Packaging chip pin controllable laser pin cutting conveying system and method

Abstract

The application discloses a kind of encapsulation chip pin controllable laser cutting pin conveying system and method, it is related to laser cutting pin field, including fixed pin device and laser cutting pin device, fixed pin device includes fixed pin base plate and detachable fixed pin plate, fixed pin base plate is fixedly arranged, multiple sets of positioning components are linearly arranged on fixed pin base plate, positioning component includes two parallelly arranged positioning slots, positioning slot is through along the thickness direction of fixed pin base plate Setting, multiple detachable fixed pin plates are overlapped on fixed pin base plate, multiple strip grooves are through on detachable fixed pin plate, multiple strip grooves are coincident with multiple positioning slots, laser cutting pin device includes fixed beam and laser cutting machine, laser seat is slidably arranged on fixed beam, laser cutting machine is installed on laser seat, the pin of component on both sides respectively from two positioning slots and strip groove, so that the pin of component is located in the cutting range of laser cutting machine, different cutting angle requirements can be met, and automatic cutting angle processing is realized.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of laser pin cutting, in particular to a laser pin cutting conveying system and method for packaged chip pins. BACKGROUND

[0002] The inside of a chip is usually composed of many precise circuits, if the precise circuits are directly exposed to air, the precise circuits will be corroded by impurities, bad gases and water vapor in the air, thereby causing the electrical performance of the circuits to decrease. The chip packaging technology is a process technology capable of wrapping the precise circuits in the inside of the chip to avoid contact with the outside world, and can effectively protect the precise circuits in the inside of the chip. Before being welded to a circuit board, the pins on both sides of a packaged chip need to be subjected to pin cutting treatment to meet the requirements of circuit boards of different thicknesses. At present, a mechanical cutter is used to cut the pins of the chip. The mechanical cutter will apply a force to the pins during cutting, thereby causing the pins to be prone to deformation after cutting, which affects subsequent welding and installation. In addition, the chip needs to be conveyed to the cutting range of the mechanical cutter one by one for pin cutting, and the pin cutting efficiency is low. SUMMARY

[0003] The application aims to overcome the deficiencies of the prior art and provide a laser pin cutting conveying system and method for packaged chip pins, which can solve the deficiencies of the prior art.

[0004] The application is achieved by the following technical scheme: a laser pin cutting conveying system for packaged chip pins, comprising a pin fixing device and a laser pin cutting device. The pin fixing device comprises a pin fixing base plate and a detachable pin fixing plate. The pin fixing base plate is fixedly arranged. A plurality of positioning assemblies are linearly arranged on the pin fixing base plate. The positioning assembly comprises two parallel positioning grooves. The positioning grooves are arranged in the thickness direction of the pin fixing base plate. A plurality of the detachable pin fixing plates are arranged in an overlapping manner on the pin fixing base plate. A plurality of strip-shaped grooves are arranged in a penetrating manner on the detachable pin fixing plate. The strip-shaped grooves are arranged in a one-to-one coincident manner with the positioning grooves. The laser pin cutting device comprises a fixed cross beam and a laser cutting machine. The fixed cross beam is parallel to the pin fixing base plate. A laser seat is slidably arranged on the fixed cross beam. The laser seat moves along the length direction of the positioning groove. The laser cutting machine is installed on the laser seat. The laser beam of the laser cutting machine is perpendicular to the positioning groove. The laser beam of the laser cutting machine is located below the pin fixing base plate. The pins on both sides of the component are arranged to pass through the strip-shaped grooves and the positioning grooves, so that the pins of the component are located in the cutting range of the laser cutting machine. The overlapping number of the detachable pin fixing plates is adjusted to control the passing length of the pins of the component from the positioning groove.

[0005] Further, the foot fixing device further comprises a base and a mounting shaft, four corners of the foot fixing base are fixedly provided with the mounting shaft, the mounting shaft is vertically fixed on the base, the detachable foot fixing plate is slidably arranged on the mounting shaft, both sides of the foot fixing base are provided with a pressing plate assembly, the pressing plate assembly comprises a pressing plate slide, a vertical rod and a pressing slide, the pressing plate slide is slidably arranged on the base, the top of the pressing plate slide is fixedly provided with the vertical rod, the pressing slide is slidably arranged on the vertical rod, and the pressing slide presses the detachable foot fixing plate on the foot fixing base.

[0006] Further, the vertical rod is sleeved with a pressing spring, two ends of the pressing spring are connected with the pressing plate slide and the pressing slide respectively, the bottom of one end of the pressing slide close to the foot fixing base is provided with a pressing inclined surface, the top surface of the base is provided with a first screw rod groove, the first screw rod groove is parallel to the positioning groove, a bidirectional screw thread screw rod is rotatably arranged in the first screw rod groove, two opposite screw thread segments of the bidirectional screw thread screw rod are threadedly sleeved with a screw rod slide block, the pressing plate slides of the two pressing plate assemblies are arranged on the two screw rod slide blocks respectively, the top of the fixed cross beam is provided with a second screw rod groove, a screw rod is rotatably arranged in the second screw rod groove, a laser seat is slidably arranged on the second screw rod groove, and the laser seat is threadedly sleeved on the screw rod, one end of the fixed cross beam is provided with a first motor, and an output shaft of the first motor is in transmission connection with the screw rod.

