A wire bonding machine transducer, wire bonding machine and vibration amplitude detection and calibration method

Abstract

The application discloses a wire bonding machine transducer, a wire bonding machine and a vibration amplitude detection and calibration method, which realizes non-contact and high-sensitivity amplitude detection of a vibrating part of the transducer by integrating a laser interference detection part in the wire bonding machine transducer. The laser outputs continuous laser with a stable wavelength, and the signal light and the reference light are separated by a beam splitter. The signal light is irradiated on the vibrating part of the transducer and is reflected. The reference light and the reflected light are combined in a beam combiner to form interference fringes. Finally, the phase change signal is collected by a photodetector. The application can extract the micron-level vibration displacement of the transducer in the working state in real time and with high precision. Compared with the traditional judgment mode, the application provides an objective and quantifiable detection method, effectively improves the precision and automation degree of the transducer performance consistency evaluation, and can be widely applied to the production line detection, equipment calibration and online quality control of the wire bonding equipment and the like. The application has important significance for guaranteeing the welding stability and improving the packaging yield.

Description

Technical Field

[0001] This application belongs to the field of semiconductor packaging equipment technology, specifically relating to wire bonding machine transducers, wire bonding machines, and vibration amplitude detection and calibration methods. Background Technology

[0002] Wire bonding machines, as a key process platform in modern semiconductor packaging equipment, play a vital role in semiconductor manufacturing. They are responsible for electrically connecting chips to external circuits via bonding wires, ensuring the performance and reliability of semiconductor devices. The transducer is one of the core components of the wire bonding machine; its function is to convert electrical energy into mechanical energy, thereby generating high-frequency vibrations to drive the bonding pins to complete the electrical connection between the chip and the lead frame or substrate.

[0003] Transducer performance fluctuations, especially inconsistent amplitude response, are one of the main factors affecting solder joint quality stability. Inconsistent amplitude can lead to uneven solder joint strength, poor contact, and other problems, thereby affecting the overall performance and reliability of semiconductor devices. Existing transducer conformance assessment methods include:

[0004] The empirical method relies on the subjective judgment of process personnel, lacks objectivity and repeatability, and makes it difficult to guarantee the accuracy and consistency of the evaluation results.

[0005] Tooling comparison method: Although relatively objective, it requires multiple changes of mechanical fixtures, which is inefficient and not suitable for large-scale production environments.

[0006] Self-excited response measurement: Its accuracy is limited under actual ultrasonic loading conditions, and it cannot be measured independently of the equipment, which limits its application scope and flexibility.

[0007] Large optical instrument measurement: Although it can provide relatively accurate measurement results, the equipment is large in size, expensive, and complex to operate, making it unsuitable for rapid, online measurement on production lines.

[0008] To meet the batch consistency control requirements of the packaging industry, developing a compact, high-frequency response, digital output, and integrable transducer vibration amplitude measurement and calibration system for wire bonding machine transducers has become an urgent technical problem to be solved. Summary of the Invention

[0009] The embodiments of this application provide a wire bonding machine transducer, a wire bonding machine, and a vibration amplitude detection and calibration method. A compact, high-frequency response, digital output, and integrable transducer vibration amplitude measurement and calibration system is developed for the wire bonding machine transducer to solve the above-mentioned technical problems.

[0010] In a first aspect, embodiments of this application provide a wire bonding machine transducer, including a detection unit and a transducer body. The detection unit is integrated into the transducer body and includes a laser, a beam splitter, a beam combiner, and a photodetector, wherein:

[0011] A laser is a device used to output a continuous wavelength of light with a stable wavelength.

[0012] A beam splitter is used to split the laser output from a laser to obtain a signal beam and a reference beam. The signal beam is incident on the vibrating part of the transducer body, and the reference beam is incident on the beam combiner.

[0013] A beam combiner is used to receive the reflected light reflected by the vibrating part and the reference light, and to combine the reflected light and the reference light to obtain optical interference fringes.

[0014] A photodetector is used to detect the phase information of optical interference fringes in order to obtain the phase changes between the reflected light and the reference light.

[0015] Furthermore, it also includes a frequency shifter, which is used to frequency shift the reference light to obtain a frequency-shifted reference light.

[0016] Furthermore, the frequency shifter is a heterodyne frequency shift module, which is located between the beam splitter and the beam combiner. The heterodyne frequency shift module adds a fixed frequency shift to the reference light to obtain a frequency-shifted reference light.

