Novel inverted polishing pad cleaning equipment

Abstract

The invention provides novel inverted polishing pad cleaning equipment, and relates to the technical field of cleaning equipment.The novel inverted polishing pad cleaning equipment comprises a cleaning cabin with the open top end, and the open end of the cleaning cabin is provided with a sealing cover selectively connected with the cleaning cabin in a sealed mode; the adsorption rotating device is arranged on the sealing cover and is used for inversely adsorbing and driving the polishing disc and the polishing pad connected with the polishing disc to rotate; the circulating water system is used for injecting deionized water into the cleaning cabin and discharging the deionized water out of the cleaning cabin and realizing regular circulating flow of the deionized water; in a cleaning state, the polishing disc and the polishing pad are sealed in the cleaning cabin and rotate, and the polishing surface of the polishing pad faces the bottom of the cleaning cabin; cleaning is conducted through the deionized water which continuously flows; after cleaning is completed, the deionized water is discharged to form a sealed storage environment. The damage risk and environmental pollution in the polishing pad cleaning process are avoided, the cleaning efficiency is high, and the cleaning effect is better.

Description

Technical Field

[0001] This invention relates to the field of cleaning equipment technology, and in particular to a novel inverted polishing pad cleaning device. Background Technology

[0002] In hybrid chip thinning processes, the chip substrate is thinned to a certain thickness, allowing the photogenerated charges on the surface to be collected more effectively by the PN junction, thus maximizing the device's quantum efficiency. The thinning polishing process requires a uniform, clear chip surface free of scratches, dirt, and material residue to facilitate subsequent back-reflection enhancement processes.

[0003] Due to prolonged polishing, a large amount of substrate residue and polishing material mixture accumulates on the surface of the polishing pad. If cleaning is not thorough, it will lead to problems such as chip scratches and solution imbalances during subsequent polishing, seriously affecting chip yield and polishing pad lifespan. Therefore, cleaning the polishing pad is a crucial step. Without damaging the polishing pad surface, the mixture of substrate residue and polishing material must be thoroughly removed, ensuring better surface cleanliness for subsequent polishing stages and extending the polishing pad's lifespan.

[0004] The main methods for cleaning polishing pads in related technologies include the following: One option is to use a brush for mechanical cleaning, but the brushing process can easily damage the nap structure on the surface of the polishing pad, affecting its polishing uniformity and service life. Secondly, deionized water is used for front rinsing, but because the polishing particles are extremely small (about 200 nanometers), it is difficult to judge the degree of cleaning with the naked eye, the actual cleaning effect is limited, and residues may still accumulate. Third, immersing the polishing pad in deionized water to soften residues can lead to secondary contamination as particulate matter in the air can easily precipitate onto the surface of the polishing pad through the deionized water, thus reducing its cleanliness. Summary of the Invention

[0005] This invention provides a novel inverted polishing pad cleaning device, which solves the problems of damage risk, incomplete cleaning, and environmental pollution during the polishing pad cleaning process.

[0006] To achieve the above objectives, this application adopts the following technical solution: A novel inverted polishing pad cleaning device is provided, comprising: A top-open cleaning chamber, wherein the open end of the cleaning chamber is provided with a sealing cover that can be optionally sealed to the cleaning chamber; An adsorption-rotation device is provided on the sealing cover for inverting and adsorbing the polishing disc and the polishing pad connected to it to rotate. A circulating water system is used to inject and discharge deionized water into the cleaning chamber and to realize the timed circulation of the deionized water. During the cleaning process, the polishing disc and polishing pad are sealed inside the cleaning chamber and rotate, with the polishing surface of the polishing pad facing the bottom of the cleaning chamber; cleaning is performed using continuously flowing deionized water. After cleaning, the deionized water is drained to form a sealed storage environment.

[0007] Furthermore, when the equipment is in storage, the circulating water system is configured to start a timed circulation mode.

