Thermal management integrated device

Abstract

The invention provides a heat management integrated device which comprises a flow channel part, the flow channel part is provided with a first flow channel and a second flow channel, the heat management integrated device comprises a first heat exchanger and a second heat exchanger, the first flow channel is provided with a first inlet and a first outlet, and the first inlet or the first outlet communicates with the first flow channel; the second heat exchanger is provided with a second inlet and a second outlet, the second flow channel is provided with a second flow channel, the second inlet or the second outlet is communicated with the second flow channel, at least part of the first flow channel and at least part of the second flow channel are arranged close to each other, and the first flow channel penetrates through the end faces of the two ends of the flow channel part in the length direction of the flow channel part. The first runner can be formed through extrusion, and / or the second runner penetrates through the end faces of the two ends of the runner part in the length direction of the runner part, and the second runner can be formed through extrusion, so that the machining process of the runner can be simplified.

Description

Technical Field

[0001] This application belongs to the field of thermal management technology, specifically, it relates to an integrated thermal management device. Background Technology

[0002] The fluid control components used in the thermal management system are connected to the evaporator, condenser, and expansion valve respectively. The fluid control components have internal channels that allow the fluid flowing out of the condenser to enter the expansion valve and evaporator in sequence. To ensure that the fluid in the fluid control component channel is superheated after absorbing heat from the evaporator, a regenerator (heat exchanger) is usually added to the thermal management system. However, the presence of the regenerator will occupy a certain amount of installation space, which will result in a larger size of the thermal management system.

[0003] To address the aforementioned issues, related technologies incorporate flow channels with heat exchange / regeneration functions in the design of fluid control components. This allows the fluid exiting the condenser to flow along the first flow channel, and the fluid exiting the evaporator to flow along the second flow channel. Furthermore, the fluid in the first flow channel can exchange heat with the fluid in the second flow channel. However, the first and second flow channels are typically obtained through machining, and the machining processes for the first and second flow channels are quite complex. Summary of the Invention

[0004] This application provides an integrated thermal management device designed to simplify the processing of flow channels.

[0005] To achieve the above objectives, this application provides a thermal management integrated device, including a flow channel section, a first heat exchanger, and a second heat exchanger. The flow channel section has a first flow channel and a second flow channel. The first heat exchanger has a first inlet and a first outlet. The first flow channel includes a first flow channel, and the first inlet or the first outlet communicates with the first flow channel. The second flow channel includes a second flow channel. The second heat exchanger has a second inlet and a second outlet, and the second inlet or the second outlet communicates with the second flow channel. At least a portion of the first flow channel and at least a portion of the second flow channel are disposed close to each other.

[0006] At least one of the first flow channel and the second flow channel extends through the end faces of both ends of the flow channel portion along its length.

[0007] The thermal management integrated device provided in this application includes a flow channel section, which has a first flow channel and a second flow channel. At least one of the first flow channel and the second flow channel extends through the end faces of both ends of the flow channel section along the length direction of the flow channel section, thereby simplifying the processing technology of the flow channel.

[0008] This application also provides a thermal management integrated device, including a flow channel section, a first heat exchanger, a second heat exchanger, and a first valve. The flow channel section has a first flow channel and a second flow channel. The first valve is connected to the outlet of the first heat exchanger and has a first valve inlet and a first valve outlet. The first flow channel includes a first flow channel, and the second flow channel includes a second flow channel. The first valve inlet or the first valve outlet is connected to the first flow channel, and the second flow channel is connected to the outlet of the second heat exchanger. At least a portion of the first flow channel and at least a portion of the second flow channel are disposed close to each other.

[0009] At least one of the first flow channel and the second flow channel extends through the end faces of both ends of the flow channel portion along its length.

[0010] The thermal management integrated device provided in this application includes a flow channel section, which has a first flow channel and a second flow channel. At least one of the first flow channel and the second flow channel extends through the end faces of both ends of the flow channel section along the length direction of the flow channel section, thereby simplifying the processing technology of the flow channel. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 An exploded view of a thermal management integrated device provided in an embodiment of this application, omitting the gas-liquid separator, the second valve, the third cover plate, and the fourth cover plate;

[0013] Figure 2 This is a plan view of the flow channel and cylinder sections provided in an embodiment of this application;

[0014] Figure 3 for Figure 2 A sectional view of the section shown;

[0015] Figure 4 A perspective view of the flow channel, the cylindrical body, and the first end cap provided in an embodiment of this application;

[0016] Figure 5 A perspective view of the flow channel, the cylindrical body, and the second end cap provided in an embodiment of this application;

[0017] Figure 6 for Figure 5 A partial sectional view of the structure shown;

[0018] Figure 7Another perspective view of the flow channel, the cylindrical body, and the first end cap provided in one embodiment;

[0019] Figure 8 for Figure 7 A partial sectional view of the structure shown;

[0020] Figure 9 A perspective view of an integrated thermal management device provided in an embodiment of this application;

[0021] Figure 10 Another perspective view of a thermal management integrated device provided in an embodiment of this application;