[0017] Furthermore, the frequency shifter is an I / Q demodulation structure formed by dual sampling. I / Q demodulation divides the signal into in-phase (I) and quadrature (Q) paths for demodulation. The I / Q demodulation structure is integrated into the photodetector. A virtual frequency shift algorithm is constructed in the field programmable gate array of the photodetector using the I / Q demodulation structure. The virtual frequency shift algorithm is used to add a fixed frequency shift to the reference light to obtain a frequency-shifted reference light.

[0018] Secondly, embodiments of this application provide a wire bonding machine, including a wire bonding machine body and a wire bonding machine transducer as described above, wherein the wire bonding machine transducer is disposed on the wire bonding machine body.

[0019] Thirdly, embodiments of this application provide a vibration amplitude detection and calibration method, which is applied to the wire bonding machine transducer described above. The vibration amplitude detection and calibration method includes:

[0020] A beam splitter is used to obtain a signal light and a reference light, wherein the signal light is incident on the vibrating part of the transducer body and the reference light is incident on the beam combiner.

[0021] A beam combiner is used to receive the reflected light from the vibrating part and the reference light, and the reflected light and the reference light are combined to obtain optical interference fringes.

[0022] A photodetector is used to detect the phase information of optical interference fringes in order to obtain the phase changes of the reflected light and the reference light;

[0023] The amplitude of the wire bonding machine transducer is determined based on the phase changes of the reflected light and the reference light.

[0024] Obtain the excitation current of the wire bonding machine transducer and construct the amplitude-excitation current curve of the wire bonding machine transducer to obtain the first response curve;

[0025] Obtain the standard response curve corresponding to the wire bonding machine transducer to obtain the second response curve;

[0026] Calculate the consistency evaluation coefficient of the wire bonding machine transducer based on the first response curve and the second response curve;

[0027] The consistency evaluation coefficient is used as the bias compensation parameter of the wire bonding machine transducer, and the output of the wire bonding machine transducer is calibrated and compensated using the bias compensation parameter.

[0028] Further, the steps of obtaining the excitation current of the wire bonding machine transducer and constructing the amplitude-excitation current curve of the wire bonding machine transducer to obtain the first response curve specifically include:

[0029] The excitation current of the wire bonding machine transducer is sampled;

[0030] Obtain the transducer amplitude value corresponding to each excitation current;

[0031] The first response curve is plotted based on the sampled excitation currents and the corresponding transducer amplitude values.

[0032] Furthermore, the consistency evaluation coefficients include the slope coefficient and the intercept coefficient, and the expression for the first response curve is:

[0033] A ref (I)=k ref *I+b ref

[0034] In the formula, I is the sampled excitation current, A ref (I) represents the amplitude value of the standard transducer sample under excitation current I, k ref Let b be the slope of the first response curve. ref The intercept of the first response curve;

[0035] The expression for the second response curve is:

[0036] A meas (I)=k meas *I+b meas

[0037] In the formula, A meas(I) represents the amplitude value of the transducer under test when the excitation current is I, k meas Let b be the slope of the second response curve. meas The intercept of the second response curve;

[0038] The formula for calculating the slope coefficient is:

[0039]

[0040] The formula for calculating the intercept coefficient is:

[0041]

[0042] Or US2 = b meas -b ref

[0043] In the formula, US1 is the slope coefficient and US2 is the intercept coefficient.

[0044] Fourthly, embodiments of this application provide a processing apparatus, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the vibration amplitude detection and calibration method described in any one of the first aspects above.

[0045] Fifthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the vibration amplitude detection and calibration method described in any one of the first aspects above.

[0046] The beneficial effects of the embodiments of this application are:

[0047] This application discloses a wire bonding machine transducer, a wire bonding machine, and a vibration amplitude detection and calibration method. By integrating a laser interferometry detection unit into the wire bonding machine transducer, non-contact, high-sensitivity amplitude detection of the transducer's vibrating parts is achieved. A continuous laser with a stable wavelength is output from a laser, which is split into a signal light and a reference light by a beam splitter. The signal light illuminates the vibrating part of the transducer and is reflected. The reference light and the reflected light are combined in a beam combiner to form interference fringes. Finally, a photodetector collects the phase change signal. This application can extract the micron-level vibration displacement of the transducer in its operating state in real time with high precision, and is suitable for detecting small amplitude vibrations at high frequencies. Compared with traditional contact or experience-based judgment methods, this invention provides an objective and quantifiable detection method, effectively improving the accuracy and automation of transducer performance consistency evaluation. It can be widely applied to production line testing, equipment calibration, and online quality control of wire bonding equipment, and is of great significance for ensuring welding stability and improving packaging yield. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is one of the structural schematic diagrams of a wire bonding machine transducer provided in an embodiment of this application;