[0008] Furthermore, the cleaning chamber is provided with a water inlet and a water outlet; the water outlet is located at the bottom of the cleaning chamber, and the height of the water inlet is higher than the height of the water outlet.

[0009] Furthermore, the edge of the water outlet is funnel-shaped.

[0010] Furthermore, both the inlet and outlet are located at the bottom of the cleaning chamber; the inner surface of the bottom of the cleaning chamber is inclined so that the height of the inlet is higher than the height of the outlet.

[0011] Furthermore, the adsorption rotation device includes: The motor is mounted on the sealing cover, and its output end is equipped with a drive motor gear. A hollow tube is inserted through the sealing cover and rotatably connected to it via a bearing; a gear is mounted on the hollow tube, and the gear is connected to the gear transmission of the drive motor. An adsorption plate is fixedly connected to one end of the hollow tube near the inside of the sealing cover; the other end of the hollow tube is the connection end of a vacuum device.

[0012] Furthermore, the hollow tube is rotatably connected to the sealing cover via a first bearing and a second bearing fixedly connected to both sides of the sealing cover; the first bearing is embedded inside the sealing cover.

[0013] The present invention has the following beneficial effects: This application overturns the conventional thinking of immersing or brushing polishing pads with the front facing upwards. Instead, the polishing surface to be cleaned is placed downwards. During rotation, heavier substrate residues and polishing particles washed away by the water flow naturally fall downwards under their own gravity and are carried away by the water flow, thus greatly improving cleaning efficiency and avoiding the problem of particle redeposition on the polishing pad surface. The main contaminants that fall downwards fall to the bottom of the water tank and are discharged by the circulation system, preventing them from floating on the polishing pad and causing secondary pollution. The cleaning process is carried out in a sealed cleaning chamber, solving the defect of secondary pollution caused by the settling of airborne particles in the original immersion method. After cleaning, the polishing pad is still stored in the sealed chamber environment, reducing the chance of contact between external airborne particles and the polishing pad. In other words, the equipment itself can serve as an ultra-clean storage environment. After cleaning, there is no need to manually transfer the polishing pad, avoiding surface scratches and environmental pollution that may occur during the transfer process. This application uses continuously flowing deionized water for cleaning, and the circulation can be started periodically during storage and standby. Cleaning is carried out purely by the shearing force and dissolving action of the water flow, completely avoiding damage to the polishing pad fibers caused by physical contact such as brushes. The system can quickly and thoroughly remove chemical polishing liquid residues, preventing residual chemicals from disrupting the original ratio of the polishing solution for the next polishing, thus ensuring the consistency of polishing results. The timed circulation function ensures that the water environment inside the equipment is kept at an ultra-high level of cleanliness during storage, ready for the next cleaning or ensuring that the stored polishing pads are in optimal standby condition. Attached Figure Description

[0014] Figure 1 A schematic structural diagram of a novel inverted polishing pad cleaning device provided in this application embodiment; Figure 2 A schematic flowchart illustrating the use of a novel inverted polishing pad cleaning device provided in this application embodiment; Figure label: 1. Water inlet; 2. Drain outlet; 3. Polishing pad; 4. Polishing disc; 5. Adsorption disc; 6. First bearing; 7. Second bearing; 8. Gear; 9. Drive motor gear; 10. Motor; 11. Vacuum device connection end; 12. Hollow tube; 13. Sealing cover. Detailed Implementation

[0015] To further illustrate the technical means and effects adopted by the present invention to achieve its intended purpose, the technical solutions in the embodiments of this application are clearly described. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art are within the scope of protection of this application.

[0016] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0017] The steps described in the specification and the flowcharts in the accompanying drawings of this invention are not necessarily strictly executed according to the step numbers; the execution order of the method steps can be changed. Furthermore, certain steps can be omitted, multiple steps can be combined into one step, and / or one step can be broken down into multiple steps.

