Cleaning equipment and cleaning environment adjusting method
By setting multiple air outlets and inlets in the cleaning equipment and using detection and control units to adjust the air pressure and wind speed, the problem of particulate matter residue caused by unstable laminar flow in the cleaning chamber is solved, thereby improving the cleanliness and yield of semiconductor devices.
Patent Information
- Application Number
- CN202511014362.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-22
- Publication Date
- 2025-10-31
AI Technical Summary
In existing cleaning equipment, the flow control of the air inlet and outlet is difficult to effectively reflect the laminar flow stability inside the cleaning chamber, resulting in long-term residue of particulate matter, which affects the cleanliness and yield of semiconductor devices.
By setting multiple air outlets and inlets in the cleaning equipment and equipping it with pressure detection and wind speed detection units, the control unit adjusts the opening of the air outlets and the air flow rate to ensure the balance of air pressure and wind speed in the cleaning chamber and stabilize laminar flow.
Effective monitoring and stabilization of laminar flow within the cleaning chamber prevents particulate matter residue and improves the cleanliness and yield of semiconductor devices.
Smart Images

Figure CN120878593A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and in particular to a cleaning device and a method for conditioning the cleaning environment. Background Technology
[0002] In semiconductor manufacturing processes, the cleanliness of the semiconductor device (e.g., wafer) surface is one of the important factors affecting semiconductor reliability. Common semiconductor processes, such as deposition, plasma etching, spin coating of photoresist, photolithography, electroplating, etc., can introduce contaminants and / or particles onto the device surface, leading to a decrease in surface cleanliness and resulting in low semiconductor yield.
[0003] Semiconductor cleaning equipment is an important tool for keeping device surfaces clean. This equipment typically has a process area (such as a cleaning chamber) with a cleaning tank for housing the devices. During the cleaning process, environmental factors in the process area and the cleaning solution directly affect the quality of the cleaned products.
[0004] For example, if particulate matter remains in the process area for an extended period, it can easily adhere to the device surface, causing contamination. Therefore, in traditional cleaning processes, to prevent particle adhesion during the cleaning process, an air circulation system is usually added to the process area to remove particulate matter with the air.
[0005] In existing cleaning equipment, the stability of environmental factors within the cleaning chamber is typically maintained by ensuring that the airflow at the inlet and outlet of the process area is consistent. However, the airflow at the inlet and outlet cannot effectively reflect the laminar flow stability within the cleaning chamber. For example, during normal cleaning, pressure fluctuations at the inlet can occur due to factors such as malfunctions in the fan filter unit (ULPA) and exhaust system (e.g., filter blockage or exhaust system malfunctions), as well as changes in the external environment. This leads to laminar flow turbulence within the cleaning chamber, causing particles from the environment to remain in the cleaning chamber for extended periods due to inertial forces, resulting in abnormal product quality.
[0006] Therefore, it is difficult to determine the stability of laminar flow inside the process area by monitoring the flow rate of the air inlet and outlet. Since the laminar flow inside is not visible to the naked eye, it can easily lead to a decrease in product yield.
[0007] Therefore, a cleaning device and a cleaning environment conditioning method are needed to ensure the balance of the internal environment of the semiconductor cleaning device. Summary of the Invention
[0008] This invention provides a cleaning device and a cleaning environment adjustment method to ensure the balance of the internal environment of the semiconductor cleaning device.
[0009] The cleaning equipment includes: a main body, a cleaning tank, an air inlet unit, an air outlet unit, a pressure detection unit, and a wind speed detection unit;
[0010] The main body of the equipment has a cleaning chamber, the cleaning tank is disposed in the cleaning chamber, the main body of the equipment is provided with an air inlet, and the air inlet unit is disposed at the air inlet for introducing gas into the cleaning chamber;
[0011] The main body of the equipment is provided with a first air outlet and a second air outlet that communicate with the cleaning chamber. The first air outlet and the second air outlet are respectively located on both sides of the cleaning tank along the horizontal direction.
[0012] The air outlet unit is disposed at the first air outlet and the second air outlet to adjust the opening size of the first air outlet and the second air outlet;
[0013] The pressure detection unit is used to detect the air pressure inside the cleaning chamber; the wind speed detection unit is used to detect the wind speed at the first air outlet and the second air outlet, respectively.
[0014] Optionally, the main body of the device is further provided with a third air outlet, the first air outlet and the second air outlet are connected to the third air outlet, the third air outlet is connected to the outside, and the air outlet unit is also provided at the third air outlet for controlling and adjusting the opening of the third air outlet.
[0015] Optionally, the main body of the device has a transport cavity, which is connected to the cleaning cavity, and the main body of the device is provided with a fourth air outlet that is connected to the transport cavity and is connected to the outside.
[0016] The air outlet unit is also provided at the fourth air outlet for adjusting the opening size of the fourth air outlet;
[0017] The pressure detection unit is also used to detect the air pressure inside the transport chamber.
[0018] Optionally, the cleaning equipment further includes a control unit, which is connected to the air inlet unit, the air outlet unit, the pressure detection unit, and the wind speed detection unit;
[0019] The control unit is used to adjust the opening degree of the first air outlet and / or the opening degree of the second air outlet and / or the opening degree of the third air outlet and / or the opening degree of the fourth air outlet and / or the air intake flow rate of the air intake unit based on the air pressure data detected by the pressure detection unit and the wind speed data detected by the wind speed detection unit, so that the wind speed of the first air outlet and the wind speed of the second air outlet are equal, and the air pressure of the cleaning chamber is equal to the set air pressure.
[0020] The air pressure data includes the air pressure in the cleaning chamber and the air pressure in the transport chamber, and the wind speed data includes the wind speed at the first air outlet and the wind speed at the second air outlet.
