Display module, manufacturing method of display module, display screen and electronic equipment

Abstract

The embodiment of the invention provides a display module, a manufacturing method of the display module, a display screen and electronic equipment. The display module comprises a pixel definition layer, a plurality of sub-pixels, a cathode layer, a conductive part and a substrate. The first side and the second side of the plane where the pixel definition layer is located are opposite in the thickness direction of the display module. The plurality of sub-pixels are arranged on the pixel definition layer, and an interval is arranged between the adjacent sub-pixels. The face, facing the first side, of each sub-pixel is covered with a cathode layer. The cathode layer has a conductive portion. The conduction parts are located at intervals between the adjacent sub-pixels and are exposed on the second side. And each conduction part is provided with a conductive part. The conductive part is located on the second side and is connected with the conduction part. The conductive part is connected with a power supply. The substrate is located on the second side, and at least part of the conductive part is located in the substrate. The display module can reduce the connection difficulty of the cathode layer and the power supply.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, a method for manufacturing a display module, a display screen, and electronic equipment. Background Technology

[0002] Currently, mobile phones, computers, and other electronic devices have played an important role in people's lives and work, greatly facilitating their lives and work.

[0003] Electronic device displays typically consist of a display module and a cover plate. The cover plate covers the display module to protect it. The display module has a pixel definition layer, multiple sub-pixels, an anode layer, and a cathode layer. Multiple sub-pixels are disposed on the pixel definition layer. The anode and cathode layers are located on opposite sides of the pixel definition layer in the thickness direction of the display module and cover each sub-pixel, used to excite the sub-pixels to emit light. Metal isolation pillars are disposed on the pixel definition layer of the display module. The metal isolation pillars and the cathode layer are located on the same side of the pixel definition layer. The cathode layer overlaps the metal isolation pillars so that the cathode layer can be connected to the power supply of the electronic device through the metal isolation pillars. Driven by the voltage of the power supply, the cathode layer and the anode layer can excite the sub-pixels to emit light.

[0004] However, the overlap of the cathode layer on the metal isolation pillar is difficult, making the connection between the cathode layer and the power supply more challenging. Summary of the Invention

[0005] This application provides a display module, a method for manufacturing the display module, a display screen, and an electronic device, which can reduce the difficulty of connecting the cathode layer and the power supply while ensuring that the cathode layer in the display module is connected to the power supply.

[0006] In a first aspect, embodiments of this application provide a display module, the display module comprising:

[0007] The pixel definition layer has its first and second sides on the plane containing the pixel definition layer relative to each other in the thickness direction of the display module.

[0008] Multiple sub-pixels, which are set in the pixel definition layer and have a gap between adjacent sub-pixels;

[0009] A cathode layer is provided, with each sub-pixel having a cathode layer covering the side facing the first side. The cathode layer has a conductive portion located at a distance and exposed on the second side.

[0010] A conductive part is located on the second side and connected to a conductive part. The conductive part is used to connect to a power source.

[0011] A substrate, located on the second side, with at least a portion of the conductive portion located within the substrate.

[0012] This application, through the provision of conductive portions in the cathode layer and conductive portions in the display module, enables the cathode layer to be connected to the power supply via these portions. This allows the cathode layer to excite the covered sub-pixels to emit light under voltage drive, thereby realizing the display function of the display module. Furthermore, since the conductive portions are located on the second side, away from the cathode layer in the pixel definition layer, during the cathode layer fabrication process using vapor deposition, the cathode layer material can naturally fall along the thickness direction of the display module to form the conductive portions. This eliminates the need to control the vapor deposition angle, reducing the difficulty of connecting the cathode layer and the conductive portions. This makes it easier to connect the cathode layer to the power supply, solving the problem of high connection difficulty between the cathode layer and the power management module in existing display modules.

[0013] In some embodiments, the conductive part is provided with a conductive part in the thickness direction of the display module, so that the conductive part corresponds one-to-one with the conductive part in the thickness direction of the display module, so that the conductive part of the cathode layer covered on each sub-pixel can be connected to the power supply through the corresponding conductive part, thereby exciting the covered sub-pixel to emit light through the cathode layer, and realizing the display function of the display module.

[0014] In some embodiments, the pixel definition layer has through holes at corresponding intervals, and the conductive portion is located inside the through holes, so that the conductive portion can be exposed on the second side of the pixel definition layer through the through holes while ensuring that the conductive portion is located at the interval between adjacent sub-pixels.

[0015] In some embodiments, the pixel definition layer has pixel openings at positions corresponding to each sub-pixel, with a gap between adjacent pixel openings, and at least a portion of the sub-pixel is located within the corresponding pixel opening;

[0016] The via is located between adjacent pixel openings to enable the sub-pixel to be set in the pixel definition layer while the via is located at the corresponding interval in the pixel definition layer.

[0017] In some embodiments, a portion of the edge region of the cathode layer is located within a through-hole, and a conductive portion is formed within the through-hole to achieve connection between the cathode layer and the conductive portion.

[0018] In some embodiments, the conductive portion is flush with the surface of the pixel definition layer facing the second side, or the conductive portion protrudes from the surface of the pixel definition layer facing the second side.

[0019] Compared to embedding the conductive portion within the pixel definition layer, when the conductive portion is flush with the second-side surface of the pixel definition layer, or protrudes from the second-side surface of the pixel definition layer, it not only allows for a larger dimension of the conductive portion in the thickness direction of the display module, thus enhancing the stability of the connection between the cathode layer and the power supply by improving the connection stability between the cathode layer and the conductive portion, but also eliminates the need for precise control of the amount of cathode overflow into the pixel definition layer during the cathode layer fabrication process. This simplifies the display module manufacturing process and reduces its manufacturing cost. Furthermore, the conductive portion can be completely located within the substrate and integrally formed with the substrate, eliminating the need for it to protrude from the substrate surface facing the pixel definition layer, further simplifying the display module manufacturing process and reducing its cost.

[0020] In some embodiments, the conductive parts are all located within the substrate, so that the conductive parts can be integrally formed with the substrate without the conductive parts protruding from the surface of the substrate facing the pixel definition layer. This can further simplify the manufacturing process of the display module and reduce the manufacturing cost of the display module.

[0021] In some embodiments, the display module further includes an anode layer, the anode layer including a transition portion, the transition portion being disposed on the side of the conductive portion facing the conductive portion, the conductive portion being connected to the conductive portion through the transition portion, so as to realize the conduction between the conductive portion and the conductive portion by utilizing the anode layer of the display module.

[0022] In some embodiments, a portion of the sub-pixel is exposed on the second side; the anode layer also includes a cover portion, which covers the side of the sub-pixel facing the second side, and the cover portion is used for connection to a power source;

[0023] Each cover is interconnected so that when any one of the covers is connected to the power supply, all covers can be connected to the power supply. Furthermore, there is a gap between the cover and the adapter to prevent short circuits when the cover and the adapter are connected, thus ensuring normal power supply between the cover and the cathode layer.

[0024] In some embodiments, the cathode layer has two or more conductive portions. Compared to a cathode layer with only one conductive portion, having two or more conductive portions enhances the connection stability between the cathode layer and the power supply, thereby enhancing the stability of light emission from the sub-pixel.

[0025] In some embodiments, the display module further includes a first encapsulation layer, wherein the side of each cathode layer away from the sub-pixel is covered by the first encapsulation layer;

[0026] There is a gap between adjacent first encapsulation layers, and the gap is opposite to the interval in the thickness direction of the display module.

[0027] By designing the gaps, the overlapping of adjacent first encapsulation layers can be avoided while ensuring the reliability of the first encapsulation layer's encapsulation of the cathode layer and sub-pixels. This ensures a high degree of flatness for the display module at adjacent first encapsulation layers, thus solving the leveling problem of the second encapsulation layer. This ensures a good leveling effect for the second encapsulation layer on the first encapsulation layer, improving the folding reliability of the display screen. Furthermore, the gaps are aligned with the spacing between adjacent sub-pixels in the thickness direction (Z direction) of the display module, ensuring both the leveling problem of the second encapsulation layer and the encapsulation reliability of the sub-pixels.

[0028] In some embodiments, the gap is between adjacent cathode layers;

[0029] The pixel definition layer or the side of the substrate facing the cathode layer has an open barrier cavity;

[0030] An isolation cavity is positioned between adjacent cathode layers and corresponds to the gap, with its opening facing the gap. The isolation cavity isolates adjacent cathode layers, creating a disconnect at the gap. This reduces the risk of electrochemical corrosion of the cathode layers due to the gap and prevents the spread of electrochemical corrosion between adjacent cathode layers, thus reducing the risk of sub-pixel erosion and consequently reducing the risk of black spots in the display module, improving the reliability of the display. Furthermore, when adjacent cathode layers are disconnected at the gap, the power supply can still provide the required voltage to the covered sub-pixels through each cathode layer. This allows for differentiated voltage settings for sub-pixels while avoiding power waste caused by sub-pixels with low voltage requirements, improving low grayscale effects and ultimately enhancing the display's overall performance.

[0031] In some embodiments, the size of the barrier cavity at the opening is smaller than the size of the inner cavity of the barrier cavity, so that the barrier cavity has a smaller size at the opening. In this way, when the cathode material is deposited on each sub-pixel, the film layer formed by the cathode material in the barrier cavity cannot grow around the inner wall of the barrier cavity toward the opening. And through the opening, the film layer formed by the cathode material at adjacent sub-pixels is in a broken state, thereby realizing the barrier cavity's barrier effect on adjacent cathode layers.

[0032] In some embodiments, the barrier cavity includes a groove and an isolation portion, and the pixel definition layer or the side of the substrate facing the cathode layer has a groove, the groove being located between adjacent cathode layers and at the corresponding gap;

[0033] The isolation section is positioned at part of the groove opening and forms a barrier cavity with the groove.

[0034] The opening corresponds to the unisolated opening of the groove, and the groove wall forms a cavity.

[0035] When the dimensions within the groove remain constant, the size of the groove communicating with the outside at the opening can be reduced due to the blocking of the isolation part, so that the size of the formed barrier cavity at the opening is smaller than the size of the barrier cavity inside the cavity.

[0036] In some embodiments, along the width direction of the groove, isolation portions are provided on both sides of the groove opening to block the groove opening on both sides in the width direction through the two isolation portions, so as to further reduce the size of the barrier cavity in the opening.

[0037] In some embodiments, the barrier cavities are interconnected to form a barrier mesh, which enables each cathode layer to be independent of each other, preventing the spread of electrochemical corrosion between adjacent cathode layers.

[0038] In some embodiments, the barrier cavity has a cathode material layer, and the barrier cavity is isolated between the cathode material layer and an adjacent cathode layer.

[0039] The cathode material layer is used to make the cathode layer.

[0040] Since the barrier cavity is located between the cathode material layer and the adjacent cathode layer, it can prevent the spread of electrochemical corrosion of the cathode material layer in the barrier cavity to the adjacent cathode layer, ensuring that the cathode layer has a low risk of electrochemical corrosion. This results in a lower risk of black spots in the display module of this application, which can improve the reliability of the display module.

[0041] In some embodiments, the isolation portion in the barrier cavity is an insulating isolation portion to prevent the cathode material layer in the barrier cavity from spreading to the adjacent cathode layer through the isolation portion after electrochemical corrosion occurs, thereby further reducing the risk of electrochemical corrosion of the cathode layer and improving the reliability of the display module.

[0042] In some embodiments, the plurality of sub-pixels includes a plurality of first sub-pixels, a plurality of second sub-pixels, and a plurality of third sub-pixels, wherein the first sub-pixels, second sub-pixels, and third sub-pixels can display different colors; the conductive portions at the first sub-pixels, second sub-pixels, and third sub-pixels are all interconnected to form a conductive mesh, or...

[0043] The conductive portions at each first sub-pixel are interconnected to form a first conductive mesh;

[0044] The conductive portions at each second sub-pixel are interconnected to form a second conductive mesh;

[0045] The conductive parts at each third sub-pixel are interconnected to form a third conductive mesh;

[0046] The first conductive mesh, the second conductive mesh, and the third conductive mesh are independent of each other.

[0047] In this way, when the first, second, and third conductive grids are respectively connected to the power supply, the power supply can provide the required voltage signals to each first sub-pixel, each second sub-pixel, and each third sub-pixel through the first, second, and third conductive grids. This activates the first, second, and third sub-pixels while enabling differentiated voltage settings for the sub-pixels. This avoids wasted power consumption caused by sub-pixels with low voltage requirements, improves low grayscale effects, and thus enhances the display effect of the screen.

[0048] In some embodiments, the thickness of the conductive portion is greater than the thickness of the cathode layer. Since sheet resistance is inversely proportional to thickness, the conductive portion has a smaller sheet resistance compared to the cathode layer. Furthermore, compared to the cathode layer being entirely connected to the power supply, the conductive portion allows for a longitudinal connection (connection in the Z-direction) between the cathode layer and the conductive portion. When the cathode layer is connected to the power supply through the conductive portion, the signal transmitted by the power supply is transmitted to the cathode layer along the thickness direction (Z-direction) of the display module via the conductive portion. This provides the required voltage to the cathode layer while preventing high-signal and low-signal areas from appearing on the cathode layer, ensuring the display effect of the screen. In addition, when the cathode layer is connected to the power supply through a conductive portion with lower sheet resistance, the signal loss of the power supply reaching the cathode layer is reduced, thereby reducing the voltage drop of the cathode layer and improving the VDS voltage across the display module and power consumption.

[0049] In some embodiments, the conductive part is a metal wire. While enabling the conductive part to be connected to the power source through the conductive part, the conductive properties of the metal can be utilized to allow the signal transmitted by the power source to be transmitted to the cathode layer through the conductive part.

[0050] In some embodiments, the display module further includes a substrate located on the second side, so that the substrate can serve as a carrier plate for the pixel definition layer within the display module.

[0051] The conductive portion is located within the substrate to fix it within the display module. Furthermore, since the substrate is located on the second side of the pixel definition layer, and the conductive portion is exposed on the second side of the pixel definition layer, the conductive portion can be located below the conductive portion to achieve a longitudinal connection (Z-direction connection) between the cathode layer and the conductive portion at the conductive portion.

[0052] Secondly, embodiments of this application also provide a method for manufacturing a display module, used to prepare a display module as described in any of the above claims, the method comprising:

[0053] A conductive portion is formed on a substrate such that at least a portion of the conductive portion is located within the substrate, and the conductive portion is used to connect to a power source.