[0018] This specification provides a novel inverted polishing pad cleaning device, which will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0019] Please see Figure 1 This application provides a novel inverted polishing pad cleaning device, such as... Figure 1 As shown, it includes: A top-open cleaning chamber, wherein the open end of the cleaning chamber is provided with a sealing cover 13 which is optionally sealed to the cleaning chamber; An adsorption rotation device is provided on the sealing cover 13 for inverting adsorption and driving the polishing disk 4 and its connected polishing pad 3 to rotate. The circulating water system is used to inject and discharge deionized water into the clean chamber and to achieve timed circulation of deionized water. During the cleaning process, the polishing disc 4 and polishing pad 3 are sealed inside the cleaning chamber and rotate, with the polishing surface of the polishing pad 3 facing the bottom of the cleaning chamber; cleaning is performed using continuously flowing deionized water. After cleaning, the deionized water is drained to create a sealed storage environment.

[0020] Furthermore, when the equipment is in storage, the circulating water system is configured to start a timed circulation mode.

[0021] This application overturns the conventional thinking of immersing or brushing polishing pads with the front facing upwards. Instead, the polishing surface to be cleaned is placed downwards. During rotation, heavier substrate residues and polishing particles washed away by the water flow naturally fall downwards under their own gravity and are carried away by the water flow, thus greatly improving cleaning efficiency and avoiding the problem of particle redeposition on the polishing pad surface. The main contaminants that fall downwards fall to the bottom of the water tank and are discharged by the circulation system, preventing them from floating on the polishing pad and causing secondary pollution. The cleaning process is carried out in a sealed cleaning chamber, solving the defect of secondary pollution caused by the settling of airborne particles in the original immersion method. After cleaning, the polishing pad is still stored in the sealed chamber environment, reducing the chance of contact between external airborne particles and the polishing pad. In other words, the equipment itself can serve as an ultra-clean storage environment. After cleaning, there is no need to manually transfer the polishing pad, avoiding surface scratches and environmental pollution that may occur during the transfer process. This application uses continuously flowing deionized water for cleaning, and the circulation can be started periodically during storage and standby. Cleaning is carried out purely by the shearing force and dissolving action of the water flow, completely avoiding damage to the polishing pad fibers caused by physical contact such as brushes. The system can quickly and thoroughly remove chemical polishing liquid residues, preventing residual chemicals from disrupting the original ratio of the polishing solution for the next polishing, thus ensuring the consistency of polishing results. The timed circulation function ensures that the water environment inside the equipment is kept at an ultra-high level of cleanliness during storage, ready for the next cleaning or ensuring that the stored polishing pads are in optimal standby condition.

[0022] Furthermore, the cleaning chamber is provided with a water inlet 1 and a water outlet 2; the water outlet 2 is located at the bottom of the cleaning chamber, and the height of the water inlet 1 is higher than the height of the water outlet 2.

[0023] Furthermore, the side of the outlet 2 is funnel-shaped.

[0024] In some possible embodiments, both the inlet 1 and the outlet 2 are located at the bottom of the cleaning chamber; the inner surface of the bottom of the cleaning chamber is inclined so that the height of the inlet 1 is higher than the height of the outlet 2.

[0025] Furthermore, the adsorption rotation device includes: Motor 10 is mounted on sealing cover 13, and its output end is equipped with drive motor gear 9; A hollow tube 12 is inserted through a sealing cover 13 and rotatably connected to it via a bearing; a gear 8 is placed on the hollow tube 12, and the gear 8 is connected to the drive motor gear 9 for transmission. The adsorption plate 5 is fixedly connected to one end of the hollow tube 12 near the inner side of the sealing cover 13; the other end of the hollow tube 12 is the vacuum device connection end 11, which is used to connect the vacuum device to adsorb the polishing plate 4 and the polishing pad 3 connected thereto through the adsorption plate 5.

[0026] In practice, the hollow tube 12 and the gear 8 can be connected by a key.