[0007] Further, the device further comprises a guiding conveying device, the guiding conveying device comprises an upper conveying belt and two groups of limiting guiding assemblies, the two groups of limiting guiding assemblies are arranged at intervals along the width direction of the positioning groove, the limiting guiding assembly comprises two guiding rods, a guiding gap is formed between the two guiding rods, the pins on both sides of the component are arranged in the guiding gaps of the two groups of limiting guiding assemblies, the upper conveying belt is arranged above the guiding rods in parallel, an elastic rubber layer is arranged on the conveying surface of the upper conveying belt, the elastic rubber layer contacts the top surface of the component to drive the component to move along the length direction of the guiding rod, one end of the limiting guiding assembly close to the foot fixing device is provided with a baffle, the bottom of the baffle is connected with the extension shaft of a jacking cylinder, and the jacking cylinder is vertically installed.

[0008] Further, a gantry feeding device is further included, which is used for clamping and feeding the components on the foot fixing device by the guiding conveying device, the gantry feeding device comprises a gantry, a sliding cross beam and a lifting base, a first linear drive module is installed on each side of the foot fixing device, the two ends of the bottom of the gantry are respectively installed on the sliding seats of the two first linear drive modules, a second linear drive module is installed on the gantry, the sliding cross beam is installed on the sliding seat of the second linear drive module, a feeding cylinder is vertically installed on the sliding cross beam, the lifting base is connected to the telescopic shaft of the feeding cylinder, and a vacuum feeding pipe is installed at the bottom of the lifting base.

[0009] Further, a long-distance conveying device is further included, which comprises a hollow conveying pipe, the conveying space inside the hollow conveying pipe is only used for conveying one component, the component is conveyed in an inverted state in the hollow conveying pipe, the component is conveyed in the hollow conveying pipe in a pneumatic manner, the conveying end of the hollow conveying pipe is sealed, a bottom wall of the conveying end of the hollow conveying pipe is provided with a discharging window, and a turnover feeding device is arranged below the discharging window, which is used for feeding the component output by the hollow conveying pipe onto the guiding conveying device after being turned over.

[0010] Further, a plurality of alternating conveying assemblies are arranged along the length direction of the hollow conveying pipe, the alternating conveying assembly comprises a sealing plate, an installation window communicating with the conveying space is formed in the top of the hollow conveying pipe, the sealing plate is slidably fitted in the installation window, a gas cavity is arranged in the sealing plate, a gas hole is formed in the end face of the sealing plate close to the end of the hollow conveying pipe, the gas hole communicates with the gas cavity, and a gas input pipe is connected to the top of the sealing plate.

[0011] Further, the alternating conveying assembly further comprises an electromagnet, a spring and a permanent magnet, a top plate is fixed to the top of the sealing plate, the two ends of the spring are respectively connected to the top plate and the hollow conveying pipe, the electromagnet is installed on the hollow conveying pipe, the permanent magnet is installed on the top plate, the permanent magnet is arranged opposite to the electromagnet, the electromagnet generates a magnetic pole different from that of the permanent magnet when electrified, and when the spring is in a normal state, the sealing plate is separated from the conveying space.

[0012] Further, the turnover feeding device comprises a feeding rack, a lifting top plate, a horizontal sliding plate and a negative pressure turnover plate, the lifting top plate is slidingly installed on the feeding rack, the horizontal sliding plate is slidingly installed on the bottom surface of the lifting top plate, two sides of the hollow conveying pipe are provided with mounting supports, the negative pressure turnover plate is arranged between the two mounting supports, the negative pressure turnover plate is rotationally connected with the mounting supports through a turnover shaft, and the top surface of the negative pressure turnover plate is provided with a plurality of negative pressure adsorption holes; a gas cylinder is vertically installed on the feeding rack, the lifting top plate is connected with the telescopic shaft of the gas cylinder, a pushing gas cylinder is horizontally installed on the bottom surface of the lifting top plate, and the telescopic shaft of the pushing gas cylinder is connected with the horizontal sliding plate; one of the mounting supports is provided with a turnover motor, and the output shaft of the turnover motor is drivingly connected with the turnover shaft.

[0013] A laser pin cutting method for controllable packaging chip pins comprises the following steps by using the above laser pin cutting conveying system for controllable packaging chip pins.

[0014] S1, according to the length of the angle to be cut, a corresponding number of detachable pin setting plates are installed;

[0015] S2, the pins of the packaging chip are placed downward, the pins pass through the positioning groove, and the part exceeding the cutting position of the laser cutting machine is the cutting length;

[0016] S3, the laser cutting machine moves along the length direction of the positioning groove, and sequentially completes the pin cutting operation on the arranged packaging chips.

[0017] The beneficial effects of the present application are:

[0018] 1. The packaging chip is placed on the uppermost detachable pin setting plate, the pins of the packaging chip pass through the strip-shaped groove and the positioning groove, the pins passing through the packaging chip are cut by the laser cutting machine, the pin cutting operation is completed by the laser cutting method, the pins are not affected, the pin cutting quality is good, different numbers of detachable pin setting plates are installed according to the pin cutting length requirement, the passing length of the packaging chip is adjusted, and thus different angle cutting requirements can be met.

