensing functional layer includes a pressure-sensitive material, such as piezoelectric ceramics, organic piezoelectric films, piezoelectric composites, metal strain gauges, polymer strain gauges, piezoresistive materials, etc. The sensing functional layer is used to convert the sensed pressure signal into an electrical signal so that the processor can perform pressure detection based on the converted electrical signal.

[0023] Secondly, based on the same concept, this application also provides a method for manufacturing a display module, including: forming a composite structure, the process of which includes: patterning a metal layer to form a first metal and a wiring metal that are on the same layer and spaced apart from each other; connecting a sensing functional layer to the wiring metal and forming a protective layer; and attaching the composite structure to the backlight side of the display panel, wherein after attachment, the metal layer is located on the side of the protective layer away from the display panel.

[0024] Based on the foregoing analysis, in this manufacturing method, the sensor signal lines in the sensor module and the metal components in the SCF structure that serve for heat dissipation are formed using the same metal film layer. This results in a high degree of integration for the sensor module, eliminating the need for an FPC trace layer and an adhesive backing layer. On one hand, this significantly reduces the overall thickness of the display module; on the other hand, it avoids the attenuation of signals entering the sensing functional layer through the screen or being emitted outwards by the soft adhesive backing material, thus improving the accuracy of pressure and sound recognition. Furthermore, the sensing functional layer is positioned closer to the screen, resulting in superior signal quality.

[0025] Furthermore, this manufacturing method integrates the sensor module and the SCF structure as a single material, which is then directly bonded to the screen. This requires only one bonding process to attach the SCF structure and sensor module to the underside of the screen. The bonding steps and equipment are identical to those used in the existing assembly line for bonding the SCF structure to the screen, eliminating the need for a separate bonding process for the sensor module. Additionally, no extra bonding pressure is required on the SCF structure, ensuring consistent pressure and significantly reducing the risk of film printing and screen breakage.

[0026] In one feasible implementation, the process of connecting the sensing functional layer to the trace metal and forming a protective layer includes: connecting the sensing functional layer to the trace metal on a second side of the metal layer; and forming a protective layer on a first side of the metal layer, with the first side opposite to the second side.

[0027] The sensing functional layer and the protective layer formed by this manufacturing method are located on opposite sides of the metal layer. In this way, the thickness of the protective layer between the display panel and the metal layer is uniform at all locations, and the protective and shock absorption properties of the protective layer are good at all locations.

[0028] In one feasible implementation, the process of connecting the sensing functional layer to the trace metal and forming a protective layer includes: connecting the sensing functional layer to the trace metal on a first side of the metal layer; and forming a protective layer on the first side of the metal layer, the protective layer covering the sensing functional layer.

[0029] This manufacturing method creates a sensing functional layer and a protective layer on the same side of the metal layer. Thus, the protective layer covers the sensing functional layer, protecting it from contamination by moisture and other impurities. Furthermore, when the sensing functional layer includes pressure-sensitive materials for detecting pressure signals, the protective layer can also provide comprehensive light protection, preventing stray light from ambient light from reaching the sensing functional layer.

[0030] Furthermore, in the display module formed by this method, the sensing functional layer is located above the metal layer and is not blocked by the metal layer. The sensing functional layer under this structure can also receive light signals incident from the outside of the display panel and / or emit light signals to the outside of the display panel, and then realize the detection function based on the light signals. The functions that the sensing functional layer can realize are more diversified.

[0031] Furthermore, between the steps of connecting the sensing functional layer to the trace metal and forming the protective layer, the process of forming the composite structure also includes: attaching a reinforcing sheet to the second side of the metal layer, with the attachment position of the reinforcing sheet corresponding to the position of the sensing functional layer.

[0032] At this point, in the entire display module structure, the reinforcing sheet is located below the sensing functional layer. While effectively improving the strength of the sensor module, the reinforcing sheet also provides better support for the sensing functional layer.

[0033] In one feasible implementation, after forming the composite structure, the manufacturing method further includes coating the composite structure with a release film.

[0034] After the sensor module and SCF structure form a complete material, covering it with a release film can protect this complete material from water and oxygen corrosion. The release film can then be removed when the composite structure is subsequently bonded to the display panel 1.

