Monitoring device, driver and large-current assembly

Abstract

The invention provides a monitoring device, a driver and a high-current assembly. The monitoring device comprises at least one data acquisition unit which is used for respectively acquiring electrical parameters of the large-current assembly; the data processing unit is used for evaluating the health state of the large-current assembly according to the electrical parameters; the isolation power supply unit is used for performing isolation power supply on the at least one data acquisition unit and the data processing unit; wherein the at least one data acquisition unit is communicated with the data processing unit through an optical fiber. The monitoring device can monitor parameters such as current and voltage of the large-current component in a smaller space, is highly integrated, has lower cost and higher isolation voltage, and can simultaneously collect electrical parameters of the large-current component in multiple channels.

Description

Technical Field

[0001] This invention relates to the field of monitoring and control technology, and in particular to a monitoring device, a driver, and a high-current component. Background Technology

[0002] In related technologies, current and voltage measurement systems for high-current components typically use a combination of Rogowski coils, high-voltage probes, current transmitters, oscilloscopes, and isolation transformers, which are widely used in power electronic systems.

[0003] Rogowski coils are made by winding wires, and their measurement bandwidth is generally not high. Rogowski coils with higher bandwidth and high voltage probes are relatively expensive and are monopolized by some foreign manufacturers. In fact, the accuracy requirements for current and voltage monitoring in high current components are less than 1 / 10 of those of commercial detection solutions. Therefore, a new current and voltage monitoring device is needed. Summary of the Invention

[0004] The main objective of this invention is to provide a monitoring device, a driver, and a high-current component, so as to provide a monitoring device that can monitor the health status of a high-current component in real time.

[0005] The present invention provides a monitoring device, comprising: at least one data acquisition unit for acquiring electrical parameters of a high-current component; a data processing unit for evaluating the health status of the high-current component based on the electrical parameters; and an isolation power supply unit for providing isolated power to the at least one data acquisition unit and the data processing unit; wherein the at least one data acquisition unit and the data processing unit communicate via optical fiber.

[0006] In one embodiment, the data acquisition unit includes a current acquisition unit, which includes a first microcontroller for acquiring the current value of a high-current component and converting the current value into a digital signal.

[0007] In one embodiment, the first microcontroller includes a PCB Rogowski coil for acquiring the current value of a high-current component.

[0008] In one embodiment, the data acquisition unit includes a voltage acquisition unit, which includes: a voltage attenuation circuit for acquiring the voltage value of the high-current component and attenuating the voltage value; and a second microcontroller for determining the voltage value of the high-current component based on the attenuated voltage value.

[0009] In one embodiment, the voltage acquisition unit further includes: an operational amplifier, the input of which is connected to the output of a voltage attenuation circuit; a low-pass filter, the input of which is connected to the output of the operational amplifier; an analog-to-digital converter, the input of which is connected to the output of the low-pass filter, and the output of which is connected to the input of a second microcontroller; the second microcontroller is further configured to determine the voltage value of the high-current component based on the voltage value output by the analog-to-digital converter.

[0010] In one embodiment, the isolated power supply unit includes: a high-frequency inverter circuit, the input of which is connected to a DC voltage source; an isolation transformer, the primary winding of which is connected to the output of the high-frequency inverter circuit, and the secondary winding of which is connected to at least one data acquisition unit; and a rectifier filter circuit, the input of which is connected to the secondary winding, and the output of which is connected to a data processing unit.

[0011] In one embodiment, the data processing unit includes an FPGA whose input is connected to at least one data acquisition unit for evaluating the health status of high-current components based on electrical parameters.

[0012] In one embodiment, it further includes: a host computer, whose input terminal is connected to the output terminal of the FPGA, for receiving preset alarm values ​​and sending preset alarm values ​​to the FPGA, receiving and storing electrical parameters and the FPGA's evaluation results of the health status of high-current components.

[0013] The present invention provides a driver that includes the monitoring device described above.

[0014] The present invention provides a high-current component, characterized in that it includes the monitoring device as claimed in claim 9.

[0015] The monitoring device of the present invention can monitor parameters such as current and voltage of high-current components in a smaller space. It is highly integrated, has lower cost, higher isolation voltage, and enables multiple channels to simultaneously acquire electrical parameters of high-current components. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention.

