Silicon wafer carrying device, silicon wafer drifting prevention system and silicon wafer drifting prevention method
By designing a silicon wafer handling device, the synchronous movement of the basket and the clamping structure was achieved, solving the problem of silicon wafers floating, improving production efficiency and silicon wafer quality, and avoiding additional equipment investment.
Patent Information
- Application Number
- CN202510990882.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-17
- Publication Date
- 2025-10-31
AI Technical Summary
The existing basket structure is prone to causing silicon wafers to float during the rough polishing process, affecting production rhythm and capacity. Moreover, the existing solutions require additional equipment investment and complex precision requirements.
A silicon wafer handling device is adopted, including a base frame, a first pick-and-place mechanism and a second pick-and-place mechanism. The basket is picked up and placed synchronously through the first hook structure and the second hook structure. Combined with the hook structure and the pressing structure, the basket and the pressing structure are moved synchronously to avoid the silicon wafer from floating.
It improved the production pace, prevented silicon wafers from drifting and falling during handling, enhanced the consistency and stability of picking and placing, adapted to structures of different heights, and improved the quality of silicon wafers.
Smart Images
Figure CN120878613A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heterojunction solar cell processing technology, specifically to a silicon wafer handling device, an anti-drift wafer system, and a method. Background Technology
[0002] Currently, in the production process of heterojunction solar cells, the silicon wafers obtained after cutting need to undergo several processing steps in a liquid medium, such as cleaning and rough polishing. The rough polishing process is a preparation process for the gettering process in the subsequent process. It includes: placing the cut silicon wafers into a rough polishing tank containing a chemical solution to treat the surface of the silicon wafers, so as to remove residual silicon powder and metals left over from the cutting process, while also removing some of the damaged layers.
[0003] Existing rough polishing processes typically involve a robot placing a basket structure carrying silicon wafers into a rough polishing tank filled with a chemical solution. However, due to limitations in precision and other conditions, existing basket structures are usually designed with their openings facing upwards. During the rough polishing reaction, a large number of bubbles are generated, which can easily cause the silicon wafers in the basket structure to float, resulting in a wafer floating problem that affects the progress of the rough polishing process.
[0004] In related technologies, the main methods to solve the problem of floating pieces are to open the basket side or add additional basket pressure bars. However, the side opening method requires the addition of a limiting device to each slot of the basket structure, which requires high precision of the basket structure slot. When adding additional basket pressure bars to solve the problem of floating pieces, it is necessary to use an additional loading and unloading pressure bar robot to pick up and put in the basket pressure bars after placing the basket structure into the coarse throwing slot, which affects the production rhythm and capacity, and increases equipment investment. Summary of the Invention
[0005] In view of this, the present invention provides a silicon wafer handling device, an anti-drift wafer system and method to solve the problem that when using basket pressure bars to solve the wafer drift problem, additional auxiliary equipment is required, which affects the production rhythm and capacity and results in poor economic benefits.
[0006] In a first aspect, the present invention provides a silicon wafer handling device, comprising: a base frame, a first pick-and-place mechanism, and a second pick-and-place mechanism, the base frame being adapted to be driven to move; the first pick-and-place mechanism comprising a first hook structure and a second hook structure spaced apart on the base frame, the first hook structure and the second hook structure being adapted to be driven to pick up and place a basket, the basket being adapted to carry a silicon wafer; the second pick-and-place mechanism being installed between the first hook structure and the second hook structure, the second pick-and-place mechanism comprising at least one hook structure, the hook structure being adapted to be driven to pick up and place a clamping structure, the clamping structure being disposed within the basket to limit the silicon wafer within the basket.
[0007] In one alternative embodiment, the first hooking structure and the second hooking structure are adapted to be driven to move closer to each other in a first direction to remove the flower basket or to move further apart from each other to release the flower basket; the hooking structure is adapted to be driven to move in the first direction to connect with or disconnect with the clamping structure.
[0008] In one alternative implementation, the first pick-and-place mechanism and / or the second pick-and-place mechanism are telescopically arranged along a second direction.
[0009] In one optional embodiment, the vertical distance between the second picking and placing mechanism near the end of the flower basket and the base frame is L1, and the vertical distance between the first picking and placing mechanism near the end of the flower basket and the base frame is L2. The relationship between L1 and L2 is: L1 < L2.
[0010] In one optional embodiment, the first hanging structure and the second hanging structure have the same structure; the first hanging structure includes: a first sliding plate, a first connecting rod and a hanging member, the first sliding plate is slidably mounted on the base frame; one end of the first connecting rod is fixed to one side of the first sliding plate, and the other end extends in a direction away from the base frame and is fixedly connected to the hanging member, the hanging member being suitable for supporting the flower basket;
[0011] The second pick-up and drop-off mechanism includes two hook structures, each including a second connecting rod and a hook member. One end of the second connecting rod is slidably inserted through the base frame, and the other end extends away from the base frame and is fixedly connected to the hook member. The hook member is adapted to support the pressing structure.
[0012] In one alternative embodiment, the hook structure further includes a second sliding plate, which is slidably mounted on the base frame, and a second connecting rod passes through one end of the base frame and is fixed to the second sliding plate.