[0021] Optionally, the transport chamber and the third air outlet are located on opposite sides of the cleaning chamber along the first horizontal direction, and the first air outlet and the second air outlet are located on opposite sides of the cleaning tank along the first horizontal direction.
[0022] The present invention also provides a method for adjusting the cleaning environment, comprising the following steps:
[0023] S1: Detect the air pressure P1 in the cleaning chamber of the main body of the equipment. If P1 is greater than the set air pressure P, then execute step S2.
[0024] S2: Detect the wind speed U1 at the first air outlet and the wind speed U2 at the second air outlet; the first air outlet and the second air outlet are located on the main body of the equipment, and the first air outlet and the second air outlet are connected to the cleaning chamber and are respectively located on both sides of the cleaning tank along a horizontal direction, and the cleaning tank is located in the cleaning chamber.
[0025] If U1 is equal to U2, then proceed to step S3; if U1 is not equal to U2, then proceed to step S4.
[0026] S3: Adjust the opening of the third air outlet or the fourth air outlet or the air intake flow rate of the air intake unit so that P1 approaches P; the third air outlet is located on the main body of the equipment, the first air outlet and the second air outlet are connected to the third air outlet, and the third air outlet is connected to the outside; the fourth air outlet is located on the main body of the equipment and connects the transport cavity in the main body to the outside, and the transport cavity is connected to the cleaning cavity; the air intake unit is used to introduce gas into the cleaning cavity;
[0027] S4: Adjust the opening of the first air outlet or the opening of the second air outlet so that U1 is equal to U2, and then execute step S1.
[0028] Optionally, step S3 further includes:
[0029] The air pressure P1 in the cleaning chamber and the air pressure P2 in the transport chamber of the main body of the detection equipment are compared.
[0030] If P1 is greater than P2, increase the opening of the fourth air outlet so that P1 approaches P;
[0031] If P1 is less than P2, increase the opening of the third air outlet so that P1 approaches P;
[0032] If P1 equals P2, increase the opening of the third air outlet so that P1 approaches P.
[0033] Optionally, step S1 further includes: if P1 is less than the set air pressure P, then step S5 is executed;
[0034] S5: Detect the wind speed U1 at the first air outlet and the wind speed U2 at the second air outlet. If U1 is equal to U2, proceed to step S6. If U1 is not equal to U2, proceed to step S7.
[0035] S6: Adjust the opening of the third air outlet or the opening of the fourth air outlet or the air intake flow rate of the air intake unit so that P1 approaches P;
[0036] S7: Adjust the opening of the first air outlet or the opening of the second air outlet so that U1 equals U2, and then execute step S1.
[0037] Optionally, step S6 includes:
[0038] The air pressure P1 in the cleaning chamber and the air pressure P2 in the transport chamber are tested in the main body of the equipment.
[0039] If P1 is greater than P2, increase the intake flow rate of the intake unit so that P1 approaches P;
[0040] If P1 is less than P2, reduce the opening of the third air outlet so that P1 approaches P;
[0041] If P1 equals P2, reduce the opening of the fourth air outlet so that P1 approaches P.
[0042] Optionally, step S1 further includes: if P1 is equal to the set air pressure P, then step S8 is executed;
[0043] S8: Detect the wind speed U1 at the first air outlet and the wind speed U2 at the second air outlet. If U1 is equal to U2, the adjustment ends. If U1 is not equal to U2, proceed to step S9.
[0044] S9: Adjust the opening of the first air outlet or the opening of the second air outlet so that U1 equals U2, and then execute step S1.
[0045] In summary, the cleaning equipment includes: a main body, a cleaning tank, an air inlet unit, an air outlet unit, a pressure detection unit, and a wind speed detection unit; the main body has a cleaning chamber, the cleaning tank is disposed within the cleaning chamber, the main body has an air inlet, and the air inlet unit is disposed at the air inlet for introducing gas into the cleaning chamber; the main body has a first air outlet and a second air outlet communicating with the cleaning chamber, the first air outlet and the second air outlet being respectively disposed on both sides of the cleaning tank along the horizontal direction; the air outlet unit is disposed at the first air outlet and the second air outlet for adjusting the opening size of the first air outlet and the second air outlet; the pressure detection unit is used to detect the air pressure in the cleaning chamber; and the wind speed detection unit is used to detect the wind speed at the first air outlet and the second air outlet respectively.
[0046] The cleaning equipment of this invention can introduce gas into the cleaning chamber through the air inlet and exit through the first and second air outlets on both sides of the cleaning tank. The first and second air outlets are located on both sides of the cleaning tank in the horizontal direction, which helps to divert the gas and ensure the gas balance on both sides of the cleaning tank. This improves the phenomenon of long-term particulate matter residue caused by local laminar flow turbulence in the cleaning chamber, and ensures that the particulate matter in the cleaning chamber is smoothly discharged from the first and second air outlets with the gas flow. During the process of taking out the semiconductor device from the cleaning tank after cleaning, it can prevent the semiconductor device from being contaminated by particulate matter.
[0047] The cleaning device of the present invention can adjust the air intake volume of the air intake unit and the opening of the first air outlet and the second air outlet to make the air pressure in the cleaning chamber equal to the set air pressure, and at the same time make the flow velocities of the first air outlet and the second air outlet equal. This ensures both stable air pressure in the cleaning chamber and stable laminar flow in the cleaning chamber, thereby improving the phenomenon of long-term particulate matter residue caused by local laminar flow turbulence in the cleaning chamber.
[0048] The cleaning equipment of this invention, by setting a first air outlet and a second air outlet on both sides of the horizontal cleaning tank, and by detecting the flow velocity relationship between the first air outlet and the second air outlet, can effectively provide feedback on the laminar flow stability inside the cleaning chamber, thereby effectively monitoring the laminar flow inside the cleaning chamber, realizing the controllability of the laminar flow inside the cleaning chamber, and helping to solve the phenomenon of semiconductor device contamination caused by particulate matter residue due to laminar flow instability. Attached Figure Description
[0049] Figure 1 This is a schematic diagram of the structure of a cleaning device according to an embodiment of the present invention.
