Integrated oscillator and antenna array

Abstract

The invention discloses an integrated oscillator and an antenna array. The integrated oscillator comprises a radiation substrate, a Balun substrate, a radiation circuit and a Balun circuit. The radiation substrate is integrally formed at the upper end of the balun substrate; the radiation circuit is arranged on the radiation substrate; the balun circuit is arranged on the balun substrate and forms a continuous circuit with the radiation circuit; through the structure, required signal receiving and transmitting can be effectively carried out, a connecting assembly is not needed between the radiating surface and the Balun, welding points are reduced, the higher transmission rate is provided, delay is reduced to the maximum extent, errors and interference possibly occurring in practical application are reduced, the reliability of the oscillator is effectively improved, and the service life of the oscillator is prolonged. The overall investment cost is greatly reduced, and the selection requirements of the array and the oscillator are low under the same condition.

Description

Technical Field

[0001] This invention relates to the field of antennas, and particularly to an integrated vibrator and antenna array. Background Technology

[0002] A vibrator is a component on an antenna, also known as an antenna vibrator. It guides and amplifies electromagnetic waves, making the received electromagnetic signals stronger. A traditional dual-polarized vibrator consists of a radiating surface and a balun. The radiating surface includes a first substrate and a radiating circuit, while the balun includes a second substrate and a balun circuit. Both the first and second substrates are PCBs and are independent of each other, meaning the radiating circuit and the balun circuit are discontinuous and need to be connected by solder points. In addition, to transmit signals, a phase shifter is often used to connect to the bottom of the second substrate via an adapter. This type of dual-polarized vibrator requires at least ten solder points, which not only makes the assembly process very cumbersome but also increases the soldering cost due to the large number of solder points, thus failing to meet the requirements of energy-saving and emission-reduction production. Therefore, there is an urgent need for an integrated vibrator and antenna array to solve the above problems. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an integrated vibrator and antenna array.

[0004] One embodiment of the present invention provides a technical solution to solve its technical problem: an integrated oscillator, comprising a radiating substrate, a balun substrate, a radiating circuit, and a balun circuit; The radiating substrate is integrally formed on the upper end of the balun substrate; The radiation circuit is mounted on the radiation substrate; The balun circuit is mounted on the balun substrate and forms a continuous circuit with the radiation circuit.

[0005] As one of the preferred embodiments of the present invention, the radiating substrate and the balun substrate are made of PPS material of type 1140L4.

[0006] As one of the preferred embodiments of the present invention, the radiating substrate and the balun substrate are made of PPS material of type ZF40A.

[0007] As one of the preferred embodiments of the present invention, the radiation circuit is etched or electroplated on the radiation substrate, and the balun circuit is etched or electroplated on the balun substrate.

[0008] As one of the preferred embodiments of the present invention, the integrated oscillator further includes a ground plane integrally formed on the lower end of the balun substrate, and a filter circuit is disposed on the ground plane, the filter circuit and the balun circuit forming a continuous circuit.

[0009] As one of the preferred embodiments of the present invention, the grounding plate is integrally formed with a plurality of reinforcing ribs extending along its length and / or width.

[0010] As one of the preferred embodiments of the present invention, the mounting plate is integrally formed with a hook.

[0011] As one of the preferred embodiments of the present invention, the integrated oscillator further includes a reflector, a shielding shell, a phase-shifting substrate, and a phase-shifting circuit, with the balun substrate disposed on the front side of the reflector. The reflector is provided with a mounting groove that extends along its length and runs vertically through it. The shielding housing is located on the back of the reflector and communicates with the mounting groove; The phase-shifting substrate is housed within the shielding housing and is integrally formed with the balun substrate; The phase-shifting circuit is mounted on the phase-shifting substrate and forms a continuous circuit with the balun circuit.

[0012] As one of the preferred embodiments of the present invention, the edge of the radiating substrate is provided with a downwardly extending folded edge.