[0013] In an optional embodiment, it further includes: a first guide structure disposed between the base frame and the first pick-and-place mechanism, and a second guide structure disposed between the base frame and the hooking structure; the first guide structure includes: a first guide portion formed on the base frame; a second guide portion formed on the first pick-and-place mechanism; wherein one of the first guide portion and the second guide portion is a slide rail, and the other is a slider, the slider sliding on the slide rail to guide the relative sliding between the base frame and the first pick-and-place mechanism;
[0014] The second guide structure includes: a third guide portion formed on the base frame; and a fourth guide portion formed on the hook structure. Of the third and fourth guide portions, one is a slide rail and the other is a slider. The slider slides on the slide rail to guide the relative sliding between the base frame and the hook structure.
[0015] In one optional embodiment, the first picking and placing mechanism further includes: a first driving member, the mounting end and the telescopic end of the first driving member being fixed to the first hanging structure and the second hanging structure respectively, and the first driving member being adapted to drive the first hanging structure and the second hanging structure to move closer to each other or further away from each other.
[0016] The second pick-and-place mechanism further includes: a second driving member, wherein the mounting end and the telescopic end of the second driving member are respectively fixed on two hook structures arranged sequentially along the first direction, so as to drive the two hook structures to move closer to each other or further away from each other; or the mounting end and the telescopic end of the second driving member are respectively fixed on the base frame and a single hook structure, so as to drive the hook structure to move relative to the base frame.
[0017] In one alternative embodiment, the silicon wafer handling device includes at least two sets of pick-and-place components, each pick-and-place component including a first pick-and-place mechanism and a second pick-and-place mechanism, and the at least two sets of pick-and-place components are arranged side by side on a base frame along a first direction.
[0018] Secondly, the present invention provides an anti-drift plate system, comprising:
[0019] The aforementioned silicon wafer handling device; and a basket and a clamping structure, the basket being adapted to carry silicon wafers and adapted to be connected to a first pick-and-place mechanism; the clamping structure includes two sets of relatively spaced fixing members and a plurality of clamping members and snap-fit members installed between the two sets of fixing members, the snap-fit members being adapted to be connected to a hooking structure, and the clamping members being adapted to press against the upper part of the basket.
[0020] In one alternative embodiment, the snap-fit component includes a snap-fit groove and a slot, the snap-fit groove extending along the extension direction of the snap-fit component, and the slot being formed in the circumferential direction of the snap-fit groove to communicate with the outside.
[0021] The hook structure has a hook portion at one end near the snap-fit component, which is suitable for vertically passing through the slot and moving along the extension direction of the snap-fit slot. The moving distance of the hook structure in the snap-fit slot is greater than the width of the slot along the extension direction of the snap-fit slot.
[0022] In one optional embodiment, it further includes: a snap-fit structure disposed between the first pick-and-place mechanism and the flower basket, the snap-fit structure including: a first snap-fit portion formed on the first hook-and-place structure and the second hook-and-place structure; a second snap-fit portion formed on both ends of the flower basket; in the first snap-fit portion and the second snap-fit portion, one of them is a slot and the other is a protrusion, the protrusion and the slot are snap-fitted to fix the first pick-and-place mechanism and the flower basket.
[0023] Thirdly, the present invention also provides a method for producing an anti-drift sheet, comprising the following steps:
[0024] S101, The clamping structure is placed on the basket carrying the silicon wafer;
[0025] S102, the silicon wafer handling device is activated. The first and second hooking structures of the first pick-and-place mechanism are driven to hook the basket, and the hooking structure of the second pick-and-place mechanism simultaneously hooks the clamping structure.
[0026] S103, the silicon wafer transport device moves to place the basket and pressing structure carrying the silicon wafer into the coarse polishing tank, which is filled with coarse polishing reaction liquid.
[0027] S104, the first and second hooking structures of the first pick-up and place mechanism are driven to release the basket, and the hooking structure of the second pick-up and place mechanism moves synchronously to release the pressing structure, so that the silicon wafer is coarsely polished in the coarse polishing tank.
[0028] S105, the silicon wafer handling device moves away from the coarse polishing tank.
[0029] In one optional embodiment, the coarse polishing reaction solution in step S103 is a KOH solution with a concentration of 0.5wt%-1wt% and a temperature of 70°C.
[0030] In one optional implementation, the coarse polishing time in step S104 is 100s-200s.
[0031] In an optional embodiment, between step S102 and step S103, the silicon wafer transport device moves to place the basket carrying the silicon wafer and the clamping structure into the pre-polishing water tank for cleaning to remove impurities.
[0032] After step S105, the process further includes: moving the silicon wafer transport device into the coarse polishing tank, removing the basket and pressing structure carrying the silicon wafer from the coarse polishing tank and placing them into the coarse polishing post-polishing water tank to remove the coarse polishing reaction liquid.
