Die cutting device and die cutting method for thick PI material die cutting piece

Abstract

The invention relates to a die cutting device and method for a thick PI material die cutting piece. The device comprises a first feeding mechanism, a second feeding mechanism, a first die cutting mechanism, a first waste discharging mechanism, a third feeding mechanism, a second die cutting mechanism, a second waste discharging mechanism and a finished product winding mechanism which are sequentially arranged in the advancing direction of a material belt. The first die cutting mechanism comprises a first cutter point used for punching the outline of the thick PI material die cutting piece, and the angle of an outer cutter point of the first cutter point is 45-60 degrees. The second die cutting mechanism comprises a second cutter point used for punching the contour of the handle film, and the angle of an outer cutter point of the second cutter point is 45-60 degrees. Compared with the prior art, defective products are reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of die-cutting technology, and in particular relates to a die-cutting device and method for die-cutting parts made of thick PI material. Background Technology

[0002] Thick PI film (100) (polyimide), as a special engineering material, has been widely used in aerospace, microelectronics, nanotechnology, liquid crystals, separation membranes, lasers, and other fields. In the 1960s, countries worldwide listed the research, development, and utilization of polyimide as one of the most promising engineering plastics of the 21st century. Due to its outstanding performance and synthesis characteristics, polyimide's enormous application potential, whether as a structural or functional material, has been fully recognized. It is known as a "problem solver," and it is believed that "without polyimide, there would be no microelectronics technology as we know it today."

[0003] In existing technologies, various types of thick PI films are frequently used. During production, with conventional waste removal designs, after the second punching, the outer waste adhesive layer quickly re-adhedes to the cut edge of the product adhesive layer, leading to problems such as waste film pulling and missing sheets. For example... Figure 1 and Figure 2 As shown, Figure 1 For the desired die-cut shape, Figure 2 This is a schematic diagram of the cross-section of the blade used in the die-cutting machine. The angle of the outer blade is less than 30 degrees. When waste is discharged after die-cutting, the waste adhesive layer will stick back to the cut edge of the PI film layer. During waste discharge, the PI film is torn, resulting in defective products. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art by providing a die-cutting device and method for thick PI material die-cutting parts.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] The present invention provides a die-cutting device for thick PI material die-cutting parts, including a first feeding mechanism, a second feeding mechanism, a first die-cutting mechanism, a first waste removal mechanism, a third feeding mechanism, a second die-cutting mechanism, a second waste removal mechanism, and a finished product winding mechanism arranged sequentially along the material strip traveling direction;

[0007] The first die-cutting mechanism includes a first blade for punching out the outline of a thick PI material die-cutting part, and the angle of the outer blade of the first blade is 45-60°;

[0008] The second die-cutting mechanism includes a second blade for punching out the outline of the handle film, the outer edge of the second blade having an angle of 45-60°.

[0009] Furthermore, the cross-section of the first blade is an acute triangle with an angle of 10-30°, and the cross-section of the second blade is an acute triangle with an angle of 10-30°.

[0010] Furthermore, the first feeding mechanism includes a first feeding roller and a first feeding roller drive motor that is connected to the first feeding roller. The first feeding mechanism feeds out the first double-sided adhesive and the thick PI film and laminates them from top to bottom to form a "thick PI film-first double-sided adhesive" composite layer structure.

[0011] Furthermore, the second feeding mechanism includes a second feeding roller and a second feeding roller drive motor that is connected to the second feeding roller in a transmission. The second feeding mechanism feeds out the second double-sided adhesive and sequentially adheres it from top to bottom to form a composite layer structure of "second double-sided adhesive - thick PI film - first double-sided adhesive".

[0012] Furthermore, the first die-cutting mechanism includes a first die-cutting machine and a first die-cutting machine drive motor that is connected to the first die-cutting machine in a transmission manner, and the first blade is mounted on the first die-cutting machine.

[0013] Furthermore, the first waste removal mechanism includes a first waste removal roller and a first waste removal roller drive motor that is connected to the first waste removal roller in a transmission manner. The first waste removal mechanism is used to remove the waste material generated after the first die-cutting mechanism punches.

[0014] Furthermore, the third feeding mechanism includes a third feeding roller and a third feeding roller drive motor that is connected to the third feeding roller in a transmission. The third feeding mechanism delivers the handle and attaches it from top to bottom to form a composite layer structure of "handle-second double-sided adhesive-thick PI film-first double-sided adhesive".

