A dustproof and high heat dissipation automotive backlight

Abstract

This invention belongs to the field of automotive backlighting and provides a dustproof and high-heat-dissipation automotive backlighting, including a substrate layer. The substrate layer includes an aluminum alloy substrate. A first thermally conductive silicone layer is disposed on the upper surface of the aluminum alloy substrate. A first heat dissipation layer is disposed on the upper surface of the first high thermal conductivity silicone layer, and the first heat dissipation layer includes a top laser-etched layer. A second thermally conductive silicone layer is disposed on the lower surface of the aluminum alloy substrate. The second thermally conductive silicone layer includes a second high thermal conductivity silicone layer, and a second heat dissipation layer is disposed on the lower surface of the second high thermal conductivity silicone layer. This invention achieves IP67 dustproof rating by soldering LED chips to the aluminum alloy substrate and filling it with high thermal conductivity silicone. It utilizes top / bottom radial and linear heat-conducting grooves to guide heat, and embeds a centrifugal fan at the bottom to form directional airflow. In addition, by combining a three-level dustproof component and a double-layer silicone sealing ring, it achieves IP67 dustproof rating, significantly improving heat dissipation efficiency and dustproof performance.

Description

Technical Field

[0001] This invention belongs to the field of automotive backlights, specifically a dustproof and heat-dissipating automotive backlight. Background Technology

[0002] Currently, the use of automotive backlights is quite common in the automotive industry. An automotive backlight is a light source located behind an LCD display. Its light emission effect directly affects the visual effect of the LCD display module. It is a device used to modulate light.

[0003] In the prior art, Chinese Patent Publication No. CN219715882U discloses a dustproof and high-heat-dissipation automotive backlight, relating to the field of automotive backlight technology. This automotive backlight aims to solve the technical problem of the inconvenience of dustproofing and efficient heat dissipation of automotive backlights in the prior art. The automotive backlight includes an FPC substrate; an FPC front copper layer is fixedly installed on the upper end of the FPC substrate, and an FPC back copper layer is fixedly installed on the bottom end of the FPC substrate. Heat dissipation holes are opened on the inner side of the FPC substrate. An LED shell is set on the upper end of the FPC front copper layer. A fixing base plate is set on the inner bottom end of the LED shell. An LED module is set on the upper end of the fixing base plate. A reinforcing component is set on the inner side of the LED shell. A wiring component is set on the inner side of the fixing base plate. The dustproof and high-heat-dissipation automotive backlight transfers heat from the FPC front copper layer to the FPC back copper layer through the heat dissipation holes. The FPC front copper layer, FPC back copper layer, and heat dissipation holes provide efficient heat dissipation for the automotive backlight. The corner seam design achieves a dustproof effect.

[0004] However, although the above-mentioned applications can efficiently dissipate heat from the vehicle backlight by using the copper layer on the front of the FPC, the copper layer on the back of the FPC, and the heat dissipation holes, and can achieve the effect of dust prevention by setting the corner seams, the heat dissipation effect is not ideal by relying solely on the copper layer and the heat dissipation holes, and simply relying on setting the corner seams cannot effectively prevent dust from the vehicle backlight.

[0005] To address the problems raised in the background art, those skilled in the art have proposed a dustproof and high-heat-dissipation automotive backlight. Summary of the Invention

[0006] To address the aforementioned technical problems, this invention provides a dustproof and high-heat-dissipation automotive backlight, which solves the problem that the existing technology only uses copper layers and heat dissipation holes for heat dissipation, resulting in unsatisfactory heat dissipation, and that simply setting up corner seams cannot effectively prevent dust from entering the automotive backlight.

[0007] A dustproof and heat-dissipating automotive backlight includes a substrate layer comprising an aluminum alloy substrate. A first thermally conductive silicone layer is disposed on the upper surface of the aluminum alloy substrate. The first thermally conductive silicone layer includes a first high thermal conductivity silicone layer. A first heat dissipation layer is disposed on the upper surface of the first high thermal conductivity silicone layer, and the first heat dissipation layer includes a top laser-etched layer. A second thermally conductive silicone layer is disposed on the lower surface of the aluminum alloy substrate. The second thermally conductive silicone layer includes a second high thermal conductivity silicone layer. A second heat dissipation layer is disposed on the lower surface of the second high thermal conductivity silicone layer, and the second heat dissipation layer includes a bottom laser-etched layer.