[0019] 2. The hollow conveying pipe remotely conveys the chips processed in the previous work station by the pneumatic method, then the packaging chip is turned over 180° by the turnover feeding device and fed to the guiding conveying device, the packaging chip is conveyed at a short distance by the guiding conveying device, so that the packaging chip is in the clamping and feeding range of the gantry feeding device, then the packaging chip is fed one by one to the pin setting device by the gantry feeding device, and the pin cutting operation is sequentially completed on the fed packaging chip by the linear movement of the laser cutting machine. The feeding operation and the angle cutting operation of the packaging chip can be performed at the same time, the angle cutting and discharging are improved, and the automatic angle cutting processing is realized. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 Structure diagram of a laser pin cutting and conveying system for packaged chip pins according to the present application Figure 1

[0021] Figure 2 Structure diagram of a laser pin cutting and conveying system for packaged chip pins according to the present application Figure 2

[0022] Figure 3 Structure diagram of a laser pin cutting and conveying system for packaged chip pins according to the present application Figure 3

[0023] Figure 4 Structure diagram of a laser pin cutting and conveying system for packaged chip pins according to the present application Figure 4

[0024] Figure 5 Figure 3 Enlarged view of A in FIG.

[0025] Figure 6 Structure diagram of a negative pressure turnover plate in a laser pin cutting and conveying system for packaged chip pins according to the present application

[0026] Figure 7 Partial structure diagram of a hollow conveying pipe in a laser pin cutting and conveying system for packaged chip pins according to the present application

[0027] In the figure, 1 is a fixed pin base plate, 2 is a detachable fixed pin plate, 3 is a positioning groove, 4 is a strip-shaped groove, 5 is a fixed cross beam, 6 is a laser cutting machine, 7 is a laser seat, 8 is a base, 9 is a mounting shaft, 10 is a pressing plate sliding seat, 11 is a vertical rod, 12 is a downward pressing sliding block, 13 is a pressing spring, 14 is a pressing inclined surface, 15 is a first screw rod groove, 16 is a bidirectional screw thread screw rod, 17 is a second screw rod groove, 18 is a screw rod, 19 is a first motor, 20 is a second motor, 21 is an upper conveying belt, 22 is a guide rod, 23 is an elastic rubber layer, 24 is a baffle, 25 is a jacking air cylinder, 26 is a gantry, 27 is a sliding cross beam, 28 is a lifting base, 29 is a first linear drive module, 30 is a second linear drive module, 31 is a feeding air cylinder, 32 is a vacuum feeding pipe, 33 is a hollow conveying pipe, 34 is a sealing plate, 35 is an air cavity, 36 is an air hole, 37 is an electromagnet, 38 is a spring, 39 is a permanent magnet, 40 is a top plate, 41 is a feeding rack, 42 is a lifting top plate, 43 is a horizontal sliding plate, 44 is a negative pressure turnover plate, 45 is a mounting pillar, 46 is an air cylinder, 47 is a negative pressure adsorption hole, 48 is a pushing air cylinder, and 49 is a turnover motor. DETAILED DESCRIPTION

[0028] ​​​​​The technical solutions of the present application are described in further detail below with reference to the drawings, but the protection scope of the present application is not limited to the following description.

[0029] Implementation I

[0030] As Figures 1 to 7The application discloses a laser cutting pin conveying system with controllable packaging chip pins, which comprises a pin fixing device and a laser cutting pin device. The pin fixing device comprises a pin fixing base plate 1 and detachable pin fixing plates 2. The pin fixing base plate 1 is fixedly arranged, and a plurality of groups of positioning components are linearly arranged on the pin fixing base plate 1. The positioning component comprises two parallel positioning grooves 3 which are arranged in a penetrating mode along the thickness direction of the pin fixing base plate 1. A plurality of detachable pin fixing plates 2 are arranged in an overlapping mode on the pin fixing base plate 1. A plurality of strip-shaped grooves 4 are arranged in a penetrating mode on the detachable pin fixing plates 2, and the strip-shaped grooves 4 are arranged in a one-to-one coincident mode with the positioning grooves 3. The laser cutting pin device comprises a fixed cross beam 5 and a laser cutting machine 6. The fixed cross beam 5 is parallel to the pin fixing base plate 1. A laser seat 7 is slidably arranged on the fixed cross beam 5 and moves along the length direction of the positioning groove 3. The laser cutting machine 6 is installed on the laser seat 7. The laser beam of the laser cutting machine 6 is perpendicular to the positioning groove 3 and is arranged below the pin fixing base plate 1. The pins on both sides of the component are arranged to pass through the two positioning grooves 3 and the strip-shaped grooves 4, so that the pins of the component are arranged in the cutting range of the laser cutting machine 6. The length of the pins of the component passing through the positioning groove 3 is controlled by adjusting the overlapping number of the detachable pin fixing plates 2. The packaging chip is arranged on the detachable pin fixing plates 2, that is, the pins of the packaging chip are arranged to be placed downward. The pins on both sides of the packaging chip are arranged to be inserted into the two positioning grooves 3 in the positioning component. The pins of the packaging chip pass through the strip-shaped grooves 4 and the positioning grooves 3 in sequence, so that the pins of the packaging chip passing through part are arranged in the cutting range of the laser cutting machine 6. The pin cutting operation is completed by means of laser cutting. No force is applied to the pins, so that the deformation of the pins is avoided during the cutting process, and the pin cutting quality is good. Secondly, according to the pin cutting length requirement, different numbers of detachable pin fixing plates 2 are arranged to adjust the length of the pins of the packaging chip passing through. The more the numbers of the detachable pin fixing plates 2 arranged, the shorter the length of the pins passing through. Therefore, different cutting angle requirements can be met. In the specific implementation, detachable pin fixing plates 2 with different thicknesses are arranged. Different thicknesses of the detachable pin fixing plates 2 are arranged according to the requirement, so that different cutting angle length requirements can be met. The cutting height of the laser cutting machine 6 is kept unchanged, and the position of the pins of the packaging chip passing through is kept unchanged. Only the cutting angle length is adjusted by changing the detachable pin fixing plates 2, that is, the pin cutting operation is performed by means of a unique variable. The influence of the error is greatly reduced, and the cutting angle precision is higher. In actual cutting production, the positioning component is provided with two groups. The feeding operation and the laser pin cutting operation are synchronously performed, that is, the packaging chips to be cut are arranged in sequence along the length direction of the positioning groove 3. The laser cutting machine 6 moves along the arrangement direction of the packaging chips and performs the pin cutting operation on the pins of the arranged packaging chips in sequence. When the positioning components are filled with the packaging chips, the packaging chips are continuously arranged on the other positioning components. The laser cutting machine 6 synchronously performs the pin cutting operation on the packaging chips on the other positioning components. Meanwhile, the packaging chips on which the cutting operation is completed are discharged from the positioning components. Then, the above operation is repeated, so that the industrial pin cutting operation of the packaging chip is completed, and the cutting efficiency is greatly improved.