[0015] Furthermore, the second die-cutting mechanism includes a second die-cutting machine and a second die-cutting machine drive motor that is connected to the second die-cutting machine in a transmission manner, and the second blade is mounted on the second die-cutting machine.

[0016] Furthermore, the second waste removal mechanism includes a second waste removal roller and a second waste removal roller drive motor that is connected to the second waste removal roller in a transmission. The second waste removal mechanism is used to remove the waste generated after the second die-cutting mechanism punches.

[0017] The finished product winding mechanism includes a finished product winding roller and a finished product winding roller drive motor that is connected to the finished product winding roller for transmission.

[0018] The present invention also provides a die-cutting method for a die-cutting device for thick PI material die-cutting parts, comprising the following steps:

[0019] S1, Primary material tape bonding: The second double-sided adhesive, the thick PI film, and the first double-sided adhesive are bonded together from top to bottom to form the primary material tape;

[0020] S2, One-shot die cutting and waste removal: The primary strip is punched to obtain the desired product shape and the waste is removed;

[0021] S3, Secondary strip bonding: The punched primary strip and the handle film are bonded together from top to bottom to form the secondary strip;

[0022] S4, two-stage die cutting and waste removal: the secondary strip is punched to cut out the required handle shape, and then it is wound up.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The outer blade angle design of the first and second blades provided by the present invention causes the strip to be split open by the blades during punching, increasing the gap between waste and product, avoiding re-sticking, reducing defective products, and improving production efficiency.

[0025] 2. In existing technologies, conventional cutting edges typically use blades with negligible angles, generally not exceeding 5°. Therefore, existing blades cannot separate the thick PI film from the waste double-sided adhesive. Due to the thickness of the thick PI film, it will dent downwards during punching and come into contact with the waste double-sided adhesive, causing re-adhesion. Therefore, this invention increases the angle of the first and second blades, thereby reducing the downward dent width of the thick PI film during punching, avoiding re-adhesion, reducing defective products, and improving production efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the product structure to be punched in Examples 1 and 2.

[0027] Figure 2 This is a schematic diagram of the cross-section of a blade in the prior art.

[0028] Figure 3 This is a schematic diagram of the cross-section of the first blade in Example 1.

[0029] Figure 4 This is a schematic cross-sectional view of the second blade in Example 1.

[0030] Figure 5 This is a schematic diagram of the die-cutting device in Example 1.

[0031] Numbering on the map:

[0032] 100 - PI film, 200 - First double-sided adhesive, 300 - Second double-sided adhesive, 400 - Handle, 1 - First feeding mechanism, 2 - Second feeding mechanism, 3 - First die-cutting mechanism, 301 - First blade, 4 - First waste removal mechanism, 5 - Third feeding mechanism, 6 - Second die-cutting mechanism, 601 - Second blade, 7 - Second waste removal mechanism, 8 - Finished product winding mechanism. Detailed Implementation

[0033] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0034] Unless otherwise specified in this technical solution, the component model, material name, connection structure, control method, and other features are considered to be common technical features disclosed in the prior art.

[0035] In the description of this invention, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0036] In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integrated connection; they can refer to a bolted connection or a welded connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] To prevent the double-sided adhesive from sticking back to the PI film during waste removal from die-cut PI film parts, this invention provides a die-cutting device for thick PI material parts. For its structure, please refer to [link to device description]. Figures 3 to 5 As shown, it includes a first feeding mechanism 1, a second feeding mechanism 2, a first die-cutting mechanism 3, a first waste removal mechanism 4, a third feeding mechanism 5, a second die-cutting mechanism 6, a second waste removal mechanism 7, and a finished product winding mechanism 8 arranged sequentially along the material belt travel direction;

[0038] The first die-cutting mechanism 3 includes a first blade 301 for punching out the outline of a thick PI material die-cutting part, and the angle of the outer blade of the first blade 301 is 45-60°.

[0039] The second die-cutting mechanism 6 includes a second blade 601 for punching out the outline of the handle film. The angle of the outer blade of the second blade 601 is 45-60°. The outer blades of the first blade 301 and the second blade 601 are set so that the strip is torn apart by the blades when punching the strip, which increases the gap between the waste and the product and can prevent re-sticking. Preferably, the outer blade angle of the first blade 301 and the second blade 601 is 45°.