[0054] Create a pixel definition layer on the conductive part;

[0055] Multiple pixel devices are fabricated on the pixel definition layer to obtain a display module;

[0056] The first and second sides of the plane where the pixel definition layer is located are opposite each other in the thickness direction of the display module; the pixel device includes a cathode layer and sub-pixels, and the sub-pixels in each pixel device are disposed in the pixel definition layer, with a gap between adjacent sub-pixels;

[0057] Each sub-pixel has a cathode layer covering its side facing the first side. The cathode layer has a conductive portion located at intervals and exposed on the second side. A conductive portion is provided at each conductive portion, located on the second side and connected to the conductive portion, to achieve conductivity between the cathode layer and the power supply, thereby activating the sub-pixels covered by the cathode layer to emit light and realize the display function of the display module. Furthermore, since at least a portion of the conductive portion is located within the substrate, this allows for both the placement of the conductive portion within the display module and the vertical connection between the cathode layer and the conductive portion.

[0058] In some embodiments, the plurality of pixel devices includes a plurality of first pixel devices, a plurality of second pixel devices, and a plurality of third pixel devices, wherein the sub-pixels in the first pixel devices, second pixel devices, and third pixel devices can display different colors;

[0059] Multiple pixel devices are fabricated on the pixel definition layer, including:

[0060] Fabricate the first pixel device on the pixel definition layer;

[0061] Fabricate a second pixel device on the pixel definition layer;

[0062] Create a third pixel device on the pixel definition layer.

[0063] This allows the first pixel device, the second pixel device, and the third pixel device to be formed sequentially on the pixel definition layer. This enables the patterning design of subpixels on the pixel definition layer while eliminating the need for a fine metal mask during the manufacturing process of the display module, thereby reducing the manufacturing cost of the display module.

[0064] In some embodiments, the pixel definition layer has a plurality of pixel openings, including a first pixel opening, a second pixel opening, and a third pixel opening;

[0065] The sub-pixel in the first pixel device is the first sub-pixel. The first pixel device is fabricated on the pixel definition layer, including:

[0066] Set the first sub-pixel within multiple pixel openings;

[0067] A cathode material layer and an encapsulation material layer are formed sequentially on the side of the first sub-pixel facing the first side, such that the cathode material layer covers the first side of the pixel definition layer and the encapsulation material layer covers the cathode material layer.

[0068] The first sub-pixel, the encapsulation material layer, and the cathode material layer formed at the second pixel opening and the third pixel opening are removed to obtain the first pixel device at the first pixel opening, thereby completing the fabrication of the first pixel device and realizing the patterned design of the first sub-pixel on the pixel definition layer.

[0069] The retained cathode material layer forms the cathode layer, and the retained encapsulation material layer forms the first encapsulation layer.

[0070] In some embodiments, the sub-pixels in the second pixel device are second sub-pixels. Fabricating the second pixel device on the pixel definition layer includes:

[0071] The second sub-pixel is set within multiple pixel openings, and the second pixel device is obtained at the second pixel opening according to the method of obtaining the first pixel device at the first pixel opening, thereby completing the fabrication of the second pixel device and realizing the patterned design of the second sub-pixel on the pixel definition layer.

[0072] In some embodiments, the sub-pixels in the third pixel device are third sub-pixels. Fabricating the third pixel device on the pixel definition layer includes:

[0073] The third sub-pixel is set within multiple pixel openings, and the third pixel device is obtained at the third pixel opening using the same method as the first pixel device obtained at the first pixel opening, thereby completing the fabrication of the third pixel device and realizing the patterned design of the third sub-pixel on the pixel definition layer.

[0074] Thirdly, embodiments of this application also provide a display screen, which includes a cover plate and a display module, with the cover plate covering the display module;

[0075] The display module may be a display module as described above, or may be manufactured using any of the manufacturing methods described above.

[0076] By setting the conductive and conductive parts in the display module, the cathode layer can be easily connected to the power supply to realize the display function of the display module.

[0077] Fourthly, embodiments of this application also provide an electronic device, which includes a housing and a display screen as described above, the display screen being mounted on the housing.

[0078] By setting the conductive and conductive parts in the display module, the cathode layer can be easily connected to the power supply to realize the display function of the display module. Attached Figure Description

[0079] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0080] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0081] Figure 3 This is a schematic diagram of a stacked structure of a display screen provided in an embodiment of this application;

[0082] Figure 4 A schematic diagram illustrating the connection between a display module and a power supply, provided in an embodiment of this application;

[0083] Figure 5 A partial top view of a display module provided in an embodiment of this application;

[0084] Figure 6 for Figure 5 A partial cross-sectional view of the display module in the AA direction;

[0085] Figure 7 A partial top view of another display module provided in an embodiment of this application;

[0086] Figure 8 for Figure 7 A partial cross-sectional view of the display module in the BB direction;

[0087] Figure 9 A partial cross-sectional view of another display module provided in an embodiment of this application;

[0088] Figure 10 for Figure 8 Enlarged view of section C;

[0089] Figure 11 A partial cross-sectional view of another display module provided in an embodiment of this application;

[0090] Figure 12 for Figure 11 Enlarged view at point D;

[0091] Figure 13 for Figure 7 Partial structure of a display module without a cathode material layer inside the middle barrier cavity;

[0092] Figure 14 A sub-pixel arrangement method provided for embodiments of this application;

[0093] Figure 15 Another arrangement of sub-pixels provided in the embodiments of this application;

[0094] Figure 16 A schematic diagram showing the connection of each conductive part when different types of sub-pixels are routed separately, as provided in the embodiments of this application.

[0095] Figure 17A schematic diagram showing the connection of each conductive part when each sub-pixel shares a conductive mesh, as provided in an embodiment of this application.

[0096] Figure 18 This application provides an embodiment of another connection diagram of each conductive part when each sub-pixel shares a conductive mesh;

[0097] Figure 19 This is a partial view of a pixel definition layer on which a cathode material layer and an encapsulation material layer are formed, provided in an embodiment of this application.

[0098] Figure 20 A partial view of a first pixel device formed on a pixel definition layer provided in an embodiment of this application;

[0099] Figure 21 A schematic diagram illustrating a portion of the process of obtaining a first pixel device at the first pixel opening, provided in an embodiment of this application;

[0100] Figure 22 This is a schematic diagram illustrating the process of obtaining a second pixel device at the second pixel opening, as provided in an embodiment of this application.

[0101] Figure label:

[0102] 100 - Electronic devices;

[0103] 1-Shell; 11-Middle plate; 12-Frame;

[0104] 2-Display screen;

[0105] 21-Cover plate;

[0106] 22-Substrate; 221-Conductive part; 222-Metal connecting wire;

[0107] 23-Encapsulation layer; 231-First encapsulation layer;

[0108] 24-Pixel definition layer; 241-Metal isolation pillar; 242-Barrier cavity; 2421-Opening; 2422-Groove; 2423-Isolation section; 243-Second pixel opening;

[0109] 25 - Subpixel; 25a - Blue subpixel; 25b - Red subpixel; 25c - Green subpixel; 251 - First subpixel; 252 - Second subpixel; 253 - Third subpixel;

[0110] 26-Anode layer; 261-Transfer section; 262-Cover section;

[0111] 27-Cathode layer; 271-Conducting section;

[0112] 28 - Padding area;

[0113] 29-Pixel device; 291-First pixel device; 292-Second pixel device; 293-Cathode material layer; 294-Encapsulation material layer; 295-Pixel protection layer; 296-Mask;

[0114] 3-Back cover;

[0115] 4-Circuit board; 41-Power supply;

[0116] 200-Metallic trace;

[0117] X direction - length direction of the display module; Y direction - width direction of the display module; Z direction - thickness direction of the display module. Detailed Implementation

[0118] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0119] This application provides an electronic device. The electronic device can be referred to as a user equipment (UE) or terminal, etc. For example, the electronic device can be a portable Android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc. This application does not specifically limit the form of the electronic device.

[0120] Figure 1 A schematic overall view of an electronic device 100 is shown. See also Figure 1 As shown, electronic device 100 is a handheld device with wireless communication capabilities. For example, a handheld device with wireless communication capabilities can be a mobile phone.

[0121] When the handheld device with wireless communication capabilities is a mobile phone, the mobile phone can... Figure 1The non-folding phone illustrated can also be a folding phone. Compared to non-folding phones, folding phones can change the configuration of electronic device 100, giving it a foldable function. This satisfies users' needs for a larger display screen 2 on electronic device 100 while also making it easier for users to carry.

[0122] The following is based on Figure 1 Using a non-foldable mobile phone as an example, the structure of the electronic device 100 of this application will be further explained.

[0123] Figure 2 schematically shown Figure 1 Exploded view of electronic device 100 in the image. Figure 2 The diagram shows only a portion of the structure of the electronic device 100 and does not constitute a limitation on the structure of the electronic device 100.

[0124] The following combination Figure 1 and Figure 2 The structure of the electronic device 100 is described in detail.

[0125] See Figure 1 and Figure 2 As shown, the electronic device 100 includes a housing 1 and a display screen 2. The housing 1 is the main supporting structure of the electronic device 100. The display screen 2 is mounted on the housing 1. The display screen 2 can provide a display interface and an interactive interface with the user for the electronic device 100. The display screen 2 can be, but is not limited to, an organic light-emitting diode (OLED) display screen. For example, in some embodiments, the display screen 2 can also be a microorganic light-emitting diode (micro-OLED) display screen, a micro organic light-emitting diode (micro-OLED) display screen, etc. In this embodiment, an OLED display screen is used as an example for explanation.

[0126] See Figure 2 As shown, the housing 1 can be the mid-frame of an electronic device 100 (e.g., a mobile phone). The housing 1 includes a mid-plate 11 and a frame 12 connected to each other. The frame 12 can be a square ring structure formed by multiple side frames 12 joined end to end. The frame 12 surrounds the peripheral edge of the mid-plate 11 and is connected to the peripheral edge of the mid-plate 11. The display screen 2 can be mounted on the frame 12 and form a cavity with the housing 1, so that the display screen 2 can be fixed on the housing 1, and some structural components of the electronic device 100 can be assembled in the cavity formed by the display screen 2 and the housing 1. For example, the structural components can be a camera module, etc.

[0127] Continue to see Figure 2 The electronic device 100 may also include a back cover 3. The back cover 3 is disposed on the side of the housing 1 away from the display screen 2 and is connected to the frame 12 to secure the back cover 3 to the housing 1. The back cover 3 and the housing 1 may also form another cavity within the electronic device 100, facilitating the installation of other structural components and further enabling the assembly of these components within the cavity formed by the back cover 3 and the housing 1. For example, in addition to the camera module, other structural components may include circuit boards 4, batteries, and other devices.

[0128] Continue to see Figure 2 Circuit board 4 typically houses a large number of electronic components (not shown). These components may include processor modules, system-on-chips (SoCs), storage modules, communication modules, radio frequency modules, charging management modules, and power management ICs (PMICs).

[0129] Figure 3 A schematic diagram of a stacked structure for a display screen 2 is shown. See also Figure 3 As shown, the display screen 2 includes a cover plate 21 and a display module. The display module is the unit in the display screen 2 that performs the display function. The cover plate 21 is placed on the display module to protect it. When the cover plate 21 is placed on the display module, it can be connected to the display module by means of adhesive bonding, hot pressing, etc., to achieve the fixation of the cover plate 21 on the display module. The cover plate 21 can be a light-transmitting plate structure to facilitate the display of the display module. For example, the cover plate 21 can be a transparent glass plate.

[0130] The processor module on circuit board 4 can be connected to the display module to control the display brightness of the display module, reduce power consumption, and adjust the display brightness of the display module according to the intensity of ambient light outside the electronic device 100, so that the display screen 2 can achieve better display effect and improve user experience.

[0131] The power management module on circuit board 4 is used to connect the battery, charging management module, processor module, display module, camera module, etc. The power management module can receive input from at least one of the battery and charging management module to supply power to the processor module, display module, camera module, etc.

[0132] Continue to see Figure 3 The display module includes a substrate 22, a light-emitting unit (not shown), and an encapsulation layer 23. Along the thickness direction of the display module, the light-emitting unit and the encapsulation layer 23 are sequentially stacked on the substrate 22. The thickness direction of the display module can be found in [reference needed]. Figure 3In the Z-direction. The cover plate 21 can be placed on the encapsulation layer 23 and can be connected to the display module by the bonding, hot pressing or other methods mentioned above.

[0133] The light-emitting unit is the main light-emitting film layer of the display module, which can generate light and realize the display function of the display screen 2. For example, the display module can generate red, green and blue primary colors of light to form a three-primary-color light model (RGB color model, or RGB mode for short), thereby generating light and realizing the display function of the display screen 2.

[0134] The light-emitting unit has a pixel definition layer 24 and a plurality of sub-pixels 25. The pixel definition layer 24 can be an inorganic material layer or an organic material layer. The plurality of sub-pixels 25 are disposed on the pixel definition layer 24. For example, at least a portion of the sub-pixels 25 can be disposed within the pixel definition layer 24. Alternatively, the sub-pixels 25 can also be disposed on the first side of the plane where the pixel definition layer 24 is located, and by processing the pixel definition layer 24 at the positions of the corresponding sub-pixels 25, the anode layer 26 in the light-emitting unit can be connected to the sub-pixels 25 on the second side of the plane where the pixel definition layer 24 is located, and transmit signals. In this application, the arrangement of the sub-pixels 25 on the pixel definition layer 24 is not particularly limited. It should be noted that the structure of the anode layer 26 will be further described below. The first side and the second side of the plane where the pixel definition layer 24 is located are opposite to each other in the thickness direction of the display module, that is, the pixel definition layer 24 has a first side and a second side disposed opposite to each other in the thickness direction of the display module. When the display module is applied to the electronic device 100, the first side of the pixel definition layer 24 faces the cover plate 21.

[0135] With regard to the fact that at least a portion of sub-pixel 25 can be set within pixel definition layer 24, pixel definition layer 24 has pixel openings. See also Figure 3 Subpixel 25 can be entirely located within the pixel opening, or subpixel 25 can be partially located within the pixel opening.

[0136] The following section will further elaborate on the structure of the display module, taking the example that at least a portion of sub-pixel 25 can be set within pixel definition layer 24.