[0035] Thirdly, based on the same concept, embodiments of this application also provide an electronic device including the above-described display module. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of a display module structure in related technologies;

[0038] Figure 2 This is a schematic diagram of another structure of a display module in related technologies;

[0039] Figure 3 This is a schematic diagram of a display module provided in an embodiment of this application;

[0040] Figure 4 A top view of the protective layer, metal layer, and sensing functional layer provided in the embodiments of this application;

[0041] Figure 5This is another structural schematic diagram of the display module provided in the embodiments of this application;

[0042] Figure 6 A top view of the metal layer and sensing functional layer provided in an embodiment of this application;

[0043] Figure 7 for Figure 6 A sectional view along the A1-A2 direction;

[0044] Figure 8 This is another structural schematic diagram of the display module provided in the embodiments of this application;

[0045] Figure 9 This is another structural schematic diagram of the display module provided in the embodiments of this application;

[0046] Figure 10 A flowchart illustrating a manufacturing method provided in an embodiment of this application;

[0047] Figure 11 for Figure 10 A corresponding structural flowchart;

[0048] Figure 12 for Figure 10 Another corresponding structural flowchart;

[0049] Figure 13 Another flowchart illustrating the manufacturing method provided in this application embodiment;

[0050] Figure 14 for Figure 13 A corresponding structural flowchart;

[0051] Figure 15 Another flowchart illustrating the manufacturing method provided in the embodiments of this application;

[0052] Figure 16 for Figure 15 A corresponding structural flowchart;

[0053] Figure 17 This is another flowchart illustrating the manufacturing method provided in the embodiments of this application;

[0054] Figure 18 for Figure 17 A corresponding structural flowchart;

[0055] Figure 19 This is another flowchart illustrating the manufacturing method provided in the embodiments of this application;

[0056] Figure 20 for Figure 19 A corresponding structural flowchart;

[0057] Figure 21 This is another flowchart illustrating the manufacturing method provided in the embodiments of this application;

[0058] Figure 22 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0059] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0060] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0061] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0062] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0063] Before describing the technical solution provided in this application, this application first introduces the existing structure and explains the problems existing in the prior art.

[0064] In existing under-display sensor display technology, the sensor module is directly attached to the backlight side of the screen module. For example... Figure 1 As shown, Figure 1 This is a schematic diagram of a display module in the related technology. The display module includes a screen module 101 and a sensor module 102.

[0065] The screen module 101 includes a cover plate 1011, an optical adhesive layer 1012, a polarizer 1013, a display panel 1014, a support layer 1015, and a screen cooling foam (SCF) structure 1016, all stacked together. The SCF structure 1016 includes a protective layer 10161 and a metal layer 10162, with the metal layer 10162 primarily serving to dissipate heat, provide support, and offer protection.

[0066] The sensor module 102 includes a stacked adhesive layer 1021, a reinforcing sheet 1022, a pressure-sensitive adhesive layer 1023, a flexible printed circuit (FPC) trace layer 1024, a solder layer 1025, and a sensing functional layer 1026. The sensor module 102 is attached to the metal layer 10162 of the screen module 101 via the adhesive layer 1021. The sensing functional layer 1026 receives signals entering through the screen module 101, such as pressure, light, and sound, and / or emits signals, such as sound. The sensing functional layer 1026 is soldered to the FPC trace layer 1024, which transmits the electrical signals converted by the sensing functional layer 1026 to the processor.

[0067] For example, in some applications, when a user presses their finger on the screen, the sensing layer 1026 senses the pressure and generates a corresponding electrical signal, thereby achieving pressure detection. Alternatively, the sensing layer 1026 senses sound and generates a corresponding electrical signal, thereby achieving sound detection.

[0068] However, the inventors discovered that this method of directly bonding the sensor module 102 to the screen module 101 results in poor integration of the sensor module 102 and is prone to causing some adverse problems:

[0069] Structurally, the sensor module 102 is relatively thick. For example, the thickness of current strain gauge pressure sensor modules is typically greater than 0.6 mm, and the thickness of piezoelectric ceramic pressure sensor modules is typically greater than or equal to 0.4 mm. This results in the sensor module 102 occupying a large portion of the overall device space, significantly impacting the slimness and lightness of the smart terminal device. Furthermore, because the sensor module 102 needs to receive signals entering through the screen module 101 and / or emit signals outwards during operation, it needs to be as close to the screen as possible. However, from the perspective of either the screen module 101 or the sensor module 102 alone, the thickness of both modules is already close to its limit, making further reduction difficult. This significantly restricts the reduction of the distance between the sensor module 102 and the screen. In addition, the sensor module 102 is bonded to the screen module 101 via a soft material called the adhesive layer 1021. The adhesive layer 1021 attenuates the energy of the transmitted signals, leading to signal weakening. For example, when a user presses the screen with their finger, the adhesive layer 1021 will reduce the transmitted pressure energy, thereby affecting the pressure signal sensed by the sensing functional layer 1026. Or, sound will also be attenuated when it passes through the adhesive layer 1021, thereby affecting the sound signal sensed by the sensing functional layer 1026.