[0033] The present invention has the following advantages:
[0034] 1. The silicon wafer handling device provided by the present invention includes a first picking and placing mechanism that drives a basket fixedly connected thereto to move, and a second picking and placing mechanism that drives a pressing structure fixedly connected thereto to move. One device can simultaneously drive the basket and the pressing structure, eliminating the need for an additional handling structure. Furthermore, the first and second picking and placing mechanisms can achieve synchronous picking and placing, resulting in a compact production rhythm and helping to save process time. The pressing structure is placed at the opening above the basket to prevent the silicon wafer from falling out of the basket. When the basket is placed in a solution, it can prevent wafer drift. During handling, it can prevent problems such as silicon wafers falling due to shaking, thereby improving the quality of silicon wafers.
[0035] 2. The silicon wafer handling device provided by the present invention has a first hooking structure and a second hooking structure of the first pick-and-place mechanism that are close to each other to jointly hook the basket and move away from each other to release the basket; correspondingly, the second pick-and-place mechanism is provided with two hooking structures that are spaced apart from each other. The arrangement direction of the two hooking structures is the same as the arrangement direction of the two hooking structures, and the actions can be performed synchronously, which greatly enhances the pick-and-place consistency of the first pick-and-place mechanism and the second pick-and-place mechanism, avoids interference, and makes the pick-and-place process convenient and efficient.
[0036] 3. The silicon wafer handling device provided by the present invention has a first picking and placing mechanism with a vertical height greater than that of the second picking and placing mechanism. The mounting ends of both the first and second picking and placing mechanisms are located on the mounting plate. The picking and placing ends have a distance difference in the second direction. The telescopic structure can be adjusted according to different items to be picked and placed to adapt to structures of different heights, increase the scope of application, and make it convenient and efficient to use.
[0037] 4. The silicon wafer handling device provided by the present invention includes two first connecting rods for each hooking structure of the first picking and placing mechanism, which are adapted to be fixed at positions close to both ends of the hooking component; and two second connecting rods for each hooking structure of the second picking and placing mechanism, which are adapted to be fixed at positions close to both ends of the hooking component, so as to uniformly bear force and ensure picking and placing stability.
[0038] 5. The anti-floating wafer system provided by the present invention includes a silicon wafer handling device, a basket, and a clamping structure. The silicon wafer handling device simultaneously picks up and places the basket and the clamping structure, and then places the basket and the clamping structure in a coarse polishing trough, with the clamping structure positioned at the upper opening of the basket. During the coarse polishing process, several clamping components of the clamping structure will block silicon wafers that may float upwards from the basket trough due to the generation of air bubbles.
[0039] 6. The anti-floating wafer system provided by the present invention includes pre-polishing cleaning, polishing and post-polishing cleaning. A basket carrying silicon wafers is placed in a solution, and a clamping structure is set at the upper end of the basket to prevent wafers from floating. Since the clamping structure can also be set in the cleaning tanks before and after polishing, it can improve the quality of silicon wafers while avoiding damage caused by wafers floating. Attached Figure Description
[0040] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0041] Figure 1 This is a schematic diagram of the silicon wafer handling device provided in an embodiment of the present invention;
[0042] Figure 2 This is a top view schematic diagram of the silicon wafer handling device provided in an embodiment of the present invention;
[0043] Figure 3 This is a front view schematic diagram of the silicon wafer handling device provided in an embodiment of the present invention;
[0044] Figure 4 This is a side view schematic diagram of the silicon wafer handling device provided in an embodiment of the present invention;
[0045] Figure 5 This is a schematic diagram of the clamping structure provided in an embodiment of the present invention;
[0046] Figure 6 This is a top view of a flower basket provided in an embodiment of the present invention;
[0047] Explanation of reference numerals in the attached figures:
[0048] 100. Silicon wafer handling device;
[0049] 1. Base frame; 11. Mounting plate; 12. Lifting plate;
[0050] 2. First pick-and-place mechanism; 21. First hook-and-hold structure; 211. First sliding plate; 212. First connecting rod; 213. Hook-and-hold component; 2131. First locking part; 22. Second hook-and-hold structure; 23. First driving component;
[0051] 3. Second pick-and-place mechanism; 31. Hook structure; 311. Second sliding plate; 312. Second connecting rod; 313. Hook component; 3131. Hook part; 32. Second driving component;
[0052] 4. First guide structure; 41. First guide section; 42. Second guide section;
[0053] 200. Flower basket; 201. Second card joint;
[0054] 300, clamping structure; 301, fastener; 302, clamping component; 303, snap-fit component; 3031, snap-fit groove; 3032, slot. Detailed Implementation
[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0056] In related technologies, the main methods to solve the problem of drifting wafers are to open the basket side or add additional basket pressure bars. However, the side opening method requires a limiting device to be added to each slot of the basket structure, which requires high precision of the basket structure slot. But when using additional basket pressure bars to solve the problem of drifting wafers, it is necessary to use an additional loading and unloading robot after placing the basket structure into the coarse casting slot, which affects the production rhythm and capacity, and increases equipment investment.