[0017] In the picture:

[0018] Figure 1 This is a schematic diagram of the structure of a monitoring device according to an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of a PCB Rogowski coil according to an embodiment of this application;

[0020] Figure 3This is a schematic diagram of the structure of a voltage acquisition unit according to an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of a voltage acquisition unit according to an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the structure of a high-current component according to an embodiment of this application. Detailed Implementation

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] refer to Figure 1 This embodiment provides a monitoring device 100, including: at least one data acquisition unit 110 for acquiring electrical parameters of a high-current component; a data processing unit 120 for evaluating the health status of the high-current component based on the electrical parameters; and an isolation power supply unit 130 for providing isolated power to at least one data acquisition unit and the data processing unit; wherein at least one data acquisition unit and the data processing unit communicate via optical fiber.

[0025] The electrical parameters may include, for example, voltage, current, and inductance. The data acquisition unit may include voltage acquisition units, current acquisition units, and inductance acquisition units. The data processing unit may include, for example, a microcontroller or a controller. The isolation power supply unit may include, for example, an isolation transformer or other device capable of achieving high-voltage isolation.

[0026] In this embodiment, multiple data acquisition units can be arranged in parallel, which facilitates multi-channel expansion. The data acquired by the data acquisition units can be transmitted to the data processing unit via optical fiber. The data processing unit 120 can then package the received data and transmit it to the host computer 200 via optical fiber. The host computer can set some alarm parameters and can also be used for real-time querying and data storage.

[0027] In this embodiment, the data processing unit can assess the health status of high-current components based on electrical parameters, enabling real-time analysis and control of the component's health status. It can determine in real-time whether the high-current component is within its safe operating range and, based on the assessment result, execute corresponding control actions to protect the component. Furthermore, utilizing optical fiber for communication between the data acquisition unit and the data processing unit facilitates high-speed data transmission and improves the timeliness of monitoring the electrical parameters of high-current components.

[0028] In one embodiment, the data acquisition unit may include a current acquisition unit 110a, which may include a first microcontroller for acquiring the current value of a high-current component and converting the current value into a digital signal.

[0029] In this embodiment, using a first microcontroller to collect the current value of a high-current component helps to simplify the entire monitoring device, reduce its size, and improve integration. The first microcontroller can be a QFN (Quad Flat No-leads Package) microcontroller, with a size of 3x3mm to 5x5mm, thereby compressing the PCB board size to 10cm×5cm×1cm, which facilitates easy integration into the driver of power semiconductor devices.

[0030] refer to Figure 2 In one embodiment, the first microcontroller may include a PCB (Printed Circuit Board) Rogowski coil for acquiring the current value of a high-current component.

[0031] The Rogowski coil, also known as an AC current sensor, is a hollow toroidal coil available in both flexible and rigid forms. It is directly fitted onto the conductor being measured to determine AC current. Containing no ferromagnetic materials, it exhibits no hysteresis, near-zero phase difference, and no magnetic saturation. Therefore, it can measure currents ranging from several amperes to hundreds of kiloamperes, with a wide response bandwidth of 0.1 Hz to 1 MHz.

[0032] refer to Figure 2 In a PCB Rogowski coil, the conductor is wound radially along a ring. When the current-carrying conductor passes perpendicularly through the center of the coil, the current in the conductor will generate a time-varying magnetic field in the coil. The current in the conductor can be determined using Ampere's circuital law and Faraday's law of electromagnetic induction. PCB Rogowski coils are characterized by low cost, high dimensional accuracy, and small size.

[0033] refer to Figure 3 In one embodiment, the data acquisition unit may include a voltage acquisition unit 110b, which may include: a voltage attenuation circuit 110b1 for acquiring the voltage value of the high-current component and attenuating the voltage value; and a second microcontroller 110b2 for determining the voltage value of the high-current component based on the attenuated voltage value.

[0034] The voltage attenuation circuit can be designed as needed, as long as it can attenuate the voltage of the high-current component. The second microcontroller determines the voltage value of the high-current component based on the attenuated voltage value. Specifically, the second microcontroller can first convert the attenuated analog voltage value of the high-current component into a digital signal, and then determine the voltage value of the high-current component based on this digital signal.