[0050] Figure 2 This is a second schematic diagram of the structure of a wire bonding machine transducer provided in one embodiment of this application;

[0051] Figure 3 This is the third schematic diagram of the structure of the wire bonding machine transducer provided in one embodiment of this application;

[0052] Figure 4 This is a schematic diagram of the structure of a wire bonding machine provided in one embodiment of this application;

[0053] Figure 5 This is a flowchart illustrating the implementation of a vibration amplitude detection and calibration method provided in an embodiment of this application;

[0054] Figure 6 This is a schematic diagram of the structure of a processing device provided in one embodiment of this application. Detailed Implementation

[0055] To make the technical problem to be solved, the technical solution and the beneficial effects of this application clearer, the following is in conjunction with the appendix. Figures 1 to 6 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

[0056] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0057] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0058] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0059] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0060] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0061] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0062] Example 1

[0063] Please refer to Figure 1This embodiment discloses a wire bonding machine transducer 12, including a detection unit 121 and a transducer body. The detection unit 121 is integrated into the transducer body and includes a laser 1211, a beam splitter 1212, a beam combiner 1213, and a photodetector 1214. The laser 1211 outputs a continuous wavelength laser L with a stable wavelength. The beam splitter 1212 is disposed in the output optical path of the laser 1211 and is used to split the laser L output by the laser 1211 to obtain... Signal light L1 and reference light L2 are incident on the transducer body's vibrating part 122, which is a ceramic nozzle or a chamfer. Reference light L2 is incident on the combiner 1213. The combiner 1213 is used to receive the reflected light L1' reflected by the vibrating part and the reference light L2, and to combine the reflected light L1' and the reference light L2 to obtain optical interference fringes. Photodetector 1214 is used to detect the phase information of the optical interference fringes to obtain the phase change of the reflected light L1' and the reference light L2.

[0064] Specifically, by integrating a detection unit 121 based on the laser interference principle into the transducer 12 of the wire bonding machine, high-precision measurement of the transducer's vibration characteristics is achieved. The system uses a laser 1211 to generate a continuous laser with a stable wavelength to ensure the stability and consistency of the measurement signal. The laser is split into a signal light L1 and a reference light L2 by a beam splitter 1212. The signal light L1 illuminates the vibrating part of the transducer body and undergoes a phase change with its slight vibration. The reflected light (reflected light L1') interferes with the reference light L2 in the beam combiner 1213 to form fringes, thereby converting the vibration information into a detectable optical signal.

[0065] The photodetector 1214 acquires the phase changes of the interference fringes, and the displacement amplitude of the vibrating part can be accurately reconstructed through subsequent electronic processing. This method has advantages such as non-contact operation, high-frequency response, and submicron resolution, and is especially suitable for ultrasonic transducers operating at high frequencies of 50–150 kHz, effectively capturing their minute vibration characteristics.

[0066] With its compact overall design, it is suitable for integration into wire bonding equipment without interfering with the normal welding process. It can also achieve automated data acquisition and digital output, significantly improving the consistency control and quality assurance capabilities in the wire bonding process. It has good engineering application value and industrial promotion prospects.

[0067] Furthermore, the wire bonding machine transducer 12 also includes a frequency shifter 1215, which is used to frequency shift the reference light L2 to obtain a frequency-shifted reference light L2'.

[0068] Further, please refer to Figure 2The frequency shifter 1215 is a heterodyne frequency shift module. The heterodyne frequency shift module is located between the beam splitter 1212 and the beam combiner 1213. The reference light L2 is given a fixed frequency shift by the heterodyne frequency shift module to obtain the frequency shifted reference light L2'.

[0069] Furthermore, in another embodiment of this application, please refer to Figure 3 The frequency shifter 1215 is an I / Q demodulation structure formed by dual-channel sampling. I / Q demodulation divides the signal into in-phase (I) and quadrature (Q) paths for demodulation. The I / Q demodulation structure is integrated into the photodetector 1214. Specifically, a virtual frequency shift algorithm is constructed in the field-programmable gate array of the photodetector 1214 using the I / Q demodulation structure. The virtual frequency shift algorithm is used to add a fixed frequency shift to the reference light L2 to obtain the frequency-shifted reference light L2'.