[0022] Figure 11 An exploded view of an integrated thermal management device provided in an embodiment of this application;

[0023] Figure 12 Another exploded view of a thermal management integrated device provided in an embodiment of this application;

[0024] Figure 13 An exploded view of a thermal management integrated device provided in an embodiment of this application, omitting the first heat exchanger, second heat exchanger, gas-liquid separator, first valve, and second valve;

[0025] Figure 14 Another exploded view of a thermal management integrated device provided in an embodiment of this application, omitting the gas-liquid separator, the second valve, the third cover plate, and the fourth cover plate;

[0026] Figure 15 A cross-sectional view of the first cover plate provided in an embodiment of this application;

[0027] Figure 16 A perspective view of the second cover plate provided in an embodiment of this application;

[0028] Figure 17 This is a system diagram of an integrated thermal management device provided in an embodiment of this application.

[0029] In the diagram: 1-Flow channel section; 11-First flow channel; 11a-First flow channel cavity; 12-Second flow channel; 12a-Second flow channel cavity; 13-Third flow channel; 110-First mounting groove; 120-Second mounting groove; 130-Third mounting groove; 2-Plug; 31-First cover plate; 310-First channel; 32-Second cover plate; 320-Second channel; 33-Third cover plate; 34-Fourth cover plate; A1-First heat exchanger; A11-First inlet; A12-First outlet; A2-... Two heat exchangers; A22 - Second outlet; B1 - First valve; B10 - First valve seat; C - Gas-liquid separator; B2 - Second valve; B20 - Second valve seat; D1 - First sensor; D2 - Second sensor; S1 - First flow path; S2 - Second flow path; P1 - Compressor exhaust port; P2 - Compressor intake port; F1 - First direction; F2 - Second direction; 4 - Compression module; 41 - Cylinder body; 42 - Compressor core; 51 - First end cover; 52 - Second end cover; 6 - Heat insulation groove. Detailed Implementation

[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0031] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0032] It should be understood that the terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one; "multiple" indicates two or more. Unless otherwise stated, terms such as "front," "rear," "lower," and / or "upper" are for illustrative purposes only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, but do not exclude other elements or objects.

[0033] The exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementation methods can complement or combine with each other.

[0034] An integrated thermal management device according to this embodiment includes a flow channel section 1, a first heat exchanger A1, and a second heat exchanger A2. The flow channel section 1 has a first flow channel 11 and a second flow channel 12. The first flow channel 11 extends through the end faces of both ends of the flow channel section 1 along its length direction and can be formed by extrusion molding. The second flow channel 12 extends through the end faces of both ends of the flow channel section 1 along its length direction and can be formed by extrusion molding, thereby simplifying the processing technology of the flow channel.

[0035] The first flow channel 11 includes a first flow channel cavity 11a. The first heat exchanger A1 has a first inlet A11 and a first outlet A12. The first inlet A11 or the first outlet A12 is connected to the first flow channel cavity 11a. The second flow channel 12 includes a second flow channel cavity 12a. The second heat exchanger A2 has a second inlet A21 and a second outlet A22. The second outlet A22 is connected to the second flow channel 12a, or the second flow channel cavity 12a is connected to the second inlet A21. At least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a are arranged close to each other. The close portion of the first flow channel cavity 11a and the second flow channel cavity 12a can realize heat exchange between the fluid in the first flow channel 11 and the fluid in the second flow channel 12. That is, the close portion of the first flow channel cavity 11a and the second flow channel cavity 12a has a heat exchange / regeneration effect.

[0036] The thermal management integrated device of this application includes a flow channel section 1, a first heat exchanger A1, and a second heat exchanger A2. The flow channel section 1 has a first flow channel 11 and a second flow channel 12. The first flow channel 11 includes a first flow channel cavity 11a, and the second flow channel 12 includes a second flow channel cavity 12a. The first flow channel cavity 11a is connected to the first inlet A11 or the first outlet A12 of the first heat exchanger A1, and the second flow channel cavity 12a is connected to the second inlet A21 or the second outlet A22 of the second heat exchanger A2. Since the fluid temperature in the first flow channel cavity 11a is different from the fluid temperature in the second flow channel cavity 12a, and at least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a are arranged close to each other, the fluids in the close flow channels can exchange heat, thereby saving space in the thermal management integrated device.

[0037] This application also provides another embodiment, in which the thermal management integrated device includes a flow channel 1, the flow channel 1 having a first flow channel 11 and a second flow channel 12, the first flow channel 11 extending through the end faces of both ends of the flow channel 1 along the length direction of the flow channel 1, the first flow channel 11 being capable of being extruded, and / or the second flow channel 12 extending through the end faces of both ends of the flow channel 1 along the length direction of the flow channel 1, the second flow channel 12 being capable of being extruded, thereby simplifying the processing technology of the flow channel.