[0137] Multiple subpixels 25 typically include multiple red photonic subpixels, multiple green photonic subpixels, and multiple blue photonic subpixels. Red photonic subpixels produce red light. Green photonic subpixels produce green light. Blue photonic subpixels produce blue light. By arranging the red photonic subpixels, multiple green photonic subpixels, and multiple blue photonic subpixels, a display module pattern can be formed, thereby generating light and realizing the display function of display screen 2.

[0138] It should be noted that in some embodiments, in addition to red, green, and blue sub-pixels, the plurality of sub-pixels 25 may also include sub-pixels 25 of more colors. For example, the plurality of sub-pixels 25 may also include white sub-pixels. In this application, the types of sub-pixels 25 among the plurality of sub-pixels 25 are not particularly limited.

[0139] The following text uses multiple sub-pixels 25, which include only red, green, and blue sub-pixels, as an example to further illustrate the structure of the display module.

[0140] Continue to see Figure 3 In addition to the pixel definition layer 24 and multiple sub-pixels 25, the light-emitting unit also includes an anode layer 26 and a cathode layer 27. The anode layer 26 can be a transparent electrode. The material used to fabricate the anode layer 26 can be formed on the substrate 22 by means of vapor deposition or the like, so that the anode layer 26 is obtained on the substrate 22. The material used to fabricate the anode layer 26 can be a transparent conductive material. For example, the material used to fabricate the anode layer 26 can be indium tin oxide (ITO).

[0141] The cathode layer 27 can be a transparent electrode that transmits light. Similarly, the material used to fabricate the cathode layer 27 can be formed on the pixel definition layer 24 by methods such as vapor deposition, so that the cathode layer 27 is obtained on the pixel definition layer 24. The material used to fabricate the cathode layer 27 can be a conductive material that transmits light. For example, the material used to fabricate the cathode layer 27 can be a magnesium-silver alloy, etc.

[0142] A cathode layer 27 is disposed on the first side of the pixel definition layer 24. An anode layer 26 is disposed on the second side of the pixel definition layer 24. Both the anode layer 26 and the cathode layer 27 cover the sub-pixel 25 and are used to excite the sub-pixel 25 to emit light under voltage driving. For example, a photon sub-pixel can generate red light after being excited, a green photon sub-pixel can generate green light after being excited, and a blue photon sub-pixel can generate blue light after being excited.

[0143] The anode layer 26 and cathode layer 27 can be connected to a power supply within the electronic device 100. For example, the anode layer 26 can be connected to the positive signal terminal of the power supply, and the cathode layer 27 can be connected to the negative signal terminal of the power supply. The power supply can provide voltage to the anode layer 26 and cathode layer 27, enabling them to excite the sub-pixel 25 to emit light under voltage drive. The power supply can be a power management module on the circuit board 4, or other power supply modules capable of providing voltage to the anode layer 26 and cathode layer 27.

[0144] It should be noted that this application does not limit the connection between the anode layer 26 and the power supply. For example, the anode layer 26 can be connected to the positive signal terminal of the power supply through a field-effect transistor in the display module. The following details the connection between the cathode layer 27 and the power management module.

[0145] In the following text, the power supply may be identified by the number 41. Figure 4 This diagram illustrates the connection between a display module and a power management module according to an embodiment of this application. It should be noted that, to facilitate differentiation between different display modules, the same component within a display module can be identified using different designations. For example, in the display modules provided in different embodiments, the cathode layer can be identified as 27, 27a, and 27b.

[0146] See Figure 4 As shown, the cathode layer 27a of the display module is a continuous layered structure. The cathode layer 27a covers the first side of each sub-pixel 25 (not shown) in the light-emitting unit facing the pixel definition layer 24. The cathode layer 27a is entirely bonded to the metal trace 200. The metal trace 200 is located at the peripheral edge of the display module and is connected to the power supply 41 in the pad area 28 of the display module, thereby realizing the connection between the cathode layer 27a and the power supply 41. It should be noted that the pad area 28 can also be called the bonding area. The pad area 28 can be understood as the area on the periphery of the display module where the cathode layer 27a and the anode layer 26 are connected to the external circuitry.

[0147] Sheet resistance, also known as sheet resistance, refers to the resistance between edges of a square thin-film conductive material. Since sheet resistance is inversely proportional to thickness, the smaller the thickness, the larger the sheet resistance. Because the cathode layer 27a typically has a relatively small thickness, it has a relatively large sheet resistance. Furthermore, when the cathode layer 27a is connected to the power management module, the signal transmitted by the power supply 41 will propagate along the cathode layer 27a within its plane. This results in poor signal uniformity on the cathode layer 27a, creating high-signal and low-signal areas that affect the display effect of the screen 2. The direction of the thickness of the cathode layer 27a can be seen in the Z-direction.

[0148] to this end, Figure 5 A portion of sub-pixels 25 of a display module provided in an embodiment of this application is shown. Figure 5 The substrate 22 of the display module is not shown. See also Figure 5As shown, the display module has metal isolation pillars 241 on the pixel definition layer 24 (not shown). The metal isolation pillars 241 can be made of a viable metal. For example, the metal isolation pillars 241 can be made of aluminum. The metal isolation pillars 241 and the cathode layer 27 are located on the same side of the pixel definition layer 24. That is, the metal isolation pillars 241 are also located on the first side of the pixel definition layer 24. The pixel definition layer 24 has metal isolation pillars 241 between adjacent sub-pixels 25. The metal isolation pillars 241 are provided between adjacent sub-pixels 25 in a first direction. For example, the first direction can be the X direction or a direction a which is at an angle to the X direction. The length direction of the display module can be represented by the X direction. The metal isolation pillars 241 are provided between adjacent sub-pixels 25 in a second direction. The second direction is perpendicular to the first direction. For example, the second direction can be the Y direction or a direction b which is at an angle to the Y direction. The width direction of the display module can be represented by the Y direction. The X and Y directions are perpendicular to the Z direction mentioned above. The a-direction, b-direction, X-direction, and Y-direction are all coplanar.

[0149] The following text uses direction a as the first direction and direction b as the second direction as an example to further explain the structure of the display module. For ease of description, blue sub-pixels are identified as 25a, red sub-pixels as 25b, and green sub-pixels as 25c.

[0150] Continue to see Figure 5 When the pixel definition layer 24 has metal isolation pillars 241 positioned between adjacent sub-pixels 25, for example, the pixel definition layer 24 has metal isolation pillars 241 between blue sub-pixels 25a and green sub-pixels 25c in the first direction. For example, the pixel definition layer 24 has metal isolation pillars 241 between green sub-pixels 25c and red sub-pixels 25b in the second direction. The metal isolation pillars 241 on the pixel definition layer 24 can be interconnected to form a mesh structure.

[0151] Figure 6 Schematic illustration Figure 5 A partial cross-sectional view of the display module in the AA direction. See also... Figure 6 As shown, the cathode layer 27b covers the side of each sub-pixel 25 facing the pixel definition layer 24. The cathode layer 27b has a clearance opening (not shown) at the location corresponding to the metal isolation pillar 241, so that the end of the metal isolation pillar 241 can be exposed outside the cathode layer 27b through the clearance opening. That is, the metal isolation pillar 241 can be seen from the side of the cathode layer 27b away from the sub-pixel 25. The cathode layer 27b can simultaneously overlap the metal isolation pillar 241, and the cathode layer 27b is connected to the power supply 41 through the metal isolation pillar 241 to achieve the connection between the cathode layer 27b and the power supply.

[0152] It should be noted that in this application, "B can be seen from one side of A" means that B is visible on that side of A before other components are covered, regardless of whether it is visible in the overall system environment or other application environments. For example, the above-mentioned "metal isolation pillar 241 can be seen from the side of cathode layer 27b away from sub-pixel 25" can be understood as the metal isolation pillar 241 being visible on the cathode layer 27b before the encapsulation layer 23 is covered. Any similar descriptions of "B can be seen from one side of A" in the following text can be interpreted in the same way.

[0153] Continue to see Figure 6 The metal isolation pillar 241 has a relatively large thickness. The direction of the thickness of the metal isolation pillar 241 can be seen in the Z-direction. Since sheet resistance is inversely proportional to thickness, the metal isolation pillar 241 has a smaller sheet resistance than the cathode layer 27b due to its larger thickness. Therefore, when the cathode layer 27b is connected to the power supply through the metal isolation pillar 241, the signal transmitted by the power supply 41 is transmitted to the cathode layer 27b along the thickness direction of the metal isolation pillar 241. Furthermore, because the cathode layer 27b has a smaller sheet resistance, high-signal and low-signal regions formed on the cathode layer 27a by the signal transmitted by the power supply 41 can be avoided.

[0154] However, see continue. Figure 6 The display module has the following defects:

[0155] Since the metal isolation pillars 241 and the cathode layer 27b are located on the same side of the pixel definition layer 24, the evaporation angle needs to be controlled when the cathode layer 27b is formed on each sub-pixel 25 by evaporation. By controlling the evaporation angle, it is ensured that the material of the cathode layer 27b can be deposited on the metal isolation pillars 241 along the thickness direction (Z direction) of the display module, so as to achieve the overlap between the cathode layer 27b and the metal isolation pillars 241. However, since the evaporation angle needs to be controlled when forming the cathode layer 27b, the overlap between the cathode layer 27b and the metal isolation pillars 241 is relatively difficult, making the connection between the cathode layer 27b and the power supply more difficult.

[0156] In view of this, this application provides a display module. The display module has a cathode layer. Through the conductive portion in the cathode layer and the conductive portion in the display module, the conductive portion can be connected to a power source, thereby connecting the cathode layer to the power source and realizing the display function of the display module. Furthermore, the cathode layer in the display module of this application can naturally droop during manufacturing to form a conductive portion connected to the conductive portion, eliminating the need to control the evaporation angle of the cathode layer material during evaporation. This reduces the difficulty of connecting the cathode layer to the conductive portion, making it easier to connect the cathode layer to the power source.

[0157] The structure of the display module of this application will be further described below with reference to the accompanying drawings and embodiments.

[0158] Figure 7 A partial top view of another display module is shown schematically. As described above, the display module includes light-emitting units (not shown). See also Figure 7 As shown, the light-emitting unit includes multiple sub-pixels 25. As described above, the multiple sub-pixels 25 include multiple red sub-pixels 25b, multiple green sub-pixels 25c, and multiple blue sub-pixels 25a. The colors of the light produced by the red sub-pixels 25b, green sub-pixels 25c, and blue sub-pixels 25a after being excited can be found in the relevant description above, and will not be repeated here.

[0159] Figure 8 It shows Figure 7 A partial cross-sectional view of the display module in the BB direction. See also... Figure 8 As shown, the light-emitting unit includes a pixel definition layer 24. As described above, multiple sub-pixels 25 are disposed in the pixel definition layer 24. There is a gap between adjacent sub-pixels 25 to avoid crosstalk between them. When at least a portion of a sub-pixel 25 is disposed within the pixel definition layer 24, the pixel definition layer 24 has a pixel opening (not shown) at each corresponding sub-pixel 25, with a gap between adjacent pixel openings. At least a portion of the sub-pixel 25 can be located within the corresponding pixel opening, and there is a gap between adjacent sub-pixels 25. While achieving the placement of each sub-pixel 25 within the pixel definition layer 24, the pixel definition layer 24 can separate adjacent sub-pixels 25, thereby avoiding crosstalk between them.

[0160] For example, the pixel definition layer 24 has a pixel opening at the corresponding blue sub-pixel 25a, and at least a portion of the blue sub-pixel 25a can be located within the corresponding pixel opening. The pixel definition layer 24 also has a pixel opening at the corresponding red sub-pixel 25b, and at least a portion of the red sub-pixel 25b can be located within the corresponding pixel opening. The pixel opening accommodating the blue sub-pixel 25a and the pixel opening accommodating the red sub-pixel 25b are spaced apart, and there is a gap between the blue sub-pixel 25a and the red sub-pixel 25b.

[0161] Subpixels 25 can be formed within the pixel openings of the pixel definition layer 24 by vapor deposition. Specifically, during vapor deposition, the molding material of the subpixel 25 can be sprayed into the corresponding pixel openings through the vapor deposition nozzles in the vapor deposition equipment to form the subpixel 25.

[0162] Continue to see Figure 8The light-emitting unit also includes a cathode layer 27. The cathode layer 27 can be a transparent electrode with light transmittance. The formation and materials of the cathode layer 27 can be found in the relevant description of the cathode layer 27 above, and will not be repeated here.

[0163] Each sub-pixel 25 has a cathode layer 27 covering its first side facing the pixel definition layer 24. Since there are multiple sub-pixels 25, there can also be multiple cathode layers 27. Each cathode layer 27 corresponds one-to-one with each sub-pixel 25 to ensure that each sub-pixel 25 is covered with a cathode layer 27. The cathode layer 27 has a conductive portion 271. The conductive portion 271 can be understood as part of the cathode layer 27. In some embodiments, the conductive portion 271 and other parts of the cathode layer 27 can be made of the same material, so that during the fabrication of the cathode layer 27, a portion of the fabricating material of the cathode layer 27 can naturally form the conductive portion 271, allowing the conductive portion 271 to be integrally formed with the cathode layer 27 without the need for a separate fabricating material, thus simplifying the manufacturing process of the display module. The natural formation of the conductive portion 271 will be further explained below in conjunction with other structures in the display module. The conductive portion 271 is located in the gap between adjacent sub-pixels 25 and is exposed on the first side of the pixel definition layer 24. That is, the conductive portion 271 can be seen from the first side of the pixel definition layer 24.

[0164] Continue to see Figure 8 The display module also includes a conductive portion 221. The conductive portion 221 is located on the second side of the pixel definition layer 24. That is, the conductive portion 221 is located on the side of the pixel definition layer 24 away from the cathode layer 27, rather than on the same side of the pixel definition layer 24 as the cathode layer 27. The conductive portion 221 is connected to the conductive portion 271. The conductive portion 221 is used to conduct electricity to the power supply 41.

[0165] This application allows for modification of the structure of the cathode layer 27 by incorporating the conductive portion 271. Furthermore, the conductive portion 221 enables the conductive portion 271 of the cathode layer 27 to be connected to the power supply 41, thereby connecting the cathode layer 27 to the power supply 41. This allows the cathode layer 27 to excite the covered sub-pixels 25 to emit light under voltage drive. For details regarding the connection between the cathode layer 27 and the power supply 41, please refer to the relevant description above; further details will not be repeated here.