[0008] Preferably, two LED chips are disposed on the surface of the aluminum alloy substrate, and encapsulation blocks are disposed on the sides of the two LED chips. The LED chips are soldered to the surface of the aluminum alloy substrate through the encapsulation blocks. Mounting baffles are disposed on the upper surface of the aluminum alloy substrate around the two LED chips. The mounting baffles are snapped into the aluminum alloy substrate. Several temperature sensors are disposed on the upper surface of the aluminum alloy substrate. Several flow guide grooves are disposed on the sides of the aluminum alloy substrate. Heat dissipation holes are opened at the four corners of the aluminum alloy substrate. Each heat dissipation hole is provided with a three-level dustproof component.

[0009] Preferably, the surface of the first high thermal conductivity silicone layer has two first chip mounting slots, the positions of the two first chip mounting slots correspond to the positions of the two LED chips respectively, and the top of the LED chip passes through the first chip mounting slot. The surface of the first high thermal conductivity silicone layer has a plurality of sensor mounting slots, the positions of the sensor mounting slots correspond to the positions of the temperature sensors, and the temperature sensors are located in the sensor mounting slots.

[0010] Preferably, the first high thermal conductivity silicone layer has a plurality of first connecting grooves on its side, each first connecting groove corresponding to the position of each flow channel, and each first connecting groove communicating with the corresponding flow channel. The first high thermal conductivity silicone layer has first through holes at its four corners, each first through hole corresponding to each heat dissipation hole, and the first through hole communicating with the heat dissipation hole.

[0011] Preferably, the upper surface of the top laser-etched layer has two second chip mounting slots, the positions of the two second chip mounting slots correspond to the positions of the two LED chips respectively, and the top of the LED chip passes through the second chip mounting slot. The upper surface of the top laser-etched layer has a plurality of top radial heat conduction grooves laser-etched, the top radial heat conduction grooves being located around the LED chips. The upper surface of the top laser-etched layer has a top straight heat conduction groove laser-etched in the middle, the top straight heat conduction groove connecting the two second chip mounting slots.

[0012] Preferably, each of the top radial heat conduction grooves corresponds to and matches each of the first connecting grooves, and each of the top radial heat conduction grooves is connected to the corresponding first connecting groove. A second through hole is provided at each of the four corners of the top laser etched layer, and each of the second through holes corresponds to each of the first through holes, and the second through hole is connected to the first through hole.

[0013] Preferably, the surface of the second high thermal conductivity silicone layer has two fan mounting slots, and each of the four corners of the second high thermal conductivity silicone layer has a third through hole. The position of each third through hole corresponds to the position of each heat dissipation hole, and the third through hole is connected to the heat dissipation hole. The side of the second high thermal conductivity silicone layer has a plurality of second connecting slots. Each second connecting slot corresponds to the position of each guide slot, and each second connecting slot is connected to the corresponding guide slot.

[0014] Preferably, the surface of the bottom laser-etched layer has two fan placement slots, and each of the two fan placement slots is equipped with a miniature centrifugal fan. The lower surface of the bottom laser-etched layer has several bottom radial heat conduction grooves laser-etched around the fan placement slots. The lower surface of the bottom laser-etched layer has a bottom straight heat conduction groove laser-etched in the middle, and the bottom straight heat conduction groove connects the two fan placement slots. Both of the miniature centrifugal fans are equipped with three-level dustproof components.

[0015] Preferably, a fourth perforation is provided at each of the four corners of the bottom laser etched layer, each fourth perforation corresponds to each third perforation, and the fourth perforation is connected to the third perforation. A plurality of mounting posts are provided at the bottom of the bottom laser etched layer.