[0050] In the attached diagram:
[0051] 10-Main body of equipment; 101-Cleaning chamber; 102-Transfer chamber; 11-Air inlet; 12-First air outlet; 13-Second air outlet; 14-Third air outlet; 15-Fourth air outlet;
[0052] 20 - Cleaning tank;
[0053] 30 - Intake unit;
[0054] 40 - Air outlet unit; 41 - First valve; 42 - Second valve; 43 - Third valve; 44 - Fourth valve;
[0055] 50 - Pressure detection unit; 51 - First pressure sensor; 52 - Second pressure sensor;
[0056] 60 - Wind speed detection unit; 61 - First wind speed sensor; 62 - Second wind speed sensor;
[0057] 71 - First flow channel; 72 - Second flow channel;
[0058] a - First direction. Detailed Implementation
[0059] The cleaning equipment and cleaning environment conditioning method proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this invention will become clearer from the following description. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this invention.
[0060] In this invention, "outer diameter" and "inner diameter" refer to the diameter of a circular structure, while for a non-circular structure, the inner diameter refers to the diameter of its inscribed circle and the outer diameter refers to the diameter of its circumscribed circle. "Axial direction" refers to the direction of the central axis of a cylindrical rod, while for a non-cylindrical rod, the axial direction refers to the length direction of the rod.
[0061] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Additionally, as used in this invention, “installed,” “connected,” “joined,” and “set” on one element by another should be interpreted broadly, generally indicating only a connection, coupling, mating, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located inside, outside, above, below, or to one side of another element, unless otherwise explicitly stated. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances. Furthermore, directional terms such as above, below, up, down, upward, downward, left, right, etc., are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.
[0062] Please refer to Figure 1 As shown, this embodiment provides a cleaning device, including a device body 10, a cleaning tank 20, an air inlet unit 30, an air outlet unit 40, a pressure detection unit 50, and a wind speed detection unit 60.
[0063] The main body 10 of the device has a cleaning chamber 101, which is isolated from the outside as an independent space, providing an independent environment for cleaning semiconductor devices. The cleaning tank 20 is set as an independent component in the cleaning chamber 101. Cleaning fluid can be introduced into the cleaning tank 20 to clean the semiconductor devices placed inside it. The cleaning tank 20 is consistent with the existing structure and will not be described in detail here.
[0064] The main body 10 of the device is provided with an air inlet 11, and the air intake unit 30 is disposed at the air inlet 11 for introducing gas into the cleaning chamber 101. The air intake unit 30 includes a fan and a filter element, wherein the filter element is built into the air inlet 11 to filter the incoming air to ensure the cleanliness of the air entering the cleaning chamber 101. The air outlet of the fan is connected to the air inlet 11, and the fan is located on the side of the filter element away from the cleaning chamber 101 to ensure that the air introduced by the fan flows into the cleaning chamber 101 after passing through the filter element. In addition, the air intake unit 30 may also include a frequency converter, which is connected to the fan. By controlling the frequency converter, the operating conditions of the fan can be adjusted to regulate the ventilation volume of the fan per unit time.
[0065] The main body 10 of the equipment is provided with a first air outlet 12 and a second air outlet 13 communicating with the cleaning chamber 101. The first air outlet 12 and the second air outlet 13 are respectively located in the cleaning tank 20 along the horizontal direction. Figure 1 The first direction 'a' in the middle also corresponds to Figure 1 The gas introduced through the vent 11 flows within the cleaning chamber 101 and is then discharged through the first vent 12 and the second vent 13.
[0066] Combination Figure 1 As shown, the air inlet 11 is located at the top of the main body 10 of the equipment and directly above the cleaning tank 20. Therefore, the gas entering through the air inlet 11 flows downward along the cleaning tank 20 and then flows out through the first air outlet 12 and the second air outlet 13 on both sides of the cleaning tank 20. This helps to improve the phenomenon of long-term residue of particulate matter caused by laminar flow turbulence in the cleaning chamber 101, and ensures that the particulate matter in the cleaning chamber 101 is smoothly discharged from the first air outlet 12 and the second air outlet 13 with the gas flow.
[0067] The air outlet unit 40 is disposed at the first air outlet 12 and the second air outlet 13 to adjust the opening size of the first air outlet 12 and the second air outlet 13. Figure 1 As shown, the air outlet unit 40 includes a first valve 41 and a second valve 42. The first valve 41 is located at the first air outlet 12, and the second valve 42 is located at the second air outlet 13. The opening degree of each air outlet can be adjusted by adjusting the opening degree of the valves.
[0068] The pressure detection unit 50 is used to detect the air pressure inside the cleaning chamber 101; the wind speed detection unit 60 is used to detect the wind speed at the first air outlet 12 and the second air outlet 13 respectively.
[0069] Combination Figure 1As shown, the pressure detection unit 50 includes a first pressure sensor 51, which is built into the cleaning chamber 101. Preferably, the first pressure sensor 51 is located approximately below the air inlet 11 to detect the air pressure in the cleaning chamber 101 and ensure that the air pressure in the cleaning chamber 101 is equal to the set air pressure.