[0038] In another embodiment, the thermal management integrated device includes a first heat exchanger A1, a second heat exchanger A2, and a first valve B1. The first valve B1 is connected to the outlet of the first heat exchanger A1, that is, the first valve B1 is connected to the first outlet A12. The first flow channel 11 includes a first flow channel cavity 11a, and the second flow channel 12 includes a second flow channel cavity 12a. The first valve B1 has a first valve inlet B11 and a first valve outlet B12. The first valve inlet B11 or the first valve outlet B12 is connected to the first flow channel cavity 11a, and the second flow channel cavity 12a is connected to the inlet or outlet of the second heat exchanger A2. At least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a are arranged close to each other. The close portion of the first flow channel cavity 11a and the second flow channel cavity 12a can realize heat exchange between the fluid in the first flow channel 11 and the fluid in the second flow channel 12, that is, the close portion of the first flow channel cavity 11a and the second flow channel cavity 12a has a heat exchange / regeneration effect.

[0039] Another embodiment of the thermal management integrated device includes a first valve B1, and a flow channel 1 having a first flow channel 11 and a second flow channel 12. The first flow channel 11 includes a first flow channel cavity 11a, which is connected to a first valve inlet B11 or a first valve outlet B12. The second flow channel 12 includes a second flow channel cavity 12a, which is connected to a second outlet A22 of a second heat exchanger A2. Since the fluid temperature in the first flow channel cavity 11a is different from the fluid temperature in the second flow channel cavity 12a, and since at least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a are arranged close to each other, heat exchange can be performed between the fluids in the close-to-each flow channels, thereby saving space in the thermal management integrated device.

[0040] According to a specific embodiment of this application, please refer to Figures 1 to 16 The thermal management integrated device includes a flow channel section 1, which contains a flow channel. When the thermal management integrated device is running, fluid / heat exchange medium can flow through the flow channel.

[0041] The flow channel section 1 has a first flow channel 11 and a second flow channel 12. The first flow channel 11 extends through the end faces of both ends of the flow channel section 1 along its length direction, such as... Figure 1 and Figure 3As shown, the first flow channel 11 can be manufactured by extrusion molding, and / or the second flow channel 12 extends through the end faces of both ends of the flow channel 1 along the length direction of the flow channel 1. The second flow channel 12 can be manufactured by extrusion molding. The manufacturing process of the first flow channel 11 and / or the second flow channel 12 manufactured by extrusion molding is simple, thereby simplifying the processing technology of the flow channel.

[0042] Preferably, the flow channel 1 in this embodiment is an extruded part.

[0043] This embodiment takes the flow channel 1 as an extruded part and the first flow channel 11 as an extruded structure as an example for description. The first flow channel 11 and the flow channel 1 can be extruded integrally, and the processing of the first flow channel 11 and the flow channel 1 is simpler and more efficient.

[0044] In this embodiment, the second flow channel 12 extends through the end faces of both ends of the flow channel 1 along its length direction, such as... Figure 1 and Figure 3 As shown.

[0045] Similarly, the second flow channel 12 can be obtained by one or more of the following processing methods: extrusion molding, casting, forging, and machining.

[0046] This embodiment is described using the example of a first flow channel 11 penetrating the end faces of both ends of the flow channel 1 along its length direction, and a second flow channel 12 penetrating the end faces of both ends of the flow channel 1 along its length direction. In this embodiment, the first flow channel 11 can be extruded and the second flow channel 12 can be extruded. The processing / manufacturing process of the first flow channel 11 by extrusion is simple, and the processing / manufacturing process of the second flow channel 12 by extrusion is also simple. In summary, the processing / manufacturing process of the flow channels (first flow channel 11 and second flow channel 12) of the flow channel 1 in this embodiment is simple.

[0047] The second flow channel 12 and the flow channel section 1 can be integrally extruded and molded, making the processing of the second flow channel 12 and the flow channel section 1 simpler and faster.

[0048] In this application, the thermal management integrated device includes a first heat exchanger A1 and a second heat exchanger A2. The first heat exchanger A1 is capable of exchanging heat with the fluid in the flow channel inside the flow channel section 1. Similarly, the second heat exchanger A2 is capable of exchanging heat with the fluid in the flow channel inside the flow channel section 1.

[0049] This embodiment describes the process using the example of selecting the first heat exchanger A1 as a condenser and the second heat exchanger A2 as an evaporator. The fluid flows into the first heat exchanger A1 before the second heat exchanger A2, that is, the fluid first flows into the first heat exchanger A1 for heat exchange, and the fluid that has completed heat exchange in the first heat exchanger A1 then flows into the second heat exchanger A2 for heat exchange.

[0050] In this application, the thermal management integrated device includes a first valve B1, which also facilitates the heat exchange process of the fluid. The first valve B1 is connected to the outlet of the first heat exchanger A1 and the inlet of the second heat exchanger A2. The fluid that has completed heat exchange in the first heat exchanger A1 first enters the first valve B1 and then flows into the second heat exchanger A2. That is, along the fluid flow path, the first valve B1 is located between the first heat exchanger A1 and the second heat exchanger A2. In other words, the first valve B1 is located in the fluid flow path from the first heat exchanger A1 to the second heat exchanger A2.