[0016] Preferably, a double-layer silicone sealing ring is provided at the joint between the aluminum alloy substrate and the display panel. The three-level dustproof component includes an outer layer, a middle layer, and an inner layer. The outer layer of the three-level dustproof component is a stainless steel metal filter screen for intercepting large dust particles. The middle layer of the three-level dustproof component is an electrospun nanofiber membrane for adsorbing microparticles. The inner layer of the three-level dustproof component is a hydrophobic dustproof cotton made of polyester fiber for moisture protection and anti-caking.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. This invention directly solders LED chips onto the surface of an aluminum alloy substrate via a packaging block, and fills the space between the LED chips and the aluminum alloy substrate with high thermal conductivity silicone to eliminate air gaps and reduce thermal resistance. Heat is then transferred to the surface of a first heat dissipation layer through the first thermal conductivity silicone layer. Heat is guided by top radial and top linear thermal conductive grooves laser-etched on the surface of the first heat dissipation layer, and further guided to bottom radial and bottom linear thermal conductive grooves through first and second connecting grooves. A micro centrifugal fan, embedded in the bottom of the aluminum alloy substrate and aligned with the bottom radial and bottom linear thermal conductive grooves, forms a directional airflow, allowing heat to flow within the top radial and top linear thermal conductive grooves, improving heat dissipation efficiency. Furthermore, a temperature sensor positioned between the top laser-etched layer and the aluminum alloy substrate layer can monitor the temperature of the aluminum alloy substrate in real time.

[0019] 2. This invention achieves IP67 dustproof rating by symmetrically opening heat dissipation holes at the four corners of an aluminum alloy substrate, connecting these holes with the first, second, third, and fourth through holes. Each heat dissipation hole contains a three-stage dustproof component. The outer layer of the three-stage dustproof component is a stainless steel metal filter to intercept large dust particles. The middle layer is an electrospun nanofiber membrane to adsorb microparticles. The inner layer is a hydrophobic dustproof cotton made of polyester fiber for moisture and anti-caking purposes. A double-layer silicone sealing ring is also provided at the joint between the aluminum alloy substrate and the display panel, thereby improving the dustproof effect of the device. Attached Figure Description

[0020] Figure 1 This is a top view of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall bottom view of the present invention;

[0022] Figure 3 This is an exploded view of the overall structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the substrate layer structure in this invention;

[0024] Figure 5 This is a schematic diagram of the structure of the first thermally conductive silicone layer in this invention;

[0025] Figure 6 This is a schematic diagram of the structure of the first heat dissipation layer in this invention;

[0026] Figure 7 This is a schematic diagram of the structure of the second thermally conductive silicone layer in this invention;

[0027] Figure 8This is a schematic diagram of the structure of the second heat dissipation layer in this invention.

[0028] In the picture:

[0029] 1. Substrate layer; 101. Aluminum alloy substrate; 102. LED chip; 103. Encapsulation block; 104. Temperature sensor; 105. Channel; 106. Heat dissipation hole; 107. Three-level dustproof component; 2. First thermally conductive silicone layer; 201. First high thermal conductivity silicone layer; 202. First chip mounting slot; 203. Sensor mounting slot; 204. First through hole; 205. First connection slot; 3. First heat dissipation layer; 301. Top laser etched layer; 302. Second chip mounting slot; 303. Mounting 304. Baffle; 305. Second perforation; 306. Top radial heat conduction groove; 307. Top linear heat conduction groove; 4. Second thermally conductive silicone layer; 408. Second high thermal conductivity silicone layer; 409. Fan mounting slot; 400. Third perforation; 400. Second connecting slot; 501. Second heat dissipation layer; 502. Bottom laser etched layer; 503. Fan placement slot; 504. Fourth perforation; 505. Bottom radial heat conduction groove; 506. Bottom linear heat conduction groove; 507. Mounting column; 508. Miniature centrifugal fan. Detailed Implementation

[0030] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0031] like Figure 1 To be continued Figure 8 As shown:

[0032] Example 1: This invention provides a dustproof and high heat dissipation automotive backlight, including a substrate layer 1, which includes an aluminum alloy substrate 101. A first thermally conductive silicone layer 2 is disposed on the upper surface of the aluminum alloy substrate 101. The first thermally conductive silicone layer 2 includes a first high thermal conductivity silicone layer 201. A first heat dissipation layer 3 is disposed on the upper surface of the first high thermal conductivity silicone layer 201. The first heat dissipation layer 3 includes a top laser-etched layer 301. A second thermally conductive silicone layer 4 is disposed on the lower surface of the aluminum alloy substrate 101. The second thermally conductive silicone layer 4 includes a second high thermal conductivity silicone layer 401. A second heat dissipation layer 5 is disposed on the lower surface of the second high thermal conductivity silicone layer 401. The second heat dissipation layer 5 includes a bottom laser-etched layer 501.