[0070] Please continue to refer to this. Figure 1 As shown, the wind speed detection unit 60 includes a first wind speed sensor 61 and a second wind speed sensor 62. The first wind speed sensor 61 is disposed at the first air outlet 12 to detect the wind speed at the first air outlet 12, and the second wind speed sensor 62 is disposed at the second air outlet 13 to detect the wind speed at the second air outlet 13. The first wind speed sensor 61 can be disposed on the side of the first air outlet 12 closer to the cleaning chamber 101 or on the side farther away from the cleaning chamber 101; its specific installation position can be adjusted based on actual conditions. The installation position of the second wind speed sensor 62 is similar to that of the first wind speed sensor 61, and will not be described again here. The purpose of the first wind speed sensor 61 and the second wind speed sensor 62 is to detect the gas flow rate at the first air outlet 12 and the second air outlet 13 to ensure that the flow rates at the two outlets are equal, thereby ensuring the stability of the laminar flow within the cleaning chamber 101.
[0071] The cleaning device of the present invention can introduce gas into the cleaning chamber 101 through the air inlet 11 and exit through the first air outlet 12 and the second air outlet 13 on both sides of the cleaning tank 20. The first air outlet 12 and the second air outlet 13 are located on both sides of the cleaning tank 20 in the horizontal direction, which helps to divert the gas and ensure the gas balance on both sides of the cleaning tank 20. This improves the phenomenon of long-term residue of particulate matter caused by local laminar flow turbulence in the cleaning chamber 101, and ensures that the particulate matter in the cleaning chamber 101 is smoothly discharged from the first air outlet 12 and the second air outlet 13 with the gas flow. During the process of taking out the semiconductor device from the cleaning tank after cleaning, the semiconductor device can be prevented from being contaminated by particulate matter.
[0072] The cleaning device of the present invention can adjust the air intake volume of the air intake unit 30 and the opening of the first air outlet 12 and the second air outlet 13 to make the air pressure in the cleaning chamber 101 equal to the set air pressure, and at the same time make the flow velocity of the first air outlet 12 and the second air outlet 13 equal. This ensures the stability of the air pressure in the cleaning chamber 101 and the stability of the laminar flow in the cleaning chamber 101, thereby improving the phenomenon of long-term particulate matter residue caused by local laminar flow turbulence in the cleaning chamber 101.
[0073] The cleaning equipment of the present invention, by setting a first air outlet 12 and a second air outlet 13 on both sides of the cleaning tank 20 horizontally, and by detecting the flow velocity relationship between the first air outlet 12 and the second air outlet 13, can effectively provide feedback on the laminar flow stability inside the cleaning chamber 101, thereby effectively monitoring the laminar flow in the cleaning chamber 101, realizing the controllability of the laminar flow in the cleaning chamber 101, and helping to solve the phenomenon of semiconductor devices being contaminated due to particulate matter residue caused by unstable laminar flow.
[0074] Please continue to refer to this. Figure 1 As shown, the main body 10 of the device is also provided with a third air outlet 14. The first air outlet 12 and the second air outlet 13 are connected to the third air outlet 14. The third air outlet 14 is connected to the outside. The air outlet unit 40 is also provided on the third air outlet 14 to control and adjust the opening degree of the third air outlet 14.
[0075] The first air outlet 12 is located at Figure 1 On the left side of the intermediate cleaning tank 20, the first air outlet 12 opens downwards; the second air outlet 13 is located... Figure 1 The second air outlet 13 is located on the right side of the cleaning tank 20 and opens horizontally to the right. The third air outlet 14 is located on the top of the main body 10 and opens upwards, positioned above the cleaning tank 20 on the right. The main body 10 has an internal layer to form a flow channel. The first air outlet 12 is connected to the third air outlet 14 through a first flow channel 71. The first flow channel 71 has an approximately U-shaped structure. One end of the first flow channel 71 connects to the first air outlet 12 and extends downwards from the side (left side) of the cleaning tank 20 to the bottom of the cleaning tank 20. It then extends horizontally from the bottom of the cleaning tank 20 to the other side (right side) of the cleaning tank 20, and then extends vertically upwards to connect with the third air outlet 14. The second air outlet 13 is connected to the third air outlet 14 through a second flow channel 72. The second flow channel 72 is a vertical straight channel. The second air outlet 13 connects to the side of the second flow channel 72, and the second flow channel 72 extends vertically to connect with the third air outlet 14.
[0076] In addition, the air outlet unit 40 also includes a third valve 43, which is located at the third air outlet 14 to control the overall air flow rate. The air pressure inside the cleaning chamber 101 can be adjusted by regulating the air intake of the air intake unit 30 and the air output of the third air outlet 14 via the third valve 43. The opening of the first air outlet 12 and the second air outlet 13 can be controlled by the first valve 41 and the second valve 42, thereby adjusting the flow rate at the two air outlets to regulate the laminar flow inside the cleaning chamber 101.
[0077] Furthermore, the main body 10 of the device has a transport cavity 102, which is connected to the cleaning cavity 101. That is, the transport cavity 102 and the third air outlet 14 are located on opposite sides of the cleaning cavity 101 along the first horizontal direction a. Figure 1 By combining the arrangement of the first air outlet 12 and the second air outlet 13 (arranged in the left and right directions of the first horizontal direction a), the gas entering the cleaning chamber 101 can be diverted to the left and right sides along the first horizontal direction a to ensure a better laminar flow effect.
[0078] Combination Figure 1 As shown, the transport cavity 102 is located on the left side of the cleaning cavity 101. The transport cavity 102 has a transport arm. The transport cavity 102 serves as a transfer station for transporting semiconductor devices. It is used to transport semiconductor devices to be cleaned into the cleaning cavity 101, or to transport cleaned semiconductor devices into the transport cavity 102 and then to the outside of the equipment body.
[0079] The main body 10 of the equipment is provided with a fourth air outlet 15 that communicates with the transport chamber 102 and is connected to the outside. The fourth air outlet 15 is located on the lower left side of the main body 10 of the equipment. When the fourth air outlet 15 is needed to adjust the airflow, the above arrangement allows the gas passing through the air inlet 11 to flow smoothly to the lower left without affecting the stability of the laminar flow in the cleaning chamber 101.