[0031] A method for controllable laser cutting of packaged chip pins, employing the aforementioned controllable laser cutting delivery system for packaged chip pins, includes the following steps:

[0032] S1. Install the corresponding number of detachable pin plates 2 according to the required cut length of the packaged chip;

[0033] S2. Position the chip with the pins facing down so that the pins pass through the positioning groove 3. The portion that extends beyond the cutting position 6 of the laser cutting machine is the cutting length.

[0034] S3. The laser cutting machine 6 moves along the length of the positioning groove 3 to perform the lead cutting operation on the arranged packaged chips in sequence.

[0035] Example 2

[0036] Based on Example 1, such as Figures 1 to 4 As shown, the pin fixing device also includes a base 8 and a mounting shaft 9. The mounting shaft 9 is fixedly inserted at each of the four corners of the pin fixing base 1. The mounting shaft 9 is vertically fixed on the base 8. The detachable pin fixing plate 2 is slidably sleeved on the mounting shaft 9. Pressure plate assemblies are provided on both sides of the pin fixing base 1. The pressure plate assembly includes a pressure plate slide 10, a vertical rod 11 and a downward sliding block 12. The pressure plate slide 10 is slidably disposed on the base 8. The top of the pressure plate slide 10 is fixed with the vertical rod 11. The downward sliding block 12 is slidably sleeved on the vertical rod 11. The downward sliding block 12 presses the detachable pin fixing plate 2 onto the pin fixing base 1, sleeves the detachable pin fixing plate 2 on the mounting shaft 9, and presses it tightly by the downward sliding block 12, so that the detachable pin fixing plate 2 overlaps with the pin fixing base 1, so as to adjust the length of the package chip pins passing through the positioning groove 3, thereby adjusting the chamfer length to meet different chamfer requirements.

[0037] Furthermore, such as Figures 1 to 4As shown, the vertical rod 11 is sleeved with a compression spring 13, two ends of the compression spring 13 are connected with the pressing plate sliding seat 10 and the lower pressing sliding block 12 respectively, the bottom of the lower pressing sliding block 12 close to one end of the fixed foot base plate 1 is provided with a pressing inclined surface 14, the top surface of the base 8 is provided with a first lead screw groove 15, the first lead screw groove 15 is parallel to the positioning groove 3, the first lead screw groove 15 is rotatably provided with a bidirectional threaded lead screw 16, the two opposite threaded segments of the bidirectional threaded lead screw 16 are both threadedly sleeved with a lead screw sliding block, the pressing plate sliding seat 10 in the two pressing plate assemblies is respectively installed on the two lead screw sliding blocks, the top of the fixed cross beam 5 is provided with a second lead screw groove 17, the second lead screw groove 17 is rotatably provided with a lead screw 18, the laser seat 7 is slidingly fitted in the second lead screw groove 17, and the laser seat 7 is threadedly sleeved on the lead screw 18, one end of the fixed cross beam 5 is provided with a first motor 19, an output shaft of the first motor 19 is drivingly connected with the lead screw 18, one end of the base 8 is provided with a second motor 20, an output shaft of the second motor 20 is drivingly connected with the bidirectional threaded lead screw 16, the second motor 20 drives the bidirectional threaded lead screw 16 to rotate, so that the lead screw sliding blocks move linearly along the axial direction of the bidirectional threaded lead screw 16, and the moving directions of the two lead screw sliding blocks are opposite, the lead screw sliding blocks drive the lower pressing sliding block 12 to move through the pressing plate sliding seat 10, the lower pressing sliding block 12 is first moved away from the fixed foot base plate 1, so that the lower pressing sliding block 12 is separated from the fixed foot base plate 1, then the corresponding detachable fixed foot plate 2 is installed according to the cutting foot requirement, then the second motor 20 drives the bidirectional threaded lead screw 16 to reverse, so that the lead screw sliding blocks drive the pressing plate sliding seat 10 to move reversely, the lower pressing sliding block 12 is moved close to the fixed foot base plate 1, the pressing inclined surface 14 of the lower pressing sliding block 12 extrudes the detachable fixed foot plate 2, the compression spring 13 is stretched and deformed, under the reaction force of the compression spring 13, the lower pressing sliding block 12 presses the detachable fixed foot plate 2 on the fixed foot base plate 1, and the installation shaft 9 is matched to complete the limiting of the detachable fixed foot plate 2, so that the detachable fixed foot plate 2 is conveniently disassembled and assembled.

