Heat dissipation control method and device, electronic equipment and computer program product

Abstract

The invention discloses a heat dissipation control method, a heat dissipation control device, electronic equipment and a computer program product. The method is applied to the electronic equipment, and the electronic equipment comprises a fan and at least one heat source. The method comprises the following steps: acquiring a real-time environment temperature and real-time power of each heat source; on the basis of the real-time environment temperature, the real-time power of each heat source and the preset target control temperature of each heat source, candidate duty ratios corresponding to the heat sources are calculated; determining a target duty ratio based on the maximum value in the candidate duty ratios; and controlling the fan to operate based on the target duty ratio. According to the scheme, the rotating speed of the fan can be rapidly and accurately controlled.

Description

Technical Field

[0001] This application belongs to the field of equipment control technology, and in particular relates to a heat dissipation control method, a heat dissipation control device, an electronic device, and a computer program product. Background Technology

[0002] Currently, fan speed control in large equipment is primarily based on temperature monitoring of its internal heat sources. Specifically, the system compares the real-time temperature of each heat source with a preset target value: when the detected temperature is higher than the target value, the fan speed is increased; when the detected temperature is lower than the target value, the fan speed is decreased. This fan speed control mechanism is essentially a closed-loop control process based on dynamic temperature changes. Because this mechanism cannot quickly determine the required fan speed for the current state, but rather dynamically adjusts the fan speed according to the temperature changes of each heat source to bring them to the target temperature, the speed control process is often relatively slow. Summary of the Invention

[0003] This application provides a heat dissipation control method, a heat dissipation control device, an electronic device, and a computer program product, which can achieve rapid and precise control of fan speed.

[0004] In a first aspect, this application provides a heat dissipation control method, including:

[0005] Obtain real-time ambient temperature and real-time power of each heat source;

[0006] Based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source, the candidate duty cycle corresponding to each heat source is calculated.

[0007] The target duty cycle is determined based on the maximum value among the candidate duty cycles;

[0008] The fan is controlled to operate based on the target duty cycle.

[0009] Secondly, this application provides a heat dissipation control device, comprising:

[0010] The acquisition module is used to acquire the real-time ambient temperature and the real-time power of each heat source;

[0011] The calculation module is used to calculate the candidate duty cycle of each heat source based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source.

[0012] The first determining module is used to determine the target duty cycle based on the maximum value among the candidate duty cycles;

[0013] The control module is used to control the fan to operate based on the target duty cycle.

[0014] Thirdly, this application provides an electronic device including a fan, at least one heat source, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the method described in the first aspect.

[0015] Fourthly, this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the method described in the first aspect above.

[0016] Fifthly, this application provides a computer program product comprising a computer program that, when executed by one or more processors, implements the steps of the method described in the first aspect.

[0017] The advantages of this application compared to existing technologies are as follows: This application's solution no longer considers only the temperature of the heat source, but integrates real-time ambient temperature, power data of each heat source, and target control temperature of each heat source to dynamically calculate the required fan duty cycle for each heat source, using the maximum value as the global target to control fan operation. This not only overcomes the lag limitations of traditional temperature feedback, achieving predictive and rapid response of fan speed, but also improves temperature control accuracy while ensuring the thermal safety of electronic equipment, enabling fan speed to adapt to changes in device power consumption and the environment.

[0018] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram illustrating the implementation process of the heat dissipation control method provided in the embodiments of this application;

[0021] Figure 2 This is a structural block diagram of the heat dissipation control device provided in the embodiments of this application;

[0022] Figure 3 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0023] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0025] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0028] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), unless otherwise expressly and specifically defined.