[0057] Combination Figures 1 to 4 The present invention provides a silicon wafer handling device 100, comprising:
[0058] The base frame 1, the first pick-and-place mechanism 2, and the second pick-and-place mechanism 3 are provided. The base frame 1 is adapted to be moved by a drive. The first pick-and-place mechanism 2 includes a first hook structure 21 and a second hook structure 22 spaced apart on the base frame 1. The first hook structure 21 and the second hook structure 22 are adapted to pick up and place a basket 200 by a drive. The basket 200 is adapted to carry silicon wafers. The second pick-and-place mechanism 3 is installed between the first hook structure 21 and the second hook structure 22. The second pick-and-place mechanism 3 includes at least one hook structure 31. The hook structure 31 is adapted to pick up and place a pressing structure 300 by a drive. The pressing structure 300 is disposed inside the basket to limit the silicon wafers inside the basket.
[0059] The aforementioned silicon wafer handling device 100, with its base frame 1 adapted to move in a driven manner in both horizontal and vertical directions, refers to... Figures 1 to 4 The horizontal direction includes a first direction and a second direction. The first direction is set as the x-direction and the second direction is set as the y-direction. The vertical direction is the z-direction. The first hooking structure 21 and the second hooking structure 22 of the first pick-and-place mechanism 2 approach each other in the first horizontal direction to clamp the basket 200. The hooking structure 31 of the second pick-and-place mechanism 3 moves along the first horizontal direction and extends into the pressing structure 300. Then the base frame 1 moves in the vertical direction. At this time, the first pick-and-place mechanism 2 drives the basket 200 fixedly connected to it to move, and the second pick-and-place mechanism 3 drives the pressing structure 300 fixedly connected to it to move. One device can simultaneously drive the basket 200 and the pressing structure 300 without the need for an additional handling structure. Moreover, the first pick-and-place mechanism 2 and the second pick-and-place mechanism 3 can simultaneously pick up and place different workpieces, resulting in a compact production rhythm and helping to save process time. The pressing structure 300 is placed at the opening above the basket 200 to prevent the silicon wafer from falling out of the basket 200. When the basket 200 is placed in the solution, it can prevent wafer drift. During the handling process, it can prevent the silicon wafer from falling due to shaking, thus improving the quality of the silicon wafer.
[0060] Of course, depending on different process requirements, the first pick-and-place mechanism 2 and the second pick-and-place mechanism 3 can also function independently. The device is widely applicable and highly flexible.
[0061] Among them, such as Figure 1As shown, the base frame 1 includes a horizontally arranged mounting plate 11 and a vertically arranged lifting plate 12. The first pick-and-place mechanism 2 and the second pick-and-place mechanism 3 are mounted on the mounting plate 11. One end of the lifting plate 12 is fixedly connected to the mounting plate 11, and the other end is connected to the terminal drive structure to realize the displacement drive of the base frame 1 in the first and second directions.
[0062] Specifically, the first picking and placing mechanism 2 and the second picking and placing mechanism 3 are telescopically arranged in the vertical direction; the vertical distance between the end of the second picking and placing mechanism 3 near the flower basket 200 and the base frame 1 is L1, and the vertical distance between the end of the first picking and placing mechanism 2 near the flower basket 200 and the base frame 1 is L2. The relationship between L1 and L2 is: L1 < L2. That is, the vertical height of the first picking and placing mechanism 2 is greater than the vertical height of the second picking and placing mechanism 3. The mounting ends of the first picking and placing mechanism 2 and the second picking and placing mechanism 3 are both located on the mounting plate 11, and the picking and placing ends have a distance difference in the second direction. The telescopic structure can be adjusted according to different items to be picked and placed to adapt to structures of different heights, increase the applicable range, and make it convenient and efficient to use.
[0063] In this embodiment, the first direction is parallel to the horizontally arranged mounting plate 11. The first hooking structure 21 and the second hooking structure 22 of the first pick-up and place mechanism 2 move closer to or further away from each other along the first direction. Similarly, the hooking structure 31 of the second pick-up and place mechanism 3 moves along the first direction.
[0064] Optionally, the first hook-up structure 21 and the second hook-up structure 22 can be different clamping structures to accommodate asymmetrical items to be picked up or put down.
[0065] In this embodiment, the first hooking structure 21 and the second hooking structure 22 are identical in structure, which facilitates the processing and shaping of the device and enhances its aesthetics; for example Figures 1 to 4 As shown, the first hanging structure 21 includes: a first sliding plate 211, a first connecting rod 212 and a hanging member 213. The first sliding plate 211 is slidably mounted on the base frame 1. One end of the first connecting rod 212 is fixed to one side of the first sliding plate 211, and the other end extends away from the base frame 1 and is fixedly connected to the hanging member 213. The hanging member 213 is suitable for supporting the flower basket 200.
[0066] In this embodiment, two first connecting rods 212 are provided, which are fixed to the positions near both ends of the hook 213 respectively, so that the force is evenly distributed and the clamping stability of the hook 213 and the hook 313 is improved.
[0067] Since the pressing structure 300 is lighter than the flower basket 200, the second picking and placing mechanism 3 can be equipped with only one hooking structure 31, as long as it can be fixed with the pressing structure 300.
