Dispensing device for sensor processing

Abstract

The dispensing device comprises a base, a mounting table, a glue injection gun, an adjusting mechanism and a placement mechanism, the mounting table is fixedly connected to the top of the base, the glue injection gun is arranged on one side of the mounting table, the adjusting mechanism is arranged in the mounting table, and the placement mechanism is arranged in the mounting table. The placing mechanism is arranged at the top of the mounting table and is positioned below the glue injection gun; the placing mechanism comprises a centering assembly and an adsorption assembly, the adsorption assembly is arranged at the top of the mounting table, and the centering assembly is arranged in the adsorption assembly; the adjusting mechanism drives the glue injection gun to move up and down, the centering action of the centering assembly and the adsorption action of the adsorption assembly are synchronously triggered in the downward moving process of the glue injection gun, an air curtain is formed in the glue injection process, and the UV curing function is synchronously started. Therefore, the problems that a traditional device is poor in positioning and glue dispensing collaboration, glue transfer is prone to deviation, and a quality guarantee mechanism is single can be effectively solved, and then the efficiency and quality of sensor glue dispensing machining are effectively improved.

Description

Technical Field

[0001] This application relates to the technical field of sensor processing, and more particularly to a dispensing device for sensor processing. Background Technology

[0002] As a core detection device, the sensor can convert the sensed physical and chemical quantities into electrical signals or other usable forms of output according to a certain rule. It is widely used in many fields such as intelligent manufacturing, environmental monitoring, and medical equipment. In the precision manufacturing process of the sensor, the dispensing process is one of the key links to ensure its performance. Usually, it is necessary to precisely apply adhesive at specific positions of the sensor seat to bond the micro-pressure spring to form a sealed air cavity. Subsequently, the pressure sensing function is realized by welding the electrode sheet to the micro-pressure spring.

[0003] In related technologies, the centering calibration and adsorption fixation of existing devices often require separate operation or step-by-step control. Positioning needs to be completed manually or by an additional driving mechanism before dispensing. The operation process is cumbersome, which not only reduces processing efficiency, but may also cause positioning deviation due to the time difference of step-by-step operation, affecting dispensing accuracy.

[0004] Furthermore, after dispensing, the product needs to be transferred to a UV curing device for colloid curing. However, during the transfer process, the incompletely cured colloid is easily affected by external forces or gravity, causing it to flow or shift, resulting in uneven colloid distribution and reduced sealing performance, making it difficult to meet the stringent requirements of precision machining. Summary of the Invention

[0005] This application aims to at least partially address one of the technical problems in the related art.

[0006] Therefore, one objective of this application is to provide a dispensing device for sensor processing that can effectively solve the problems of poor coordination between positioning and dispensing, easy displacement of adhesive transfer, and single quality assurance mechanism in traditional devices, thereby effectively improving the efficiency and quality of sensor dispensing processing.

[0007] To achieve the above objectives, a first aspect of this application provides a dispensing device for sensor processing, comprising a base, a mounting platform, a dispensing gun, an adjustment mechanism, and a placement mechanism. The mounting platform is fixedly connected to the top of the base, the dispensing gun is disposed on one side of the mounting platform, the adjustment mechanism is disposed inside the mounting platform, and the placement mechanism is disposed on the top of the mounting platform and below the dispensing gun. The placement mechanism includes an alignment component and an adsorption component. The adsorption component is disposed on the top of the mounting platform, and the alignment component is disposed inside the adsorption component. The adjustment mechanism drives the dispensing gun to move up and down, and simultaneously triggers the alignment action of the alignment component and the adsorption action of the adsorption component during the downward movement of the dispensing gun. An air curtain is formed during the dispensing process, and the UV curing function is activated simultaneously.

[0008] The dispensing device for sensor processing in this application embodiment can achieve synchronous adsorption, centering and positioning of the product during the downward movement of the dispensing gun. At the same time, with the synergistic effect of air curtain restriction and UV lamp initial curing, it effectively solves the problems of poor positioning and dispensing coordination, easy displacement of adhesive transfer and single quality assurance mechanism of traditional devices, thereby effectively improving the efficiency and quality of sensor dispensing processing.

[0009] In addition, the dispensing device for sensor processing proposed above in this application may also have the following additional technical features: In one embodiment of this application, the adjustment mechanism includes an air pump, a connecting pipe, a mounting ring, and a connecting ring. A working chamber is formed on one side of the mounting platform. The air pump is disposed inside the working chamber, and a filter screen is fixedly connected to the inner wall of the working chamber. The air pump's inlet is located inside the working chamber. One end of the connecting pipe is connected to the air pump. The mounting ring is fixedly connected to the surface of the glue gun. The connecting ring is fixedly connected to the bottom of the mounting ring. A connecting cavity is formed inside the connecting ring. The other end of the connecting pipe passes through the mounting platform and the mounting ring sequentially and communicates with the connecting cavity.