[0166] As described above, this application can form the cathode layer 27 by vapor deposition, which forms the material of the cathode layer 27 and covers each sub-pixel 25. Since the conductive portion 221 is located on the side of the pixel definition layer 24 away from the cathode layer 27, when the cathode layer 27 is formed by vapor deposition, the material of the cathode layer 27 can naturally fall along the thickness direction (Z direction) of the display module to form the conductive portion 271, without the need to control the vapor deposition angle, thus simplifying the manufacturing process of the display module.

[0167] Therefore, by providing the conductive part 271 and the conductive part 221, this application can reduce the difficulty of connecting the cathode layer 27 and the power supply 41 while realizing the display function of the display module, making it easier for the cathode layer 27 of this application to be connected to the power supply 41.

[0168] The thickness of the conductive portion 221 is greater than the thickness of the cathode layer 27. The thickness of the conductive portion 221 can be tens of times greater than the thickness of the cathode layer 27, making the thickness of the conductive portion 221 significantly greater than that of the cathode layer 27. For example, the thickness of the conductive portion 221 can be 60 to 75 times the thickness of the cathode layer 27. Since sheet resistance is inversely proportional to thickness, the conductive portion 221 has a smaller sheet resistance compared to the cathode layer 27. Furthermore, compared to the cathode layer 27a being entirely connected to the power supply 41, the conductive portion 271 enables a longitudinal connection (Z-direction connection) between the cathode layer 27 and the conductive portion 221. When the cathode layer 27 is connected to the power supply 41 through the conductive portion 271 and the conductive portion 221, the signal transmitted by the power supply 41 is transmitted to the cathode layer 27 along the thickness direction (Z-direction) of the display module via the conductive portion 221. This provides the required voltage to the cathode layer 27 while preventing high-signal and low-signal areas from appearing on the cathode layer 27, ensuring the display effect of the display screen 2.

[0169] When the cathode layer 27 is connected to the power supply 41 through the conductive portion 221 with lower sheet resistance, the signal loss from the power supply 41 reaching the cathode layer 27 can be reduced, thereby reducing the voltage drop across the cathode layer 27. Since the voltage drop across the cathode layer 27 is related to the VDS voltage across the display module and its power consumption, a decrease in the voltage drop across the cathode layer 27 will reduce the voltage required by the cathode layer 27, resulting in lower VDS voltage across the display module and lower power consumption. Therefore, when the cathode layer 27 is connected to the power supply 41 through the conductive portion 221 with lower sheet resistance, the VDS voltage across the display module and its power consumption can also be improved.

[0170] It should be noted that the display module contains a driving circuit, which in turn contains a metal-oxide-semiconductor field-effect transistor (MOSFET). VDS can be understood as the voltage between the drain (d) and source (s) of the MOSFET. The location of the MOSFET in the display module can be found in the existing OLED display screen 2, and will not be repeated here.

[0171] The conductive part 221 may be, but is not limited to, a metal wire. While enabling the conductive part 271 to be connected to the power source 41 via the conductive part 221, the conductive properties of the metal allow signals transmitted by the power source 41 to be transmitted to the cathode layer 27 via the conductive part 221. For example, the conductive part 221 may also be a columnar structure. In this application, the structure of the conductive part 221 is not particularly limited.

[0172] Continue to see Figure 8 The display module may also include a substrate 22. The substrate 22 is located on the second side of the pixel definition layer 24 so that the substrate 22 can serve as a support plate for the pixel definition layer 24 within the display module. At least a portion of the conductive portion 221 is located within the substrate 22. That is, the conductive portion 221 may be entirely located within the substrate 22, or a portion may be located within the substrate 22 and another portion within the pixel definition layer 24. This allows for the fixed placement of the conductive portion 221 within the display module while also enabling more diverse placement options to meet the design requirements of different display modules. Furthermore, since the substrate 22 is located on the second side of the pixel definition layer 24, and the conductive portion 271 is exposed on the second side of the pixel definition layer 24, the conductive portion 221 can be located below the conductive portion 271. This allows for a longitudinal connection (Z-direction connection) between the cathode layer 27 and the conductive portion 221 at the conductive portion 271, so that the signal transmitted by the power supply 41 can be transmitted along the Z-direction to the cathode layer 27 via the conductive portion 221.

[0173] The substrate 22 can be a multilayer laminate. For example, the substrate 22 can include an array substrate or the like. Taking an array substrate as an example, the substrate 22 can include a substrate and an array layer (not shown) stacked together, wherein the array layer is located at the bottom layer of the substrate. The bottom layer of the substrate is located on the side of the substrate away from the pixel definition layer 24. The array layer includes an active layer, a gate layer, a gate insulating layer, a planarization layer, etc. The structure of the array layer can be determined by existing display modules and will not be described in detail here. It should be noted that the planarization layer is located on the surface of the array layer and is located on the side of the array layer away from the substrate. At least a portion of the conductive portion 221 can be located within the planarization layer. To realize the placement of the conductive portion 221 within the substrate 22, the planarization layer provides a groove at the location of the conductive portion 221, and at least a portion of the conductive portion 221 can be located within the groove, so that the conductive portion 221 is located within the substrate 22. The material (metal) used to fabricate the conductive portion 221 can be formed in the groove of the substrate 22 by vapor deposition. Specifically, during vapor deposition, the material for the conductive portion 221 can be sprayed into the tank of the substrate 22 through the vapor deposition nozzle in the vapor deposition equipment to form the conductive portion 221. The material for the conductive portion 221 can be aluminum, titanium, or a composite metal material of aluminum and titanium, etc. In this application, the material for the conductive portion 221 is not particularly limited.

[0174] The substrate 22 can be a rigid substrate, so that the display screen 2 is a rigid display screen, in which case the display screen 2 cannot be folded or bent. Alternatively, in some embodiments, the substrate 22 can also be a flexible substrate, so that the display screen 2 is a flexible display screen, in which case the display screen 2 can be folded or bent. In this application, the structure of the substrate 22 is not particularly limited.

[0175] It should be noted that when the conductive portion 271 is exposed on the first side of the pixel definition layer 24, the conductive portion 271 can be flush with the surface of the pixel definition layer 24 facing the second side, or the conductive portion 271 can protrude from the surface of the pixel definition layer 24 facing the second side. In this case, the conductive portion 221 can be entirely located within the substrate. Alternatively, in the thickness direction of the display module, the side of the conductive portion 271 facing the conductive portion 221 can be spaced apart from the surface of the pixel definition layer 24 facing the second side, so that the conductive portion 271 can also be embedded within the pixel definition layer 24. This also allows the conductive portion 271 to be exposed on the first side of the pixel definition layer 24, in which case a portion of the conductive portion 221 can be located within the pixel definition layer 24. This allows for more diverse placement options for the conductive portion 271 relative to the pixel definition layer 24.

[0176] Compared to the embedded conductive portion 271 within the pixel definition layer 24, when the conductive portion 271 is flush with the second-side surface of the pixel definition layer 24, or when the conductive portion 271 protrudes from the second-side surface of the pixel definition layer 24, it not only allows the conductive portion 271 to have a larger dimension in the thickness direction of the display module, thus enhancing the stability of the connection between the cathode layer 27 and the power supply by strengthening the connection between the cathode layer 27 and the conductive portion 221, but also eliminates the need for precise control of the amount of cathode layer 27 overflowing into the pixel definition layer 24 during the fabrication of the cathode layer 27. This simplifies the manufacturing process of the display module and reduces its manufacturing cost. Furthermore, the conductive portion 221 can be completely located within the substrate 22 and can be integrally formed with the substrate 22, eliminating the need for the conductive portion 221 to protrude from the surface of the substrate 22 facing the pixel definition layer 24. This further simplifies the manufacturing process of the display module and reduces its manufacturing cost.

[0177] The structure of the display module of this application embodiment will be further described below, taking the example where the conductive part 271 is flush with the surface of the pixel definition layer 24 facing the second side and all the conductive parts 221 are located in the substrate 22.

[0178] Conductive portions 221 are provided correspondingly to conductive portions 271 in the thickness direction of the display module. That is, conductive portions 221 correspond one-to-one with conductive portions 271 in the thickness direction of the display module. When conductive portions 221 and conductive portions 271 correspond one-to-one, conductive portions 221 can be directly opposite to the corresponding conductive portions 271, or conductive portions 221 can have some positional deviation relative to the corresponding conductive portions 271. The structure of the display module of this application embodiment will be further described below with the example that conductive portions 221 can be directly opposite to the corresponding conductive portions 271. Since each sub-pixel 25 is covered with a cathode layer 27, when conductive portions 221 correspond one-to-one with conductive portions 271 in the thickness direction of the display module, the conductive portions 271 of the cathode layer 27 covered on each sub-pixel 25 can be connected to the power supply 41 through the corresponding conductive portions 221, thereby exciting the covered sub-pixels 25 to emit light through the cathode layer 27, realizing the display function of the display module. It should be noted that the conductive part 271 may not correspond one-to-one with the conductive part 271 in the thickness direction of the display module. For example, two conductive parts 271 may also be connected to the power supply 41 through the same conductive part 221. The following text will further explain the structure of the display module by taking the example of the conductive part 221 corresponding one-to-one with the conductive part 271 in the thickness direction of the display module.

[0179] Continue to see Figure 8The pixel definition layer 24 has through holes (not shown) at intervals between adjacent sub-pixels 25. Since at least a portion of the sub-pixels 25 are located within the pixel definition layer 24, the through holes can be located on the side of the sub-pixels 25 facing adjacent sub-pixels 25 within the pixel definition layer 24. That is, the through holes can be located between the openings of two adjacent pixels within the pixel definition layer 24, so that while the sub-pixels 25 are set in the pixel definition layer 24, the through holes are located at intervals between adjacent sub-pixels 25 within the pixel definition layer 24. The conductive portion 271 is located within the through hole so that the conductive portion 271 can be exposed on the second side of the pixel definition layer 24 through the through hole. Alternatively, in some embodiments, the conductive portion 271 can also be exposed on the second side of the pixel definition layer 24 in other ways (such as bypassing), without the need to open through holes in the pixel definition layer 24. The structure of the display module of the present application embodiment will be further described below with the example of the conductive portion 271 being exposed on the second side of the pixel definition layer 24 through the through hole.

[0180] It should be noted that when the conductive part 271 is exposed on the second side of the pixel definition layer 24 through the through hole, that is, the conductive part 271 can be seen from the through hole on the second side of the pixel definition layer 24, so that the conductive part 271 can be connected to the corresponding conductive part 221, thereby realizing the connection between the cathode layer 27 and the power supply 41, so that while the sub-pixel 25 is excited to emit light, the conductive part 271 can be located at the interval between adjacent sub-pixels 25.

[0181] For example, the pixel definition layer 24 has a through hole on the side of the blue sub-pixel 25a facing the interval. The conductive part 271 of the cathode layer 27 covering the blue sub-pixel 25a can be located in the through hole and exposed on the second side of the pixel definition layer 24, thereby realizing the connection between the cathode layer 27 and the power supply 41 so that the blue sub-pixel 25a is excited to emit blue light.

[0182] It should be noted that the pixel definition layer 24 may have through holes on the side of each sub-pixel 25 facing the adjacent sub-pixel 25, so that the conductive portion 271 of the cathode layer 27 can be connected to the power supply through the conductive portion 221, thereby enabling each sub-pixel 25 to be excited and emit light. Alternatively, in some embodiments, the pixel definition layer 24 may also have through holes on the side of some sub-pixels 25 facing the adjacent sub-pixels 25, and the cathode layer 27 on the remaining sub-pixels 25 may be connected to the power supply 41 by other methods (such as metal isolation pillars 241).

[0183] The following example, which shows that the pixel definition layer 24 can have through holes on one side of each sub-pixel 25 facing the adjacent sub-pixel 25, will be used to further explain the structure of the display module.

[0184] A portion of the edge region of the cathode layer 27 is located within the through-hole, forming a conductive portion 271 within the through-hole to connect the cathode layer 27 with the conductive portion 221. The structure of the conductive portion 271 is adapted to the shape of the through-hole. It should be noted that the adaptation described herein can be understood as identical or similar. That is, the structure of the conductive portion 271 is identical or similar to the shape of the through-hole. The through-hole can be a circular hole, a rectangular hole, etc. For example, when the through-hole is a circular hole, the conductive portion 271 can be a cylindrical structure that fits against the wall of the circular hole. Thus, when the conductive portion 271 is located within the through-hole, it can be exposed on the side of the pixel definition layer 24 with the second surface through the through-hole, while ensuring a good fit between the structure of the conductive portion 271 and the shape of the through-hole, thereby increasing the conductive area between the conductive portion 271 and the conductive portion 221 and enhancing the connection stability between the cathode layer 27 and the power supply 41.

[0185] To ensure that the conductive portion 271 is exposed on the second side of the pixel definition layer 24, the dimension of the conductive portion 271 in the thickness direction (Z direction) of the display module can be greater than or equal to the depth of the via. The depth of the via is the dimension of the via in the thickness direction (Z direction) of the display module.

[0186] Continue to see Figure 8 A portion of the cathode layer 27 extends into the via to form a conductive portion 271, thereby allowing the conductive portion 271 to be exposed through the via on the side of the pixel definition layer 24 that has a second surface.

[0187] Continue to see Figure 8 The light-emitting unit also includes an anode layer 26. The anode layer 26 can be a transparent electrode. The anode layer 26 includes a transition portion 261. The transition portion 261 is disposed on the side of the conductive portion 271 facing the conductive portion 221. In this case, the conductive portion 221 can be entirely covered by the transition portion 261 (e.g., Figure 8 (As shown), or, the conductive portion 221 may be partially covered by the adapter portion 261. In this application, the extent to which the conductive portion 221 is covered by the adapter portion 261 is not particularly limited. The conductive portion 271 can be connected to the conductive portion 221 through the adapter portion 261 so that the conductive portion 271 and the conductive portion 221 can be connected using the anode layer 26 of the display module. At this time, the dimension of the conductive portion 271 in the thickness direction (Z direction) of the display module can be equal to the depth of the through hole, the conductive portion 271 is flush with the surface of the pixel definition layer 24 facing the second side, and the adapter portion 261 is disposed on the second side of the pixel definition layer 24.