[0033] Furthermore, two LED chips 102 are disposed on the surface of the aluminum alloy substrate 101, and encapsulation blocks 103 are disposed on the sides of the two LED chips 102. The LED chips 102 are soldered to the surface of the aluminum alloy substrate 101 through the encapsulation blocks 103. Mounting baffles 303 are disposed on the upper surface of the aluminum alloy substrate 101 around the two LED chips 102. The mounting baffles 303 are snapped into the aluminum alloy substrate 101. Several temperature sensors 104 are disposed on the upper surface of the aluminum alloy substrate 101. Several flow guide grooves 105 are disposed on the sides of the aluminum alloy substrate 101. Heat dissipation holes 106 are opened at the four corners of the aluminum alloy substrate 101. Each heat dissipation hole 106 is provided with a three-level dustproof component 107 inside.

[0034] Furthermore, two first chip mounting slots 202 are formed on the surface of the first high thermal conductivity silicone layer 201. The positions of the two first chip mounting slots 202 correspond to the positions of the two LED chips 102, and the top of the LED chip 102 passes through the first chip mounting slot 202. Several sensor mounting slots 203 are formed on the surface of the first high thermal conductivity silicone layer 201. The positions of the sensor mounting slots 203 correspond to the positions of the temperature sensors 104, and the temperature sensors 104 are located in the sensor mounting slots 203. Several first connecting slots 205 are formed on the side of the first high thermal conductivity silicone layer 201. Each first connecting slot 205 corresponds to the position of each flow channel 105, and each first connecting slot 205 is interconnected with the corresponding flow channel 105. First through holes 204 are formed at the four corners of the first high thermal conductivity silicone layer 201. Each first through hole 204 corresponds to each heat dissipation hole 106, and the first through hole 204 is interconnected with the heat dissipation hole 106.

[0035] Furthermore, two second chip mounting slots 302 are formed on the upper surface of the top laser-etched layer 301. The positions of the two second chip mounting slots 302 correspond to the positions of the two LED chips 102, and the top of the LED chip 102 passes through the second chip mounting slots 302. Several top radial heat conduction grooves 305 are laser-etched on the upper surface of the top laser-etched layer 301. The top radial heat conduction grooves 305 are located around the LED chips 102. A top straight heat conduction groove 306 is laser-etched in the middle of the upper surface of the top laser-etched layer 301. The top straight heat conduction groove 306 connects the two second chip mounting slots 302. Each top radial heat conduction groove 305 corresponds to and matches each first connecting groove 205, and each top radial heat conduction groove 305 is connected to the corresponding first connecting groove 205. Second through holes 304 are formed at the four corners of the top laser-etched layer 301. Each second through hole 304 corresponds to each first through hole 204, and the second through hole 304 is connected to the first through hole 204.

[0036] Furthermore, two fan mounting slots 402 are formed on the surface of the second high thermal conductivity silicone layer 401, and a third through hole 403 is provided at each of the four corners of the second high thermal conductivity silicone layer 401. The position of each third through hole 403 corresponds to the position of each heat dissipation hole 106, and the third through hole 403 is connected to the heat dissipation hole 106. Several second connecting slots 404 are formed on the side of the second high thermal conductivity silicone layer 401. Each second connecting slot 404 corresponds to the position of each guide slot 105, and each second connecting slot 404 is connected to the corresponding guide slot 105.