[0038] Example three

[0039] In order to improve the cutting efficiency, the packaged chip needs to be accurately fed on the fixed foot device, and the laser cutting device is matched to complete the automatic cutting operation of the packaged chip. Therefore, on the basis of example two, as shown in Figures 1 to 4Also shown, the guiding conveying device includes the upper conveying belt 21 and two sets of limiting guiding assemblies, the two sets of limiting guiding assemblies are arranged along the width direction of the positioning groove 3, the limiting guiding assembly includes two guiding rods 22, the two guiding rods 22 form a guiding gap therebetween, the pins on both sides of the component are respectively located in the guiding gap of the two sets of limiting guiding assemblies, the upper conveying belt 21 is arranged above the guiding rods 22 in parallel, the conveying surface of the upper conveying belt 21 is arranged with an elastic rubber layer 23, the elastic rubber layer 23 contacts the top surface of the component to drive it to move along the length direction of the guiding rod 22, the limiting guiding assembly is provided with a baffle 24 at the end close to the fixing device, the bottom of the baffle 24 is connected with the telescopic shaft of the jacking cylinder 25, the jacking cylinder 25 is vertically installed, and the gantry feeding device is used for clamping and feeding the component conveyed by the guiding conveying device to the fixing device, the gantry feeding device includes a gantry 26, a sliding cross beam 27 and a lifting base 28, the two sides of the fixing device are both installed with a first linear drive module 29, the two ends of the bottom of the gantry 26 are respectively installed on the sliding seats of the two first linear drive modules 29, the gantry 26 is installed with a second linear drive module 30, the sliding cross beam 27 is installed on the sliding seat of the second linear drive module 30, the sliding cross beam 27 is vertically installed with a feeding cylinder 31, the telescopic shaft of the feeding cylinder 31 is connected with the lifting base 28, the bottom of the lifting base 28 is installed with a vacuum feeding pipe 32, the packaged chip is placed on the guiding rod 22 in a right-lying state, and the pins on both sides of the packaged chip pass through the two guiding gaps respectively, and then the packaged chip is conveyed in advance by the upper conveying belt 21 to realize the guiding conveying of the packaged chip, and meanwhile in the conveying process, the pins of the packaged chip will not be extruded, which can protect the pins of the packaged chip from bending, deformation and other problems, in order to ensure good conveying effect, the elastic rubber layer 23 is arranged, the elastic rubber layer 23 contacts the top surface of the packaged chip through its own deformation, so that the elastic rubber layer 23 and the packaged chip have a large friction force therebetween, so as to ensure that the packaged chip has good conveying effect, when the packaged chip contacts the baffle 24, it indicates that the packaged chip is conveyed to the feeding position of the to-be-cut corner, at this time, the gantry 26 is moved to approach the guiding conveying device by the first linear drive module 29, and then the vacuum feeding pipe 32 is moved to the position directly above the packaged chip to be fed by the second linear drive module 30, and then the feeding cylinder 31 is moved downward to make the vacuum feeding pipe 32 contact the top surface of the packaged chip, the vacuum feeding pipe 32 is connected with a gas pump through a pipeline, and the packaged chip is adsorbed by a negative pressure mode, which belongs to the prior art, therefore, the specific vacuum adsorption equipment is not described, finally the packaged chip is fed to the fixing device by the gantry feeding device, so that the pins of the packaged chip pass through the positioning groove 3, and then the above feeding operation is repeated to feed the packaged chip along the length direction of the positioning groove 3 in turn, and meanwhile the laser cutting machine 6 performs the corner cutting operation synchronously.

[0040] Example four

[0041] On the basis of embodiment three, as Figures 1 to 7 shown, it further comprises a long-distance conveying device, the long-distance conveying device comprises a hollow conveying pipe 33, the conveying space inside the hollow conveying pipe 33 is only for conveying one component, the component is conveyed in an inverted state in the hollow conveying pipe 33, the component is conveyed in the hollow conveying pipe 33 in a pneumatic manner, the conveying end of the hollow conveying pipe 33 is sealed, the bottom wall of the conveying end of the hollow conveying pipe 33 is provided with a discharging window, a turnover feeding device is arranged below the discharging window, the turnover feeding device is used to overturn the component output by the hollow conveying pipe 33 and feed it to the guide conveying device, the long-distance conveying device can convey the packaged chip, and the packaged chip processed by the previous work station can be directly conveyed to the pin cutting station for pin cutting processing, the hollow conveying pipe 33 can be installed in a hoisting manner or a support manner, the hollow conveying pipe 33 conveys the packaged chip in a pneumatic manner, so that the hollow conveying pipe 33 can be provided in an arc shape to meet different environmental requirements and facilitate the arrangement of the hollow conveying pipe 33, in order to avoid that the pins of the packaged chip are affected during conveying, the packaged chip is conveyed in the hollow conveying pipe 33 in an inverted manner, so that the pins of the packaged chip are arranged upward, and the pins of the packaged chip will not be damaged by contacting the hollow conveying pipe 33 during conveying, the open end of the hollow conveying pipe 33 is connected to the previous work station, after the packaged chip is conveyed to the end of the hollow conveying pipe 33, it is removed from the hollow conveying pipe 33 through the discharging window, and then the packaged chip is turned over by 180° through the turnover feeding device, so that the pins of the packaged chip are fed downward in the guide conveying device, and the packaged chip is conveyed to the pin cutting feeding position in the feeding state through the guide conveying device, in this way, it can be ensured that the pins of the packaged chip will not be damaged during the whole conveying process, and the packaged chip corner bad rate is greatly reduced.