[0029] This application proposes a heat dissipation control method applicable to electronic devices. The electronic device integrates a fan and at least one heat source. The heat source refers to a functional module unit within the electronic device that generates heat during operation; its temperature changes directly affect the device's heat dissipation requirements. Common heat sources in electronic devices include, but are not limited to: computing units, such as central processing units (CPUs) and graphics processing units (GPUs); storage units, such as memory chips and solid-state drive (SSD) controllers; and communication units, such as network interface card (NIC) chips and peripheral component interconnect (PCIe) switches. In some examples, the electronic device can be a server, an industrial switch, or any other device integrating a fan and at least one heat source. The specific type of electronic device is not limited here.

[0030] Please see Figure 1 , Figure 1 The implementation flow of the heat dissipation control method applied to this electronic device is presented, and detailed below:

[0031] Step 101: Obtain the real-time ambient temperature and the real-time power of each heat source.

[0032] Electronic devices may be equipped with ambient temperature sensors. In some examples, the ambient temperature sensor may be deployed at the air inlet or other designated location of the electronic device, allowing the real-time ambient temperature to be read directly from the sensor. In other examples, multiple ambient temperature sensors may be deployed at different designated locations within the electronic device, allowing the real-time ambient temperature to be obtained by averaging the temperature values ​​read from each sensor.

[0033] In addition, electronic devices can obtain the real-time power of each heat source through their internal circuitry. It can be understood that the real-time power of a heat source can be used to characterize its transient heat generation, which generally precedes the temperature change of the corresponding heat source; that is, generally speaking, the power of a heat source directly affects its temperature.

[0034] For ease of subsequent description, the real-time ambient temperature can be denoted as T0, the total number of heat sources included in the electronic equipment can be denoted as n, and the real-time power can be denoted as P. i , is used to represent the real-time power of heat source i, where i = 1, 2, ..., n.

[0035] In some embodiments, considering that the ambient temperature may remain relatively stable for a period of time and the power of the heat source may also remain relatively stable for a period of time, the electronic device can periodically acquire the real-time ambient temperature and the real-time power of each heat source based on a preset interval, thereby saving the energy consumption of the electronic device to a certain extent.

[0036] Step 102: Based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source, calculate the candidate duty cycle corresponding to each heat source.

[0037] For each heat source, the electronic device can pre-store its target control temperature. This target control temperature is understood to be the temperature the electronic device expects the heat source to be at. In some examples, the target control temperature can be set according to the temperature specification of the corresponding heat source and a preset first temperature difference value. For example, if the temperature specification of a heat source is 100°C and the preset first temperature difference value is 15°C, then the target control temperature could be 85°C.

[0038] Based on real-time ambient temperature, real-time power of each heat source, and preset target control temperatures for each heat source, the electronic equipment can calculate the appropriate fan PWM duty cycle for each heat source using a preset formula. For ease of distinction, the calculated duty cycle is referred to as the candidate duty cycle. It can be understood that the candidate duty cycle reflects the current urgency of heat dissipation for the corresponding heat source.

[0039] As described above, the target control temperature of each heat source is a constant, while the real-time ambient temperature and the real-time power of each heat source are variable. If the real-time ambient temperature and the real-time power of each heat source remain unchanged, the candidate duty cycle corresponding to each heat source will also not change. Therefore, this step can be triggered only when the real-time ambient temperature and / or the real-time power of any heat source changes.

[0040] Step 103: Determine the target duty cycle based on the maximum value among the candidate duty cycles.

[0041] In step 102, the corresponding candidate duty cycle can be calculated for each heat source, that is, there are N candidate duty cycles in total. Since the candidate duty cycle reflects the current urgency of heat dissipation for the corresponding heat source, the maximum value among the candidate duty cycles can be considered here, that is, the heat source with the greatest urgency of heat dissipation is taken as the main factor to determine the corresponding target duty cycle.

[0042] Step 104: Control the fan to operate based on the target duty cycle.

[0043] The electronic device can generate a PWM signal for controlling the fan based on the target duty cycle and transmit the PWM signal to the fan, thereby enabling the fan to operate based on the PWM signal and adjusting its speed.