[0037] Furthermore, two fan placement slots 502 are formed on the surface of the bottom laser-etched layer 501, and a miniature centrifugal fan 507 is provided inside each of the two fan placement slots 502. Several bottom radial heat conduction grooves 504 are laser-etched on the lower surface of the bottom laser-etched layer 501. The bottom radial heat conduction grooves 504 are located around the fan placement slots 502. A bottom straight heat conduction groove 505 is laser-etched in the middle of the lower surface of the bottom laser-etched layer 501. The bottom straight heat conduction groove 505 connects the two fan placement slots 502. A fourth through hole 503 is formed at each of the four corners of the bottom laser-etched layer 501. Each fourth through hole 503 corresponds to each third through hole 403 and the fourth through hole 503 is connected to the third through hole 403. Several mounting posts 506 are provided at the bottom of the bottom laser-etched layer 501.

[0038] As can be seen from the above, the LED chip 102 is directly soldered to the surface of the aluminum alloy substrate 101 through the encapsulation block 103, and high thermal conductivity silicone is filled between the LED chip 102 and the aluminum alloy substrate 101 to eliminate air gaps and reduce thermal resistance. Then, heat is transferred to the surface of the first heat dissipation layer 3 through the first thermal conductivity silicone layer 2. The heat is guided by the top radial heat conduction grooves 305 and the top linear heat conduction grooves 306 laser-etched on the surface of the first heat dissipation layer 3, and the heat is guided to the bottom radial heat conduction grooves 504 and the bottom linear heat conduction grooves 505 through the first connecting groove 205 and the second connecting groove 404. The heat is dissipated by a miniature centrifugal fan 507, which is embedded in the bottom of the aluminum alloy substrate 101 and aligned with the bottom radial heat conduction groove 504 and the bottom linear heat conduction groove 505 to form a directional airflow. This allows heat to flow in the top radial heat conduction groove 305, the top linear heat conduction groove 306, the guide groove 105, the bottom radial heat conduction groove 504, and the bottom linear heat conduction groove 505, thereby improving heat dissipation efficiency. The temperature of the aluminum alloy substrate 101 can be monitored in real time by a temperature sensor 104 located between the top laser etched layer 301 and the aluminum alloy substrate 101 layer 1.

[0039] Example 2: This example is basically the same as the previous example, except that a double-layer silicone sealing ring is provided at the joint between the aluminum alloy substrate 101 and the display panel, and a three-level dustproof component 107 is installed on the outside of both miniature centrifugal fans 507. The three-level dustproof component 107 includes an outer layer, a middle layer and an inner layer. The outer layer of the three-level dustproof component 107 is a stainless steel metal filter screen, which is used to intercept large dust particles. The middle layer of the three-level dustproof component 107 is an electrospun nanofiber membrane, which is used to adsorb microparticles. The inner layer of the three-level dustproof component 107 is a hydrophobic dustproof cotton, which is made of polyester fiber and is used for moisture prevention and anti-caking.

[0040] As can be seen from the above, by symmetrically opening heat dissipation holes 106 at the four corners of the aluminum alloy substrate 101, and connecting the heat dissipation holes 106 with the first through hole 204, the second through hole 304, the third through hole 403 and the fourth through hole 503, and by embedding a three-level dustproof component 107 in each heat dissipation hole 106, the outer layer of the three-level dustproof component 107 is a stainless steel metal filter screen for intercepting large dust particles, the middle layer of the three-level dustproof component 107 is an electrospun nanofiber membrane for adsorbing microparticles, and the inner layer of the three-level dustproof component 107 is a hydrophobic dustproof cotton made of polyester fiber for moisture prevention and anti-caking, and by setting a double-layer silicone sealing ring at the joint between the aluminum alloy substrate 101 and the display panel, an IP67 dustproof rating is achieved, thereby improving the dustproof effect of the device.