[0070] From a manufacturing process perspective, when producing this display module, the SCF structure 1016 is first bonded to one side of the support layer 1015, and then the sensor module is bonded to the SCF structure through bonding and pressure holding. This bonding process is an additional bonding step added to the existing assembly line, leading to process complexity. Furthermore, because additional pressure needs to be applied at the bonding location of the sensor module 102 during bonding, the SCF structure 1016 may be deformed at the bonding location, creating slight step differences, which can result in film marks on the screen. Moreover, the bonding process may also pose a risk of bright spots on the screen, affecting production line yield.

[0071] In another existing structure, such as Figure 2 As shown, Figure 2 This is a schematic diagram of another display module structure in related technologies. Related technologies propose that the SCF structure 1016 can be removed in certain locations to free up space to accommodate the sensor module 102. However, this method only reduces the overall thickness of the display module by avoiding certain areas; it does not improve the integration between the sensor module 102 and the screen module 101, and it also introduces a significant risk of film printing.

[0072] In response, this application provides a display module, such as... Figure 3 and Figure 4 As shown, Figure 3 This is a schematic diagram of a display module provided in an embodiment of this application. Figure 4 This is a top view of the protective layer 3, metal layer 4 and sensing functional layer 5 provided in the embodiments of this application. The display module includes a display panel 1 and a composite structure 2. The composite structure 2 is located on the backlight side of the display panel 1 and includes the protective layer 3, metal layer 4 and sensing functional layer 5.

[0073] The display panel 1 includes, but is not limited to, organic light-emitting diode (OLED) display panels, liquid crystal display (LCD) panels, and light-emitting diode (LED) display panels.

[0074] The protective layer 3 includes foam, which may be adhesive on its own, or at least one side may have an adhesive layer to enable bonding with other structures. Furthermore, the protective layer 3 may include light-blocking foam to provide a light-blocking effect.

[0075] The metal layer 4 is located on the side of the protective layer 3 away from the display panel 1, and may include metal materials such as copper and aluminum. The metal layer 4 includes a first metal 6 and a trace metal 7 that are in the same layer and spaced apart from each other, that is, the first metal 6 and the trace metal 7 are formed by patterning a single layer of metal.

[0076] The sensing functional layer 5 is connected to the trace metal 7, for example, the two can be soldered together, see [reference]. Figure 3 At this time, there is also a solder layer 8 between the sensing functional layer 5 and the trace metal 7.

[0077] This embodiment of the application involves a patterned design of the original monolithic metal SCF structure in the screen module. The original monolithic metal is divided into spaced wiring areas and non-wiring areas. The non-wiring areas contain a first metal 6, which continues the functions of heat dissipation, support, and protection previously provided by the monolithic metal. The wiring areas contain trace metal 7, which serves as sensor signal lines connected to the sensing functional layer 5, transmitting the electrical signals converted by the sensing functional layer 5 to the processor. It should be noted that since the metal layers in the SCF structure are generally made of highly conductive metals such as copper and aluminum, using these materials for wiring can ensure good signal transmission performance.

[0078] In this technical solution, the sensor signal lines in the sensor module and the metal that plays a role in heat dissipation in the SCF structure are formed by the same metal film layer. The sensor module has a high degree of integration, which not only eliminates the need for the FPC trace layer, but also, compared with the existing structure, it can be seen that when the sensing functional layer 5 is connected to the sensor signal lines through the solder layer 8, the sensing functional layer 5 can be directly fixed to the SCF structure without relying on the adhesive layer for bonding. Therefore, this solution can further eliminate the need for the adhesive layer.