[0068] The second pick-and-place mechanism 3 in this embodiment includes two hook structures 31 to enhance clamping stability. Each hook structure 31 includes a second connecting rod 312 and a hook member 313. One end of the second connecting rod 312 slidably passes through the base frame 1 along a second direction, and the other end extends away from the base frame 1 and is fixedly connected to the hook member 313. The hook member 313 is adapted to support the clamping structure 300. When the hook structure 31 is driven to move along a first direction, the second connecting rod 312 slides through an elongated groove formed on the mounting plate 11. In this embodiment, two second connecting rods 312 are provided, fixed to the hook member 313 near both ends, ensuring even force distribution and improving the stability of the hook structure 31.
[0069] Based on the above scheme, the hooking structure 31 further includes a second sliding plate 311, which is slidably mounted on the base frame 1. A second connecting rod 312 passes through one end of the base frame 1 and is fixed to the second sliding plate 311. The second sliding plate 311 better ensures the stability and reliability of the hooking structure 31 during movement, preventing damage to the device.
[0070] Similarly, since the pressing structure 300 is lighter than the flower basket 200, in another embodiment, the hook structure 31 may not have the second sliding plate 311, thus simplifying the structure.
[0071] The aforementioned silicon wafer handling device 100 further includes: a first guide structure 4 and a second guide structure.
[0072] Specifically, the first guide structure 4 is disposed between the base frame 1 and the first pick-and-place mechanism 2. The first guide structure 4 includes a first guide portion 41 and a second guide portion 42. The first guide portion 41 is formed on the base frame 1, and the second guide portion 42 is formed on the first pick-and-place mechanism 2. Figure 3 and Figure 4 As shown, in this embodiment, the first guide part 41 is a slide rail, and the second guide part 42 is a slider. The slider slides on the slide rail, which facilitates the relative sliding between the base frame 1 and the first pick-and-place mechanism 2.
[0073] Of course, as an alternative implementation, the first guide part 41 can be a slider and the second guide part 42 can be a slide rail. The relative sliding between the base frame 1 and the first pick-and-place mechanism 2 can also be achieved by the slider sliding on the slide rail.
[0074] The second guide structure is disposed between the base frame 1 and the hook structure 31. The second guide structure includes a third guide portion and a fourth guide portion. The third guide portion is formed on the base frame 1, and the fourth guide portion is formed on the hook structure 31. In this embodiment, the third guide portion is a slide rail, and the fourth guide portion is a slider. The slider slides on the slide rail, which facilitates the relative sliding between the base frame 1 and the second pick-and-place mechanism 3.
[0075] Similarly, as an alternative implementation, the third guide part can be a slider and the fourth guide part can be a slide rail. The relative sliding between the base frame 1 and the second pick-and-place mechanism 3 can also be achieved by the slider sliding on the slide rail.
[0076] The first guide structure 4 and the second guide structure described above enable the first pick-and-place mechanism 2 and the second pick-and-place mechanism 3 to be relatively stable when sliding along the first direction, thereby enhancing the stability of the device, preventing shaking, and extending the service life of the device.
[0077] like Figure 2 As shown, the first pick-up and put-down mechanism 2 also includes a first drive member 23. The mounting end and the telescopic end of the first drive member 23 are respectively fixed on the first hook structure 21 and the second hook structure 22. The first drive member 23 is adapted to drive the first hook structure 21 and the second hook structure 22 to move closer to each other or further away from each other.
[0078] The second pick-and-place mechanism 3 also includes a second driving member 32. The mounting end and the telescopic end of the second driving member 32 are respectively fixed on two hook structures 31 arranged sequentially along the first direction, so as to drive the two hook structures 31 to move closer to each other or further away from each other; or the mounting end and the telescopic end of the second driving member 32 are respectively fixed on the base frame 1 and a single hook structure 31, so as to drive the hook structure 31 to move relative to the base frame 1.
[0079] In this embodiment, the first driving component 23 and the second driving component 32 are linear cylinders, which provide precise and convenient control. Of course, other driving structures, such as linear motors, can also be used.
[0080] To enhance single-pass handling performance, the silicon wafer handling device 100 in this embodiment is equipped with two sets of pick-and-place components, such as... Figures 1 to 4 As shown, each set of pick-and-place components includes a first pick-and-place mechanism 2 and a second pick-and-place mechanism 3. The two sets of pick-and-place components are arranged side by side on the base frame 1 along the first direction.
[0081] Of course, the pick-and-place components can be set to three, four or even more groups, depending on the actual process requirements.
[0082] Combination Figures 1 to 6 Based on the present invention, an anti-drift wafer system can be provided, comprising: a silicon wafer handling device 100; a basket 200 and a clamping structure 300. The basket 200 is adapted to carry silicon wafers and is adapted to be connected to a first pick-and-place mechanism 2; the clamping structure 300 includes two sets of relatively spaced fixing members 301 and a plurality of clamping members 302 and snap-fit members 303 installed between the two sets of fixing members 301, the snap-fit members 303 being adapted to be connected to a hooking structure 31, and the clamping members 302 being adapted to press against the upper part of the basket 200.