[0042] Embodiment five

[0043] On the basis of embodiment four, as Figures 1 to 7As shown, the turnover feeding device comprises a feeding frame 41, a lifting top plate 42, a horizontal sliding plate 43 and a negative pressure turnover plate 44. The lifting top plate 42 is slidingly installed on the feeding frame 41. The horizontal sliding plate 43 is slidingly installed on the bottom surface of the lifting top plate 42. Both sides of the hollow conveying pipe 33 are provided with mounting pillars 45. The negative pressure turnover plate 44 is arranged between the two mounting pillars 45. The negative pressure turnover plate 44 is rotationally connected to the mounting pillars 45 through a turnover shaft. The top surface of the negative pressure turnover plate 44 is provided with a plurality of negative pressure adsorption holes 47. The feeding frame 41 is vertically provided with a pneumatic cylinder 46. The pneumatic cylinder 46 is connected to the lifting top plate 42 through an extension shaft. The bottom surface of the lifting top plate 42 is horizontally provided with a pushing pneumatic cylinder 48. The pushing pneumatic cylinder 48 is connected to the horizontal sliding plate 43 through an extension shaft. One of the mounting pillars 45 is provided with a turnover motor 49. The output shaft of the turnover motor 49 is drivingly connected to the turnover shaft. The packaged chips conveyed to the end of the hollow conveying pipe 33 fall on the negative pressure turnover plate 44 through a discharging window. The negative pressure turnover plate 44 is also connected to a gas pump through a pipeline. The negative pressure adsorption holes 47 generate adsorption force to adsorb the packaged chips on the negative pressure turnover plate 44, so as to ensure that the position of the packaged chips will not change during the turnover feeding process, thereby accurately feeding the packaged chips to the guide conveying device. Specifically, the lifting top plate 42 is driven by the pneumatic cylinder 46 to move downward, the negative pressure turnover plate 44 is driven by the lifting top plate 42 to move downward, the packaged chips are moved out of the hollow conveying pipe 33, then the horizontal sliding plate 43 is driven by the pushing pneumatic cylinder 48 to move, the horizontal sliding plate 43 carries the negative pressure turnover plate 44 to move between the guide rod 22 and the hollow conveying pipe 33, so as to ensure that the negative pressure turnover plate 44 will not interfere with the hollow conveying pipe 33 during the turnover process, then the negative pressure turnover plate 44 is driven by the turnover motor 49 to turn 180°, so that the pins of the packaged chips are arranged downward, then the packaged chips are placed on the guide rod 22 through the cooperation of the lifting top plate 42 and the horizontal sliding plate 43, and the pins on both sides of the packaged chips pass through the two guide gaps, then the horizontal sliding plate 43 moves away from the movement of the packaged chips on the upper conveying belt 21, the packaged chips are pushed forward through the horizontal sliding plate 43, so that the packaged chips smoothly enter the conveying range of the upper conveying belt 21, the packaged chips are conveyed to the feeding position of the fixing device through the upper conveying belt 21, and finally the turnover feeding device is reset to turnover feed the next packaged chip.

[0044] Embodiment six

[0045] Since the hollow conveying pipe 33 is a long-distance conveying, it is difficult to realize long-distance conveying of the packaged chips through single pneumatic conveying. Therefore, on the basis of embodiment five, as shown in Figures 1 to 7As shown, the hollow conveying pipe 33 is provided with a plurality of alternate conveying assemblies at intervals along the length direction of the hollow conveying pipe 33, the alternate conveying assembly comprises a sealing plate 34, the top of the hollow conveying pipe 33 is provided with a mounting window communicating with the conveying space, the sealing plate 34 is slidably fitted in the mounting window, the sealing plate 34 is provided with a gas cavity 35, the end face of the sealing plate 34 close to the end of the hollow conveying pipe 33 is provided with a gas hole 36 communicating with the gas cavity 35, the top of the sealing plate 34 is connected with a gas input pipe, the alternate conveying assembly further comprises an electromagnet 37, a spring 38 and a permanent magnet 39, the top of the sealing plate 34 is fixed with a top plate 40, the two ends of the spring 38 are connected with the top plate 40 and the hollow conveying pipe 33 respectively, the electromagnet 37 is mounted on the hollow conveying pipe 33, the permanent magnet 39 is mounted on the top plate 40, the permanent magnet 39 is oppositely arranged with the electromagnet 37, the electromagnet 37 generates a magnetic pole different from the permanent magnet 39 when electrified, when the spring 38 is in normal state, the sealing plate 34 is separated from the conveying space, the transfer conveying is arranged at intervals on the hollow conveying pipe 33, i.e. the alternate conveying assembly is arranged, the specific process of the transfer conveying is that, in normal state, the bottom of the sealing plate 34 contacts the inner bottom wall of the hollow conveying pipe 33, so as to isolate the hollow conveying pipe 33 into a plurality of separate conveying pipes, the packaging chips are sequentially conveyed in each conveying pipe, when the packaging chips are conveyed in one of the conveying pipes, the remaining conveying pipes are in sealed state, so as to avoid the air pressure leakage and affect the smooth conveying of the packaging chips, when the packaging chips are close to the next conveying pipe, the electromagnet 37 is de-energized, the sealing plate 34 moves upward under the action of the spring 38, so as to make the two conveying pipes communicate, i.e. the packaging chips can be conveyed into the next conveying pipe, then the electromagnet 37 is energized to attract the permanent magnet 39, so as to make the sealing plate 34 press the spring 38 to move downward, so as to make the sealing plate 34 repeatedly block the two conveying pipes, then the gas input pipe inputs high-pressure gas, the high-pressure gas passes through the gas cavity 35 and then blows out from the gas hole 36, the packaging chips are conveyed in the conveying pipe by the blown gas, in this way, the packaging chips are sequentially conveyed through the plurality of conveying pipes to the end of the hollow conveying pipe 33, the distance of conveying the packaging chips in each conveying pipe is short at a time, so as to ensure the continuous conveying of the packaging chips and avoid the problem of stagnation; in specific implementation, in order to position the conveying position of the packaging chips and make the sealing plate 34 automatically start according to the position of the packaging chips, a photoelectric sensor is mounted on the end face of the sealing plate 34 away from the gas hole 36, the position of the packaging chips is recognized by the photoelectric sensor, when the photoelectric sensor detects the packaging chips, the sealing plate 34 corresponding to the photoelectric sensor moves upward, so as to make the packaging chips smoothly move into the next conveying pipe, in this way, the packaging chips can be conveyed without obstacles, the whole corner cutting operation is realized automatically, the production efficiency of the packaging chips is improved, and the labor cost is reduced.