[0040] For some specific implementation methods, please refer to [link / reference]. Figure 3 and Figure 4 As shown, the cross-section of the first blade 301 is an acute triangle with an angle of 10-30°, and the cross-section of the second blade 601 is an acute triangle with an angle of 10-30°.

[0041] For some specific implementation methods, please refer to [link / reference]. Figure 5 As shown, the first feeding mechanism 1 includes a first feeding roller and a first feeding roller drive motor that is connected to the first feeding roller. The first feeding mechanism 1 feeds out the first double-sided adhesive 200 and the thick PI film 100 and they are sequentially bonded from top to bottom to form a "thick PI film 100-first double-sided adhesive 200" composite layer structure.

[0042] For some specific implementation methods, please refer to [link / reference]. Figure 5 As shown, the second feeding mechanism 2 includes a second feeding roller and a second feeding roller drive motor that is connected to the second feeding roller. The second feeding mechanism 2 feeds out the second double-sided adhesive 300 and sequentially adheres it from top to bottom to form a composite layer structure of "second double-sided adhesive 300-thick PI film 100-first double-sided adhesive 200".

[0043] For some specific implementation methods, please refer to [link / reference]. Figure 5 As shown, the first die-cutting mechanism 3 includes a first die-cutting machine and a first die-cutting machine drive motor that is connected to the first die-cutting machine in a transmission manner, and the first blade 301 is mounted on the first die-cutting machine.

[0044] For some specific implementation methods, please refer to [link / reference]. Figure 5 As shown, the first waste removal mechanism 4 includes a first waste removal roller and a first waste removal roller drive motor that is connected to the first waste removal roller in a transmission manner. The first waste removal mechanism 4 is used to remove the waste material generated after the first die-cutting mechanism 3 punches.

[0045] For some specific implementation methods, please refer to [link / reference]. Figure 5As shown, the third feeding mechanism 5 includes a third feeding roller and a third feeding roller drive motor that is connected to the third feeding roller. The third feeding mechanism 5 feeds out the handle 400 and sequentially attaches it from top to bottom to form a composite layer structure of "handle 400-second double-sided adhesive 300-thick PI film 100-first double-sided adhesive 200".

[0046] For some specific implementation methods, please refer to [link / reference]. Figure 5 As shown, the second die-cutting mechanism 6 includes a second die-cutting machine and a second die-cutting machine drive motor that is connected to the second die-cutting machine in a transmission manner, and the second blade 601 is mounted on the second die-cutting machine.

[0047] For some specific implementation methods, please refer to [link / reference]. Figure 5 As shown, the second waste removal mechanism 7 includes a second waste removal roller and a second waste removal roller drive motor that is connected to the second waste removal roller in a transmission. The second waste removal mechanism 7 is used to remove the waste generated after the second die-cutting mechanism 6 punches.

[0048] The finished product winding mechanism 8 includes a finished product winding roller and a finished product winding roller drive motor that is connected to the finished product winding roller for transmission.

[0049] The present invention also provides a die-cutting method for a die-cutting device for thick PI material die-cutting parts, comprising the following steps:

[0050] S1, Primary material tape bonding: The second double-sided adhesive 300, the thick PI film 100, and the first double-sided adhesive 200 are bonded together from top to bottom to form the primary material tape;

[0051] S2, One-shot die cutting and waste removal: The primary strip is punched to obtain the desired product shape and the waste is removed;

[0052] S3, Secondary strip bonding: The punched primary strip and the handle film are bonded together from top to bottom to form the secondary strip;

[0053] S4, two-stage die cutting and waste removal: the secondary strip is punched to cut out the required handle shape of 400, and then it is wound up.

[0054] The above implementation methods will be described in more detail below with reference to specific embodiments.

[0055] Example 1

[0056] like Figure 1 The image shows a PI material die-cut part produced in this embodiment. This embodiment provides a die-cutting device for thick PI material die-cut parts; its structure can be found in [link to device description]. Figures 3 to 5As shown, the device includes a first feeding mechanism 1, a second feeding mechanism 2, a first die-cutting mechanism 3, a first waste removal mechanism 4, a third feeding mechanism 5, a second die-cutting mechanism 6, a second waste removal mechanism 7, and a finished product winding mechanism 8, arranged sequentially along the material strip's travel direction. The first die-cutting mechanism 3 includes a first blade 301 for punching out the outline of a thick PI material die-cut part, with the outer blade angle of the first blade 301 being 45°. The second die-cutting mechanism 6 includes a second blade 601 for punching out the outline of a handle film, with the outer blade angle of the second blade 601 also being 45°. The outer blade settings of the first blade 301 and the second blade 601 cause the material strip to be torn apart by the blades during punching, increasing the gap between the waste and the product and preventing re-adhesion.