[0035] The second microcontroller can be a QFN (Quad Flat No-leads Package) microcontroller, with a size of 3x3mm to 5x5mm, which can compress the PCB board size to 10cm×5cm×1cm, making it easier to integrate into the driver of power semiconductor devices.

[0036] Using a second microcontroller to determine the voltage value of high-current components helps to simplify the entire monitoring device, reduce its size, and improve its integration.

[0037] Continue to refer to Figure 3 In one embodiment, the voltage acquisition unit may further include: an operational amplifier 110b3, the input of which is connected to the output of a voltage attenuation circuit; a low-pass filter 110b4, the input of which is connected to the output of the operational amplifier; an analog-to-digital converter 110b5, the input of which is connected to the output of the low-pass filter 110b4, and the output of which is connected to the input of a second microcontroller 110b2; the second microcontroller 110b2 is further configured to determine the voltage value of the high-current component based on the voltage value output by the analog-to-digital converter 110b5.

[0038] The voltage value of the high-current component is attenuated by a voltage attenuation circuit, then output to a low-pass filter via an operational amplifier. After filtering, it is converted by an A / D converter chip and output as 8-10 bits of parallel data. The second microcontroller can use GPIO (General-Purpose Input / Output) for high-speed DMA (Direct Memory Access) storage, supporting a sampling rate of 50Msps. This circuit is suitable for scenarios requiring short-term data acquisition and observation of waveform details. (Reference) Figure 4 This is a schematic diagram of the actual product of the voltage acquisition unit in this embodiment.

[0039] In one embodiment, the isolated power supply unit may include: a high-frequency inverter circuit, the input of which is connected to a DC voltage source; an isolation transformer, the primary winding of which is connected to the output of the high-frequency inverter circuit, and the secondary winding of which is connected to at least one data acquisition unit; and a rectifier filter circuit, the input of which is connected to the secondary winding, and the output of which is connected to a data processing unit.

[0040] A high-frequency inverter circuit can convert a DC voltage source into a high-frequency resonant current. This resonant current is coupled to the primary winding of an isolation transformer through a high-voltage conductor, generating a magnetic flux in the primary winding. This flux is then coupled to the secondary winding, which supplies power to the data acquisition unit, achieving high-voltage isolation. After rectification and filtering, the current in the secondary winding can also supply power to the data processing unit, similarly achieving high-voltage isolation. In one embodiment, after rectification and filtering, the current in the secondary winding can also supply power to the voltage attenuation circuit, operational amplifier, and analog-to-digital converter in the voltage acquisition unit.

[0041] In a specific example, an IR2104 gate driver can be used to drive the power switching devices of a high-frequency inverter circuit. The high-frequency inverter circuit can be a 50kHz high-frequency half-bridge resonant inverter circuit, with an isolation voltage reaching 100kV, exhibiting high isolation voltage. Furthermore, the isolation voltage can be further increased by adjusting the isolation power supply wire (see reference). Figure 5 ).

[0042] In one embodiment, the data processing unit may include an FPGA (Field Programmable Gate Array) whose input is connected to at least one data acquisition unit for evaluating the health status of high-current components based on electrical parameters.

[0043] In one embodiment, it may further include: a host computer, whose input terminal is connected to the output terminal of the FPGA, for receiving preset alarm values ​​and sending preset alarm values ​​to the FPGA, receiving and storing electrical parameters and the FPGA's evaluation results of the health status of high-current components.

[0044] The preset alarm values ​​can include voltage alarm values, current alarm values, etc. The FPGA can determine whether the high-current component is over-voltage based on the comparison between the collected voltage value of the high-current component and the voltage alarm value, and determine whether the high-current component is over-current based on the comparison between the collected current value of the high-current component and the current alarm value. This is beneficial for achieving high-concurrency computing, judging the health status of the high-current component, and performing timely fault analysis. It is also beneficial for quickly resolving on-site faults and discovering product quality problems, thereby improving the safety and reliability of the high-current component.

[0045] In one embodiment, the FPGA may have a fiber optic transceiver port, which can communicate with the host computer via fiber optic Ethernet or serial port to achieve high-speed data interaction with the host computer, while also achieving high-voltage isolation between high-current components and the host computer.