[0080] The air outlet unit 40 also includes a fourth valve 44, which is disposed at the fourth air outlet 15 for adjusting the opening size of the fourth air outlet 15.
[0081] The pressure detection unit 50 also includes a second pressure sensor 52, which is built into the transport cavity 102 to detect the air pressure inside the transport cavity 102.
[0082] The aforementioned fourth air outlet 15 is introduced into the transport chamber 102, serving as a diversion point for the airflow. This facilitates the adjustment of the air pressure within the cleaning chamber 101 and has little or no impact on the flow rates of the first air outlet 12 and the second air outlet 13. This allows for more flexible adjustment of both the air pressure within the cleaning chamber 101 and the flow rates of the first and second air outlets 12 and 13, thus balancing the adjustment of both.
[0083] Furthermore, the cleaning equipment also includes a control unit, which is connected to the air inlet unit 30, the air outlet unit 40, the pressure detection unit 50, and the wind speed detection unit 60.
[0084] In this embodiment, the frequency converter of the intake unit 30 can be connected to the control unit. The first valve 41, second valve 42, third valve 43, and fourth valve 44 of the exhaust unit 40 are all connected to the control unit. Each of these valves can be a solenoid valve or other valve with control functions, and can be a ball valve, butterfly valve, or valve of other structures. The first pressure sensor 51 and second pressure sensor 52 of the pressure detection unit 50 are connected to the control unit, and the first wind speed sensor 61 and second wind speed sensor 62 of the wind speed detection unit 60 are connected to the control unit.
[0085] The first pressure sensor 51 and the second pressure sensor 52 transmit the detected air pressure data of the cleaning chamber 101 and the transport chamber 102 to the control unit. Similarly, the first wind speed sensor 61 and the second wind speed sensor 62 transmit the detected wind speed data of the first air outlet 12 and the second air outlet 13 to the control unit. The control unit controls the operation of the first valve 41, the second valve 42, the third valve 43, and the fourth valve 44 based on the aforementioned air pressure and wind speed data. This adjusts the opening of the first air outlet 12, the second air outlet 13, the third air outlet 14, and the fourth air outlet 15. The control unit can also adjust the airflow of the air intake unit 30 to ensure that the wind speeds of the first air outlet 12 and the second air outlet 13 are equal, and that the air pressure in the cleaning chamber 101 is equal to the set air pressure. This ensures that the air pressure in the cleaning chamber 101 meets the cleaning requirements and that the laminar flow within the cleaning chamber 101 is stable, mitigating the long-term residue of particulate matter caused by laminar flow turbulence within the cleaning chamber 101. In specific adjustments, the control unit can adjust one or a combination of the opening degree of the first air outlet 12, the opening degree of the second air outlet 13, the opening degree of the third air outlet 14, the opening degree of the fourth air outlet 15, and the air intake flow rate of the air intake unit 30.
[0086] In this embodiment, the control unit typically includes at least one processor, which may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.
[0087] The at least one processor can communicate with multiple peripheral devices via a bus subsystem. These peripheral devices may include storage systems, user interface input devices, user interface output devices, and network interfaces.
[0088] The control unit described above is intended only as an example to illustrate just one embodiment of the invention. Due to the ever-changing nature of computers and networks, the control unit may also have a configuration that differs from the controller depicted above in other alternative embodiments, which will not be elaborated here.
[0089] In this embodiment, a method for adjusting the cleaning environment is also provided, including the following steps:
[0090] S1: Detect the air pressure P1 in the cleaning chamber 101 of the main body 10 of the detection device. If P1 is greater than the set air pressure P, then execute step S2.
[0091] The air pressure P1 of the cleaning chamber 101 is detected by the first pressure sensor 51. The first pressure sensor 51 transmits the detected air pressure P1 to the control unit. The set air pressure P can be input through the user interface input device and the data is uploaded to the control unit. The control unit compares the collected air pressure P1 of the cleaning chamber 101 with the set air pressure P.
[0092] When comparing air pressure P1 with the set air pressure P, if the difference between the two is within the threshold range, they are considered equal. For example, if the difference is within ±3 Pa, they are considered equal. If the difference is outside the threshold range, the relative relationship between the two is determined by the relative magnitude of P1 and P.
[0093] S2: Detect the wind speed U1 at the first air outlet 12 and the wind speed U2 at the second air outlet 13;
[0094] If U1 equals U2, proceed to step S3; if U1 does not equal U2, proceed to step S4.
[0095] When comparing the wind speed U1 of the first air outlet 12 and the wind speed U2 of the second air outlet 13, if the difference between the two is within the threshold range, they are considered equal. For example, if the difference is within ±0.3 m / min, they are considered equal. If the difference is outside the threshold range, the relative relationship between the two is determined by the relative magnitude of U1 and U2.
[0096] The wind speed U1 at the first air outlet 12 is detected by the first wind speed sensor 61, and the wind speed U2 at the second air outlet 13 is detected by the second wind speed sensor 62.
[0097] The first air outlet 12 and the second air outlet 13 are disposed on the main body 10 of the equipment. The first air outlet 12 and the second air outlet 13 are connected to the cleaning chamber 101 and are respectively disposed on both sides of the cleaning tank 20 along a horizontal direction. The cleaning tank 20 is disposed in the cleaning chamber 101. The first wind speed sensor 61 is disposed on the first air outlet 12 and the second wind speed sensor 62 is disposed on the second air outlet 13. The relative positional relationship between the first air outlet 12, the second air outlet 13, the first wind speed sensor 61 and the second wind speed sensor 62 in the main body 10 of the equipment and the cleaning tank 20 has been described in detail above and will not be repeated here.