[0070] Specifically, a frequency shifter 1215 is further introduced into the original wire bonding machine transducer 12 structure to perform frequency shifting processing on the reference light L2, which significantly improves the signal-to-noise ratio and measurement accuracy of the interference signal. By frequency shifting the reference light L2, the interference signal can be moved from the DC or low-frequency region to the high-frequency region, thereby effectively avoiding 1 / f noise and system background interference, making subsequent phase demodulation more stable and reliable.

[0071] In terms of implementation, the scheme provides two optional paths: one is to use a heterodyne frequency shift module (such as an acousto-optic modulator AOM) to apply a fixed frequency offset to the reference light L2 to generate a frequency-shifted reference light L2', which facilitates the formation of a stable beat frequency signal with the reflected signal; the other is based on an I / Q demodulation structure formed by dual-channel sampling. I / Q demodulation divides the signal into in-phase (I) and quadrature (Q) paths for demodulation. The I / Q demodulation structure is used to construct a virtual frequency shift algorithm in the field programmable gate array of the photodetector. The virtual frequency shift algorithm is used to add a fixed frequency shift to the reference light to obtain a frequency-shifted reference light. The frequency shift operation is completed without adding additional optical components, further improving the system integration and stability.

[0072] For example, taking an acousto-optic modulator (AOM) as an example, the AOM is introduced into the reference optical path. The AOM is positioned between the beam splitter 1212 and the beam combiner 1213 to add a fixed frequency shift to the reference light L2, obtaining a frequency-shifted reference light L2'. The optical signal is frequency-shifted by a fixed offset f. shift (e.g., 1MHz), the frequency of the interference signal becomes f vib +f shift f vib Using the reference optical frequency, it can escape the low-frequency region and effectively suppress environmental noise. If AOM is not used, a dual-channel sampling can be used to form an I / Q demodulation structure, and a virtual frequency shift algorithm can be built in the FPGA to achieve frequency shift.

[0073] This frequency shift design not only enhances the system's anti-interference capability but also optimizes signal processing efficiency and demodulation accuracy, enabling the transducer to maintain high resolution and high sensitivity vibration detection capability even in complex working environments. It is particularly suitable for microelectronics manufacturing scenarios with high requirements for precision welding quality.

[0074] Furthermore, the photodetector 1214 detects the phase information of the optical interference fringes through a dual-channel I / Q demodulation method to obtain the relative changes of the reflected light L1' and the frequency-shifted reference light L2'.

[0075] A dual-channel I / Q demodulation method is introduced into the photodetector 1214 to achieve high-precision extraction of phase information from optical interference fringes. This method utilizes two sampling signals to simultaneously acquire the phase changes of the interference fringes and, combined with the aforementioned frequency-shifted reference light technique, effectively achieves relative phase demodulation between the reflected light L1' and the frequency-shifted reference light L2'. This demodulation method exhibits strong noise immunity and dynamic range, significantly improving the transducer's resolution and stability against minute vibration signals. Compared to traditional single-channel or analog demodulation methods, the dual-channel demodulation method not only improves demodulation accuracy but also enhances the system's robustness to external disturbances.

[0076] In addition, after obtaining the optical interference fringes, the system performs the following processing in sequence:

[0077] First, the optical interference fringes are converted into electrical signals by the photodetector 1214 and then enter the analog conditioning section. In this stage, the signal is first amplified by a low-noise amplifier (LNA) to increase the amplitude of the weak interference signal and ensure that subsequent processing has a sufficient signal-to-noise ratio.

[0078] The signal then enters a bandpass filter (BPF) to filter out interference from non-target frequency bands, retaining only the effective signal within the transducer's operating frequency band (e.g., 50–150 kHz). If the system uses heterodyne detection, the modulation frequency can be increased to 1 MHz. In this case, the bandpass filter parameters will also be adjusted accordingly, mainly focusing on key indicators such as the filter's center frequency, bandwidth, and possible quality factor (Q value) to accommodate the extraction of high-frequency signals.

[0079] Heterodyne detection uses mixing and down-conversion techniques to convert high-frequency signals to intermediate frequencies, thereby improving the system's anti-interference capability and signal processing efficiency while preserving signal information. In this scheme, heterodyne detection enables the system to handle modulation frequencies up to 1MHz and accurately extract effective signals from 50–150kHz by adjusting bandpass filter parameters.

[0080] Next, the filtered analog signal is sampled by a high-speed analog-to-digital converter (ADC), with a sampling rate typically exceeding 10 Msps (millions per second) to ensure accurate capture of high-frequency signals.