[0010] In one embodiment of this application, the bottom of the connecting ring is provided with annularly distributed jet pipes, the upper end of the jet pipes is connected to the connecting cavity, and the bottom of the connecting ring is fixedly connected with mounting rods that are staggered with the jet pipes. The other end of the mounting rods is provided with a groove, and a UV lamp is provided inside the groove.

[0011] In one embodiment of this application, a mounting plate is fixedly connected to one side of the mounting ring, one end of the mounting plate is slidably connected to the inner wall of the mounting platform, an electric push rod is provided on the surface of the mounting platform, and the output shaft of the electric push rod is fixedly connected to the surface of the mounting plate.

[0012] In one embodiment of this application, the adsorption assembly includes a placement platform, an adjusting rod, and an adjusting plate. The placement platform is fixedly connected to the top of a base. An adjusting cavity is formed inside the base. The adjusting plate is slidably connected to the inner wall of the adjusting cavity. The top of the adjusting plate and the interior of the adjusting cavity form a pressure regulating cavity. A storage cavity is formed between the bottom of the adjusting plate and the interior of the adjusting cavity. The storage cavity stores inert gas. One end of the adjusting rod is fixedly connected to the top of the adjusting plate, and the other end of the adjusting rod passes through the base and is fixedly connected to the surface of the adjacent mounting plate.

[0013] In one embodiment of this application, the top of the placement platform is provided with an adsorption cavity, the interior of the placement platform is provided with a cavity communicating with the adsorption cavity, the interior of the base is provided with a connecting channel communicating with the adjustment cavity, the cavity is connected through the connecting channel, and a diaphragm is fixedly connected to the inner wall of the cavity.

[0014] In one embodiment of this application, the centering component includes four sliding plates and four push plates, wherein the four push plates are respectively connected to one end of the four sliding plates, and the other end of the sliding plates passes through the placement platform and is slidably connected to the inner wall of the placement platform.

[0015] In one embodiment of this application, the placement platform has an annular cavity inside, and the placement platform has an adjustment channel that communicates with the storage cavity. The annular cavity is connected to the storage cavity through the adjustment channel.

[0016] In one embodiment of this application, the placement platform has uniformly distributed mounting cavities inside, and an adjusting block is slidably connected to the inner wall of the mounting cavity. A spring is fixedly connected between one end of the adjusting block and the inner wall of the mounting cavity, and an adjusting area is formed between the other end of the adjusting block and the mounting cavity. The placement platform has uniformly distributed connecting holes that communicate with an annular cavity inside, and the annular cavity is connected to the adjacent adjusting area through the connecting holes.

[0017] In one embodiment of this application, a slide rod is fixedly connected to the end of the adjusting block away from the spring, and the other end of the slide rod passes through the mounting cavity and is fixedly connected to the surface of the adjacent slide plate.

[0018] Compared with the prior art, the beneficial effects of this application are as follows: 1. By setting an adjustment mechanism, airflow can be sprayed out under the action of the jet pipe to form an air curtain, ensuring that the adhesive does not flow out of the inner side of the air curtain during dispensing. At the same time, the UV lamp is turned on during the dispensing process, which can initially cure the adhesive under the action of the UV lamp. The combination of the air curtain and its restriction can ensure the quality of dispensing and avoid the situation where the adhesive moves and deviates during the transfer to the curing equipment, which affects the dispensing effect.

[0019] 2. By setting up an adsorption component, the internal space of the pressure regulating zone can be increased during the downward movement of the dispensing gun. As the internal space of the pressure regulating zone increases, a low pressure can be formed inside. At this time, under the action of external air pressure, a pressure difference is formed with the inside of the adsorption chamber to generate an adsorption effect, thereby achieving the initial positioning of the product and avoiding the situation where the product position shifts during the dispensing process, which affects the dispensing effect.

[0020] 3. During the downward movement of the dispensing gun, the mounting plate and adjusting rod move down synchronously, squeezing the inert gas stored inside the storage chamber. The inert gas pushes the adjusting block to move, thereby synchronously adjusting the position of the sliding plate and the push plate, thus achieving the centering effect of the product position.

[0021] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0022] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a schematic diagram of a dispensing apparatus for sensor processing according to an embodiment of this application; Figure 2 This is a cross-sectional schematic diagram of a dispensing apparatus for sensor processing according to an embodiment of this application; Figure 3 This is a schematic diagram showing the connection between the adjustment mechanism and the mounting table of a dispensing apparatus for sensor processing according to an embodiment of this application; Figure 4 This is a schematic diagram showing the distribution of the mounting rod and the jet pipe of a dispensing device for sensor processing according to an embodiment of this application; Figure 5 This is a schematic diagram of the placement structure of a dispensing device for sensor processing according to an embodiment of this application.

[0023] Figure 6 for Figure 5 A magnified view of A in the middle.

[0024] Figure 7 This is a cross-sectional schematic diagram of the placement platform of a dispensing apparatus for sensor processing according to an embodiment of this application.