[0079] On the one hand, this type of sensor module has significant advantages in terms of space occupation and thickness, which can greatly reduce the overall thickness of the display module, thus helping to optimize the thinness and lightness of smart terminal devices. For example, in existing structural designs, combined with Figure 1 The protective layer 10161 has a thickness of 190 μm, the metal layer 10162 has a thickness of 30 μm, the adhesive layer 1021 has a thickness of 50 μm, the reinforcing sheet 1022 has a thickness of 100 μm, the pressure-sensitive adhesive layer 1023 has a thickness of 25 μm, the FPC wiring layer 1024 has a thickness of 100 μm, the solder layer 1025 has a thickness of 25 μm, and the sensing functional layer 1026 has a thickness of 100 μm. By adopting the technical solution provided in this application, the FPC wiring layer 1024 and the adhesive layer 1021 can be omitted, thus reducing the overall thickness of the SCF structure and sensor module by at least 150 μm.

[0080] On the other hand, this application directly welds the sensing functional layer 5 to the screen, eliminating the need for an adhesive backing layer. This avoids signal attenuation caused by the adhesive backing material. For example, when the sensing functional layer 5 is used for pressure sensing, the adhesive backing layer prevents it from weakening the transmitted pressure energy; similarly, when the sensing functional layer 5 is used for sound sensing, the adhesive backing layer prevents it from weakening incoming sound signals. As a result, the signal attenuation of the receiving or transmitting signal by the sensing functional layer 5 is minimal, significantly improving the SNR and enhancing the accuracy of pressure and sound recognition. Furthermore, the sensing functional layer 5 is closer to the screen, resulting in superior signal quality.

[0081] Furthermore, during the fabrication of this display module, the incoming metal layer can be patterned to form the first metal 6 and the wiring metal 7. Then, the sensing functional layer 5 and the wiring metal 7 are connected together to form the protective layer 3. At this point, the integrated structure of the sensor module and the SCF structure can be treated as a single, complete material, which is then directly bonded to the screen. This allows for a single bonding process to attach the SCF structure and sensor module to the underside of the screen. The bonding steps and equipment are identical to those used in the existing assembly line for bonding the SCF structure to the screen, eliminating the need for a separate bonding process to bond the sensor module, thus simplifying the process flow. Consequently, no additional bonding pressure needs to be applied to the SCF structure, ensuring pressure consistency and significantly reducing the risk of film printing and screen breakage, thereby increasing production line capacity.

[0082] It should be noted that, in comparison Figure 2 This application does not simply remove the SCF structure at certain locations to avoid the sensor module. Instead, the embodiment of this application achieves the purpose of reducing the thickness of the sensor module itself by highly integrating the sensor module with the SCF structure. The protective layer 3 in this application does not need to be patterned. The protective layer 3 will cover the first metal 6, the wiring metal 7, and the gap between the first metal 6 and the wiring metal 7, which not only ensures the relative position of the metal pattern, but also ensures the protective effect of the protective layer 3.

[0083] In one feasible implementation, see again Figure 3 The sensing functional layer 5 is connected to the trace metal 7 on the side of the metal layer 4 away from the protective layer 3.

[0084] That is, the sensing functional layer 5 and the protective layer 3 are located on opposite sides of the metal layer 4. In the manufacturing process of this structure, the sensing functional layer 5 is first connected to one side of the metal layer 4, and then the protective layer 3 is formed on the other side of the metal layer 4. In this structure, the thickness of the protective layer 3 between the display panel 1 and the metal layer 4 is uniform at all locations, and the protective and shock absorption uniformity of the protective layer 3 at all locations is good.

[0085] Alternatively, in another feasible implementation, such as Figure 5 As shown, Figure 5 This is another structural diagram of the display module provided in the embodiment of this application. The sensing functional layer 5 is connected to the wiring metal 7 on the side of the metal layer 4 near the display panel 1, and the protective layer 3 covers the sensing functional layer 5.

[0086] That is, the sensing functional layer 5 and the protective layer 3 are located on the same side of the metal layer 4. In the manufacturing process of this structure, the sensing functional layer 5 is first connected to one side of the metal layer 4, and then the protective layer 3 is formed on the same side to cover the sensing functional layer 5. In this structure, the protective layer 3 can cover the sensing functional layer 5, thereby preventing the sensing functional layer 5 from being contaminated by moisture or other impurities. Furthermore, when the sensing functional layer 5 does not need to sense light signals, the protective layer 3 can be made of light-shielding foam to provide all-round light protection for the sensing functional layer 5, preventing stray light such as ambient light from shining on the sensing functional layer 5. Moreover, in this structure, the sensing functional layer 5 is closer to the screen, and the signals it receives or emits do not need to penetrate the metal layer 4, resulting in better signal quality. The overall thickness of the sensor module and the integrated SCF structure is also thinner.