[0081] The sampled digital signal is sent to a digital processing platform, such as an FPGA or DSP, for further processing. In the digital processing stage, the system first extracts the phase information of the signal using phase-locked loop (PLL) or quadrature demodulation (IQ) technology to achieve high-precision tracking of minute changes in the interference signal.

[0082] Subsequently, the steady-state amplitude of the signal is calculated using the RMS digital module, which reflects the actual operating state or excitation amplitude of the transducer. Furthermore, the system automatically removes DC offset components and low-frequency noise drift introduced by the environment to ensure the stability and accuracy of the final output. Through this series of analog and digital processing steps, the entire interferometric detection system can acquire the dynamic response of the transducer in real time and with precision.

[0083] The aforementioned low-noise amplifier (LNA), bandpass filter (BPF), high-speed analog-to-digital converter (ADC), and digital module RMS are integrated into the post-signal processing circuit (not shown) after the photodetector 1214.

[0084] In this embodiment, this application discloses a wire bonding machine transducer. By integrating a laser interferometry detection unit into the transducer, non-contact, high-sensitivity amplitude detection of the transducer's vibrating parts is achieved. A continuous laser with a stable wavelength is output from a laser, which is split into a signal light and a reference light by a beam splitter. The signal light illuminates the vibrating part of the transducer and is reflected. The reference light and the reflected light are combined in a beam combiner to form interference fringes. Finally, a photodetector collects the phase change signal. This application can extract the micron-level vibration displacement of the transducer in its operating state in real time with high precision, and is suitable for detecting small amplitude vibrations at high frequencies.

[0085] Furthermore, by setting a frequency shifter, this application applies a fixed frequency offset to the reference light to generate a frequency-shifted reference light, which can shift the interference signal from the DC or low-frequency region to the high-frequency region, thereby effectively avoiding 1 / f noise and system background interference, making phase demodulation more stable and reliable.

[0086] Compared with traditional contact-based or experience-based judgment methods, this invention provides an objective and quantifiable testing method, which effectively improves the accuracy and automation of transducer performance consistency assessment. It can be widely used in production line testing, equipment calibration, and online quality control of wire bonding equipment, and is of great significance for ensuring welding stability and improving packaging yield.

[0087] Example 2

[0088] Please refer to Figure 4This embodiment discloses a wire bonding machine 1, including a wire bonding machine body 11 and a wire bonding machine transducer 12 as described above, wherein the wire bonding machine transducer 12 is disposed on the wire bonding machine body 11.

[0089] Specifically, the wire bonding machine integrates a transducer with interference detection capabilities, introducing high-precision displacement and vibration monitoring functions into the traditional wire bonding machine body, significantly improving the equipment's intelligence and control accuracy. The transducer utilizes the principle of laser interference, employing components such as a laser, beam splitter, frequency shifter, beam combiner, and photodetector to achieve real-time monitoring of vibration during the wire bonding process, acquiring nanometer-level displacement information. By acquiring the phase of the interference fringes through the photodetector, and then performing analog conditioning, analog-to-digital conversion, and digital signal processing, the system can quickly respond to state changes during the bonding process, ensuring consistent solder joint quality and process stability. It is suitable for microelectronic packaging fields with high welding precision requirements and has promising application prospects.

[0090] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the wire bonding machine transducer embodiment of this application. For details on their specific functions and technical effects, please refer to the method embodiment section, and they will not be repeated here.

[0091] Example 3

[0092] Please refer to Figure 5 This embodiment discloses a vibration amplitude detection and calibration method, which is applied to the wire bonding machine transducer as described above. The vibration amplitude detection and calibration method includes:

[0093] S301, a beam splitter is used to obtain signal light and reference light, wherein the signal light is incident on the vibrating part of the transducer body and the reference light is incident on the beam combiner;

[0094] Specifically, the beam splitter splits a stable, continuous-wavelength laser emitted by a laser into two beams: one is a signal beam used to detect the mechanical vibration information of the transducer; the other is a reference beam, serving as a reference light source in interferometry. The signal beam is directed onto the vibrating part of the transducer body, causing its surface to vibrate periodically in response to the driving signal, thus causing phase modulation or a slight change in the path length of the incident signal beam. The reference beam, on the other hand, is guided into the beam combiner through optical path adjustment to maintain a stable propagation path.