[0057] Specifically, the cross-section of the first blade 301 is an acute triangle with an angle of 20°, and the cross-section of the second blade 601 is an acute triangle with an angle of 20°. In the existing technology, conventional blades generally use blades with angles that are negligible, usually not exceeding 5°. Therefore, the existing blades cannot separate the thick PI film from the double-sided adhesive of the waste material. Because the thick PI film is relatively thick, it will sink downwards during punching and come into contact with the double-sided adhesive of the waste material, causing it to stick back. Therefore, increasing the angle can prevent this phenomenon from occurring.

[0058] The first feeding mechanism 1 includes a first feeding roller and a first feeding roller drive motor connected to the first feeding roller. The first feeding mechanism 1 feeds out the first double-sided adhesive 200 and the thick PI film 100 and they are sequentially bonded from top to bottom to form a composite layer structure of "thick PI film 100 - first double-sided adhesive 200". The second feeding mechanism 2 includes a second feeding roller and a second feeding roller drive motor connected to the second feeding roller. The second feeding mechanism 2 feeds out the second double-sided adhesive 300 and they are sequentially bonded from top to bottom to form a composite layer structure of "second double-sided adhesive 300 - thick PI film 100 - first double-sided adhesive 200". The first die-cutting mechanism 3 includes a first die-cutting machine and a first die-cutting machine drive motor connected to the first die-cutting machine. The first blade 301 is mounted on the first die-cutting machine. The first waste removal mechanism 4 includes a first waste removal roller and a first waste removal roller drive motor connected to the first waste removal roller. The machine includes a first waste removal mechanism 4 for removing waste generated after the first die-cutting mechanism 3 punches; a third feeding mechanism 5 including a third feeding roller and a third feeding roller drive motor connected to the third feeding roller; the third feeding mechanism 5 feeds out a handle 400 and sequentially attaches it from top to bottom to form a composite layer structure of "handle 400-second double-sided adhesive 300-thick PI film 100-first double-sided adhesive 200"; a second die-cutting mechanism 6 including a second die-cutting machine and a second die-cutting machine drive motor connected to the second die-cutting machine; a second blade 601 mounted on the second die-cutting machine; a second waste removal mechanism 7 including a second waste removal roller and a second waste removal roller drive motor connected to the second waste removal roller; the second waste removal mechanism 7 is used to remove waste generated after the second die-cutting mechanism 6 punches; and a finished product winding mechanism 8 including a finished product winding roller and a finished product winding roller drive motor connected to the finished product winding roller.

[0059] Example 2

[0060] This embodiment provides a die-cutting method for a die-cutting device for thick PI material die-cutting parts, including the following steps:

[0061] S1, Primary material tape bonding: The second double-sided adhesive 300, the thick PI film 100, and the first double-sided adhesive 200 are bonded together from top to bottom to form a primary material tape. Specifically, the first feeding roller drive motor drives the first feeding roller to feed out the first double-sided adhesive 200 and the thick PI film 100 and bond them together from top to bottom to form a composite layer structure of "thick PI film 100-first double-sided adhesive 200". Then, the second feeding roller drive motor drives the second feeding roller to feed out the second double-sided adhesive 300 and bond it together from top to bottom to form a primary material tape of "second double-sided adhesive 300-thick PI film 100-first double-sided adhesive 200".

[0062] S2, First punch die cutting and waste removal: The primary strip is punched to obtain the desired product shape and the waste is removed. Specifically, the first die cutting machine drive motor drives the first die cutting machine to work, the first blade 301 punches the primary strip, and then the first waste roller drive motor drives the first waste roller to remove the waste generated after the first blade 301 punches.

[0063] S3, Secondary material strip bonding: The punched primary material strip and the handle film are bonded together from top to bottom to form a secondary material strip. Specifically, the third feeding roller drive motor drives the third feeding roller to send out the handle mold 400 and bond it from top to bottom to form a secondary material strip of "handle mold 400-second double-sided adhesive 300-thick PI film 100-first double-sided adhesive 200".