[0013] Antenna array, including the aforementioned integrated vibrator.

[0014] The beneficial effects of this invention are as follows: An integrated vibrator and antenna array, comprising a radiating substrate, a balun substrate, a radiating circuit, and a balun circuit; the radiating substrate is integrally formed on the upper end of the balun substrate; the radiating circuit is disposed on the radiating substrate; the balun circuit is disposed on the balun substrate and forms a continuous circuit with the radiating circuit; the above structure enables effective signal transmission and reception, eliminating the need for connecting components between the radiating surface and the balun, thus reducing soldering points, providing higher transmission rates, minimizing delay, reducing potential errors and interference in practical applications, effectively improving the reliability of the vibrator, and significantly reducing overall investment costs. Under the same conditions, the selection requirements for the array and vibrator are lower. Attached Figure Description

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of the first embodiment of the antenna array; Figure 2 This is a schematic diagram of the structure of the second embodiment of the antenna array; Figure 3 This is an exploded view of the first embodiment of the antenna array; Figure 4 This is a cross-sectional view of the third embodiment of the antenna array; Figure 5 for Figure 4 A magnified view of a portion of region A in the middle. Detailed Implementation

[0016] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0017] In the description of this invention, "multiple" means two or more; "greater than," "less than," and "exceeding" are understood to exclude the stated number; "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0018] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0019] In this invention, unless otherwise explicitly defined, the terms "setting," "installing," and "connecting" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to a fixed connection, a detachable connection, or an integrally formed connection; they can refer to a mechanical connection; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0020] Reference Figures 1-5 The present invention provides an integrated oscillator, including a radiating substrate 10, a balun substrate 20, a radiating circuit, and a balun circuit 30; the radiating substrate 10 is integrally formed on the upper end of the balun substrate 20; the radiating circuit is disposed on the radiating substrate 10; the balun circuit 30 is disposed on the balun substrate 20 and forms a continuous circuit with the radiating circuit.

[0021] In this invention, an integrated base is manufactured using processes such as injection molding. The base has a horizontal panel and a vertical panel. The horizontal panel serves as the substrate for the radiating circuit (not shown), i.e., the radiating substrate 10, and the vertical panel serves as the substrate for the balun circuit 30, i.e., the balun substrate 20. The radiating circuit is attached to the radiating substrate 10 and the balun circuit 30 is attached to the balun substrate 20 by etching or electroplating processes. It should be noted that the radiating circuit and the balun circuit 30 are continuous circuits on the base (radiating substrate 10 and balun substrate 20), and there is no connection point between them. The radiating circuit and the balun circuit 30 are directly connected and continuous, and no adapter is needed to connect them. This reduces the number of solder points from four to zero. Power supply can be completed by only two solder points generated by the connection of the balun circuit 30 to the phase shifter, saving the assembly process.

[0022] The integrated design reduces the processing of intermediate components between the radiating circuit and the balun circuit 30, thereby providing higher transmission speeds; it makes the feed point connection more stable, greatly improving antenna efficiency, effectively reducing losses, and reducing potential risks in practical applications, such as poor contact caused by solder joints, improving risk resistance, avoiding communication interruptions that may be caused by physical medium failures, and also enabling better impedance matching, reducing signal reflection, and improving transmission efficiency; it also reduces the internal resistance of the vibrator, thus affecting the selection of the characteristic impedance of the transmission line during impedance matching; in some embodiments, the radiating substrate 10 and the balun substrate 20 are made of PPS material of type 1140L4, and in other embodiments, the radiating substrate 10 and the balun substrate 20 are made of PPS material of type ZF40A; furthermore, the radiating circuit and the balun circuit 30 can be attached to the surface, back, or intermediate layer of the base, and through slots can also be formed on the radiating substrate 10 and / or the balun substrate 20, with the radiating circuit and / or the balun circuit 30 attached to the inner wall of the through slot, thereby connecting the circuits on the front and back of the substrate, without limitation.