[0046] See the table below for a comparison of the monitoring device of the present invention with monitoring devices in related technologies.

[0047]

[0048] The monitoring device in this embodiment can monitor parameters such as current and voltage of high-current components in a smaller space. It is highly integrated, has lower cost, higher isolation voltage, and enables multiple channels to simultaneously acquire electrical parameters of high-current components.

[0049] This embodiment provides a driver that includes the monitoring device described above.

[0050] This embodiment provides a high-current component, including the monitoring device described above.

[0051] refer to Figure 5 This is a schematic diagram of one implementation of a high-current component. The high-current component switching device is located on the left side, the data processing unit is located outside the frame, and the data acquisition unit is located between the data processing unit and the high-current component switching device. Power is supplied to the data acquisition unit and the data processing unit via isolated power supply wires. Each unit adopts a modular design, allowing for multi-module combination and stacked installation, achieving high integration with the driver and resistor-capacitor components, thus reducing the overall size of the high-current component.

[0052] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this application. When the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0053] It should be noted that the terms "first," "second," etc., used in the specification, claims, and drawings of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate.

[0054] It should be understood that the exemplary embodiments described herein can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps. These embodiments are provided so that the disclosure of this application is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art, and should not be construed as limiting the invention.

[0055] While the spirit and principles of the invention have been described with reference to several specific embodiments, it should be understood that the invention is not limited to the disclosed specific embodiments, and the division of aspects does not imply that features in these aspects cannot be combined for benefit; such division is merely for ease of description. The invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A monitoring device, characterized in that, include: At least one data acquisition unit is used to acquire the electrical parameters of the high-current components respectively; A data processing unit is used to evaluate the health status of the high-current component based on the electrical parameters; An isolated power supply unit is used to provide isolated power to the at least one data acquisition unit and the data processing unit; wherein... The at least one data acquisition unit communicates with the data processing unit via optical fiber.

2. The monitoring device according to claim 1, characterized in that, The data acquisition unit includes a current acquisition unit, which includes: The first microcontroller is used to collect the current value of the high-current component and convert the current value into a digital signal.

3. The monitoring device according to claim 2, characterized in that, The first microcontroller includes: The PCB Rogowski coil is used to collect the current value of the high-current component.

4. The monitoring device according to claim 1, characterized in that, The data acquisition unit includes a voltage acquisition unit, which includes: A voltage attenuation circuit is used to acquire the voltage value of the high-current component and attenuate the voltage value. The second microcontroller is used to determine the voltage value of the high-current component based on the attenuated voltage value.

5. The monitoring device according to claim 4, characterized in that, The voltage acquisition unit also includes: An operational amplifier, the input of which is connected to the output of the voltage attenuation circuit; A low-pass filter, the input of which is connected to the output of the operational amplifier; An analog-to-digital converter, the input of which is connected to the output of the low-pass filter, and the output of which is connected to the input of the second microcontroller; The second microcontroller is also used to determine the voltage value of the high-current component based on the voltage value output by the analog-to-digital converter.

6. The monitoring device according to claim 1, characterized in that, The isolated power supply unit includes: A high-frequency inverter circuit, whose input terminal is connected to a DC voltage source; An isolation transformer, the primary winding of which is connected to the output terminal of the high-frequency inverter circuit, and the secondary winding of which is connected to the at least one data acquisition unit; The rectifier and filter circuit has its input terminal connected to the secondary coil and its output terminal connected to the data processing unit.

7. The monitoring device according to claim 1, characterized in that, The data processing unit includes: An FPGA, whose input is connected to the at least one data acquisition unit, is used to evaluate the health status of the high-current component based on the electrical parameters.

8. The monitoring device according to claim 7, characterized in that, Also includes: The host computer, whose input terminal is connected to the output terminal of the FPGA, is used to receive preset alarm values ​​and send the preset alarm values ​​to the FPGA, receive and store the electrical parameters and the FPGA's evaluation results of the health status of the high-current components.

9. A driver, characterized in that, Includes the monitoring device as described in any one of claims 1 to 8.

10. A high-current component, characterized in that, Includes the monitoring device as described in claim 9.

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