[0098] S3: Adjust the opening of the third air outlet 14 or the opening of the fourth air outlet 15 or the air intake flow of the air intake unit 30 so that P1 approaches P. When P1 equals P, stop adjusting.
[0099] The third air outlet 14 is disposed on the device body 10, and the first air outlet 12 and the second air outlet 13 are connected to the third air outlet 14, which is connected to the outside. The fourth air outlet 15 is disposed on the device body 10 and connects the transport cavity 102 in the device body 10 to the outside. The transport cavity 102 is connected to the cleaning cavity 101. The air inlet unit 30 is used to introduce gas into the cleaning cavity 101.
[0100] A third valve 43 is installed on the third air outlet 14, and a fourth valve 44 is installed on the fourth air outlet 15. The control unit can send a signal to the third valve 43 or the fourth valve 44 to activate them, thereby adjusting the opening degree of the third air outlet 14 or the fourth air outlet 15. In addition, the control unit can send a signal to the air intake unit 30, and the frequency converter of the air intake unit 30 can adjust the operating conditions of the fan, thereby adjusting the air intake flow rate.
[0101] The configuration of the third air outlet 14, the configuration of the fourth air outlet 15, the opening control method of the third air outlet 14 and the fourth air outlet 15, and the air intake flow control method of the air intake unit 30 are detailed in the relevant content of the cleaning equipment, and will not be repeated here.
[0102] S4: Adjust the opening of the first air outlet 12 or the second air outlet 13 so that U1 equals U2, and then execute step S1;
[0103] When U1 is greater than U2, the control unit sends a signal to the first valve 41, increasing the opening of the first valve 41. This increases the opening of the first air outlet 12, causing the flow velocity U1 at the first air outlet 12 to decrease, making U1 approach U2, until U1 equals U2. Increasing the opening of the first valve 41 also reduces the flow resistance, thereby reducing the air pressure P1 in the cleaning chamber 101. After the flow velocity adjustment is complete, the air pressure P1 in the cleaning chamber 101 is re-detected, and the relationship between P1 and P is determined (i.e., step S1 is executed).
[0104] Similarly, when U1 is less than U2, the opening of the second valve 42 is increased to increase the opening of the second air outlet 13. At this time, the flow velocity U2 of the second air outlet 13 decreases, causing U2 to approach U1, until U2 equals U1. Increasing the opening of the second valve 42 also helps to reduce the flow resistance of the second valve 42, thereby reducing the air pressure P1 in the cleaning chamber 101. After the flow velocity adjustment is completed, the air pressure P1 of the cleaning chamber 101 is re-detected, and the relationship between P1 and P is determined (i.e., step S1 is executed).
[0105] Furthermore, step S3 includes:
[0106] The air pressure P1 in the cleaning chamber 101 of the main body 10 of the equipment is detected by the first pressure sensor 51, and the air pressure P2 in the transport chamber 102 is detected by the second pressure sensor 52.
[0107] The air pressure P1 and air pressure P2 data are transmitted to the control unit, which then determines their magnitudes.
[0108] If the air pressure P1 in the cleaning chamber 101 is greater than the air pressure P2 in the transport chamber 102, the control unit sends a signal to the fourth valve 44, causing the opening of the fourth valve 44 to increase, thereby increasing the opening of the fourth air outlet 15 to release pressure in the transport chamber 102. This reduces the air pressure P1 in the cleaning chamber 101 to approach the air pressure P, until the air pressure P1 equals the air pressure P and the adjustment stops. In this adjustment method, reducing the air pressure in the cleaning chamber 101 by releasing pressure in the transport chamber 102 can minimize the impact on the laminar flow stability within the cleaning chamber 101, thus ensuring the stability of the environment within the cleaning chamber 101.
[0109] If the air pressure P1 in the cleaning chamber 101 is less than the air pressure P2 in the transport chamber 102, the control unit sends a signal to the third valve 43, causing the opening of the third valve 43 to increase. This increases the opening of the third air outlet 14, simultaneously increasing the exhaust volume of the first air outlet 12 and the second air outlet 13 to depressurize the cleaning chamber 101. This reduces the air pressure P1 to approach the air pressure P, until the air pressure P1 equals the air pressure P and the adjustment stops. This adjustment method, by increasing the opening of the third air outlet 14 to depressurize, helps to balance the flow rates of the first air outlet 12 and the second air outlet 13, maintaining their dynamic equilibrium. It also helps to accelerate the gas replacement speed within the cleaning chamber 101, improving the cleaning effect, and simultaneously helps prevent gas leakage.
[0110] If the air pressure P1 in the cleaning chamber 101 is equal to the air pressure P2 in the transport chamber 102, the control unit sends a signal to the third valve 43, causing the opening of the third valve 43 to increase. This increases the opening of the third air outlet 14, simultaneously increasing the exhaust volume of the first air outlet 12 and the second air outlet 13 to depressurize the cleaning chamber 101. This causes the air pressure P1 to decrease and approach the air pressure P, until the air pressure P1 equals the air pressure P and the adjustment stops. This adjustment method, by increasing the opening of the third air outlet 14 to depressurize, helps to balance the flow rates of the first air outlet 12 and the second air outlet 13, maintaining their dynamic equilibrium. It also helps to accelerate the gas replacement speed within the cleaning chamber 101, improving the cleaning effect, and simultaneously helps to prevent gas leakage.
[0111] In other alternative embodiments, in the various cases of U1 and U2 described above, the pressure can be adjusted by adjusting one or a combination of the opening degree of the first air outlet, the opening degree of the second air outlet, the opening degree of the third air outlet, the opening degree of the fourth air outlet, and the air intake volume of the air intake unit. The specific adjustment method can be set based on actual needs.
[0112] Furthermore, if the air pressure P1 of the cleaning chamber 101 is less than the set air pressure P in step S1, then step S5 is executed.