[0023] In practical applications, the integrated structure can prevent the internal power supply failure or solder joint detachment of the oscillator caused by external corrosion, and can be better applied to more environments, such as humid or outdoor environments. In addition, the structural strength of the oscillator has also been improved, making it superior when considering wind load and vibration, suitable for vehicle or airborne conditions, and its temperature adaptability has also been greatly expanded. Since there is no need to consider the solder joint detachment caused by thermal expansion and contraction of external conditions, it can be applied to more environments.

[0024] Reference Figure 2In some embodiments, the integrated oscillator also includes a ground plane 40 integrally formed on the lower end of the balun substrate 20. A filter circuit 50 is disposed on the ground plane 40, and the filter circuit 50 and the balun circuit 30 form a continuous circuit. The integrated design allows the radiation circuit and the balun circuit 30 to be directly connected without the need for an adapter. The design of the filter circuit 50 can protect the oscillator, prevent the antenna from being broken down or burned, and also improve the power utilization rate. The filter circuit 50 can filter and improve signal quality, reduce line loss, and extend the life of the oscillator.

[0025] Reference Figures 1-5 In some embodiments, a plurality of reinforcing ribs 41 extending along their length and / or width are integrally formed on the ground plane 40; in the dual-polarized oscillator, two balun substrates 20 are provided and orthogonally arranged below the radiating substrate 10. The reinforcing ribs 41 can improve the structural strength between the two balun substrates 20 and between the balun substrate 20 and the ground plane 40, thereby further improving the stability of the oscillator.

[0026] Reference Figures 4-5 In some embodiments, the integrated oscillator also includes a reflector 60, a shielding housing 71, a phase-shifting substrate 72, and a phase-shifting circuit 73, with the balun substrate 20 disposed on the front side of the reflector 60. The reflector 60 is provided with a mounting groove 61 that extends along its length and runs vertically through it; The shielding housing 71 is disposed on the back of the reflector 60 and communicates with the mounting groove 61; The phase-shifting substrate 72 is disposed inside the shielding housing 71 and is integrally formed with the balun substrate 20; The phase-shifting circuit 73 is disposed on the phase-shifting substrate 72 and forms a continuous circuit with the balun circuit 30.

[0027] Specifically, an integrated reflector 60 and shielding housing 71 are manufactured using processes such as pultrusion. Then, a mounting groove 61 extending along the length of the reflector 60 and penetrating vertically is created using processes such as stamping and cutting, connecting the mounting groove 61 to the shielding housing 71. A phase-shifting substrate 72 is integrally formed with the balun substrate 20 and the radiating substrate 10 using processes such as injection molding. A phase-shifting circuit 73 is attached to the phase-shifting substrate 72 using etching or electroplating processes, forming a continuous circuit with the balun circuit 30. Finally, the integrated radiating substrate 10, balun substrate 20, and phase-shifting substrate 72 are inserted into the mounting groove 61 from the reflective side of the emitting plate 60, positioning the phase-shifting substrate 72 and the phase-shifting circuit 73 within the reflective surface. Inside the shielding housing 71, the radiating substrate 10 and the balun substrate 20 are located above the reflective surface of the reflector 60. In some embodiments, when a ground plane 40 is provided, the phase-shifting substrate 72 is integrally formed with the ground plane 40. In a further embodiment, a hook 42 is integrally formed on the ground plane 40, and a corresponding locking position is provided on the reflector 60. The hook 42 is locked into the locking position, so that the vibrator and the reflector 60 are connected together, which has the advantage of quick assembly and disassembly. Through the direct connection between the radiating circuit and the balun circuit 30 and the direct connection between the balun circuit 30 and the phase-shifting circuit 73, the phase error is greatly reduced and the phase accuracy is improved, which has great advantages in antenna types with special requirements for beamforming.

[0028] Reference Figures 1-5 In some embodiments, the edge of the radiating substrate 10 is provided with a downwardly extending folded edge 11, which can broaden the bandwidth while reducing the physical aperture of the radiating surface.