[0095] S302, a beam combiner is used to receive the reflected light reflected by the vibrating part and the reference light, and the reflected light and the reference light are combined to obtain optical interference fringes;

[0096] Specifically, when the signal light shines on the surface of the transducer's vibrating section, its reflection path is modulated by a minute surface displacement, forming reflected light carrying information about the vibration position. A beam combiner receives this reflected light and simultaneously receives the reference light, combining them to form an interference field. Since the reference light wavefront remains stable, while the reflected light wavefront changes periodically with the transducer's vibration, the two beams interfere spatially or temporally, thus forming detectable optical interference fringes on the detection surface. The contrast and phase changes of the fringes are closely related to the transducer surface displacement.

[0097] S303 uses a photodetector to detect the phase information of optical interference fringes in order to obtain the phase changes of the reflected light and the reference light;

[0098] Specifically, a photodetector is placed at the location where interference fringes form, typically employing a high-speed response photodiode, a four-quadrant detector, or a coherent detection array. This detector receives the fringe signal in real time, converting changes in light intensity into electrical signals, which are then analyzed for phase information through subsequent analog and digital processing. Tiny changes in phase represent the displacement of the transducer's vibrating section; therefore, phase measurement allows for the precise reconstruction of the dynamic process of mechanical vibration. To improve signal quality, the system can also incorporate virtual or actual frequency shift modules, employing heterodyne interferometry to enhance the sensitivity and linear response range of phase change detection. This step requires the detector to possess high bandwidth and low noise characteristics to ensure accurate capture of vibration information with higher frequencies and smaller amplitudes.

[0099] S304, the amplitude of the wire bonding machine transducer is determined based on the phase change of the reflected light and the reference light;

[0100] Specifically, by accurately demodulating the phase change of the interference fringes, the periodic change of the optical path during vibration can be obtained, and the actual displacement amplitude of the vibrating part can be calculated. Since there is a definite mathematical relationship between the optical path change and the mechanical displacement (such as the 2π periodic relationship between wavelength and phase difference), phase demodulation techniques, such as orthogonal demodulation (IQ demodulation) and Fourier transform, can be used to convert the optical phase information into an equivalent vibration amplitude. This amplitude value represents the response intensity of the wire bonding machine transducer under the action of the excitation signal and is a core parameter for transducer performance evaluation and subsequent calibration.

[0101] S305, obtain the excitation current of the wire bonding machine transducer and construct the amplitude-excitation current curve of the wire bonding machine transducer to obtain the first response curve;

[0102] Specifically, while determining the transducer's vibration amplitude, the system needs to simultaneously record its excitation current value, typically obtained through a high-precision current sensor or drive current sampling interface. Multiple excitation current values ​​are then paired with their corresponding vibration amplitudes to plot the transducer's response curves under different drive current conditions, i.e., amplitude-current relationship curves.

[0103] Further, the steps of obtaining the excitation current of the wire bonding machine transducer and constructing the amplitude-excitation current curve of the wire bonding machine transducer to obtain the first response curve specifically include:

[0104] The excitation current of the wire bonding machine transducer is sampled;

[0105] Obtain the transducer amplitude value corresponding to each excitation current;

[0106] The first response curve is plotted based on the sampled excitation currents and the corresponding transducer amplitude values.

[0107] S306, Obtain the standard response curve corresponding to the wire bonding machine transducer to obtain the second response curve;

[0108] Specifically, the standard response curve is a transducer reference curve established based on an ideal model, factory calibration samples, or batch average sample data. It represents the ideal vibration amplitude corresponding to different excitation currents under standard conditions. This curve can be obtained through laboratory testing, finite element simulation, or historical data accumulation, and has high repeatability and representativeness.

[0109] S307, Calculate the consistency evaluation coefficient of the wire bonding machine transducer based on the first response curve and the second response curve;

[0110] Specifically, the consistency evaluation coefficients include the slope coefficient and the intercept coefficient, which are used to quantify the degree of linear matching and offset between the first response curve (actual measured amplitude-excitation current relationship) and the second response curve (standard reference curve), respectively. The slope coefficient reflects whether the transducer's amplitude response sensitivity is consistent with the standard; a large deviation in the slope indicates a difference in the transducer's gain or response rate. The intercept coefficient describes the baseline offset of the output signal, assessing whether the transducer has systematic errors or zero-point drift. By calculating and comprehensively analyzing these two coefficients, the consistency of the transducer's performance can be fully evaluated, ensuring that its output meets design and process specifications.