[0087] Furthermore, in this structure, the sensing functional layer 5 is located above the metal layer 4 and is not blocked by the metal layer 4. The sensing functional layer 5 under this structure can also receive light signals incident from the outside of the display panel 1 and / or emit light signals to the outside of the display panel 1, and then realize the detection function based on the light signals. The functions that the sensing functional layer 5 can realize are more diversified.

[0088] In one feasible implementation, such as Figure 6 and Figure 7 As shown, Figure 6 This is a top view of the metal layer 4 and sensing functional layer 5 provided in the embodiments of this application. Figure 7 for Figure 6 A cross-sectional view along the A1-A2 direction shows that the wiring metal 7 includes a first connecting end 9 and a wiring portion 10. The first connecting end 9 is connected to the sensing functional layer 5. The distance d1 between the first connecting end 9 and the first metal 6 is greater than the distance d2 between the wiring portion 10 and the first metal 6.

[0089] The sensing functional layer 5 is connected to the trace metal 7 by solder. The first connection end 9 is a solder pad. By setting the distance between the first connection end 9 and the surrounding first metal 6 to be larger, the risk of short circuit between the solder and the first metal 6 can be reduced, thereby avoiding different trace metals 7 from being short-circuited together through the first metal 6, and improving the working reliability of the sensor module.

[0090] Furthermore, d1 and d2 can be set as: 0.2mm≤d1≤0.4mm, 0.1mm≤d2≤0.3mm.

[0091] Considering the potential solder overflow range, d1 is set between 0.2mm and 0.4mm. Even if solder overflows, it will only overflow into the gap between the first connecting end 9 and the first metal 6, without contacting the first metal 6. Furthermore, with d1 and d2 within the aforementioned range, the spacing between the first metal 6 and the trace metal 7 is reasonable and not excessive. Given a fixed trace width and length, more metal can be retained as the first metal 6, improving its heat dissipation.

[0092] Furthermore, the line width of the wiring section 10 is d, which can be set to 0.1mm≤d1≤0.3mm to set a reasonable line width for the wiring section 10.

[0093] It should be noted that, Figure 6 and Figure 7 The illustration is based on the example of the sensing functional layer 5 being connected to the trace metal 7 on the side of the metal layer 4 away from the protective layer 3. When the sensing functional layer 5 is connected to the trace metal 7 on the side of the metal layer 4 close to the display panel 1, the distance d1 between the first connection end 9 and the first metal 6 and the distance d2 between the trace part 10 and the first metal 6 still satisfy the above relationship.

[0094] In one feasible implementation, see again Figure 4 The first metal 6 includes a cutout 11, with a gap between the cutout 11 and the outer edge of the first metal 6, and the wiring metal 7 is located within the cutout 11. In this structure, the first metal 6 is a continuous closed pattern, which does not affect heat transfer and allows the first metal 6 to still achieve better heat dissipation performance.

[0095] In one feasible implementation, such as Figure 8 and Figure 9 As shown, Figure 8 This is another schematic diagram of the display module provided in the embodiments of this application. Figure 9 This is a schematic diagram of another structure of the display module provided in the embodiments of this application. The composite structure 2 also includes a reinforcing sheet 12, which is located on the side of the metal layer 4 away from the display panel 1 and on the side of the sensing functional layer 5 away from the display panel 1.

[0096] Specifically, see Figure 8 When the sensing functional layer 5 is connected to the trace metal 7 on the side of the metal layer 4 away from the protective layer 3, the reinforcing sheet 12 is bonded to the sensing functional layer 5 through the pressure-sensitive adhesive layer 13. See also Figure 9When the sensing functional layer 5 is connected to the wiring metal 7 on the side of the metal layer 4 near the display panel 1, the reinforcing sheet 12 is bonded to the wiring metal 7 through the pressure-sensitive adhesive layer 13, specifically to the first connecting end 9 in the wiring metal 7.

[0097] Unlike existing structures, the sensing functional layer 5 in this application is directly connected to the metal layer 4. Regardless of whether the sensing functional layer 5 is located on the side of the metal layer 4 closer to the display panel 1 or away from the display panel 1, the reinforcing sheet 12 will be located below the sensing functional layer 5. The reinforcing sheet 12 can improve the strength of the sensor module and provide better support for the sensing functional layer 5.