[0044] In some embodiments, to improve the accuracy of candidate duty cycle calculation, taking any heat source as an example, the candidate duty cycle corresponding to the heat source can be calculated through the following steps:

[0045] Step 1021: Obtain the first duty cycle relationship and the second duty cycle relationship of the heat source.

[0046] The thermal resistance of a heat source is not a fixed value, but a variable value that varies depending on other external factors. For example, a change in the fan's duty cycle leads to a change in the fan speed; a change in fan speed causes a change in airflow; and a change in airflow causes a change in the thermal resistance of the heat source. Therefore, in this embodiment, the correspondence between the thermal resistance of the heat source and the fan's duty cycle can be primarily considered. In some examples, the correspondence between the thermal resistance of the heat source and the fan's duty cycle can be obtained in advance through testing or simulation. This correspondence can be recorded as a first duty cycle correspondence and written into the storage space of the electronic device. In this way, during the operation of the electronic device, the first duty cycle relationship of the heat source can be obtained through this storage space.

[0047] The temperatures of heat sources influence each other. Based on this interaction, the following conclusion can be drawn: the influence of heat source 1 on heat source 2 at temperature T. 12 = Real-time power consumption P1 of heat source 1 * influence coefficient K 12 Among them, the influence coefficient K 12 It can be used to express the degree of influence of heat source 1 on heat source 2. For ease of description, it can be expressed using the influence coefficient K. ij Let K represent the degree of influence of heat source i on heat source j, where i = 1, 2, ..., n, and j = 1, 2, ..., n, and i ≠ j. In some examples, the various influence coefficients K can be obtained in advance through testing or simulation. ij The correspondence between the heat source and the fan's duty cycle is recorded as a second duty cycle correspondence, and this second duty cycle correspondence is written into the electronic device's storage space. In this way, during the operation of the electronic device, the second duty cycle relationship of the heat source can be obtained through this storage space. Taking heat source m as an example, the second duty cycle relationship of heat source m includes the correspondence between n-1 influence coefficients and the fan's duty cycle, specifically: influence coefficient K... 1m The relationship between the fan's duty cycle and its influence coefficient K 2m The relationship between the fan's duty cycle and its influence coefficient K 3m The relationship between the fan's duty cycle and the influence coefficient K. nm The correspondence between the fan's duty cycle and the fan's duty cycle.

[0048] Step 1022: Calculate the candidate duty cycle corresponding to the heat source based on the real-time ambient temperature, the real-time power of the heat source, the preset target control temperature of each heat source, the first duty cycle relationship, and the second duty cycle relationship.

[0049] Electronic devices are pre-set with the following calculation formulas:

[0050] T m =T0+P m *R m +P1*K 1m +P2*K 2m +……+P n *K nm

[0051] Among them, T m Indicates heat source m The target control temperature; T0 represents the real-time ambient temperature; P m R represents the real-time power consumption of heat source m; m K represents the thermal resistance of heat source m. 1m The influence coefficient represents the degree of influence of heat source 1 on heat source m; and so on. The meanings of other parameters are not elaborated here.

[0052] As an example only, for heat source 1, the above formula can be specifically defined as follows:

[0053] T1 = T0 + P1 * R1 + P2 * K 21 +P3*K 31 +……+P n *K n1

[0054] For heat source 2, the above formula can be specifically defined as follows:

[0055] T2 = T0 + P2 * R2 + P1 * K 12 +P3*K 32 +……+P n *K n2

[0056] Similarly, for heat source n, the above formula can be specifically defined as follows:

[0057] T n =T0+P n *R n +P1*K 1n +P2*K 2n +……+P n-1 *K (n-1)n

[0058] Based on the above calculation formula, it can be seen that for any heat source m, its target control temperature T mReal-time ambient temperature T0 and real-time power consumption P1, P2, and so on, of each heat source. n All of these are known, while the thermal resistances of each heat source, R1, R2, and so on, are... n (A total of n thermal resistances) are all related to the fan PWM duty cycle, and each influence coefficient K 1m K 2m Until K nm (A total of n-1 influence coefficients) are also related to the fan PWM duty cycle. Based on this, the relevant first duty cycle relationship and second duty cycle relationship can be substituted into it, and the heat dissipation thermal resistance involved in the calculation formula can be expressed by the duty cycle. In addition, the influence coefficients involved can be expressed by the duty cycle. Thus, the fan PWM duty cycle required by the heat source m can be calculated, which can be used as the candidate duty cycle corresponding to the heat source m.