[0188] Alternatively, in some embodiments, the conductive portion 271 can be directly connected to the conductive portion 221 without going through the adapter portion 261. In this case, the dimension of the conductive portion 271 in the thickness direction (Z direction) of the display module can be greater than the depth of the through hole, so that the conductive portion 271 protrudes from the surface of the pixel definition layer 24 facing the second side.

[0189] The structure of the display module will be further explained below, taking the example of the conductive part 271 being connected to the conductive part 221 through the adapter part 261.

[0190] Continue to see Figure 8 A portion of sub-pixel 25 is exposed on the second side of pixel definition layer 24. In addition to the adapter 261, anode layer 26 may also include a cover 262. Cover 262 is used to connect to power supply 41. The connection method between cover 262 and power supply 41 can be found in the above description of anode layer 26, and will not be repeated here. Each sub-pixel 25 has a cover 262 covering its side facing the second side of pixel definition layer 24, so that anode layer 26 can connect to power supply 41 through cover 262, thereby exciting sub-pixel 25 to emit light in cooperation with cathode layer 27.

[0191] Since there are multiple sub-pixels 25, there are also multiple cover portions 262. Each cover portion 262 can be interconnected, so that when any one of the cover portions 262 is turned on by the power supply 41, the power supply 41 can be turned on by each cover portion 262, thereby turning on the anode layer 26 and the power supply 41.

[0192] It should be noted that when the covering parts 262 are connected to each other, adjacent covering parts 262 can be connected to each other so that the covering parts 262 can be connected to each other and form a mesh structure.

[0193] A gap exists between the cover portion 262 and the adapter portion 261 to prevent a short circuit from occurring when the cover portion 262 and the adapter portion 261 are connected, thus ensuring a normal connection between the anode layer 26 and the power supply 41. In this application, the size of the gap between the cover portion 262 and the adapter portion 261 is not particularly limited; it is only necessary to ensure that the cover portion 262 and the adapter portion 261 do not connect to each other and cause a short circuit.

[0194] Continue to see Figure 8 Since the adapter 261 is provided on the side of the conductive part 271 facing the conductive part 221, the conductive part 221 can be located on the side of the cover 262 facing the adapter 261 and have a gap between it and the cover 262 to ensure that there is a gap between the cover 262 and the adapter 261.

[0195] The cover portion 262 and the transition portion 261 can be formed sequentially on the side of the substrate 22 facing the pixel definition layer 24 through two vapor deposition processes to ensure that the transition portion 261 covers the conductive portion 221. Alternatively, the cover portion 262 and the transition portion 261 can also be formed simultaneously on the side of the substrate 22 facing the pixel definition layer 24 through a single vapor deposition process. In this application, the formation process of the cover portion 262 and the transition portion 261 on the substrate 22 is not particularly limited.

[0196] Continue to see Figure 8 The cathode layer 27 has two or more conductive portions 271. For example, the number of conductive portions 271 on the cathode layer 27 can be two, three, four, etc. The two or more conductive portions 271 are distributed in the plane of the pixel definition layer 24 on the side of the sub-pixel 25 covered by the cathode layer 27. Since conductive portions 221 are provided at the conductive portions 271, the number of conductive portions 221 is equal to the number of conductive portions 271, and they correspond one-to-one, so that the conductive portions 271 can be connected to the power supply 41 through the corresponding conductive portions 221, thereby realizing the connection between the cathode layer 27 and the power supply 41.

[0197] Compared to the cathode layer 27 having one conductive part 271, when the cathode layer 27 has two or more conductive parts 271, the connection stability between the cathode layer 27 and the power supply 41 can be enhanced, thereby enhancing the light emission stability of the sub-pixel 25.

[0198] In summary, by providing the conductive part 271 and the conductive part 211, this application not only enables the connection between the cathode layer 27 and the power supply 41 and reduces the difficulty of connecting the cathode layer 27 and the power supply 41, but also avoids the occurrence of high signal areas and low signal areas in the cathode layer 27, thereby improving the VDS voltage and power consumption of the display module.

[0199] See you again Figure 6 Besides the difficulty in connecting the cathode layer 27 to the power supply 41, the display module also suffers from other defects. For example, the display module also has an organic laminar flow leveling problem. The organic laminar flow leveling problem can also be called the IJP flow leveling problem.

[0200] The following section, in conjunction with the accompanying drawings and the manufacturing process of the display module, further elaborates on the organic laminar flow leveling issue that still exists in the display module.

[0201] See you again Figure 6The encapsulation layer 23 within the display module may include a first encapsulation layer 231a and a second encapsulation layer (not shown). The first encapsulation layer 231a and the second encapsulation layer are stacked sequentially on the cathode layer 27b. The first encapsulation layer 231a is an inorganic encapsulation layer. The second encapsulation layer is an organic encapsulation layer. The first encapsulation layer 231a is used to encapsulate various sub-pixels 25 and the cathode layer 27b. The sub-pixels 25 can form pixel devices 29a that emit different colors of light with the cathode layer 27b, anode layer 26a, and first encapsulation layer 231a at the sub-pixel 25. For example, a green sub-pixel 25c can form a green-light-emitting pixel device 29a (referred to as a green pixel device) with the cathode layer 27b, anode layer 26a, and first encapsulation layer 231a at its own position. A blue sub-pixel 25a can form a blue-light-emitting pixel device 29a (referred to as a blue pixel device) with the cathode layer 27b, anode layer 26a, and first encapsulation layer 231a at its own position. The red sub-pixel 25b can form a red-emitting pixel device 29a (referred to as a red pixel device) with the cathode layer 27b, anode layer 26a and first encapsulation layer 231a at its own position.

[0202] In the display module of the second related technology mentioned above, various pixel devices 29a will be manufactured sequentially.

[0203] The fabrication of pixel device 29a will be explained using the fabrication of a green pixel device as an example.

[0204] See you again Figure 6 After forming blue sub-pixels 25a, red sub-pixels 25b and green sub-pixels 25c on the corresponding pixel definition layer 24a, and covering each sub-pixel 25 with a cathode layer 27b, the fabrication material of the first encapsulation layer 231a (not shown) is first set on the cathode layer 27b. Then, the fabrication material of the first encapsulation layer 231a covering the red sub-pixels 25b and blue sub-pixels 25a is removed by exposure and etching, leaving only the fabrication material of the first encapsulation layer 231a on the green sub-pixels 25c, thereby obtaining a green light emitting pixel device at the green sub-pixels 25c.

[0205] After the green pixel device is fabricated, red or blue pixel devices are successively obtained according to the fabrication method of the green pixel device. After the red and blue pixel devices are fabricated, the first encapsulation layer 231a will also be formed on the red sub-pixel 25b and the blue sub-pixel 25a.

[0206] It should be noted that, when fabricating the pixel device, a pixel protective layer 295 needs to be first deposited on the material of the first encapsulation layer 231a, and a mask 296 needs to be deposited on the side of the pixel protective layer 295 away from the material of the first encapsulation layer 231a. For example, the pixel protective layer 295 can be a photoresist layer. The mask 296 has an etching pattern (not shown). By means of exposure, the etching pattern on the mask 296 can be transferred onto the pixel protective layer 295. The material of the first encapsulation layer 231a is etched according to the etching pattern. After etching, the pixel protective layer 295 is removed, and the first encapsulation layer 231 is obtained on the sub-pixel 25.

[0207] Since the first encapsulation layer 231 needs to encapsulate the sub-pixel 25 and the cathode layer 27 on the sub-pixel 25, and the cathode layer 27 is angled and overlapped on the sidewall of the metal isolation pillar 241, this places high requirements on the alignment accuracy of the mask 296 and the material of the first encapsulation layer 231a. This alignment accuracy can also be referred to as the mask accuracy of the mask 296.

[0208] When the masking accuracy of the mask plate 296 is high, the encapsulation reliability of the formed first encapsulation layer 231a for the sub-pixel 25 and the cathode layer 27b is better. Conversely, when the masking accuracy of the mask plate is low, the encapsulation reliability of the formed first encapsulation layer 231a for the sub-pixel 25 and the cathode layer 27b is worse.

[0209] The existing mask 296 has a low masking accuracy, typically 1µm to 1.5µm or even greater. When the masking accuracy of the mask 296 is 1µm to 1.5µm, it may cause a positional deviation of 1µm to 1.5µm between the edge of the first encapsulation layer 231a and the edge of the cathode layer 27b and the preset position, which will affect the reliability of the first encapsulation layer 231a in encapsulating the sub-pixel 25 and the cathode layer 27b.

[0210] Due to the limited masking accuracy of the existing mask 296, to ensure the reliability of the first encapsulation layer 231a in encapsulating the sub-pixel 25 and the cathode layer 27b, the edge of the first encapsulation layer 231a is extended towards the metal isolation pillar 241 during the fabrication of the pixel device 29a (i.e., the first encapsulation layer 231 is in an outward-expanding state relative to the sub-pixel 25). However, this results in the edge of the first encapsulation layer 231a in the first-fabricated pixel device 29a (e.g., a green pixel device) overlapping with the metal isolation pillar 241. After the next pixel device 29 (e.g., a blue pixel device) is fabricated, the edge of the first encapsulation layer 231a in the next pixel device 29 will also overlap with the same metal isolation pillar 241, resulting in the later-formed first encapsulation layer 231a overlapping with the earlier-formed first encapsulation layer 231a on the same metal isolation pillar 241, forming a step difference (height difference), which leads to poor flatness of the first encapsulation layer 231a.

[0211] When the second encapsulation layer is formed on the first encapsulation layer 231a, the poor planarization of the first encapsulation layer 231a will cause the second encapsulation layer to have IJP leveling problems on the first encapsulation layer 231a, which will lead to poor folding reliability of the display screen 2.

[0212] Figure 9 This shows a partial cross-sectional view of yet another display module. See also... Figure 9 As shown, the encapsulation layer 23 of the display module in this application also includes a first encapsulation layer 231 and a second encapsulation layer. The materials of the first encapsulation layer 231 and the second encapsulation layer are the same as those of the first encapsulation layer 231a and the second encapsulation layer mentioned above, and will not be described again here.

[0213] Each cathode layer 27 is covered with a first encapsulation layer 231 on the side away from the sub-pixel 25. A gap V exists between adjacent first encapsulation layers 231. By setting the gap V, while ensuring the reliability of the first encapsulation layer 231's encapsulation of the cathode layer 27 and the sub-pixel 25, it is possible to prevent adjacent first encapsulation layers 231 from overlapping, thus ensuring a high degree of flatness of the display module at adjacent first encapsulation layers 231. This solves the leveling problem of the second encapsulation layer, ensuring that the second encapsulation layer of the display module has a good leveling effect on the first encapsulation layer 231, and improving the folding reliability of the display screen 2.

[0214] The display module of this application eliminates the metal isolation pillar 241. Therefore, while ensuring the reliability of the first encapsulation layer 231 in encapsulating the sub-pixel 25 and the cathode layer 27, it reduces the masking accuracy requirements of the mask during the formation of the first encapsulation layer 231. Therefore, in fabricating the pixel device 29, this application eliminates the need to extend the first encapsulation layer 231 outwards.

[0215] The gap V is opposite to the spacing between adjacent sub-pixels 25 in the thickness direction (Z direction) of the display module, so as to solve the leveling problem of the two encapsulation layers while ensuring the encapsulation reliability of the sub-pixels 25.

[0216] Continue to see Figure 9 The display module of this application also includes multiple pixel devices 29. The multiple pixel devices 29 include multiple first pixel devices 291, multiple second pixel devices 292, and multiple third pixel devices. The sub-pixels 25 of the first pixel devices 291, second pixel devices 292, and third pixel devices can display different colors. For example, the first pixel device 291 can be a blue light pixel device, with its internal sub-pixel 25 being the first sub-pixel 251. The second pixel device 292 can be a red light pixel device, with its internal sub-pixel 25 being the second sub-pixel 252. The third pixel device can be a green light pixel device, with its internal sub-pixel 25 including the third sub-pixel 253. The multiple sub-pixels 25 include multiple first sub-pixels 251, multiple second sub-pixels 252, and multiple third sub-pixels 253. The first sub-pixels 251, second sub-pixels 252, and third sub-pixels 253 are different types of pixels and can display different colors, so that the display module can form an RGB mode and realize the display function of the display screen 2. For example, the first sub-pixel 251 can be the blue light sub-pixel 25a mentioned above, the second sub-pixel 252 can be the red light sub-pixel 25b mentioned above, and the third sub-pixel 253 can be the green light sub-pixel 25c mentioned above.

[0217] A first sub-pixel 251, together with a cathode layer 27, an anode layer 26, and a first encapsulation layer 231 sequentially covering the first sub-pixel 251, can form a first pixel device 291. A second sub-pixel 252, together with a cathode layer 27, an anode layer 26, and a first encapsulation layer 231 sequentially covering the second sub-pixel 252, can form a second pixel device 292. A third sub-pixel 253, together with a cathode layer 27, an anode layer 26, and a first encapsulation layer 231 sequentially covering the third sub-pixel 253, can form a third pixel device.

[0218] It should be noted that the first pixel device 291, the second pixel device 292, and the third pixel device are three types of pixel devices. In the display module of this application, the first encapsulation layer 231 of the multiple types of pixel devices is also fabricated sequentially using exposure and etching methods. The gap V between adjacent first encapsulation layers 231 is greater than or equal to 3µm and less than or equal to 5µm. Due to the low masking precision of the mask plate 296, during the sequential fabrication of two pixel devices 29 (e.g., the first pixel device 291 and the second pixel device 292), the gap V between adjacent first encapsulation layers 231 is naturally caused by the masking precision of the mask plate 296, thus avoiding an excessively large gap V between adjacent first encapsulation layers 231 and ensuring the encapsulation reliability of the first encapsulation layer 231 for the sub-pixels 25 and the cathode layer 27.

[0219] The formation of the gap V will be further explained below, taking the gap V between adjacent first encapsulation layers 231 as 3µm and the masking accuracy of the mask plate 296 as 1.5µm.

