ELQFP packaging lead frame structure and packaging piece thereof

Abstract

The invention provides an ELQFP packaging lead frame structure, which reduces the number of leads for routing for packaging, enables subsequent packaging to be convenient and reliable, and further improves the performance and reliability of integrated circuit packaging. The structure is characterized in that the structure comprises a base island which is located in a central area and is used for bearing an IC chip; a grounding ring; the plurality of inner pins are annularly distributed on the periphery of the grounding ring; the base island is located in the inner center area of the grounding ring and is arranged in a downward concave mode, the multiple inner pins are all annularly distributed on the periphery of the grounding ring, each inner pin comprises a pin part which is obliquely arranged from inside to outside, a single-ring Power bar structure or / and a double-ring Power bar structure is / are arranged at the inner end corresponding to the inner pin, and the inner pin part and the single-ring Power bar structure and / or the double-ring Power bar structure are / is arranged at the outer end of the single-ring Power bar structure or / and the double-ring Power bar structure. The arrangement of the Power bar structure needs to consider the distance and layout between the inner pins.

Description

Technical Field

[0001] This invention relates to the technical field of integrated circuit packaging, specifically to an ELQFP package lead frame structure. The invention also provides a package using this package lead frame structure. Background Technology

[0002] In the integrated circuit packaging industry, ELQFP packaging has become the preferred packaging solution for high-performance electronic devices due to its significant advantages such as compact structure, excellent heat dissipation performance, and flexible pin layout. However, traditional ELQFP packaging products feature a single, unconnected internal pin design on each carrier when designing a matrix lead frame.

[0003] With the rapid development of electronic technology and the increasing sophistication of product functions, integrated circuit packaging faces more stringent challenges. To achieve specific circuit functions, some internal pins require special structural designs. When product functionality demands power isolation between pins to protect the circuit from current loop interference, a power bar structure is introduced. This structure effectively isolates different power paths by designing some internal pins as closed-loop single or double rings, avoiding the risk of crossover lines, thereby improving the stability and reliability of the circuit.

[0004] Therefore, in order to meet the ever-increasing functional requirements of electronic products, it is particularly important to innovate and optimize the internal pin structure of the ELQFP package leadframe. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides an ELQFP package lead frame structure that reduces the number of wires required for packaging, making subsequent packaging more convenient and reliable, thereby improving the performance and reliability of integrated circuit packaging.

[0006] An ELQFP package lead frame structure, characterized in that it comprises:

[0007] The base island, located in the central area, is used to house IC chips;

[0008] Grounding ring;

[0009] And several inner pins arranged around the periphery of the grounding ring;

[0010] The base island is located in the inner central region of the grounding ring and is recessed. Several inner pins are arranged around the outer periphery of the grounding ring, and each inner pin includes a pin portion arranged obliquely from the inside to the outside. A single-ring Power bar structure or / and a double-ring Power bar structure are provided at the inner end of the inner pin. The setting of the Power bar structure needs to take into account the spacing and layout between the inner pins.

[0011] Its further features are:

[0012] Based on the layout of the internal pins, the internal pins with small external space distance and large internal space are set as Y-type structures, which makes the outer ends of the two internal pins converge into one external lead, making the layout reasonable.

[0013] The grounding ring is a rectangular structure with rounded corners, and the grounding ring is provided with base island connecting ribs with bent base islands at the four corners of the grounding ring.

[0014] According to the layout of the inner pins, the inner pins arranged in the same group adjacent to each other in one side area of ​​the grounding ring form a parallel structure.

[0015] Based on the layout of the internal pins and the length of the bonding wire, the internal pins arranged adjacent to each other in one side area of ​​the grounding ring are set to an equal length structure with the same bonding wire length as the IC chip during soldering, which makes the bonding wire arrangement convenient and quick.

[0016] An ELQFP package, characterized in that it comprises:

[0017] ELQFP package lead frame structure;

[0018] IC chips;

[0019] And several stitches;

[0020] The IC chip is mounted on the base island of the ELQFP package lead frame structure. The IC chip is connected to a single-ring power bar structure, a double-ring power bar structure, a Y-type structure, a parallel structure, an equal-length structure, and other internal leads and grounding rings through several wire bonding connections.

[0021] By adopting the above technical solution, firstly, the present invention achieves efficient isolation and management of power paths by using a single-ring power bar structure or / and a double-ring power bar structure. This innovative design not only significantly improves the stability and reliability of the circuit, but also effectively prevents mutual interference between different power circuits. The single-ring power bar structure is suitable for relatively simple power management needs. Its simple design makes the current path clearer and reduces the complexity of the circuit. The double-ring power bar structure is designed for more complex power management scenarios. Through the nested design of the double rings, it achieves fine control of multiple power paths, further improving the performance and safety of the circuit.