[0059] It can be understood that by iterating through m from 1 to n and adjusting the calculation formula and related parameters accordingly, the candidate duty cycles corresponding to each heat source can be calculated, thus ultimately yielding n candidate duty cycles for each heat source.

[0060] In some embodiments, considering that with the increase in the usage time of electronic devices, heat dissipation devices may age and / or dust may accumulate on the devices, leading to a decrease in the heat dissipation performance of the electronic devices. Based on this, after step 104, for each heat source, the electronic device may continue to monitor whether the temperature of the heat source exceeds the upper limit of the target control temperature corresponding to the heat source. In some examples, the upper limit of the target control temperature can be set according to the temperature specification of the corresponding heat source and a preset second temperature difference value. The second temperature difference value is generally less than the first temperature difference value, that is, the upper limit of the target control temperature is generally greater than the target control temperature; for example, if the temperature specification of a heat source is 100°C and the preset second temperature difference value is 10°C, then the upper limit of the target control temperature can be 90°C.

[0061] If the temperature of the heat source exceeds the upper limit of the target control temperature corresponding to the heat source, the current target duty cycle of the fan is considered insufficient and needs to be compensated by increasing the fan's duty cycle. In some examples, the fan's duty cycle can be increased by a specified value (e.g., 1%) continuously based on a pre-set unit time (e.g., 1 second), but this is not limited here. During this process, the temperature of the heat source is still monitored until the temperature of the heat source drops below the upper limit of the target control temperature corresponding to the heat source, at which point the current compensation of the fan's duty cycle based on the heat source is stopped.

[0062] In some embodiments, after the temperature of the heat source drops below the upper limit of the target control temperature corresponding to the heat source, and the electronic device stops compensating the fan's duty cycle based on the heat source, it can also record the increase in the fan's duty cycle for this current operation; that is, it records how much the fan's current duty cycle has increased from the originally determined target duty cycle. Based on this increase, the electronic device can update the fan's duty cycle compensation value, which is initialized to 0 after the electronic device is powered on and updated based on the actual situation after the current power-on. It can be understood that the updated duty cycle compensation value (i.e., the latest duty cycle compensation value) can affect the target duty cycle when it is determined next time.

[0063] For example, assuming that the electronic device compensates the fan's duty cycle by 10% after the temperature of heat source 1 exceeds the upper limit of the target control temperature of heat source 1, the duty cycle compensation value can be updated to 10%. In this way, if step 103 needs to be triggered again due to changes in the real-time ambient temperature and / or changes in the real-time power of the heat source, the electronic device can first determine the maximum value among all the latest calculated candidate duty cycles, and then add the duty cycle compensation value to this maximum value as the final determined target duty cycle. That is, the target duty cycle should actually be the sum of the maximum value of the candidate duty cycles and the duty cycle compensation value.

[0064] In some embodiments, theoretically, the duty cycle compensation value will increase due to equipment aging. To ensure the normal operation of the electronic device, a compensation value threshold can be preset. Based on this threshold, the electronic device can monitor the duty cycle compensation value. Once the detected duty cycle compensation value exceeds the threshold, it is considered that the device is severely aged, and an alert message can be output to remind the electronic device that maintenance is needed. Based on this alert message, staff can perform maintenance on the electronic device, such as replacing relevant components and / or cleaning accumulated dust, to improve the heat dissipation performance of the electronic device.