[0051] The first valve component B1 has a first valve inlet B11 and a first valve outlet B12, and fluid can enter the first valve component B1 from the first valve inlet B11 and flow out of the first valve component B1 from the first valve outlet B12.

[0052] Optionally, the first valve B1 is preferably, but not limited to, an electronic expansion valve.

[0053] The first flow channel 11 includes a first flow channel cavity 11a. The first heat exchanger A1 has a first inlet A11 and a first outlet A12. Fluid can flow into the first heat exchanger A1 from the first inlet A11 and out of the first heat exchanger A1 from the first outlet A12. At least one of the first inlet A11, the first outlet A12 and the first valve outlet B12 is in communication with the first flow channel cavity 11a. The second flow channel 12 includes a second flow channel cavity 12a. The second heat exchanger A2 has a second inlet A21 and a second outlet A22. Fluid can flow into the second heat exchanger A2 from the second inlet A21 and out of the second heat exchanger A2 from the second outlet A22. The second outlet A22 is in communication with the second flow channel cavity 12a or the second flow channel cavity 12a is in communication with the second inlet A21. At least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a are arranged close to each other.

[0054] The first valve B1 is connected to the first outlet A12.

[0055] Since the fluid first enters the first heat exchanger A1 for a first heat exchange and then enters the second heat exchanger A2 for a second heat exchange, the fluid temperatures in the first flow channel 11 and the second flow channel 12 are different. By designing at least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a to be close together, heat transfer and heat exchange can be achieved between the fluid in the first flow channel cavity 11a and the fluid in the second flow channel cavity 12a.

[0056] Alternatively, the first valve inlet B11 or the first valve outlet B12 is connected to the first flow channel cavity 11a, and the second flow channel cavity 12a is connected to the outlet of the second heat exchanger A2, with at least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a located close to each other.

[0057] Since the fluid first enters the first valve B1 and then enters the second heat exchanger A2, the fluid temperatures in the first flow channel 11 and the second flow channel 12 are different. By designing at least a portion of the first flow channel cavity 11a and at least a portion of the second flow channel cavity 12a to be close together, heat transfer and heat exchange can be carried out between the fluid in the first flow channel cavity 11a and the fluid in the second flow channel cavity 12a.

[0058] The temperature of the fluid in the second flow channel cavity 12a is lower than that of the fluid in the first flow channel cavity 11a. Therefore, it is possible to ensure that the fluid is superheated after absorbing heat through the second heat exchanger A2 / evaporator.

[0059] This application adjusts the positions of the first flow channel cavity 11a and the second flow channel cavity 12a to enable them to have heat exchange / regeneration functions. Compared with the heat exchange function achieved by using a regenerator in the prior art, this application can save space in the thermal management integrated device. The thermal management integrated device of this application has a higher space utilization rate and a more compact spatial layout.

[0060] This embodiment describes the situation with the first flow channel cavity 11a connected to the first outlet A12 and the second flow channel cavity 12a connected to the second outlet A22 as an example. Of course, in some other embodiments, the first flow channel cavity 11a may be connected to the first inlet A11 or the first valve outlet or the first valve inlet.

[0061] In this embodiment, the first flow channel 11 and the second flow channel 12 are arranged in parallel; therefore, the first flow channel cavity 11a and the second flow channel cavity 12a are arranged in parallel, as shown below. Figure 1 and Figure 3 As shown.

[0062] The first flow channel 11 allows fluid to flow through, and the fluid in the first flow channel 11 has a first flow path S1. The second flow channel 12 allows fluid to flow through, and the fluid in the second flow channel 12 has a second flow path S2. The first flow path S1 and the second flow path S2 are arranged in opposite directions. In other words, when the thermal management integrated device is working, the fluid in the first flow channel 11 has the first flow path S1, and the fluid in the second flow channel 12 has the second flow path S2. It should be noted that the first flow path S1 refers to a directional fluid flow path, and the second flow path S2 also refers to a directional fluid flow path, and the direction of the first flow path S1 is opposite to the direction of the second flow path S2. Figure 3 and Figure 14 As shown. In this embodiment, the first flow path S1 and the second flow path S2 are arranged in opposite directions, which can improve the heat exchange / regeneration efficiency of the fluid in the first flow channel 11 and the fluid in the second flow channel 12.

[0063] That is, the fluid located in the first flow channel cavity 11a has a first flow path S1, and the fluid located in the second flow channel cavity 12a has a second flow path S2.

[0064] In this embodiment, the first valve B1 is connected to the flow channel 1 through the first valve seat B10. That is, the first valve seat B10 connects the first valve B1 and the flow channel 1. The first valve seat B10 has a channel that connects the first valve B1 and the second heat exchanger A2, which allows fluid to flow from the first valve seat B10 into the first valve B1. After passing through the first valve B1, the fluid flows back to the first valve seat B10 and then enters the second heat exchanger A2.

[0065] In this embodiment, the thermal management integrated device includes a plug 2, which is connected to the flow channel 1.