[0083] Specifically, the silicon wafer handling device 100 simultaneously moves the basket 200 and the clamping structure 300, placing them into the coarse polishing trough. The clamping structure 300 is positioned at the upper opening of the basket 200. Several silicon wafers are arranged sequentially along the length of the basket 200, and the clamping members 302 of the clamping structure 300 extend along the arrangement direction of the silicon wafers. During coarse polishing, the clamping members 302 of the clamping structure 300 prevent silicon wafers from floating upwards in the basket 200 due to the generation of air bubbles. Furthermore, the two sets of fixing members 301 of the clamping structure 300 have several through holes to facilitate a thorough reaction between the coarse polishing reaction solution and the silicon wafers.
[0084] The aforementioned clamping element 302 is designed as a rod, which not only provides obstruction but also facilitates installation and saves materials.
[0085] like Figure 5 As shown, the above-mentioned snap-fit component 303 includes: a snap-fit groove 3031 and a slot 3032. The snap-fit groove 3031 extends along the extension direction of the snap-fit component 303, and the slot 3032 is formed in the circumferential direction of the snap-fit groove 3031 to communicate with the outside.
[0086] The hook structure 31 has a hook portion 3131 at one end near the snap fastener 303, which is adapted to pass vertically through the slot 3032 and move along the extension direction of the snap fastener slot 3031. The moving distance of the hook structure 31 in the snap fastener slot 3031 is greater than the width of the slot 3032 along the extension direction of the snap fastener slot 3031.
[0087] A long, narrow slot 3031 is formed at the lower end of the snap-fit member 303, and the same number of slots 3032 as the hook structure 31 are formed at the upper end. When the hook member 313 of the hook structure 31 snaps into the snap-fit member 303, the hook portion 3131 of the hook member 313 first extends from the slot 3032 into the snap-fit slot 3031. Then, the hook member 313 moves along the extending direction of the snap-fit slot 3031, so that the hook portion 3131 of the hook member 313 extends into the unslotted part of the snap-fit slot 3031, offset from the slot 3032, thus achieving the snap-fit fixation of the hook structure 31 and the snap-fit slot 3031. The hook portion 3131 effectively prevents the clamping structure 300 from coming off during movement.
[0088] In this embodiment, the snap-fit groove 3031 is connected to the outside through two slots 3032. Two hook structures 31 are provided, and the two hook structures 31 are close to each other so that the hook portion 3131 extends into the snap-fit groove 3031, resulting in stronger snap-fit stability at both ends. Furthermore, the snap-fit direction is consistent with the clamping direction of the first pick-and-place mechanism 2, making operation convenient. In the above-described snap-fit, the end of the hook member 313 may not be provided with a hook portion 3131. Since the bottom of the snap-fit groove 3031 is completely connected to the outside without obstruction, snap-fit can still be achieved without a hook portion 3131 at the end of the hook member 313.
[0089] Furthermore, the aforementioned anti-drift plate system also includes a snap-fit structure disposed between the first pick-and-place mechanism 2 and the flower basket 200. The snap-fit structure includes a first snap-fit portion 2131 and a second snap-fit portion 201. The first snap-fit portion 2131 is formed on the first hook-up structure 21 and the second hook-up structure 22, and the second snap-fit portion 201 is formed at both ends of the flower basket 200. For example... Figure 4 and Figure 6 As shown, in this embodiment, the first latching part 2131 is a latching groove, and the second latching part 201 is a protrusion. The protrusion and the latching groove are latched together to fix the first picking and placing mechanism 2 and the flower basket 200.
[0090] Of course, as an alternative implementation, the first latching part 2131 can be a protrusion and the second latching part 201 can be a slot. As long as the first picking and placing mechanism 2 and the flower basket 200 can be fixedly connected by the latching of the protrusion and the slot.
[0091] Combination Figures 1 to 6 The present invention also provides a method for making an anti-drift sheet, comprising the following steps:
[0092] S101, the clamping structure 300 is placed on the basket 200 that carries the silicon wafer.
[0093] Specifically, there can be a certain gap between the pressing structure 300 and the basket 200 to facilitate the full coarse polishing reaction.
[0094] S102, the silicon wafer transport device 100 is turned on. The first hooking structure 21 and the second hooking structure 22 of the first pick-and-place mechanism 2 are driven to clamp the basket 200. The hooking structure 31 of the second pick-and-place mechanism 3 simultaneously hooks and presses the clamping structure 300.
[0095] Specifically, the first hooking structure 21 and the second hooking structure 22 are identical structures, close to each other to hook the flower basket 200, achieving a reliable connection with the flower basket 200, which is convenient and efficient. At the same time, the hooking structure 31 is also set in two sets, which are adapted to the two sets of hooking structures of the first pick-and-place mechanism 2, ensuring stable and reliable operation.
[0096] S103, the silicon wafer transport device 100 moves to place the basket 200 carrying the silicon wafer and the pressing structure 300 into the coarse polishing tank, which is filled with coarse polishing reaction liquid.
[0097] Specifically, the coarse polishing reaction solution mentioned above is a KOH solution with a concentration of 0.5wt%-1wt%, and the temperature of the coarse polishing reaction solution is 70℃. This ensures the best coarse polishing effect.