[0220] Continue to see Figure 9 For example, during the fabrication of the first encapsulation layer 231 of the first pixel device 291, due to the mask precision of the mask 296 being 1.5µm, when the mask 296 is placed on the fabrication material (not shown) of the first encapsulation layer 231, the edge of the mask 296 on the fabrication material of the first encapsulation layer 231 may have a positional deviation of 1.5µm from the preset position. This will cause the edge of the pixel protection layer 295 with the etched pattern on the fabrication material of the first encapsulation layer 231 to shift towards the first sub-pixel 251, with a positional deviation of 1.5µm from the preset position. Due to the positional deviation of the pixel protection layer 295, the edge of the first encapsulation layer 231 formed at the first sub-pixel 251 will also shift towards the first sub-pixel 251, with a positional deviation of 1.5µm from the preset position. At this point, the fabrication of the first encapsulation layer 231 of the first pixel device 291 is complete.

[0221] Next, the fabrication of the first encapsulation layer 231 of the first pixel device 291 begins. During the fabrication of the first encapsulation layer 231 of the second pixel device 292, when the mask 296 is placed on the fabrication material (not shown) of the first encapsulation layer 231 of the second pixel device 292, the edge of the mask 296 may still deviate from the preset position by 1.5µm on the fabrication material of the first encapsulation layer 231 of the second pixel device 292. This will cause the pixel protection layer 295 with the etched pattern to shift towards the second sub-pixel 252 on the fabrication material of the first encapsulation layer 231 of the second pixel device 292, with a positional deviation of 1.5µm from the preset position. Due to the positional deviation of the pixel protection layer 295, the edge of the first encapsulation layer 231 formed at the second sub-pixel 252 will also shift to one side of the second sub-pixel 251, with a positional deviation of 1.5µm from the preset position. At this point, the fabrication of the first encapsulation layer 231 of the second pixel device 292 is complete. There is a gap V between the first encapsulation layer 231 of the first pixel device 291 and the first encapsulation layer 231 of the second pixel device 292, and the gap V is 3um.

[0222] It should be noted that, compared to the first encapsulation layer 231a mentioned above, the edge of the first encapsulation layer 231 of this application is inward relative to the corresponding sub-pixel 251 (such as the first sub-pixel 251 or the second sub-pixel 252), rather than outward.

[0223] Due to the setting of the gap V between adjacent first encapsulation layers 231, not only do the first encapsulation layers 231 become independent island structures, but if the cathode layers 27 are connected to each other, electrochemical corrosion of the cathode layers 27 near the gap V between adjacent first encapsulation layers 231 is likely to occur.

[0224] Since the cathode layers 27 are interconnected, when one cathode layer 27 undergoes electrochemical corrosion, it will spread to the adjacent cathode layers 27, causing the adjacent cathode layers 27 to also undergo electrochemical corrosion. This results in a high risk of black spots in the display module, affecting the reliability of the display module.

[0225] Therefore, please continue to see Figure 9 The gap V is located between adjacent cathode layers 27. Figure 10 It shows Figure 8 Enlarged view of section C. See also Figure 10 As shown, as described above, the display module also includes a substrate 22, and a barrier cavity 242 with an opening 2421 on the side of the pixel definition layer 24 facing the cathode layer 27. Figure 11 A partial cross-sectional view of another display module provided in an embodiment of this application is shown. (Forming) Figure 11 The cross-sectional direction and formation Figure 8 The cross-sectional directions are the same; see details for more information. Figure 7 The BB direction in the diagram. See also Figure 11 As shown, or in other embodiments, the side of the substrate 22 facing the cathode layer 27 has a barrier cavity 242 with an opening 2421.

[0226] Continue to see Figure 11 As shown, the barrier cavity 242 is disposed between adjacent cathode layers 27 and corresponds to the gap V. The opening 2421 faces the gap V. The barrier cavity 242 is used to block adjacent cathode layers 27, so that adjacent cathode layers 27 are disconnected at the gap V. That is, the connected adjacent cathode layers 27 are not electrically connected to each other at the gap V, which reduces the risk of electrochemical corrosion of the cathode layers 27 due to the gap V, and prevents the spread of electrochemical corrosion between adjacent cathode layers 27, thereby reducing the risk of sub-pixel 25 being eroded, and thus reducing the risk of black spots in the display module and improving the reliability of the display module.

[0227] See you again Figure 9 The first sub-pixel 251, the second sub-pixel 252, and the third sub-pixel 253 (not shown) require different voltages to be activated. The voltage signal is set based on the type of sub-pixel 25 that requires a higher voltage. For sub-pixels 25 with low voltage requirements, this will result in wasted power consumption and a low grayscale (low luminous brightness) effect, affecting the display effect of the display screen 2.

[0228] For example, the first sub-pixel 251 requires a -3V voltage signal, the second sub-pixel 252 requires a -1V voltage signal, and the third sub-pixel 253 requires a -2V voltage signal. Since the cathode layers 27 are interconnected, the power supply 41 will input a voltage of -3V to each sub-pixel 25 through the cathode layer 27. This will result in wasted power consumption and a low grayscale effect for the second sub-pixel 252 and the third sub-pixel 253, affecting the display effect of the display screen 2.

[0229] When adjacent cathode layers 27 are disconnected at the gap V, since the cathode layers 27 are not interconnected, the power supply 41 can still input the required voltage to the covered sub-pixels 25 through each cathode layer 27. This allows for differentiated voltage settings for the sub-pixels 25 while avoiding power waste caused by sub-pixels 25 with low voltage requirements, improving the low grayscale effect, and thus enhancing the display effect of the display screen 2.

[0230] The following section will first explain how the risk of black spots can be reduced when the cathode layers 27 are not interconnected. Next, it will further explain how the differentiated voltage settings required for the sub-pixels 25 can be achieved when the cathode layers 27 are not interconnected.

[0231] Continue to see Figure 11 and Figure 10 Compared to the blocking cavity 242 being located within the pixel definition layer 24, when the blocking cavity 242 is located within the substrate 22, it allows the blocking cavity 242 to have a larger size in the thickness direction (Z direction) of the display panel, thereby enhancing the blocking effect of the blocking cavity 242 on the adjacent cathode layer 27. However, this requires the substrate 22 to have a larger thickness in the Z direction. In this application, the placement of the blocking cavity 242 within the display module is not particularly limited, which allows for more diverse placement of the blocking cavity 242 within the display module to meet the design requirements of different display modules.

[0232] Figure 12 for Figure 11 Enlarged view at point D. See also Figure 12 and Figure 10 As shown, the size of the barrier cavity 242 at the opening 2421 is smaller than the size of the inner cavity of the barrier cavity 242, resulting in a smaller size at the opening 2421. During the deposition of the cathode layer 27 material onto each sub-pixel 25, some of the cathode layer 27 material also enters the barrier cavity 242. Because the size of the barrier cavity 242 at the opening 2421 is smaller than the size of the inner cavity of the barrier cavity 242, the film formed by the cathode layer 27 material within the barrier cavity 242 cannot grow around the inner wall of the barrier cavity 242 towards the opening 2421 and pass through the opening 2421. Therefore, the barrier cavity 242 causes the film formed by the cathode layer 27 material at adjacent sub-pixels 25 to be in a disconnected state. The film formed at the sub-pixel 25 ultimately forms the cathode layer 27. Therefore, by setting the barrier cavity 242, the adjacent cathode layers 27 are disconnected, thereby achieving the barrier function of the barrier cavity 242 on the adjacent cathode layers 27.

[0233] It should be noted that before fabricating the next pixel device 29, the material used to fabricate the cathode layer 27 within the barrier cavity 242 needs to be removed. For example, a wet etching method can be used to remove the material used to fabricate the cathode layer 27 within the barrier cavity 242. However, after removal, some material used to fabricate the cathode layer 27 will still remain within the barrier cavity 242.

[0234] Continue to see Figure 12 and Figure 10 The remaining material used to make the cathode layer 27 forms a cathode material layer 293 within the barrier cavity 242. In other words, the cathode material layer 293 is made from the material used to make the cathode layer 27. The cathode material layer 293 is used to make the cathode layer 27. At this time, the barrier cavity 242 contains the cathode material layer 293. The barrier cavity 242 separates the cathode material layer 293 from the adjacent cathode layer 27.

[0235] When wet etching is used to remove the cathode material layer 293 within the barrier cavity 242, the cathode material layer 293 is prone to electrochemical corrosion with the etching solution, leading to aging of the cathode material layer 293 within the barrier cavity 242. Since the barrier cavity 242 isolates the cathode material layer 293 from the adjacent cathode layer 27, the cathode material layer 293 within the barrier cavity 242 is disconnected from the adjacent cathode layer 27. This prevents the electrochemical corrosion of the cathode material layer 293 within the barrier cavity 242 from spreading to the adjacent cathode layer 27, ensuring a lower risk of electrochemical corrosion for the cathode layer 27. Consequently, the display module of this application has a lower risk of black spots, improving the reliability of the display module.

[0236] See you again Figure 10 The barrier cavity 242 includes a groove 2422 and an isolation portion 2423. When the barrier cavity 242 is located within the pixel definition layer 24, the side of the pixel definition layer 24 facing the cathode layer 27 has a groove 2422. The groove 2422 is located between adjacent cathode layers 27 and at the corresponding gap V. The isolation portion 2423 is disposed at a portion of the opening of the groove 2422 and together with the groove 2422, forms the barrier cavity 242. The opening of the groove 2422 can be understood as the opening of the groove 2422 facing the isolation portion 2423, and correspondingly, the side of the groove 2422 away from the isolation portion 2423 can be understood as the bottom of the groove 2422. The opening 2421 corresponds to the opening of the groove 2422 that is not blocked by the isolation portion 2423. The groove wall of the groove 2422 forms the cavity within the barrier cavity 242. At this time, the isolation portion 2423 can be formed on the first surface of the pixel definition layer 24, that is, the first surface of the pixel definition layer 24 has the isolation portion 2423.

[0237] When the size of the groove 2422 remains unchanged, the size of the groove 2422 communicating with the outside at the groove opening can be reduced due to the blocking of the isolation part 2423, so that the size of the formed barrier cavity 242 at the opening 2421 is smaller than the size of the barrier cavity 242 inside the cavity.

[0238] The difference is that when the barrier cavity 242 is located in the pixel definition layer 24, the side of the substrate 22 facing the cathode layer 27 also has a groove 2422. The pixel definition layer 24 has a via (not shown) at the position corresponding to the groove 2422. The portion of the pixel definition layer 24 at the via is blocked at the opening of the groove 2422 to form an isolation portion 2423.

[0239] The following text takes the example of the barrier cavity 242 being located within the pixel definition layer 24 to further illustrate the structure of the display module.

[0240] See you again Figure 10The isolation portion 2423 can be a columnar structure to give it a certain height, effectively blocking the cathode material layer 293 from the cathode layer 27. In this application, the inorganic isolation column material can be formed on the pixel definition layer 24 by methods such as vapor deposition. After obtaining the pattern of the isolation portion 2423 by exposure on the pixel definition layer 24, the isolation portion 2423 is obtained through etching. Then, using the isolation portion 2423 as a mask, the pixel definition layer 24 is etched to form a groove 2422 on the pixel definition layer 24, thereby obtaining the blocking cavity 242. For example, in this application, the groove 2422 can be formed on the pixel definition layer 24 by dry etching or plasma etching. The groove 2422 can be, but is not limited to, as shown in the image. Figure 9 The rectangular groove is shown. For example, when plasma etching is used, the groove 2422 can be an arc-shaped groove.

[0241] The isolation section 2423 can be an insulating isolation section to prevent the cathode material layer 293 in the isolation cavity 242 from spreading to the adjacent cathode layer 27 through the isolation section 2423 after electrochemical corrosion occurs, thereby further reducing the risk of electrochemical corrosion of the cathode layer 27 and improving the reliability of the display module.

[0242] When the isolation portion 2423 is an insulating isolation portion, the material used to manufacture the isolation portion 2423 can be an insulating inorganic material. For example, the insulating inorganic material can be silicon nitride, silicon oxide, etc. In this application, there is no particular limitation on the material used to manufacture the insulating isolation portion.

[0243] The structure of the display module will be further explained below, taking the isolation part 2423 as an example of the insulating isolation part.

[0244] Figure 13 It shows Figure 7 A partial structure of a display module without a cathode material layer 293 within the middle barrier cavity 242. See also... Figure 13 As shown, for example, the dimension of the barrier cavity 242 at the opening 2421 may include the width of the opening 2421. Correspondingly, the dimension of the inner cavity of the barrier cavity 242 may also include the width of the groove 2422. The direction of the width of the opening 2421 is parallel to the width of the groove 2422. For example, the direction of the width of the groove 2422 at the opening can be seen in [reference needed]. Figure 13 The direction of the groove 2422 is either a or b, depending on its position on the pixel definition layer 24.

[0245] For example, when the first sub-pixel 251 and the third sub-pixel 253 are adjacent sub-pixels 25 in the a direction, and the groove 2422 is located between the first sub-pixel 251 and the third sub-pixel 253, the width direction of the groove 2422 can be referred to as the a direction, and the length direction of the groove 2422 can be referred to as the b direction.

[0246] For example, when the second sub-pixel 252 and the third sub-pixel 253 are adjacent sub-pixels 25 in the b direction, and the groove 2422 is located between the second sub-pixel 252 and the third sub-pixel 253, the width direction of the groove 2422 can be referred to as the b direction, and the length direction of the groove 2422 can be referred to as the a direction. Therefore, in this application, the width and length directions of the groove 2422 are not particularly limited.

[0247] Continue to see Figure 13 The width w of the isolation portion 2423 can be 3-5µm, so that the isolation portion 2423 forms a mask on the pixel definition layer 24, and after etching the pixel definition layer 24, the barrier cavity 242 can be obtained. For example, the width of the isolation portion 2423 can be 3µm, 4µm, 5µm, etc.

[0248] Furthermore, by limiting the width w of the isolation portion 2423, the blocking effect of the isolation portion 2423 on the groove opening of the groove 2422 can be enhanced, so as to ensure that the isolation portion 2423 can block above the cathode material layer 293, thereby isolating the cathode material layer 293 from the cathode layer 27. This ensures that there is a gap between the cathode material layer 293 and the cathode layer 27, while preventing the cathode material layer 293 from spreading to the cathode layer 27 when electrochemical corrosion occurs.

[0249] See you again Figure 10 The thickness h of the isolation portion 2423 can be 50-150 nm. For example, the thickness h of the isolation portion 2423 can be 50 nm, 60 nm, 80 nm, 100 nm, 120 nm, etc.

[0250] There are multiple isolation sections 2423, all located on the same side of the pixel definition layer 24. The distance L between the isolation section 2423 and the adjacent sub-pixel 25 is 5-10 μm. For example, the distance L between each isolation section 2423 and the adjacent sub-pixel 25 can be equal, so as to better control the position of each isolation section 2423 relative to the sub-pixel 25.