[0066] Preferably, the plug 2 is welded to the flow channel 1.

[0067] In this application, the plug 2 is located in at least one of the first flow channel 11 and the second flow channel 12. That is, the plug 2 is located in the first flow channel 11, or the plug 2 is located in the second flow channel 12, or the plug 2 is located in both the first flow channel 11 and the second flow channel 12.

[0068] A plug 2 located in at least one of the first flow channel 11 and the second flow channel 12 is connected to the flow channel portion 1. The plug 2 is located at the end of at least one of the first flow channel cavity 11a and the second flow channel cavity 12a, that is, the plug 2 restricts and forms the first flow channel cavity 11a and / or the second flow channel cavity 12a.

[0069] This application does not limit the number of plugs 2. The number of plugs 2 in the first flow channel 11 can be adjusted according to actual needs. Similarly, the number of plugs 2 in the second flow channel 12 can also be adjusted according to actual needs.

[0070] This embodiment is described using the example of multiple plugs 2, with some plugs located in the first flow channel 11 and some plugs 2 located in the second flow channel 12.

[0071] The flow channel 1 has a compressor exhaust port P1, which is located on the wall forming the second flow channel 12, such as... Figure 1 and Figure 14 As shown.

[0072] The flow channel section 1 has a compressor suction port P2, and the compressor suction port P2 and the compressor discharge port P1 are respectively connected to two flow channels.

[0073] The flow channel section 1 has a third flow channel 13, which extends through the end faces of both ends of the flow channel section 1 along its length. Figure 1 and Figure 3 As shown;

[0074] like Figure 3As shown, the third flow channel 13 is located on the side of the second flow channel 12 away from the first flow channel 11, the compressor intake port P2 is located on the wall forming the third flow channel 13, and a number of plugs 2 are located in the third flow channel 13.

[0075] In this embodiment, the thermal management integrated device includes a first cover plate 31, which is connected to the flow channel portion 1. The first cover plate 31 has a first channel 310, such as... Figure 15 As shown;

[0076] The first channel 310 connects the first outlet A12 and the first flow channel cavity 11a.

[0077] The first cover plate 31 is located between the first heat exchanger A1 and the flow channel 1, and the first heat exchanger A1 and the flow channel 1 are connected by the first cover plate 31.

[0078] Optionally, the first cover plate 31 is connected to the flow channel 1, and the first cover plate 31 is sealed to the flow channel 1.

[0079] Preferably, the first cover plate 31 is welded to the flow channel portion 1.

[0080] In this embodiment, the flow channel 1 has a first mounting groove 110, and the first cover plate 31 is located in the first mounting groove 110.

[0081] A plane perpendicular to the length direction of the flow channel 1 is defined as a reference plane. The flow channel 1 is projected onto the reference plane. On the reference plane, a first flow channel 11 and a second flow channel 12 are defined to be arranged along a first direction F1. On the same reference plane, a second direction F2 is defined to be arranged perpendicular to the first direction F1. Figure 2 As shown;

[0082] In other words, on the reference plane, the first flow channel 11 and the second flow channel 12 are arranged along the width direction of the flow channel portion 1, the first direction F1 is the width direction of the flow channel portion 1, and both the first direction F1 and the second direction F2 are located on the reference plane.

[0083] Along the first direction F1, the minimum distance between the wall forming the first flow channel 11 and the wall forming the second flow channel 12 is L1. Along the second direction F2, the minimum spacing between the walls forming the first flow channel 11 is Y1, and the minimum spacing between the walls forming the second flow channel 12 is Y2. The minimum value between Y1 and Y2 is selected and L2 is defined, where 2≤L2 / L1≤3.

[0084] In this embodiment, the projection of the wall forming the first flow channel 11 onto the aforementioned reference plane is a rectangular or approximately rectangular cross-sectional profile, and the projection of the wall forming the second flow channel 12 onto the aforementioned reference plane is also a rectangular or approximately rectangular cross-sectional profile. The cross-sectional profiles of the wall forming the first flow channel 11 and the wall forming the second flow channel 12 are the same and equal in size. In this embodiment, Y2 = Y1, combined with... Figure 2As can be seen, in this embodiment, 2≤Y2 / L1≤3, in other words, 2≤Y1 / L1≤3.

[0085] In this embodiment, the thermal management integrated device includes a second cover plate 32, which is connected to the flow channel portion 1. The second cover plate 32 has a second channel 320, such as... Figure 16 As shown;

[0086] The second channel 320 connects the second outlet A22 with the second flow channel cavity 12a.

[0087] The second cover plate 32 is located between the second heat exchanger A2 and the flow channel 1, and the second heat exchanger A2 and the flow channel 1 are connected by the second cover plate 32.

[0088] Optionally, the second cover plate 32 is connected to the flow channel 1, and the second cover plate 32 is sealed to the flow channel 1. Preferably, the second cover plate 32 is welded to the flow channel 1.

[0089] In this embodiment, the flow channel 1 has a second mounting groove 120, and the second cover plate 32 is located in the second mounting groove 120.