[0027] In some possible embodiments, the hollow tube 12 is rotatably connected to the sealing cover 13 via a first bearing 6 and a second bearing 7 fixedly connected to both sides of the sealing cover 13; the first bearing 6 is embedded inside the sealing cover 13.

[0028] For example, in use, the novel inverted polishing pad cleaning device provided in this application mainly includes two processes: polishing pad cleaning and storage. The detailed steps are as follows: Figure 2 As shown, it includes the following steps: After completing one round of polishing closed loop on the chip substrate S100, invert the polishing pad and attach it to the device, submerge the polishing pad in water, and close the sealing cap; S200, the motor drives the polishing pad to rotate, the motor rotates for 10 minutes, and the substrate residue and polishing liquid are removed from the polishing pad by flowing deionized water. S300, the circulating water is turned on to clean the polishing pad, and the substrate residue and polishing liquid are discharged through the flowing circulating water. S400, the motor stops rotating, and the circulating water circulates once every 60 minutes; This step involves placing the polishing pad in preparation for the next use. S500: Discharge deionized water, the motor rotates to clean the polishing pad and remove excess deionized water. The rotation time is 3 minutes to prepare for subsequent polishing.

[0029] Verification has shown that this device is inexpensive, easy to operate, and can be widely used in the fabrication of many hybrid devices such as MEMS, infrared detectors, and ultraviolet detectors, thereby improving the lifespan of polishing pads and increasing the yield in the polishing process.

[0030] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0031] It is understood that the embodiments of this application have been described above in conjunction with the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. As those skilled in the art will know, various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, those skilled in the art, under the guidance or instruction of this application, can modify these features and embodiments to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, this invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this invention.

Claims

1. A novel inverted polishing pad cleaning device, characterized in that, include: A top-open cleaning chamber, wherein the open end of the cleaning chamber is provided with a sealing cover that can be optionally sealed to the cleaning chamber; An adsorption-rotation device is provided on the sealing cover for inverting and adsorbing the polishing disc and the polishing pad connected to it to rotate. A circulating water system is used to inject and discharge deionized water into the cleaning chamber and to realize the timed circulation of the deionized water. During the cleaning process, the polishing disc and polishing pad are sealed inside the cleaning chamber and rotate, with the polishing surface of the polishing pad facing the bottom of the cleaning chamber; cleaning is performed using continuously flowing deionized water. After cleaning, the deionized water is drained to form a sealed storage environment.

2. The novel inverted polishing pad cleaning equipment according to claim 1, characterized in that, When the equipment is in storage, the circulating water system is configured to start a timed circulation mode.

3. The novel inverted polishing pad cleaning equipment according to claim 1, characterized in that, The cleaning chamber is equipped with a water inlet and a water outlet; the water outlet is located at the bottom of the cleaning chamber, and the height of the water inlet is higher than the height of the water outlet.

4. The novel inverted polishing pad cleaning equipment according to claim 3, characterized in that, The outlet has a funnel-shaped edge.

5. The novel inverted polishing pad cleaning equipment according to claim 3, characterized in that, Both the inlet and outlet are located at the bottom of the cleaning chamber; the inner surface of the bottom of the cleaning chamber is inclined so that the height of the inlet is higher than the height of the outlet.

6. The novel inverted polishing pad cleaning equipment according to claim 1, characterized in that, The adsorption rotation device includes: The motor is mounted on the sealing cover, and its output end is equipped with a drive motor gear. A hollow tube is inserted through the sealing cover and rotatably connected to it via a bearing; a gear is mounted on the hollow tube, and the gear is connected to the gear transmission of the drive motor. An adsorption plate is fixedly connected to one end of the hollow tube near the inside of the sealing cover; the other end of the hollow tube is the connection end of a vacuum device.

7. The novel inverted polishing pad cleaning device according to claim 6, characterized in that, The hollow tube is rotatably connected to the sealing cover via a first bearing and a second bearing fixedly connected to both sides of the sealing cover; the first bearing is embedded inside the sealing cover.

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