[0065] As can be seen from the above, the embodiments of this application no longer consider only the temperature of the heat source, but integrate the real-time ambient temperature, the power data of each heat source, and the target control temperature of each heat source to dynamically calculate the required fan duty cycle for each heat source, and use the maximum value as the global target to control the operation of the fan. In this way, not only can the limitations of the lag in traditional temperature feedback be overcome to achieve predictive and rapid response of fan speed, but temperature control accuracy can also be improved while ensuring the thermal safety of electronic equipment, so that the fan speed can adapt to changes in device power consumption and environment.

[0066] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0067] Corresponding to the heat dissipation control method provided above, this application also provides a heat dissipation control device. Please refer to... Figure 2 The heat dissipation control device 2 in this embodiment includes:

[0068] The acquisition module 201 is used to acquire the real-time ambient temperature and the real-time power of each heat source;

[0069] The calculation module 202 is used to calculate the candidate duty cycle corresponding to each heat source based on the real-time ambient temperature, the real-time power of each heat source and the preset target control temperature of each heat source.

[0070] The first determining module 203 is used to determine the target duty cycle based on the maximum value among the candidate duty cycles;

[0071] Control module 204 is used to control the fan to operate based on the target duty cycle.

[0072] In some embodiments, the acquisition module 201 is specifically used to periodically acquire the real-time ambient temperature and the real-time power of each heat source.

[0073] In some embodiments, the calculation module 202 is triggered when the real-time ambient temperature and / or the real-time power of any heat source changes.

[0074] In some embodiments, the computing module 202 includes:

[0075] The acquisition unit is used to acquire a first duty cycle relationship and a second duty cycle relationship for each heat source. The first duty cycle relationship is used to describe the correspondence between the thermal resistance of the heat source and the duty cycle of the fan. The second duty cycle relationship is used to describe the correspondence between the influence coefficient of other heat sources on the heat source and the duty cycle of the fan.

[0076] The calculation unit is used to calculate the candidate duty cycle corresponding to the heat source based on the real-time ambient temperature, the real-time power of the heat source, the preset target control temperature of each heat source, the first duty cycle relationship and the second duty cycle relationship.

[0077] In some embodiments, the heat dissipation control device 2 further includes:

[0078] The second determining module is used to determine whether the temperature of each heat source exceeds the upper limit of the target control temperature corresponding to the heat source.

[0079] The adjustment module is used to increase the fan duty cycle when the temperature of the heat source exceeds the upper limit of the target control temperature corresponding to the heat source, until the temperature of the heat source drops below the upper limit of the target control temperature corresponding to the heat source.

[0080] In some embodiments, the heat dissipation control device 2 further includes:

[0081] The recording module is used to record the increase in the fan's duty cycle for this operation.

[0082] The update module is used to update the fan's duty cycle compensation value based on the increment value. The duty cycle compensation value affects the determination of the target duty cycle.

[0083] In some embodiments, the heat dissipation control device 2 further includes:

[0084] The output module is used to output a reminder message when the duty cycle compensation value exceeds a preset compensation value threshold. The reminder message is used to remind the electronic device that maintenance is required.

[0085] As can be seen from the above, the embodiments of this application no longer consider only the temperature of the heat source, but integrate the real-time ambient temperature, the power data of each heat source, and the target control temperature of each heat source to dynamically calculate the required fan duty cycle for each heat source, and use the maximum value as the global target to control the operation of the fan. In this way, not only can the limitations of the lag in traditional temperature feedback be overcome to achieve predictive and rapid response of fan speed, but temperature control accuracy can also be improved while ensuring the thermal safety of electronic equipment, so that the fan speed can adapt to changes in device power consumption and environment.

[0086] Corresponding to the heat dissipation control method provided above, this application also provides an electronic device. Please refer to... Figure 3 The electronic device 3 in this application embodiment includes: a memory 301, and one or more processors 302. Figure 3 (Only one is shown in the image) and a computer program stored in memory 301 and executable on the processor. In addition, the electronic device includes a fan and at least one heat source (…). Figure 3 (Not shown in the image). Specifically, the processor 302 performs the following steps when running the aforementioned computer program stored in the memory 301:

[0087] Obtain real-time ambient temperature and real-time power of each heat source;

[0088] Based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source, the candidate duty cycle corresponding to each heat source is calculated.