[0090] In this embodiment, the thermal management integrated device includes a compression module 4, which includes a cylindrical body 41 and a compressor core 42. The cylindrical body 41 has a cavity 410, and the compressor core 42 is at least partially located in the cavity 410 of the cylindrical body 41. The cylindrical body 41 and the flow channel 1 are integrally formed. In this embodiment, the compression module 4 and the flow channel 1 are integrated, resulting in a high degree of integration in the thermal management integrated device, which is beneficial for the miniaturization of the thermal management integrated device.

[0091] Optionally, the cylinder part 41 and the flow channel part 1 are integrally extruded parts.

[0092] The cavity 410 extends through the two end faces of the two ends of the cylinder body 41 along the length direction of the cylinder body 41. The length direction of the cylinder body 41 is consistent with the length direction of the flow channel 1. In other words, the cavity 410 extends through the two end faces of the two ends of the cylinder body 41 along the length direction of the flow channel 1.

[0093] The thermal management integrated device includes a first end cover 51 and a second end cover 52. The first end cover 51 is connected to the cylinder portion 41 and is located at one end of the cylinder portion 41 near the compressor exhaust port P1. The second end cover 52 is connected to the cylinder portion 41 and is located at the other end of the cylinder portion 41. In other words, the second end cover 52 is located at one end of the cylinder portion 41 near the compressor intake port P2.

[0094] Optionally, the first end cap 51 and the cylindrical body 41 are preferably, but not limited to, welded together; the second end cap 52 and the cylindrical body 41 are preferably, but not limited to, welded together.

[0095] In this embodiment, the thermal management integrated device includes a third flow channel 13, which extends through the end faces of both ends of the flow channel 1 along its length. Figure 1 and Figure 3 As shown.

[0096] The third flow channel 13 can be obtained by one or more of the following processing methods: extrusion molding, casting, forging, and machining.

[0097] This embodiment takes the third flow channel 13 as an example of extrusion molding structure for further description. The third flow channel 13 and the flow channel part 1 can be extruded integrally, and the processing of the third flow channel 13 and the flow channel part 1 is simpler and more efficient.

[0098] The thermal management integrated device includes a heat insulation groove 6, which extends through both end faces of the flow channel 1 along its length. At least a portion of the heat insulation groove 6 is located between the third flow channel 13 and the second flow channel 12, and at least a portion of the heat insulation groove 6 is located between the third flow channel 13 and the cylindrical body 41. Figure 1 , Figure 2 and Figure 3 As shown, the heat insulation groove 6 can isolate the heat transfer and heat exchange between the fluid in the third flow channel 13 and the fluid in the second flow channel 12. At the same time, the heat insulation groove 6 can isolate the heat transfer and heat exchange between the fluid in the third flow channel 13 and the fluid in the cylinder section 41.

[0099] In this embodiment, the heat insulation groove 6 located between the third flow channel 13 and the second flow channel 12 and the heat insulation groove 6 located between the third flow channel 13 and the cylindrical body 41 are not continuous. In other words, the heat insulation groove 6 located between the third flow channel 13 and the second flow channel 12 and the heat insulation groove 6 located between the third flow channel 13 and the cylindrical body 41 are not connected. In other words, the heat insulation groove 6 located between the third flow channel 13 and the second flow channel 12 and the heat insulation groove 6 located between the third flow channel 13 and the cylindrical body 41 are two separate grooves.

[0100] Optionally, the heat insulation channel 6 can be manufactured by an extrusion process. Furthermore, the heat insulation channel 6 and the flow channel 1 can be integrally extruded, making the processing of the heat insulation channel 6 and the flow channel 1 simpler and more efficient.

[0101] In this embodiment, the first flow channel 11, the second flow channel 12, the third flow channel 13 and the heat insulation groove 6 can be processed simultaneously by an extrusion process.

[0102] In this embodiment, please refer to Figure 9 , Figure 10 , Figure 11 and Figure 12As shown, the thermal management integrated device includes a gas-liquid separator C, which has a gas-liquid separator inlet and a gas-liquid separator outlet. Fluid can enter the gas-liquid separator from the gas-liquid separator inlet and flow out of the gas-liquid separator from the gas-liquid separator outlet.

[0103] The gas-liquid separator inlet is connected to the second outlet A22 of the second heat exchanger A2, and the gas-liquid separator outlet is connected to the compressor suction port P2, so that the fluid passing through the gas-liquid separator can flow from the gas-liquid separator outlet to the compressor suction port P2.

[0104] In this embodiment, the thermal management integrated device includes a third cover plate 33, which is located between the gas-liquid separator C and the flow channel 1. The third cover plate 33 has a third channel inside, which connects the gas-liquid separator inlet and the second flow channel 12. Specifically, the third channel connects the gas-liquid separator inlet and the second flow path S2.

[0105] When the thermal management integrated device is in operation, the fluid in the second flow channel 12 can enter the gas-liquid separator C through the third channel of the third cover plate 33 along the second flow path S2.