[0041] Working principle: The LED chip 102 is directly soldered to the surface of the aluminum alloy substrate 101 through the encapsulation block 103. High thermal conductivity silicone is filled between the LED chip 102 and the aluminum alloy substrate 101 to eliminate air gaps and reduce thermal resistance. The LED chip 102 is protected by the mounting baffle 303. A double-layer silicone sealing ring is set at the joint between the aluminum alloy substrate 101 and the display panel. When the LED chip 102 heats up, the heat is transferred to the surface of the first heat dissipation layer 3 through the first thermally conductive silicone layer 2. The heat is guided by the top radial heat conduction grooves 305 and the top linear heat conduction grooves 306 laser-etched on the surface of the first heat dissipation layer 3. The heat is also guided to the bottom radial heat conduction grooves 504 and the bottom linear heat conduction grooves 505 through the first connecting groove 205 and the second connecting groove 404. The heat is then discharged by a micro centrifugal fan 507, which is embedded in the bottom of the aluminum alloy substrate 101 and connects with the bottom radial heat conduction grooves 504 and 505. The radial heat conduction groove 504 and the bottom linear heat conduction groove 505 are aligned to form a directional airflow, allowing heat to flow in the top radial heat conduction groove 305, the top linear heat conduction groove 306, the guide groove 105, the bottom radial heat conduction groove 504, and the bottom linear heat conduction groove 505, thereby improving heat dissipation efficiency. The temperature of the aluminum alloy substrate 101 can be monitored in real time by a temperature sensor 104 located between the top laser etching layer 301 and the aluminum alloy substrate 101 layer 1. Each heat dissipation hole 106 is equipped with a three-level dustproof component 107. The outer layer of the three-level dustproof component 107 is a stainless steel metal filter to intercept large dust particles. The middle layer of the three-level dustproof component 107 is an electrospun nanofiber membrane to adsorb microparticles. The inner layer of the three-level dustproof component 107 is a hydrophobic dustproof cotton made of polyester fiber for moisture prevention and anti-caking. A double-layer silicone sealing ring is provided at the joint between the aluminum alloy substrate 101 and the display panel, thereby achieving an IP67 dustproof rating.

[0042] The embodiments of the present invention are given for the purposes of illustration and description. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A dustproof and high-heat-dissipation automotive backlight, characterized in that: The application relates to a heat dissipation device, which comprises a substrate layer (1) comprising an aluminum alloy substrate (101), the upper surface of the aluminum alloy substrate (101) is provided with a first heat-conducting silica gel layer (2), the first heat-conducting silica gel layer (2) comprises a first high-heat-conducting silica gel layer (201), the upper surface of the first high-heat-conducting silica gel layer (201) is provided with a first heat dissipation layer (3), the first heat dissipation layer (3) comprises a top laser etching layer (301), the lower surface of the aluminum alloy substrate (101) is provided with a second heat-conducting silica gel layer (4), the second heat-conducting silica gel layer (4) comprises a second high-heat-conducting silica gel layer (401), the lower surface of the second high-heat-conducting silica gel layer (401) is provided with a second heat dissipation layer (5), and the second heat dissipation layer (5) comprises a bottom laser etching layer (501). The side edges of the aluminum alloy substrate (101) are provided with a plurality of flow guide grooves (105). The side edges of the first high-heat-conducting silica gel layer (201) are provided with a plurality of first connecting grooves (205), each first connecting groove (205) corresponds to the position of each flow guide groove (105), and each first connecting groove (205) is in communication with the corresponding flow guide groove (105). The top surface of the top laser etching layer (301) is laser etched with a plurality of top radial heat-conducting grooves (305), the middle part of the top surface of the top laser etching layer (301) is laser etched with a top linear heat-conducting groove (306), each top radial heat-conducting groove (305) is correspondingly matched with each first connecting groove (205), and each top radial heat-conducting groove (305) is in communication with the corresponding first connecting groove (205). The side edges of the second high-heat-conducting silica gel layer (401) are provided with a plurality of second connecting grooves (404), each second connecting groove (404) corresponds to the position of each flow guide groove (105), and each second connecting groove (404) is in communication with the corresponding flow guide groove (105). The surface of the bottom laser etching layer (501) is provided with two fan placing grooves (502), each fan placing groove (502) is internally provided with a micro centrifugal fan (507), the lower surface of the bottom laser etching layer (501) is laser etched with a plurality of bottom radial heat-conducting grooves (504), the bottom radial heat-conducting grooves (504) are located around the fan placing grooves (502), the middle part of the lower surface of the bottom laser etching layer (501) is laser etched with a bottom linear heat-conducting groove (505), and the bottom linear heat-conducting groove (505) is in communication with the two fan placing grooves (502). The surface of the second high-heat-conducting silica gel layer (401) is provided with two fan mounting grooves (402). Each bottom radial heat-conducting groove (504) is matched with each second connecting groove (404), and each bottom radial heat-conducting groove (504) is in communication with the corresponding second connecting groove (404).