[0113] S5: Detect the wind speed U1 of the first air outlet 12 and the wind speed U2 of the second air outlet 13. If U1 is equal to U2, proceed to step S6. If U1 is not equal to U2, proceed to step S7.
[0114] S6: Adjust the opening of the third air outlet 14 or the opening of the fourth air outlet 15 or the air intake flow of the air intake unit 30 so that P1 approaches P. When P1 equals P, stop adjusting.
[0115] S7: Adjust the opening of the first air outlet 12 or the opening of the second air outlet 13 so that U1 equals U2, and then execute step S1.
[0116] When U1 is greater than U2, the opening of the second valve 42 is reduced to decrease the opening of the second air outlet 13. At this time, the flow velocity U2 at the second air outlet 13 decreases, causing U2 to approach U1, until U2 equals U1. Reducing the opening of the second valve 42 also increases the flow resistance of the second valve 42, thereby increasing the air pressure P1 in the cleaning chamber 101. After the flow velocity adjustment is completed, the air pressure P1 in the cleaning chamber 101 is re-detected, and the relationship between P1 and P is determined (i.e., step S1 is executed).
[0117] Similarly, when U1 is less than U2, the opening of the first valve 41 is reduced to increase the opening of the first air outlet 12. At this time, the flow velocity U1 at the first air outlet 12 decreases, causing U1 to approach U2, until U1 equals U2. Reducing the opening of the first valve 41 also increases the flow resistance at the first air outlet 12, thereby increasing the air pressure P1 in the cleaning chamber 101. After the flow velocity adjustment is completed, the air pressure P1 in the cleaning chamber 101 is re-detected, and the relationship between P1 and P is determined (i.e., step S1 is executed).
[0118] Furthermore, step S6 includes:
[0119] The air pressure P1 in the cleaning chamber 101 of the main body 10 of the equipment is detected by the first pressure sensor 51, and the air pressure P2 in the transport chamber 102 is detected by the second pressure sensor 52.
[0120] The air pressure P1 and air pressure P2 data are transmitted to the control unit, which then determines their magnitudes.
[0121] If the air pressure P1 in the cleaning chamber 101 is greater than the air pressure P2 in the transport chamber 102, a signal is sent through the control unit to adjust the operating conditions of the fan via the frequency converter, thereby increasing the air intake flow rate of the air intake unit 30. This causes P1 to increase and approach P, until the air pressure P1 equals the air pressure P and the adjustment stops. In this adjustment method, increasing the air intake flow rate increases the air pressure P1 in the cleaning chamber 101, which helps to accelerate the gas replacement speed in the cleaning chamber 101 and improve the cleaning effect.
[0122] If the air pressure P1 in the cleaning chamber 101 is less than the air pressure P2 in the transport chamber 102, the control unit sends a signal to the third valve 43, causing the opening of the third valve 43 to decrease. This reduces the opening of the third air outlet 14, simultaneously reducing the exhaust volume of the first air outlet 12 and the second air outlet 13 to maintain pressure in the cleaning chamber 101. This causes the air pressure P1 to increase and approach the air pressure P, until the air pressure P1 equals the air pressure P and the adjustment stops. This adjustment method, which uses the reduction of the opening of the third air outlet 14 to maintain pressure, helps ensure the dynamic balance between the first air outlet 12 and the second air outlet 13, and also helps prevent gas leakage.
[0123] If the air pressure P1 in the cleaning chamber 101 is equal to P2 in the transport chamber 102, the control unit sends a signal to the fourth valve 44, causing the opening of the fourth valve 44 to decrease, thereby reducing the opening of the fourth air outlet 15 to maintain pressure in the transport chamber 102. This causes the air pressure P1 in the cleaning chamber 101 to increase and approach the air pressure P, until the air pressure P1 equals the air pressure P and the adjustment stops. In this adjustment method, increasing the air pressure in the cleaning chamber 101 by maintaining pressure in the transport chamber 102 can minimize the impact on the laminar flow stability within the cleaning chamber 101, thus ensuring the stability of the environment within the cleaning chamber 101.
[0124] In other alternative embodiments, in the various cases of U1 and U2 described above, the pressure can be adjusted by adjusting one or a combination of the opening degree of the first air outlet, the opening degree of the second air outlet, the opening degree of the third air outlet, the opening degree of the fourth air outlet, and the air intake volume of the air intake unit. The specific adjustment method can be set based on actual needs.
[0125] Furthermore, if P1 is equal to the set air pressure P in step S1, then step S8 is executed.
[0126] S8: Detect the wind speed U1 of the first air outlet 12 and the wind speed U2 of the second air outlet 13. If U1 is equal to U2, the adjustment ends. If U1 is not equal to U2, proceed to step S9.
[0127] S9: Adjust the opening of the first air outlet 12 or the second air outlet 13 so that U1 equals U2, and then execute step S1.
[0128] Specifically, when U1 is greater than U2, the opening of the first valve 41 can be increased to increase the opening of the first outlet 12. At this time, the flow velocity U1 of the first outlet 12 decreases until it equals U2, and then step S1 is executed again. When U1 is less than U2, the opening of the second valve 42 can be increased to increase the opening of the second outlet 13. At this time, the flow velocity U2 of the second outlet 13 decreases until it equals U1, and then step S1 is executed again.
[0129] In other alternative embodiments, if U1 is not equal to U2, the flow rate can be adjusted by adjusting one or a combination of the opening of the first outlet and the opening of the second outlet. The specific adjustment method can be set based on actual needs.
[0130] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0131] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.