[0251] Continue to see Figure 13 Along the width direction of the groove 2422, isolation portions 2423 can be provided on both sides of the groove opening to block the groove opening of the groove 2422 in the width direction. This further reduces the size of the opening 2421 of the barrier cavity 242, thereby further preventing the film layer formed by the cathode material layer 293 during the manufacturing process from connecting with the cathode layer 27 through the opening 2421 of the barrier cavity 242, and enhancing the barrier effect between the cathode material layer 293 and the cathode layer 27. At this time, the opening 2421 is located between the two isolation portions 2423.

[0252] Continue to see Figure 13Each barrier cavity 242 is interconnected to form a barrier network, which allows each cathode layer 27 to be independent of each other, preventing the spread of electrochemical corrosion between adjacent cathode layers 27. For example, the grooves 2422 of two adjacent barrier cavities 242 in the a direction are interconnected, and the grooves 2422 of two adjacent barrier cavities 242 in the b direction are interconnected to form a mesh structure. At the same time, the isolation portions 2423 at adjacent grooves 2422 are connected to each other to achieve interconnection of each barrier cavity 242.

[0253] Multiple subpixels 25 can be arranged in an array on the pixel definition layer 24 so that the multiple subpixels 25 are arranged regularly on the pixel definition layer 24.

[0254] Continue to see Figure 13 Multiple subpixels 25 can be arranged in a Diamond arrangement on the pixel definition layer 24. The Diamond arrangement is also called a diamond pattern. For ease of description, in the Diamond arrangement, the subpixels 252, 253, 251, 253, 252, 253, 251, 253, ... are arranged cyclically on the pixel definition layer 24 in the following order: second subpixel 252, third subpixel 253, first subpixel 251, third subpixel 253... In the Diamond arrangement, the second subpixel 252, third subpixel 253, first subpixel 251, and third subpixel 253 form a loop unit, arranged in a diamond shape.

[0255] Multiple subpixels 25 can also be arranged on the pixel definition layer 24 in other ways. For example, multiple subpixels 25 can also be arranged on the pixel definition layer 24 in a Real-RGBπ arrangement or a Real-RGB arrangement. In this application, there is no particular limitation on the arrangement of multiple subpixels 25 on the pixel definition layer 24.

[0256] It should be noted that in some embodiments, when multiple sub-pixels 25 are arranged on the pixel definition layer 24 in a Real-RGBπ or Real-RGB arrangement, the first direction can be the X direction and the second direction can be the Y direction.

[0257] Figure 14 This illustrates the Real-RGB π arrangement of multiple sub-pixels of 25. See also Figure 14 As shown, in the Real-RGBπ arrangement, the second sub-pixel 252, the third sub-pixel 253, and the first sub-pixel 251 are arranged in a triangular pattern as a loop unit. Within one loop unit, the second sub-pixel 252 and the third sub-pixel 253 are spaced apart along a second direction, and the first sub-pixel 251 is located on the same side of the second sub-pixel 252 and the third sub-pixel 253 along a first direction.

[0258] Figure 15 This illustrates the Real-RGB arrangement of multiple sub-pixels of 25. See also Figure 15 As shown, in the Real-RGB arrangement, the second sub-pixel 252, the third sub-pixel 253, and the first sub-pixel 251 are arranged in a straight line as a loop unit.

[0259] The following section uses the Diamond arrangement as an example to further explain the differentiated voltage settings required for the power supply 41 pairs of sub-pixels 25.

[0260] Figure 16 A schematic diagram showing the connection of each conductive part 221 when different types of sub-pixels 25 are routed separately. See also Figure 16 As shown, the conductive portions 221a at each of the first sub-pixels 251 are interconnected to form a first conductive mesh. For example, the conductive portions 221a of two adjacent first sub-pixels 251 in the same direction (direction a) can be located on the same side of these two first sub-pixels 251, so that the conductive portions 221 at these two first sub-pixels 251 can be interconnected through metal connecting lines 222 to obtain an electrical connecting line. The electrical connecting line corresponding to the first sub-pixel 251 is marked with B. In this way, when the electrical connecting lines formed by the conductive portions 221a at each of the first sub-pixels 251 are connected, a first conductive mesh can be formed.

[0261] Continue to see Figure 16 The conductive portions 221b at each of the second sub-pixels 252 are interconnected to form a second conductive mesh. The formation method of the second conductive mesh can be the same as that of the first conductive mesh; please refer to the relevant description of the first conductive mesh above, which will not be repeated here. The electrical connection lines corresponding to the second sub-pixels 252 are marked with R.

[0262] Continue to see Figure 16 The conductive portions 221c at each of the third sub-pixels 253 are interconnected to form a third conductive mesh. Unlike the formation of the first conductive mesh, when two adjacent third sub-pixels 253 are located in the same direction (b direction), the two conductive portions 221c can be distributed along that direction (b direction) on both sides of each third sub-pixel 253. The four conductive portions 221c of two adjacent third sub-pixels 253 are interconnected via metal connecting lines 222 to form an electrical connecting line. The electrical connecting line corresponding to the third sub-pixel 253 is marked with G. Thus, by connecting the electrical connecting lines formed by the conductive portions 221c at each of the third sub-pixels 253, a third conductive mesh can be formed.

[0263] The first, second, and third conductive meshes are independent of each other. That is, they are not connected to each other. Thus, when the first, second, and third conductive meshes are connected to the power supply 41, the power supply 41 can provide the required voltage signals to each of the first sub-pixels 251, second sub-pixels 252, and third sub-pixels 253 through the first, second, and third conductive meshes. This activates the first, second, and third sub-pixels 251 and 252, while simultaneously allowing the power supply 41 to differentiate the voltage requirements of the sub-pixels 25. This avoids wasted power consumption caused by sub-pixels 25 with low voltage requirements, improves low grayscale effects, and ultimately enhances the display effect of the display screen 2.

[0264] For example, when at least one location of the first conductive mesh is connected to the power supply 41, the power supply 41 can provide a -3V voltage signal to each first sub-pixel 251 through the first conductive mesh. When at least one location of the second conductive mesh is connected to the power supply 41, the power supply 41 can provide a -1V voltage signal to each second sub-pixel 252 through the second conductive mesh. When at least one location of the third conductive mesh is connected to the power supply 41, the power supply 41 can provide a -2V voltage signal to each third sub-pixel 253 through the third conductive mesh.

[0265] Figure 17 and Figure 18 This diagram illustrates the different connections of each conductive part 221 when each sub-pixel 25 shares a conductive mesh.

[0266] See Figure 17 and Figure 18 As shown, when the power consumption requirement for sub-pixels 25 is not high, the conductive portions 221 at the first sub-pixel 251, the second sub-pixel 252, and the third sub-pixel 253 can also be interconnected to form a conductive mesh. When at least one part of the conductive mesh is connected to the power supply 41, the power supply 41 can provide the same voltage signal to each sub-pixel 25 through the conductive mesh.

[0267] Continue to see Figure 17 The conductive portions 221 of adjacent sub-pixels 25 along the X direction can be interconnected by metal connecting lines to form a first electrical connecting line. The conductive portions 221 of adjacent sub-pixels 25 along the Y direction can be interconnected by metal connecting lines to form a second electrical connecting line. When the first electrical connecting line and the second electrical connecting line are interconnected, a conductive mesh can be formed.

[0268] Continue to see Figure 17 and Figure 18Each sub-pixel 25 has two conductive portions 221, which does not constitute a limitation on the number of conductive portions 221. In some embodiments, some sub-pixels 25 may also have four conductive portions 221, in which case metal connecting lines 222 can be added to these sub-pixels 25. For example, Figure 16 Four conductive parts 221 can be provided at the first sub-pixel 251 and the second sub-pixel 252 in the b direction, and the added metal connecting lines 222 are shown as dashed lines. For example, Figure 17 Four conductive parts 221 can be set at the two second sub-pixels 252 in the middle, and the added metal connecting lines 222 are also shown with dashed lines.

[0269] Cathode layer 27, cathode layer 27, cathode layer 27, cathode layer 27. Based on the above, this application also provides a method for manufacturing a display module, used to prepare a display module as described in any of the above claims. See again. Figure 9 The production method includes:

[0270] Step S1: A conductive portion 221 is formed on the substrate 22 such that at least a portion of the conductive portion 221 is located within the substrate 22, and the conductive portion 221 is used to connect to the power supply 41.

[0271] Step S2: Create a pixel definition layer 24 on the conductive part 221;

[0272] Step S3: Fabricate multiple pixel devices 29 on the pixel definition layer 24 to obtain a display module.

[0273] As described above, the configuration of each pixel device 29 can be found in the relevant description above, and will not be repeated here. Sub-pixels 25 in each pixel device 29 are disposed in the pixel definition layer 24. There is a gap between adjacent sub-pixels 25. The configuration of sub-pixels 25 in the pixel definition layer 24 can be found in the relevant description above, and will not be repeated here.

[0274] Each sub-pixel 25 has a cathode layer 27 covering its side facing the first side of the pixel definition layer 24. The cathode layer 27 has a conductive portion 271. The position of the conductive portion 271 can be found in the relevant description above, and will not be repeated here. The conductive portion 221 is located on the second side of the pixel definition layer 24 and is connected to the conductive portion 271, so that when the conductive portion 221 is connected to the power supply 41 and the conductive portion 271, the cathode layer 27 can be connected to the power supply 41, thereby activating the sub-pixels 25 covered by the cathode layer 27 to emit light and realize the display function of the display module.

[0275] In step S1,

[0276] Conductive portions 221 are fabricated on the substrate 22. Specifically, the conductive portions 221 can be fabricated on the substrate 22 by vapor deposition or other methods to ensure that each sub-pixel 25 is provided with a conductive portion 221. By fabricating the conductive portions 221 on the substrate 22, the conductive portions 221 are placed within the display module, and a vertical connection between the cathode layer 27 and the conductive portions 221 can be achieved. The structure of the substrate 22 and the placement of the conductive portions 221 within the substrate 22 can be found in the relevant description above, and will not be repeated here.

[0277] See you again Figure 11 When the barrier cavity 242 is located within the substrate 22, in step S1, a groove 2422 for the barrier cavity 242 also needs to be fabricated on the substrate 22. Specifically, the method for fabricating the barrier cavity 242 on the substrate 22 can be found in the above description of the fabrication of the barrier cavity 242 on the pixel definition layer 24, and will not be repeated here.

[0278] In step S2, a pixel definition layer 24 is formed on the conductive portion 221. Specifically, this may include forming the pixel definition layer 24 on a substrate 22 that already has the conductive portion 221.

[0279] After the pixel definition layer 24 is completed, through holes need to be opened on the side of the pixel opening of the pixel definition layer 24 facing the adjacent pixel opening. The positions of the through holes on the pixel definition layer 24 must correspond one-to-one with the conductive parts 221 to ensure that when the pixel device 29 is fabricated in step S3, the conductive part 271 of the cathode layer 27 in the pixel device 29 is located in the through hole and forms the conductive part 271. In this way, the conductive part 271 can be exposed on the second surface of the pixel definition layer 24 through the through hole and conduct to the corresponding conductive part 221.

[0280] It should be noted that after step S1 and before step S2, an anode layer 26 needs to be formed on the conductive portion 221. The anode layer 26 can also be formed on the substrate 22 by means of vapor deposition or the like. The fabrication of the anode layer 26 will not be further described here.

[0281] See you again Figure 9 As shown, when the barrier cavity 242 is located within the pixel definition layer 24, the barrier cavity 242 needs to be fabricated on the substrate 22 before step S3. The fabrication of the barrier cavity 242 on the pixel definition layer 24 can be found in the relevant description above, and will not be repeated here.

[0282] The following section uses the example of the cathode material layer 293 being located within the pixel definition layer 24 to further illustrate the manufacturing method of the display module.

[0283] See you again Figure 9 The method for fabricating multiple pixel devices 29 on one side of the pixel definition layer 24 in step S3 specifically includes:

[0284] Step S31: Fabricate the first pixel device 291 on the pixel definition layer 24;

[0285] Step S32: Fabricate a second pixel device 292 on the pixel definition layer 24;

[0286] Step S33: Fabricate the third pixel device on the pixel definition layer 24.

[0287] In a display module, a fine metal mask (FMM) can be used to set multiple sub-pixels 25 within corresponding pixel openings, achieving patterned design of sub-pixels on the pixel definition layer 24. However, the cost of the metal mask is relatively high. Through steps S31 to S33, the first pixel device 291, the second pixel device 292, and the third pixel device can be sequentially formed on the pixel definition layer 24. This achieves patterned design of sub-pixels 25 on the pixel definition layer 24 while eliminating the need for a fine metal mask during the manufacturing process of the display module, thereby reducing the manufacturing cost of the display module.

[0288] Specifically, the multiple pixel openings in the pixel definition layer 24 include a first pixel opening (not shown), a second pixel opening 243, and a third pixel opening (not shown). The sub-pixel 25 in the first pixel device 291 is the first sub-pixel 251.

[0289] In step S31, after the first pixel device 291 is fabricated, the first sub-pixel 251 can be placed within the first pixel opening to achieve a patterned design of the first sub-pixel 251 on the pixel definition layer 24. The sub-pixel 25 in the second pixel device 292 is the second sub-pixel 252. In step S32, after the second pixel device 292 is fabricated, the second sub-pixel 252 can be placed within the second pixel opening 243 to achieve a patterned design of the second sub-pixel 252 on the pixel definition layer 24. The sub-pixel 25 in the third pixel device is the third sub-pixel 253. In step S33, after the third pixel device is fabricated, the third sub-pixel 253 can be placed within the third pixel opening to achieve a patterned design of the third sub-pixel 253 on the pixel definition layer 24.

[0290] Therefore, by using steps S31 to S33, the patterning (pixel patterning) of the first sub-pixel 251, the second sub-pixel 252, and the third sub-pixel 253 can be achieved, so that each of the first sub-pixel 251, the second sub-pixel 252, and the third sub-pixel 253 can be set within the corresponding pixel opening. At the same time, the use of a fine metal mask in the manufacturing process of the display module can be eliminated, thereby reducing the manufacturing cost of the display module.