[0022] Secondly, the two sets of Y-shaped structures of the internal pins further optimize the layout and performance of the lead frame. This design not only increases the contact area of ​​the power pins and improves heat dissipation efficiency, but also allows heat to be distributed to the surrounding environment more quickly and evenly, effectively preventing the package performance from deteriorating or being damaged due to heat accumulation. At the same time, the Y-shaped structure also cleverly reduces the coupling effect between input and output signals, reduces errors in the signal transmission process, and ensures the stability and accuracy of the signal.

[0023] Finally, the parallel and equal-length structure design in groups brings significant improvements and enhancements to the ELQFP package lead frame. This design ensures a more balanced and stable electrical connection between each group of pins, which not only improves the consistency and efficiency of signal transmission, but also simplifies the wire bonding process in the packaging process, making it easier to achieve equal-length wire bonding, thereby further enhancing the reliability and durability of the package.

[0024] In summary, the ELQFP package lead frame structure of this invention has been innovated and optimized in both structural design and packaging process, aiming to comprehensively improve the performance and reliability of integrated circuit packaging. It will strongly promote the performance improvement and reliability enhancement of electronic devices and lead integrated circuit packaging technology to a new stage of development. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the lead frame according to a specific embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the single-ring Power bar structure of the inner pins in a specific embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the double-ring Power bar structure of the inner pins in a specific embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the Y-shaped structure of the internal pins in a specific embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram showing the connection between the Power bar structure and the second Y-shaped structure in a specific embodiment of the present invention;

[0030] Figure 6 This is a schematic diagram of the equal-length structure of the inner pins in a specific embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram of the parallel structure of the inner pins in a specific embodiment of the present invention;

[0032] Figure 8 This is a schematic diagram of the wiring method of the package of the present invention;

[0033] The names corresponding to the serial numbers in the diagram are as follows:

[0034] It includes a first single-ring Power bar structure 1, a grounding ring 2, a base island connecting rib 21, a base island 3, a first Y-shaped structure 4, a second single-ring Power bar structure 5, a parallel structure 6, a third single-ring Power bar structure 7, an equal-length structure 8, an inner pin 9, a second Y-shaped structure 10, a fourth single-ring Power bar structure 11, and a double-ring Power bar structure 12.

[0035] IC chip 20, wire bonding 30, ELQFP package lead frame structure 100. Detailed Implementation

[0036] An ELQFP package lead frame structure, see Figures 1-7 It includes a base island 3, a grounding ring 2, and several internal pins 9;

[0037] Base Island 3 is located in the central area and is used to house the IC chip;

[0038] The base island 3 is located in the inner central region of the grounding ring 2 and is recessed. Several inner pins 9 are arranged around the outer periphery of the grounding ring 2, and each inner pin 9 includes a pin portion arranged obliquely from the inside to the outside. The inner pins 9 are evenly distributed around the base island 3. A single-ring Power bar structure or / and a double-ring Power bar structure are provided corresponding to the inner end of the inner pin 9. The setting of the Power bar structure needs to take into account the spacing and layout between the inner pins.

[0039] In a specific embodiment, the lead frame is provided with a first single-ring Power bar structure 1, a second single-ring Power bar structure 5, a third single-ring Power bar structure 7, a fourth single-ring Power bar structure 11, and a double-ring Power bar structure 12. The Power bar structure effectively isolates different power paths, preventing current loops from interfering with each other, thereby significantly improving the stability and reliability of the circuit. Simultaneously, the Power bar structure design carefully considers the spacing and layout between pins, optimizes the flatness of the grounding ring 7, reduces the risk of frame deformation after wire bonding, and minimizes parasitic inductance, ensuring that it meets the functional and performance requirements of the circuit.

[0040] In specific implementation, based on the layout of the inner pins 9, the inner pins with small external space distance and large internal space are set as the first Y-type structure 4, the second Y-type structure 10, and the third Y-type structure 13, which makes the outer ends of the two inner pins 9 converge into one outer lead-out pin, making the layout reasonable.

[0041] This design increases the surface area of ​​the power pins, improving their heat dissipation performance. At the same time, it reduces input / output signal coupling and errors, and facilitates equal-length soldering wires.

[0042] In a specific embodiment, in order to arrange the inner pins 9 reasonably, one of the inner pins connected to the double-ring Power bar structure 12 is one of the inner pins of the second Y-type structure 10, and the inner pin of the fourth single-ring Power bar structure 11 is the other inner pin of the second Y-type structure 10. In order to reduce the circuit function failure caused by cross wiring, the fourth single-ring Power bar structure 11, the double-ring Power bar structure 12 and the second Y-type structure 10 are connected to achieve the same potential and circuit function.

[0043] In a specific embodiment, the grounding ring 2 is a rectangular structure with rounded corners, and the grounding ring 2 has protruding base island connecting ribs 21 at the four corners of each corner.

[0044] According to the layout of the inner pins 9, the inner pins arranged in the same group in one side area of ​​the grounding ring 2 form a parallel structure 6; the pins of the corresponding two pin numbers in the same subgroup in the parallel structure need to control the parallel error (except at the tensile corner), and the pins between different subgroups do not need to control the parallelism.