[0064] S4, Two-stage die-cutting and waste removal: The secondary strip is punched to form the required handle shape (400). Then it is wound up. Specifically, the second die-cutting machine drive motor drives the second die-cutting machine to work. The second blade 601 punches the secondary strip. Then the second waste roller drive motor drives the second waste roller to remove the waste generated after the second blade 601 punches. Finally, the finished product winding roller drive motor drives the finished product winding roller to wind up the finished product.

[0065] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.

Claims

1. A die-cutting device for thick PI material die-cutting parts, characterized in that, It includes a first feeding mechanism (1), a second feeding mechanism (2), a first die-cutting mechanism (3), a first waste removal mechanism (4), a third feeding mechanism (5), a second die-cutting mechanism (6), a second waste removal mechanism (7), and a finished product winding mechanism (8) arranged sequentially along the material belt travel direction; The first die-cutting mechanism (3) includes a first blade (301) for punching out the outline of a thick PI material die-cutting part, and the angle of the outer blade of the first blade (301) is 45-60°. The second die-cutting mechanism (6) includes a second blade (601) for punching out the outline of the handle film, and the angle of the outer blade of the second blade (601) is 45-60°.

2. The die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The first blade (301) has an acute triangle cross section with an angle of 10-30°, and the second blade (601) has an acute triangle cross section with an angle of 10-30°.

3. The die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The first feeding mechanism (1) includes a first feeding roller and a first feeding roller drive motor connected to the first feeding roller. The first feeding mechanism (1) feeds out the first double-sided adhesive (200) and the thick PI film (100) and they are bonded together from top to bottom to form a "thick PI film (100)-first double-sided adhesive (200)" composite layer structure.

4. The die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The second feeding mechanism (2) includes a second feeding roller and a second feeding roller drive motor connected to the second feeding roller. The second feeding mechanism (2) feeds out the second double-sided adhesive (300) and sequentially attaches it from top to bottom to form a composite layer structure of "second double-sided adhesive (300) - thick PI film (100) - first double-sided adhesive (200)".

5. The die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The first die-cutting mechanism (3) includes a first die-cutting machine and a first die-cutting machine drive motor that is connected to the first die-cutting machine in a transmission manner, and the first blade (301) is mounted on the first die-cutting machine.

6. The die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The first waste discharge mechanism (4) includes a first waste discharge roller and a first waste discharge roller drive motor connected to the first waste discharge roller. The first waste discharge mechanism (4) is used to discharge the waste generated after the first die-cutting mechanism (3) punches.

7. The die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The third feeding mechanism (5) includes a third feeding roller and a third feeding roller drive motor connected to the third feeding roller. The third feeding mechanism (5) feeds out the handle (400) and sequentially attaches it from top to bottom to form a composite layer structure of "handle (400)-second double-sided adhesive (300)-thick PI film (100)-first double-sided adhesive (200)".

8. The die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The second die-cutting mechanism (6) includes a second die-cutting machine and a second die-cutting machine drive motor that is connected to the second die-cutting machine in a transmission manner, and the second blade (601) is mounted on the second die-cutting machine.

9. A die-cutting device for thick PI material die-cutting parts according to claim 1, characterized in that, The second waste removal mechanism (7) includes a second waste removal roller and a second waste removal roller drive motor that is connected to the second waste removal roller. The second waste removal mechanism (7) is used to remove the waste generated after the second die-cutting mechanism (6) punches. The finished product winding mechanism (8) includes a finished product winding roller and a finished product winding roller drive motor that is connected to the finished product winding roller drive.

10. A die-cutting method for a die-cutting apparatus for thick PI material die-cutting parts as described in any one of claims 1-9, characterized in that, Includes the following steps: S1, Primary material tape bonding: The second double-sided adhesive (300), the thick PI film (100), and the first double-sided adhesive (200) are bonded together from top to bottom to form a primary material tape; S2, One-shot die cutting and waste removal: The primary strip is punched to obtain the desired product shape and the waste is removed; S3, Secondary strip bonding: The punched primary strip and the handle film are bonded together from top to bottom to form the secondary strip; S4, two-stage die cutting and waste removal: the secondary strip is punched to cut out the required handle (400) shape, and then it is wound up.

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