[0089] The target duty cycle is determined based on the maximum value among the candidate duty cycles;

[0090] The fan is controlled to operate based on the target duty cycle.

[0091] Assuming the above is the first possible implementation, then in the second possible implementation provided based on the first possible implementation, the real-time ambient temperature and the real-time power of each heat source are obtained, including:

[0092] The system periodically acquires real-time ambient temperature and the real-time power of each heat source.

[0093] In the third possible implementation based on the second possible implementation described above, the step of calculating the candidate duty cycle corresponding to each heat source based on the real-time ambient temperature, the real-time power of each heat source and the preset target control temperature of each heat source is triggered when the real-time ambient temperature and / or the real-time power of any heat source changes.

[0094] In the fourth possible implementation provided based on the first possible implementation described above, the candidate duty cycle corresponding to each heat source is calculated based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source, including:

[0095] For each heat source, a first duty cycle relationship and a second duty cycle relationship are obtained. The first duty cycle relationship is used to describe the correspondence between the thermal resistance of the heat source and the duty cycle of the fan. The second duty cycle relationship is used to describe the correspondence between the influence coefficient of other heat sources on the heat source and the duty cycle of the fan.

[0096] Based on the real-time ambient temperature, the real-time power of the heat source, the preset target control temperature of each heat source, the first duty cycle relationship, and the second duty cycle relationship, the candidate duty cycle corresponding to the heat source is calculated.

[0097] In a fifth possible implementation provided based on the first, second, third, or fourth possible implementations described above, after controlling the fan to operate based on the target duty cycle, the processor 302 performs the following steps by running the computer program stored in the memory 301:

[0098] For each heat source, determine whether the temperature of the heat source exceeds the upper limit of the target control temperature corresponding to the heat source;

[0099] If the temperature of the heat source exceeds the upper limit of the target control temperature corresponding to the heat source, increase the duty cycle of the fan until the temperature of the heat source drops below the upper limit of the target control temperature corresponding to the heat source.

[0100] In the sixth possible implementation provided based on the fifth possible implementation described above, after the temperature of the heat source decreases below the upper limit of the target control temperature corresponding to the heat source, the processor 302 further performs the following steps when running the computer program stored in the memory 301:

[0101] Record the increase in the fan's duty cycle this time;

[0102] Based on the increment, the fan duty cycle compensation value is updated, which affects the determination of the target duty cycle.

[0103] In the seventh possible implementation provided based on the sixth possible implementation described above, the processor 302 further performs the following steps when running the computer program stored in the memory 301:

[0104] If the duty cycle compensation value exceeds the preset compensation value threshold, an alert message is output to remind the electronic device that maintenance is required.

[0105] It should be understood that, in the embodiments of this application, the processor 302 may be a central processing unit (CPU), but it may also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor.

[0106] Memory 301 may include read-only memory and random access memory, and provides instructions and data to processor 302. Some or all of memory 301 may also include non-volatile random access memory. For example, memory 301 may also store device type information.

[0107] As can be seen from the above, the embodiments of this application no longer consider only the temperature of the heat source, but integrate the real-time ambient temperature, the power data of each heat source, and the target control temperature of each heat source to dynamically calculate the required fan duty cycle for each heat source, and use the maximum value as the global target to control the operation of the fan. In this way, not only can the limitations of the lag in traditional temperature feedback be overcome to achieve predictive and rapid response of fan speed, but temperature control accuracy can also be improved while ensuring the thermal safety of electronic equipment, so that the fan speed can adapt to changes in device power consumption and environment.

[0108] This application also provides a computer program product that, when run on an electronic device, enables the electronic device to perform the steps described in the various method embodiments above.