[0098] In one feasible implementation, see again Figure 6 The metal layer 4 includes multiple trace metals 7, each trace metal 7 being connected to a sensing functional layer 5. Each trace metal 7 includes a first connection end 9 and a second connection end 14, the first connection end 9 being connected to the sensing functional layer 5. The metal layer 4 has an interface area 15, and the second connection ends 14 of the multiple trace metals 7 are all located in the interface area 15, meaning the second connection ends 14 of the multiple trace metals 7 are close to each other to facilitate connection between the multiple trace metals 7 and the processor's ports.

[0099] In one feasible implementation, the sensing functional layer 5 includes a pressure-sensitive material, such as piezoelectric ceramics, organic piezoelectric films, piezoelectric composites, metal strain gauges, polymer strain gauges, piezoresistive materials, etc. The sensing functional layer 5 is used to convert the sensed pressure signal into an electrical signal so that the processor can perform pressure detection based on the converted electrical signal.

[0100] Of course, in other alternative embodiments, the sensing functional layer 5 may also include other materials, such as photoelectric conversion materials. The sensor types to which the sensing functional layer 5 belongs in this application include, but are not limited to, pressure sensors, light sensors, fingerprint sensors, proximity sensors, sound sensors, ceramic sound-emitting units, under-display cameras, etc.

[0101] In addition, see again Figure 3 The display module provided in this application embodiment may further include a support layer 16, a polarizer 17, an optical adhesive layer 18, and a cover plate 19. The support layer 16 is located between the display panel 1 and the protective layer 3; the polarizer 17 is located on the side of the display panel 1 away from the support layer 16; the optical adhesive layer 18 is located on the side of the polarizer 17 away from the display panel 1; and the cover plate 19 is located on the side of the optical adhesive layer 18 away from the polarizer 17.

[0102] Based on the same concept, this application also provides a method for manufacturing a display module, which is used to manufacture the above-mentioned display module.

[0103] Combination Figure 3 and Figure 4 ,like Figure 10 and Figure 11 As shown, Figure 10 This is a flowchart of a manufacturing method provided in an embodiment of this application. Figure 11 for Figure 10 A corresponding structural flowchart, Figure 12 for Figure 10 The corresponding alternative structural flowchart shows that the manufacturing method includes step S1: forming a composite structure 2.

[0104] Step S1 specifically includes:

[0105] Step S11: Pattern the metal layer 4 to form a first metal 6 and a trace metal 7 that are on the same layer and spaced apart from each other.

[0106] Specifically, after the metal layer arrives, it is patterned according to the design drawings using methods such as mechanical cutting, laser cutting, die cutting, electrolysis, photolithography and chemical etching, dividing the entire metal into spaced wiring areas and non-wiring areas. The non-wiring area contains the first metal 6, while the wiring area contains the wiring metal 7.

[0107] Step S12: Connect the sensing functional layer 5 to the wiring metal 7 and form the protective layer 3.

[0108] Specifically, the sensing functional layer 5 can be welded at the location of the first connecting end 9 of the wiring metal 7 to ensure the electrical and physical connection between the sensing functional layer 5 and the wiring metal 7. The protective layer 3 may include foam, which can be encapsulated together with the metal layer 4 by casting or coating.

[0109] The manufacturing method also includes step S2: attaching the composite structure 2 to the backlight side of the display panel 1. After attachment, the metal layer 4 is located on the side of the protective layer 3 away from the display panel 1.

[0110] It should be noted that the composite structure 2 being attached to the backlight side of the display panel 1 as described in this application does not mean that the composite structure 2 must be attached to the back surface of the display panel 1. When other structures, such as the support layer 16, are provided on the backlight side of the display panel 1, the composite structure 2 can be attached to the side of the support layer 16 away from the display panel 1, thereby achieving the purpose of attaching the composite structure 2 to the backlight side of the display panel 1.

[0111] Based on the foregoing analysis, in this manufacturing method, the sensor signal lines in the sensor module and the metal components in the SCF structure that serve for heat dissipation are formed using the same metal film layer. This results in a high degree of integration for the sensor module, eliminating the need for an FPC trace layer and an adhesive backing layer. This significantly reduces the overall thickness of the display module and prevents the adhesive backing material from attenuating signals entering the sensing functional layer 5 through the screen or emitting signals from the sensing functional layer 5 outwards, thus improving the detection accuracy for pressure, sound, and other signals. Furthermore, the sensing functional layer 5 is closer to the screen, resulting in superior signal quality.