[0098] S104, the first hooking structure 21 and the second hooking structure 22 of the first pick-up and place mechanism 2 are driven to release the basket 200, and the hooking structure 31 of the second pick-up and place mechanism 3 moves synchronously to release the pressing structure 300, so that the silicon wafer is coarsely polished in the coarse polishing tank.
[0099] Specifically, after the basket 200 and the clamping structure 300 are placed into the coarse polishing tank, the first hooking structure 21 and the second hooking structure 22 of the silicon wafer handling device move away from each other to release the basket 200. The hooking structure 31 of the second pick-and-place mechanism 3 moves to disengage from the clamping structure 300 to release the clamping structure 300. The coarse polishing time is 100s-200s, ensuring a sufficient reaction.
[0100] S105, the silicon wafer handling device 100 moves away from the coarse polishing tank.
[0101] In a preferred embodiment, between steps S102 and S103, the process further includes: the silicon wafer transport device 100 moves to place the basket 200 carrying the silicon wafer and the pressing structure 300 into the pre-polishing water tank for cleaning to remove the preceding chemicals and ensure that there are no residues on the surface of the silicon wafer entering the polishing tank; after step S105, the process further includes: the silicon wafer transport device 100 moves to the polishing tank, removes the basket 200 carrying the silicon wafer and the pressing structure 300 from the polishing tank and places them into the post-polishing water tank to remove the polishing reaction solution, facilitating subsequent processes.
[0102] When the silicon wafers in another new basket 200 are rough polished, the silicon wafer transport device 100 can extend into the processing tank with the pressing structure 300, and drive the second pick-and-place mechanism 3 to remove the pressing structure 300 from the processing tank. Then the silicon wafer transport device 100 moves to the top of the new basket 200 and descends vertically to place the pressing structure 300 on the new basket 200. That is, the above steps S101 to S105 are repeated.
[0103] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0104] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.
[0105] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0106] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. A silicon wafer handling device, characterized in that, include: A base frame (1) adapted to be moved by a drive; The first pick-and-place mechanism (2) includes a first pick-and-place structure (21) and a second pick-and-place structure (22) spaced apart on the base frame (1). The first pick-and-place structure (21) and the second pick-and-place structure (22) are adapted to pick up and place the basket (200) in a driven manner. The basket (200) is adapted to carry silicon wafers. A second pick-and-place mechanism (3) is installed between the first hook structure (21) and the second hook structure (22). The second pick-and-place mechanism (3) includes at least one hook structure (31) adapted to be driven to pick up and place a clamping structure (300), which is disposed in the basket to limit the silicon wafer in the basket.
2. The silicon wafer handling device according to claim 1, characterized in that, The first hook structure (21) and the second hook structure (22) are adapted to be driven to move closer to each other in a first direction to remove the flower basket (200) or to move further apart from each other to release the flower basket (200); the hook structure (31) is adapted to be driven to move in the first direction to connect with or disconnect from the clamping structure (300).
3. The silicon wafer handling device according to claim 1, characterized in that, The first pick-and-place mechanism (2) and / or the second pick-and-place mechanism (3) are extended and retracted in the vertical direction.
4. The silicon wafer handling device according to claim 3, characterized in that, The vertical distance between the second picking and placing mechanism (3) near the flower basket (200) and the base frame (1) is L1, and the vertical distance between the first picking and placing mechanism (2) near the flower basket (200) and the base frame (1) is L2. The relationship between L1 and L2 is: L1 < L2.
5. The silicon wafer handling device according to claim 1, characterized in that, The first hanging structure and the second hanging structure have the same structure; the first hanging structure (21) includes: a first sliding plate (211), a first connecting rod (212) and a hanging member (213), the first sliding plate (211) is slidably mounted on the base frame (1); one end of the first connecting rod (212) is fixed to one side of the first sliding plate (211), and the other end extends away from the base frame (1) and is fixedly connected to the hanging member (213), the hanging member (213) is suitable for supporting the flower basket (200); The second pick-and-place mechanism (3) includes two hook structures (31), each hook structure (31) including a second connecting rod (312) and a hook member (313). One end of the second connecting rod (312) is slidably inserted through the base frame (1), and the other end extends in a direction away from the base frame (1) and is fixedly connected to the hook member (313). The hook member (313) is adapted to support the pressing structure (300).
6. The silicon wafer handling device according to claim 5, characterized in that, The hook structure (31) also includes: The second sliding plate (311) is slidably mounted on the base frame (1), and the second connecting rod (312) passes through one end of the base frame (1) and is fixed to the second sliding plate (311).
7. The silicon wafer handling device according to claim 1, characterized in that, Also includes: A first guide structure (4) is disposed between the base frame (1) and the first pick-and-place mechanism (2), and the first guide structure (4) includes: The first guide part (41) is formed on the base frame (1); The second guide part (42) is formed on the first pick-and-place mechanism (2); In the first guide part (41) and the second guide part (42), one of them is a slide rail and the other is a slider. The slider slides on the slide rail to guide the relative sliding of the base frame (1) and the first pick-and-place mechanism (2). A second guide structure is disposed between the base frame (1) and the hook structure (31), the second guide structure comprising: The third guide section is formed on the base frame (1); The fourth guide portion is formed on the hook structure (31); In the third guide section and the fourth guide section, one of them is a slide rail and the other is a slider. The slider slides on the slide rail to guide the relative sliding of the base frame (1) and the hook structure (31).