[0106] Optionally, the third cover plate 33 is connected to the flow channel 1. The connection method between the third cover plate 33 and the flow channel 1 is preferably, but not limited to, welding.

[0107] In this embodiment, the thermal management integrated device includes a second valve B2, please refer to... Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown.

[0108] Optionally, the second valve B2 is connected to the flow channel 1 via the second valve seat B20. That is, the second valve seat B20 connects the second valve B2 and the flow channel 1. The second valve seat B20 has a channel that connects the second valve B2 and the gas-liquid separator C, which allows fluid to flow from the second valve seat B20 into the second valve B2. After passing through the second valve B2, the fluid flows back to the second valve seat B20 and then enters the gas-liquid separator C.

[0109] In this embodiment, the thermal management integrated device includes a fourth cover plate 34, which is located between the gas-liquid separator C and the flow channel 1. The fourth cover plate 34 has a fourth channel that connects the outlet of the gas-liquid separator and the suction port P2 of the compressor.

[0110] In this embodiment, the thermal management integrated device includes a first sensor D1, which is used to detect the air pressure and / or air temperature at the compressor exhaust port P1;

[0111] Optionally, the first sensor D1 is connected to the second valve seat B20, which has a high degree of integration and high assembly efficiency. The second valve seat B20 has a passage connecting the first sensor D1 and the compressor exhaust port P1.

[0112] In this embodiment, the thermal management integrated device includes a second sensor D2, which is used to detect the air pressure and / or air temperature at the compressor intake port P2;

[0113] Optionally, the second sensor D2 is connected to the fourth cover plate 34, which has a high degree of integration. The fourth cover plate 34 has a passage connecting the second sensor D2 and the compressor intake port P2.

[0114] Furthermore, please combine Figure 4 , Figure 5 and Figure 12 As shown, the flow channel 1 has a third mounting groove 130, and the third cover plate 33 is located in the third mounting groove 130.

[0115] The third flow channel 13 can connect the gas-liquid separator C and the second valve B2. The fluid in the third flow channel 13 has a third flow path, which refers to the flow path of the fluid from the second valve B2 along the third flow channel 13 to the inlet of the gas-liquid separator.

[0116] In this embodiment, as Figure 1 and Figure 3 As shown, the first flow channel 11, the second flow channel 12, and the third flow channel 13 are all equipped with plugs 2. The first flow channel 11 contains two plugs 2, which cooperate with the flow channel portion 1 to define the flow range of the fluid within the first flow channel 11. In other words, the plugs 2 restrict the flow range of the fluid along the first flow path S1. The second flow channel 12 contains four plugs 2, two of which cooperate with the flow channel portion 1 to define the flow range of the fluid within the second flow channel 12. In other words, the plugs 2 restrict the flow range of the fluid along the second flow path S2. The other two plugs 2 of the second flow channel 12 are used to restrict the flow between the compressor discharge port P1 and the second flow channel 12. The connection range, in other words, the other two plugs 2 of the second flow channel 12 are used to restrict the compressor exhaust passage connecting the compressor exhaust port P1 and the second valve seat 20; the third flow channel 13 is provided with four plugs 2, of which two plugs 2 cooperate with the flow channel part 1 to limit the flow range of fluid in the third flow channel 13. In other words, the plugs 2 can be used to restrict the flow range of fluid along the third flow path. The other two plugs 2 of the third flow channel 13 are used to restrict the connection range between the compressor suction port P2 and the third flow channel 13. In other words, the other two plugs 2 of the third flow channel 13 are used to restrict the compressor exhaust passage connecting the compressor suction port P2 and the fourth cover plate 34.

[0117] In summary, as Figure 14 As shown, Figure 14The thick dotted lines with arrows represent the fluid flow path. The fluid processed by the compression module 4 enters the second valve seat 20 from the compressor exhaust port P1. The fluid can enter the first heat exchanger A1 from the second valve seat 20. The fluid processed by the first heat exchanger A1 enters the first cover plate 31 and enters the first flow channel 11 along the first channel 310. The fluid in the first flow channel 11 can enter the first valve seat B10 along the first flow path S1. The fluid passing through the first valve B1 can enter the second heat exchanger A2 from the first valve seat B10. The fluid processed by the second heat exchanger A2 enters the second cover plate 32 and enters the second flow channel 12 along the second channel 320. The fluid in the second flow channel 12 can enter the third cover plate 33 along the second flow path S2. The fluid can enter the gas-liquid separator C from the third passage of the third cover plate 33, then enter the fourth cover plate 34, and flow into the compressor intake port P2 along the fourth passage of the fourth cover plate 34.

[0118] In addition, the fluid processed by the compression module 4 enters the second valve seat 20 from the compressor exhaust port P1. The fluid can enter the second valve B2 from the second valve seat 20. The fluid passing through the second valve B2 can enter the third flow channel 13 from the second valve seat 20. Then, it enters the gas-liquid separator C from the third flow channel 13. Then, the fluid can enter the fourth cover plate 34 and flow into the compressor intake port P2 along the fourth passage of the fourth cover plate 34.