Claims

1. A laser-controlled lead-cutting and conveying system for packaged chips, characterized in that, The application relates to a pin setting device and a laser pin cutting device, the pin setting device comprises a pin setting base plate (1) and a detachable pin setting plate (2), the pin setting base plate (1) is fixedly arranged, a plurality of groups of positioning components are linearly arranged on the pin setting base plate (1), the positioning component comprises two parallel positioning grooves (3), the positioning grooves (3) are arranged in a penetrating mode along the thickness direction of the pin setting base plate (1), a plurality of the detachable pin setting plates (2) are arranged in an overlapping mode on the pin setting base plate (1), a plurality of strip-shaped grooves (4) are arranged in a penetrating mode on the detachable pin setting plate (2), a plurality of the strip-shaped grooves (4) are arranged in a one-to-one coincident mode with a plurality of the positioning grooves (3), the laser pin cutting device comprises a fixed cross beam (5) and a laser cutting machine (6), the fixed cross beam (5) is parallel to the pin setting base plate (1), a laser seat (7) is slidably arranged on the fixed cross beam (5), the laser seat (7) moves along the length direction of the positioning groove (3), the laser cutting machine (6) is installed on the laser seat (7), the laser beam of the laser cutting machine (6) is perpendicular to the positioning groove (3), the laser beam of the laser cutting machine (6) is located below the pin setting base plate (1), the pins on both sides of the component are respectively arranged to pass through the positioning groove (3) and the strip-shaped groove (4), so that the pins of the component are located in the cutting range of the laser cutting machine (6), the overlapping quantity of the detachable pin setting plate (2) is adjusted to control the passing length of the pins of the component from the positioning groove (3); The application further relates to a guiding and conveying device, the guiding and conveying device comprises an upper conveying belt (21) and two groups of limiting and guiding components, the two groups of limiting and guiding components are arranged in a spaced mode along the width direction of the positioning groove (3), the limiting and guiding component comprises two guide rods (22), a guiding gap is formed between the two guide rods (22), the pins on both sides of the component are respectively arranged in the guiding gaps of the two groups of limiting and guiding components, the upper conveying belt (21) is arranged above the guide rods (22) in a parallel mode, an elastic rubber layer (23) is arranged on the conveying surface of the upper conveying belt (21), the elastic rubber layer (23) contacts the top surface of the component and drives the component to move along the length direction of the guide rod (22), one end of the limiting and guiding component close to the pin setting device is provided with a baffle (24), the bottom of the baffle (24) is connected with the extension shaft of a jacking air cylinder (25), and the jacking air cylinder (25) is vertically installed. The gantry feeding device is used for clamping and feeding the components on the foot fixing device, the two sides of the foot fixing device are both provided with a first linear driving module (29), the bottom of the gantry (26) is respectively installed on the sliding seat of the two first linear driving modules (29), a second linear driving module (30) is installed on the gantry (26), the sliding cross beam (27) is installed on the sliding seat of the second linear driving module (30), a feeding cylinder (31) is vertically installed on the sliding cross beam (27), the telescopic shaft of the feeding cylinder (31) is connected with the lifting base (28), and a vacuum feeding pipe (32) is installed at the bottom of the lifting base (28); The long-distance conveying device comprises a hollow conveying pipe (33), the conveying space in the hollow conveying pipe (33) is only used for conveying one component, the component is conveyed in an inverted state in the hollow conveying pipe (33), the component is conveyed in the hollow conveying pipe (33) in a pneumatic mode, the conveying end of the hollow conveying pipe (33) is sealed, a bottom wall of the conveying end of the hollow conveying pipe (33) is provided with a discharging window, and a turnover feeding device is arranged below the discharging window, the turnover feeding device is used for overturning and feeding the component output by the hollow conveying pipe (33) onto the guide conveying device; The turnover feeding device comprises a feeding rack (41), a lifting top plate (42), a horizontal sliding plate (43) and a negative pressure turnover plate (44), the lifting top plate (42) is slidably installed on the feeding rack (41), the horizontal sliding plate (43) is slidably installed on the bottom surface of the lifting top plate (42), the two sides of the hollow conveying pipe (33) are both provided with a mounting support (45), the negative pressure turnover plate (44) is arranged between the two mounting supports (45), the negative pressure turnover plate (44) is rotationally connected with the mounting supports (45) through a turnover shaft, and a plurality of negative pressure adsorption holes (47) are formed in the top surface of the negative pressure turnover plate (44); A cylinder (46) is vertically installed on the feeding rack (41), the telescopic shaft of the cylinder (46) is connected with the lifting top plate (42), a pushing cylinder (48) is horizontally installed on the bottom surface of the lifting top plate (42), the telescopic shaft of the pushing cylinder (48) is connected with the horizontal sliding plate (43), one of the mounting supports (45) is provided with a turnover motor (49), and the output shaft of the turnover motor (49) is in transmission connection with the turnover shaft.