[0025] As shown in the figure: 1. Base; 2. Mounting platform; 3. Glue gun; 4. Adjustment mechanism; 401. Air pump; 402. Electric push rod; 403. Connecting pipe; 404. UV lamp; 405. Filter screen; 406. Mounting ring; 407. Mounting plate; 408. Connecting ring; 409. Connecting cavity; 410. Mounting rod; 411. Air jet pipe; 5. Placement mechanism; 501. Placement platform; 502. Adjustment cavity; 503. Adjustment plate; 504. Adjustment rod; 505. Connecting channel; 506. Adjustment channel; 507. Annular cavity; 508. Diaphragm; 509. Mounting cavity; 510. Connecting hole; 511. Spring; 512. Adjustment block; 513. Slide rod; 514. Slide plate; 515. Push plate; 516. Adsorption cavity; 517. Cavity. Detailed Implementation

[0026] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0027] The dispensing apparatus for sensor processing according to embodiments of this application will now be described with reference to the accompanying drawings.

[0028] like Figure 1-7 As shown in the figure, the dispensing device for sensor processing in this application embodiment includes a base 1, a mounting platform 2, a dispensing gun 3, an adjustment mechanism 4, and a placement mechanism 5.

[0029] The mounting platform 2 is fixedly connected to the top of the base 1, the glue gun 3 is located on one side of the mounting platform 2, the adjustment mechanism 4 is located inside the mounting platform 2, and the placement mechanism 5 is located on the top of the mounting platform 2 and below the glue gun 3.

[0030] The placement mechanism 5 includes an alignment component and an adsorption component. The adsorption component is located on the top of the mounting platform 2, and the alignment component is located inside the adsorption component.

[0031] The adjustment mechanism 4 is used to drive the glue gun 3 to move up and down. During the downward movement of the glue gun 3, the centering action of the centering component and the adsorption action of the adsorption component are triggered simultaneously. During the glue injection process, an air curtain is formed and the UV curing function is activated simultaneously.

[0032] Specifically, when the device is in its initial state, the glue gun 3 is in a high position, the adjustment mechanism 4 is not activated, and the centering component and adsorption component of the placement mechanism 5 are in an untriggered state. The sensor product to be processed is placed on the adsorption component of the placement mechanism 5 to complete the pre-processing preparation.

[0033] The adjustment mechanism 4 is activated, driving the glue gun 3 to move downward from the initial high position toward the placement mechanism 5 until the glue gun 3 reaches the preset glue dispensing height (aligned with the product to be glued). During the downward movement of the glue gun 3, the adjustment mechanism 4 simultaneously triggers the adsorption component of the placement mechanism 5 to operate. Through changes in air pressure, the adsorption component generates adsorption force, firmly fixing the product placed on the adsorption component and preventing the product from shifting during the glue dispensing process.

[0034] In addition, the adjustment mechanism 4 also triggers the centering component of the placement mechanism 5. The centering component moves synchronously with the adsorption action, moving towards the center of the product through mechanical linkage, adjusting the product to a precise centering position, and ensuring the accuracy of the dispensing position.

[0035] After the dispensing gun 3 reaches the preset height, it applies adhesive to the area of ​​the product to be dispensed, completing the dispensing operation. During the dispensing process, the adjusting mechanism 4 activates the air path function to form an air curtain around the dispensing area of ​​the product. This airflow barrier restricts the flow range of the adhesive, preventing it from overflowing the preset area. At the same time, the adjusting mechanism 4 activates the UV curing function to pre-cur the freshly applied adhesive through ultraviolet irradiation, preventing the adhesive from shifting or deforming in subsequent processing due to lack of curing.

[0036] After the dispensing operation is completed, the adjusting mechanism 4 drives the dispensing gun 3 to move upward and reset to the initial high position. At the same time, the centering component and the adsorption component are released (the centering component is reset and the adsorption force disappears), the air curtain and UV curing functions are turned off, the processed product is removed, the device returns to the initial state, and waits for the next processing cycle.

[0037] In one embodiment of this application, such as Figure 2-4 As shown, the adjustment mechanism 4 includes an air pump 401, a connecting pipe 403, a mounting ring 406, and a connecting ring 408.

[0038] The mounting platform 2 has a working chamber on one side, and an air pump 401 is located inside the working chamber. A filter screen 405 is fixedly connected to the inner wall of the working chamber. The air pump 401 is located inside the working chamber, and one end of the connecting pipe 403 is connected to the air pump 401. The mounting ring 406 is fixedly connected to the surface of the glue gun 3, and the connecting ring 408 is fixedly connected to the bottom of the mounting ring 406. A connecting cavity 409 is opened inside the connecting ring 408, and the other end of the connecting pipe 403 passes through the mounting platform 2 and the mounting ring 406 in sequence and is connected to the connecting cavity 409.

[0039] Specifically, in the initial state, the air pump 401 is not started, the working chamber is connected to the outside air through the filter screen 405 to ensure a clean air intake environment, the mounting ring 406 is fixed to the surface of the glue gun 3, the connecting ring 408 is in the initial high position with the mounting ring (synchronized with the glue gun), and the two ends of the connecting pipe 403 are respectively connected to the connecting chamber 409 of the air pump 401 and the connecting ring 408, and the air passage is in the state of waiting to be ventilated.