[0045] Based on the layout of the inner pins 9 and the length of the bonding wire, the inner pins 9 arranged adjacent to each other in one side area of ​​the grounding ring 2 are set as equal-length structures 8 with the same bonding wire length as when soldering the IC chip, which makes the arrangement of the bonding wire 30 convenient and quick; in specific implementation, every 8 pins are grouped into the same large group, and the equal length error needs to be controlled. Otherwise, the equal length does not need to be controlled.

[0046] An ELQFP package, see Figure 8 It includes an ELQFP package lead frame structure 100, an IC chip 20, and several wire bonding structures 30; the IC chip 20 is mounted on the base island 3 of the ELQFP package lead frame structure 100, and the IC chip 20 is connected to a first single-ring Power bar structure 1, a second single-ring Power bar structure 5, a third single-ring Power bar structure 7, a fourth single-ring Power bar structure 11, a double-ring Power bar structure 12, a first Y-type structure 4, a second Y-type structure 10, a third Y-type structure 13, a parallel structure 6, an equal-length structure 8, and other inner leads 9 and a grounding ring 2 through several wire bonding structures 30.

[0047] Its beneficial effects are as follows:

[0048] First, this invention achieves efficient isolation and management of power paths by employing a single-ring power bar structure or / and a dual-ring power bar structure. This innovative design not only significantly improves the stability and reliability of the circuit, but also effectively prevents mutual interference between different power circuits. The single-ring power bar structure is suitable for relatively simple power management needs, and its simple design makes the current path clearer and reduces circuit complexity. The dual-ring power bar structure is designed for more complex power management scenarios. Through the nested design of the two rings, it achieves fine control of multiple power paths, further improving the performance and safety of the circuit.

[0049] Secondly, the two sets of Y-shaped structures of the internal pins further optimize the layout and performance of the lead frame. This design not only increases the contact area of ​​the power pins and improves heat dissipation efficiency, but also allows heat to be distributed to the surrounding environment more quickly and evenly, effectively preventing the package performance from deteriorating or being damaged due to heat accumulation. At the same time, the Y-shaped structure also cleverly reduces the coupling effect between input and output signals, reduces errors in the signal transmission process, and ensures the stability and accuracy of the signal.

[0050] Finally, the parallel and equal-length structure design in groups brings significant improvements and enhancements to the ELQFP package lead frame. This design ensures a more balanced and stable electrical connection between each group of pins, which not only improves the consistency and efficiency of signal transmission, but also simplifies the wire bonding process in the packaging process, making it easier to achieve equal-length wire bonding, thereby further enhancing the reliability and durability of the package.

[0051] In summary, the ELQFP package lead frame structure of this invention has been innovated and optimized in both structural design and packaging process, aiming to comprehensively improve the performance and reliability of integrated circuit packaging. It will strongly promote the performance improvement and reliability enhancement of electronic devices and lead integrated circuit packaging technology to a new stage of development.

[0052] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0053] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A lead frame structure for an ELQFP package, characterized in that, It includes: The base island, located in the central area, is used to house IC chips; Grounding ring; And several inner pins arranged around the periphery of the grounding ring; The base island is located in the inner central region of the grounding ring and is recessed. Several inner pins are arranged around the outer periphery of the grounding ring, and each inner pin includes a pin portion arranged obliquely from the inside to the outside. A single-ring Power bar structure or / and a double-ring Power bar structure are provided at the inner end of the inner pin. The setting of the Power bar structure needs to take into account the spacing and layout between the inner pins.

2. The ELQFP package lead frame structure according to claim 1, characterized in that: Based on the layout of the internal pins, the internal pins with small external space distance and large internal space are set as a Y-type structure.

3. The ELQFP package lead frame structure according to claim 2, characterized in that: The grounding ring is a rectangular structure with rounded corners, and the four corners of the grounding ring are respectively provided with base island connecting ribs that are bent to connect to the base island.

4. The ELQFP package lead frame structure according to claim 3, characterized in that: Based on the layout of the inner pins, the inner pins arranged in adjacent groups within one side region of the grounding ring form a parallel structure.

5. The ELQFP package lead frame structure according to claim 4, characterized in that: Based on the layout of the internal pins and the length of the bonding wire, the internal pins arranged adjacent to each other in one side area of ​​the grounding ring are set to an equal length structure with the same bonding wire length as that corresponding to the IC chip during soldering.

6. An ELQFP package, characterized in that, It includes: The ELQFP package lead frame structure as described in claim 5; IC chips; And several stitches; The IC chip is mounted on the base island of the ELQFP package lead frame structure. The IC chip is connected to a single-ring power bar structure, a double-ring power bar structure, a Y-type structure, a parallel structure, an equal-length structure, and other internal leads and grounding rings through several wire bonding connections.

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