[0029] Reference Figure 3 In some embodiments, a copper foil layer 81 and an insulating layer 82 are provided between the ground plane 40 and the reflector 60, so that the filter circuit 50 can be composed of microstrip lines. In other embodiments, the integrated oscillator also includes a connector 80 and a plurality of guide pieces 90. The connector 80 is snapped onto the radiating substrate 10, and the guide pieces 90 are snapped onto the connector 80 and located above the radiating substrate 10. By providing the guide pieces 90, the electrical performance of the oscillator can be improved, thereby improving the performance of the base station antenna. The snap-fit ​​connection between the connector 80 and the radiating substrate 10 and the snap-fit ​​connection between the guide pieces 90 and the connector 80 can improve the assembly speed of the guide pieces 90. In a further embodiment, two guide pieces 90 are provided and are stacked sequentially at intervals above the radiating substrate 10, and the size of the guide piece 90 at the upper end is smaller than the size of the guide piece 90 at the lower end.

[0030] The advantages of this invention are: the above structure can effectively transmit and receive the required signals, and there is no need for connecting components between the radiating surface and the balun. This not only reduces the number of welding points, but also provides a higher transmission rate and minimizes delay, reduces possible errors and interference in practical applications, effectively improves the reliability of the oscillator, greatly reduces the overall investment cost, and requires lower selection requirements for the array and oscillator under the same conditions.

[0031] Of course, the present invention is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications and substitutions are included within the scope defined by the claims of this application.

Claims

1. An integrated oscillator, characterized in that: It includes a radiating substrate (10), a balun substrate (20), a radiating circuit, and a balun circuit (30). The radiating substrate (10) is integrally formed on the upper end of the balun substrate (20); The radiation circuit is disposed on the radiation substrate (10); The balun circuit (30) is disposed on the balun substrate (20) and forms a continuous circuit with the radiation circuit.

2. The integrated oscillator according to claim 1, characterized in that: The radiating substrate (10) and the balun substrate (20) are made of PPS material of type 1140L4.

3. The integrated oscillator according to claim 1, characterized in that: The radiating substrate (10) and the balun substrate (20) are made of PPS material of type ZF40A.

4. The integrated oscillator according to claim 1, characterized in that: The radiation circuit is etched or electroplated on the radiation substrate (10), and the balun circuit (30) is etched or electroplated on the balun substrate (20).

5. The integrated oscillator according to claim 1, characterized in that: It also includes a ground plane (40) integrally formed on the lower end of the balun substrate (20), on which a filter circuit (50) is provided, and the filter circuit (50) and the balun circuit (30) form a continuous circuit.

6. The integrated oscillator according to claim 5, characterized in that: The grounding plate (40) is integrally formed with a plurality of reinforcing ribs (41) extending along its length and / or width.

7. The integrated oscillator according to claim 5, characterized in that: The grounding plate (40) has a snap hook (42) integrally formed on it.

8. The integrated oscillator according to claim 1, characterized in that: It also includes a reflector (60), a shielding housing (71), a phase-shifting substrate (72), and a phase-shifting circuit (73), wherein the balun substrate (20) is disposed on the front side of the reflector (60); The reflector (60) is provided with a mounting groove (61) that extends along its length and runs vertically through it. The shielding housing (71) is disposed on the back of the reflector (60) and communicates with the mounting groove (61); The phase-shifting substrate (72) is disposed inside the shielding housing (71) and integrally formed with the balun substrate (20); The phase-shifting circuit (73) is disposed on the phase-shifting substrate (72) and forms a continuous circuit with the balun circuit (30).

9. The integrated oscillator according to claim 8, characterized in that: The edge of the radiating substrate (10) is provided with a downwardly extending folded edge (11).

10. An antenna array, characterized in that: Includes the integrated oscillator as described in any one of claims 1-9.

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