[0040] When the glue gun 3 moves up and down under the action of an external drive (such as an electric push rod), the mounting ring 406 moves synchronously because it is fixedly connected to the surface of the glue gun. The connecting ring 408 is fixed to the bottom of the mounting ring 406 and moves up and down synchronously with the mounting ring to ensure that the subsequent air curtain generation position always corresponds to the glue dispensing area of ​​the glue gun.

[0041] When the dispensing operation begins, the air pump 401 starts and draws air from the working chamber of the mounting platform 2 through the air inlet. Before entering the air pump, the air is filtered by the filter screen 405 on the inner wall of the working chamber to intercept dust, impurities and other contaminants, ensuring the cleanliness of the airflow. The air pump 401 compresses the filtered air to form a high-pressure airflow, which is transmitted to the connecting ring 408 through the connecting pipe 403. The connecting pipe 403 passes through the side wall of the mounting platform 2 and the mounting ring 406 in sequence, and finally guides the airflow into the connecting cavity 409 inside the connecting ring 408, completing the delivery of the airflow from the air source to the distribution cavity.

[0042] The connecting cavity 409 is an annular closed chamber. After receiving the airflow from the connecting pipe 403, it evenly distributes it to the jet pipe 411 at the bottom of the connecting ring to provide a stable airflow for the formation of the air curtain.

[0043] In one embodiment of this application, such as Figure 2-4 As shown, the bottom of the connecting ring 408 is provided with annularly distributed jet pipes 411. The upper end of the jet pipes 411 is connected to the connecting cavity 409. The bottom of the connecting ring 408 is fixedly connected with mounting rods 410 that are distributed alternately with the jet pipes 411. The other end of the mounting rods 410 is provided with a groove, and a UV lamp 404 is provided inside the groove.

[0044] Specifically, the jet pipes 411 are slender tubular structures, and their number is set according to the size of the connecting ring 408. They are evenly distributed in a ring along the bottom edge of the connecting ring 408. The upper end of each jet pipe 411 vertically penetrates the bottom wall of the connecting ring 408 and communicates with the connecting cavity 409 inside the connecting ring. The lower end is inclined downwards (towards the center of the dispensing area) to ensure that the ejected airflow forms a closed annular air curtain. The mounting rods 410 are rigid rod-shaped structures, and their number is the same as that of the jet pipes 411. They are fixedly connected to the bottom of the connecting ring 408 and are distributed alternately with the jet pipes 411 (i.e., a mounting rod is set between two adjacent jet pipes). The end of the mounting rod 410 away from the connecting ring has a groove that matches the size of the UV lamp 404. The UV lamp 404 is embedded in the groove and fixed by bolts or buckles. The lamp beads face the dispensing area to ensure that the ultraviolet light can directly irradiate the adhesive.

[0045] The jet pipe 411 and the mounting rod 410 are both fixed to the bottom of the connecting ring 408 by welding or threading, and move synchronously with the connecting ring 408 (the connecting ring is rigidly connected to the glue gun 3 through the mounting ring 406), ensuring that the air curtain and the ultraviolet irradiation range are always aligned with the glue dispensing position of the glue gun.

[0046] The high-pressure airflow generated by the air pump 401 is delivered to the connecting cavity 409 of the connecting ring 408 via the connecting pipe 403. Since the connecting cavity is a closed annular structure, the airflow is evenly distributed to the upper end of each jet pipe 411. The airflow is ejected from the lower end of the jet pipe 411. Since the jet pipes are distributed in a ring and tilted towards the center, the ejected airflow forms a closed annular air curtain around the dispensing area. The air curtain blocks the diffusion of the adhesive to the outside through the airflow pressure, avoiding the flow deviation of the adhesive due to gravity or external force during the dispensing process, and ensuring the accurate distribution of the adhesive within the preset area.

[0047] When the dispensing operation is started, the UV lamp 404 is simultaneously powered on and emits ultraviolet light with a wavelength of about 365nm (adapted to the photocuring characteristics of the colloid). Due to the staggered distribution of the mounting rod 410 and the air jet pipe 411, the irradiation range of the UV lamp 404 can cover the entire dispensing area. The ultraviolet light directly acts on the surface of the freshly coated colloid, and the photoinitiator in the colloid reacts rapidly under the ultraviolet irradiation, causing the surface of the colloid to initially cure within a few seconds. Combined with the physical restriction of the air curtain, it further prevents the colloid from deforming or flowing during subsequent transfer or processing, thereby improving the stability of the sealing performance.

[0048] When the dispensing gun 3 moves down to the dispensing position, the connecting ring 408 moves down simultaneously, ensuring that the air curtain and ultraviolet irradiation range always match the position of the colloid. The physical barrier of the air curtain and the chemical setting of UV curing provide dual protection, solving the problem of displacement caused by the transfer of uncured colloid in traditional devices. This achieves integrated quality control of "dispensing-protection-curing". Furthermore, the staggered distribution of the jet pipe 411 and the UV lamp in a limited space achieves functional integration, reducing the size of the device and improving work efficiency.