2. The laser die pin shearing system of claim 1, wherein, The foot fixing device further comprises a base (8) and a mounting shaft (9), the four corners of the foot fixing base plate (1) are fixedly provided with the mounting shaft (9), the mounting shaft (9) is vertically fixed on the base (8), the detachable foot plate (2) is slidably sleeved on the mounting shaft (9), both sides of the foot fixing base plate (1) are provided with a pressing plate assembly, the pressing plate assembly comprises a pressing plate sliding seat (10), a vertical rod (11) and a pressing sliding block (12), the pressing plate sliding seat (10) is slidably arranged on the base (8), the top of the pressing plate sliding seat (10) is fixedly provided with the vertical rod (11), the pressing sliding block (12) is slidably sleeved on the vertical rod (11), and the pressing sliding block (12) presses the detachable foot plate (2) on the foot fixing base plate (1).

3. The laser die pin shearing system of claim 2, wherein the laser die pin shearing system further comprises a laser die pin shearing system controller configured to control the laser die pin shearing system. A pressing spring (13) is sleeved on the vertical rod (11), the two ends of the pressing spring (13) are connected with the pressing plate sliding seat (10) and the pressing sliding block (12) respectively, the bottom of one end of the pressing sliding block (12) close to the foot fixing base plate (1) is provided with a pressing inclined surface (14), the top surface of the base (8) is provided with a first screw rod groove (15), the first screw rod groove (15) is parallel to the positioning groove (3), a bidirectional screw thread screw rod (16) is rotatably arranged in the first screw rod groove (15), a screw rod sliding block is threadedly sleeved on each of the two opposite screw thread segments of the bidirectional screw thread screw rod (16), the pressing plate sliding seats (10) of the two pressing plate assemblies are respectively arranged on the two screw rod sliding blocks, the top of the fixed cross beam (5) is provided with a second screw rod groove (17), a screw rod (18) is rotatably arranged in the second screw rod groove (17), the laser seat (7) is slidably fitted in the second screw rod groove (17) and is threadedly sleeved on the screw rod (18), one end of the fixed cross beam (5) is provided with a first motor (19), the output shaft of the first motor (19) is in transmission connection with the screw rod (18), one end of the base (8) is provided with a second motor (20), the output shaft of the second motor (20) is in transmission connection with the bidirectional screw thread screw rod (16).

4. The laser die pin shearing system of claim 3, wherein the laser die pin shearing system further comprises a laser die pin shearing system controller. The hollow conveying pipe (33) is provided with a plurality of alternating conveying assemblies at intervals along the length direction of the hollow conveying pipe (33), the alternating conveying assembly comprises a sealing plate (34), the top of the hollow conveying pipe (33) is provided with a mounting window communicating with a conveying space, the sealing plate (34) is slidably fitted in the mounting window, the sealing plate (34) is provided with an air cavity (35) therein, the end face of the sealing plate (34) close to the end of the hollow conveying pipe (33) is provided with an air hole (36), the air hole (36) is in communication with the air cavity (35), and the top of the sealing plate (34) is connected with a gas input pipe.

5. The laser die pin shearing system of claim 4, wherein the laser die pin shearing system further comprises a laser die pin shearing system controller. The alternate conveying assembly further comprises an electromagnet (37), a spring (38) and a permanent magnet (39), a top plate (40) is fixed on the top of the sealing plate (34), two ends of the spring (38) are connected with the top plate (40) and the hollow conveying pipe (33) respectively, the electromagnet (37) is installed on the hollow conveying pipe (33), the permanent magnet (39) is installed on the top plate (40), the permanent magnet (39) is oppositely arranged with the electromagnet (37), the electromagnet (37) generates a magnetic pole different from the permanent magnet (39) when electrified, and the sealing plate (34) is separated from the conveying space when the spring (38) is in a normal state.

6. A method for laser pin cutting of a packaged chip pin controllable by using the laser pin cutting delivery system of claim 1, wherein, The method comprises the following steps: S1, install a corresponding number of detachable pin plates (2) according to the length of the required corner cutting of the packaged chip; S2, make the pins of the packaged chip downward, make the pins pass through the positioning groove (3), and the part exceeding the cutting position of the laser cutting machine (6) is the cutting length; S3, the laser cutting machine (6) moves along the length direction of the positioning groove (3), and sequentially completes the pin cutting operation on the arranged packaged chips.

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