2. The dustproof high-heat-dissipation vehicle-mounted backlight source according to claim 1, characterized in that: The surface of the aluminum alloy substrate (101) is provided with two LED chips (102), the side surface of each of the two LED chips (102) is provided with an encapsulation block (103), the LED chip (102) is welded on the surface of the aluminum alloy substrate (101) through the encapsulation block (103), the upper surface of the aluminum alloy substrate (101) around the two LED chips (102) is provided with a mounting baffle (303), the mounting baffle (303) is clamped with the aluminum alloy substrate (101), the upper surface of the aluminum alloy substrate (101) is provided with a plurality of temperature sensors (104), the four corners of the aluminum alloy substrate (101) are provided with heat dissipation holes (106), and the inside of each heat dissipation hole (106) is provided with a three-stage dustproof piece (107).

3. The dustproof high-heat-dissipation vehicle-mounted backlight source according to claim 2, characterized in that: The surface of the first high-thermal-conductivity silica gel layer (201) is provided with two first chip mounting grooves (202), the positions of the two first chip mounting grooves (202) correspond to the positions of the two LED chips (102) respectively, and the top of the LED chip (102) passes through the first chip mounting groove (202); the surface of the first high-thermal-conductivity silica gel layer (201) is provided with a plurality of sensor mounting grooves (203), the positions of the sensor mounting grooves (203) correspond to the positions of the temperature sensors (104), and the temperature sensors (104) are located in the sensor mounting grooves (203).

4. The dustproof high-heat-dissipation vehicle-mounted backlight according to claim 3, characterized in that: The four corners of the first high-thermal-conductivity silica gel layer (201) are provided with first perforations (204), each first perforation (204) corresponds to each heat dissipation hole (106) respectively, and the first perforation (204) is in communication with the heat dissipation hole (106).

5. The dustproof high-heat-dissipation vehicle-mounted backlight source according to claim 4, characterized in that: The upper surface of the top laser etching layer (301) is provided with two second chip mounting grooves (302), the positions of the two second chip mounting grooves (302) correspond to the positions of the two LED chips (102) respectively, and the top of the LED chip (102) passes through the second chip mounting groove (302); the top radial heat conduction groove (305) is located around the LED chip (102), and the top linear heat conduction groove (306) is in communication with the two second chip mounting grooves (302).

6. The dustproof high-heat-dissipation vehicle-mounted backlight source according to claim 5, characterized in that: The four corners of the top laser etching layer (301) are provided with second perforations (304), each second perforation (304) corresponds to each first perforation (204) respectively, and the second perforation (304) is in communication with the first perforation (204).

7. The dustproof high-heat-dissipation vehicle-mounted backlight source according to claim 6, characterized in that: The four corners of the second high-thermal-conductivity silica gel layer (401) are provided with third perforations (403), the positions of each third perforation (403) correspond to the positions of each heat dissipation hole (106) respectively, and the third perforation (403) is in communication with the heat dissipation hole (106).

8. The dustproof high-heat-dissipation vehicle-mounted backlight source according to claim 7, characterized in that: The outside of each of the two micro centrifugal fans (507) is additionally provided with a three-stage dustproof piece (107).

9. The dustproof high-heat-dissipation vehicle-mounted backlight according to claim 8, characterized in that: The fourth through hole (503) is communicated with the third through hole (403).

10. The dustproof high-heat-dissipation vehicle-mounted backlight according to claim 2, characterized in that: The aluminum alloy substrate (101) is provided with a double-layer silica gel sealing ring at a joint with the display panel, the three-stage dustproof part (107) comprises an outer layer, a middle layer and an inner layer, the outer layer of the three-stage dustproof part (107) is a stainless steel filter screen for intercepting large particles of dust, the middle layer of the three-stage dustproof part (107) is an electrospun nanofiber membrane for adsorbing fine particles, and the inner layer of the three-stage dustproof part (107) is hydrophobic dustproof cotton, which is made of polyester fiber and is used for preventing moisture and blocking.

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