Claims
1. A cleaning device, characterized in that, include: The equipment consists of a main body, a cleaning tank, an air inlet unit, an air outlet unit, a pressure detection unit, and a wind speed detection unit. The main body of the equipment has a cleaning chamber, the cleaning tank is disposed in the cleaning chamber, the main body of the equipment is provided with an air inlet, and the air inlet unit is disposed at the air inlet for introducing gas into the cleaning chamber; The main body of the equipment is provided with a first air outlet and a second air outlet that communicate with the cleaning chamber. The first air outlet and the second air outlet are respectively located on both sides of the cleaning tank along the horizontal direction. The air outlet unit is disposed at the first air outlet and the second air outlet to adjust the opening size of the first air outlet and the second air outlet; The pressure detection unit is used to detect the air pressure inside the cleaning chamber; The wind speed detection unit is used to detect the wind speed at the first air outlet and the second air outlet, respectively.
2. The cleaning equipment as described in claim 1, characterized in that, The main body of the device is also provided with a third air outlet. The first air outlet and the second air outlet are connected to the third air outlet. The third air outlet is connected to the outside. The air outlet unit is also provided at the third air outlet for controlling and adjusting the opening of the third air outlet.
3. The cleaning equipment as described in claim 2, characterized in that, The main body of the equipment has a transport cavity, which is connected to the cleaning cavity. The main body of the equipment is provided with a fourth air outlet that is connected to the transport cavity and is connected to the outside. The air outlet unit is also provided at the fourth air outlet for adjusting the opening size of the fourth air outlet; The pressure detection unit is also used to detect the air pressure inside the transport chamber.
4. The cleaning equipment as described in claim 3, characterized in that, The cleaning equipment also includes a control unit, which is connected to the air inlet unit, the air outlet unit, the pressure detection unit, and the wind speed detection unit. The control unit is used to adjust the opening degree of the first air outlet and / or the opening degree of the second air outlet and / or the opening degree of the third air outlet and / or the opening degree of the fourth air outlet and / or the air intake flow rate of the air intake unit based on the air pressure data detected by the pressure detection unit and the wind speed data detected by the wind speed detection unit, so that the wind speed of the first air outlet and the wind speed of the second air outlet are equal, and the air pressure of the cleaning chamber is equal to the set air pressure. The air pressure data includes the air pressure in the cleaning chamber and the air pressure in the transport chamber, and the wind speed data includes the wind speed at the first air outlet and the wind speed at the second air outlet.
5. The cleaning equipment as described in claim 3, characterized in that, The transport chamber and the third air outlet are located on opposite sides of the cleaning chamber along the first horizontal direction, and the first air outlet and the second air outlet are located on opposite sides of the cleaning tank along the first horizontal direction.
6. A method for conditioning a cleaning environment, characterized in that, Includes the following steps: S1: Detect the air pressure P1 in the cleaning chamber of the main body of the equipment. If P1 is greater than the set air pressure P, then execute step S2. S2: Detect the wind speed U1 at the first air outlet and the wind speed U2 at the second air outlet; the first air outlet and the second air outlet are located on the main body of the equipment, and the first air outlet and the second air outlet are connected to the cleaning chamber and are respectively located on both sides of the cleaning tank along a horizontal direction, and the cleaning tank is located in the cleaning chamber. If U1 is equal to U2, then proceed to step S3; if U1 is not equal to U2, then proceed to step S4. S3: Adjust the opening of the third air outlet or the fourth air outlet or the air intake flow rate of the air intake unit so that P1 approaches P; the third air outlet is located on the main body of the equipment, the first air outlet and the second air outlet are connected to the third air outlet, and the third air outlet is connected to the outside; the fourth air outlet is located on the main body of the equipment and connects the transport cavity in the main body to the outside, and the transport cavity is connected to the cleaning cavity; the air intake unit is used to introduce gas into the cleaning cavity; S4: Adjust the opening of the first air outlet or the opening of the second air outlet so that U1 is equal to U2, and then execute step S1.
7. The cleaning environment conditioning method as described in claim 6, characterized in that, Step S3 further includes: The air pressure P1 in the cleaning chamber and the air pressure P2 in the transport chamber of the main body of the detection equipment are compared. If P1 is greater than P2, increase the opening of the fourth air outlet so that P1 approaches P; If P1 is less than P2, increase the opening of the third air outlet so that P1 approaches P; If P1 equals P2, increase the opening of the third air outlet so that P1 approaches P.
8. The cleaning environment conditioning method as described in claim 6, characterized in that, Step S1 further includes: if P1 is less than the set air pressure P, then step S5 is executed; S5: Detect the wind speed U1 at the first air outlet and the wind speed U2 at the second air outlet. If U1 is equal to U2, proceed to step S6. If U1 is not equal to U2, proceed to step S7. S6: Adjust the opening of the third air outlet or the opening of the fourth air outlet or the air intake flow rate of the air intake unit so that P1 approaches P; S7: Adjust the opening of the first air outlet or the opening of the second air outlet so that U1 equals U2, and then execute step S1.
9. The cleaning environment conditioning method as described in claim 8, characterized in that, Step S6 includes: The air pressure P1 in the cleaning chamber and the air pressure P2 in the transport chamber are tested in the main body of the equipment. If P1 is greater than P2, increase the intake flow rate of the intake unit so that P1 approaches P; If P1 is less than P2, reduce the opening of the third air outlet so that P1 approaches P; If P1 equals P2, reduce the opening of the fourth air outlet so that P1 approaches P.
10. The cleaning environment conditioning method as described in claim 6, characterized in that, Step S1 further includes: if P1 is equal to the set air pressure P, then step S8 is executed; S8: Detect the wind speed U1 at the first air outlet and the wind speed U2 at the second air outlet. If U1 is equal to U2, the adjustment ends. If U1 is not equal to U2, proceed to step S9. S9: Adjust the opening of the first air outlet or the opening of the second air outlet so that U1 equals U2, and then execute step S1.