[0112] Moreover, this manufacturing method integrates the sensor module and the SCF structure as a single material, which is then directly bonded to the screen. This requires only one bonding process to attach the SCF structure and sensor module to the underside of the screen. The bonding steps and equipment are identical to those used in the existing assembly line for bonding the SCF structure to the screen, eliminating the need for a separate bonding process for the sensor module. Furthermore, it eliminates the need to apply additional bonding pressure to the SCF structure, ensuring consistent pressure across the SCF structure and significantly reducing the risk of film printing and screen breakage.

[0113] In one feasible implementation, combined with Figure 3 ,like Figure 13 and Figure 14 As shown, Figure 13 This is another flowchart illustrating the manufacturing method provided in an embodiment of this application. Figure 14 for Figure 13 A corresponding structural flowchart, step S12 may specifically include:

[0114] Step S121: Connect the sensing functional layer 5 to the wiring metal 7 on the second side ss of the metal layer 4.

[0115] Step S122: A protective layer 3 is formed on the first side fs of the metal layer 4, with the first side fs facing the second side ss.

[0116] The sensing functional layer 5 and the protective layer 3 formed by this manufacturing method are located on opposite sides of the metal layer 4. In this way, the thickness of the protective layer 3 between the display panel 1 and the metal layer 4 is uniform at each position, and the protective and shock absorption uniformity of the protective layer 3 at each position is good.

[0117] Alternatively, in another feasible implementation, combined with Figure 5 ,like Figure 15 and Figure 16 As shown, Figure 15 This is another flowchart illustrating the manufacturing method provided in the embodiments of this application. Figure 16 for Figure 15In a corresponding structural flowchart, step S12 may further include:

[0118] Step S121': Connect the sensing functional layer 5 to the wiring metal 7 on the first side fs of the metal layer 4.

[0119] Step S122': A protective layer 3 is formed on the first side fs of the metal layer 4, and the protective layer 3 covers the sensing functional layer 5.

[0120] The sensing functional layer 5 and the protective layer 3 formed by this manufacturing method are located on the same side of the metal layer 4. In this way, the protective layer 3 can cover the sensing functional layer 5, thus protecting it from contamination by moisture and other impurities. Furthermore, when the sensing functional layer 5 includes a pressure-sensitive material for detecting pressure signals, the protective layer 3 can also provide all-around light protection for the sensing functional layer 5, preventing stray light such as ambient light from shining onto it.

[0121] Furthermore, in the display module formed in this way, the sensing functional layer 5 is located above the metal layer 4 and will not be blocked by the metal layer 4. The sensing functional layer 5 under this structure can also receive light signals incident from the outside of the display panel 1 and / or emit light signals to the outside of the display panel 1, and then realize the detection function based on the light signals. The functions that the sensing functional layer 5 can realize are more diversified.

[0122] Furthermore, in one feasible implementation, combined with Figure 8 ,like Figure 17 and Figure 18 As shown, Figure 17 This is another flowchart illustrating the manufacturing method provided in the embodiments of this application. Figure 18 for Figure 17 A corresponding structural flowchart, and combined with Figure 9 ,like Figure 19 and Figure 20 As shown, Figure 19 This is another flowchart illustrating the manufacturing method provided in the embodiments of this application. Figure 20 for Figure 19 In a corresponding structural flowchart, between the steps of connecting the sensing functional layer 5 to the wiring metal 7 and forming the protective layer 3, step S1 may further include:

[0123] Step S13: Attach a reinforcing sheet 12 to the second side ss of the metal layer 4. The attachment position of the reinforcing sheet 12 corresponds to the position of the sensing functional layer 5.

[0124] At this time, in the entire display module structure, the reinforcing sheet 12 is located below the sensing functional layer 5. While effectively improving the strength of the sensor module, the reinforcing sheet 12 also provides better support for the sensing functional layer 5.

[0125] In one feasible implementation, such as Figure 21 As shown, Figure 21 This is another flowchart of the manufacturing method provided in the embodiments of this application. After forming the composite structure 2, the manufacturing method further includes:

[0126] Step S3: Apply a release film to the composite structure 2. For example, a release film can be applied to at least one side of the composite structure 2. After the sensor module and the SCF structure form a complete material, applying the release film can protect this complete material from water and oxygen corrosion. The release film can be removed when the composite structure 2 is subsequently bonded to the display panel 1.