[0049] In one embodiment of this application, such as Figure 2-4 As shown, a mounting plate 407 is fixedly connected to one side of the mounting ring 406. One end of the mounting plate 407 is slidably connected to the inner wall of the mounting platform 2. An electric push rod 402 is provided on the surface of the mounting platform 2. The output shaft of the electric push rod 402 is fixedly connected to the surface of the mounting plate 407.

[0050] Specifically, the mounting ring 406 is a ring structure, which is fixed to the surface of the glue gun 3 (near the middle position) by welding or high-strength bolts, forming a rigid connection with the glue gun to ensure that there is no relative displacement between the two. A flat connecting part extends from one side of the mounting ring 406 for fixing the mounting plate 407. The mounting plate 407 is a long strip of rigid plate, one end of which is fixed to the side connecting part of the mounting ring 406 by bolts or welding, and the other end extends towards the mounting platform 2. The end is machined with a sliding structure (such as a slider or guide rail groove) that matches the inner wall of the mounting platform. The extended end of the mounting plate 407 is slidably connected to the vertical sliding groove opened in the inner wall of the mounting platform 2, and can move smoothly up and down along the sliding groove. The electric push rod 402 is horizontally fixed to the surface of the mounting platform 2 (near the top position). Its output shaft faces the mounting plate 407 and is rigidly connected to the middle of the surface of the mounting plate by a coupling or bolts, ensuring that the extension force of the output shaft can be directly transmitted to the mounting plate 407.

[0051] The electric push rod 402 serves as a power source and receives control signals to achieve the extension and retraction of the output shaft. When the output shaft extends, it pushes the mounting plate 407 to slide downward along the groove on the inner wall of the mounting platform 2. When the output shaft retracts, it pulls the mounting plate 407 to slide upward. Since the mounting plate 407 is rigidly connected to the mounting ring 406, the up and down movement of the mounting plate directly drives the mounting ring 406 to move synchronously. In turn, the mounting ring drives the glue gun 3 to achieve the up and down height adjustment and control the distance between the glue gun and the product to be processed.

[0052] In one embodiment of this application, such as Figure 5-7 As shown, the adsorption assembly includes a placement platform 501, an adjusting rod 504, and an adjusting plate 503.

[0053] The placement platform 501 is fixedly connected to the top of the base 1. The base 1 has an adjustment cavity 502 inside. The adjustment plate 503 is slidably connected to the inner wall of the adjustment cavity 502. The top of the adjustment plate 503 and the inside of the adjustment cavity 502 form a pressure regulating cavity. The bottom of the adjustment plate 503 and the inside of the adjustment cavity 502 form a storage cavity. The storage cavity stores inert gas. One end of the adjustment rod 504 is fixedly connected to the top of the adjustment plate 503. The other end of the adjustment rod 504 passes through the base 1 and is fixedly connected to the surface of the adjacent mounting plate 407.

[0054] In one embodiment of this application, such as Figure 5-7 As shown, the top of the placement platform 501 is provided with an adsorption cavity 516, and the interior of the placement platform 501 is provided with a cavity 517 that communicates with the adsorption cavity 516. The interior of the base 1 is provided with a connecting channel 505 that communicates with the adjustment cavity 502. The cavity 517 is connected through the connecting channel 505, and a diaphragm 508 is fixedly connected to the inner wall of the cavity 517.

[0055] Specifically, the placement platform 501 is a block structure, which is fixedly connected to the top center of the base 1 by bolts or welding. Its top surface is the product bearing area, directly opposite the bottom of the dispensing gun 3 to ensure precise dispensing position. The base 1 has a vertical adjustment cavity 502 inside. The adjustment plate 503 is a rigid plate that matches the inner wall of the adjustment cavity. It is slidably connected to the inner wall of the adjustment cavity 502 by a sealing sleeve or guide rail structure and can move smoothly up and down along the cavity wall. The adjustment plate 503 divides the adjustment cavity 502 into two independent areas: the top is the pressure regulating cavity (connected to the subsequent adsorption gas path) and the bottom is the storage cavity (pre-filled with inert gas, such as nitrogen).

[0056] When the electric push rod 402 of the adjustment mechanism drives the mounting plate 407 to move downward, the mounting plate simultaneously drives the adjustment plate 503 to slide downward along the inner wall of the adjustment cavity 502 via the adjustment rod 504. During the downward movement of the adjustment plate 503, the pressure regulating cavity space at the top increases, and the storage cavity space at the bottom is compressed (inert gas is squeezed). The pressure regulating cavity is connected to the cavity 517 inside the placement platform 501 through the connecting channel 505. When the pressure regulating cavity space increases, the internal air pressure decreases, forming a low-pressure area. The adsorption cavity 516 at the top of the placement platform 501 (connected to the cavity 517) has an air pressure difference with the outside atmosphere. Under the action of the outside air pressure, it tightly adsorbs the product placed on the surface, realizing the fixed positioning of the product. The diaphragm 508 (rubber material) on the inner wall of the cavity 517 deforms with the change of air pressure, which not only ensures the air passage is sealed, but also prevents impurities from entering the pressure regulating cavity and causing blockage.