[0111] S308 uses the consistency evaluation coefficient as the bias compensation parameter of the wire bonding machine transducer, and uses the bias compensation parameter to calibrate and compensate the output of the wire bonding machine transducer.

[0112] Specifically, after obtaining the consistency evaluation coefficient, the system can use it as a bias compensation parameter to dynamically adjust the transducer's output, and it can also be used for transducer classification. Specific methods include linearly correcting the output amplitude, adding digital filtering and correction factors, or adjusting the excitation current to ensure the output amplitude matches the standard response. This compensation operation can be automatically completed in the digital signal processing module using software algorithms, without requiring changes to the hardware structure, achieving online real-time calibration.

[0113] Furthermore, the consistency evaluation coefficients include the slope coefficient and the intercept coefficient, and the expression for the first response curve is:

[0114] A ref (I)=k ref *I+b ref

[0115] In the formula, I is the sampled excitation current, A ref (I) represents the amplitude value of the standard transducer sample under excitation current I, k ref Let b be the slope of the first response curve. ref The intercept of the first response curve;

[0116] The expression for the second response curve is:

[0117] A meas (I)=k meas *I+b meas

[0118] In the formula, A meas (I) represents the amplitude value of the transducer under test when the excitation current is I, k meas Let b be the slope of the second response curve. meas The intercept of the second response curve;

[0119] The formula for calculating the slope coefficient is:

[0120]

[0121] The formula for calculating the intercept coefficient is:

[0122]

[0123] Or US2 = b meas -b ref

[0124] In the formula, US1 is the slope coefficient and US2 is the intercept coefficient.

[0125] In the above embodiments, this application discloses a vibration amplitude detection and calibration method. By integrating a laser interferometry detection unit into the transducer of a wire bonding machine, non-contact, high-sensitivity amplitude detection of the transducer's vibrating parts is achieved. A continuous laser with a stable wavelength is output from a laser, which is split into a signal light and a reference light by a beam splitter. The signal light illuminates the vibrating part of the transducer and is reflected. The reference light and the reflected light are combined in a beam combiner to form interference fringes. Finally, a photodetector collects the phase change signal. This application can extract the micron-level vibration displacement of the transducer in its working state in real time with high precision, and is suitable for detecting small amplitudes at high frequencies. Compared with traditional contact or experience-based judgment methods, this invention provides an objective and quantifiable detection method, effectively improving the accuracy and automation of transducer performance consistency evaluation. It can be widely applied to production line testing, equipment calibration, and online quality control of wire bonding equipment, and is of great significance for ensuring welding stability and improving packaging yield.

[0126] Example 4

[0127] Figure 6 This is a schematic diagram of the structure of a processing device provided in one embodiment of this application. Figure 6 As shown, the processing equipment 6 in this embodiment includes: at least one processor 60 ( Figure 6 (Only one is shown in the diagram), memory 61, and computer program 62 stored in memory 61 and executable on at least one processor 60; when processor 60 executes computer program 62, it implements the steps in the various method embodiments described above.

[0128] The processing equipment may include, but is not limited to, processor 60 and memory 61. Those skilled in the art will understand that... Figure 6 This is merely an example of processing equipment and does not constitute a limitation on the processing equipment. It may include more or fewer components than shown in the figure, or combinations of certain components, or different components. For example, it may also include input / output devices, network access devices, buses, etc.

[0129] The processor 60 can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0130] In some embodiments, memory 61 may be an internal storage unit of the processing equipment 6, such as a hard drive or memory of the processing equipment. In other embodiments, memory 61 may be an external storage device of the processing equipment, such as a plug-in hard drive, smart media card (SMC), secure digital (SD) card, flash card, etc., provided on the processing equipment. Furthermore, memory 61 may include both internal and external storage units of the processing equipment. Memory 61 is used to store operating systems, applications, bootloaders, data, and other programs, such as program code for computer programs. Memory 61 can also be used to temporarily store data that has been output or will be output.

[0131] For example, computer program 62 may be divided into one or more modules / units, one or more of which are stored in memory 61 and executed by processor 60 to complete this application. One or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of computer program 62 in processing equipment 6.

[0132] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0133] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0134] If the aforementioned integrated units are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. This computer program can be stored in a computer-readable storage medium; when executed by a processor, the computer program can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. Computer-readable media include: any entity or device capable of carrying computer program code to a device / terminal equipment, recording media, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0135] Embodiments of this application also provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps described in the various method embodiments above.

[0136] The embodiments of this application provide a computer program product that, when run on a terminal device, enables the terminal device to implement the steps in the various method embodiments described above.