8. The silicon wafer handling device according to claim 7, characterized in that, The first pick-up and put-down mechanism (2) further includes: a first drive member (23), the mounting end and the telescopic end of the first drive member (23) are respectively fixed on the first hook structure (21) and the second hook structure (22), and the first drive member (23) is adapted to drive the first hook structure (21) and the second hook structure (22) to move closer to each other or further away from each other; The second pick-and-place mechanism (3) further includes: a second drive member (32), the mounting end and the telescopic end of the second drive member (32) being fixed on two hook structures (31) arranged sequentially along the first direction, so as to drive the two hook structures (31) to move closer to each other or further away from each other; or the mounting end and the telescopic end of the second drive member (32) being fixed on the base frame (1) and a single hook structure (31) respectively, so as to drive the hook structure (31) to move relative to the base frame (1).
9. The silicon wafer handling device according to claim 1, characterized in that, include: At least two sets of pick-and-place components, each of which includes a first pick-and-place mechanism (2) and a second pick-and-place mechanism (3), and the at least two sets of pick-and-place components are arranged side by side on the base frame (1) along a first direction.
10. An anti-drift plate system, characterized in that, include: The silicon wafer handling apparatus (100) according to any one of claims 1-9; and, A flower basket (200) is suitable for carrying silicon wafers and for connecting to the first pick-and-place mechanism (2); The clamping structure (300) includes two sets of relatively spaced fasteners (301) and a plurality of clamping members (302) and snap-fit members (303) installed between the two sets of fasteners (301), the snap-fit members (303) being adapted to connect with the hook structure (31), and the clamping members (302) being adapted to press against the upper part of the flower basket (200).
11. The anti-drift plate system according to claim 10, characterized in that, The snap-fit component (303) includes a snap-fit groove (3031) and a slot (3032). The snap-fit groove (3031) extends along the extension direction of the snap-fit component (303), and the slot (3032) is formed in the circumferential direction of the snap-fit groove (3031) to communicate with the outside. The hook structure (31) has a hook portion (3131) at one end near the snap-fit member (303), which is adapted to pass vertically through the slot (3032) and move along the extension direction of the snap-fit slot (3031). The moving distance of the hook structure (31) in the snap-fit slot (3031) is greater than the width of the slot (3032) along the extension direction of the snap-fit slot (3031).
12. The anti-drift plate system according to claim 10, characterized in that, Also includes: A snap-fit structure is disposed between the first pick-and-place mechanism (2) and the flower basket (200), the snap-fit structure comprising: The first snap-fit portion (2131) is formed on the first hook-up structure (21) and the second hook-up structure (22); The second snap-fit portion (201) is formed at both ends of the flower basket (200); In the first latching part (2131) and the second latching part (201), one of them is a latching groove and the other is a protrusion. The protrusion is latched with the latching groove to fix the first picking and placing mechanism (2) and the flower basket (200).
13. A method for producing an anti-drift sheet, characterized in that, Includes the following steps: S101, the clamping structure (300) is placed on the basket (200) carrying the silicon wafer; S102, the silicon wafer handling device (100) is turned on, the first hooking structure (21) and the second hooking structure (22) of the first pick-up and place mechanism (2) are driven to hook up the basket (200), and the hooking structure (31) of the second pick-up and place mechanism (3) simultaneously hooks up the pressing structure (300). S103, the silicon wafer transport device (100) moves to place the basket (200) carrying the silicon wafer and the pressing structure (300) into the coarse polishing tank, which is provided with coarse polishing reaction liquid. S104, the first hooking structure (21) and the second hooking structure (22) of the first pick-up and place mechanism (2) are driven to release the basket (200), and the hooking structure of the second pick-up and place mechanism (3) moves synchronously to release the pressing structure (300) so that the silicon wafer is coarsely polished in the coarse polishing tank; S105, the silicon wafer handling device (100) moves away from the coarse polishing tank.
14. The method for using an anti-drift sheet according to claim 13, characterized in that, The coarse polishing reaction solution in step S103 is a KOH solution with a concentration of 0.5wt%-1wt% and a temperature of 70℃.
15. The method for using an anti-drift sheet according to claim 13, characterized in that, The coarse polishing time in step S104 is 100s-200s.
16. The method for using an anti-drift sheet according to claim 13, characterized in that, Between steps S102 and S103, the silicon wafer transport device (100) moves to place the basket (200) carrying the silicon wafer and the clamping structure (300) into the pre-polishing water tank for cleaning to remove impurities. After step S105, the process further includes: moving the silicon wafer transport device (100) into the coarse polishing tank, removing the basket (200) carrying the silicon wafer and the pressing structure (300) from the coarse polishing tank and placing them into the coarse polishing post-polishing water tank to remove the coarse polishing reaction liquid.