[0057] After the dispensing is completed, the electric push rod 402 drives the mounting plate 407 to move upward, and the adjusting rod 504 drives the adjusting plate 503 to move upward synchronously. The pressure regulating chamber space shrinks, the air pressure returns to normal, the air pressure difference between the adsorption chamber 516 and the outside disappears, the adsorption force is released, and the product can be removed. At the same time, the inert gas in the storage chamber is returned to its original position, ready for the next operation.

[0058] In one embodiment of this application, such as Figure 5-7 As shown, the centering assembly includes four slide plates 514 and four push plates 515.

[0059] Among them, four push plates 515 are respectively connected to one end of four slide plates 514, and the other end of the slide plate 514 passes through the placement platform 501 and is slidably connected to the inner wall of the placement platform 501.

[0060] Specifically, when the glue gun 3 moves down, the adjustment mechanism drives the adjustment plate 503 to move down through the mounting plate 407 and the adjustment rod 504, squeezing the inert gas in the storage chamber at the bottom of the adjustment chamber 502 of the base 1. The inert gas enters the annular cavity 507 of the placement table 501 through the adjustment channel 506, and then is distributed to the adjustment area of ​​each mounting cavity 509 through the connection hole 510, pushing the adjustment block 512 to compress the spring 511 and driving the slide plate 514 to slide towards the center of the placement table through the slide rod 513.

[0061] When the four slide plates 514 slide towards the center simultaneously, the push plates 515 at their ends move closer to the edge of the product. Through uniform pushing force, the product is pushed from the initial deviation position to the center area of ​​the placement table 501. Since the push plates 515 are symmetrically distributed and move synchronously, the product achieves precise centering under the balanced force in four directions, ensuring that the area to be glued corresponds perfectly with the position of the glue gun 3.

[0062] After the glue is applied, the glue gun 3 moves upward, the adjusting plate 503 resets, the air pressure in the storage chamber decreases, the spring 511 rebounds and pushes the adjusting block 512 to reset, and the slide bar 513 drives the slide plate 514 and the push plate 515 to move away from the center. The push plate 515 separates from the edge of the product, the centering and positioning are released, and the product can be easily removed.

[0063] In one embodiment of this application, such as Figure 5-7 As shown, the placement platform 501 has an annular cavity 507 inside, and an adjustment channel 506 connected to the storage cavity inside. The annular cavity 507 is connected to the storage cavity through the adjustment channel 506.

[0064] Specifically, the inert gas compressed inside the storage cavity can be injected into the interior of the annular cavity 507 through the regulating channel 506.

[0065] In one embodiment of this application, such as Figure 5-7 As shown, the placement platform 501 has evenly distributed mounting cavities 509 inside. An adjusting block 512 is slidably connected to the inner wall of the mounting cavity 509. A spring 511 is fixedly connected between one end of the adjusting block 512 and the inner wall of the mounting cavity 509. An adjusting area is formed between the other end of the adjusting block 512 and the mounting cavity 509. The placement platform 501 has evenly distributed connecting holes 510 that communicate with the annular cavity 507 inside. The annular cavity 507 is connected to the adjacent adjusting area through the connecting holes 510.

[0066] Specifically, when the glue gun 3 moves down, the adjusting plate 503 squeezes the inert gas in the base storage cavity. The gas flows into the annular cavity 507 of the placement table through the adjusting channel 506 and fills the entire annular space. The high-pressure gas in the annular cavity 507 is evenly distributed to the adjusting area of ​​each mounting cavity 509 through the connecting hole 510, generating a thrust on the adjusting block 512 towards the center of the placement table. Under the action of the air pressure thrust, the adjusting block 512 overcomes the elastic force of the spring 511 and slides along the inner wall of the mounting cavity 509 towards the center. Then, through the slide rod 513, it drives the sliding plate 514 and the push plate 515 to move synchronously, thereby achieving the centering and positioning of the product.

[0067] After dispensing is completed, the dispensing gun 3 moves upward, the adjusting plate 503 resets, the air pressure in the storage chamber decreases, and the air pressure in the annular cavity 507 and the adjusting area decreases accordingly. The adjusting block 512 loses its air pressure thrust. At this time, the spring 511 releases its elastic potential energy, pushing the adjusting block 512 to slide away from the center and return to its initial position. During the resetting process of the adjusting block 512, the gas in the adjusting area flows back to the annular cavity 507 through the connecting hole 510, and then returns to the base storage chamber through the adjusting channel 506, completing the air circulation and waiting for the next drive.

[0068] In one embodiment of this application, such as Figure 5-7 As shown, the end of the adjusting block 512 away from the spring 511 is fixedly connected to a slide rod 513, and the other end of the slide rod 513 passes through the mounting cavity 509 and is fixedly connected to the surface of the adjacent slide plate 514.