[0137] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0138] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0139] In the embodiments provided in this application, it should be understood that the disclosed apparatus / devices and methods can be implemented in other ways. For example, the apparatus / device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0140] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0141] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for detecting and calibrating vibration amplitude, characterized in that, The vibration amplitude detection and calibration method is applied to a wire bonding machine transducer. The wire bonding machine transducer includes a detection unit and a transducer body. The detection unit is integrated into the transducer body and includes a laser, a beam splitter, a beam combiner, and a photodetector. The laser is used to output a continuous wavelength laser with a stable wavelength. The beam splitter is used to split the laser output from the laser to obtain a signal light and a reference light. The signal light is incident on the vibration unit of the transducer body, and the reference light is incident on the beam combiner. The beam combiner is used to receive the reflected light reflected by the vibration unit and the reference light, and combines the reflected light and the reference light to obtain optical interference fringes. The photodetector is used to detect the phase information of the optical interference fringes to obtain the phase change of the reflected light and the reference light. The vibration amplitude detection and calibration method includes: The beam splitter is used to obtain a signal light and a reference light, wherein the signal light is incident on the vibrating part of the transducer body and the reference light is incident on the beam combiner; A beam combiner is used to receive the reflected light reflected by the vibrating part and the reference light, and the reflected light and the reference light are combined to obtain optical interference fringes. A photodetector is used to detect the phase information of the optical interference fringes in order to obtain the phase changes of the reflected light and the reference light; The amplitude of the wire bonding machine transducer is determined based on the phase change between the reflected light and the reference light; Obtain the excitation current of the wire bonding machine transducer and construct the amplitude-excitation current curve of the wire bonding machine transducer to obtain the first response curve; Obtain the standard response curve corresponding to the wire bonding machine transducer to obtain the second response curve; Calculate the consistency evaluation coefficient of the wire bonding machine transducer based on the first response curve and the second response curve; The consistency evaluation coefficient is used as the bias compensation parameter of the wire bonding machine transducer, and the output of the wire bonding machine transducer is calibrated and compensated using the bias compensation parameter.

2. The vibration amplitude detection and calibration method as described in claim 1, characterized in that, The wire bonding machine transducer also includes a frequency shifter, which is used to frequency shift the reference light to obtain a frequency-shifted reference light.

3. The vibration amplitude detection and calibration method as described in claim 2, characterized in that, The frequency shifter is a heterodyne frequency shift module, which is disposed between the beam splitter and the beam combiner. The heterodyne frequency shift module adds a fixed frequency shift to the reference light to obtain the frequency-shifted reference light.

4. The vibration amplitude detection and calibration method as described in claim 2, characterized in that, The frequency shifter is an I / Q demodulation structure formed by dual sampling. The I / Q demodulation divides the signal into two paths, in-phase (I) and quadrature (Q), for demodulation. The I / Q demodulation structure is integrated into the photodetector. The I / Q demodulation structure is used to construct a virtual frequency shift algorithm in the field programmable gate array of the photodetector. The virtual frequency shift algorithm is used to add a fixed frequency shift to the reference light to obtain the frequency-shifted reference light.

5. The vibration amplitude detection and calibration method as described in claim 1, characterized in that, The steps of obtaining the excitation current of the wire bonding machine transducer and constructing the amplitude-excitation current curve of the wire bonding machine transducer to obtain the first response curve specifically include: The excitation current of the wire bonding machine transducer is sampled; Obtain the transducer amplitude value corresponding to each of the excitation currents; The first response curve is plotted based on the sampled excitation currents and the transducer amplitude values ​​corresponding to each excitation current.

6. The vibration amplitude detection and calibration method as described in claim 2, characterized in that, The consistency evaluation coefficients include a slope coefficient and an intercept coefficient, and the expression for the first response curve is: (I)= I + In the formula, I is the sampled excitation current. (I) represents the amplitude value of the transducer sample under test when the excitation current is I. The slope of the first response curve. The intercept of the first response curve; The expression for the second response curve is: (I)= I + In the formula, (I) represents the amplitude value of the standard transducer under excitation current I. The slope of the second response curve. The intercept of the second response curve; The formula for calculating the slope coefficient is: The formula for calculating the intercept coefficient is: or In the formula, The slope coefficient, This is the intercept coefficient.

7. A processing equipment, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements the vibration amplitude detection and calibration method as described in any one of claims 1-6.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the vibration amplitude detection and calibration method as described in any one of claims 1-6.

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