[0119] Some of the technical implementation methods described above can be combined or replaced.

[0120] The technical principles of this application have been described above in conjunction with specific embodiments. However, it should be noted that these descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, other specific embodiments or equivalent substitutions of this application that can be conceived by those skilled in the art without creative effort will fall within the scope of protection of this application.

Claims

1. A thermal management integrated device, characterized in that: The device includes a flow channel section, a first heat exchanger, and a second heat exchanger. The flow channel section has a first flow channel and a second flow channel. The first heat exchanger has a first inlet and a first outlet. The first flow channel includes a first flow channel cavity. The first inlet or the first outlet communicates with the first flow channel cavity. The second flow channel includes a second flow channel cavity. The second heat exchanger has a second inlet and a second outlet. The second inlet or the second outlet communicates with the second flow channel cavity. At least a portion of the first flow channel cavity and at least a portion of the second flow channel cavity are disposed close to each other. At least one of the first flow channel and the second flow channel extends through the end faces of both ends of the flow channel portion along its length.

2. The integrated thermal management device according to claim 1, characterized in that: The first flow channel cavity is connected to the first outlet, and the first flow channel and the second flow channel are arranged in parallel.

3. The integrated thermal management device according to claim 1 or 2, characterized in that: The first flow channel cavity is capable of facilitating fluid flow, and the fluid has a first flow path in the first flow channel cavity. The second flow channel cavity is capable of facilitating fluid flow, and the fluid has a second flow path in the second flow channel cavity. The first flow path and the second flow path are arranged in opposite directions.

4. The integrated thermal management device according to claim 3, characterized in that: The thermal management integrated device includes a plug connected to the flow channel portion, the plug being located in at least one of the first flow channel and the second flow channel.

5. The integrated thermal management device according to claim 4, characterized in that: The plug is welded to the flow channel portion; The flow channel has a compressor exhaust port, which is located on the wall forming the second flow channel.

6. The integrated thermal management device according to claim 4 or 5, characterized in that: The flow channel portion has a third flow channel, which extends through the end faces of both ends of the flow channel portion along its length direction; The third flow channel is located on the side of the second flow channel away from the first flow channel. The flow channel has a compressor intake port, which is located on the wall forming the third flow channel. The plug is located in the third flow channel.

7. The integrated thermal management device according to any one of claims 1-6, characterized in that: The thermal management integrated device includes a first cover plate connected to the flow channel portion. The first cover plate has a first channel that connects the first outlet to the first flow channel cavity.

8. The integrated thermal management device according to claim 7, characterized in that: The flow channel portion has a first mounting groove, the first cover plate is at least partially located in the first mounting groove, and the first cover plate is connected to the flow channel portion; Define a plane perpendicular to the length direction of the flow channel as a reference plane, project the flow channel onto the reference plane, define the first flow channel and the second flow channel as being arranged along a first direction on the reference plane, and define a second direction as being arranged perpendicular to the first direction on the reference plane; Along the first direction, the minimum distance between the wall forming the first flow channel and the wall forming the second flow channel is L1. Along the second direction, the minimum spacing between the walls forming the first flow channel is Y1, and the minimum spacing between the walls forming the second flow channel is Y2. The minimum value between Y1 and Y2 is selected and defined as L2, where 2≤L2 / L1≤3.

9. The integrated thermal management device according to any one of claims 1-6, characterized in that: The thermal management integrated device includes a second cover plate connected to the flow channel portion. The second cover plate has a second channel that connects the second outlet to the second flow channel cavity.

10. The integrated thermal management device according to claim 9, characterized in that: The flow channel portion has a second mounting groove, the second cover plate is at least partially located in the second mounting groove, and the second cover plate is connected to the flow channel portion; The thermal management integrated device includes a compression module, which includes a cylindrical body and a compressor core. The compressor core is at least partially located in the cavity of the cylindrical body, and the cylindrical body and the flow channel are integral parts.

11. A thermal management integrated device, characterized in that: The device includes a flow channel section, a first heat exchanger, a second heat exchanger, and a first valve. The flow channel section has a first flow channel and a second flow channel. The first valve is connected to the outlet of the first heat exchanger and has a first valve inlet and a first valve outlet. The first flow channel includes a first flow channel cavity, and the second flow channel includes a second flow channel cavity. The first valve inlet or the first valve outlet is connected to the first flow channel cavity, and the second flow channel cavity is connected to the outlet of the second heat exchanger. At least a portion of the first flow channel cavity and at least a portion of the second flow channel cavity are disposed close to each other. At least one of the first flow channel and the second flow channel extends through the end faces of both ends of the flow channel portion along its length.

12. The integrated thermal management device according to claim 11, characterized in that: The thermal management integrated device includes a plug, which is located in at least one of the first flow channel and the second flow channel. The plug located in at least one of the first flow channel and the second flow channel is connected to the flow channel portion. The plug is located at the end of at least one of the first flow channel cavity and the second flow channel cavity.

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