[0069] Specifically, when high-pressure inert gas is introduced into the adjustment area of ​​the placement platform 501, the adjustment block 512 slides along the mounting cavity 509 towards the center of the placement platform under the action of air pressure thrust. The adjustment block 512 pushes the slide plate 514 to move synchronously through the rigidly connected slide rod 513. Due to the guiding effect of the slide rod, the slide plate 514 remains horizontal and stable along the sliding trajectory of the inner wall of the placement platform to avoid deviation. The adjustment blocks 512 in the four mounting cavities 509 slide synchronously under force, and drive the corresponding slide plate 514 to move closer to the center through their respective slide rods 513. The push plate 515 at the end of the slide plate 514 moves synchronously with the slide plate, applying a balanced thrust to the product on the top of the placement platform from four directions, adjusting the product to the center position, and completing the centering and positioning.

[0070] After the dispensing is completed, the air pressure in the adjustment area decreases, and the spring 511 pushes the adjustment block 512 to reset in a direction away from the center. The adjustment block 512 pulls the slide plate 514 back to the initial position through the slide rod 513. The push plate 515 separates from the product, and the centering action is released.

[0071] Specifically, the overall workflow of this application is as follows: In the initial state, the glue gun 3 is in the initial high position, the electric push rod 402 of the adjustment mechanism 4 is in the retracted state, the mounting plate 407, the mounting ring 406 and the connecting ring 408 are simultaneously in the high position, the adsorption component of the placement mechanism 5 does not generate adsorption force, the push plate 515 of the centering component is in the open state (the spring 511 is not compressed), and there is no air pressure difference on the surface of the adsorption chamber 516.

[0072] During processing, the sensor product to be processed is manually or automatically placed above the adsorption chamber 516 of the placement stage 501. The bottom of the product initially contacts the surface of the adsorption chamber. Then, the electric push rod 402 is activated, and its output shaft extends and pushes the mounting plate 407 to slide down along the inner wall of the mounting stage 2. The mounting plate 407 drives the mounting ring 406, the connecting ring 408 and the glue gun 3 to move down synchronously through a rigid connection until the glue gun 3 reaches the preset glue dispensing height (aligned with the glue area of ​​the product).

[0073] When the mounting plate 407 moves down, the adjusting rod 504 drives the adjusting plate 503 to slide down along the inner wall of the adjusting cavity 502 of the base 1, which increases the space of the pressure regulating cavity at the top of the adjusting plate and reduces the air pressure. The pressure regulating cavity is connected to the cavity 517 of the placement table 501 through the connecting channel 505. The air pressure in the cavity drops accordingly, forming an air pressure difference with the outside, which tightly adsorbs the product onto the surface of the adsorption cavity 516, achieving synchronous fixation.

[0074] As the adjusting plate 503 moves downward, it squeezes the inert gas in the storage chamber at the bottom of the adjusting cavity. The gas flows into the annular cavity 507 of the placement table through the adjusting channel 506. The gas in the annular cavity is distributed to the adjusting area of ​​each mounting cavity 509 through the connecting hole 510, which pushes the adjusting block 512 to compress the spring 511. The sliding rod 513 drives the sliding plate 514 and the push plate 515 to move towards the center. The four push plates 515 exert force simultaneously to push the product to the center position of the placement table, completing precise centering.

[0075] After the dispensing gun 3 reaches the preset height, it starts to apply a quantitative amount of adhesive (such as adhesive for sealing air chambers) to the product area to be dispensed. At the same time, the air pump 401 is started. Outside air enters the working chamber after being filtered by the filter screen 405. It is compressed by the air pump and transmitted to the connecting chamber 409 of the connecting ring 408 through the connecting pipe 403. The airflow in the connecting chamber 409 is sprayed downward through the annularly distributed jet pipes 411 to form an annular air curtain around the dispensing area, which blocks the flow of adhesive and prevents it from overflowing into the preset area.

[0076] The UV lamps 404 at the bottom of the connecting ring 408 (interspersed with the jet pipes) are turned on synchronously, emitting ultraviolet light to irradiate the freshly coated colloid. The ultraviolet light triggers the photocuring reaction of the colloid, allowing it to quickly and initially set. Combined with the air curtain, this prevents the colloid from shifting during subsequent transfer.

[0077] After dispensing is completed, the electric push rod 402 retracts, causing the dispensing gun 3, mounting ring 406, and connecting ring 408 to move upward and reset to their initial high positions. The adjusting plate 503 moves upward with the adjusting rod 504, the air pressure in the pressure regulating chamber is restored, the adsorption force of the adsorption component is released, the inert gas pressure in the storage chamber decreases, the spring 511 rebounds, causing the adjusting block 512, sliding plate 514, and push plate 515 to reset, the centering component releases the product, the air pump 401 and UV lamp 404 are turned off, and the processed product is removed manually or by a robotic arm. The device returns to its initial state and waits for the next processing cycle.