[0291] Figure 19A partial view is shown showing the cathode material layer 293 and the encapsulation material layer 294 formed on the pixel definition layer 24. See also Figure 19 As shown, step S31, which involves fabricating the first pixel device 291 on the pixel definition layer, includes:

[0292] Step S311: Set the first sub-pixel 251 within the multiple pixel openings;

[0293] Step S312: A cathode material layer 293 and an encapsulation material layer 294 are sequentially formed on the first side of the first sub-pixel 251 facing the first side of the pixel definition layer 24, such that the cathode material layer 293 covers the first side of the pixel definition layer 24 and the encapsulation material layer 294 covers the cathode material layer 293.

[0294] Step S313: Remove the first sub-pixel 251, the encapsulation material layer 294, and the cathode material layer 293 formed at the second pixel opening 243 and the third pixel opening (not shown) to obtain the first pixel device 291 at the first pixel opening.

[0295] The fabrication of the first pixel device 291 can be completed through steps S311 to S313, realizing the patterned design of the first sub-pixel 251 on the pixel definition layer 24.

[0296] It should be noted that in step S313, by exposing and etching the encapsulation material layer 294, the first sub-pixel 251, the encapsulation material layer 294, and the cathode material layer 293 formed at the second pixel opening 243 and the third pixel opening (not shown) can be removed.

[0297] Figure 20 A partial view illustrating the formation of the first pixel device 291 on the pixel definition layer 24 is shown. See also Figure 20 and combined Figure 19 It can be seen that the cathode material layer 293 retained after etching in step S313 forms the cathode layer 27, and the retained encapsulation material layer 294 forms the first encapsulation layer 231.

[0298] In step S311, the first sub-pixel 251 can be set in the opening of multiple pixels by means of vapor deposition or other methods.

[0299] In step S312, the material for the cathode layer 27 can be formed on each of the first sub-pixels 251 by means of vapor deposition or the like to obtain the cathode material layer 293. Due to the opening of the vias and the blocking cavities 242 on the pixel definition layer 24, while the cathode material is being formed on each of the first sub-pixels 251, it is also being formed in the vias and the blocking cavities 242, and the cathode material layer 293 is formed in the vias and the blocking cavities 242.

[0300] In step S312, the material for the first encapsulation layer 231 can also be formed on the cathode material layer 293 by means of vapor deposition or other methods.

[0301] Figure 21 A partial schematic diagram of the process of obtaining the first pixel device 291 at the first pixel opening is shown. See also... Figure 21 As shown, before exposing the encapsulation material layer 294 in step S313, a pixel protection layer 295 can be covered on the encapsulation material layer 294, and a mask 296 can be set on the pixel protection layer 295. After exposing the pixel protection layer 295, the etching pattern on the mask 296 is transferred to the pixel protection layer 295, so that the pixel protection layer 295 with the etching pattern covers the cathode material layer 293 corresponding to the first pixel opening. Then, the first sub-pixel 251, the encapsulation material layer 294, and the cathode material layer 293 formed at the second pixel opening 243 and the third pixel opening are removed by etching. Finally, after removing the pixel protection layer 295 corresponding to the first sub-pixel 251, the first pixel device 291 is obtained at the first pixel opening.

[0302] The structure of the pixel protection layer 295 can be found in the relevant description above, and will not be repeated here. The encapsulation material layer 294 can be removed by dry etching. Since the first sub-pixel 251 and the cathode material layer 293 are difficult to remove by dry etching, they can be removed by wet etching.

[0303] It should be noted that, while removing the first sub-pixel 251, the encapsulation material layer 294, and the cathode material layer 293 formed at the second pixel opening 243 and the third pixel opening, the first sub-pixel 251, the encapsulation material layer 294, and the cathode material layer 293 formed in the barrier cavity 242 also need to be removed.

[0304] Figure 22 A schematic diagram illustrating the process of obtaining the second pixel device 292 at the second pixel opening 243 is shown. See also Figure 22 As shown, step S32, which involves fabricating a second pixel device 292 on the pixel definition layer 24, may specifically include:

[0305] The second sub-pixel 252 is set within multiple pixel openings, and the second pixel device 292 is obtained at the second pixel opening 243 according to the method of obtaining the first pixel device 291 at the first pixel opening, thereby completing the fabrication of the first pixel device 291.

[0306] Continue to see Figure 22 While the second sub-pixel 252 is set within the multiple pixel openings, it is also formed on the first encapsulation layer 231 of the first pixel device 291.

[0307] Continue to see Figure 22 According to the method of obtaining the first pixel device 291 at the first pixel opening, the second pixel device 292 is obtained at the second pixel opening 243, which may specifically include:

[0308] A cathode material layer 293 and an encapsulation material layer 294 are sequentially formed on the second sub-pixel 252, such that the cathode material layer 293 covers the pixel definition layer 24 and the encapsulation material layer 294 covers the cathode material layer 293. At this time, the cathode material layer 293 and the encapsulation material layer 294 will also cover the first encapsulation layer 231 of the first pixel device 291.

[0309] The newly formed encapsulation material layer 294 is exposed and etched to remove the second sub-pixel 252, encapsulation material layer 294 and cathode material layer 293 formed at the first pixel opening and the third pixel opening, so as to obtain the second pixel device 292 at the second pixel opening 243, thereby completing the fabrication of the second pixel device 292 and realizing the patterned design of the second sub-pixel 252 on the pixel definition layer 24.

[0310] It should be noted that the methods for exposing and etching the re-formed encapsulation material layer 294, and the methods for removing the second sub-pixel 252, encapsulation material layer 294, and cathode material layer 293 formed at the first pixel opening and the third pixel opening, can be found in the relevant description of the first pixel device 291 above, and will not be repeated here.

[0311] Step S33 involves fabricating a third pixel device on the pixel definition layer 25, which may specifically include:

[0312] The third sub-pixel 253 is set within multiple pixel openings, and the third pixel device is obtained at the third pixel opening according to the method of obtaining the first pixel device 291 at the first pixel opening, thereby completing the fabrication of the third pixel device and realizing the patterned design of the third sub-pixel 253 on the pixel definition layer 24.

[0313] It should be noted that the method for obtaining the third pixel device at the third pixel opening can be found in the relevant descriptions of the first pixel device 291 and the second pixel device 292 above, and will not be repeated here.

[0314] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0315] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A display module, characterized in that, include: A pixel definition layer, wherein the first and second sides of the plane in which the pixel definition layer is located are opposite each other in the thickness direction of the display module; Multiple sub-pixels, wherein the sub-pixels are disposed in the pixel definition layer and adjacent sub-pixels are spaced apart; A cathode layer, wherein the side of each sub-pixel facing the first side is covered by the cathode layer, the cathode layer having a conductive portion located at the interval and exposed on the second side; A conductive part is located on the second side and connected to the conductive part, and the conductive part is used to connect to a power source; A substrate, the substrate being located on the second side, and at least a portion of the conductive portion being located within the substrate.

2. The display module according to claim 1, characterized in that, The conductive part is provided with the conductive part corresponding to the thickness direction of the display module.

3. The display module according to claim 1 or 2, characterized in that, The pixel definition layer has a through hole at the position corresponding to the interval, and the conductive part is located in the through hole.

4. The display module according to claim 3, characterized in that, The pixel definition layer has a pixel opening at a position corresponding to each of the sub-pixels, and there is a gap between adjacent pixel openings. At least a portion of the sub-pixel is located within the corresponding pixel opening. The via is located between adjacent pixel openings.

5. The display module according to claim 4, characterized in that, A portion of the edge region of the cathode layer is located within the through hole, and the conductive portion is formed within the through hole.

6. The display module according to any one of claims 1 to 5, characterized in that, The conductive portion is flush with the surface of the pixel definition layer facing the second side, or the conductive portion protrudes from the surface of the pixel definition layer facing the second side.

7. The display module according to claim 6, characterized in that, All of the conductive parts are located within the substrate.

8. The display module according to any one of claims 1 to 7, characterized in that, It also includes an anode layer, which includes a transition portion disposed on the side of the conductive portion facing the conductive portion, and the conductive portion is connected to the conductive portion through the transition portion.

9. The display module according to claim 8, characterized in that, A portion of the sub-pixel is exposed on the second side; the anode layer further includes a cover portion, which covers the side of the sub-pixel facing the second side, and the cover portion is used to connect to the power source; The covering portions are interconnected, and there is a gap between the covering portion and the connecting portion.

10. The display module according to any one of claims 1 to 9, characterized in that, The cathode layer has two or more of the aforementioned conductive portions.

11. The display module according to any one of claims 1 to 10, characterized in that, It also includes a first encapsulation layer, on the side of each cathode layer away from the sub-pixel; There is a gap between adjacent first encapsulation layers, and the gap is opposite to the interval in the thickness direction of the display module.

12. The display module according to claim 11, characterized in that, The gap is between adjacent cathode layers; the pixel definition layer or the side of the substrate facing the cathode layer has an open barrier cavity; The barrier cavity is disposed between adjacent cathode layers and corresponds to the gap, with the opening facing the gap, and the barrier cavity is used to block adjacent cathode layers.

13. The display module according to claim 12, characterized in that, The size of the barrier cavity at the opening is smaller than the size of the inner cavity of the barrier cavity.

14. The display module according to claim 13, characterized in that, The barrier cavity includes a groove and an isolation portion. The pixel definition layer or the side of the substrate facing the cathode layer has the groove. The groove is located between adjacent cathode layers and at the corresponding gap. The isolation part is positioned at a portion of the groove opening and forms the barrier cavity with the groove. The opening corresponds to the slot of the groove that is not blocked by the isolation part, and the groove wall of the groove forms the cavity.

15. The display module according to claim 14, characterized in that, Along the width direction of the groove, the isolation portion is provided on both sides of the groove opening.

16. The display module according to any one of claims 12 to 15, characterized in that, The barrier cavities are interconnected to form a barrier network.

17. The display module according to any one of claims 12 to 16, characterized in that, The barrier cavity has a cathode material layer, and the barrier cavity is separated between the cathode material layer and the adjacent cathode layer; The cathode material layer is used to form the cathode layer.

18. The display module according to claim 17, characterized in that, The isolation section in the barrier cavity is an insulating isolation section.

19. The display module according to any one of claims 1 to 18, characterized in that, The plurality of sub-pixels includes a plurality of first sub-pixels, a plurality of second sub-pixels, and a plurality of third sub-pixels, wherein the first sub-pixels, second sub-pixels, and third sub-pixels can display different colors; the conductive portions at the first sub-pixels, second sub-pixels, and third sub-pixels are all interconnected to form a conductive mesh, or... The conductive portions at each of the first sub-pixels are interconnected to form a first conductive mesh; The conductive portions at each of the second sub-pixels are interconnected to form a second conductive mesh; The conductive portions at each of the third sub-pixels are interconnected to form a third conductive mesh; The first conductive mesh, the second conductive mesh, and the third conductive mesh are independent of each other.

20. The display module according to any one of claims 1 to 19, characterized in that, The thickness of the conductive part is greater than the thickness of the cathode layer.

21. The display module according to any one of claims 1 to 20, characterized in that, The conductive part is a metal wire.

22. The display module according to any one of claims 1 to 21, characterized in that, It also includes a substrate, which is located on the second side; The conductive portion is located within the substrate.

23. A method for manufacturing a display module, characterized in that, The method for manufacturing a display module as described in any one of claims 1 to 22 includes: A conductive portion is formed on a substrate such that at least a portion of the conductive portion is located within the substrate, the conductive portion being used for connection to a power source; A pixel definition layer is formed on the conductive portion; Multiple pixel devices are fabricated on the pixel definition layer to obtain the display module; Wherein, the first and second sides of the plane where the pixel definition layer is located are opposite each other in the thickness direction of the display module; the pixel device includes a cathode layer and sub-pixels, and the sub-pixels in each pixel device are disposed on the pixel definition layer, with a gap between adjacent sub-pixels; Each of the sub-pixels has a cathode layer covering the side facing the first side. The cathode layer has a conductive portion located at the interval and exposed on the second side. A conductive portion is provided at each of the conductive portions, and the conductive portion is located on the second side and connected to the conductive portion.

24. The manufacturing method according to claim 23, characterized in that, The plurality of pixel devices includes a plurality of first pixel devices, a plurality of second pixel devices, and a plurality of third pixel devices, wherein the sub-pixels of the first pixel devices, the second pixel devices, and the third pixel devices are capable of displaying different colors; The fabrication of multiple pixel devices on the pixel definition layer includes: The first pixel device is fabricated on the pixel definition layer; The second pixel device is fabricated on the pixel definition layer; The third pixel device is fabricated on the pixel definition layer.

25. The manufacturing method according to claim 24, characterized in that, The pixel definition layer has multiple pixel openings, including a first pixel opening, a second pixel opening, and a third pixel opening; The sub-pixel in the first pixel device is the first sub-pixel, and the fabrication of the first pixel device on the pixel definition layer includes: The first sub-pixel is positioned within the plurality of pixel openings; A cathode material layer and an encapsulation material layer are sequentially formed on the side of the first sub-pixel facing the first side, such that the cathode material layer covers the first side of the pixel definition layer, and the encapsulation material layer covers the cathode material layer. The first sub-pixel, the encapsulation material layer, and the cathode material layer formed at the second pixel opening and the third pixel opening are removed to obtain the first pixel device at the first pixel opening; The retained cathode material layer forms the cathode layer, and the retained encapsulation material layer forms the first encapsulation layer.

26. The manufacturing method according to claim 25, characterized in that, The sub-pixel in the second pixel device is a second sub-pixel, and the fabrication of the second pixel device on the pixel definition layer includes: The second sub-pixel is disposed within the plurality of pixel openings, and the second pixel device is obtained at the second pixel opening according to the method of obtaining the first pixel device at the first pixel opening.

27. The manufacturing method according to claim 25 or 26, characterized in that, The sub-pixel in the third pixel device is a third sub-pixel, and the fabrication of the third pixel device on the pixel definition layer includes: The third sub-pixel is disposed within the plurality of pixel openings, and the third pixel device is obtained at the third pixel opening according to the method of obtaining the first pixel device at the first pixel opening.

28. A display screen, characterized in that, It includes a cover plate and a display module, wherein the cover plate is disposed on the display module; The display module is manufactured using any one of claims 1 to 22, or using any one of claims 23 to 27.

29. An electronic device, characterized in that, It includes a housing and a display screen as described in claim 28, the display screen being mounted on the housing.

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