[0127] Based on the same concept, embodiments of this application also provide an electronic device, such as... Figure 22 As shown, Figure 22 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device includes the above-described display module 100. The specific structure of the display module 100 has been described in detail in the above embodiments and will not be repeated here.

[0128] Furthermore, the electronic device also includes a processor. The processor includes interfaces, some of which are connected to the trace metal 7 in the display module 100, specifically to the second connection end 14 of the trace metal 7. The processor receives electrical signals transmitted by the trace metal 7 and then performs detection based on these electrical signals. For example, the sensing functional layer 5 in the display module 100 includes a pressure-sensitive material. The sensing functional layer 5 senses pressure signals and converts them into electrical signals. The trace metal 7 transmits the electrical signals converted by the sensing functional layer 5 to the processor, enabling the processor to perform pressure detection.

[0129] It should be noted that, Figure 22 The electronic device shown is for illustrative purposes only. It can be any electronic device with a display function, such as a smartphone, tablet, smartwatch, laptop, e-reader, or television.

[0130] The same or similar parts between the various embodiments in this specification can be referred to mutually. In particular, the device embodiments and terminal embodiments are basically similar to the method embodiments, so the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

Claims

1. A display module, characterized in that, It includes a display panel and a composite structure, wherein the composite structure is located on the backlight side of the display panel; The composite structure includes a protective layer, a metal layer, and a sensing functional layer. The metal layer is located on the side of the protective layer away from the display panel. The metal layer includes a first metal and a trace metal that are in the same layer and spaced apart from each other. The sensing functional layer is connected to the trace metal.

2. The display module according to claim 1, characterized in that, The sensing functional layer is connected to the trace metal on the side of the metal layer away from the protective layer.

3. The display module according to claim 1, characterized in that, The sensing functional layer is connected to the trace metal on the side of the metal layer near the display panel, and the protective layer covers the sensing functional layer.

4. The display module according to claim 1, characterized in that, The trace metal includes a first connecting end and a trace portion. The first connecting end is connected to the sensing functional layer, wherein the distance between the first connecting end and the first metal is greater than the distance between the trace portion and the first metal.

5. The display module according to claim 4, characterized in that, The distance between the first connecting end and the first metal is d1, 0.2mm≤d1≤0.4mm, and the distance between the wiring part and the first metal is d2, 0.1mm≤d2≤0.3mm.

6. The display module according to claim 1, characterized in that, The first metal includes a cutout, and there is a gap between the cutout and the outer edge of the first metal, with the wiring metal located within the cutout.

7. The display module according to claim 1, characterized in that, The composite structure also includes reinforcing sheets located on the side of the metal layer away from the display panel and on the side of the sensing functional layer away from the display panel.

8. The display module according to claim 1, characterized in that, The metal layer includes a plurality of the wiring metals, and the wiring metals include a first connection end and a second connection end, wherein the first connection end is connected to the sensing functional layer. The metal layer has an interface area, and the second connection ends of the plurality of trace metals are all located in the interface area.

9. The display module according to claim 1, characterized in that, The sensing functional layer includes a pressure-sensitive material.

10. A method for manufacturing a display module, characterized in that, include: The process of forming a composite structure includes: patterning a metal layer to form a first metal and a trace metal that are on the same layer and spaced apart from each other; connecting the sensing functional layer to the trace metal; and forming a protective layer. The composite structure is bonded to the backlight side of the display panel. After bonding, the metal layer is located on the side of the protective layer away from the display panel.

11. The manufacturing method according to claim 10, characterized in that, The process of connecting the sensing functional layer to the trace metal and forming the protective layer includes: The sensing functional layer is connected to the wiring metal on the second side of the metal layer; The protective layer is formed on a first side of the metal layer, with the first side opposite to the second side.

12. The manufacturing method according to claim 10, characterized in that, The process of connecting the sensing functional layer to the trace metal and forming the protective layer includes: The sensing functional layer is connected to the wiring metal on the first side of the metal layer; The protective layer is formed on the first side of the metal layer, and the protective layer covers the sensing functional layer.

13. The manufacturing method according to claim 11 or 12, characterized in that, Between the steps of connecting the sensing functional layer to the trace metal and forming the protective layer, the process of forming the composite structure further includes: attaching a reinforcing sheet to the second side of the metal layer, wherein the attachment position of the reinforcing sheet corresponds to the position of the sensing functional layer.

14. The manufacturing method according to claim 10, characterized in that, After forming the composite structure, the manufacturing method further includes coating the composite structure with a release film.

15. An electronic device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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