[0078] In summary, the dispensing device for sensor processing according to the embodiments of this application can achieve synchronous adsorption, centering and positioning of the product during the downward movement of the dispensing gun. At the same time, with the synergistic effect of air curtain restriction and UV lamp initial curing, it effectively solves the problems of poor coordination between positioning and dispensing, easy displacement of adhesive transfer and single quality assurance mechanism of traditional devices, thereby effectively improving the efficiency and quality of sensor dispensing processing.

[0079] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0080] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0081] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A dispensing device for sensor processing, characterized in that, It includes a base, mounting platform, glue gun, adjustment mechanism, and placement mechanism, among which, The mounting platform is fixedly connected to the top of the base, the glue gun is located on one side of the mounting platform, the adjustment mechanism is located inside the mounting platform, and the placement mechanism is located on the top of the mounting platform and below the glue gun. The placement mechanism includes an alignment component and an adsorption component. The adsorption component is disposed on the top of the mounting platform, and the alignment component is disposed inside the adsorption component. The adjustment mechanism is used to drive the glue gun to move up and down, and during the downward movement of the glue gun, it simultaneously triggers the centering action of the centering component and the adsorption action of the adsorption component, forming an air curtain during the glue injection process and simultaneously activating the UV curing function.

2. The dispensing device for sensor processing according to claim 1, characterized in that, The adjusting mechanism includes an air pump, a connecting pipe, a mounting ring, and a connecting ring, wherein, A working chamber is provided on one side of the mounting platform, and the air pump is located inside the working chamber. A filter screen is fixedly connected to the inner wall of the working chamber, and the air inlet of the air pump is located inside the working chamber. One end of the connecting tube is connected to the air pump, the mounting ring is fixedly connected to the surface of the glue gun, the connecting ring is fixedly connected to the bottom of the mounting ring, and a connecting cavity is opened inside the connecting ring; The other end of the connecting pipe passes through the mounting platform and the mounting ring in sequence and is connected to the connecting cavity.

3. The dispensing device for sensor processing according to claim 2, characterized in that, The bottom of the connecting ring is provided with annularly distributed jet pipes, the upper end of which is connected to the connecting cavity. The bottom of the connecting ring is fixedly connected with mounting rods that are staggered with the jet pipes. The other end of the mounting rods is provided with a groove, and a UV lamp is installed inside the groove.

4. The dispensing device for sensor processing according to claim 2, characterized in that, A mounting plate is fixedly connected to one side of the mounting ring, and one end of the mounting plate is slidably connected to the inner wall of the mounting platform. An electric push rod is provided on the surface of the mounting platform, and the output shaft of the electric push rod is fixedly connected to the surface of the mounting plate.

5. The dispensing device for sensor processing according to claim 4, characterized in that, The adsorption assembly includes a placement platform, an adjusting rod, and an adjusting plate, wherein... The placement platform is fixedly connected to the top of the base, and the base has an adjustment cavity inside, with the adjustment plate slidably connected to the inner wall of the adjustment cavity; The top of the regulating plate and the interior of the regulating cavity form a pressure regulating cavity, and the bottom of the regulating plate and the interior of the regulating cavity form a storage cavity, which stores inert gas. One end of the adjusting rod is fixedly connected to the top of the adjusting plate, and the other end of the adjusting rod passes through the base and is fixedly connected to the surface of the adjacent mounting plate.

6. The dispensing apparatus for sensor processing according to claim 5, characterized in that, The top of the placement platform has an adsorption chamber, and the interior of the placement platform has a cavity that communicates with the adsorption chamber. The interior of the base has a connecting channel that communicates with the adjustment chamber. The cavity is connected to the pressure regulating chamber through the connecting channel. A diaphragm is fixedly connected to the inner wall of the cavity.

7. The dispensing apparatus for sensor processing according to claim 6, characterized in that, The centering component includes four sliding plates and four push plates. The four push plates are respectively connected to one end of the four sliding plates, and the other end of the sliding plates passes through the placement platform and is slidably connected to the inner wall of the placement platform.

8. The dispensing apparatus for sensor processing according to claim 7, characterized in that, The placement platform has an annular cavity inside, and an adjustment channel that communicates with the storage cavity inside the placement platform. The annular cavity is connected to the storage cavity through the adjustment channel.

9. The dispensing apparatus for sensor processing according to claim 8, characterized in that, The placement platform has evenly distributed mounting cavities inside. An adjusting block is slidably connected to the inner wall of the mounting cavity. A spring is fixedly connected between one end of the adjusting block and the inner wall of the mounting cavity, and an adjusting area is formed between the other end of the adjusting block and the mounting cavity. The placement platform has evenly distributed connecting holes that communicate with the annular cavity. The annular cavity is connected to the adjacent adjustment area through the connecting holes.

10. The dispensing apparatus for sensor processing according to claim 9, characterized in that, The end of the adjusting block away from the spring is fixedly connected to a sliding rod, and the other end of the sliding rod passes through the mounting cavity and is fixedly connected to the surface of the adjacent sliding plate.

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