[0109] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the above device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0110] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0111] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of external device software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0112] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For instance, the division of modules or units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between devices or units through some interfaces, and may be electrical, mechanical, or other forms.

[0113] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0114] If the integrated units described above are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing associated hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable storage medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer-readable storage device, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium, etc. It should be noted that the contents of the aforementioned computer-readable storage media may be appropriately added to or subtracted from the contents according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable storage media may not include electrical carrier signals and telecommunication signals.

[0115] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heat dissipation control method, characterized in that, The heat dissipation control method is applied to an electronic device, the electronic device including a fan and at least one heat source; the heat dissipation control method includes: Obtain the real-time ambient temperature and the real-time power of each of the heat sources; Based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source, the candidate duty cycle corresponding to each heat source is calculated respectively. The target duty cycle is determined based on the maximum value among the candidate duty cycles; The fan is controlled to operate based on the target duty cycle.

2. The heat dissipation control method as described in claim 1, characterized in that, The acquisition of real-time ambient temperature and real-time power of each of the heat sources includes: The real-time ambient temperature and the real-time power of each heat source are periodically acquired.

3. The heat dissipation control method as described in claim 2, characterized in that, The step of calculating the candidate duty cycle corresponding to each heat source based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source is triggered when the real-time ambient temperature and / or the real-time power of any heat source changes.

4. The heat dissipation control method as described in claim 1, characterized in that, The step of calculating the candidate duty cycle for each heat source based on the real-time ambient temperature, the real-time power of each heat source, and the preset target control temperature of each heat source includes: For each heat source, a first duty cycle relationship and a second duty cycle relationship are obtained. The first duty cycle relationship is used to describe the correspondence between the thermal resistance of the heat source and the duty cycle of the fan. The second duty cycle relationship is used to describe the correspondence between the influence coefficient of other heat sources on the heat source and the duty cycle of the fan. Based on the real-time ambient temperature, the real-time power of the heat source, the preset target control temperature of each heat source, the first duty cycle relationship, and the second duty cycle relationship, the candidate duty cycle corresponding to the heat source is calculated.

5. The heat dissipation control method according to any one of claims 1 to 4, characterized in that, After controlling the fan to operate based on the target duty cycle, the heat dissipation control method further includes: For each heat source, determine whether the temperature of the heat source exceeds the upper limit of the target control temperature corresponding to the heat source; If the temperature of the heat source exceeds the upper limit of the target control temperature corresponding to the heat source, the duty cycle of the fan is increased until the temperature of the heat source is reduced to below the upper limit of the target control temperature corresponding to the heat source.

6. The heat dissipation control method as described in claim 5, characterized in that, After the temperature of the heat source decreases below the upper limit of the target control temperature corresponding to the heat source, the heat dissipation control method further includes: Record the increase in the duty cycle of the fan this time; Based on the increased value, the duty cycle compensation value of the fan is updated, and the duty cycle compensation value affects the determination of the target duty cycle.

7. The heat dissipation control method as described in claim 6, characterized in that, The heat dissipation control method further includes: If the duty cycle compensation value exceeds a preset compensation value threshold, an alert message is output to remind the electronic device that maintenance is required.

8. A heat dissipation control device, characterized in that, The heat dissipation control device is applied to an electronic device, the electronic device including a fan and at least one heat source; the heat dissipation control device includes: The acquisition module is used to acquire the real-time ambient temperature and the real-time power of each of the heat sources; The calculation module is used to calculate the candidate duty cycle corresponding to each heat source based on the real-time ambient temperature, the real-time power of each heat source and the preset target control temperature of each heat source. The first determining module is used to determine the target duty cycle based on the maximum value among the candidate duty cycles; The control module is used to control the fan to operate based on the target duty cycle.

9. An electronic device comprising a fan, at least one heat source, a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 7.

10. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by one or more processors, implements the method as described in any one of claims 1 to 7.

Images